Fully Specified for 5 V and +5 V Supplies
High Output Current, 125 mA
High Speed
350 MHz, –3 dB Bandwidth (G = +1)
150 MHz, –3 dB Bandwidth (G = +2)
2,250 V/s Slew Rate
20 ns Settling Time to 0.1%
Low Distortion
–72 dBc Worst Harmonic @ 500 kHz, R
–66 dBc Worst Harmonic @ 5 MHz, R
Good Video Specifications (R
= 1 k, G = +2)
L
= 100
L
= 1 k
L
0.02% Differential Gain Error
0.06 Differential Phase Error
Gain Flatness 0.1 dB to 40 MHz
60 ns Overdrive Recovery
Low Offset Voltage, 1.5 mV
Low Voltage Noise, 2.5 nV/√Hz
Available in 8-Lead SOIC and 8-Lead MSOP
APPLICATIONS
XDSL, HDSL Line Drivers
ADC Buffers
Professional Cameras
CCD Imaging Systems
Ultrasound Equipment
Digital Cameras
PRODUCT DESCRIPTION
The AD8012 is a dual, low power, current feedback amplifier
capable of providing 350 MHz bandwidth while using only
1.7 mA per amplifier. It is intended for use in high frequency,
wide dynamic range systems where low distortion and high
speed are essential and low power is critical.
With only 1.7 mA of supply current, the AD8012 also offers
exceptional ac specifications such as 20 ns settling time and
2,250 V/µs slew rate. The video specifications are 0.02% differ-
ential gain and 0.06 degree differential phase, excellent for such
a low power amplifier. In addition, the AD8012 has a low offset
of 1.5 mV.
The AD8012 is well suited for any application that requires high
performance with minimal power.
The product is available in standard 8-lead SOIC or MSOP
packages and operates over the industrial temperature range
–40°C to +85°C.
AD8012
*
FUNCTIONAL BLOCK DIAGRAM
–40
G = +2
V
= 2V p-p
OUT
= 750
R
–50
–60
–70
DISTORTION – dBc
–80
–90
101k100
THIRD
SECOND
RL –
F
Figure 1. Distortion vs. Load Resistance, VS = ±5V,
Frequency = 500 kHz
+V
S
+
V
–
AMP 1
IN
–V
S
V
REF
R1
R2
Np:Ns
TRANSFORMER
RL = 100
OR
135
+
LINE
V
OUT
POWER
IN dB
–
Figure 2. Differential Drive Circuit for XDSL Applications
*Protected under U.S. Patent Number 5,537,079.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Input Common-Mode Voltage Range1.5 to 3.51.2 to 3.8V
OUTPUT CHARACTERISTICS
Output ResistanceG = +20.1Ω
Output Voltage Swing1 to 40.9 to 4.2V
Output CurrentT
MIN–TMAX
50100mA
Short-Circuit Current500mA
POWER SUPPLY
Supply Current/Amp1.551.75mA
T
MIN–TMAX
1.85mA
Operating RangeSingle Supply312V
Power Supply Rejection Ratio–58–60dB
Specifications subject to change without notice.
REV. B
–3–
AD8012
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8012
is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately +150°C. Temporarily exceeding this limit may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175°C for an extended period can result in
device failure.
The output stage of the AD8012 is designed for maximum load
current capability. As a result, shorting the output to common
can cause the AD8012 to source or sink 500 mA. To ensure
proper operation, it is necessary to observe the maximum power
derating curves. Direct connection of the output to either power
supply rail can destroy the device.
Test Circuits
750750
V
IN
49.9
0.1F
0.1F
+
+
10F
10F
Test Circuit 1. Gain = +2
V
OUT
R
L
+V
S
–V
S
2.0
TJ = 150C
1.5
1.0
0.5
MAXIMUM POWER DISSIPATION – W
0
–40 –30
–50
8-LEAD SOIC
PACKAGE
8-LEAD
MSOP
010203040506070 8090
–20 –10
AMBIENT TEMPERATURE – C
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature for AD8012
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Storage Temperature Range RM, R . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8012 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
AD8012AR–40°C to +85°C8-Lead SOICR-8
AD8012AR-REEL–40°C to +85°C13” Tape and ReelR-8
AD8012AR-REEL7–40°C to +85°C7” Tape and ReelR-8
AD8012ARM–40°C to +85°C8-Lead MSOPRM-08H6A
AD8012ARM-REEL–40°C to +85°C13” Tape and ReelRM-08H6A
AD8012ARM-REEL7–40°C to +85°C7” Tape and ReelRM-08H6A
AD8012ARMZ*–40°C to +85°C8-Lead MSOPRM-08H6A
AD8012ARMZ-REEL*–40°C to +85°C13” Tape and ReelRM-08H6A
AD8012ARMZ-REEL7* –40°C to +85°C7” Tape and ReelRM-08H6A
*Z = Pb-free product.
REV. B
–5–
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