FEATURES
2 ms ADC with Track/Hold
1 ms DAC with Output Amplifier
AD7569, Single DAC Output
AD7669, Dual DAC Output
On-Chip Bandgap Reference
Fast Bus Interface
Single or Dual 5 V Supplies
GENERAL DESCRIPTION
The AD7569/AD7669 is a complete, 8-bit, analog I/O system
on a single monolithic chip. The AD7569 contains a high speed
successive approximation ADC with 2 µs conversion time, a track/
hold with 200 kHz bandwidth, a DAC and an output buffer amplifier with 1 µs settling time. A temperature-compensated 1.25 V
bandgap reference provides a precision reference voltage for the
ADC and the DAC. The AD7669 is similar, but contains two
DACs with output buffer amplifiers.
A choice of analog input/output ranges is available. Using a supply voltage of +5 V, input and output ranges of zero to 1.25 V
and zero to 2.5 volts may be programmed using the RANGE input pin. Using a ±5 V supply, bipolar ranges of ±1.25 V or
±2.5 V may be programmed.
Digital interfacing is via an 8-bit I/O port and standard microprocessor control lines. Bus interface timing is extremely fast, allowing easy connection to all popular 8-bit microprocessors. A
separate start convert line controls the track/hold and ADC to
give precise control of the sampling period.
The AD7569/AD7669 is fabricated in Linear-Compatible
CMOS (LC
combining precision bipolar circuits with low power CMOS
logic. The AD7569 is packaged in a 24-pin, 0.3" wide “skinny”
DIP, a 24-terminal SOIC and 28-terminal PLCC and LCCC
packages. The AD7669 is available in a 28-pin, 0.6" plastic
DIP, 28-terminal SOIC and 28-terminal PLCC package.
2
MOS), an advanced, mixed technology process
Complete, 8-Bit Analog I/0 Systems
AD7569/AD7669
AD7569 FUNCTIONAL BLOCK DIAGRAM
AD7669 FUNCTIONAL BLOCK DIAGRAM
PRODUCT HIGHLIGHTS
1. Complete Analog I/O on a Single Chip.
The AD7569/AD7669 provides everything necessary to
interface a microprocessor to the analog world. No external
components or user trims are required and the overall accuracy of the system is tightly specified, eliminating the need
to calculate error budgets from individual component
specifications.
2. Dynamic Specifications for DSP Users.
In addition to the traditional ADC and DAC specifications,
the AD7569/AD7669 is specified for ac parameters, including signal-to-noise ratio, distortion and input bandwidth.
3. Fast Microprocessor Interface.
The AD7569/AD7669 has bus interface timing compatible
with all modern microprocessors, with bus access and relinquish times less than 75 ns and write pulse width less than
80 ns.
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Digital-to-Analog Glitch Impulse
Digital Feedthrough
to V
V
IN
OUT
DAC to DAC Crosstalk
5
Isolation60606060dB typVIN = ±2.5 V, 50 kHz Sine Wave
5
15151515nV secs typ
1111nV secs typ
5
(AD7669 Only)1nV secs typ
DACA to DACB Isolation5 (AD7669 Only)–70dB max
POWER REQUIREMENTS
V
Range4.75/5.254.75/5.254.75/5.254.75/5.25V min/V max For Specified Performance
DD
Range (Dual Supplies)–4.75/–5.25–4.75/–5.25 –4.75/–5.25 –4.75/–5.25 V min/V max Specified Performance also applies to VSS = 0 V
V
SS
I
DD
(AD7569)13131313mA maxOutput unloaded
for unipolar ranges.
V
= VIN = 2.5 V; Logic Inputs = 2.4 V; CLK = 0.8 V
OUT
(AD7669)18mA maxOutputs unloaded
I
(Dual Supplies)V
SS
(AD7569)4444mA maxOutput unloaded
= VIN = –2.5 V; Logic Inputs = 2.4 V; CLK = 0.8 V
OUT
(AD7669)6mA maxOutputs unloaded
DAC/ADC MATCHING
Gain Matching
@ +25°C1 111% typ20 kHz sine wave
T
MIN
NOTES
1
Specifications apply to both DACs in the AD7669. V
2
Except where noted, specifications apply for all output ranges including bipolar ranges with dual supply operation.
3
Temperature ranges as follows:J, K versions; 0°C to +70°C
4
1 LSB = 4.88 mV for 0 V to +1.25 V output range, 9.76 mV for 0 V to +2.5 V and ±1.25 V ranges and 19.5 mV for ±2.5 V range.
5
See Terminology.
6
Includes internal voltage reference error and is calculated after offset error has been adjusted out. Ideal unipolar full-scale voltage is (FS – 1 LSB); ideal bipolar positive full-scale voltage is (FS/2 – 1 LSB)
and ideal bipolar negative full-scale voltage is –FS/2.
7
Sample tested at +25°C to ensure compliance.
Specifications subject to change without notice.
to T
MAX
6
VIN to V
match with VIN = ±2.5 V,
OUT
1 111% typ
applies to both V
OUT
A, B versions; –40°C to +85°C
S, T versions; –55°C to +125°C
Signal-to-Noise Ratio
Total Harmonic Distortion4 (THD)48484848dB maxVIN = 100 kHz full-scale sine wave with f
Intermodulation Distortion4 (IMD)60606060dB typfa = 99 kHz, fb = 96.7 kHz with f
Frequency Response0.10.10.10.1dB typV
Track/Hold Acquisition Time
(SNR)44464445dB minVIN = 100 kHz full-scale sine wave with f
7
INL
INH
8
8
= +25°C1.61.61.61.6µs minUsing recommended clock components shown in Figure 21.
A
(VDD = +5 V 6 5%; V
to T
MIN
unless otherwise noted.) Specifications apply to Mode 1 interface.
MAX
AD7569
J, A Versions
AD7669K, BAD7569AD7569
8888Bits
± 3± 3±4±4LSB typ
± 1± 1/2± 1± 1/2LSB max
± 1± 3/4± 1± 3/4LSB maxNo Missing Codes
3
± 3±2.5± 3±2.5LSB max
±3.5±3±4± 3.5LSB max
–5.5, +1.5–5.5, +1.5–7.5, +2–7.5, +2LSB max
200200300300ns typ
0.80.80.80.8V max
2.42.42.42.4V min
10101010pF max
–1.6–1.6–1.6–1.6mA maxVIN = 0 V
40404040µA maxVIN = V
10101010pF max
2.62.62.62.6µs maxClock frequency can be adjusted by varying R
= 0 V
SS
SS
= 400 kHz
= 400 kHz
.
CLK
= –5 V
6
6
POWER REQUIREMENTS As per DAC Specifications
NOTES
1
Except where noted, specifications apply for all ranges including bipolar ranges with dual supply operation.
2
Temperature ranges are as follows: J, K versions; 0°C to +70°C
3
1 LSB = 4.88 mV for 0 V to +1.25 V range, 9.76 mV for 0 V to +2.5 V and ±1.25 V ranges and 19.5 mV for +2.5 V range.
4
See Terminology.
5
Includes internal voltage reference error and is calculated after offset error has been adjusted out. Ideal unipolar last code transition occurs at (FS – 3/2 LSB). Ideal bipolar last code transition occurs at
(FS/2 – 3/2 LSB).
6
Exact frequencies are 101 kHz and 384 kHz to avoid harmonics coinciding with sampling frequency.
7
Rising edge of BUSY to falling edge of ST. The time given refers to the acquisition time, which gives a 3 dB degradation in SNR from the tested figure.
8
Sample tested at +25°C to ensure compliance.
Specifications subject to change without notice.
REV. B
A, B versions; –40°C to +85°C
S, T versions; –55°C to +125°C
–3–
1
WARNING!
ESD SENSITIVE DEVICE
AD7569/AD7669–TIMING CHARACTERISTICS
(See Figures 8, 10, 12; VDD = 5 V 6 5%; VSS = 0 V or –5 V 6 5%)
Limit atLimit at
Limit atT
MIN
, T
MAX
T
, T
MIN
MAX
Parameter258C (All Grades)(J, K, A, B Grades)(S, T Grades)UnitsTest Conditions/Comments
DAC Timing
t
1
t
2
t
3
t
4
t
5
808090ns minWR Pulse Width
000ns minCS, A/B to WR Setup Time
000ns minCS, A/B to WR Hold Time
607080ns minData Valid to WR Setup Time
101010ns minData Valid to WR Hold Time
ADC Timing
t
6
t
7
t
8
t
9
t
10
t
11
t
12
2
t
13
3
t
14
505050ns minST Pulse Width
110130150ns maxST to BUSY Delay
203030ns maxBUSY to INT Delay
000ns minBUSY to CS Delay
000ns minCS to RD Setup Time
607590ns minRD Pulse Width Determined by t13.
000ns minCS to RD Hold Time
607590ns maxData Access Time after RD; CL = 20 pF
95120135ns maxData Access Time after
RD; CL = 100 pF
101010ns minBus Relinquish Time after RD
607585ns max
t
15
t
16
2
t
17
657585ns maxRD to INT Delay
120140160ns maxRD to BUSY Delay
607590ns maxData Valid Time after BUSY; CL = 20 pF
90115135ns maxData Valid Time after BUSY; CL = 100 pF
NOTES
1
Sample tested at +25°C to ensure compliance. All input control signals are specified with tR = tF = 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.
2
t13 and t17 are measured with the load circuits of Figure 1 and defined as the time required for an output to cross either 0.8 V or 2.4 V.
3
tl4 is defined as the time required for the data line to change 0.5 V when loaded with the circuit of Figure 2.
Logic Voltage to DGND . . . . . . . . . . . . . –0.3 V, V
CLK Input Voltage to DGND . . . . . . . . . –0.3 V, V
V
(V
OUT
1
A, V
DAC
OUT
AGND
V
to AGND
IN
NOTE
1
Output may be shorted to any voltage in the range VSS to VDD provided that the
power dissipation of the package is not exceeded. Typical short circuit current for
a short to AGND or VSS is 50 mA.
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other condition above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7569/AD7669 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. B
AD7569/AD7669
NOTE:
The term DAC (Digital-to-Analog Converter) throughout the
data sheet applies equally to the dual DACs in the AD7669 as
well as to the single DAC of the AD7569 unless otherwise
stated. It follows that the term V
V
B of the AD7669 also.
OUT
TERMINOLOGY
Total Unadjusted Error
applies to both V
OUT
OUT
A and
Total unadjusted error is a comprehensive specification that includes internal voltage reference error, relative accuracy, gain
and offset errors.
Relative Accuracy (DAC)
Relative Accuracy or endpoint nonlinearity is a measure of the
maximum deviation from a straight line passing through the
endpoints of the DAC transfer function. It is measured after allowing for offset and gain errors. For the bipolar output ranges,
the endpoints of the DAC transfer function are defined as those
voltages that correspond to negative full-scale and positive fullscale codes. For the unipolar output ranges, the endpoints are
code 1 and code 255. Code 1 is chosen because the amplifier is
now working in single supply and, in cases where the true offset
of the amplifier is negative, it cannot be seen at code 0. If the
relative accuracy were calculated between code 0 and code 255,
the “negative offset” would appear as a linearity error. If the offset is negative and less than 1 LSB, it will appear at code 1, and
hence the true linearity of the converter is seen between code 1
and code 255.
Relative Accuracy (ADC)
Relative Accuracy is the deviation of the ADC’s actual code
transition points from a straight line drawn between the endpoints of the ADC transfer function. For the bipolar input
ranges, these points are the measured, negative, full-scale transition point and the measured, positive, full-scale transition point.
For the unipolar ranges, the straight line is drawn between the
measured first LSB transition point and the measured full-scale
transition point.
Differential Nonlinearity
Differential Nonlinearity is the difference between the measured
change and an ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ± 1 LSB max ensures monotonicity (DAC) or no missed codes (ADC). A differential nonlinearity of ±3/4 LSB max ensures that the minimum
step size (DAC) or code width (ADC) is 1/4 LSB, and the maximum step size or code width is 3/4 LSB.
Digital-to-Analog Glitch Impulse
Digital-to-Analog Glitch Impulse is the impulse injected into the
analog output when the digital inputs change state with the
DAC selected. It is normally specified as the area of the glitch in
nV secs and is measured when the digital input code is changed
by 1 LSB at the major carry transition.
Digital Feedthrough
Digital Feedthrough is also a measure of the impulse injected to
the analog output from the digital inputs, but is measured when
the DAC is not selected. It is essentially feedthrough across the
die and package. It is also a measure of the glitch impulse transferred to the analog output when data is read from the internal
ADC. It is specified in nV secs and is measured with
WR high
and a digital code change from all 0s to all 1s.
DAC-to-DAC Crosstalk (AD7669 Only)
The glitch energy transferred to the output of one DAC due to
an update at the output of the second DAC. The figure given is
the worst case and is expressed in nV secs. It is measured with
an update voltage of full scale.
DAC-to-DAC Isolation (AD7669 Only)
DAC-to-DAC Isolation is the proportion of a digitized sine
wave from the output of one DAC, which appears at the output
of the second DAC (loaded with all 1s). The figure given is the
worst case for the second DAC output and is expressed as a ratio in dBs. It is measured with a digitized sine wave (f
SAMPLING
=
100 kHz) of 20 kHz at 2.5 V pk-pk.
Signal-to-Noise Ratio
Signal-to-Noise Ratio (SNR) is the measured signal to noise at
the output of the converter. The signal is the rms magnitude of
the fundamental. Noise is the rms sum of all the nonfundamental signals (excluding dc) up to half the sampling frequency.
SNR is dependent on the number of quantization levels used in
the digitization process; the more levels, the smaller the quantization noise. The theoretical SNR for a sine wave is given by
SNR = (6.02N + 1.76) dB
where N is the number of bits. Thus for an ideal 8-bit converter,
SNR = 50 dB.
Harmonic Distortion
Harmonic Distortion is the ratio of the rms sum of harmonics to
the fundamental. For the AD7569/AD7669, Total Harmonic
Distortion (THD) is defined as
2
2
2
2
2
+V
5
6
20 log
+V
+V
V
2
3
+V
4
V
1
where V1 is the rms amplitude of the fundamental and V2, V3,
V
, V5 and V6 are the rms amplitudes of the individual
4
harmonics.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities will create distortion
products, of order (m + n), at sum and difference frequencies of
mfa ± nfb where m, n = 0, l, 2, 3,… . Intermodulation terms
are those for which m or n is not equal to zero. For example,
the second order terms include (fa + fb) and (fa – fb) and the
third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and
(fa – 2fb).
REV. B
–5–
AD7569/AD7669
AD7569 PIN CONFIGURATIONS
DIP, SOIC
AD7669 PIN CONFIGURATIONS
DIP, SOIC
PLCC
PLCC
LCCC
ORDERING GUIDE
Relative
TemperatureAccuracyPackage
ModelRangeT
MIN –TMAX
Option
AD7569JN0°C to +70°C±1 LSBN-24
AD7569JR0°C to +70°C±1 LSBR-24
AD7569AQ–40°C to +85°C±1 LSBQ-24
AD7569SQ
2
–55°C to +125°C±1 LSBQ-24
AD7569BN–40°C to +85°C±0.5 LSBN-24
AD7569KN0°C to +70°C±0.5 LSBN-24
AD7569BR–40°C to +85°C±0.5 LSBR-24
AD7569BQ–40°C to +85°C±0.5 LSBQ-24
AD7569TQ
AD7569JP0°C to +70°C±1 LSBP-28A
AD7569SE
AD7569KP0°C to +70°C±1/2 LSBP-28A
AD7569TE
2
–55°C to +125°C±1/2 LSBQ-24
2
–55°C to +125°C±1 LSBE-28A
2
–55°C to +125°C±1/2 LSBE-28A
AD7669AN–40°C to +85°C±1 LSBN-28
AD7669JN0°C to +70°C±1 LSBN-28
AD7669JP0°C to +70°C±1 LSBP-28A
AD7669AR–40°C to +85°C±1 LSBR-28
AD7669JR0°C to +70°C±1 LSBR-28
NOTES
1
E = Leadless Ceramic Chip Carrier; N = Plastic DIP; P = Plastic Leaded Chip
Carrier; Q = Cerdip; R = Small Outline SOIC.
2
To order MIL-STD-883, Class B processed parts, add /883B to part number.
Contact your local sales office for military data sheet.
1
–6–
REV. B
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