ANALOG DEVICES AD7834, AD7835 Service Manual

LC2MOS
V
V
VCCVDDVSSV
A
V
A

FEATURES

Four 14-bit DACs in one package AD7834—serial loading AD7835—parallel 8-bit/14-bit loading Voltage outputs Power-on reset function Maximum/minimum output voltage range of ±8.192 V Maximum output voltage span of 14 V Common voltage reference inputs User-assigned device addressing Clear function to user-defined voltage Surface-mount packages AD7834—28-lead SOIC and PDIP AD7835—44-lead MQFP and PLCC

APPLICATIONS

Process control Automatic test equipment General-purpose instrumentation

GENERAL DESCRIPTION

The AD7834 and AD7835 contain four 14-bit DACs on one monolithic chip. The AD7834 and AD7835 have output voltages in the range ±8.192 V with a maximum span of 14 V.
The AD7834 is a serial input device. Data is loaded in 16-bit format from the external serial bus, MSB first after two leading 0s,
Quad 14-Bit DACs
AD7834/AD7835
into one via DIN, SCLK, and dedicated package address pins, PA0 to PA4, that can be wired to AGND or V
to permit up to 32 AD7834s to be individually
CC
addressed in a multipackage application.
The AD7835 can accept either 14-bit parallel loading or double­byte loading, where right-justified data is loaded in one 8-bit byte and one 6-bit byte. Data is loaded from the external bus into one of the input latches under the control of the BYSHF
, and DAC channel address pins, A0 to A2.
With each device, the DAC outputs simultaneously, or individually, on reception of new data. In addition, for each device, the asynchronous input can be used to set all signal outputs, V the user-defined voltage level on the device sense ground pin, DSG. On power-on, before the power supplies have stabilized, internal circuitry holds the DAC output voltage levels to within ±2 V of the DSG potential. As the supplies stabilize, the DAC output levels move to the exact DSG potential (assuming exercised).
The AD7834 is available in a 28-lead 0.3" SOIC package and a 28-lead 0.6" PDIP package, and the AD7835 is available in a 44-lead MQFP package and a 44-lead PLCC package.
FSYNC
. The AD7834 has five
LDAC
signal is used to update all four
OUT
1 to V
WR
OUT
, CS,
CLR
4, to
CLR
is

FUNCTIONAL BLOCK DIAGRAMS

(–)
VDDV
PAE N
PA0
PA1
PA2
PA3
PA4
FSYNC
DIN
SCLK
AD7834
CONTROL
LOGIC
AND
ADDRESS
DECODE
SERIAL-TO-
PARALLEL
CONVERTER
CC
AGND DGND DSG
INPUT
REGI STER
1
INPUT
REGISTER
2
INPUT
REGISTER
3
INPUT
REGISTER
4
SS
DAC 1
LATCH
DAC 2
LATCH
DAC 3
LATCH
DAC 4
LATCH
LDAC
Figure 1. AD7834 Figure 2. AD7835
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
REF
DAC 1
DAC 2
DAC 3
DAC 4
V
(+)
REF
×1
V
OUT
×1
V
OUT
V
×1
OUT
×1
V
OUT
CLR
(–)
REF
AD7835
1
2
3
4
BYSHF
DB13
01006-001
DB0
WR
CS
INPUT
BUFFER
A0
ADDRESS
A1
DECODE
A2
INPUT
REGISTER
1
14
INPUT
REGISTER
2
INPUT
REGISTER
3
INPUT
REGISTER
4
AGND DGND
DAC 1
LATCH
DAC 2
LATCH
DAC 3
LATCH
DAC 4
LATCH
LDAC
V
REF
DAC 3
(–)B
DAC 1
DAC 2
DAC 4
(+)
DSGA
REF
×1
V
1
OUT
×1
V
2
OUT
×1
V
3
OUT
×1
DSGB
(+)B
V
REF
V
OUT
CLR
4
01006-002
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2003–2007 Analog Devices, Inc. All rights reserved.
www.analog.com
AD7834/AD7835

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Performance Characteristics ................................................ 5
Timing Specifications .................................................................. 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 13
Theory of Operation ...................................................................... 14
DAC Architecture....................................................................... 14
Data Loading—AD7834 Serial Input Device ......................... 14
Data Loading—AD7835 Parallel Loading Device .................14
Unipolar Configuration............................................................. 15
Bipolar Configuration................................................................ 16
Controlled Power-On of the Output Stage.................................. 17
Power-On with
Power-On with
Loading the DAC and Using the
DSG Voltage Range .................................................................... 18
Power-On of the AD7834/AD7835.............................................. 19
Microprocessor Interfacing........................................................... 20
AD7834 to 80C51 Interface ...................................................... 20
AD7834 to 68HC11 Interface................................................... 20
AD7834 to ADSP-2101 Interface ............................................. 20
AD7834 to DSP56000/DSP56001 Interface............................ 21
AD7834 to TMS32020/TMS320C25 Interface....................... 21
Interfacing the AD7835—16-Bit Interface.............................. 21
Interfacing the AD7835—8-Bit Interface................................ 22
Applications Information.............................................................. 23
Serial Interface to Multiple AD7834s ...................................... 23
Opto-Isolated Interface ............................................................. 23
Automated Test Equipment ...................................................... 23
Power Supply Bypassing and Grounding................................ 24
Outline Dimensions....................................................................... 25
Ordering Guide .......................................................................... 27
CLR
LDAC
Low,
Low,
LDAC
High................................... 17
CLR
High................................... 17
CLR
Input .......................... 17

REVISION HISTORY

7/07—Rev. C to Rev. D
Changes to Table 5 ........................................................................... 7
Added Table 6.................................................................................... 7
Changes to Table 8............................................................................ 9
Updated Outline Dimensions....................................................... 25
Changes to Ordering Guide.......................................................... 27
7/05—Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to Figure 40...................................................................... 25
Changes to Ordering Guide.......................................................... 27
7/03—Rev. A to Rev. B
Revision 0: Initial Version
Rev. D | Page 2 of 28
AD7834/AD7835

SPECIFICATIONS

1
= T
VCC = 5 V ± 5%; VDD = 15 V ± 5%; VSS = −15 V ± 5%; AGND = DGND = 0 V; T
A
MIN
to T
Table 1.
Parameter
A B S Unit Test Conditions/Comments
ACCURACY
Resolution 14 14 14 Bits Relative Accuracy ±2 ±1 ±2 LSB max Differential Nonlinearity ±0.9 ±0.9 ±0.9 LSB max Guaranteed monotonic over temperature. Full-Scale Error V
T
to T
MIN
±5 ±5 ±8 mV max
MAX
Zero-Scale Error ±4 ±4 ±5 mV max V Gain Error ±0.5 ±0.5 ±0.5 mV typ V Gain Temperature
Coefficient
2
4 4 4 ppm FSR/°C typ
20 20 20 ppm FSR/°C max DC Crosstalk2 50 50 50 μV max See the Terminology section. RL = 10 kΩ.
REFERENCE INPUTS
DC Input Resistance 30 30 30 MΩ typ Input Current ±1 ±1 ±1 μA max Per input. V
(+) Range 0/8.192 0/8.192 0/8.192 V min/max
REF
V
(−) Range −8.192/0 −8.192/0 −8.192/0 V min/max
REF
V
REF
(+) − V
(−) 5/14 7/14 5/14 V min/max
REF
DEVICE SENSE GROUND INPUTS
Input Current ±2 ±2 ±2 μA max Per input. V
DIGITAL INPUTS
V
, Input High Voltage 2.4 2.4 2.4 V min
INH
V
, Input Low Voltage 0.8 0.8 0.8 V max
INL
I
, Input Current ±10 ±10 ±10 μA max
INH
CIN, Input Capacitance 10 10 10 pF max
POWER REQUIREMENTS
VCC 5.0 5.0 5.0 V nom ±5% for specified performance. VDD 15.0 15.0 15.0 V nom ±5% for specified performance. VSS −15.0 −15.0 −15.0 V nom ±5% for specified performance. Power Supply Sensitivity
ΔFull Scale/ΔVDD 110 110 110 dB typ
ΔFull Scale/ΔVSS 100 100 100 dB typ ICC 0.2 0.2 0.5 mA max V 3 3 3 mA max AD7834: V 6 6 6 mA max AD7835: V IDD 13 13 15 mA max AD7834: outputs unloaded. 15 15 15 mA max AD7835: outputs unloaded. ISS 13 13 15 mA max Outputs unloaded.
1
Temperature range for A, B, and C versions is 40°C to +85°C.
2
Guaranteed by design.
, unless otherwise noted.
MAX
(+) = +7 V, V
REF
(+) = +7 V, V
REF
(+) = +7 V, V
REF
(−) = −7 V.
REF
(−) = −7 V.
REF
(−) = −7 V.
REF
For specified performance. Can go as low as 0 V, but performance is not guaranteed.
= −2 V to +2 V.
DSG
= VCC, V
INH
= DGND.
INL
= 2.4 V min, V
INH
= 2.4 V min, V
INH
= 0.8 V max.
INL
= 0.8 V max.
INL
Rev. D | Page 3 of 28
AD7834/AD7835
VCC = 5 V ± 5%; VDD = 12 V ± 5%; VSS = −12 V ± 5%; AGND = DGND = 0 V; T
1
= T
to T
MIN
A
, unless otherwise noted.
MAX
Table 2.
Parameter
A B S Unit Test Conditions/Comments
ACCURACY
Resolution 14 14 14 Bits Relative Accuracy ±2 ±1 ±2 LSB max Differential Nonlinearity ±0.9 ±0.9 ±0.9 LSB max Guaranteed monotonic over temperature. Full-Scale Error V
T
to T
MIN
±5 ±5 ±8 mV max
MAX
Zero-Scale Error ±4 ±4 ±5 mV max V Gain Error ±0.5 ±0.5 ±0.5 mV typ V
(+) = +5 V, V
REF
(+) = +5 V, V
REF
(+) = +5 V, V
REF
(−) = –5 V.
REF
(−) = −5 V.
REF
(−) = −5 V.
REF
Gain Temperature Coefficient2 4 4 4 ppm FSR/°C typ 20 20 20 ppm FSR/°C max DC Crosstalk2 50 50 50 μV max See the Terminology section. RL = 10 kΩ.
REFERENCE INPUTS
DC Input Resistance 30 30 30 MΩ typ Input Current ±1 ±1 ±1 μA max Per input. V
(+) Range 0/8.192 0/8.192 0/8.192 V min/max
REF
V
(−) Range −5/0 −5/0 −5/0 V min/max
REF
V
REF
(+) − V
(−) 5/13.192 7/13.192 5/13.192 V min/max
REF
For specified performance. Can go as low as 0 V, but performance is not guaranteed.
DEVICE SENSE GROUND INPUTS
Input Current ±2 ±2 ±2 μA max Per input. V
= −2 V to +2 V.
DSG
DIGITAL INPUTS
V
, Input High Voltage 2.4 2.4 2.4 V min
INH
V
, Input Low Voltage 0.8 0.8 0.8 V max
INL
I
, Input Current ±10 ±10 ±10 μA max
INH
CIN, Input Capacitance 10 10 10 pF max
POWER REQUIREMENTS
VCC 5.0 5.0 5.0 V nom ±5% for specified performance. VDD 15.0 15.0 15.0 V nom ±5% for specified performance. VSS −15.0 −15.0 −15.0 V nom ±5% for specified performance. Power Supply Sensitivity
ΔFull Scale/ΔVDD 110 110 110 dB typ
ΔFull Scale/ΔVSS 100 100 100 dB typ ICC 0.2 0.2 0.5 mA max V 3 3 3 mA max AD7834: V 6 6 6 mA max AD7835: V
= VCC, V
INH
= DGND.
INL
= 2.4 V min, V
INH
= 2.4 V min, V
INH
= 0.8 V max.
INL
= 0.8 V max.
INL
IDD 13 13 15 mA max AD7834: outputs unloaded. 15 15 15 mA max AD7835: outputs unloaded. ISS 13 13 15 mA max Outputs unloaded.
1
Temperature range for A, B, and C versions is 40°C to +85°C.
2
Guaranteed by design.
Rev. D | Page 4 of 28
AD7834/AD7835

AC PERFORMANCE CHARACTERISTICS

These characteristics are included for design guidance and are not subject to production testing.
Table 3.
Parameter
DYNAMIC PERFORMANCE
Output Voltage Settling Time 10 10 10 μs
Digital-to-Analog Glitch Impulse 120 120 120 nV-s
DC Output Impedance 0.5 0.5 0.5 Ω See the Terminology section. Channel-to-Channel Isolation 100 100 100 dB See the Terminology section; applies to the AD7835 only. DAC-to-DAC Crosstalk 25 25 25 nV-s See the Terminology section. Digital Crosstalk 3 3 3 nV-s
Digital Feedthrough—AD7834 0.2 0.2 0.2 nV-s Effect of input bus activity on DAC output under test. Digital Feedthrough—AD7835 1.0 1.0 1.0 nV-s Output Noise Spectral Density at 1 kHz 40 40 40 nV/√Hz All 1s loaded to DAC. V
A B S Unit (typ) Test Conditions/Comments
Full-scale change to ±1/2 LSB. DAC latch contents alternately loaded with all 0s and all 1s.
Measured with V
(+) = V
REF
REF
alternately loaded with all 0s and all 1s.
Feedthrough to DAC output under test due to change in digital input code to another converter.
(+) = V
REF
(−) = 0 V. DAC latch
(−) = 0 V.
REF
Rev. D | Page 5 of 28
AD7834/AD7835
)

TIMING SPECIFICATIONS

VCC = 5 V ± 5%; VDD = 11.4 V to 15.75 V; VSS = −11.4 V to −15.75 V; AGND = DGND = 0 V1.
Table 4.
Parameter Limit at T
MIN
AD7834-SPECIFIC
2
t
1
2
t
2
2
t
30 ns min SCLK high time
3
30 ns min
t4
100 ns min SCLK cycle time 50 ns min SCLK low
t5 40 ns min t6 30 ns min Data setup time
10 ns min Data hold time
t7
0 ns min
t8 t9 40 ns min t21 20 ns min Delay between write operations
AD7835-SPECIFIC
t11 15 ns min t12 15 ns min t13 0 ns min t14 0 ns min t15 40 ns min t16 40 ns min Data setup time
10 ns min Data hold time
t17
0 ns min
t18 t19 0 ns min t20 0 ns min
GENERAL
t10 40 ns min
1
All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and time from a voltage level of 1.6 V.
2
Rise and fall times should be no longer than 50 ns.
1ST
SCLK
FSYNC
DIN
(SIMULTANEOUS
LDAC
UPDATE)
LDAC
(PER-CHANNE L
UPDATE
2ND
CLK
CLK
t
4
t
6
t
MSB LSB
7
D23 D2 2
t
8
Figure 3. AD7834 Timing Diagram Figure 4. AD7835 Timing Diagram
t
1
t
2
Unit Description
, T
MAX
24TH
CLK
t
3
t
5
t
21
D0
D1
t
10
t
9
01006-003
(SIMULTANEOUS
(PER-CHANNEL
, PAEN setup time
FSYNC
, PAEN hold time
FSYNC
LDAC
to FSYNC setup time to FSYNC hold time
LDAC
A0, A1, A2, BYSHF A0, A1, A2, BYSHF CS
to WR setup time
CS
to WR hold time
WR
pulse width
LDAC
to CS setup time
CS
to LDAC setup time
to CS hold time
LDAC
LDAC
, CLR pulse width
A0 A1 A2
BYSHF
CS
WR
DB0 TO DB13
LDAC
UPDATE)
LDAC
UPDATE)
to CS setup time to CS hold time
t
11
t
13
t
18
t
15
t
16
t
12
t
14
t
17
t
10
t
19
t
20
01006-004
Rev. D | Page 6 of 28
AD7834/AD7835

ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in
provide protection.
V
Table 5.
Parameter Rating
VCC to DGND −0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
VDD to AGND −0.3 V to +17 V
DD
IN4148
SD103C
V
DD
AD7834/
AD7835
VSS to AGND +0.3 V to –17 V
AGND to DGND −0.3 V to +0.3 V
Figure 5. Diode Protection
−0.3 V to VCC + 0.3 V Digital Inputs to DGND
V
(+) to V
REF
V
(+) to AGND VSS – 0.3 V to VDD + 0.3 V
REF
V
(–) to AGND VSS – 0.3 V to VDD + 0.3 V
REF
(–) −0.3 V to +18 V
REF
VSS – 0.3 V to VDD + 0.3 V DSG to AGND
V
(1–4) to AGND VSS – 0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range, T
A
−40°C to +85°C Industrial (A Version)
−65°C to +150°C Storage Temperature Range
150°C Junction Temperature, TJ (max) Power Dissipation, PD (max) (TJ − TA)/θJA Lead Temperature JEDEC Industry Standard
Soldering J-STD-020

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θJA Unit
PDIP 75 °C/W SOIC 75 MQFP 95 PLCC 55 °C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 5 can be used to
V
CC
V
CC
01006-005
°C/W °C/W
Rev. D | Page 7 of 28
AD7834/AD7835

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

28
27
26
25
24
23
22
21
20
19
18
17
16
15
AGND
NC
NC
NC
NC
V
DD
V
OUT
V
OUT
CLR
LDAC
FSYNC
PAEN
PA4
PA3
1
3
01006-006
V
REF
V
REF
V
V
DGND
SCLK
V
DSG
OUT
OUT
V
DIN
PA0
PA1
PA2
SS
(–)
(+)
NC
2
4
CC
1
2
3
4
5
AD7834
6
TOP VIEW
(Not to Scale)
7
8
9
10
11
12
13
14
NC = NO CONNECT
Figure 6. AD7834 PDIP and SOIC Pin Configuration
Table 7. AD7834 Pin Function Descriptions
Pin No. Pin Mnemonic Description
1 VSS Negative Analog Power Supply: −15 V ± 5% or −12 V ± 5%. 2 DSG
3 V 4 V
(−) Negative Reference Input. The negative reference voltage is referred to AGND.
REF
Positive Reference Input. The positive reference voltage is referred to AGND.
(+)
REF
5, 24, 25, 26, 27 NC
V
OUT
1 to V
OUT
4 8 DGND 9 VCC
Logic Power Supply: 5 V ± 5%.
10 SCLK
Device Sense Ground Input. Used in conjunction with the CLR the DACs. When CLR
is low, the DAC outputs are forced to the potential on the DSG pin.
No Connect.
22, 6, 21, 7 DAC Outputs.
Digital Ground.
Clock Input. Used for writing data to the device; data is clocked into the input register on the
falling edge of SCLK. 11 DIN 12,13,14,15,16 PA0 to PA4
Serial Data Input.
Package Address Inputs. These inputs are hardwired high (VCC) or low (DGND) to assign dedicated
package addresses in a multipackage environment. 17
PAEN
Package Address Enable Input. When low, this input allows normal operation of the device. When
high, the device ignores the package address, but not the channel address, in the serial data
stream and loads the serial data into the input registers. This feature is useful in a multipackage
application where it can be used to load the same data into the same channel in each package. 18
Frame Sync Input. Active low logic input used, in conjunction with DIN and SCLK, to write data to
FSYNC
the device with serial data expected after the falling edge of this signal. The contents of the 24-bit
serial-to-parallel input register are transferred on the rising edge of this signal. 19
Load DAC Input (Level Sensitive). This input signal, in conjunction with the FSYNC input signal,
LDAC
LDAC
determines how the analog outputs are updated. If
is maintained high while new data is being loaded into the device’s input registers, no change occurs on the analog outputs. Subsequently, when
LDAC
is brought low, the contents of all four input registers are transferred
into their respective DAC latches, updating all of the analog outputs simultaneously.
20
CLR
Asynchronous Clear Input (Level Sensitive, Active Low). When this input is brought low, all analog outputs are switched to the externally set potential on the DSG pin. When CLR signal outputs remain at the DSG potential until LDAC
is brought low. When LDAC is brought low,
the analog outputs are switched back to reflect their individual DAC output levels. As long as CLR
LDAC
remains low, the potential on the DSG pin.
signals are ignored, and the signal outputs remain switched to the
23 VDD Positive Analog Power Supply: 15 V ± 5% or 12 V ± 5%. 28 AGND Analog Ground.
input for power-on protection of
is brought high, the
Rev. D | Page 8 of 28
AD7834/AD7835
AGND
DB2
NC
DB3
(+)B
V
DB4
NC
1
DSGA
2
1
V
3
OUT
2
V
4
OUT
NC
5
A2
6
A1
7
8
A0
CLR
9
LDAC
10
11
BYSHF
NC = NO CONNECT
(+)A
(–)A
REF
NC
V
PIN 1 IDENTIFIER
REF
V
DD
SS
V
V
NC
40 39 3841424344 36 35 3437
AD7835
TOP VIEW
(Not to Scale)
12 13 14 15 16 17 18 192021 22
CC
CS
WR
V
DB0
DGND
DB1
Figure 7. AD7835 MQFP Pin Configuration Figure 8. AD7835 PLCC Pin Configuration
Table 8. AD7835 Pin Function Descriptions
Pin No. MQFP
1, 5, 33, 34, 37, 41, 44
Pin No. PLCC Pin Mnemonic Description
3, 6, 7, 11, 39,
NC No Connect.
40, 43
(–)A
(–)B
REF
REF
V
NC
NC
DSGA
V
OUT
V
OUT
CLR
LDAC
BYSHF
NC
A0
7
8
1
9
10
2
11
A2
12
13
A1
14
15
16
17
DB5
DB6
NC
33
32
DSGB
3
V
31
OUT
4
30
V
OUT
DB13
29
DB12
28
27
DB11
DB10
26
25
DB9
24
DB8
23
DB7
01006-007
NC = NO CONNECT
(+)A
REF
NC
V
SS
DD
V
AGND
V
244345642414043
1
PIN 1 IDENTIFIER
NC
REF
V
AD7835
TOP VIEW
(Not to Scale)
181920 21 22 23 24 252627 28
CC
CS
WR
V
DGND
DB0
DB1
DB2
NC
DB3
(+)B
REF
V
DB4
(–)B
REF
V
DB5
NC
DB6
NC
39
38
DSGB
3
V
37
OUT
36
4
V
OUT
DB13
35
34
DB12
33
DB11
DB10
32
31
DB9
DB8
30
29
DB7
01006-008
2 8 DSGA
Device Sense Ground A Input. Used in conjunction with the CLR protection of the DACs. When
V
1 to V
OUT
8, 7, 6 14, 13, 12 A0, A1, A2
potential on the DSGA pin.
4 3, 4, 31, 30 9, 10, 37, 36 DAC Outputs.
OUT
Address Inputs. A0 and A1 are decoded to select one of the four input latches for a data transfer. A2 is used to select all four DACs simultaneously.
9 15
CLR
Asynchronous Clear Input (Level Sensitive, Active Low). When this input is brought low,
all analog outputs are switched to the externally set potentials on the DSG pins (V and V
2 follow DSGA, and V
OUT
signal outputs remain at the DSG potentials until LDAC brought low, the analog outputs are switched back to reflect their individual DAC output levels. As long as
remains low, the LDAC signals are ignored, and the signal outputs
CLR
remain switched to the potential on the DSG pins.
10 16
Load DAC Input (Level Sensitive). This input signal, in conjunction with the WR and CS
LDAC
input signals, determines how the analog outputs are updated. If high while new data is being loaded into the device’s input registers, no change occurs on the analog outputs. Subsequently, when input registers are transferred into their respective DAC latches, updating the analog outputs simultaneously. Alternatively, if entered, the addressed DAC latch and corresponding analog output are updated immediately on the rising edge of
11 17
Byte Shift Input. When low, it shifts the data on DB0 to DB7 into the DB8 to DB13 half of
BYSHF
the input register.
12 18
CS
Level-Triggered Chip Select Input (Active Low). The device is selected when this input is
low.
13 19
Level-Triggered Write Input (Active Low). When active, it is used in conjunction with CS
WR
to write data over the input databus. 14 20 VCC Logic Power Supply: 5 V ± 5%. 15 21 DGND Digital Ground.
CLR
is low, DAC outputs V
OUT
3 and V
4 follow DSGB). When CLR
OUT
LDAC
LDAC
.
WR
input for power-on
1 and V
OUT
2 are forced to the
OUT
OUT
is brought high, the
is brought low. When LDAC is
LDAC
is maintained
is brought low, the contents of all four
is brought low while new data is being
1
Rev. D | Page 9 of 28
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