1350 V/s Slew Rate, G = +2
Fast Settling Time: 4 ns
Low Supply Current: <30 mA
Excellent Video Specifications (R
Gain Flatness of 0.1 dB to 50 MHz
0.01% Differential Gain Error
0.01ⴗ Differential Phase Error
“All Hostile“ Crosstalk
–80 dB @ 10 MHz
–50 dB @ 100 MHz
High “OFF” Isolation of 90 dB @ 10 MHz
Low Cost
Fast Output Disable Feature
APPLICATIONS
RGB Buffer in LCD and Plasma Displays
RGB Driver
Video Routers
= 150 ⍀):
L
Video Buffers with Disable
AD8074/AD8075
FUNCTIONAL BLOCK DIAGRAM
AD8074 /AD8075
OE
DGND
IN2
AGND
IN1
AGND
IN0
V
1
2
G =
3
+1/+2
4
G =
5
+1/+2
6
G =
7
+1/+2
8
EE
V
16
CC
V
15
CC
14
OUT2
13
V
EE
12
OUT1
V
11
CC
OUT0
10
V
9
EE
PRODUCT DESCRIPTION
The AD8074/AD8075 are high-speed triple video buffers with
G = +1 and +2 respectively. They have a –3 dB full signal bandwidth in excess of 450 MHz, along with slew rates in excess of
1400 V/µs. With better than –80 dB of all hostile crosstalk and
90 dB isolation, they are useful in many high-speed applications. The differential gain and differential phase error are 0.01%
and 0.01°. Gain flatness of 0.1 dB up to 50 MHz makes the
AD8074/AD8075 ideal for RGB buffering or driving. They
consume less than 30 mA on a ±5 V supply.
Both devices offer a high-speed disable feature that allows the
outputs to be put into a high impedance state. This allows the
building of larger input arrays while minimizing “OFF” channel output loading. The AD8074/AD8075 are offered in a
16-lead TSSOP package.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
Storage Temperature Range . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air (TA = 25°C).
3
16-lead plastic TSSOP; θJA = 150.4°C/W. Maximum internal power dissipation (P
) should be derated for ambient temperature (TA) such that
D
PD < (150°C – TA)/θJA.
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOption
AD8074ARU–40°C to +85°C16-Lead Plastic TSSOP RU-16
AD8075ARU–40°C to +85°C16-Lead Plastic TSSOP RU-16
AD8074-EVALEvaluation Board
AD8075-EVALEvaluation Board
PIN CONFIGURATION
AD8074 /AD8075
OE
DGND
IN2
AGND
IN1
AGND
IN0
V
1
2
G =
3
+1/+2
4
G =
5
+1/+2
6
G =
7
+1/+2
8
EE
V
16
CC
V
15
CC
14
OUT2
13
V
EE
12
OUT1
V
11
CC
OUT0
10
V
9
EE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8074/AD8075 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8074/
AD8075 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in
device failure.
While the AD8074/AD8075 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 1.
Figure 1. Maximum Power Dissipation vs. Temperature