Analog Devices AD824AR-3V, AD824AR-16, AD824AR-14-3V, AD824AR-14, AD824AR Datasheet

...
Single Supply, Rail-to-Rail
1
2
14
13
5
6
7
10
9
8
3
4
12
11
TOP VIEW
AD824
OUT A
–IN A
+IN A
V+
+IN B
–IN B
OUT B
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
a
FEATURES Single Supply Operation: 3 V to 30 V Very Low Input Bias Current: 2 pA Wide Input Voltage Range Rail-to-Rail Output Swing Low Supply Current: 500 A/Amp Wide Bandwidth: 2 MHz Slew Rate: 2 V/s No Phase Reversal
APPLICATIONS Photo Diode Preamplifier Battery Powered Instrumentation Power Supply Control and Protection Medical Instrumentation Remote Sensors Low Voltage Strain Gage Amplifiers DAC Output Amplifier
GENERAL DESCRIPTION
The AD824 is a quad, FET input, single supply amplifier, fea­turing rail-to-rail outputs. The combination of FET inputs and rail-to-rail outputs makes the AD824 useful in a wide variety of low voltage applications where low input current is a primary consideration.
The AD824 is guaranteed to operate from a 3 V single supply up to ±15 V dual supplies.
Fabricated on ADI’s complementary bipolar process, the AD824 has a unique input stage that allows the input voltage to safely extend beyond the negative supply and to the positive supply without any phase inversion or latchup. The output voltage swings to within 15 mV of the supplies. Capacitive loads to 350 pF can be handled without oscillation.
The FET input combined with laser trimming provides an input that has extremely low bias currents with guaranteed offsets below 300 µV. This enables high accuracy designs even with high source impedances. Precision is combined with low noise, making the AD824 ideal for use in battery powered medical equipment.
Low Power, FET-Input Op Amp
AD824
PIN CONFIGURATIONS
14-Lead Epoxy DIP
(N Suffix)
16-Lead Epoxy SO
(R Suffix)
OUT A
1
–IN A
2
+IN A
3
V+
4
AD824
5
+IN B
–IN B
6
OUT B
7
8
NC
NC = NO CONNECT
Applications for the AD824 include portable medical equipment, photo diode preamplifiers and high impedance transducer amplifiers.
The ability of the output to swing rail-to-rail enables designers to build multistage filters in single supply systems and maintain high signal-to-noise ratios.
The AD824 is specified over the extended industrial (–40°C to +85°C) temperature range and is available in 14-pin DIP and narrow 14-lead and 16-lead SO packages.
14-Lead Epoxy SO
(R Suffix)
1
OUT A
2
–IN A
3
+IN A
V+
+IN B
–IN B
OUT B
4
5
6
7
16
15
14
13
12
11
10
9
AD824
TOP VIEW
(Not to Scale)
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
NC
14
13
12
11
10
9
8
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
AD824–SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
(@ VS = 5.0 V, VCM = 0 V, V
= 0.2 V, TA = 25C unless otherwise noted)
OUT
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Offset Voltage AD824A V
Input Bias Current I
Input Offset Current I
B
OS
OS
T
to T
MIN
T
MIN
T
MIN
to T
to T
MAX
MAX
MAX
0.1 1.0 mV
1.5 mV 212pA 300 4000 pA 210pA 300 pA
Input Voltage Range –0.2 3.0 V Common-Mode Rejection Ratio CMRR V
Input Impedance 10 Large Signal Voltage Gain A
VO
= 0 V to 2 V 66 80 dB
CM
= 0 V to 3 V 60 74 dB
V
CM
T
MIN
to T
MAX
60 dB
13
3.3 pF
VO = 0.2 V to 4.0 V R
= 2 k 20 40 V/mV
L
R
= 10 k 50 100 V/mV
L
= 100 k 250 1000 V/mV
R
L
T
MIN
to T
= 100 k 180 400 V/mV
MAX, RL
Offset Voltage Drift ∆VOS/T2µV/°C
OUTPUT CHARACTERISTICS
Output Voltage High V
Output Voltage Low V
Short Circuit Limit I
Open-Loop Impedance Z
OH
OL
SC
OUT
I
= 20 µA 4.975 4.988 V
SOURCE
to T
T
MIN
I
SOURCE
T
MIN
I
SINK
T
MIN
I
SINK
T
MIN
MAX
= 2.5 mA 4.80 4.85 V
to T
MAX
= 20 µA1525mV
to T
MAX
= 2.5 mA 120 150 mV
to T
MAX
4.97 4.985 V
4.75 4.82 V
20 30 mV
140 200 mV
Sink/Source ±12 mA
to T
T
MIN
MAX
±10 mA
f = 1 MHz, AV = 1 100
POWER SUPPLY
Power Supply Rejection Ratio PSRR VS = 2.7 V to 12 V 70 80 dB
T
Supply Current/Amplifier I
SY
to T
MIN
T
MIN
to T
MAX
MAX
66 dB
500 600 µA
DYNAMIC PERFORMANCE
Slew Rate SR RL = 10 k, AV = 1 2 V/µs Full-Power Bandwidth BW Settling Time t
S
P
1% Distortion, VO = 4 V p-p 150 kHz V
= 0.2 V to 4.5 V, to 0.01% 2.5 µs
OUT
Gain Bandwidth Product GBP 2 MHz Phase Margin φo No Load 50 Degrees Channel Separation CS f = 1 kHz, RL = 2 k –123 dB
NOISE PERFORMANCE
Voltage Noise en p-p 0.1 Hz to 10 Hz 2 µV p-p Voltage Noise Density e Current Noise Density i
n
n
f = 1 kHz 16 nV/Hz f = 1 kHz 0.8 fA/Hz
Total Harmonic Distortion THD f = 10 kHz, RL = 0, AV = +1 0.005 %
–2–
REV. B
AD824
ELECTRICAL SPECIFICATIONS
(@ VS = 15.0 V, V
= 0 V, TA = 25C unless otherwise noted)
OUT
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Offset Voltage AD824A V
Input Bias Current I
Input Offset Current I
OS
B
I
B
OS
to T
T
MIN
MAX
VCM = 0 V 4 35 pA T
to T
MIN
MAX
VCM = –10 V 25 pA
T
to T
MIN
MAX
0.5 2.5 mV
0.6 4.0 mV
500 4000 pA
320 pA
500 pA Input Voltage Range –15 13 V Common-Mode Rejection Ratio CMRR V
Input Impedance 10 Large Signal Voltage Gain A
VO
= –15 V to 13 V 70 80 dB
CM
T
MIN
to T
MAX
66 dB
13
3.3 pF
Vo = –10 V to +10 V; R
= 2 k 12 50 V/mV
L
= 10 k 50 200 V/mV
R
L
R
= 100 k 300 2000 V/mV
L
T
MIN
to T
= 100 k 200 1000 V/mV
MAX, RL
Offset Voltage Drift ∆VOS/T2µV/°C
OUTPUT CHARACTERISTICS
Output Voltage High V
Output Voltage Low V
Short Circuit Limit I Open-Loop Impedance Z
OH
OL
SC
OUT
I
= 20 µA 14.975 14.988 V
SOURCE
T
to T
MIN
I
SOURCE
T
MIN
I
SINK
T
MIN
I
SINK
T
MIN
Sink/Source, T
MAX
= 2.5 mA 14.80 14.85 V
to T
MAX
= 20 µA –14.985 –14.975 V
to T
MAX
= 2.5 mA –14.88 –14.85 V
to T
MAX
MIN
to T
MAX
14.970 14.985 V
14.75 14.82 V
–14.98 –14.97 V
–14.86 –14.8 V
±8 ± 20 mA
f = 1 MHz, AV = 1 100
POWER SUPPLY
Power Supply Rejection Ratio PSRR VS = 2.7 V to 15 V 70 80 dB
T
Supply Current/Amplifier I
SY
to T
MIN
MAX
VO = 0 V 560 625 µA T
to T
MIN
MAX
68 dB
675 µA
DYNAMIC PERFORMANCE
Slew Rate SR RL = 10 k, AV = 1 2 V/µs Full-Power Bandwidth BW Settling Time t
S
P
1% Distortion, VO = 20 V p-p 33 kHz V
= 0 V to 10 V, to 0.01% 6 µs
OUT
Gain Bandwidth Product GBP 2 MHz Phase Margin φo 50 Degrees Channel Separation CS f = 1 kHz, RL =2 k –123 dB
NOISE PERFORMANCE
Voltage Noise en p-p 0.1 Hz to 10 Hz 2 µV p-p Voltage Noise Density e Current Noise Density i
n
n
Total Harmonic Distortion THD f =10 kHz, V
f = 1 kHz 16 nV/Hz f = 1 kHz 1.1 fA/Hz
= 3 V rms,
O
RL = 10 k 0.005 %
REV. B
–3–
AD824–SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
(@ VS = 3.0 V, VCM = 0 V, V
= 0.2 V, TA = 25C unless otherwise noted)
OUT
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Offset Voltage AD824A -3 V V
Input Bias Current I
Input Offset Current I
B
OS
OS
T
to T
MIN
T
MIN
T
MIN
to T
to T
MAX
MAX
MAX
0.2 1.0 mV
1.5 mV 212pA 250 4000 pA 210pA 250 pA
Input Voltage Range 0 1 V Common-Mode Rejection Ratio CMRR V
Input Impedance 10 Large Signal Voltage Gain A
VO
= 0 V to 1 V 58 74 dB
CM
T
MIN
to T
MAX
56 dB
13
3.3 pF
VO = 0.2 V to 2.0 V R
= 2 k 10 20 V/mV
L
= 10 k 30 65 V/mV
R
L
R
= 100 k 180 500 V/mV
L
T
MIN
to T
= 100 k 90 250 V/mV
MAX, RL
Offset Voltage Drift ∆VOS/T2µV/°C
OUTPUT CHARACTERISTICS
Output Voltage High V
Output Voltage Low V
Short Circuit Limit I
Open-Loop Impedance Z
I
OH
OL
SC
SC
OUT
I
= 20 µA 2.975 2.988 V
SOURCE
T
to T
MIN
I
SOURCE
T
MIN
I
SINK
T
MIN
I
SINK
T
MIN
MAX
= 2.5 mA 2.8 2.85 V
to T
MAX
= 20 µA1525mV
to T
MAX
= 2.5 mA 120 150 mV
to T
MAX
2.97 2.985 V
2.75 2.82 V
20 30 mV
140 200 mV
Sink/Source ±8mA Sink/Source, T
MIN
to T
MAX
±6mA
f = 1 MHz, AV = 1 100
POWER SUPPLY
Power Supply Rejection Ratio PSRR VS = 2.7 V to 12 V, 70 dB
Supply Current/Amplifier I
SY
to T
T
MIN
MAX
VO = 0.2 V, T
MIN
to T
MAX
66 dB
500 600 µA
DYNAMIC PERFORMANCE
Slew Rate SR RL =10 k, AV = 1 2 V/µs Full-Power Bandwidth BW Settling Time t
S
P
1% Distortion, VO = 2 V p-p 300 kHz V
= 0.2 V to 2.5 V, to 0.01% 2 µs
OUT
Gain Bandwidth Product GBP 2 MHz Phase Margin φo 50 Degrees Channel Separation CS f = 1 kHz, RL = 2 k –123 dB
NOISE PERFORMANCE
Voltage Noise en p-p 0.1 Hz to 10 Hz 2 µV p-p Voltage Noise Density e Current Noise Density i
n
n
f = 1 kHz 16 nV/Hz
0.8 fA/Hz
Total Harmonic Distortion THD f = 10 kHz, RL = 0, AV = +1 0.01 %
–4–
REV. B
AD824
R1 R2
+IN
J1 J2
R13
–IN
R15
Q4
Q5
Q6
R9
I5
V
CC
C3
Q7
C2
Q22
Q19
Q21 Q27
Q18 Q29
Q20
Q23
R7
C4
V
OUT
Q24 Q25
Q31
Q28
R17
Q26
C1
I4I3I2I1
R12 R14
Q2
Q8
Q3
V
EE
I6

WAFER TEST LIMITS

(@ VS = 5.0 V, VCM = 0 V, TA = 25C unless otherwise noted)
Parameter Symbol Conditions Limit Unit
Offset Voltage V Input Bias Current I Input Offset Current I Input Voltage Range V
OS
B
OS
CM
Common-Mode Rejection Ratio CMRR V
= 0 V to 2 V 66 dB min
CM
1.0 mV max 12 pA max 20 pA –0.2 to 3.0 V min
Power Supply Rejection Ratio PSRR V = + 2.7 V to +12 V 70 µV/V Large Signal Voltage Gain A Output Voltage High V Output Voltage Low V Supply Current/Amplifier I
NOTE Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

ABSOLUTE MAXIMUM RATINGS

1
VO
OH
OL
SY
RL = 2 k 15 V/mV min I
= 20 µA 4.975 V min
SOURCE
I
= 20 µA25 mV max
SINK
VO = 0 V, RL = 600 µA max
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . –V
– 0.2 V to +V
S
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 30 V
Output Short Circuit Duration to GND . . . . . . . . . Indefinite
Storage Temperature Range
N, R Package . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
AD824A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range
N, R Package . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300°C
Package Type θ
2
JA
θ
JC
Units
14-Pin Plastic DIP (N) 76 33 °C/W 14-Pin SOIC (R) 120 36 °C/W 16-Pin SOIC (R) 92 27 °C/W
NOTES
1
Absolute maximum ratings apply to packaged parts unless otherwise noted.
2
θJA is specified for the worst case conditions, i.e., θ
for P-DIP packages; θJA is specified for device soldered in circuit board for SOIC package.
is specified for device in socket
JA
Figure 1. Simplified Schematic of 1/4 AD824

ORDERING GUIDE

Temperature Package Package
Model Range Description Option
AD824AN* –40°C to +85°C 14-Pin Plastic DIP N-14 AD824AR –40°C to +85°C 14-Pin SOIC R-14 AD824AR-3V –40°C to +85°C 14-Pin SOIC R-14 AD824AR-14 –40°C to +85°C 14-Pin SOIC R-14 AD824AR-14-3V –40°C to +85°C 14-Pin SOIC R-14
AD824AR-16 –40°C to +85°C 16-Pin SOIC R-16
*Not for new designs. Obsolete April 2002.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD824 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
–5–
WARNING!
ESD SENSITIVE DEVICE
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