Analog Devices AD8012ARM-REEL7, AD8012ARM-REEL, AD8012ARM, AD8012AR-REEL7, AD8012AR-REEL, AD8012AR Datasheet
Dual 350 MHz
AMP 1
V
IN
V
REF
R2
R1
RL = 100V
OR
135V
V
OUT
Np:Ns
TRANSFORMER
LINE
POWER
IN dB
+V
S
+
–
–V
S
+
–
a
FEATURES
Low Power
1.7 mA/Amplifier Supply Current
Fully Specified for ⴞ5 V and +5 V Supplies
High Output Current, 125 mA
High Speed
350 MHz, –3 dB Bandwidth (G = +1)
150 MHz, –3 dB Bandwidth (G = +2)
2,250 V/s Slew Rate
20 ns Settling Time to 0.1%
Low Distortion
–72 dBc Worst Harmonic @ 500 kHz, R
–66 dBc Worst Harmonic @ 5 MHz, R
Good Video Specifications (R
= 1 k⍀, G = +2)
L
0.02% Differential Gain Error
0.06ⴗ Differential Phase Error
Gain Flatness 0.1 dB to 40 MHz
60 ns Overdrive Recovery
Low Offset Voltage, 1.5 mV
Low Voltage Noise, 2.5 nV/√Hz
Available in 8-Lead SOIC and 8-Lead microSOIC
APPLICATIONS
XDSL, HDSL Line Driver
ADC Buffer
Professional Cameras
CCD Imaging System
Ultrasound Equipment
Digital Camera
PRODUCT DESCRIPTION
The AD8012 is a dual low power current feedback amplifier
capable of providing 350 MHz bandwidth while using only
1.7 mA per amplifier. It is intended for use in high frequency,
wide dynamic range systems where low distortion, high speed
are essential and low power is critical.
With only 1.7 mA of supply current, the AD8012 also offers
exceptional ac specs such as 20 ns settling time and 2,250 V/µs
slew rate. The video specifications are 0.02% differential gain
and 0.06 degree differential phase, excellent for such a low power
amplifier. In addition, the AD8012 has a low offset of 1.5 mV.
The AD8012 is well suited for any application that requires high
performance with minimal power.
The product is available in standard 8-lead SOIC or microSOIC packages and operates over the industrial temperature
range –40°C to +85°C.
= 100 ⍀
L
= 1 k⍀
L
Low Power Amplifier
AD8012
FUNCTIONAL BLOCK DIAGRAM
+V
2nd
3rd
8
S
OUT2
7
6
–IN2
+IN2–V
5
G = +2
= 2V p-p
V
OUT
R
= 750V
F
OUT1
1
2
–IN1
3
+IN1
4
S
AD8012
–40
–50
–60
–70
DISTORTION – dBc
–80
–90
101k100
RL – V
Figure 1. Distortion vs. Load Resistance, VS = ±5 V,
Frequency = 500 kHz
Figure 2. Differential Drive Circuit for XDSL Applications
*
*Protected under U.S. Patent Number 5,537,079.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Storage Temperature Range RM, R . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . –40°C to +85°C
Lead Temperature Range (Soldering␣ 10␣ sec) . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air at +25°C
8-Lead SOIC Package: θJA = 155°C/W
8-Lead microSOIC Package: θJA = 200°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8012
is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately +150°C. Temporarily exceeding this limit may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175°C for an extended period can result in device failure.
The output stage of the AD8012 is designed for maximum load
current capability. As a result, shorting the output to common
can cause the AD8012 to source or sink 500 mA. To ensure
proper operation, it is necessary to observe the maximum power
derating curves. Direct connection of the output to either power
supply rail can destroy the device.
2.0
TJ = +1508C
1.5
1.0
8-LEAD SOIC
PACKAGE
0
–50
8-LEAD
microSOIC
–40 –30
0 102030405060708090
–20 –10
AMBIENT TEMPERATURE – 8C
0.5
MAXIMUM POWER DISSIPATION – Watts
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature for AD8012
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8012 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
TemperaturePackagePackageBrand
ModelRangeDescriptionOptionsCode
AD8012AR–40°C to +85°C8-Lead SOICSO-8
AD8012AR-REEL–40°C to +85°C13” Tape and ReelSO-8
AD8012AR-REEL7–40°C to +85°C7” Tape and ReelSO-8
AD8012ARM–40°C to +85°C8-Lead microSOICRM-08H6A
AD8012ARM-REEL–40°C to +85°C13” Tape and ReelRM-08H6A
AD8012ARM-REEL7–40°C to +85°C7” Tape and ReelRM-08H6A
␣␣␣␣
–4–REV. A
0.1mF
0.1mF
10mF
10mF
R
L
V
IN
V
OUT
750V750V
53.6V
+V
S
–V
S
+
+
Typical Performance Characteristics–
AD8012
750V750V
V
IN
49.9V
0.1mF
0.1mF
+
+
10mF
10mF
Figure 4. Test Circuit; Gain = +2
20mV
5ns
V
OUT
R
L
+V
S
–V
S
Figure 7. Test Circuit; Gain = –1
20mV
5ns
Figure 5.* 100 mV Step Response; G = +2, VS = ±2.5 V or
±
5 V, RL = 1 k
Ω
1V
10ns
Figure 6. 4 V Step Response; G = +2, VS = ±5 V, RL = 1 k
Figure 8.* 100 mV Step Response; G = –1, VS = ±2.5 V or
±
5 V, RL = 1 k
Ω
Figure 9. 4 V Step Response; G = –1, VS = ±5 V, RL = 1 k
Ω
1V10ns
Ω
*NOTE:␣ VS = ±2.5 V operation is identical to VS = +5 V single supply operation.
–5–REV. A
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