Analog Devices AD7664 e Datasheet

a
SWITCHED
CAP DAC
16
CONTROL LOGIC AND
CALIBRATION CIRCUITRY
CLOCK
AD7664
D[15:0]
BUSY
RD
CS
SER/PAR
OB/2C
OGND
OVDD
DGNDDVDD
AVDD AGND REF REFGND
IN
INGND
PD
RESET
SERIAL
PORT
PARALLEL
INTERFACE
CNVSTWARP IMPULSE
PulSAR
16-Bit, 570 kSPS
®
Unipolar CMOS ADC
FEATURES Throughput:
570 kSPS (Warp Mode) 500 kSPS (Normal Mode)
444 kSPS (Impulse Mode) INL: 2.5 LSB Max (0.0038% of Full Scale) 16-Bit Resolution with No Missing Codes S/(N+D): 90 dB Typ @ 45 kHz THD: –100 dB Typ @ 45 kHz Analog Input Voltage Range: 0 V to 2.5 V Both AC and DC Specifications No Pipeline Delay Parallel and Serial 5 V/3 V Interface
®
/QSPITM/MICROWIRETM/DSP Compatible
SPI Single 5 V Supply Operation Power Dissipation
115 mW Maximum,
21 W @ 100 SPS Power-Down Mode: 7 W Max Package: 48-Lead Quad Flat Pack (LQFP)
48-Lead Chip Scale Package (LFCSP) Pin-to-Pin Compatible Upgrade of the AD7660
APPLICATIONS Data Acquisition Instrumentation Digital Signal Processing Spectrum Analysis Medical Instruments Battery-Powered Systems Process Control

GENERAL DESCRIPTION

The AD7664 is a 16-bit, 570 kSPS, charge redistribution SAR, analog-to-digital converter that operates from a single 5 V power supply. The part contains a high speed 16-bit sampling ADC, an internal conversion clock, error correction circuits, and both serial and parallel system interface ports.
The AD7664 is hardware factory-calibrated and is comprehensively tested to ensure such ac parameters as signal-to-noise ratio (SNR) and total harmonic distortion (THD), in addition to the more traditional dc parameters of gain, offset, and linearity.
It features a very high sampling rate mode (Warp), a fast mode (Normal) for asynchronous conversion rate applications, and for low power applications, a reduced power mode (Impulse) where the power is scaled with the throughput.
REV. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
AD7664

FUNCTIONAL BLOCK DIAGRAM

Table I. PulSAR Selection
*
Type/kSPS 100–250 500–570 800–1000
Pseudo AD7651 AD7650/AD7652 AD7653 Differential AD7660/AD7661 AD7664/AD7666 AD7667
True Bipolar AD7663 AD7665 AD7671
True AD7675 AD7676 AD7677 Differential
18-Bit AD7678 AD7679 AD7674
Simultaneous/ AD7654 Multichannel AD7655
It is fabricated using Analog Devices’ high performance, 0.6 micron CMOS process, with correspondingly low cost and is available in a 48-lead LQFP and a tiny 48-lead LFCSP with operation specified from –40°C to +85°C.

PRODUCT HIGHLIGHTS

1. Fast Throughput The AD7664 is a 570 kSPS, charge redistribution, 16-bit SAR ADC with internal error correction circuitry.
2. Superior INL The AD7664 has a maximum integral nonlinearity of 2.5 LSBs with no missing 16-bit code.
3. Single-Supply Operation The AD7664 operates from a single 5 V supply and dissipates only a maximum of 115 mW. In Impulse Mode, its power dissipation decreases with the throughput to, for instance, only 21 µW at a 100 SPS throughput. It consumes 7 µW maximum when in power-down.
4. Serial or Parallel Interface Versatile parallel or 2-wire serial interface arrangement compatible with both 3 V or 5 V logic.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
AD7664
–SPECIFICATIONS
(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)
Parameter Conditions Min Typ Max Unit
RESOLUTION 16 Bits
ANALOG INPUT
Voltage Range V Operating Input Voltage V
Analog Input CMRR fIN = 10 kHz 62 dB
IN
IN
V
INGND
– V
INGND
0V –0.1 +3 V
REF
V
–0.1 +0.5 V
Input Current 570 kSPS Throughput 7 µA Input Impedance See Analog Input Section
THROUGHPUT SPEED
Complete Cycle In Warp Mode 1.75 µs Throughput Rate In Warp Mode 1 570 kSPS Time between Conversions In Warp Mode 1 ms Complete Cycle In Normal Mode 2 µs Throughput Rate In Normal Mode 0 500 kSPS Complete Cycle In Impulse Mode 2.25 µs Throughput Rate In Impulse Mode 0 444 kSPS
DC ACCURACY
Integral Linearity Error –2.5 +2.5 LSB
1
Differential Linearity Error –1 +1.5 LSB No Missing Codes 16 Bits Transition Noise 0.7 LSB Full-Scale Error Unipolar Zero Error
2
2
REF = 2.5 V ±0.08 % of FSR
±5 ±15 LSB
Power Supply Sensitivity AVDD = 5 V ±5% ±3 LSB
AC ACCURACY
Signal-to-Noise f Spurious-Free Dynamic Range fIN = 45 kHz 100 dB
= 100 kHz 90 dB
IN
3
fIN = 100 kHz 100 dB
Total Harmonic Distortion fIN = 45 kHz –100 dB
fIN = 100 kHz –100 dB
Signal-to-(Noise+Distortion) fIN = 45 kHz 90 dB
fIN = 100 kHz 89 dB –60 dB Input, fIN = 100 kHz 30 dB
–3 dB Input Bandwidth 18 MHz
SAMPLING DYNAMICS
Aperture Delay 2ns Aperture Jitter 5 ps rms Transient Response Full-Scale Step 250 ns
REFERENCE
External Reference Voltage Range 2.3 2.5 AVDD – 1.85 V External Reference Current Drain 570 kSPS Throughput 115 µA
DIGITAL INPUTS
Logic Levels
V
IL
V
IH
I
IL
I
IH
–0.3 +0.8 V
2.0 OVDD + 0.3 V –1 +1 µA –1 +1 µA
DIGITAL OUTPUTS
Data Format Parallel or Serial 16-Bits Pipeline Delay Conversion Results Available
Immediately after Completed Conversion
I
V
OL
V
OH
= 1.6 mA 0.4 V
SINK
I
= –500 µA OVDD – 0.6 V
SOURCE
POWER SUPPLIES
Specified Performance
AVDD 4.75 5 5.25 V DVDD 4.75 5 5.25 V OVDD 2.7 5.25 V
Operating Current
AVDD 15.5 mA
5
DVDD
5
OVDD
Power Dissipation
4
500 kSPS Throughput
3.8 mA
5
500 kSPS Throughput 100 SPS Throughput
In Power-Down Mode
4
6
7
100 µA
115 mW
21 µW
7 µW
–2–
REV. E
AD7664
Parameter Conditions Min Typ Max Unit
TEMPERATURE RANGE
Specified Performance T
NOTES
1
LSB means least significant bit. With the 0 V to 2.5 V input range, one LSB is 38.15 µV.
2
See Definition of Specifications section. These specifications do not include the error contribution from the external reference.
3
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full-scale unless otherwise specified.
4
In Normal Mode.
5
Tested in Parallel Reading Mode.
6
In Impulse Mode.
7
With all digital inputs forced to OVDD or OGND, respect
8
Contact factory for extended temperature range.
Specifications subject to change without notice.
8
MIN
to T
MAX
–40 +85
°C
ively.

TIMING SPECIFICATIONS

Parameter
(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)
Symbol Min Typ Max Unit
REFER TO FIGURES 11 AND 12
Convert Pulse Width t Time between Conversions t
(Warp Mode/Normal Mode/Impulse Mode)
CNVST LOW to BUSY HIGH Delay t BUSY HIGH All Modes Except in t
Master Serial Read after Convert Mode
1
2
3
4
5ns
1.75/2/2.25 Note 1 µs
25 ns
1.5/1.75/2 µs
(Warp Mode/Normal Mode/Impulse Mode) Aperture Delay t End of Conversion to BUSY LOW Delay t Conversion Time t
(Warp Mode/Normal Mode/Impulse Mode) Acquisition Time t RESET Pulsewidth t
5
6
7
8
9
10 ns
250 ns 10 ns
2ns
1.5/1.75/2 µs
REFER TO FIGURES 13, 14, AND 15 (Parallel Interface Modes)
CNVST LOW to DATA Valid Delay t
(Warp Mode/Normal Mode/Impulse Mode) DATA Valid to BUSY LOW Delay t Bus Access Request to DATA Valid t Bus Relinquish Time t
REFER TO FIGURES 16 AND 17 (Master Serial Interface Modes)
CS LOW to SYNC Valid Delay t CS LOW to Internal SCLK Valid Delay
2
CS LOW to SDOUT Delay t CNVST LOW to SYNC Delay t
(Warp Mode/Normal Mode/Impulse Mode) SYNC Asserted to SCLK First Edge Delay t Internal SCLK Period t Internal SCLK HIGH (INVSCLK Low) Internal SCLK LOW (INVSCLK Low)
3
3
SDOUT Valid Setup Time t SDOUT Valid Hold Time t SCLK Last Edge to SYNC Delay t
CS HIGH to SYNC HI-Z t CS HIGH to Internal SCLK HI-Z t CS HIGH to SDOUT HI-Z t
BUSY HIGH in Master Serial Read after Convert t
(Warp Mode/Normal Mode/Impulse Mode) CNVST LOW to SYNC Asserted Delay t
(Warp Mode/Normal Mode/Impulse Mode) SYNC Deasserted to BUSY LOW Delay t
REFER TO FIGURES 18 AND 20 (Slave Serial Interface Modes)
External SCLK Setup Time t External SCLK Active Edge to SDOUT Delay t SDIN Setup Time t SDIN Hold Time t External SCLK Period t External SCLK HIGH t External SCLK LOW t
NOTES
1
In Warp Mode only, the maximum time between conversions is 1 ms; otherwise, there is no required maximum time.
2
In Serial Interface Modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
3
If the polarity of SCLK is inverted, the timing references of SCLK are also inverted.
Specifications subject to change without notice.
REV. E
10
11
12
13
2
14
t
15
16
17
18
19
t
20
t
21
22
23
24
25
26
27
28
29
30
2
31
32
33
34
35
36
37
45 ns
515ns
25/275/525 ns
4ns 40 75 ns 30 ns
9.5 ns
4.5 ns 3ns 3
1/1.25/1.5 µs
50 ns
5ns 316ns 5ns 5ns 25 ns 10 ns 10 ns
–3–
1.5/1.75/2 µs
40 ns
10 ns 10 ns 10 ns
10 ns 10 ns 10 ns
2.75/3/3.25 µs
AD7664

ABSOLUTE MAXIMUM RATINGS

1
IN2, REF, INGND, REFGND to AGND
. . . . . . . . . . . . . . . . . . . . . . . AVDD + 0.3 V to AGND – 0.3 V
Ground Voltage Differences
AGND, DGND, OGND . . . . . . . . . . . . . . . . . . . . . . ± 0.3 V
Supply Voltages
AVDD, DVDD, OVDD . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD, AVDD to OVDD . . . . . . . . . . . . . . ±7 V
DVDD to OVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±7 V
Digital Inputs
Except the Databus D(7:4) . . . . . –0.3 V to DVDD + 3.0 V
Databus D(7:4) . . . . . . . . . . . . . . –0.3 V to OVDD + 3.0 V
Internal Power Dissipation
3
. . . . . . . . . . . . . . . . . . . . 700 mW
Internal Power Dissipation4 . . . . . . . . . . . . . . . . . . . . . . 2.5 W
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.
2
See Analog Input section.
3
Specification is for the device in free air:
48-Lead LQFP; θ
4
Specification is for device in free air:
48-Lead LFCSP; θ
= 91°C/W, θ
JA
= 26°C/W.
JA
= 30°C/W.
JC
I
1.6mA
TO OUTPUT
PIN
C
L
60pF*
500A
*
IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND SDOUT TIMINGS ARE DEFINED WITH A MAXIMUM LOAD
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
C
L
OL
1.4V
I
OH
Figure 1. Load Circuit for Digital Interface Timing, SDOUT, SYNC, SCLK Outputs, C
0.8V
t
DELAY
2V
0.8V
= 10 pF
L
2V
t
DELAY
2V
0.8V
Figure 2. Voltage Reference Levels for Timing

ORDERING GUIDE

Temperature
Model Range Package Description Package Option
AD7664AST –40°C to +85°C Quad Flatpack (LQFP) ST-48 AD7664ASTRL –40°C to +85°C Quad Flatpack (LQFP) ST-48 AD7664ACP –40°C to +85°C Chip Scale (LFCSP) CP-48 AD7664ACPRL –40°C to +85°C Chip Scale (LFCSP) CP-48 EVAL-AD7664CB EVAL-CONTROL-BRD2
NOTES
1
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL-BRD2 for evaluation/
demonstration purposes.
2
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
1
2
Evaluation Board Controller Board
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7664 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. E

PIN CONFIGURATION

AD7664
AGND AVDD
NC
DGND
OB/2C WARP
IMPULSE SER/PAR
D0
D1
D2 D3
NC = NO CONNECT
NCNCNCNCNCINNCNCNC
48
47 46 45 44 39 38 3743 42 41 40
1
PIN 1 IDENTIFIER
2
3
4
5
6
7
8
9
10
11
12
13 14
D4/EXT/INT
AD7664
TOP VIEW
(Not to Scale)
15 16 17 18 19 20 21 22 23 24
OGND
D6/INVSCLK
D5/INVSYNC
D7/RDC/SDIN
OVDD
DVDD
DGND
INGND
REFGND
D9/SCLK
D10/SYNC
D8/SDOUT
REF
36
AGND
35
CNVST
34
PD
33
RESET
32
CS
31
RD
30
DGND
29
BUSY
28
D15
27
D14
26
D13
25
D12
D11/RDERROR

PIN FUNCTION DESCRIPTIONS

Pin No. Mnemonic Type Description
1 AGND P Analog Power Ground Pin. 2 AVDD P Input Analog Power Pins. Nominally 5 V. 3, 40–42, NC No Connect. 44–48 4 DGND DI Must Be Tied to the Ground Where DVDD Is Referred. 5OB/2C DI Straight Binary/Binary Twos Complement. When OB/2C is HIGH, the digital output is
straight binary; when LOW, the MSB is inverted resulting in a twos complement output from its internal shift register.
6 WARP DI Mode Selection. When HIGH and IMPULSE LOW, this input selects the fastest mode, the
maximum throughput is achievable, and a minimum conversion rate must be applied in order to guarantee full specified accuracy. When LOW, full accuracy is maintained independent of the minimum conversion rate.
7 IMPULSE DI Mode Selection. When HIGH and WARP LOW, this input selects a reduced power mode. In
this mode, the power dissipation is approximately proportional to the sampling rate.
8 SER/PAR DI Serial/Parallel Selection Input. When LOW, the Parallel Port is selected; when HIGH, the
Serial Interface Mode is selected and some bits of the DATA bus are used as a Serial Port.
9–12 D[0:3] DO Bit 0 to Bit 3 of the Parallel Port Data Output Bus. These pins are always outputs, regardless
of the state of SER/PAR.
13 D4 DI/O When SER/PAR is LOW, this output is used as Bit 4 of the Parallel Port Data Output Bus.
or EXT/INT When SER/PAR is HIGH, this input, part of the Serial Port, is used as a digital select input
for choosing the internal or an external data clock. With EXT/INT tied LOW, the internal
is selected on the SCLK output. With EXT/
clock synchronized
to an external clock signal connected to the SCLK input.
INT
set to a logic HIGH, output data is
14 D5 DI/O When SER/PAR is LOW, this output is used as Bit 5 of the Parallel Port Data Output Bus.
or INVSYNC When SER/PAR is HIGH, this input, part of the Serial Port, is used to select the active state
of the SYNC signal. It is active in both Master and Slave Mode. When LOW, SYNC is active HIGH. When HIGH, SYNC is active LOW.
15 D6 DI/O When SER/PAR is LOW, this output is used as Bit 6 of the Parallel Port Data Output Bus.
or INVSCLK
When SER/
PAR
is HIGH, this input, part of the Serial Port, is used to invert the SCLK signal.
It is active in both Master and Slave Mode.
REV. E
–5–
AD7664
Pin No. Mnemonic Type Description
16 D7 DI/O When SER/PAR is LOW, this output is used as Bit 7 of the Parallel Port Data Output Bus.
or RDC/SDIN When SER/PAR is HIGH, this input, part of the Serial Port, is used as either an external
data input or a Read Mode selection input depending on the state of EXT/INT. When EXT/INT is HIGH, RDC/SDIN could be used as a data input to daisy-chain the conversion
results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on DATA with a delay of 16 SCLK periods after the initiation of the read sequence.
When EXT/INT is LOW, RDC/SDIN is used to select the Read Mode. When RDC/SDIN is HIGH, the data is output on SDOUT during conversion. When RDC/SDIN is LOW, the
data can be output on SDOUT only when the conversion is complete. 17 OGND P Input/Output Interface Digital Power Ground. 18 OVDD P Input/Output Interface Digital Power. Nominally at the same supply as the supply of the host
interface (5 V or 3 V). 19 DVDD P Digital Power. Nominally at 5 V. 20 DGND P Digital Power Ground. 21 D8 DO When SER/PAR is LOW, this output is used as Bit 8 of the Parallel Port Data Output Bus.
or SDOUT When SER/PAR is HIGH, this output, part of the Serial Port, is used as a serial data output
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7664
provides the conversion result, MSB first, from its internal shift register. The DATA format
is determined by the logic level of OB/2C. In Serial Mode, when EXT/INT is LOW, SDOUT is
valid on both edges of SCLK.
In Serial Mode, when EXT/INT is HIGH:
If INVSCLK is LOW, SDOUT is updated on the SCLK rising edge and valid on the
next falling edge.
If INVSCLK is HIGH, SDOUT is updated on the SCLK falling edge and valid on the next
rising edge. 22 D9 DI/O When SER/PAR is LOW, this output is used as Bit 9 of the Parallel Port Data
or SCLK Output Bus.
When SER/PAR is HIGH, this pin, part of the Serial Port, is used as a serial data clock input
or output, dependent upon the logic state of the EXT/INT pin. The active edge where the
data SDOUT is updated depends upon the logic state of the INVSCLK pin. 23 D10 DO When SER/PAR is LOW, this output is used as the Bit 10 of the Parallel Port Data Output Bus.
or SYNC When SER/PAR is HIGH, this output, part of the Serial Port, is used as a digital output
frame synchronization for use with the internal data clock (EXT/INT = Logic LOW). When
a read sequence is initiated and INVSYNC is LOW, SYNC is driven HIGH and remains
HIGH while the SDOUT output is valid. When a read sequence is initiated and INVSYNC
is HIGH, SYNC is driven LOW and remains LOW while the SDOUT output is valid. 24 D11 DO When SER/PAR is LOW, this output is used as Bit 11 of the Parallel Port Data Output Bus.
or RDERROR When SER/PAR is HIGH and EXT/INT is HIGH, this output, part of the Serial Port, is
used as an incomplete read error flag. In Slave Mode, when a data read is started and not
complete when the following conversion is complete, the current data is lost and RDERROR
is pulsed HIGH. 25–28 D[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data Output Bus. These pins are always outputs regard-
less of the state of SER/PAR. 29 BUSY DO Busy Output. Transitions HIGH when a conversion is started and remains HIGH until the
conversion is complete and the data is latched into the on-chip shift register. The falling edge
of BUSY could be used as a data-ready clock signal. 30 DGND P Must Be Tied to Digital Ground. 31 RD DI 32 CS DI Chip Select. When CS and RD are both LOW, the interface parallel or serial output bus is
33 RESET DI Reset Input. When set to a logic HIGH, reset the AD7664. Current conversion if any is aborted.
34 PD DI Power-Down Input. When set to a logic HIGH, power consumption is reduced and conversions
Read Data. When CS and RD are both LOW, the interface parallel or serial output bus is enabled.
enabled. CS is also used to gate the external clock.
If not used, this pin could be tied to DGND.
are inhibited after the current one is completed.
–6–
REV. E
AD7664
Pin No. Mnemonic Type Description
35 CNVST DI Start Conversion. A falling edge on CNVST puts the internal sample-and-hold into the hold state
and initiates a conversion. In Impulse Mode (IMPULSE HIGH and WARP LOW), if CNVST is held LOW when the acquisition phase (t
into the hold state and a conversion is immediately started. 36 AGND P Must Be Tied to Analog Ground. 37 REF AI Reference Input Voltage. 38 REFGND AI Reference Input Analog Ground. 39 INGND AI Analog Input Ground. 43 IN AI Primary Analog Input with a Range of 0 V to V
NOTES AI = Analog Input DI = Digital Input DI/O = Bidirectional Digital DO = Digital Output P = Power
) is complete, the internal sample-and-hold is put
8
.
REF

DEFINITION OF SPECIFICATIONS

Integral Nonlinearity Error (INL)

Linearity error refers to the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs 1/2 LSB before the first code transition. Positive full scale is defined as a level 1 1/2 LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line.

Differential Nonlinearity Error (DNL)

In an ideal ADC, code transitions are 1 LSB apart. Differential nonlinearity is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed.

Full-Scale Error

The last transition (from 011 . . . 10 to 011 . . . 11 in twos complement coding) should occur for an analog voltage 1 1/2 LSB below the nominal full scale (2.49994278 V for the 0 V–2.5 V range). The full-scale error is the deviation of the actual level of the last transition from the ideal level.

Unipolar Zero Error

The first transition should occur at a level 1/2 LSB above analog ground (19.073 µV for the 0 V–2.5 V range). Unipolar zero error is the deviation of the actual transition from that point.

Spurious-Free Dynamic Range (SFDR)

The difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal.

Effective Number of Bits (ENOB)

ENOB is a measurement of the resolution with a sine wave input. It is related to S/(N+D) by the following formula:
ENOB S N D
=+
[]
()
176 602..
dB
and is expressed in bits.

Total Harmonic Distortion (THD)

THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in decibels.

Signal-to-Noise Ratio (SNR)

SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels.

Signal to (Noise + Distortion) Ratio (S/[N+D])

S/(N+D) is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for S/(N+D) is expressed in decibels.

Aperture Delay

Aperture delay is a measure of the acquisition performance and is measured from the falling edge of the CNVST input to when the input signal is held for a conversion.

Transient Response

The time required for the AD7664 to achieve its rated accuracy after a full-scale step function is applied to its input.

Overvoltage Recovery

The time required for the ADC to recover to full accuracy after an analog input signal 150% of full-scale is reduced to 50% of the full-scale value.
REV. E
–7–
AD7664
–Typical Performance Characteristics
2.5
2.0
1.5
1.0
0.5
0
INL – LSB
–0.5
–1.0
–1.5
–2.0
–2.5
CODE
4915232768163840
65536
TPC 1. Integral Nonlinearity vs. Code
8000
7000
6000
5000
4000
COUNTS
3000
2000
1000
0
7F86
7F87 7F8F7F8E7F8D7F8C7F8B7F8A7F897F88
7288 7148
753
CODE – Hexa
1173
10 0 01200
TPC 2. Histogram of 16,384 Conversions of a DC Input at the Code Transition
1.50
1.25
1.00
0.75
0.50
0.25
DNL – LSB
0
–0.25
–0.50
–0.75
–1.00
CODE
4915232768163840
65536
TPC 4. Differential Nonlinearity vs. Code
10000
9008
3340
CODE – Hexa
3643
257
00
9000
8000
7000
6000
5000
COUNTS
4000
3000
2000
1000
0
7FB3
00
136
7FB4 7FBB7FBA7FB97FB87FB77FB67FB5
TPC 5. Histogram of 16,384 Conversions of a DC Input at the Code Center
140
130
120
110
100
90
80
70
60
50
NUMBER OF UNITS
40
30
20
10
0
00.51.01.5 2.0 2.5
POSITIVE INL (LSB)
TPC 3. Typical Positive INL Distribution (600 Units)
–8–
180 170 160 150 140 130 120 110 100
90 80 70 60
NUMBER OF UNITS
50 40 30 20 10
0 –2.5 –2.0 –1.5 –1.0 –0.5 0.0
NEGATIVE INL (LSB)
TPC 6. Typical Negative INL Distribution (600 Units)
REV. E
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