Four 14-bit DACs in one package
AD7834—serial loading
AD7835—parallel 8-bit/14-bit loading
Voltage outputs
Power-on reset function
Maximum/minimum output voltage range of ±8.192 V
Maximum output voltage span of 14 V
Common voltage reference inputs
User-assigned device addressing
Clear function to user-defined voltage
Surface-mount packages
AD7834—28-lead SOIC and PDIP
AD7835—44-lead MQFP and PLCC
APPLICATIONS
Process control
Automatic test equipment
General-purpose instrumentation
GENERAL DESCRIPTION
The AD7834 and AD7835 contain four 14-bit DACs on one
monolithic chip. The AD7834 and AD7835 have output
voltages in the range ±8.192 V with a maximum span of 14 V.
The AD7834 is a serial input device. Data is loaded in 16-bit
format from the external serial bus, MSB first after two leading 0s,
Quad 14-Bit DACs
AD7834/AD7835
into one via DIN, SCLK, and
dedicated package address pins, PA0 to PA4, that can be wired
to AGND or V
to permit up to 32 AD7834s to be individually
CC
addressed in a multipackage application.
The AD7835 can accept either 14-bit parallel loading or doublebyte loading, where right-justified data is loaded in one 8-bit
byte and one 6-bit byte. Data is loaded from the external bus
into one of the input latches under the control of the
BYSHF
, and DAC channel address pins, A0 to A2.
With each device, the
DAC outputs simultaneously, or individually, on reception of
new data. In addition, for each device, the asynchronous
input can be used to set all signal outputs, V
the user-defined voltage level on the device sense ground pin,
DSG. On power-on, before the power supplies have stabilized,
internal circuitry holds the DAC output voltage levels to within
±2 V of the DSG potential. As the supplies stabilize, the DAC
output levels move to the exact DSG potential (assuming
exercised).
The AD7834 is available in a 28-lead 0.3" SOIC package and a
28-lead 0.6" PDIP package, and the AD7835 is available in a
44-lead MQFP package and a 44-lead PLCC package.
FSYNC
. The AD7834 has five
LDAC
signal is used to update all four
OUT
1 to V
WR
OUT
, CS,
CLR
4, to
CLR
is
FUNCTIONAL BLOCK DIAGRAMS
(–)
VDDV
PAE N
PA0
PA1
PA2
PA3
PA4
FSYNC
DIN
SCLK
AD7834
CONTROL
LOGIC
AND
ADDRESS
DECODE
SERIAL-TO-
PARALLEL
CONVERTER
CC
AGNDDGNDDSG
INPUT
REGI STER
1
INPUT
REGISTER
2
INPUT
REGISTER
3
INPUT
REGISTER
4
SS
DAC 1
LATCH
DAC 2
LATCH
DAC 3
LATCH
DAC 4
LATCH
LDAC
Figure 1. AD7834 Figure 2. AD7835
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Figure 40...................................................................... 25
Changes to Ordering Guide.......................................................... 27
7/03—Rev. A to Rev. B
Revision 0: Initial Version
Rev. D | Page 2 of 28
AD7834/AD7835
SPECIFICATIONS
1
= T
VCC = 5 V ± 5%; VDD = 15 V ± 5%; VSS = −15 V ± 5%; AGND = DGND = 0 V; T
A
MIN
to T
Table 1.
Parameter
A B S Unit Test Conditions/Comments
ACCURACY
Resolution 14 14 14 Bits
Relative Accuracy ±2 ±1 ±2 LSB max
Differential Nonlinearity ±0.9 ±0.9 ±0.9 LSB max Guaranteed monotonic over temperature.
Full-Scale Error V
T
to T
MIN
±5 ±5 ±8 mV max
MAX
Zero-Scale Error ±4 ±4 ±5 mV max V
Gain Error ±0.5 ±0.5 ±0.5 mV typ V
Gain Temperature
Coefficient
2
4 4 4 ppm FSR/°C typ
20 20 20 ppm FSR/°C max
DC Crosstalk2 50 50 50 μV max See the Terminology section. RL = 10 kΩ.
REFERENCE INPUTS
DC Input Resistance 30 30 30 MΩ typ
Input Current ±1 ±1 ±1 μA max Per input.
V
(+) Range 0/8.192 0/8.192 0/8.192 V min/max
REF
V
(−) Range −8.192/0 −8.192/0 −8.192/0 V min/max
REF
V
REF
(+) − V
(−) 5/14 7/14 5/14 V min/max
REF
DEVICE SENSE GROUND INPUTS
Input Current ±2 ±2 ±2 μA max Per input. V
DIGITAL INPUTS
V
, Input High Voltage 2.4 2.4 2.4 V min
INH
V
, Input Low Voltage 0.8 0.8 0.8 V max
INL
I
, Input Current ±10 ±10 ±10 μA max
INH
CIN, Input Capacitance 10 10 10 pF max
POWER REQUIREMENTS
VCC 5.0 5.0 5.0 V nom ±5% for specified performance.
VDD 15.0 15.0 15.0 V nom ±5% for specified performance.
VSS −15.0 −15.0 −15.0 V nom ±5% for specified performance.
Power Supply Sensitivity
ΔFull Scale/ΔVDD 110 110 110 dB typ
ΔFull Scale/ΔVSS 100 100 100 dB typ
ICC 0.2 0.2 0.5 mA max V
3 3 3 mA max AD7834: V
6 6 6 mA max AD7835: V
IDD 13 13 15 mA max AD7834: outputs unloaded.
15 15 15 mA max AD7835: outputs unloaded.
ISS 13 13 15 mA max Outputs unloaded.
1
Temperature range for A, B, and C versions is −40°C to +85°C.
2
Guaranteed by design.
, unless otherwise noted.
MAX
(+) = +7 V, V
REF
(+) = +7 V, V
REF
(+) = +7 V, V
REF
(−) = −7 V.
REF
(−) = −7 V.
REF
(−) = −7 V.
REF
For specified performance. Can go as low as
0 V, but performance is not guaranteed.
= −2 V to +2 V.
DSG
= VCC, V
INH
= DGND.
INL
= 2.4 V min, V
INH
= 2.4 V min, V
INH
= 0.8 V max.
INL
= 0.8 V max.
INL
Rev. D | Page 3 of 28
AD7834/AD7835
VCC = 5 V ± 5%; VDD = 12 V ± 5%; VSS = −12 V ± 5%; AGND = DGND = 0 V; T
1
= T
to T
MIN
A
, unless otherwise noted.
MAX
Table 2.
Parameter
A B S Unit Test Conditions/Comments
ACCURACY
Resolution 14 14 14 Bits
Relative Accuracy ±2 ±1 ±2 LSB max
Differential Nonlinearity ±0.9 ±0.9 ±0.9 LSB max Guaranteed monotonic over temperature.
Full-Scale Error V
T
to T
MIN
±5 ±5 ±8 mV max
MAX
Zero-Scale Error ±4 ±4 ±5 mV max V
Gain Error ±0.5 ±0.5 ±0.5 mV typ V
(+) = +5 V, V
REF
(+) = +5 V, V
REF
(+) = +5 V, V
REF
(−) = –5 V.
REF
(−) = −5 V.
REF
(−) = −5 V.
REF
Gain Temperature Coefficient2 4 4 4 ppm FSR/°C typ 20 20 20 ppm FSR/°C max
DC Crosstalk2 50 50 50 μV max See the Terminology section. RL = 10 kΩ.
REFERENCE INPUTS
DC Input Resistance 30 30 30 MΩ typ
Input Current ±1 ±1 ±1 μA max Per input.
V
(+) Range 0/8.192 0/8.192 0/8.192 V min/max
REF
V
(−) Range −5/0 −5/0 −5/0 V min/max
REF
V
REF
(+) − V
(−)5/13.192 7/13.192 5/13.192 V min/max
REF
For specified performance. Can go as low as
0 V, but performance is not guaranteed.
DEVICE SENSE GROUND INPUTS
Input Current ±2 ±2 ±2 μA max Per input. V
= −2 V to +2 V.
DSG
DIGITAL INPUTS
V
, Input High Voltage 2.4 2.4 2.4 V min
INH
V
, Input Low Voltage 0.8 0.8 0.8 V max
INL
I
, Input Current ±10 ±10 ±10 μA max
INH
CIN, Input Capacitance 10 10 10 pF max
POWER REQUIREMENTS
VCC 5.0 5.0 5.0 V nom ±5% for specified performance.
VDD 15.0 15.0 15.0 V nom ±5% for specified performance.
VSS −15.0 −15.0 −15.0 V nom ±5% for specified performance.
Power Supply Sensitivity
ΔFull Scale/ΔVDD 110 110 110 dB typ
ΔFull Scale/ΔVSS 100 100 100 dB typ
ICC 0.2 0.2 0.5 mA max V
3 3 3 mA max AD7834: V
6 6 6 mA max AD7835: V
= VCC, V
INH
= DGND.
INL
= 2.4 V min, V
INH
= 2.4 V min, V
INH
= 0.8 V max.
INL
= 0.8 V max.
INL
IDD 13 13 15 mA max AD7834: outputs unloaded.
15 15 15 mA max AD7835: outputs unloaded.
ISS 13 13 15 mA max Outputs unloaded.
1
Temperature range for A, B, and C versions is −40°C to +85°C.
2
Guaranteed by design.
Rev. D | Page 4 of 28
AD7834/AD7835
AC PERFORMANCE CHARACTERISTICS
These characteristics are included for design guidance and are not subject to production testing.
Table 3.
Parameter
DYNAMIC PERFORMANCE
Output Voltage Settling Time 10 10 10 μs
Digital-to-Analog Glitch Impulse 120 120 120 nV-s
DC Output Impedance 0.5 0.5 0.5 Ω See the Terminology section.
Channel-to-Channel Isolation 100 100 100 dB See the Terminology section; applies to the AD7835 only.
DAC-to-DAC Crosstalk 25 25 25 nV-s See the Terminology section.
Digital Crosstalk 3 3 3 nV-s
Digital Feedthrough—AD7834 0.2 0.2 0.2 nV-s Effect of input bus activity on DAC output under test.
Digital Feedthrough—AD7835 1.0 1.0 1.0 nV-s
Output Noise Spectral Density at 1 kHz 40 40 40 nV/√HzAll 1s loaded to DAC. V
A B S Unit (typ) Test Conditions/Comments
Full-scale change to ±1/2 LSB. DAC latch contents
alternately loaded with all 0s and all 1s.
Measured with V
(+) = V
REF
REF
alternately loaded with all 0s and all 1s.
Feedthrough to DAC output under test due to change in
digital input code to another converter.
(+) = V
REF
(−) = 0 V. DAC latch
(−) = 0 V.
REF
Rev. D | Page 5 of 28
AD7834/AD7835
)
TIMING SPECIFICATIONS
VCC = 5 V ± 5%; VDD = 11.4 V to 15.75 V; VSS = −11.4 V to −15.75 V; AGND = DGND = 0 V1.
Table 4.
Parameter Limit at T
MIN
AD7834-SPECIFIC
2
t
1
2
t
2
2
t
30 ns min SCLK high time
3
30 ns min
t4
100 ns min SCLK cycle time
50 ns min SCLK low
t5 40 ns min
t6 30 ns min Data setup time
10 ns min Data hold time
t7
0 ns min
t8
t9 40 ns min
t21 20 ns min Delay between write operations
AD7835-SPECIFIC
t11 15 ns min
t12 15 ns min
t13 0 ns min
t14 0 ns min
t15 40 ns min
t16 40 ns min Data setup time
10 ns min Data hold time
t17
0 ns min
t18
t19 0 ns min
t20 0 ns min
GENERAL
t10 40 ns min
1
All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and time from a voltage level of 1.6 V.
2
Rise and fall times should be no longer than 50 ns.
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in
provide protection.
V
Table 5.
Parameter Rating
VCC to DGND −0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
VDD to AGND −0.3 V to +17 V
DD
IN4148
SD103C
V
DD
AD7834/
AD7835
VSS to AGND +0.3 V to –17 V
AGND to DGND −0.3 V to +0.3 V
Figure 5. Diode Protection
−0.3 V to VCC + 0.3 V Digital Inputs to DGND
V
(+) to V
REF
V
(+) to AGND VSS – 0.3 V to VDD + 0.3 V
REF
V
(–) to AGND VSS – 0.3 V to VDD + 0.3 V
REF
(–) −0.3 V to +18 V
REF
VSS – 0.3 V to VDD + 0.3 V DSG to AGND
V
(1–4) to AGND VSS – 0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range, T
A
−40°C to +85°C Industrial (A Version)
−65°C to +150°C Storage Temperature Range
150°C Junction Temperature, TJ (max)
Power Dissipation, PD (max) (TJ − TA)/θJA
Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θJA Unit
PDIP 75 °C/W
SOIC 75
MQFP 95
PLCC 55 °C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5 can be used to
V
CC
V
CC
01006-005
°C/W
°C/W
Rev. D | Page 7 of 28
AD7834/AD7835
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AGND
NC
NC
NC
NC
V
DD
V
OUT
V
OUT
CLR
LDAC
FSYNC
PAEN
PA4
PA3
1
3
01006-006
V
REF
V
REF
V
V
DGND
SCLK
V
DSG
OUT
OUT
V
DIN
PA0
PA1
PA2
SS
(–)
(+)
NC
2
4
CC
1
2
3
4
5
AD7834
6
TOP VIEW
(Not to Scale)
7
8
9
10
11
12
13
14
NC = NO CONNECT
Figure 6. AD7834 PDIP and SOIC Pin Configuration
Table 7. AD7834 Pin Function Descriptions
Pin No. Pin Mnemonic Description
1 VSS Negative Analog Power Supply: −15 V ± 5% or −12 V ± 5%.
2 DSG
3 V
4 V
(−) Negative Reference Input. The negative reference voltage is referred to AGND.
REF
Positive Reference Input. The positive reference voltage is referred to AGND.
(+)
REF
5, 24, 25, 26, 27 NC
V
OUT
1 to V
OUT
4
8 DGND
9 VCC
Logic Power Supply: 5 V ± 5%.
10 SCLK
Device Sense Ground Input. Used in conjunction with the CLR
the DACs. When CLR
is low, the DAC outputs are forced to the potential on the DSG pin.
No Connect.
22, 6, 21, 7 DAC Outputs.
Digital Ground.
Clock Input. Used for writing data to the device; data is clocked into the input register on the
falling edge of SCLK.
11 DIN
12,13,14,15,16 PA0 to PA4
Serial Data Input.
Package Address Inputs. These inputs are hardwired high (VCC) or low (DGND) to assign dedicated
package addresses in a multipackage environment.
17
PAEN
Package Address Enable Input. When low, this input allows normal operation of the device. When
high, the device ignores the package address, but not the channel address, in the serial data
stream and loads the serial data into the input registers. This feature is useful in a multipackage
application where it can be used to load the same data into the same channel in each package.
18
Frame Sync Input. Active low logic input used, in conjunction with DIN and SCLK, to write data to
FSYNC
the device with serial data expected after the falling edge of this signal. The contents of the 24-bit
serial-to-parallel input register are transferred on the rising edge of this signal.
19
Load DAC Input (Level Sensitive). This input signal, in conjunction with the FSYNC input signal,
LDAC
LDAC
determines how the analog outputs are updated. If
is maintained high while new data is
being loaded into the device’s input registers, no change occurs on the analog outputs.
Subsequently, when
LDAC
is brought low, the contents of all four input registers are transferred
into their respective DAC latches, updating all of the analog outputs simultaneously.
20
CLR
Asynchronous Clear Input (Level Sensitive, Active Low). When this input is brought low, all analog
outputs are switched to the externally set potential on the DSG pin. When CLR
signal outputs remain at the DSG potential until LDAC
is brought low. When LDAC is brought low,
the analog outputs are switched back to reflect their individual DAC output levels. As long as CLR
LDAC
remains low, the
potential on the DSG pin.
signals are ignored, and the signal outputs remain switched to the
23 VDD Positive Analog Power Supply: 15 V ± 5% or 12 V ± 5%.
28 AGND Analog Ground.
Device Sense Ground A Input. Used in conjunction with the CLR
protection of the DACs. When
V
1 to V
OUT
8, 7, 6 14, 13, 12 A0, A1, A2
potential on the DSGA pin.
4 3, 4, 31, 30 9, 10, 37, 36 DAC Outputs.
OUT
Address Inputs. A0 and A1 are decoded to select one of the four input latches for a data
transfer. A2 is used to select all four DACs simultaneously.
9 15
CLR
Asynchronous Clear Input (Level Sensitive, Active Low). When this input is brought low,
all analog outputs are switched to the externally set potentials on the DSG pins (V
and V
2 follow DSGA, and V
OUT
signal outputs remain at the DSG potentials until LDAC
brought low, the analog outputs are switched back to reflect their individual DAC output
levels. As long as
remains low, the LDAC signals are ignored, and the signal outputs
CLR
remain switched to the potential on the DSG pins.
10 16
Load DAC Input (Level Sensitive). This input signal, in conjunction with the WR and CS
LDAC
input signals, determines how the analog outputs are updated. If
high while new data is being loaded into the device’s input registers, no change occurs
on the analog outputs. Subsequently, when
input registers are transferred into their respective DAC latches, updating the analog
outputs simultaneously. Alternatively, if
entered, the addressed DAC latch and corresponding analog output are updated
immediately on the rising edge of
11 17
Byte Shift Input. When low, it shifts the data on DB0 to DB7 into the DB8 to DB13 half of
BYSHF
the input register.
12 18
CS
Level-Triggered Chip Select Input (Active Low). The device is selected when this input is
low.
13 19
Level-Triggered Write Input (Active Low). When active, it is used in conjunction with CS
WR
to write data over the input databus.
14 20 VCC Logic Power Supply: 5 V ± 5%.
15 21 DGND Digital Ground.
CLR
is low, DAC outputs V
OUT
3 and V
4 follow DSGB). When CLR
OUT
LDAC
LDAC
.
WR
input for power-on
1 and V
OUT
2 are forced to the
OUT
OUT
is brought high, the
is brought low. When LDAC is
LDAC
is maintained
is brought low, the contents of all four
is brought low while new data is being
1
Rev. D | Page 9 of 28
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