5,500 V/s Slew Rate, 4 V Step, G = +2
545 ps Rise Time, 2 V Step, G = +2
Large Signal Bandwidth
440 MHz, G = +2
320 MHz, G = +10
Small Signal Bandwidth (–3 dB)
1 GHz, G = +1
700 MHz, G = +2
Settling Time 10 ns to 0.1%, 2 V Step, G = +2
Low Distortion over Wide Bandwidth
SFDR
–66 dBc @ 20 MHz, Second Harmonic
–75 dBc @ 20 MHz, Third Harmonic
Third Order Intercept (3IP)
26 dBm @ 70 MHz, G = +10
Good Video Specifications
Gain Flatness 0.1 dB to 75 MHz
0.01% Differential Gain Error, R
0.01 Differential Phase Error, R
High Output Drive
175 mA Output Load Drive
10 dBm with –38 dBc SFDR @ 70 MHz, G = +10
Supply Operation
+5 V to 5 V Voltage Supply
14 mA (Typ) Supply Current
APPLICATIONS
Pulse Amplifier
IF/RF Gain Stage/Amplifiers
High Resolution Video Graphics
High Speed Instrumentations
CCD Imaging Amplifier
2
1
0
–1
VO = 2V p-p
–2
–3
–4
–5
NORMALIZED GAIN (dB)
–6
–7
–8
1
FREQUENCY RESPONSE (MHz)
Figure 1. Large Signal Frequency Response; G = +2 and +10
REV. F
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
= 150
L
= 150
L
G = +10
= 200
R
F
= 100
R
L
100
G = +2
= 301
R
F
= 150
R
L
100010
Low Distortion Amplifier
AD8009
FUNCTIONAL BLOCK DIAGRAMS
8-Lead Plastic SOIC (R-8)5-Lead SOT-23 (RT-5)
AD8009
1
NC
2
–IN
3
+IN
–V
4
S
NC = NO CONNECT
NC
8
7
+V
S
6
OUT
NC
5
V
PRODUCT DESCRIPTION
The AD8009 is an ultrahigh speed current feedback amplifier
with a phenomenal 5,500 V/µs slew rate that results in a rise
time of 545 ps, making it ideal as a pulse amplifier.
The high slew rate reduces the effect of slew rate limiting and
results in the large signal bandwidth of 440 MHz required for
high resolution video graphic systems. Signal quality is maintained over a wide bandwidth with worst-case distortion of
–40 dBc @ 250 MHz (G = +10, 1 V p-p). For applications with
multitone signals, such as IF signal chains, the third order
intercept (3IP) of 12 dBm is achieved at the same frequency. This
distortion performance coupled with the current feedback
architecture make the AD8009 a flexible component for a gain
stage amplifier in IF/RF signal chains.
The AD8009 is capable of delivering over 175 mA of load current
and will drive four back terminated video loads while maintaining
low differential gain and phase error of 0.02% and 0.04°,
respectively. The high drive capability is also reflected in the
ability to deliver 10 dBm of output power @ 70 MHz with
–38 dBc SFDR.
The AD8009 is available in a small SOIC package and will
operate over the industrial temperature range –40°C to +85°C.
The AD8009 is also available in an SOT-23-5 and will operate
over the commercial temperature range of 0°C to 70°C.
Storage Temperature Range R Package . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . –40°C to +85°C
Operating Temperature Range (J Grade) . . . . . . . 0°C to 70°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead SOIC Package: θJA = 155°C/W.
5-Lead SOT-23 Package: θJA = 240°C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8009
is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices
is determined by the glass transition temperature of the plastic,
approximately 150°C. Exceeding this limit temporarily may cause
a shift in parametric performance due to a change in the stresses
exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure.
While the AD8009 is internally short circuit protected, this may
not be sufficient to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To ensure
proper operation, it is necessary to observe the maximum power
derating curves.
2.0
TJ = 150 C
1.5
8-LEAD SOIC PACKAGE
1.0
0.5
MAXIMUM POWER DISSIPATION (W)
5-LEAD SOT-23 PACKAGE
0
–50
AMBIENT TEMPERATURE (ⴗC)
9
80
706050403020100–40 –30 –20 –10
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
ORDERING GUIDE
TemperaturePackagePackage
ModelRangeDescriptionOptionBranding
AD8009AR–40°C to +85°C8-Lead SOICR-8
AD8009AR-REEL–40°C to +85°C8-Lead SOICR-8
AD8009AR-REEL7–40°C to +85°C8-Lead SOICR-8
AD8009ARZ*–40°C to +85°C8-Lead SOICR-8
AD8009ARZ-REEL*–40°C to +85°C8-Lead SOICR-8
AD8009ARZ-REEL7*–40°C to +85°C8-Lead SOICR-8
AD8009JRT-R2 0°C to 70°C5-Lead SOT-23RT-5HKJ
AD8009JRT-REEL 0°C to 70°C5-Lead SOT-23RT-5HKJ
AD8009JRT-REEL7 0°C to 70°C5-Lead SOT-23RT-5HKJ
AD8009JRTZ-REEL* 0°C to 70°C5-Lead SOT-23RT-5HKJ
AD8009JRTZ-REEL7* 0°C to 70°C5-Lead SOT-23RT-5HKJ
AD8009ACHIPSDie
*Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8009 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. F
Typical Performance Characteristics–
AD8009
3
2
1
0
R PACKAGE
–1
R
L
V
–2
O
G = +1, +2: R
–3
G = +10: R
RT PACKAGE
–4
G = +1: R
NORMALIZED GAIN (dB)
G = +2: R
–5
G = +10: RF = 191⍀
–6
–7
1
:
= 100⍀
= 200mV p–p
F
= 200⍀
F
= 332⍀
F
= 226⍀
F
G = +1, RT
G = +2, R AND RT
= 301⍀
G = +10, R AND RT
:
1010 0
FREQUENCY (MHz)
G = +1, R
1000
TPC 1. Frequency Response; G = +1, +2, +10,
R and RT Packages
8
7
6
5
G = +2
4
= 301⍀
R
3
GAIN (dB)
2
1
0
–1
–2
R
V
F
= 150⍀
L
AS SHOWN
O
FREQUENCY (MHz)
4V p-p
2V p-p
1001100010
TPC 2. Large Signal Frequency Response; G = +2
6.2
6.1
6.0
5.9
G = +2
R
= 301⍀
5.8
F
= 150⍀
R
L
5.7
= 200mV p-p
V
O
5.6
5.5
GAIN FLATNESS (dB)
5.4
5.3
5.2
101001
FREQUENCY (MHz)
TPC 4. Gain Flatness; G = +2
0.4
G = +2
= 301⍀
R
0.3
0.2
0.1
0
–0.1
GAIN FLATNESS (dB)
–0.2
–0.3
110100100010000
FREQUENCY (MHz)
F
= 150⍀
R
L
= 200mV p-p
V
O
= 5V
V
S
TPC 5. Gain Flatness; G = +2; VS = 5 V
1000
8
7
6
5
4
3
GAIN (dB)
2
1
0
–1
–2
G = +2
= 301⍀
R
F
= 150⍀
R
L
= 2V p–p
V
O
FREQUENCY (MHz)
–40ⴗC
1001100010
TPC 3. Large Signal Frequency Response vs.
Temperature; G = +2
REV. F
+85ⴗC
+85ⴗC
–40ⴗC
–5–
22
21
20
19
18
17
GAIN (dB)
16
15
14
13
12
G = +10
R
= 200⍀
F
RL = 100⍀
AS SHOWN
V
O
4V p-p
1001100010
FREQUENCY (MHz)
2V p-p
TPC 6. Large Signal Frequency Response; G = +10
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