Analog Devices AD7664CB, AD7664ASTRL Datasheet

a
16-Bit, 570 kSPS CMOS ADC
FEATURES Throughput:
570 kSPS (Warp Mode)
500 kSPS (Normal Mode) INL: 2.5 LSB Max (0.0038% of Full-Scale) 16 Bits Resolution with No Missing Codes S/(N+D): 90 dB Typ @ 45 kHz THD: –100 dB Typ @ 45 kHz Analog Input Voltage Range: 0 V to 2.5 V Both AC and DC Specifications No Pipeline Delay Parallel and Serial 5 V/3 V Interface
TM
/QSPITM/MICROWIRETM/DSP Compatible
SPI Single 5 V Supply Operation Power Dissipation
115 mW Maximum,
21 W @ 100 SPS Power-Down Mode: 7 W Max Package: 48-Lead Quad Flat Pack (LQFP) Pin-to-Pin Compatible Upgrade of the AD7660
APPLICATIONS Data Acquisition Instrumentation Digital Signal Processing Spectrum Analysis Medical Instruments Battery-Powered Systems Process Control

FUNCTIONAL BLOCK DIAGRAM

AVDD AGND REF REFGND
IN
INGND
PD
RESET
CALIBRATION CIRCUITRY
AD7664
SWITCHED
CAP DAC
CLOCK
CONTROL LOGIC AND
CNVSTWARP IMPULSE
AD7664
DGNDDVDD
SERIAL
PORT
16
PARALLEL
INTERFACE
*
OVDD
OGND
DATA[15:0]
BUSY
RD
CS
SER/PAR
OB/2C
GENERAL DESCRIPTION
The AD7664 is a 16-bit, 570 kSPS, charge redistribution SAR, analog-to-digital converter that operates from a single 5 V power supply. The part contains a high-speed 16-bit sampling ADC, an internal conversion clock, error correction circuits, and both serial and parallel system interface ports.
The AD7664 is hardware factory calibrated and is comprehensively tested to ensure such ac parameters as signal-to-noise ratio (SNR) and total harmonic distortion (THD), in addition to the more traditional dc parameters of gain, offset, and linearity.
It features a very high sampling rate mode (Warp) and, for asyn­chronous conversion rate applications, a fast mode (Normal) and, for low power applications, a reduced power mode (Impulse) where the power is scaled with the throughput.
It is fabricated using Analog Devices’ high-performance, 0.6 micron CMOS process, with correspondingly low cost and is available in a 48-lead LQFP with operation specified from –40°C to +85°C.
*Patent pending. SPI and QSPI are trademarks of Motorola Inc. MICROWIRE ia a trademark of National Semiconductor Corporation
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PRODUCT HIGHLIGHTS

1. Fast Throughput The AD7664 is a 570 kSPS, charge redistribution, 16-bit SAR ADC with internal error correction circuitry.
2. Superior INL The AD7664 has a maximum integral nonlinearity of 2.5 LSBs with no missing 16-bit code.
3. Single-Supply Operation The AD7664 operates from a single 5 V supply and dissipates only a maximum of 115 mW. In impulse mode, its power dissipation decreases with the throughput to, for instance, only 21 µW at a 100 SPS throughput. It consumes 7 µW maximum when in power-down.
4. Serial or Parallel Interface Versatile parallel or 2-wire serial interface arrangement compatible with both 3 V or 5 V logic.
AD7664
–SPECIFICATIONS
(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)
Parameter Conditions Min Typ Max Unit
RESOLUTION 16 Bits
ANALOG INPUT
Voltage Range V Operating Input Voltage V
Analog Input CMRR fIN = 10 kHz 62 dB
IN
IN
V
INGND
– V
INGND
0V –0.1 +3 V
REF
V
–0.1 +0.5 V
Input Current 570 kSPS Throughput 7 µA Input Impedance See Analog Input Section
THROUGHPUT SPEED
Complete Cycle In Warp Mode 1.75 µs Throughput Rate In Warp Mode 1 570 kSPS Time Between Conversions In Warp Mode 1 ms Complete Cycle In Normal Mode 2 µs Throughput Rate In Normal Mode 0 500 kSPS Complete Cycle In Impulse Mode 2.25 µs Throughput Rate In Impulse Mode 0 444 kSPS
DC ACCURACY
Integral Linearity Error –2.5 +2.5 LSB
1
Differential Linearity Error –1 +1.5 LSB No Missing Codes 16 Bits Transition Noise 0.7 LSB Full-Scale Error Unipolar Zero Error
2
2
REF = 2.5 V ±0.08 % of FSR
±5 ±15 LSB
Power Supply Sensitivity AVDD = 5 V ± 5% ±3 LSB
AC ACCURACY
Signal-to-Noise f Spurious Free Dynamic Range fIN = 45 kHz 100 dB
= 100 kHz 90 dB
IN
fIN = 100 kHz 100 dB
Total Harmonic Distortion fIN = 45 kHz –100 dB
fIN = 100 kHz –100 dB
Signal-to-(Noise+Distortion) fIN = 45 kHz 90 dB
fIN = 100 kHz 89 dB
–3 dB Input Bandwidth 18 MHz
–60 dB Input, f
= 100 kHz 30 dB
IN
SAMPLING DYNAMICS
Aperture Delay 2ns Aperture Jitter 5 ps rms Transient Response Full-Scale Step 250 ns
REFERENCE
External Reference Voltage Range 2.3 2.5 AVDD – 1.85 V External Reference Current Drain 570 kSPS Throughput 115 µA
DIGITAL INPUTS
Logic Levels
V
IL
V
IH
I
IL
I
IH
–0.3 +0.8 V
2.0 OVDD + 0.3 V –1 +1 µA –1 +1 µA
DIGITAL OUTPUTS
Data Format Parallel or Serial 16-Bits Pipeline Delay Conversion Results Available
Immediately after Completed Conversion
V
OL
V
OH
I
= 1.6 mA 0.4 V
SINK
I
= –500 µA OVDD – 0.6 V
SOURCE
POWER SUPPLIES
Specified Performance
AVDD 4.75 5 5.25 V DVDD 4.75 5 5.25 V OVDD 2.7 5.25 V
Operating Current
AVDD 15.5 mA
5
DVDD
5
OVDD
Power Dissipation
4
500 kSPS Throughput
3.8 mA
5
500 kSPS Throughput 100 SPS Throughput
In Power-Down Mode
4
6
7
100 µA
115 mW
21 µW
7 µW
–2–
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AD7664
Parameter Conditions Min Typ Max Unit
TEMPERATURE RANGE
Specified Performance T
NOTES
1
LSB means Least Significant Bit. With the 0 V to 2.5 V input range, one LSB is 38.15 µV.
2
See Definition of Specifications section. These specifications do not include the error contribution from the external reference.
3
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full-scale unless otherwise specified.
4
In normal mode.
5
Tested in parallel reading mode.
6
In impulse mode.
7
With all digital inputs forced to OVDD or OGND respect
8
Contact factory for extended temperature range.
Specifications subject to change without notice.
8
MIN
to T
MAX
–40 +85
°C
ively.
TIMING SPECIFICATIONS
(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)
Symbol Min Typ Max Unit
REFER TO FIGURES 11 AND 12
Convert Pulsewidth t Time Between Conversions t
(Warp Mode/Normal Mode/Impulse Mode)
CNVST LOW to BUSY HIGH Delay t BUSY HIGH All Modes Except in t
Master Serial Read After Convert Mode
1
2
3
4
5ns
1.75/2/2.25 Note 1 µs
25 ns
1.5/1.75/2 µs
(Warp Mode/Normal Mode/Impulse Mode) Aperture Delay t End of Conversion to BUSY LOW Delay t Conversion Time t
(Warp Mode/Normal Mode/Impulse Mode) Acquisition Time t RESET Pulsewidth t
5
6
7
8
9
10 ns
250 ns 10 ns
2ns
1.5/1.75/2 µs
REFER TO FIGURES 13, 14, AND 15 (Parallel Interface Modes)
CNVST LOW to DATA Valid Delay t
(Warp Mode/Normal Mode/Impulse Mode) DATA Valid to BUSY LOW Delay t Bus Access Request to DATA Valid t Bus Relinquish Time t
REFER TO FIGURES 16 AND 17 (Master Serial Interface Modes)
CS LOW to SYNC Valid Delay t CS LOW to Internal SCLK Valid Delay
2
CS LOW to SDOUT Delay t CNVST LOW to SYNC Delay t
(Warp Mode/Normal Mode/Impulse Mode) SYNC Asserted to SCLK First Edge Delay t Internal SCLK Period t Internal SCLK HIGH (INVSCLK Low) Internal SCLK LOW (INVSCLK Low)
3
3
SDOUT Valid Setup Time t SDOUT Valid Hold Time t SCLK Last Edge to SYNC Delay t
CS HIGH to SYNC HI-Z t CS HIGH to Internal SCLK HI-Z t CS HIGH to SDOUT HI-Z t
BUSY HIGH in Master Serial Read after Convert t
(Warp Mode/Normal Mode/Impulse Mode) CNVST LOW to SYNC Asserted Delay t
(Warp Mode/Normal Mode/Impulse Mode) SYNC Deasserted to BUSY LOW Delay t
REFER TO FIGURES 18 AND 20 (Slave Serial Interface Modes)
External SCLK Setup Time t External SCLK Active Edge to SDOUT Delay t SDIN Setup Time t SDIN Hold Time t External SCLK Period t External SCLK HIGH t External SCLK LOW t
NOTES
1
In warp mode only, the maximum time between conversions is 1 ms; otherwise, there is no required maximum time.
2
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
3
If the polarity of SCLK is inverted, the timing references of SCLK are also inverted.
Specifications subject to change without notice.
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10
11
12
13
2
14
t
15
16
17
18
19
t
20
t
21
22
23
24
25
26
27
28
29
30
2
31
32
33
34
35
36
37
45 ns
515ns
25/275/525 ns
4ns 40 75 ns 30 ns
9.5 ns
4.5 ns 3ns 3
1/1.25/1.5 µs
50 ns
5ns 316ns 5ns 5ns 25 ns 10 ns 10 ns
–3–
1.5/1.75/2 µs
40 ns
10 ns 10 ns 10 ns
10 ns 10 ns 10 ns
2.75/3/3.25 µs
AD7664
WARNING!
ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS*

IN2, REF, INGND, REFGND to AGND
. . . . . . . . . . . . . . . . . . . . . . .AVDD + 0.3 V to AGND – 0.3 V
Ground Voltage Differences
AGND, DGND, OGND . . . . . . . . . . . . . . . . . . . . . . ± 0.3 V
Supply Voltages
AVDD, DVDD, OVDD . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
AVDD to DVDD, AVDD to OVDD . . . . . . . . . . . . . . ±7 V
DVDD to OVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 7 V
Digital Inputs
Except the Data Bus D(7:4) . . . . . –0.3 V to DVDD + 3.0 V
Data Bus D(7:4) . . . . . . . . . . . . . –0.3 V to OVDD + 3.0 V
Internal Power Dissipation
3
. . . . . . . . . . . . . . . . . . . . 700 mW
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range
(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
See Analog Input section.
3
Specification is for the device in free air:
48-Lead LQFP; θ
= 91°C/W, θ
JA
= 30°C/W
JC
I
1.6mA
TO OUTPUT
PIN
C
L
60pF*
500␮A
*
IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND SDOUT TIMINGS ARE DEFINED WITH A MAXIMUM LOAD
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
C
L
OL
1.4V
I
OH
Figure 1. Load Circuit for Digital Interface Timing, SDOUT, SYNC, SCLK Outputs, C
0.8V
t
DELAY
2V
0.8V
= 10 pF
L
2V
t
DELAY
2V
0.8V
Figure 2. Voltage Reference Levels for Timing

ORDERING GUIDE

Temperature
Model INL Maximum No Missing Codes Range Package Description Package Option
AD7664AST AD7664ASTRL EVAL-AD7664CB
1
EVAL-CONTROL BRD2
NOTES
1
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD2 for evaluation/demonstration purposes.
2
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
±2.5 LSB 16 Bits ±2.5 LSB 16 Bits
2
–40°C to +85°C Quad Flatpack (LQFP) ST-48 –40°C to +85°C Quad Flatpack (LQFP) ST-48
Evaluation Board Controller Board
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7664 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
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PIN CONFIGURATION
48-Lead LQFP
(ST-48)
AD7664
AGND AVDD
NC
DGND
OB/2C WARP
IMPULSE SER/PAR
D0
D1
D2 D3
NC = NO CONNECT
NCNCNCNCNCINNCNCNC
48
47 46 45 44 39 38 3743 42 41 40
1
PIN 1 IDENTIFIER
2
3
4
5
6
7
8
9
10
11
12
13 14
D4/EXT/INT
AD7664
TOP VIEW
(Not to Scale)
15 16 17 18 19 20 21 22 23 24
OGND
D6/INVSCLK
D5/INVSYNC
D7/RDC/SDIN
OVDD
DVDD
DGND
D8/SDOUT
INGND
REFGND
D9/SCLK
D10/SYNC
REF
36
AGND
35
CNVST
34
PD
33
RESET
32
CS
31
RD
30
DGND
29
BUSY
28
D15
27
D14
26
D13
25
D12
D11/RDERROR
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Type Description
1 AGND P Analog Power Ground Pin 2 AVDD P Input Analog Power Pins. Nominally 5 V. 3, 40–42, NC No Connect 44–48 4 DGND DI Must be tied to the ground where DVDD is referred. 5 OB/2C DI Straight Binary/Binary Two’s Complement. When OB/2C is HIGH, the digital output is
straight binary; when LOW, the MSB is inverted resulting in a two’s complement output from its internal shift register.
6 WARP DI Mode Selection. When HIGH and IMPULSE LOW, this input selects the fastest mode, the
maximum throughput is achievable, and a minimum conversion rate must be applied in order to guarantee full specified accuracy. When LOW, full accuracy is maintained independent of the minimum conversion rate.
7 IMPULSE DI Mode Selection. When HIGH and WARP LOW, this input selects a reduced power mode. In
this mode, the power dissipation is approximately proportional to the sampling rate.
8 SER/PAR DI Serial/Parallel Selection Input. When LOW, the parallel port is selected; when HIGH, the
serial interface mode is selected and some bits of the DATA bus are used as a serial port.
9–12 DATA[0:3] DO Bit 0 to Bit 3 of the Parallel Port Data Output Bus. These pins are always outputs, regardless
of the state of SER/PAR.
13 DATA[4] DI/O When SER/PAR is LOW, this output is used as Bit 4 of the Parallel Port Data Output Bus.
or EXT/INT When SER/PAR is HIGH, this input, part of the serial port, is used as a digital select input for
choosing the internal or an external data clock. With EXT/INT tied LOW, the internal clock is selected on SCLK output. With EXT/INT set to a logic HIGH, output data is synchronized to an external clock signal connected to the SCLK input.
14 DATA[5] DI/O When SER/PAR is LOW, this output is used as Bit 5 of the Parallel Port Data Output Bus.
or INVSYNC When SER/PAR is HIGH, this input, part of the serial port, is used to select the active state of
the SYNC signal. It is active in both master and slave mode. When LOW, SYNC is active HIGH. When HIGH, SYNC is active LOW.
15 DATA[6] DI/O When SER/PAR is LOW, this output is used as Bit 6 of the Parallel Port Data Output Bus.
or INVSCLK
When SER/PAR is HIGH, this input, part of the serial port, is used to invert the SCLK signal. It is active in both master and slave mode.
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–5–
AD7664
Pin No. Mnemonic Type Description
16 DATA[7] DI/O When SER/PAR is LOW, this output is used as Bit 7 of the Parallel Port Data Output Bus.
or RDC/SDIN When SER/PAR is HIGH, this input, part of the serial port, is used as either an external data
input or a read mode selection input depending on the state of EXT/INT. When EXT/INT is HIGH, RDC/SDIN could be used as a data input to daisy chain the conversion
results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on DATA with a delay of 16 SCLK periods after the initiation of the read sequence.
When EXT/INT is LOW, RDC/SDIN is used to select the read mode. When RDC/SDIN is HIGH, the data is output on SDOUT during conversion. When RDC/SDIN is LOW, the
data can be output on SDOUT only when the conversion is complete. 17 OGND P Input/Output Interface Digital Power Ground 18 OVDD P Input/Output Interface Digital Power. Nominally at the same supply than the supply of the
host interface (5 V or 3 V). 19 DVDD P Digital Power. Nominally at 5 V. 20 DGND P Digital Power Ground 21 DATA[8] DO When SER/PAR is LOW, this output is used as Bit 8 of the Parallel Port Data Output Bus.
or SDOUT When SER/PAR is HIGH, this output, part of the serial port, is used as a serial data output
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7664
provides the conversion result, MSB first, from its internal shift register. The DATA format is
determined by the logic level of OB/2C. In serial mode, when EXT/INT is LOW, SDOUT is
valid on both edges of SCLK.
In serial mode, when EXT/INT is HIGH:
If INVSCLK is LOW, SDOUT is updated on SCLK rising edge and valid on the next
falling edge.
If INVSCLK is HIGH, SDOUT is updated on SCLK falling edge and valid on the next rising edge. 22 DATA[9] DI/O When SER/PAR is LOW, this output is used as the Bit 9 of the Parallel Port Data
or SCLK Output Bus.
When SER/PAR is HIGH, this pin, part of the serial port, is used as a serial data clock input
or output, dependent upon the logic state of the EXT/INT pin. The active edge where the
data SDOUT is updated depends upon the logic state of the INVSCLK pin. 23 DATA[10] DO When SER/PAR is LOW, this output is used as the Bit 10 of the Parallel Port Data Output Bus.
or SYNC When SER/PAR is HIGH, this output, part of the serial port, is used as a digital output frame
synchronization for use with the internal data clock (EXT/INT = Logic LOW). When a read
sequence is initiated and INVSYNC is LOW, SYNC is driven HIGH and remains HIGH
while SDOUT output is valid. When a read sequence is initiated and INVSYNC is High,
SYNC is driven LOW and remains LOW while SDOUT output is valid. 24 DATA[11] DO When SER/PAR is LOW, this output is used as the Bit 11 of the Parallel Port Data Output Bus.
or RDERROR When SER/PAR is HIGH and EXT/INT is HIGH, this output, part of the serial port, is
used as a incomplete read error flag. In slave mode, when a data read is started and not
complete when the following conversion is complete, the current data is lost and RDERROR
is pulsed high. 25–28 DATA[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data output bus. These pins are always outputs regard
less of the state of SER/PAR. 29 BUSY DO Busy Output. Transitions HIGH when a conversion is started, and remains HIGH until the
conversion is complete and the data is latched into the on-chip shift register. The falling edge
of BUSY could be used as a data ready clock signal. 30 DGND P Must Be Tied to Digital Ground 31 RD DI 32 CS DI Chip Select. When CS and RD are both LOW, the interface parallel or serial output bus is
33 RESET DI Reset Input. When set to a logic HIGH, reset the AD7664. Current conversion if any is aborted.
34 PD DI Power-Down Input. When set to a logic HIGH, power consumption is reduced and conversions
Read Data. When CS and RD are both LOW, the interface parallel or serial output bus is enabled.
enabled. CS is also used to gate the external clock.
If not used, this pin could be tied to DGND.
are inhibited after the current one is completed.
–6–
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