ANALOG DEVICES AD7623 Service Manual

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16-Bit, 1.33 MSPS PulSAR® ADC

FEATURES

Throughput: 1.33 MSPS
2.048 V internal reference Differential input range: ±V INL: ±1 LSB
typical 16-bit resolution with no missing codes SINAD: 88 dB typical @ 100 kHz THD: −97 dB typical @ 100 kHz No pipeline delay (SAR architecture) Parallel (16- or 8-bit bus) and serial 5 V/3.3 V/2.5 V interface SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
2.5 V single-supply operation Power dissipation: 45 mW typical @ 1.33 MSPS 48-lead LQFP and LFCSP_VQ packages Speed upgrade of the AD7677

APPLICATIONS

Medical instruments High speed data acquisition Digital signal processing Communications Instrumentation Spectrum analysis AT E
REF
(V
up to 2.5 V)
REF
AD7623

FUNCTIONAL BLOCK DIAGRAM

AGND AVDD
IN+ IN–
PDREF PDBUF
PD
RESET
TEMP
REFBUFIN
REF
CONTROL LOGIC AND
CALIBRATION CIRCUITRY
REF AMP
SWITCHED
CAP DAC
CNVST
REF REFGND
AD7623
INTERFACE
CLOCK
Figure 1.
Table 1. PulSAR Selection
Type/kSPS 100 to 250 500 to 570
Pseudo Differential
AD7651 AD7660/61
AD7650/52 AD7664/66
True Bipolar AD7663 AD7665 AD7671 True
AD7675 AD7676 AD7677 AD7621
Differential 18-Bit AD7678 AD7679 AD7674 AD7641 Multichannel/
AD7654 AD7655
Simultaneous
DGNDDVDD
OVDD OGND
SERIAL
PORT
16
D[15:0]
PARALLEL
SER/PAR BUSY RD CS OB/2C BYTESWAP
800 to 1000 >1000
AD7653 AD7667
AD7623
05574-001

GENERAL DESCRIPTION

The AD7623 is a 16-bit, 1.33 MSPS, charge redistribution SAR, fully differential analog-to-digital converter (ADC) that operates from a single 2.5 V power supply. It contains a high speed 16-bit sampling ADC, an internal conversion clock, an internal reference (and buffer), error correction circuits, and both serial and parallel system interface ports. Power consump­tion is automatically scaled with throughput, making it ideal for battery-powered applications. It is available in 48-lead, low profile quad flat package (LQFP) and a lead frame chip-scale (LFCSP_VQ) package. Operation is specified from
−40°C to +85°C.
Rev. 0

PRODUCT HIGHLIGHTS

1. Fast Throughput.
The AD7623 is a 1.33 MSPS, charge redistribution, 16-bit SAR ADC.
2. Sup
3. Int
4. S
5. Se
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
erior Linearity.
The AD7623 has no missing 16-bit code.
ernal Reference. The AD7623 has a 2.048 V internal reference with a typical drift of ±7 ppm/°C.
ingle-Supply Operation. The AD7623 operates from a 2.5 V single supply and typically dissipates 45 mW. Its power dissipation decreases with the throughput.
rial or Parallel Interface. Versatile parallel (16- or 8-bit bus) or 2-wire serial interface arrangement compatible with 2.5 V, 3.3 V, or 5 V logic.
AD7623
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TABLE OF CONTENTS
Features.............................................................................................. 1
Analog Inputs .............................................................................17
Applications....................................................................................... 1
Functional Block Diagram ..............................................................1
General Description......................................................................... 1
Product Highlights........................................................................... 1
Specifications..................................................................................... 3
Timing Specifications....................................................................... 5
Serial Clock Timing Specifications............................................ 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Terminology ....................................................................................11
Typical Performance Characteristics ...........................................12
Theory of Operation ......................................................................15
Circuit Information.................................................................... 15
Converter Operation.................................................................. 15
Driver Amplifier Choice ........................................................... 17
Voltage Reference Input ............................................................ 18
Power Supply............................................................................... 19
Power Dissipation vs. Throughput .......................................... 20
Conversion Control................................................................... 20
Interfaces.......................................................................................... 21
Digital Interface.......................................................................... 21
Parallel Interface......................................................................... 21
Serial Interface............................................................................ 22
Master Serial Interface............................................................... 22
Slave Serial Interface.................................................................. 24
Microprocessor Interfacing....................................................... 26
Application ...................................................................................... 27
Layout .......................................................................................... 27
Evaluating the AD7623 Performance...................................... 27
Transfer Functions......................................................................16
Typical Connection Diagram ................................................... 17
REVISION HISTORY
7/05—Revision 0: Initial Version
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
Rev. 0 | Page 2 of 28
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SPECIFICATIONS

AVDD = DVDD = 2.5 V; OVDD = 2.3 V to 3.6 V; V
Table 2.
Parameter Conditions Min Typ Max Unit
RESOLUTION 16 Bits ANALOG INPUT
Voltage Range
VIN+ VIN− Operating Input Voltage VIN+, VIN− to AGND −0.1 AVDD Analog Input CMRR fIN = 100 kHz 55 dB Input Current 1.33 MSPS throughput 10 μA Input Impedance
2
THROUGHPUT SPEED
Complete Cycle 750 ns Throughput Rate 0 1.33 MSPS
DC ACCURACY
Integral Linearity Error
3
V No Missing Codes V Differential Linearity Error V Transition Noise V Transition Noise V Zero Error, T
MIN
to T
MAX
5
−30 +30 LSB Zero Error Temperature Drift ±1 ppm/°C Gain Error, T
MIN
to T
MAX
5
−0.38 +0.38 % of FSR Gain Error Temperature Drift ±2 ppm/°C Power Supply Sensitivity AVDD = 2.5 V ± 5% ±2 LSB
AC ACCURACY
Dynamic Range fIN = 20 kHz 90 dB Signal-to-Noise fIN = 20 kHz 88 89.5 dB f f
IN
IN
Spurious-Free Dynamic Range fIN = 20 kHz 97 dB f
IN
Total Harmonic Distortion fIN = 20 kHz –97 dB f
IN
Signal-to-(Noise + Distortion) fIN = 20 kHz 87.5 88.5 dB
f f
IN
IN
–3 dB Input Bandwidth 50 MHz
SAMPLING DYNAMICS
Aperture Delay 1 ns Aperture Jitter 5 ps rms Transient Response Full-scale step 50 ns
INTERNAL REFERENCE PDREF = PDBUF = low
Output Voltage REF @ 25°C 2.038 2.048 2.058 V Temperature Drift –40°C to +85°C ±7 ppm/°C Line Regulation AVDD = 2.5 V ± 5% ±15 ppm/V Turn-On Settling Time C REFBUFIN Output Voltage REFBUFIN @ 25°C 1.2 V REFBUFIN Output Resistance 6.33
= 2.5 V; all specifications T
REF
= 2.048 V, PDREF = high −2 ±1 +2 LSB
REF
= 2.048 V, PDREF = high 16 Bits
REF
= 2.048 V, PDREF = high −1 +2 LSB
REF
= 2.5 V 0.70 LSB
REF
= 2.048 V 0.82 LSB
REF
= 20 kHz, V
= 2.048 V 86 88 dB
REF
MIN
to T
−V
, unless otherwise noted.
MAX
+V
REF
V
REF
1
= 100 kHz 89 dB
= 100 kHz 96 dB
= 100 kHz −95 dB
= 20 kHz, V
= 2.048 V 87.5 dB
REF
= 100 kHz 88 dB
= 10 μF 5 ms
REF
V
4
6
Rev. 0 | Page 3 of 28
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Parameter Conditions Min Typ Max Unit
EXTERNAL REFERENCE PDREF = PDBUF = high
Voltage Range REF 1.8 2.048 AVDD V Current Drain 1.33 MSPS throughput 100 μA
REFERENCE BUFFER PDREF = high, PDBUF = low
REFBUFIN Input Voltage Range 1.05 1.2 1.30 V
TEMPERATURE PIN
Voltage Output @ 25°C 273 mV Temperature Sensitivity 0.85 mV/°C Output Resistance 4.7
DIGITAL INPUTS
Logic Levels
VIL –0.3 +0.6 V VIH 1.7 5.25 V IIL –1 +1 μA IIH –1 +1 μA
DIGITAL OUTPUTS
Data Format Pipeline Delay
VOL I VOH I
POWER SUPPLIES
Specified Performance
AVDD 2.37 2.5 2.63 V DVDD 2.37 2.5 2.63 V OVDD 2.30
Operating Current
AVD D DVDD 1.6 mA OVDD 0.6 mA
Power Dissipation
With Internal Reference Without Internal Reference
In Power-Down Mode12 PD = high 600 μW
TEMPERATURE RANGE
Specified Performance T
1
When using an external reference. With the internal reference, the input range is from 0.1 V to V
2
See the Analog Inputs section.
3
Linearity is tested using endpoints, not best fit. Tested with an external reference at 2.048 V.
4
LSB means least significant bit. With the ±2.048 V input range, 1 LSB is 62.5 μV.
5
See the Terminology section. These specifications do not include the error contribution from the external reference.
6
All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified.
7
Parallel or serial 16-bit.
8
Conversion results are available immediately after completed conversion.
9
See the Absolute Maximum Ratings section.
10
Tested in parallel reading mode.
11
With internal reference, PDREF and PDBUF are low; without internal reference, PDREF and PDBUF are high.
12
With all digital inputs forced to OVDD.
13
Consult sales for extended temperature range.
7
8
10
11
10
11
11
13
= 500 μA 0.4 V
SINK
= –500 μA OVDD − 0.3 V
SOURCE
9
3.6 V
1.33 MSPS throughput With internal reference 15 mA
1.33 MSPS throughput 50 55 mW
1.33 MSPS throughput 45 53 mW
to T
MIN
–40 +85 °C
MAX
.
REF
Rev. 0 | Page 4 of 28
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TIMING SPECIFICATIONS

AVDD = DVDD = 2.5 V; OVDD = 2.3 V to 3.6 V; V
Table 3.
Parameter Symbol Min Typ Max Unit
CONVERSION AND RESET (Refer to Figure 31 and Figure 32)
Convert Pulse Width t1 15 70 Time Between Conversions t2 750 ns CNVST Low to BUSY High Delay BUSY High All Modes (Except Master Serial Read After Convert) t4 560 ns Aperture Delay t5 1 ns End of Conversion to BUSY Low Delay t6 10 ns Conversion Time t7 560 ns Acquisition Time t8 125 ns RESET Pulse Width t9 15 ns RESET Low to BUSY High Delay BUSY High Time from RESET Low
2
2
PARALLEL INTERFACE MODES (Refer to Figure 33 to Figure 35).
CNVST Low to DATA Valid Delay DATA Valid to BUSY Low Delay t11 2 ns Bus Access Request to DATA Valid t12 20 ns Bus Relinquish Time t13 2 15 ns
MASTER SERIAL INTERFACE MODES3 (Refer to Figure 37 and Figure 38)
CS Low to SYNC Valid Delay CS Low to Internal SCLK Valid Delay
3
CS Low to SDOUT Delay CNVST Low to SYNC Delay SYNC Asserted to SCLK First Edge Delay t18 0.5 ns
Internal SCLK Period Internal SCLK High Internal SCLK Low SDOUT Valid Setup Time SDOUT Valid Hold Time SCLK Last Edge to SYNC Delay
4
4
4
4
4
4
CS High to SYNC HI-Z CS High to Internal SCLK HI-Z CS High to SDOUT HI-Z BUSY High in Master Serial Read after Convert CNVST Low to SYNC Asserted Delay SYNC Deasserted to BUSY Low Delay t30 13 ns
SLAVE SERIAL INTERFACE MODES3 (Refer to Figure 40 and Figure 41)
External SCLK Setup Time t31 5 ns External SCLK Active Edge to SDOUT Delay t32 1 8 ns SDIN Setup Time t33 5 ns SDIN Hold Time t34 5 ns External SCLK Period t35 12.5 ns External SCLK High t36 5 ns External SCLK Low t37 5 ns
1
See the Conversion Control section.
2
See the Digital Interface and RESET sections.
3
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
4
In serial master read during convert mode. See Table 4 for serial master read after convert mode timing specifications.
= 2.5 V; all specifications T
REF
4
to T
MIN
23 ns
t
3
, unless otherwise noted.
MAX
1
ns
t38 10 ns t39 600 ns
560 ns
t
10
10 ns
t
14
t15 10 ns
10 ns
t
16
263 ns
t
17
t19 8 12 ns t20 2 ns t21 3 ns t22 1 ns t23 0 ns t24 0 ns
10 ns
t
25
10 ns
t
26
10 ns
t
27
t28 See Table 4
500 ns
t
29
Rev. 0 | Page 5 of 28
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SERIAL CLOCK TIMING SPECIFICATIONS

Table 4. Serial Clock Timings in Master Read After Convert Mode
DIVSCLK[1] 0 0 1 1 DIVSCLK[0] Symbol 0 1 0 1 Unit
SYNC to SCLK First Edge Delay Minimum t18 0.5 3 3 3 ns Internal SCLK Period Minimum t19 8 16 32 64 ns Internal SCLK Period Maximum t19 12 25 50 100 ns Internal SCLK High Minimum t20 2 6 15 31 ns Internal SCLK Low Minimum t21 3 7 16 32 ns SDOUT Valid Setup Time Minimum t22 1 5 5 5 ns SDOUT Valid Hold Time Minimum t23 0 0.5 10 28 ns SCLK Last Edge to SYNC Delay Minimum t24 0 0.5 9 26 ns BUSY High Width Maximum t28 0.780 1.000 1.440 2.320 μs
500μAI
TO OUTPUT
PIN
C
L
50pF
500μAI
NOTE IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND SDOUT ARE DEFINED WITH A MAXIMUM LOAD.
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
C
L
Figure 2. Load Circuit for Digital Interface Timing,
SDOUT, SYNC, and SCLK Outputs, C
OL
1.4V
OH
05574-002
= 10 pF
L
0.8V
t
DELAY
2V
0.8V
Figure 3. Voltage Reference Levels for Timing
2V
t
DELAY
2V
0.8V
05574-003
Rev. 0 | Page 6 of 28
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ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Analog Inputs/Outputs
IN+1, IN−, REF, REFBUFIN, TEMP,
INGND, REFGND to AGND
Ground Voltage Differences
AGND, DGND, OGND ±0.3 V
Supply Voltages
AVDD, DVDD –0.3 V to +2.7 V OVDD –0.3 V to +3.8 V AVDD to DVDD ±2.8 V AVDD to OVDD +2.8 V to −3.8 V
OVDD to DVDD Digital Inputs −0.3 V to +5.5 V PDREF, PDBUF Internal Power Dissipation Internal Power Dissipation Junction Temperature 125°C Storage Temperature Range –65°C to +125°C
1
See the Analog Inputs section.
2
See the Power Supply section.
3
See the Voltage Reference Input section.
4
Specification is for the device in free air: 48-Lead LQFP; θJA = 91°C/W,
θJC = 30°C/W.
5
Specification is for the device in free air: 48-Lead LFCSP; θJA = 26°C/W.
2
3
4
5
AVDD + 0.3 V to
AGND − 0.3 V
≤ +0.3 V if DVDD < 2.3 V
±20 mA 700 mW
2.5 W
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 7 of 28
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

PDBUF
PDREF
REFBUFIN
TEMP
AVDD
IN+
AGND
OVDD
OGND
AGNDNCIN–
DVDD
DGND
D8/SDOUT
48 47 46 45 44 39 38 3743 42 41 40
1
AGND AVDD
NC
BYTESWAP
OB/2C DGND DGND
SER/PAR
D0
D1 D2/DIVSCLK[0] D3/DIVSCLK[1]
NC = NO CONNECT
PIN 1 IDENTIFIER
2 3 4 5 6 7 8
9 10 11 12
13 14 15 16 17 18 19 20 21 22 23 24
D4/EXT/INT
(Not to Scale)
D6/INVSCLK
D5/INVSYNC
D7/RDC/SDIN
AD7623
TOP VIEW
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1Description
1, 41, 42 AGND P Analog Power Ground Pin. 2, 44 AVDD P Input Analog Power Pins. Nominally 2.5 V. 3, 40 NC 4 BYTESWAP DI
No Connect. Parallel Mode Selection (8-Bit/16-Bit). When high, the LSB is output on D[15:8] and the MSB is output
on D[7:0]; when low, the LSB is output on D[7:0] and the MSB is output on D[15:8].
5
OB/2C
DI
Straight Binary/Binary Twos Complement Output. When high, the digital output is straight binary;
when low, the MSB is inverted resulting in a twos complement output from its internal shift register. 6, 7 DGND P 8
SER/PA R
DI
Digital Power Ground.
Serial/Parallel Selection Input. When high, the serial interface is selected and some bits of the data bus
are used as a serial port; the remaining data bits are high impedance outputs. When SER/PA R
the parallel port is selected. 9, 10 D[0:1] DO 11, 12 D[2:3] DI/O
or DIVSCLK[0:1]
Bit 0 and Bit 1 of the Parallel Port Data Output Bus.
When SER/PA R
When SER/PA R
mode (EXT/INT
= low, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus. = high, serial clock division selection. When using serial master read after convert
= low, RDC/SDIN = low), these inputs can be used to slow down the internally generated serial clock that clocks the data output. In other serial modes, these pins are high impedance outputs.
13 D4 DI/O
or EXT/INT
When SER/PA R When SER/PA R
= low, this output is used as Bit 4 of the parallel port data output bus. = high, serial clock source select. This input is used to select the internally generated
(master ) or external (slave) serial data clock. When EXT/INT
= low, master mode. The internal serial clock is selected on SCLK output.
When EXT/INT = high, slave mode. The output data is synchronized to an external clock signal, gated by CS
, connected to the SCLK input.
D9/SCLK
REFGND
D10/SYNC
REF
36 35 34 33 32 31 30 29 28 27 26 25
D11/RDERROR
AGND CNVST PD RESET CS RD DGND BUSY D15 D14 D13 D12
05574-004
= low,
14 D5 DI/O or INVSYNC
When SER/PA R When SER/PA R
= low, this output is used as Bit 5 of the parallel port data output bus.
= high, invert sync select. In serial master mode (EXT/INT = low), this input is used to select the active state of the SYNC signal. When INVSYNC = low, SYNC is active high.
When INVSYNC = high, SYNC is active low.
15 D6 DI/O
When SER/
PA R
= low, this output is used as Bit 6 of the parallel port data output bus.
or INVSCLK Invert SCLK Select. In all serial modes, this input is used to invert the SCLK signal.
Rev. 0 | Page 8 of 28
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Pin No. Mnemonic Type1Description
16 D7 DI/O Bit 7 of the Parallel Port Data Output Bus. or RDC
or SDIN
17 OGND P Input/Output Interface Digital Power Ground. 18 OVDD P
19 DVDD P Digital Power. Nominally at 2.5 V. 20 DGND P Digital Power Ground. 21 D8 DO
or SDOUT
22 D9 DI/O
or SCLK
23 D10 DO or SYNC
24 D11 DO
or RDERROR
25 to 28 D[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data Output Bus. 29 BUSY DO
30 DGND P Digital Power Ground. 31
RD
DI
When SER/PA R used to select the read mode.
When RDC = high, the previous conversion result is read during current conversion and the period of SCLK changes (see the Master Serial Interface section).
When RDC = low (read after convert), the current result is read after conversion. Serial Data In. When using serial slave mode, (EXT/INT
daisy-chain the conversion results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after the initiation of the read sequence.
Input/Output Interface Digital Power. Nominally at the same sup (2.5 V or 3 V).
When SER/PA R When SER/PA R
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7623 provides the conversion result, MSB first, from its internal shift register. The data format is determined by the logic level of OB/2C.
In master mode, (EXT/INT In slave mode, (EXT/INT
When INVSCLK = low, SDOUT is updated on SCLK rising edge and valid on the next falling edge. When INVSCLK = high, SDOUT is updated on SCLK falling edge and valid on the next rising edge.
Parallel Port Data Output Bus Bit 9. When SER/PA R data output bus.
Serial Clock. When SER/PAR clock input or output, dependent on the logic state of the EXT/INT SDOUT is updated depends on the logic state of the INVSCLK pin. When SER/PA R
When SER/PA R used as a digital output frame synchronization for use with the internal data clock. When a read sequence is initiated and INVSYNC = low
SDOUT output is valid. When a read sequence is initiated and INVSYNC = high, SYNC is driven low and remains low while SDOUT output is valid.
Parallel Port Data Output Bus Bit 11. When SER/PA R port data output bus.
Read Error. When SER/PAR as an incomplete read error flag. If a data read is started and not completed when the current conversion is complete, the current data is lost and RDERROR is pulsed high.
Busy Output. Transitions high when a conversion is started, and remains high until the conversion is
omplete and the data is latched into the on-chip shift register. The falling edge of BUSY can be used
c as a data ready clock signal.
Read Data. When CS
= high, read during convert. When using serial master mode (EXT/INT = low), RDC is
= high), SDIN could be used as a data input to
ply as the supply of the host interface
= low, this output is used as Bit 8 of the parallel port data output bus. = high, serial data output. In serial mode, this pin is used as the serial data output
= low). SDOUT is valid on both edges of SCLK.
= high):
= low, this output is used as Bit 9 of the parallel port
= high, serial clock. In all serial modes, this pin is used as the serial data
pin. The active edge where the data
= low, this output is used as Bit 10 of the parallel port data output bus. = high, frame synchronization. In serial master mode (EXT/INT= low), this output is
, SYNC is driven high and remains high while
= low, this output is used as Bit 11 of the parallel
= high, read error. In serial slave mode (EXT/INT = high), this output is used
and RD are both low, the interface parallel or serial output bus is enabled.
32
33 RESET DI
34 PD DI
CS
DI
Chip Select. When CS also used to gate the external clock in slave serial mode.
Reset Input. When high, reset the AD7623. Current conversion if any is aborted. Falling edge of RESET enables the cali not used
Power-Down Input. When high, power down the ADC. Power consumption is reduced and conversions ar
, this pin can be tied to DGND.
e inhibited after the current one is completed.
and RD are both low, the interface parallel or serial output bus is enabled. CS is
bration mode indicated by pulsing BUSY high. Refer to the Digital Interface section. If
Rev. 0 | Page 9 of 28
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