ANALOG DEVICES AD 8022 ARZ Datasheet

Page 1
Dual High Speed,
O
Data Sheet

FEATURES

Low power amplifiers provide low noise and low distortion,
ideal for xDSL modem receiver Wide supply range: +5 V, ±2.5 V to ±12 V voltage supply Low power consumption: 4.0 mA/Amp Voltage feedback
Ease of Use
Lower total noise (insignificant input current noise
contribution compared to current feedback amps)
Low noise and distortion
2.5 nV/√Hz voltage noise @ 100 kHz
1.2 pA/√Hz current noise
MTPR < −66 dBc (G = +7)
SFDR 110 dB @ 200 kHz High speed
130 MHz bandwidth (−3 dB), G = +1
Settling time to 0.1%, 68 ns
50 V/μs slew rate High output swing: ±10.1 V on ±12 V supply Low offset voltage, 1.5 mV typical

APPLICATIONS

Receiver for ADSL, VDSL, HDSL, and proprietary
xDSL systems Low noise instrumentation front end Ultrasound preamps Active filters 16-bit ADC buffers

GENERAL DESCRIPTIONS

Low Noise Op Amp

FUNCTIONAL BLOCK DIAGRAM

UT1
–IN1
+IN1
–V
100
AD8022
1
2
– +
3
4
S
– +
Figure 1.
8
7
6
5
AD8022
+V
S
OUT2
–IN2
+IN2
01053-001
The AD8022 consists of two low noise, high speed, voltage feedback amplifiers. Each amplifier consumes only 4.0 mA of quiescent current, yet has only 2.5 nV/√Hz of voltage noise. These dual amplifiers provide wideband, low distortion performance, with high output current optimized for stability when driving capacitive loads. Manufactured on ADI’s high
10
voltage generation of XFCB bipolar process, the AD8022 operates on a wide range of supply voltages. The AD8022 is available in both an 8-lead MSOP and an 8-lead SOIC. Fast over
(pA/ Hz, nV/ Hz)
eN (nV/ Hz)
voltage recovery and wide bandwidth make the AD8022 ideal as the receive channel front end to an ADSL, VDSL, or proprietary xDSL transceiver design.
In an xDSL line interface circuit, the AD8022’s op amps can be configured as the differential receiver from the line transformer
1
10 10M1M100k10k1k100
Figure 2. Current and Voltage Noise vs. Frequency
FREQUENCY (Hz)
iN (pA/ Hz)
01053-002
or as independent active filters.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devi ces for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
Page 2
AD8022* Product Page Quick Links
Comparable Parts
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Evaluation Kits
• AD8022 Evaluation Board
• ADSP-SC584 Evaluation Hardware for the ADSP-SC58x/ ADSP-2158x SHARC Family (349-ball CSPBGA)
• ADSP-SC589 Evaluation Hardware for the ADSP-SC58x/ ADSP-2158x SHARC Family (529-ball CSPBGA)
• Universal Evaluation Board for Dual High Speed Operational Amplifiers
Documentation
Application Notes
• AN-356: User's Guide to Applying and Measuring Operational Amplifier Specifications
• AN-402: Replacing Output Clamping Op Amps with Input Clamping Amps
• AN-417: Fast Rail-to-Rail Operational Amplifiers Ease Design Constraints in Low Voltage High Speed Systems
• AN-581: Biasing and Decoupling Op Amps in Single Supply Applications
• AN-649: Using the Analog Devices Active Filter Design Tool
• AN-851: A WiMax Double Downconversion IF Sampling Receiver Design
Data Sheet
• AD8022: Dual High Speed Low Noise Op Amp Data Sheet
User Guides
• UG-128: Universal Evaluation Board for Dual High Speed Op Amps in SOIC Packages
• UG-129: Universal Evaluation Board for Dual High Speed Op Amps in MSOP Packages
• UG-886: Universal Evaluation Board for Dual High Speed Op Amps Offered in 8-Lead MSOP
Tools and Simulations
• Analog Filter Wizard
• Analog Photodiode Wizard
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• Power Dissipation vs Die Temp
• VRMS/dBm/dBu/dBV calculators
• AD8022 SPICE Macro-Model
Last Content Update: 08/30/2016
Reference Designs
• CN0039
• CN0048
Reference Materials
Product Selection Guide
• High Speed Amplifiers Selection Table
• SAR ADC & Driver Quick-Match Guide
Technical Articles
• Maximize Performance When Driving Differential ADCs
Tutorials
• MT-032: Ideal Voltage Feedback (VFB) Op Amp
• MT-033: Voltage Feedback Op Amp Gain and Bandwidth
• MT-048: Op Amp Noise Relationships: 1/f Noise, RMS Noise, and Equivalent Noise Bandwidth
• MT-049: Op Amp Total Output Noise Calculations for Single-Pole System
• MT-050: Op Amp Total Output Noise Calculations for Second-Order System
• MT-052: Op Amp Noise Figure: Don't Be Misled
• MT-053: Op Amp Distortion: HD, THD, THD + N, IMD, SFDR, MTPR
• MT-056: High Speed Voltage Feedback Op Amps
• MT-058: Effects of Feedback Capacitance on VFB and CFB Op Amps
• MT-059: Compensating for the Effects of Input Capacitance on VFB and CFB Op Amps Used in Current-to-Voltage Converters
• MT-060: Choosing Between Voltage Feedback and Current Feedback Op Amps
Design Resources
• AD8022 Material Declaration
• PCN-PDN Information
• Quality And Reliability
• Symbols and Footprints
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Page 3
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* This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to the content on this page does not constitute a change to the revision number of the product data sheet. This content may be frequently modified.
Page 4
AD8022 Data Sheet
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Maximum Power Dissipation .....................................................5
ESD Caution.................................................................................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ...................................................................... 12
Applications..................................................................................... 13

REVISION HISTORY

8/11—Rev. B to Rev. C
Changes to Figure 40 ......................................................................14
Updated Outline Dimensions........................................................16
Changes to Ordering Guide...........................................................16
5/05—Rev. A to Rev. B
Changes to Format.............................................................Universal
Deleted Evaluation Boards Section.............................................. 14
Deleted Generating DMT Section................................................ 14
Changes to Ordering Guide.......................................................... 16
Updated Outline Dimensions....................................................... 16
9/02—Rev. 0 to Rev. A
Changes to Features ..........................................................................1
Changes to Applications...................................................................1
Changes to Product Description.....................................................1
Changes to Functional Block Diagram ..........................................1
Changes to Figure 1...........................................................................1
Changes to Specifications Table......................................................2
Edits to TPCs 1, 2, 3, 6 ......................................................................5
New TPCs 7, 8....................................................................................6
Edits to TPCs 16, 17, 18....................................................................7
Edits to TPC 19..................................................................................8
Edits to TPC 28..................................................................................9
Edits to Figure 3...............................................................................11
Edits to Figure 6...............................................................................14
Updated Outline Dimensions........................................................16
DMT Modulation and Multitone Power Ratio (MTPR)....... 13
Channel Capacity and SNR....................................................... 13
Power Supply and Decoupling.................................................. 13
Layout Considerations............................................................... 15
Outline Dimensions .......................................................................16
Ordering Guide .......................................................................... 16
Rev. C | Page 2 of 16
Page 5
Data Sheet AD8022

SPECIFICATIONS

At 25°C, VS = ±12 V, RL = 500 Ω, G = +1, T
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
−3 dB Small Signal Bandwidth V Bandwidth for 0.1 dB Flatness V Large Signal Bandwidth1 V Slew Rate V Rise and Fall Time V Settling Time 0.1% V Overdrive Recovery Time
NOISE/DISTORTION PERFORMANCE
Distortion V
Second Harmonic fC = 1 MHz −95 dBc
Third Harmonic fC = 1 MHz −100 dBc Multitone Input Power Ratio2 G = +7 differential 26 kHz to 132 kHz −67.2 dBc 144 kHz to 1.1 MHz −66 dBc Voltage Noise (RTI) f = 100 kHz 2.5 nV/√Hz Input Current Noise f = 100 kHz 1.2 pA/√Hz
DC PERFORMANCE
Input Offset Voltage −1.5 ±6 mV T Input Offset Current ±120 nA Input Bias Current 2.5 5.0 μA T Open-Loop Gain 72 dB
INPUT CHARACTERISTICS
Input Resistance (Differential) 20 kΩ Input Capacitance 0.7 pF Input Common-Mode Voltage Range −11.25 to +11.75 V Common-Mode Rejection Ratio VCM = ±3 V 98 dB
OUTPUT CHARACTERISTICS
Output Voltage Swing RL = 500 Ω ±10.1 V R Linear Output Current G = +1, RL = 150 Ω, dc error = 1% ±55 mA Short-Circuit Output Current 100 mA Capacitive Load Drive RS = 0 Ω, <3 dB of peaking 75 pF
POWER SUPPLY
Operating Range +4.5 ±13.0 V Quiescent Current 4.0 5.5 mA/Amp T Power Supply Rejection Ratio VS = ±5V to ±12 V 80 dB
OPERATING TEMPERATURE RANGE −40 +85 °C
1
FPBW = Slew Rate/(2π V
2
Multitone testing performed with 800 mV rms across a 500 Ω load at Point A and Point B on the circuit of Figure 23.
PEAK
).
= –40°C, T
MIN
OUT
OUT
OUT
OUT
OUT
OUT
V
OUT
= 50 mV p-p 110 130 MHz = 50 mV p-p 25 MHz = 4 V p-p 4 MHz = 2 V p-p, G = +2 40 50 V/μs = 2 V p-p, G = +2 30 ns = 2 V p-p 62 ns = 150% of max output
= +85°C, unless otherwise noted.
MAX
200 ns
voltage, G = +2
= 2 V p-p
OUT
to T
MIN
MIN
= 2 kΩ ±10.6 V
L
MIN
±7.25 mV
MAX
to T
±7.5 μA
MAX
to T
6.1 mA/Amp
MAX
Rev. C | Page 3 of 16
Page 6
AD8022 Data Sheet
At 25°C, VS = ±2.5 V, RL = 500 Ω, G = +1, T
Table 2.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
−3 dB Small Signal Bandwidth V Bandwidth for 0.1 dB Flatness V Large Signal Bandwidth1 V Slew Rate V Rise and Fall Time V Settling Time 0.1% V Overdrive Recovery Time
NOISE/DISTORTION PERFORMANCE
Distortion V
Second Harmonic fC = 1 MHz −77.5 dBc
Third Harmonic fC = 1 MHz −94 dBc Multitone Input Power Ratio2 G = +7 differential, VS = ±6 V 26 kHz to 132 kHz −69 dBc 144 kHz to 1.1 MHz −66.7 dBc Voltage Noise (RTI) f = 100 kHz 2.3 nV/√Hz Input Current Noise f = 100 kHz 1 pA/√Hz
DC PERFORMANCE
Input Offset Voltage −0.8 ±5.0 mV T Input Offset Current ±65 nA Input Bias Current 2.0 5.0 μA T Open-Loop Gain 64 dB
INPUT CHARACTERISTICS
Input Resistance (Differential) 20 kΩ Input Capacitance 0.7 pF Input Common-Mode Voltage Range −1.83 to +2.0 V Common-Mode Rejection Ratio VCM = ±2.5 V, VS = ±5.0 V 98 dB
OUTPUT CHARACTERISTICS
Output Voltage Swing RL = 500 Ω −1.38 to +1.48 V Linear Output Current G = +1, RL = 100 Ω, dc error = 1% ±32 mA Short-Circuit Output Current 80 mA Capacitive Load Drive RS = 0 Ω, <3 dB of peaking 75 pF
POWER SUPPLY
Operating Range +4.5 ±13.0 V Quiescent Current 3.5 4.25 mA/Amp T Power Supply Rejection Ratio ∆VS = ±1 V 86 dB
OPERATING TEMPERATURE RANGE −40 +85 °C
1
FPBW = Slew Rate/(2 π V
2
Multitone testing performed with 800 mV rms across a 500 Ω load at Point A and Point B on the circuit of Figure 23.
PEAK
).
= –40°C, T
MIN
= 50 mV p-p 100 120 MHz
OUT
= 50 mV p-p 22 MHz
OUT
= 3 V p-p 4 MHz
OUT
= 2 V p-p, G = +2 30 42 V/μs
OUT
= 2 V p-p, G = +2 40 ns
OUT
= 2 V p-p 75 ns
OUT
= 150% of max output
V
OUT
= +85°C, unless otherwise noted.
MAX
225 ns
voltage, G = +2
= 2 V p-p
OUT
to T
MIN
MIN
MIN
±6.25 mV
MAX
to T
7.5 μA
MAX
to T
4.4 mA/Amp
MAX
Rev. C | Page 4 of 16
Page 7
Data Sheet AD8022

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
Supply Voltage (+VS to −VS) 26.4 V
Internal Power Dissipation1
8-Lead SOIC (R) 1.6 W
8-Lead MSOP (RM) 1.2 W Input Voltage (Common Mode) ±VS Differential Input Voltage ±0.8 V Output Short-Circuit Duration Observe Power Derating Curves Storage Temperature Range −65°C to +125°C Operating Temperature Range
−40°C to +85°C
(A Grade) Lead Temperature Range
300°C
(Soldering 10 sec)
1
Specification is for the device in free air:
8-Lead SOIC: θJA = 160°C/W. 8-Lead MSOP: θJA = 200°C/W.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8022 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure.
While the AD8022 is internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves.
2.0
1.5
8-LEAD SOIC PACKAGE
1.0
8-LEAD MSOP
0.5
MAXIMUM POWER DISSIPATION (W)
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
Figure 3. Maximum Power Dissipation vs. Temperature
AMBIENT TEMPERATURE (°C)

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
TJ = 150°C
01053-003
Rev. C | Page 5 of 16
Page 8
AD8022 Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

5
4
3
V
2
1
0
(dB)
–1
–2
–3
–4
–5
0.1 1 10 100 500
Figure 4. Frequency Response vs. R
0.4 G = +2 R
0.3
0.2
0.1
0
–0.1
(dB)
–0.2
–0.3
–0.4
–0.5
–0.6
100k 1M 10M 100M
IN
50Ω
= 500Ω
L
R
F
V
OUT
50Ω
FREQUENCY (MHz)
FREQUENCY (Hz)
RF = 715Ω
50Ω
RF = 402Ω
RF = 0Ω
, G = +1, VS = ±12 V, VIN = 63 mV p-p
F
±12V
±5.0V
±2.5V
Figure 5. Fine-Scale Gain Flatness vs. Frequency, G = +2
0.4 G = +2 R
= 500Ω
0.3
L
0.2
0.1
0
–0.1
(dB)
–0.2
–0.3
–0.4
–0.5
–0.6
100k 1M 10M 100M
FREQUENCY (Hz)
±12V
±5.0V
±2.5V
Figure 6. Fine-Scale Gain Flatness vs. Frequency, G = +1
01053-004
01053-005
01053-006
5
4
3
2
1
0
(dB)
–1
–2
–3
–4
–5
0.1 1 10 100 500
Figure 7. Frequency Response vs. Signal Level, V
5
4
3
2
1
0
–1
–2
FREQUENCY RESPONCE (dB)
–3
–4
–5
0.1 1 10 100 500
Figure 8. Frequency Response vs. Capacitive Load; C
140
120
100
80
60
FREQUENCY (MHz)
40
20
0
0 2 4 6 8 10 12 14
Figure 9. Bandwidth vs. Supply, R
V
V
IN
50Ω
IN
50Ω
715Ω
402Ω
VIN = 2.0V p-p
VIN = 0.8V p-p
VIN = 0.4V p-p
715Ω
V
OUT
453Ω
56.2Ω
FREQUENCY (MHz)
R
S
C
L
FREQUENCY (kHz)
G = +1, RF = 402Ω
G = +2, RF = 715Ω
SUPPLY VOLTAGE (±V)
VIN = 0.2V p-p
V
OUT
453Ω
56.2Ω
30pF
0pF
= 500 Ω, VIN = 200 mV p-p
L
= ±12 V, G = +1
S
= 0 pF and 50 pF; RS = 0 Ω
L
VIN = 0.05V p-p
50pF
01053-007
01053-008
01053-009
Rev. C | Page 6 of 16
Page 9
Data Sheet AD8022
80
70
60
50
40
30
GAIN (dB)
20
10
0
–10
5k 10k 100k 10M1M 100M 500M
FREQUENCY (Hz)
Figure 10. Open-Loop Gain vs. Frequency
01053-010
100mV
100
90
10
0%
100mV
Figure 13. Noninverting Small Signal Pulse Response,
= 500 Ω, VS = ±2.5 V, G = +1, RF = 0 Ω
R
L
100ns
INPUT
OUTPUT
01053-013
180
0
FREQUENCY (Degrees)
–180
5k 10k 100k 10M1M 100M 500M
FREQUENCY (Hz)
Figure 11. Open-Loop Phase vs. Frequency
100mV
100
90
100ns
INPUT
01053-011
2.00V
100
90
10
0%
100ns
INPUT
OUTPUT
2.00V
01053-014
Figure 14. Noninverting Large Signal Pulse Response,
R
= 500 Ω, VS = ±12 V, G = +1, RF = 0 Ω
L
1.00V
100
90
100ns
INPUT
10
0%
OUTPUT
100mV
01053-012
Figure 12. Noninverting Small Signal Pulse Response,
= 500 Ω, VS = ±12 V, G = +1, RF = 0 Ω
R
L
10
0%
OUTPUT
1.00V
01053-015
Figure 15. Noninverting Large Signal Pulse Response,
= 500 Ω, VS = ±2.5 V, G = +1, RF = 0 Ω
R
L
Rev. C | Page 7 of 16
Page 10
AD8022 Data Sheet
0.4
–50
0.3
0.2
= ±12 V,
S
= 500 Ω
L
+0.1%
–0.1%
0.1
0
–0.1
SETTLING ERROR (%)
–0.2
–0.3
–0.4
0 20 40 60 80 100 120
TIME (ns)
Figure 16. Settling Time to 0.1%, V
Step Size = 2 V p-p, G = +2, R
0.4
0.3
0.2
0.1
0
+0.1%
01053-016
–60
–70
–80
–90
–100
–110
HARMONIC DISTORTION (dB)
–120
–130
1k 10k 100k 1M 10M
FREQUENCY (Hz)
Figure 19. Distortion vs. Frequency, V
= 0 Ω, V
R
F
OUT
–50
–60
–70
–80
–90
3RD
2ND
= ±12 V, RL = 500 Ω,
S
= 2 V p-p, G = +1
2ND
3RD
01053-019
–0.1
SETTLING ERROR (%)
–0.2
–0.3
–0.4
0 20 40 60 80 100 120
Figure 17. Settling Time to 0.1%, V
70
60
50
40
30
SLEW RATE (V/μs)
20
10
0
2.5 4.5 6.5 8.5 10.5 12.5
TIME (ns)
= ±2.5 V, Step Size = 2 V p-p,
G = +2, R
SUPPLY VOLTAGE (V)
S
= 500 Ω
L
NEGATIVE EDGE
POSITIVE EDGE
Figure 18. Slew Rate vs. Supply Voltage, G = +2
–0.1%
01053-017
01053-018
–100
–110
HARMONIC DISTORTION (dB)
–120
–130
1k 10k 100k 1M 10M
Figure 20. Distortion vs. Frequency, V
R
= 500 Ω, RF = 0 Ω, V
L
–20
–30
–40
–50
–60
–70
–80
–90
HARMONIC DISTORTION (dBc)
–100
–120
0 5 10 15 20
Figure 21. Distortion vs. Output Voltage, V
G = +2, f = 1 MHz, R
FREQUENCY (Hz)
= ±2.5 V,
= 2 V p-p, G = +1
OUT
OUTPUT VOLTAGE (V p-p)
= 500 Ω, RF = 715 Ω
L
S
3RD
2ND
= ±12 V,
S
01053-020
01053-021
Rev. C | Page 8 of 16
Page 11
Data Sheet AD8022
2
0
–20
–40
–67.2dBc
–60
–80
HARMONIC DISTORTION (dBc)
–100
–120
0 1.50.5 1.0 2.0 2.5 3.0
Figure 22. Distortion vs. Output Voltage, V
G = +1, f = 1 MHz, R
2ND
3RD
OUTPUT VOLTAGE (V p-p)
= 500 Ω, RF = 0 Ω
L
= ±2.5 V,
S
+V
AD8022
1/2
715Ω
50Ω
500Ω
715Ω
AD8022
1/2
–V
Figure 23. Multitone Power Ratio Test Circuit
10dB/DIV (dBc)
01053-022
102.4 103.4 104.4 105.4 106.4 107.4 108.4 109.4 112.4111.4110.4
Figure 25. Multitone Power Ratio: V
FREQUENCY (kHz)
= ±12 V, RL = 500 Ω,
S
01053-025
Full Rate ADSL (DMT), Upstream
–66.7dBc
10dB/DIV (dBc)
549.3 559.3558.3557.3556.3555.3554.3553.3552.3551.3550.3
01053-023
Figure 26. Multitone Power Ratio: V
FREQUENCY (kHz)
= ±6 V, RL = 500 Ω,
S
01053-026
Full Rate ADSL (DMT), Downstream
10dB/DIV (dBc)
549.3 559.3558.3557.3556.3555.3554.3553.3552.3551.3550.3
Figure 24. Multitone Power Ratio: V
Full Rate ADSL (DMT), Downstream
–66.0dBc
FREQUENCY (kHz)
= ±12 V, RL = 500 Ω,
S
01053-024
10dB/DIV (dBc)
102.4 103.4 104.4 105.4 106.4 107.4 108.4 109.4 112.4111.4110.4
Figure 27. Multitone Power Ratio: V
Full Rate ADSL (DMT), Upstream
–69.0dBc
FREQUENCY (kHz)
= ±6 V, RL = 500 Ω,
S
01053-027
Rev. C | Page 9 of 16
Page 12
AD8022 Data Sheet
–0.5
–1.0
–1.5
0
SIDE A
SIDE B
SIDE A
SIDE B
VS = ±2.5V
–50
–60
–70
–80
CMRR (dB)
56.7
1k
Ω
1k
Ω
50
1k
Ω
1k
Ω
Ω
Ω
VOLTAGE OFFSET (mV)
–2.0
–2.5
–60 –40 –20 140120100806040200
TEMPERATURE (°C)
Figure 28. Voltage Offset vs. Temperature
4.5
4.0
3.5
A)
3.0
μ
2.5
2.0
1.5
BIAS CURRENT (
1.0
0.5
0
–60 –40 –20 140120100806040200
VS = ±2.5V
VS = ±12V
TEMPERATURE (°C)
Figure 29. Bias Current vs. Temperature
4
3
V
IN
2
1
0
(mV)
OS
V
–1
–2
–3
–4
–12.5 –10.0 –7.5 –5.0 –2.5 12.510.07.55.02.50
1k
Ω
1k
Ω
1k
Ω
1k
Ω
500
Ω
V
OUT
VS = ±2.5V
VS = ±12V
VCM(V)
Figure 30. Voltage Offset vs. Input Common-Mode Voltage
VS = +12V
01053-028
01053-029
01053-030
–90
–100
1k 10k 1M100k
FREQUENCY Hz)
Figure 31. CMRR vs. Frequen cy
8.5
8.0
VS = ±12V
7.5
7.0
6.5
VS = ±2.5V
6.0
TOTAL SUPPLY CURRENT (mA)
5.5
5.0 –50 150100500
TEMPERATURE (°C)
Figure 32. Total Supply Current vs. Temperature
0
–10
–20
–30
–40
–50
–60
–70
–80
POWER SUPPLY REJECTION (dB)
–90
–100
10k 100M10M1M100k
–PSRR
FREQUENCY (Hz)
Figure 33. Power Supply Rejection vs. Frequency V
+PSRR
= ±12 V
S
01053-031
01053-032
01053-033
Rev. C | Page 10 of 16
Page 13
Data Sheet AD8022
0
–10
–20
–30
–40
–50
–60
–70
–80
POWER SUPPLY REJECTION (dB)
–90
–100
10k 100M10M1M100k
–PSRR
+PSRR
FREQUENCY (Hz)
Figure 34. Power Supply Rejection vs. Frequency V
0
–10
–20
–30
–40
–50
–60
CROSSTALK (dB)
–70
–80
–90
–100
10k 100M10M1M100k
SIDE A OUT
SIDE B OUT
FREQUENCY (Hz)
Figure 35. Output-to-Output Crosstalk vs. Frequency, V
= ±2.5 V
S
= ±12 V
S
01053-034
01053-035
0
–10
–20
–30
–40
–50
–60
CROSSTALK (dB)
–70
–80
–90
–100
100k 100M10M1M
SIDE A OUT
SIDE B OUT
FREQUENCY (Hz)
Figure 36. Output-to-Output Crosstalk vs. Frequency, V
100
31
)
Ω
10
3.16
1
0.316
0.1
OUTPUT IMPEDANCE (
0.0316
30k 500M100M10M1M100k
FREQUENCY (Hz)
Figure 37. Output Impedance vs. Frequency, V
= ±2.5 V
S
= ±12 V
S
01053-036
01053-037
Rev. C | Page 11 of 16
Page 14
AD8022 Data Sheet
V

THEORY OF OPERATION

The AD8022 is a voltage-feedback op amp designed especially for ADSL or other applications requiring very low voltage and current noise along with low supply current, low distortion, and ease of use.
The AD8022 is fabricated on Analog Devices’ proprietary eXtra-Fast Complementary Bipolar (XFCB) process, which enables the construction of PNP and NPN transistors with similar fTs in the 4 GHz region. The process is dielectrically isolated to eliminate the parasitic and latch-up problems caused by junction isolation. These features enable the construction of high frequency, low distortion amplifiers with low supply currents.
+
S
15Ω
+IN
7.5pF
–IN
600μA
OUTPUT
15Ω
As shown in Figure 38, the AD8022 input stage consists of an NPN differential pair in which each transistor operates a 300 μA collector current. This gives the input devices a high transconductance and therefore gives the AD8022 a low input noise of 2.5 nV/√Hz @ 100 kHz. The input stage drives a folded cascode that consists of a pair of PNP transistors. These PNPs then drive a current mirror that provides a differential input to single-ended output conversion. The output stage provides a high current gain of 10,000 so that the AD8022 can maintain a high dc open-loop gain, even into low load impedances.
–V
01053-038
S
Figure 38. Simplified Schematic
Rev. C | Page 12 of 16
Page 15
Data Sheet AD8022

APPLICATIONS

The low noise AD8022 dual xDSL receiver amplifier is specifically designed for the dual differential receiver amplifier function within xDSL transceiver hybrids, as well as other low noise amplifier applications. The AD8022 can be used in receiving modulated signals including discrete multitone (DMT) on either end of the subscriber loop. Communication systems designers can be challenged when designing an xDSL modem transceiver hybrid capable of receiving the smallest signals embedded in noise that inherently exists on twisted-pair phone lines. Noise sources include near-end crosstalk (NEXT), far-end crosstalk (FEXT), background, and impulse noise, all of which are fed, to some degree, into the receiver front end. Based on a Bellcore noise survey, the background noise level for typical twisted-pair telephone loops is −140 dBm/√Hz or 31 nV/√Hz. It is therefore important to minimize the noise added by the receiver amplifiers to preserve as much signal-to­noise ratio (SNR) as possible. With careful transceiver hybrid design, using the AD8022 dual, low noise, receiver amplifier to maintain power density levels lower than −140 dBm/√Hz in ADSL modems is easily achieved.

DMT MODULATION AND MULTITONE POWER RATIO (MTPR)

ADSL systems rely on discrete multitone DMT modulation to carry digital data over phone lines. DMT modulation appears in the frequency domain as power contained in several individual frequency subbands, sometimes referred to as tones or bins, each of which is uniformly separated in frequency. (See Figure 24 to Figure 27 for MTPR results while the AD8022 receives DMT driving 800 mV rms across a 500 Ω differential load.) A uniquely encoded quadrature amplitude modulation (QAM) signal occurs at the center frequency of each subband or tone. Difficulties exist when decoding these subbands if a QAM signal from one subband is corrupted by the QAM signal(s) from other subbands, regardless of whether the corruption comes from an adjacent subband or harmonics of other subbands. Conventional methods of expressing the output signal integrity of line receivers, such as spurious-free dynamic range (SFDR), single tone harmonic distortion (THD), two­tone intermodulation distortion (IMD), and third-order intercept (IP3), become significantly less meaningful when amplifiers are required to process DMT and other heavily modulated waveforms. A typical xDSL downstream DMT signal can contain as many as 256 carriers (subbands or tones) of QAM signals. MTPR is the relative difference between the measured power in a typical subband (at one tone or carrier) vs. the power at another subband specifically selected to contain no QAM data.
In other words, a selected subband (or tone) remains open or void of intentional power (without a QAM signal) yielding an
empty frequency bin. MTPR, sometimes referred to as the empty bin test, is typically expressed in dBc, similar to expressing the relative difference between single tone fundamentals and second or third harmonic distortion components. Measurements of MTPR are typically made at the output of the receiver directly across the differential load. Other components aside, the receiver function of an ADSL transceiver hybrid is affected by the turns ratio of the selected transformers within the hybrid design. Since a transformer reflects the secondary voltage back to the primary side by the inverse of the turns ratio, 1/N, increasing the turns ratio on the secondary side reduces the voltage across the primary side inputs of the differential receiver. Increasing the turns ratio of the transformers can inadvertently cause a reduction of the SNR by reducing the received signal strength.

CHANNEL CAPACITY AND SNR

The efficiency of an ADSL system in delivering the digital data embedded in the DMT signals can be compromised when the noise power of the transmission system increases. Figure 39 shows the relationship between SNR and the relative maximum number of bits per tone or subband while maintaining a bit error rate at 10
60
50
40
30
SNR (dB)
20
10
0
–7
errors per second.
01105
Figure 39. ADSL DMT SNR vs. Bits/Tone
BITS/TONE
5

POWER SUPPLY AND DECOUPLING

The AD8022 should be powered with a good quality (that is, low noise) dual supply of ±12 V for the best overall performance. The AD8022 circuit also functions at voltages lower than ±12 V. Careful attention must be paid to decoupling the power supply pins. A pair of 10 μF capacitors located in near proximity to the AD8022 is required to provide good decoupling for lower frequency signals. In addition, 0.1 μF decoupling capacitors should be located as close to each of the power supply pins as is physically possible.
01053-039
Rev. C | Page 13 of 16
Page 16
AD8022 Data Sheet
A
A
A
01053-040
TP13
TP8
C9
0.1µF
A
OUT2
OUT1
TP9
C10
0.1µF
AVD D
TP10
R16
TP14
R
20k
2k
JP4
AVD D
C11
C8
0.1µF
C7
1µF
TP11
AVD D
B
JP1
CLK
123
A
R15
49.9
TP1
J1
27282526232421221819201617
DVDD
CLOCK
U1
AD9754
DB12
DB13
2143658
NC
AVDD
IOUTA
DCOM
IOUTB
COMP2
DB10
DB11
DB8
DB9
DB6
DB7
7
ACOM
REFIO
FS ADJ
COMP1
DB3
DB4
DB5
DB2
11
109131214
REFLO
DB1
15
SLEEP
DB0
0.1µF
123
AVD D
A
A
CT1
A A A
JP2
J2
PDIN
R17
49.9
TP12
1
DVDD
EXTCLK
VCC
VEE
AGND
VDD
2345678910
R7
DVDD
DVDD
1
2345678910
R3
1
151613
141112910
RES PK
2143658
16 PIN DIP
C19
2345678910
R5
1
7
C1
C25C2C27
C26
C29
C27
16 PIN DIP
RES PK
151613
141112910
2143658
C31
C30
C33
C32
AA
C6
+
TP7
B6
TP6
B5
TP19
B4
TP4
B3
TP2
B2
10µF
A
+
C5
10µF
TP5
TP18
C4
+
10µF
98765432
R6
10
11
DIFFERENTI AL
DMT OUTPUTS
A
98765432
R2
10
7
C35
C34
C36
249
A
750
0.1µF
AVC C
750
AD8022
A
249
A
0.1µF
AD8022
AVE E
DVDD
226
10k49.9
98765432
R6
10
1
1µF
A
AA
10k49.9
A
1µF
AA
DGND
C3
+
TP3
B1
DVDD
10µF
2345678910
R1
1
317511915
13
2119172523292733353739
31
P1
428
6
2021
AWG
TO TEK
121016142220182624302834363840
32
98765432
10
R2
Figure 40. DMT Signal Generator Schematic
C12
22pF
OUT1
J3
C13
22pF
OUT2
J4
Rev. C | Page 14 of 16
Page 17
Data Sheet AD8022
191Ω
+V
IN
COMMON-
MODE
VOLTAGE
–V
IN
191Ω
7.5
2.5
–2.5
–7.5
–12.5
–17.5
(dB)
–22.5
–27.5
–32.5
–37.5
–42.5
10k 10M1M100k
Figure 42. Frequency Response of Sallen-Key Filter
6800pF
5% NPO
1%
50V
5%
6800pF
5% NPO
3
2
6
5
12V
8
AD8022
249Ω
1%
249Ω
1%
AD8022
4
1
7
1%
SIGNAL C
0.1μF 16V
10% X7R
1%
243Ω
1%
8200pF
LEVEL
M
8200pF
243Ω
1%
10%
10%
422Ω
0.1μF
NPO
Figure 41. Differential Input Sallen-Key Filter
Using AD8022 on Single Supply, +12 V
FREQUENCY (Hz)

LAYOUT CONSIDERATIONS

As is the case with all high speed amplifiers, careful attention to printed circuit board layout details prevent associated board
+V
OUT
–V
OUT
01053-041
01053-042
parasitics from becoming problematic. Proper RF design technique is mandatory. The PCB should have a ground plane covering all unused portions of the component side of the board to provide a low impedance return path. Removing the ground plane from the area near the input signal lines reduces stray capacitance. Chip capacitors should be used for supply bypassing. One end of the capacitor should be connected to the ground plane, and the other should be connected no more than 1/8 inch away from each supply pin. An additional large (0.47 μF to 10 μF) tantalum capacitor should be connected in parallel, although not necessarily as close, in order to supply current for fast, large signal changes at the AD8022 output. Signal lines connecting the feedback and gain resistors should be as short as possible, minimizing the inductance and stray capacitance associated with these traces. Locate termination resistors and loads as close as possible to the input(s) and output, respectively. Adhere to stripline design techniques for long signal traces (greater than about 1 inch). Following these generic guidelines improves the performance of the AD8022 in all applications.
Rev. C | Page 15 of 16
Page 18
AD8022 Data Sheet

OUTLINE DIMENSIONS

5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
85
1
1.27 (0.0500)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
BSC
6.20 (0.2441)
5.80 (0.2284)
4
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
8° 0°
0.25 (0.0098)
0.17 (0.0067)
Figure 43. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)—Dimensions shown in millimeters and (inches)
3.20
3.00
2.80
8
5
4
0.40
0.25
5.15
4.90
4.65
1.10 MAX
15° MAX
6° 0°
0.23
0.09
3.20
3.00
2.80
PIN 1
IDENTIFIER
0.95
0.85
0.75
0.15
0.05
COPLANARITY
1
0.65 BSC
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 44. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)—Dimensions shown in millimeters
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
0.80
0.55
0.40
45°
10-07-2009-B
012407-A

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option
AD8022AR −40°C to +85°C 8-Lead SOIC_N R-8 AD8022ARZ −40°C to +85°C 8-Lead SOIC_N R-8 AD8022ARZ-REEL −40°C to +85°C 8-Lead SOIC_N R-8 AD8022ARZ-REEL7 −40°C to +85°C 8-Lead SOIC_N R-8 AD8022ARMZ −40°C to +85°C 8-Lead MSOP RM-8 AD8022ARMZ-REEL −40°C to +85°C 8-Lead MSOP RM-8 AD8022ARMZ-REEL7 −40°C to +85°C 8-Lead MSOP RM-8 AD8022ARM-EBZ Evaluation Board AD8022AR-EBZ
1
Z = RoHS Compliant Part.
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D01053-0-8/11(C)
Rev. C | Page 16 of 16
Evaluation Board
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