FEATURES
Very Low Cost
Good Video Specifications (R
Gain Flatness of 0.1 dB to 10 MHz
0.05% Differential Gain Error
0.1ⴗ Differential Phase Error
Low Power
3.5 mA/Amplifier Supply Current
Operates on Single 5 V to 12 V Supply
High Speed
100 MHz, –3 dB Bandwidth (G = +2)
500 V/s Slew Rate
Fast Settling Time of 25 ns (0.1%)
Easy to Use
30 mA Output Current
Output Swing to 1.3 V of Rails on Single 5 V Supply
APPLICATIONS
Video Line Driver
Computer Video Plug-In Boards
RGB or S-Video Amplifier in Component Systems
= 150 ⍀)
L
Video Amplifiers
AD8072/AD8073
PIN CONFIGURATIONS
8-Lead Plastic (N), SOIC (R), and SOIC (RM) Packages
1
OUT1
2
–IN1
3
+IN1
–V
4
S
AD8072
TOP VIEW
Not to Scale
14-Lead Plastic (N), and SOIC (R) Packages
8
7
6
5
+V
S
OUT2
–IN2
+IN2
PRODUCT DESCRIPTION
The AD8072 (dual) and AD8073 (triple) are low cost, current
feedback amplifiers intended for high volume, cost sensitive
applications. In addition to being low cost, these amplifiers
deliver solid video performance into a 150 Ω load while consuming
only 3.5 mA per amplifier of supply current. Furthermore, the
AD8073 is three amplifiers in a single 14-lead narrow-body
SOIC package. This makes it ideal for applications where small
size is essential. Each amplifier’s inputs and output are accessible providing added gain setting flexibility.
These devices provide 30 mA of output current per amplifier,
and are optimized for driving one back terminated video load
(150 Ω) each. These current feedback amplifiers feature gain
flatness of 0.1 dB to 10 MHz while offering differential gain and
phase error of 0.05% and 0.1°. This makes the AD8072 and
AD8073 ideal for business and consumer video electronics.
Both will operate from a single 5 V to 12 V power supply. The
outputs of each amplifier swing to within 1.3 volts of either supply rail to accommodate video signals on a single 5 V supply.
The high bandwidth of 100 MHz, 500 V/µs of slew rate, along
with settling to 0.1% in 25 ns, make the AD8072 and AD8073
useful in many general purpose, high speed applications where a
single 5 V or dual power supplies up to ±6 V are needed. The
AD8072 is available in 8-lead plastic DIP, SOIC, and µSOIC
packages while the AD8073 is available in 14-lead plastic DIP and
SOIC packages. Both operate over the commercial temperature
range of 0°C to 70°C. Additionally, the AD8072ARM operates
over the industrial temperature range of –40°C to +85°C.
REV. D
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
*AD8072ARM–40°C to +85°C 8-Lead µSOICRM-8
*AD8072ARM-REEL –40°C to +85°C 13" Reel 8-Lead µSOIC RM-8
*AD8072ARM-REEL7 –40°C to +85°C 7" Reel 8-Lead µSOIC RM-8
AD8072JN0°C to 70°C8-Lead Plastic DIPN-8
AD8072JR0°C to 70°C8-Lead SOICSO-8
AD8072JR-REEL0°C to 70°C13" Reel 8-Lead SOIC SO-8
AD8072JR-REEL70°C to 70°C7" Reel 8-Lead SOICSO-8
AD8073JN0°C to 70°C14-Lead Plastic DIPN-14
AD8073JR0°C to 70°C14-Lead Narrow SOIC R-14
AD8073JR-REEL0°C to 70°C13" Reel 14-Lead SOIC R-14
AD8073JR-REEL70°C to 70°C7" Reel 14-Lead SOIC R-14
*Brand Code: HLA
TemperaturePackagePackage
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8072
and AD8073 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8072 and AD8073 are internally short circuit protected, this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figures 2 and 3.
2.0
8-LEAD MINI-DIP PACKAGE
1.5
8-LEAD SOIC PACKAGE
1.0
0.5
MAXIMUM POWER DISSIPATION – W
0
–5090–40 –30 –20 –10 0 1020 305060708040
SOIC
AMBIENT TEMPERATURE – ⴗC
TJ = 150ⴗC
Figure 2. AD8072 Maximum Power Dissipation vs.
Temperature
2.5
TJ = 150ⴗC
2.0
14-LEAD DIP PACKAGE
1.5
14-LEAD SOIC
1.0
MAXIMUM POWER DISSIPATION – W
0.5
–30 –20 –100 1020 304050 6080
–5090–40
Figure 3. AD8073 Maximum Power Dissipation vs.
Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8072/AD8073 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
AMBIENT TEMPERATURE – ⴗC
70
REV. D
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