ANALOG DEVICES AD7663 Service Manual

a

16-Bit, 250 kSPS CMOS ADC

AD7663

FEATURES
Throughput: 250 kSPS
INL: 3 LSB Max (0.0046% of Full Scale)
16-Bit Resolution with No Missing Codes
S/(N+D): 90 dB Typ @ 100 kHz
THD: –100 dB Typ @ 100 kHz
Analog Input Voltage Ranges

Bipolar: 10 V, 5 V, 2.5 V

Unipolar: 0 V to 10 V, 0 V to 5 V, 0 V to 2.5 V
Both AC and DC Specifications
No Pipeline Delay
Parallel (8/16 Bits) and Serial 5 V/3 V Interface

®

/QSPI™/MICROWIRE™/DSP Compatible

SPI
Single 5 V Supply Operation
Power Dissipation

35 mW Typical

15 W @ 100 SPS
Power-Down Mode: 7 W Max
Package: 48-Lead Quad Flatpack (LQFP)
Package: 48-Lead Chip Scale (LFCSP)
Pin-to-Pin Compatible with the AD7660/AD7664/AD7665

APPLICATIONS
Data Acquisition
Motor Control
Communication
Instrumentation
Spectrum Analysis
Medical Instruments
Process Control

GENERAL DESCRIPTION

The AD7663 is a 16-bit, 250 kSPS, charge redistribution SAR,
analog-to-digital converter that operates from a single 5 V power
supply. It contains a high speed 16-bit sampling ADC, a resistor
input scaler that allows various input ranges, an internal conver­sion clock, error correction circuits, and both serial and parallel
system interface ports.

The AD7663 is hardware factory-calibrated and is comprehen­sively tested to ensure such ac parameters as signal-to-noise ratio
(SNR) and total harmonic distortion (THD), in addition to the
more traditional dc parameters of gain, offset, and linearity.

It is fabricated using Analog Devices’ high performance, 0.6 micron
CMOS process and is available in a 48-lead LQFP and a tiny
48-lead LFCSP with operation specified from –40°C to +85°C.

FUNCTIONAL BLOCK DIAGRAM

DGNDDVDDAVDD AGND REF REFGND

PD

4R

4R

2R

R

SWITCHED

CAP DAC

CONTROL LOGIC AND

CALIBRATION CIRCUITRY

CNVST

AD7663

CLOCK

SERIAL

PORT

PARALLEL

INTERFACE

16

OVDD

OGND

SER/PAR

BUSY

D[15:0]

CS

RD

OB/2C

BYTESWAP

IND(4R)

INC(4R)

INB(2R)

INA(R)

INGND

RESET

PulSAR Selection

Type/kSPS 100–250 500–570 800–1000

Pseudo AD7660 AD7650
Differential AD7664

True Bipolar AD7663 AD7665 AD7671

True Differential AD7675 AD7676 AD7677

18-Bit AD7678 AD7679 AD7674

Simultaneous/ AD7654 AD7655
Multichannel

PRODUCT HIGHLIGHTS

1. Fast Throughput
The AD7663 is a 250 kSPS charge redistribution, 16-bit
SAR ADC with various bipolar and unipolar input ranges.

2. Single-Supply Operation
The AD7663 operates from a single 5 V supply and dissipates
only 35 mW typical. Its power dissipation decreases with
the throughput to, for instance, only 15 µW at a 100 SPS
throughput.
It consumes 7 µW maximum when in power-down.

3. Superior INL
The AD7663 has a maximum integral nonlinearity of 3 LSB
with no missing 16-bit code.

4. Serial or Parallel Interface
Versatile parallel (8 bits or 16 bits) or 2-wire serial interface
arrangement compatible with both 3 V or 5 V logic.

REV. B

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] © 2003 Analog Devices, Inc. All rights reserved.

(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)

AD7663–SPECIFICATIONS

(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)

Parameter Conditions Min Typ Max Unit

RESOLUTION 16 Bits

ANALOG INPUT

Voltage Range V
Common-Mode Input Voltage V

– V

IND

INGND

INGND

±4 REF, 0 V to 4 REF, ±2 REF (See Table I)

–0.1 +0.5 V
Analog Input CMRR fIN = 45 kHz 62 dB
Input Impedance See Table I

THROUGHPUT SPEED

Complete Cycle 4µs
Throughput Rate 0 250 kSPS

DC ACCURACY

Integral Linearity Error –3+3LSB

1

No Missing Codes 16 Bits
Transition Noise 0.7 LSB
Bipolar Zero Error

Bipolar Full-Scale Error
Unipolar Zero Error2, T
Unipolar Full-Scale Error

2

, T

MIN

2

, T

MIN

to T

MIN

to T

2

, T

MAX

MIN

to T

MAX

to T

MAX

MAX

±5 V Range –25 +25 LSB
Other Range –0.06 +0.06 % of FSR

–0.25 +0.25 % of FSR

–0.18 +0.18 % of FSR

–0.38 +0.38 % of FSR

Power Supply Sensitivity AVDD = 5 V ±5% ±0.1 LSB

AC ACCURACY

Signal-to-Noise fIN = 10 kHz 89 90 dB

3

fIN = 100 kHz 90 dB

Spurious-Free Dynamic Range f

= 100 kHz 100 dB

IN

Total Harmonic Distortion fIN = 100 kHz –100 dB
Signal-to-(Noise+Distortion) f

= 10 kHz 88.5 90 dB

IN

= 100 kHz, –60 dB Input 30 dB

f

IN

–3 dB Input Bandwidth 800 kHz

SAMPLING DYNAMICS

Aperture Delay 2ns
Aperture Jitter 5 ps rms
Transient Response Full-Scale Step 2.75 µs

REFERENCE

External Reference Voltage Range 2.3 2.5 AVDD – 1.85 V
External Reference Current Drain 250 kSPS Throughput 50 µA

DIGITAL INPUTS

Logic Levels

V

IL

V

IH

I

IL

I

IH

–0.3 +0.8 V

+2.0 DVDD + 0.3 V

–1+1µA

–1+1µA

DIGITAL OUTPUTS

Data Format Parallel or Serial 16-Bit
Pipeline Delay Conversion Results Available Immediately

after Completed Conversion

I

V

OL

V

OH

= 1.6 mA 0.4 V

SINK

I

= –500 µA OVDD – 0.6 V

SOURCE

POWER SUPPLIES

Specified Performance

AVDD 4.75 5 5.25 V
DVDD 4.75 5 5.25 V
OVDD 2.7 5.25

4

V

Operating Current 250 kSPS Throughput

AVDD 5mA

5

DVDD

5

OVDD

Power Dissipation

6

250 kSPS Throughput
100 SPS Throughput
In Power-Down Mode

5

5

7

1.8 mA
10 µA
35 41 mW
15 µW

7µW

–2–

REV. B

AD7663

Parameter Conditions Min Typ Max Unit

TEMPERATURE RANGE

Specified Performance T

NOTES

1

LSB means least significant bit. With the ±5 V input range, one LSB is 152.588 µV.

2

See Definition of Specifications section. These specifications do not include the error contribution from the external reference.

3

All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.

4

The max should be the minimum of 5.25 V and DVDD + 0.3 V.

5

Tested in Parallel Reading Mode.

6

Tested with the 0 V to 5 V range and VIN – V

7

With OVDD below DVDD + 0.3 V and all digital inputs forced to DVDD or DGND, respectively.

8

Contact factory for extended temperature range.

Specifications subject to change without notice.

8

to T

MIN

= 0 V. See Power Dissipation section.

INGND

MAX

–40 +85 °C

Table I. Analog Input Configuration

Input Voltage Input
Range IND(4R) INC(4R) INB(2R) INA(R) Impedance

±4 REF
±2 REF V
±REF V
0 V to 4 REF V
0 V to 2 REF V
0 V to REF V

NOTES

1

2

3

TIMING SPECIFICATIONS

Parameter

2

Typical analog input impedance.
With REF = 3 V, in this range, the input should be limited to –11 V to +12 V.
For this range the input is high impedance.

V

IN

IN

IN

IN

IN

IN

INGND INGND REF 5.85 kW
V

IN

V

IN

V

IN

V

IN

V

IN

(–40C to +85C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted.)

INGND REF 3.41 kW
V

IN

REF 2.56 kW

INGND INGND 3.41 kW
V

IN

V

IN

INGND 2.56 kW
V

IN

Note 3

Symbol Min Typ Max Unit

Refer to Figures 11 and 12

Convert Pulsewidth t
Time between Conversions t
CNVST LOW to BUSY HIGH Delay t
BUSY HIGH All Modes Except in t

1

2

3

4

5ns
4µs

30 ns

1.25 µs

Master Serial Read after Convert Mode
Aperture Delay t
End of Conversion to BUSY LOW Delay t
Conversion Time t
Acquisition Time t
RESET Pulsewidth t

5

6

7

8

9

10 ns

2.75 µs
10 ns

2ns

1.25 µs

Refer to Figures 13, 14, 15, and 16 (Parallel Interface Modes)

CNVST LOW to DATA Valid Delay t
DATA Valid to BUSY LOW Delay t
Bus Access Request to DATA Valid t
Bus Relinquish Time t

Refer to Figures 17 and 18 (Master Serial Interface Modes)

1

CS LOW to SYNC Valid Delay t
CS LOW to Internal SCLK Valid Delay t
CS LOW to SDOUT Delay t
CNVST LOW to SYNC Delay (Read during Convert) t

SYNC Asserted to SCLK First Edge Delay
Internal SCLK Period
Internal SCLK HIGH
Internal SCLK LOW
SDOUT Valid Setup Time
SDOUT Valid Hold Time
SCLK Last Edge to SYNC Delay

2

2

2

2

2

2

2

10

11

12

13

14

15

16

17

t

18

t

19

t

20

t

21

t

22

t

23

t

24

20 ns

515ns

0.5 µs
4ns
25 40 ns
15 ns

9.5 ns

4.5 ns
2ns
3ns

1.25 µs

40 ns

10 ns
10 ns
10 ns

1

REV. B

–3–

AD7663

TIMING SPECIFICATIONS

Parameter

Refer to Figures 17 and 18 (Master Serial Interface Modes)

CS HIGH to SYNC HI-Z t
CS HIGH to Internal SCLK HI-Z t
CS HIGH to SDOUT HI-Z t

BUSY HIGH in Master Serial Read after Convert t
CNVST LOW to SYNC Asserted Delay t

(continued)

Symbol Min Typ Max

1

25

26

27

28

29

(Master Serial Read after Convert)

SYNC Deasserted to BUSY LOW Delay t

30

Refer to Figures 19 and 21 (Slave Serial Interface Modes)

External SCLK Setup Time t
External SCLK Active Edge to SDOUT Delay t
SDIN Setup Time t
SDIN Hold Time t
External SCLK Period t
External SCLK HIGH t
External SCLK LOW t

NOTES

1

In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load C

2

In Serial Master Read during Convert Mode. See Table II for Master Read after Convert Mode.

Specifications subject to change without notice.

31

32

33

34

35

36

37

5ns
316ns
5ns
5ns
25 ns
10 ns
10 ns

of 10 pF; otherwise, the load is 60 pF maximum.

L

Table II. Serial Clock Timings in Master Read after Convert

Unit

10 ns
10 ns
10 ns

See Table II µs

1.25 µs

25 ns

DIVSCLK[1] 0011
DIVSCLK[0] 0101 Unit

SYNC to SCLK First Edge Delay Minimum t
Internal SCLK Period Minimum t
Internal SCLK Period Maximum t
Internal SCLK HIGH Minimum t
Internal SCLK LOW Minimum t
SDOUT Valid Setup Time Minimum t
SDOUT Valid Hold Time Minimum t
SCLK Last Edge to SYNC Delay Minimum t
BUSY HIGH Width Maximum t

I

1.6mA

TO OUTPUT

PIN

*IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND
SDOUT TIMINGS ARE DEFINED WITH A MAXIMUM LOAD

OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.

C

L

C

L

60pF*

500A

OL

1.4V

I

OH

Figure 1. Load Circuit for Digital Interface Timing

18

19

19

20

21

22

23

24

28

4202020 ns
25 50 100 200 ns
40 70 140 280 ns
15 25 50 100 ns

9.5 24 49 99 ns

4.5 22 22 22 ns
243090 ns
360140 300 ns
2 2.5 3.5 5.75 µs

0.8V

t

DELAY

0.8V 0.8V

2V

t

DELAY

2V2V

Figure 2. Voltage Reference Levels for Timing

–4–

REV. B

AD7663

36

35

34

33

32

31

30

29

28

27

26

25

13 14

15 16 17 18 19 20 21 22 23 24

1

2

3

4

5

6

7

8

9

10

11

12

48

47 46 45 44 39 38 3743 42 41 40

PIN 1
IDENTIFIER

TOP VIEW

(Not to Scale)

AGND

CNVST

PD

RESET

CS
RD

DGND

AGND
AVDD

NC

BYTESWAP

OB/2C

NC

NC

NC = NO CONNECT

SER/PAR

D0

D1

D2/DIVSCLK[0]

BUSY

D15

D14

D13

AD7663

D3/DIVSCLK[1]

D12

D4/EXT/INT

D5/INVSYNC

D6/INVSCLK

D7/RDC/SDIN

OGND

OVDD

DVDD

DGND

D8/SDOUT

D9/SCLK

D10/SYNC

D11/RDERROR

NCNCNCNCNC

IND(4R)

INC(4R)

INB(2R)

INA(R)

INGND

REFGND

REF

ABSOLUTE MAXIMUM RATINGS

Analog Inputs

2

IND

, INC2, INB2 . . . . . . . . . . . . . . . . . . . . –11 V to +30 V

1

INA, REF, INGND, REFGND

. . . . . . . . . . . . . . . . . . . . AGND – 0.3 V to AVDD + 0.3 V

Ground Voltage Differences

AGND, DGND, OGND . . . . . . . . . . . . . . . . . . . . . ±0.3 V

Supply Voltages

AVDD, DVDD, OVDD . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DVDD,

AVDD to OVDD . . . . . . . . . . . . . . ±7 V

DVDD to OVDD . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Digital Inputs . . . . . . . . . . . . . . . . –0.3 V to DVDD + 0.3 V

Internal Power Dissipation

3

. . . . . . . . . . . . . . . . . . . 700 mW

Internal Power Dissipation4 . . . . . . . . . . . . . . . . . . . . . 2.5 W

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature Range

(Soldering 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

1

Stresses above those listed under Absolute Maximum Ratings may cause perma­nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.

2

See Analog Inputs section.

3

Specification is for device in free air: 48-Lead LQFP: qJA = 91°C/W, qJC = 30°C/W.

4

Specification is for device in free air: 48-Lead LFCSP: qJC = 26⬚C/W.

PIN CONFIGURATION

ST-48 and CP-48

ORDERING GUIDE

Model Temperature Range Package Description Package Option

AD7663AST –40°C to +85°CQuad Flatpack (LQFP) ST-48
AD7663ASTRL –40°C to +85°CQuad Flatpack (LQFP) ST-48
AD7663ACP –40⬚C to +85⬚CChip Scale (LFCSP) CP-48
AD7663ACPRL –40⬚C to +85⬚CChip Scale (LFCSP) CP-48
EVAL-AD7663CB
EVAL-CONTROL BRD2

NOTES

1

This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD2 for evaluation/demonstration purposes.

2

This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.

1

2

Evaluation Board
Controller Board

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7663 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.

REV. B

–5–

AD7663

PIN FUNCTION DESCRIPTION

Pin
No. Mnemonic Type Description

1 AGND P Analog Power Ground Pin.
2 AVDD P Input Analog Power Pin. Nominally 5 V.
3, 6, 7, NC No Connect.

44–48
4 BYTESWAP DI Parallel Mode Selection (8/16 Bit). When LOW, the LSB is output on D[7:0] and the MSB is output

on D[15:8]. When HIGH, the LSB is output on D[15:8] and the MSB is output on D[7:0].

5OB/2C DI Straight Binary/Binary Twos Complement. When OB/2C is HIGH, the digital output is straight

binary; when LOW, the MSB is inverted, resulting in a twos complement output from its internal
shift register.

8 SER/PAR DI Serial/Parallel Selection Input. When LOW, the Parallel Port is selected; when HIGH, the

Serial Interface Mode is selected and some bits of the Data bus are used as a Serial Port.

9, 10 D[0:1] DO Bit 0 and Bit 1 of the Parallel Port Data Output Bus. When SER/PAR is HIGH, these outputs

are in high impedance.

11, 12 D[2:3] or DI/O When SER/PAR is LOW, these outputs are used as Bit 2 and Bit 3 of the Parallel Port Data

Output Bus.

DIVSCLK[0:1] When SER/PAR is HIGH, EXT/INT is LOW and RDC/SDIN is LOW, which is the Serial

Master Read after Convert Mode. These inputs, part of the Serial Port, are used to slow down,
if desired, the internal serial clock that clocks the data output. In the other serial modes, these
pins are high impedance outputs.

13 D[4] DI/O When SER/PAR is LOW, this output is used as Bit 4 of the Parallel Port Data Output Bus.

or EXT/INT When SER/PAR is HIGH, this input, part of the Serial Port, is used as a digital select input for

choosing the internal or an external data clock, called respectively, Master and Slave Modes.
With EXT/INT tied LOW, the internal clock is selected on SCLK output. With EXT/INT
set to a logic HIGH, output data is synchronized to an external clock signal connected to the
SCLK input, and external clock is gated by CS.

14 D[5] DI/O When SER/PAR is LOW, this output is used as Bit 5 of the Parallel Port Data Output Bus.

or INVSYNC When SER/PAR is HIGH, this input, part of the Serial Port, is used to select the active state of

the SYNC signal. When LOW, SYNC is active HIGH. When HIGH, SYNC is active LOW.

15 D[6] DI/O When SER/PAR is LOW, this output is used as Bit 6 of the Parallel Port Data Output Bus.

or INVSCLK When SER/PAR is HIGH, this input, part of the Serial Port, is used to invert the SCLK signal.

It is active in both master and slave mode.

16 D[7] DI/O When SER/PAR is LOW, this output is used as Bit 7 of the Parallel Port Data Output Bus.

or RDC/SDIN When SER/PAR is HIGH, this input, part of the Serial Port, is used as either an external data

input or a read mode selection input, depending on the state of EXT/INT.
When EXT/INT is HIGH, RDC/SDIN could be used as a data input to daisy-chain the conversion
results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is
output on DATA with a delay of 16 SCLK periods after the initiation of the read sequence.

When EXT/INT is LOW, RDC/SDIN is used to select the read mode. When RDC/SDIN is
HIGH, the previous data is output on SDOUT during conversion. When RDC/SDIN is LOW,

the data can be output on SDOUT only when the conversion is complete.
17 OGND P Input/Output Interface Digital Power Ground.
18 OVDD P Input/Output Interface Digital Power. Nominally at the same supply as the supply of the host

interface (5 V or 3 V).
19 DVDD P Digital Power. Nominally at 5 V.
20 DGND P Digital Power Ground.

–6–

REV. B

AD7663

PIN FUNCTION DESCRIPTION (continued)

Pin
No. Mnemonic Type Description

21 D[8] DO When SER/PAR is LOW, this output is used as Bit 8 of the Parallel Port Data Output Bus.

or SDOUT When SER/PAR is HIGH, this output, part of the Serial Port, is used as a serial data output

synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7663 provides
the conversion result, MSB first, from its internal shift register. The Data format is determined
by the logic level of OB/2C. In Serial Mode, when EXT/INT is LOW, SDOUT is valid on both
edges of SCLK.

In serial mode, when EXT/INT is HIGH:
If INVSCLK is LOW, SDOUT is updated on the SCLK rising edge and valid on the next falling edge.
If INVSCLK is HIGH, SDOUT is updated on the SCLK falling edge and valid on the next rising edge.

22 D[9] DI/O When SER/PAR is LOW, this output is used as Bit 9 of the Parallel Port Data Output Bus.

or SCLK When SER/PAR is HIGH, this pin, part of the Serial Port, is used as a serial data clock input or

output, dependent upon the logic state of the EXT/INT pin. The active edge where the data
SDOUT is updated depends upon the logic state of the INVSCLK pin.

23 D[10] DO When SER/PAR is LOW, this output is used as Bit 10 of the Parallel Port Data Output Bus.

or SYNC When SER/PAR is HIGH, this output, part of the Serial Port, is used as a digital output frame

synchronization for use with the internal data clock (EXT/INT = Logic LOW). When a read
sequence is initiated and INVSYNC is LOW, SYNC is driven HIGH and remains HIGH while
SDOUT output is valid. When a read sequence is initiated and INVSYNC is HIGH, SYNC is
driven LOW and remains LOW while SDOUT output is valid.

24 D[11] DO When SER/PAR is LOW, this output is used as Bit 11 of the Parallel Port Data Output Bus.

or RDERROR When SER/PAR is HIGH and EXT/INT is HIGH, this output, part of the Serial Port, is used as

an incomplete read error flag. In Slave Mode, when a data read is started and not complete when
the following conversion is complete, the current data is lost and RDERROR is pulsed HIGH.

25–28 D[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data Output Bus. When SER/PAR is HIGH, these outputs

are in high impedance.

29 BUSY DO Busy Output. Transitions HIGH when a conversion is started and remains HIGH until the

conversion is complete and the data is latched into the on-chip shift register. The falling edge
of BUSY could be used as a data-ready clock signal.

30 DGND P Must Be Tied to Digital Ground.
31 RD DI Read Data. When CS and RD are both LOW, the Interface Parallel or Serial Output Bus is enabled.
32 CS DI Chip Select. When CS and RD are both LOW, the Interface Parallel or Serial Output Bus is

enabled. CS is also used to gate the external clock.

33 RESET DI Reset Input. When set to a logic HIGH, reset the AD7663. Current conversion, if any, is aborted.

If not used, this pin could be tied to DGND.

34 PD DI Power-Down Input. When set to a logic HIGH, power consumption is reduced and conversions

are inhibited after the current one is completed.

35 CNVST DI Start Conversion. If CNVST is HIGH when the acquisition phase (t

edge on CNVST puts the internal sample-and-hold into the hold state and initiates a conversion.
This mode is the most appropriate if low sampling jitter is desired. If CNVST is LOW when the
acquisition phase (t

) is complete, the internal sample-and-hold is put into the hold state and a

8

conversion is immediately started.
36 AGND P Must Be Tied to Analog Ground.
37 REF AI Reference Input Voltage .
38 REFGND AI Reference Input Analog Ground.
39 INGND AI Analog Input Ground.
40, 41, INA, INB, AI Analog Inputs. Refer to Table I for input range configuration.

42, 43 INC, IND

NOTES
AI = Analog Input
DI = Digital Input
DI/O = Bidirectional Digital
DO = Digital Output
P = Power

) is complete, the next falling

8

REV. B

–7–

AD7663

DEFINITION OF SPECIFICATIONS
Integral Nonlinearity Error (INL)

Linearity error refers to the deviation of each individual code
from a line drawn from “negative full scale” through “positive
full scale.” The point used as negative full scale occurs 1/2 LSB
before the first code transition. Positive full scale is defined as a
level 1 1/2 LSB beyond the last code transition. The deviation is
measured from the middle of each code to the true straight line.

Differential Nonlinearity Error (DNL)

In an ideal ADC, code transitions are 1 LSB apart. Differential
nonlinearity is the maximum deviation from this ideal value. It is
often specified in terms of resolution for which no missing codes
are guaranteed.

Full-Scale Error

The last transition (from 011 . . . 10 to 011 ...11 in twos
complement coding) should occur for an analog voltage 1 1/2 LSB
below the nominal full scale (2.499886 V for the ±2.5 V range).
The full-scale error is the deviation of the actual level of the last
transition from the ideal level.

Bipolar Zero Error

The difference between the ideal midscale input voltage (0 V) and
the actual voltage producing the midscale output code.

Unipolar Zero Error

In Unipolar Mode, the first transition should occur at a level
1/2 LSB above analog ground. The unipolar zero error is the
deviation of the actual transition from that point.

Spurious-Free Dynamic Range (SFDR)

The difference, in decibels (dB), between the rms amplitude of
the input signal and the peak spurious signal.

Effective Number of Bits (ENOB)

A measurement of the resolution with a sine wave input. It is
related to S/(N+D) by the following formula:

ENOB S N D

and is expressed in bits.

Total Harmonic Distortion (THD)

The ratio of the rms sum of the first five harmonic components to
the rms value of a full-scale input signal, expressed in decibels.

Signal-to-Noise Ratio (SNR)

The ratio of the rms value of the actual input signal to the rms
sum of all other spectral components below the Nyquist fre­quency, excluding harmonics and dc. The value for SNR is
expressed in decibels.

Signal-to-(Noise + Distortion) Ratio (S/[N+D])

The ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
S/(N+D) is expressed in decibels.

Aperture Delay

A measure of the acquisition performance measured from the
falling edge of the CNVST input to when the input signal is
held for a conversion.

Transient Response

The time required for the AD7663 to achieve its rated accuracy
after a full-scale step function is applied to its input.

=+

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176 602..

dB

)

–8–

REV. B