Throughput: 6 MSPS
SNR: 93 dB
INL: ±0.45 LSB typical, ±1 LSB maximum
DNL: ±0.3 LSB typical, ±0.5 LSB maximum
Power dissipation: 135 mW
32-lead LFCSP (5 mm × 5 mm)
SAR architecture
No latency/no pipeline delay
16-bit resolution with no missing codes
Zero error: ±1.5 LSB
Differential input voltage: ±4.096 V
Serial LVDS interface
Self-clocked mode
Echoed-clock mode
Can use LVDS or CMOS for conversion control (CNV signal)
Reference options
Internal: 4.096 V
External (1.2 V) buffered to 4.096 V
External: 4.096 V
APPLICATIONS
High dynamic range telecommunications
Receivers
Digital imaging systems
High speed data acquisition
Spectrum analysis
Test equipment
Differential ADC
AD7625
FUNCTIONAL BLOCK DIAGRAM
CAP
DAC
CM
÷2
SAR
CLOCK
Figure 1.
LOGIC
SERIAL
LVDS
VIO
CNV+, CNV–
D+, D–
DCO+, DCO–
CLK+, CLK–
REFIN REF
1.2V
BAND GAP
IN+
IN–
AD7625
GENERAL DESCRIPTION
The AD7625 is a 16-bit, 6 MSPS, charge redistribution successive
approximation register (SAR) based architecture analog-to-digital
converter (ADC). SAR architecture allows unmatched performance both in noise (93 dB SNR) and in linearity (1 LSB). The
AD7625 contains a high speed, 16-bit sampling ADC, an internal
conversion clock, and an internal buffered reference. On the
CNV± rising edge, it samples the voltage difference between the
IN+ and IN− pins. The voltages on these pins swing in opposite
phase between 0 V and REF. The 4.096 V reference voltage, REF,
can be generated internally or applied externally.
All converted results are available on a single LVDS self-clocked
or echoed-clock serial interface, reducing external hardware
connections.
The AD7625 is housed in a 32-lead, 5 mm × 5 mm LFCSP with
operation specified from −40°C to +85°C.
7652-001
Table 1. Fast PulSAR® ADC Selection
Input Type Resolution (Bits) 1 MSPS to <2 MSPS 2 MSPS to 3 MSPS 6 MSPS
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
VDD1 = 5 V; VDD2 = 2.5 V; VIO = 2.5 V; REF = 4.096 V; all specifications T
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
RESOLUTION 16 Bits
ANALOG INPUT
Voltage Range V
Operating Input Voltage V
− V
IN+
IN+
−V
IN−
, V
to GND −0.1 V
IN−
Common-Mode Input Range V
Common-Mode Rejection Ratio fIN = 1 MHz 60 dB
Input Current Midscale input 77 µA
THROUGHPUT
Complete Cycle 166 ns
Throughput Rate 0.1 6 MSPS
DC ACCURACY
Integral Linearity Error −1 ±0.45 +1 LSB
No Missing Codes 16 Bits
Differential Linearity Error −0.5 ±0.3 +0.5 LSB
Transition Noise 0.6 LSB
Zero Error T
MIN
to T
−4 ±1.5 +4 LSB
MAX
Zero Error Drift 0.5 ppm/°C
Gain Error T
MIN
to T
8 20 LSB
MAX
Gain Error Drift 0.4 ppm/°C
Power Supply Sensitivity
1
VDD1 = 5 V ± 5% 0.4 LSB
VDD2 = 2.5 V ± 5% 0.2 LSB
AC ACCURACY
External Reference fIN = 20 kHz
Dynamic Range 92.5 93.2 dB
Signal-to-Noise Ratio 92 93 dB
Spurious-Free Dynamic Range 106 dB
Total Harmonic Distortion −105.5 dB
Signal-to-(Noise + Distortion) 91.5 92 dB
Internal Reference fIN = 20 kHz
Dynamic Range 92.5 93.2 dB
Signal-to-Noise Ratio 91.5 92.9 dB
Spurious-Free Dynamic Range 106 dB
Total Harmonic Distortion −105.5 dB
Signal-to-(Noise + Distortion) 91 92.5 dB
−3 dB Input Bandwidth 100 MHz
Aperture Jitter 0.25 ps rms
INTERNAL REFERENCE
Output Voltage REFIN @ 25°C 1.2 V
Temperature Drift −40°C to +85°C ±15 ppm/°C
REFERENCE BUFFER
REFIN Input Voltage Range 1.2 V
REF Output Voltage Range 4.076 4.096 4.116 V
Line Regulation VDD1 ± 5%, VDD2 ± 5% 5 mV
EXTERNAL REFERENCE
Voltage Range REF 4.096 V
VCM PIN @ 25°C
Output Voltage REF/2 V
Output Impedance 4 5 6 kΩ
MIN
to T
REF
REF
, unless otherwise noted.
MAX
+V
/2 − 0.05 V
/2 V
REF
V
REF
+ 0.1 V
REF
/2 + 0.05 V
REF
Rev. 0 | Page 3 of 24
AD7625
Parameter Test Conditions/Comments Min Typ Max Unit
LVDS I/O (ANSI-644)
Data Format Serial LVDS twos complement
Differential Output Voltage, VOD R
Common-Mode Output Voltage, V
OCM
Differential Input Voltage, VID 100 650 mV
Common-Mode Input Voltage, V
ICM
POWER SUPPLIES
Specified Performance
VDD1 4.75 5 5.25 V
VDD2 2.37 2.5 2.63 V
VIO 2.37 2.5 2.63 V
Energy per Conversion 6 MSPS throughput 22 nJ/sample
TEMPERATURE RANGE
Specified Performance T
1
Using an external reference.
2
The ANSI-644 LVDS specification has a minimum output common mode (V
3
Power dissipation is for the AD7625 device only. In self-clocked interface mode, 9 mW is dissipated in the 100 Ω terminator. In echoed-clock interface mode, 18 mW is
dissipated in two 100 Ω terminators.
= 100 Ω 200 350 454 mV
L
2
R
= 100 Ω 850 1250 1375 mV
L
800 1575 mV
Self-clocked mode and echoed-
11 13 mA
clock mode
Self-clocked mode and echoed-
13.5 16 mA
clock mode
Self-clocked mode and echoed-
13.5 16 mA
clock mode
to T
MIN
−40 +85 °C
MAX
) of 1125 mV.
OCM
Rev. 0 | Page 4 of 24
AD7625
TIMING SPECIFICATIONS
VDD1 = 5 V; VDD2 = 2.5 V; VIO = 2.37 V to 2.63 V; REF = 4.096 V; all specifications T
Table 3.
Parameter Symbol Min Typ Max Unit
Time Between Conversions
Acquisition Time t
CNV± High Time t
CNV± to D± (MSB) Delay t
CNV± to Last CLK± (LSB) Delay t
CLK± Period
2
t
CLK± Frequency f
CLK± to DCO± Delay (Echoed-Clock Mode) t
DCO± to D± Delay (Echoed-Clock Mode) t
CLK± to D± Delay t
1
The maximum time between conversions is 10,000 ns. If CNV± is left idle for a time greater than the maximum value of t
2
For the minimum CLK period, the window available to read data is t
mode, n = 16; in self-clocked interface mode, n = 18.
1
t
CYC
ACQ
CNVH
MSB
CLKL
CLK
CLK
DCO
D
CLKD
CYC
− t
166 10,000 ns
40 ns
10 40 ns
145 ns
110 ns
(t
− t
CYC
MSB
250 300 MHz
0 4 7 ns
0 1 ns
0 4 7 ns
+ t
. Divide this time by the number of bits (n) that are read. In echoed-clock interface
MSB
CLK
to T
MIN
+ t
)/n 4 3.33 ns
CLK
, unless otherwise noted.
MAX
, the subsequent conversion result is invalid.
CYC
Rev. 0 | Page 5 of 24
AD7625
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Analog Inputs/Outputs
IN+, IN− to GND1
−0.3 V to REF + 0.3 V or
±130 mA
REF2 to GND −0.3 V to +6 V
VCM, CAP2 to GND −0.3 V to +6 V
CAP1, REFIN to GND −0.3 V to +2.7 V
Supply Voltage
VDD1 −0.3 V to +6 V
VDD2, VIO −0.3 V to +3 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Digital Outputs to GND −0.3 V to VIO + 0.3 V
Input Current to Any Pin Except
Supplies
3
Operating Temperature Range
±10 mA
−40°C to +85°C
(Commercial)
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
ESD 1 kV
1
See the Analog Inputs section.
2
Keep CNV+/CNV− low for any external REF voltage > 4.3 V applied
to the REF pin.
3
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θJA θ
Unit
JC
32-Lead LFCSP_VQ 40 4 °C/W
ESD CAUTION
Rev. 0 | Page 6 of 24
AD7625
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
P2
F
REF
GND
RE
REF
CA
GND
CAP2
CAP2
29
28
27
26
31
30
32
25
VDD1
1
2
3
4
5
6
7
8
PIN 1
INDICATOR
AD7625
TOP VIEW
(Not to Scale)
9
11
10
12
D–
D+
VIO
CNV+
13
14
15
GND
DCO–
DCO+
VDD2
CAP1
REFIN
EN0
EN1
VDD2
CNV–
NOTES
1. CONNECT T HE EXPOSED P AD TO THE G ROUND
PLANE OF T HE PCB USING MULTIPLE VIAS.
GND
24
IN+
23
IN–
22
VCM
21
VDD1
20
VDD1
19
VDD2
18
CLK+
17
16
CLK–
07652-002
Figure 2.
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type
1
Description
1 VDD1 P Analog 5 V Supply. Decouple the 5 V supply with a 100 nF capacitor.
2 VDD2 P
Analog 2.5 V Supply. Decouple this pin with a 100 nF capacitor. The 2.5 V supply source should
supply this pin first and then be traced to the other VDD2 pins (Pin 7 and Pin 18).
3 CAP1 AO Connect this pin to a 10 nF capacitor.
4 REFIN AI/O
Prebuffer Reference Voltage. When using the internal reference, this pin outputs the band gap voltage
and is nominally at 1.2 V. It can be overdriven with an external reference voltage such as the ADR280.
In either internal or external reference mode, a 10 F capacitor is required. If using an external 4.096 V
reference (connected to REF), this pin is a no connect and does not require any capacitor.
5, 6 EN0, EN1 DI Enable Pins. The logic levels of these pins set the operation of the device as follows:
EN1 = 0, EN0 = 0: Illegal state.
EN1 = 0, EN0 = 1: Enable internal buffer, disable internal reference. An external 1.2 V reference
connected to the REFIN pin is required.
EN1 = 1, EN0 = 0: Disable internal reference and reference buffer. An external 4.096 V reference
connected to the REF pin is required.
EN1 = 1, EN0 = 1: Enable internal reference and reference buffer.
7 VDD2 P Digital 2.5 V Supply. Decouple this pin with a 100 nF capacitor.
8, 9 CNV−, CNV+ DI
Convert Input. These pins act as the conversion control pin. On the rising edge of these pins, the
analog inputs are sampled and a conversion cycle is initiated. CNV+ works as a CMOS input when
CNV− is grounded; otherwise, CNV+ and CNV− are differential LVDS inputs.
10, 11 D−, D+ DO LVDS Data Outputs. The conversion data is output serially on these pins.
12 VIO P Input/Output Interface Supply. Use a 2.5 V supply and decouple this pin with a 100 nF capacitor.
13 GND P Ground. Return path for the 100 nF capacitor connected to Pin 12.
14, 15 DCO−, DCO+ DO
LVDS Buffered Clock Outputs. When DCO+ is grounded, the self-clocked interface mode is selected.
In this mode, the 16-bit results on D± are preceded by a 2-bit header (10) to allow synchronization of
the data by the digital host with simple logic. When DCO+ is not grounded, the echoed-clock inter-
face mode is selected. In this mode, DCO± is a copy of CLK±. The data bits are output on the falling
edge of DCO+ and can be latched in the digital host on the next rising edge of DCO+.
16, 17 CLK−, CLK+ DI LVDS Clock Inputs. This clock shifts out the conversion results on the falling edge of CLK+.
18 VDD2 P Analog 2.5 V Supply. Decouple this pin with a 100 nF capacitor.
19, 20 VDD1 P
Analog 5 V Supply. Isolate these pins from Pin 1 with a ferrite bead and decouple them with a 100 nF
capacitor.
21 VCM AO
Common-Mode Output. When using any reference scheme, this pin produces one-half the voltage
present on the REF pin, which can be useful for driving the common mode of the input amplifiers.
22 IN− AI Differential Negative Analog Input. Referenced to and must be driven 180° out of phase with IN+.
23 IN+ AI Differential Positive Analog Input. Referenced to and must be driven 180° out of phase with IN−.
24 GND P Ground.
Rev. 0 | Page 7 of 24
AD7625
Pin No. Mnemonic Type
25, 26, 28 CAP2 AO
1
Description
Connect all three CAP2 pins together and decouple them with the shortest trace possible to a single
10 F, low ESR, low ESL capacitor. The other side of the capacitor must be placed close to Pin 27 (GND).
27 GND P Ground. Return path for the 10 F capacitor connected to Pin 25, Pin 26, and Pin 28.
29, 30, 32 REF AI/O
Buffered Reference Voltage. When using the internal reference or the 1.2 V external reference (REFIN
input), the 4.096 V system reference is produced at this pin. When using an external reference, such
as the ADR434 or the ADR444, the internal reference buffer must be disabled. In either case, connect
all three REF pins together and decouple them with the shortest trace possible to a single 10 F, low
ESR, low ESL capacitor. The other side of the capacitor must be placed close to Pin 31 (GND).
31 GND P Ground. Return path for the 10 F capacitor connected to Pin 29, Pin 30, and Pin 32.
EP Exposed Pad
The exposed pad is located on the underside of the package. Connect the exposed pad to the
ground plane of the PCB using multiple vias. See the Exposed Paddle section for more information.
1
AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DO = digital output; P = power.
Rev. 0 | Page 8 of 24
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