Small package: 10-lead MSOP
Programmable gains: 1, 2, 5, 10
Digital or pin-programmable gain setting
Wide supply: ±5 V to ±15 V
Excellent dc performance
High CMRR 98 dB (minimum), G = 10
Low gain drift: 10 ppm/°C (maximum)
Low offset drift: 1.7 V/°C (maximum), G = 10
Excellent ac performance
Fast settling time: 615 ns to 0.001% (maximum)
High slew rate: 20 V/µs (minimum)
Low distortion: −110 dB THD at 1 kHz
High CMRR over frequency: 80 dB to 50 kHz (minimum)
Low noise: 18 nV/√Hz, G = 10 (maximum)
Low power: 4.1 mA
APPLICATIONS
Data acquisition
Biomedical analysis
Test and measurement
GENERAL DESCRIPTION
The AD8250 is an instrumentation amplifier with digitally
programmable gains that has GΩ input impedance, low output
noise, and low distortion making it suitable for interfacing with
sensors and driving high sample rate analog-to-digital converters
(ADCs). It has a high bandwidth of 10 MHz, low THD of −110
dB and fast settling time of 615 ns (maximum) to 0.001%. Offset
drift and gain drift are guaranteed to 1.7 μV/°C and 10 ppm/°C,
respectively, for G = 10. In addition to its wide input common
voltage range, it boasts a high common-mode rejection of 80 dB
at G = 1 from dc to 50 kHz. The combination of precision dc
performance coupled with high speed capabilities makes the
AD8250 an excellent candidate for data acquisition. Furthermore,
this monolithic solution simplifies design and manufacturing
and boosts performance of instrumentation by maintaining a
tight match of internal resistors and amplifiers.
The AD8250 user interface consists of a parallel port that allows
users to set the gain in one of two ways (see Figure 1). A 2-bit word
sent via a bus can be latched using the
to use the transparent gain mode where the state of the logic levels
at the gain port determines the gain.
The AD8250 is available in a 10-lead MSOP package and is
specified over the −40°C to +85°C temperature range, making
it an excellent solution for applications where size and packing
density are important considerations.
LOGIC
S
–V
S
Figure 1.
G = 10
G = 5
G = 2
G = 1
FREQUENCY (Hz)
Figure 2. Gain vs. Frequency
Mil
Grade
AD8250
Low
Power
REF
9
7
OUT
06288-001
High Speed
PGA
06288-023
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Figure 31...................................................................... 12
Deleted Figure 43 to Figure 46; Renumbered Sequentially ...... 14
Inserted Figure 45 and Figure 46.................................................. 14
Changes to Timing for Latched Gain Mode Section ................. 16
Changes to Layout Section and Coupling Noise Section.......... 18
Changes to Figure 59...................................................................... 21
1/07—Revision 0: Initial Version
Rev. B | Page 2 of 24
AD8250
SPECIFICATIONS
+VS = 15 V, −VS = −15 V, V
Table 2.
Parameter Conditions Min Typ Max Unit
COMMON-MODE REJECTION RATIO (CMRR)
CMRR to 60 Hz with 1 kΩ Source Imbalance +IN = −IN = −10 V to +10 V
G = 1 80 98 dB
G = 2 86 104 dB
G = 5 94 110 dB
G = 10 98 110 dB
CMRR to 50 kHz +IN = −IN = −10 V to +10 V
G = 1 80 dB
G = 2 86 dB
G = 5 90 dB
G = 10 90 dB
NOISE
Voltage Noise, 1 kHz, RTI
G = 1 40 nV/√Hz
G = 2 27 nV/√Hz
G = 5 21 nV/√Hz
G = 10 18 nV/√Hz
0.1 Hz to 10 Hz, RTI
G = 1 2.5 μV p-p
G = 2 2.5 μV p-p
G = 5 1.5 μV p-p
G = 10 1.0 μV p-p
Current Noise, 1 kHz 5 pA/√Hz
Current Noise, 0.1 Hz to 10 Hz 60 pA p-p
VOLTAGE OFFSET
Offset RTI VOS G = 1, 2, 5, 10 ±(70 + 200/G) ±(200 + 600/G) μV
Over Temperature T = −40°C to +85°C ±(90 + 300/G) ±(260 + 900/G) μV
Average Temperature Coefficient T = −40°C to +85°C ±(0.6 + 1.5/G) ±(1.2 + 5/G) μV/°C
Offset Referred to the Input vs. Supply (PSR) VS = ±5 V to ±15 V ±(2 + 7/G) ±(6 + 20/G) μV/V
INPUT CURRENT
Input Bias Current 5 30 nA
Over Temperature T = −40°C to +85°C 40 nA
Average Temperature Coefficient T = −40°C to +85°C 400 pA/°C
Input Offset Current 5 30 nA
Over Temperature T = −40°C to +85°C 30 nA
Average Temperature Coefficient T = −40°C to +85°C 160 pA/°C
DYNAMIC RESPONSE
Small Signal −3 dB Bandwidth
G = 1 10 MHz
G = 2 10 MHz
G = 5 10 MHz
G = 10 3 MHz
Settling Time 0.01% ΔOUT = 10 V step
G = 1 585 ns
G = 2 605 ns
G = 5 605 ns
G = 10 648 ns
= 0 V @ TA = 25°C, G = 1, RL = 2 kΩ, unless otherwise noted.
REF
Rev. B | Page 3 of 24
AD8250
Parameter Conditions Min Typ Max Unit
Settling Time 0.001% ΔOUT = 10 V step
G = 1 615 ns
G = 2 635 ns
G = 5 635 ns
G = 10 685 ns
Slew Rate
G = 1 20 V/μs
G = 2 25 V/μs
G = 5 25 V/μs
G = 10 25 V/μs
Total Harmonic Distortion
f = 1 kHz, R
= 10 kΩ, ±10 V,
L
G = 1, 10 Hz to 22 kHz
band-pass filter
GAIN
Gain Range G = 1, 2, 5, 10 1 10 V/V
Gain Error OUT = ±10 V
Input Operating Voltage Range VS = ±5 V to ±15 V −VS + 1.5 +VS − 1.5 V
Over Temperature T = −40°C to +85°C −VS + 1.6 +VS − 1.7 V
OUTPUT
Output Swing −13.5 +13.5 V
Over Temperature T = −40°C to +85°C −13.5 +13.5 V
Short-Circuit Current 37 mA
REFERENCE INPUT
RIN 20 kΩ
IIN +IN, −IN, REF = 0 1 μA
Voltage Range −VS +VS V
Gain to Output 1 ± 0.0001 V/V
DIGITAL LOGIC
Digital Ground Voltage, DGND Referred to GND −VS + 4.25 0 +VS − 2.7 V
Digital Input Voltage Low Referred to GND DGND 2.1 V
Digital Input Voltage High Referred to GND 2.8 +VS V
Digital Input Current 1 μA
Gain Switching Time1 325 ns
t
See Figure 3 timing diagram 20 ns
SU
tHD See Figure 3 timing diagram 10 ns
t
-LOW
WR
t
-HIGH
WR
See Figure 3 timing diagram 20 ns
See Figure 3 timing diagram 40 ns
−110 dB
GΩ||pF
GΩ||pF
Rev. B | Page 4 of 24
AD8250
Parameter Conditions Min Typ Max Unit
POWER SUPPLY
Operating Range ±5 ±15 V
Quiescent Current, +IS 4.1 4.5 mA
Quiescent Current, −IS 3.7 4.5 mA
Over Temperature T = −40°C to +85°C 4.5 mA
TEMPERATURE RANGE
Specified Performance −40 +85 °C
1
Add time for the output to slew and settle to calculate the total time for a gain change.
TIMING DIAGRAM
WR
t
WR-HIGH
t
WR-LOW
A0, A1
t
SU
t
HD
6288-057
Figure 3. Timing Diagram for Latched Gain Mode (See the Timing for Latched Gain Mode Section)
Rev. B | Page 5 of 24
AD8250
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage ±17 V
Power Dissipation See Figure 4
Output Short-Circuit Current Indefinite1
Common-Mode Input Voltage +VS + 13 V, −VS − 13 V
Differential Input Voltage +VS + 13 V, −VS − 13 V2
Digital Logic Inputs ±VS
Storage Temperature Range −65°C to +125°C
Operating Temperature Range3 −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 140°C
θJA (Four-Layer JEDEC Standard Board) 112°C/W
Package Glass Transition Temperature 140°C
1
Assumes that the load is referenced to midsupply.
2
Current must be kept to less than 6 mA.
3
Temperature for specified performance is −40°C to +85°C. For performance
to 125°C, see the Typical Performance Characteristics section.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8250 package is
limited by the associated rise in junction temperature (T
the die. The plastic encapsulating the die locally reaches the
junction temperature. At approximately 140°C, which is the
glass transition temperature, the plastic changes its properties.
Even temporarily exceeding this temperature limit can change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the AD8250. Exceeding
a junction temperature of 140°C for an extended period can
result in changes in silicon devices, potentially causing failure.
The still-air thermal properties of the package and PCB (θ
the ambient temperature (T
the package (P
) determine the junction temperature of the die.
D
), and the total power dissipated in
A
The junction temperature is calculated as
T
= TA + (PD × θJA)
J
) on
J
JA
),
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
). Assuming that the load (RL) is referenced
S
to midsupply, the total drive power is V
is dissipated in the package and some in the load (V
The difference between the total drive power and the load
power is the drive power dissipated in the package.
P
= Quiescent Power + (Total Drive Power − Load Power)
D
⎛
V
V
()
D
⎜
IVP
SS
⎜
⎝
OUTS
×+×=
2
R
L
In single-supply operation with R
case is V
OUT
= VS/2.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
.
JA
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature on a four-layer JEDEC
standard board.
2.00
1.75
1.50
1.25
1.00
0.75
0.50
MAXIMUM POWER DISSIPATI ON (W)
0.25
0
–40–20120100806040200
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
AMBIENT TEM P E RATURE (°C)
ESD CAUTION
) is the sum of the
D
) times the
S
/2 × I
S
⎞
⎟
⎟
⎠
2
V
OUT
–
R
L
referenced to −VS, the worst
L
, some of which
OUT
× I
OUT
OUT
JA
. In
).
06288-004
Rev. B | Page 6 of 24
AD8250
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
–IN
1
2
DGND
–V
A0
A1
3
S
4
5
AD8250
TOP VIEW
(Not to Scale)
Figure 5. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 −IN Inverting Input Terminal. True differential input.
2 DGND Digital Ground.
3 −VS Negative Supply Terminal.
4 A0 Gain Setting Pin (LSB).
5 A1 Gain Setting Pin (MSB).
6