1.5 MSPS (normal mode)
INL: ±0.5 LSB typical, ±1.5 LSB maximum (±23 ppm of FSR)
16-bit resolution with no missing codes
Dynamic range: 92.5 dB typical
SINAD: 91 dB minimum @ 20 kHz (V
THD: −115 dB typical @ 20 kHz (V
2.048 V internal reference: typical drift
Differential input range: ±V
REF
(V
No pipeline delay (SAR architecture)
Parallel (16-, or 8-bit bus) and serial 5 V/3.3 V/2.5 V interface
SPI®/QSPI™/MICROWIRE™/DSP compatible
Single 2.5 V supply operation
Power dissipation
70 mW typical @ 2 MSPS with internal REF
2 μW in power-down mode
Pb-free, 48-lead LQFP and 48-lead LFCSP_VQ
Pin compatible with other PulSAR 48-lead ADCs
APPLICATIONS
Medical instruments
High speed data acquisition/high dynamic data acquisition
Digital signal processing
Spectrum analysis
Instrumentation
Communications
AT E
GENERAL DESCRIPTION
The AD7622 is a 16-bit, 2 MSPS, charge redistribution SAR,
fully differential, analog-to-digital converter (ADC) that
operates from a single 2.5 V power supply. The part contains a
high speed, 16-bit sampling ADC, an internal conversion clock,
an internal reference (and buffer), error correction circuits, and
both serial and parallel system interface ports. It features two
very high sampling rate modes (wideband warp and warp) and
a fast mode (normal) for asynchronous rate applications. The
AD7622 is hardware factory calibrated and tested to ensure ac
parameters, such as signal-to-noise ratio (SNR), in addition to
the more traditional dc parameters of gain, offset, and linearity.
The AD7622 is available in Pb-free only packages with
operation specified from −40°C to +85°C.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Voltage REF @ 25°C 2.038 2.048 2.058 V
Temperature Drift −40°C to +85°C ±8 ppm/°C
Line Regulation AVDD = 2.5 V ± 5% ±15 ppm/V
Turn-On Settling Time C
REF
= 2.5 V; all specifications T
REF
− V
IN−
, V
to AGND −0.1 AVDD
IN−
to T
= −40°C to +85°C −1.5 ±0.5 +1.5 LSB
MAX
MIN
−V
to T
REF
, unless otherwise noted.
MAX
+V
REF
1
V
V
= 2.5 V 0.5 LSB
= 2.048 V 0.6 LSB
= 2.5 V 91.5 92.5 dB
= 2.5 V 91 92 dB
REF
= 2.048 V 89.5 90.5 dB
REF
= 2.5 V 91 dB
REF
= 2.5 V 117 dB
REF
= 2.048 V 110 dB
REF
= 2.5 V 101 dB
REF
= 2.5 V −115 dB
REF
= 2.048 V −109 dB
REF
= 2.5 V −100 dB
REF
= 2.5 V 91 92 dB
REF
= 2.048 V 89.5 90.5 dB
REF
= 2.5 V 91 dB
REF
= 10 μF 5 ms
4
6
Rev. 0 | Page 3 of 28
AD7622
Parameter Conditions Min Typ Max Unit
REFBUFIN Output Voltage REFBUFIN @ 25°C 1.19 V
REFBUFIN Output Resistance 6.33 kΩ
EXTERNAL REFERENCE PDREF = PDBUF = high
Voltage Range REF 1.8 2.5 AVDD + 0.1 V
Current Drain 2 MSPS throughput 150 μA
REFERENCE BUFFER PDREF = high, PDBUF = low
REFBUFIN Input Voltage Range REF = 2.048 V typ 1.05 1.2 1.30 V
REFBUFIN Input Current REFBUFIN = 1.2 V 1 nA
TEMPERATURE PIN
Voltage Output @ 25°C 278 mV
Temperature Sensitivity 1 mV/°C
Output Resistance 4.7 kΩ
DIGITAL INPUTS
Logic Levels
V
IL
V
IH
I
IL
I
IH
DIGITAL OUTPUTS
Data Format7
Pipeline Delay
V
OL
V
OH
8
POWER SUPPLIES
Specified Performance
AVDD 2.37 2.5 2.63 V
DVDD 2.37 2.5 2.63 V
OVDD 2.30
Operating Current
11
AVD D
10
AVDD Without internal reference 23 mA
DVDD 2.5 mA
12
OVDD
Power Dissipation
With Internal Reference
Without Internal Reference
In Power-Down Mode
TEMPERATURE RANGE
11
10
10
12
13
Specified Performance T
1
When using an external reference. With the internal reference, the input range is −0.1 V to V
2
See Analog Inputs section.
3
Linearity is tested using endpoints, not best fit.
4
LSB means least significant bit. With the ±2.048 V input range, 1 LSB is 62.5 μV.
5
See Voltage Reference Input section. These specifications do not include the error contribution from the external reference.
6
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified.
7
Parallel or serial 16-bit.
8
Conversion results are available immediately after completed conversion.
9
See the Absolute Maximum Ratings section.
10
In wideband and warp modes. Tested in parallel reading mode.
11
With internal reference, PDREF and PDBUF are low; without internal reference, PDREF and PDBUF are high.
12
With all digital inputs forced to OVDD.
13
Consult sales for extended temperature range.
−0.3 +0.6 V
1.7 5.25 V
−1 +1 μA
−1 +1 μA
I
= 500 μA 0.4 V
SINK
I
= −500 μA OVDD − 0.3 V
SOURCE
9
3.6 V
2 MSPS throughput
With internal reference 24 mA
CONVERSION AND RESET (Refer to Figure 31 and Figure 32)
Convert Pulse Width t
Time Between Conversions (Warp Mode2/Normal Mode3) t
CNVST
Low to BUSY High Delay
BUSY High All Modes (Except Master Serial Read After Convert)
Warp Mode/Normal Mode t
Aperture Delay t
End of Conversion to BUSY Low Delay t
Conversion Time (Warp Mode/Normal Mode) t
Acquisition Time (Warp Mode/Normal Mode) t
RESET Pulse Width t
RESET Low to BUSY High Delay
BUSY High Time from RESET Low
4
4
PARALLEL INTERFACE MODES (Refer to Figure 33 to Figure 36 )
CNVST
Low to Data Valid Delay (Warp Mode/Normal Mode)
Data Valid to BUSY Low Delay t
Bus Access Request to Data Valid t
Bus Relinquish Time t
MASTER SERIAL INTERFACE MODES5 (Refer to Figure 37 and Figure 38)
CS
Low to SYNC Valid Delay
CS
Low to Internal SCLK Valid Delay
CS
Low to SDOUT Delay
CNVST
Low to SYNC Delay (Warp Mode/Normal Mode)
5
SYNC Asserted to SCLK First Edge Delay t
Internal SCLK Period
Internal SCLK High
Internal SCLK Low
SDOUT Valid Setup Time
SDOUT Valid Hold Time
SCLK Last Edge to SYNC Delay
CS
High to SYNC HI-Z
CS
High to Internal SCLK HI-Z
CS
High to SDOUT HI-Z
6
6
6
6
6
6
BUSY High in Master Serial Read After Convert
CNVST
Low to SYNC Asserted Delay (Warp Mode/Normal Mode)
SYNC Deasserted to BUSY Low Delay t
SLAVE SERIAL INTERFACE MODES (Refer to Figure 40 and Figure 41)
External SCLK Setup Time t
External SCLK Active Edge to SDOUT Delay t
SDIN Setup Time t
SDIN Hold Time t
External SCLK Period t
External SCLK High t
External SCLK Low t
All timings for wideband warp mode are the same as warp mode.
3
In warp mode only, the maximum time between conversions is 1 ms; otherwise, there is no required maximum time.
4
See the Digital Interface section and the RESET section.
5
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
6
In serial master read during convert mode. See Table 4 for serial master read after convert mode timing specifications.
Table 4. Serial Clock Timings in Master Read After Convert Mode
DIVSCLK[1] 0 0 1 1
DIVSCLK[0] Symbol 0 1 0 1 Unit
SYNC to SCLK First Edge Delay Minimum t
Internal SCLK Period Minimum t
Internal SCLK Period Maximum t
Internal SCLK High Minimum t
Internal SCLK Low Minimum t
SDOUT Valid Setup Time Minimum t
SDOUT Valid Hold Time Minimum t
SCLK Last Edge to SYNC Delay Minimum t
NOTE
IN SERIAL INT ERFACE MODES, THE S YNC, SCLK, AND
SDOUT TI MING ARE DEFINED WIT H A MAXIMUM LOAD
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
C
L
OL
1.4V
OH
Figure 3. Load Circuit for Digital Interface Timing,
SDOUT, SYNC, and SCLK Outputs, C
= 10 pF
L
0.8V
t
DELAY
2V
0.8V
6023-002
Figure 4. Voltage Reference Levels for Timing
2V
t
DELAY
2V
0.8V
6023-003
Rev. 0 | Page 6 of 28
AD7622
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Analog Inputs/Outputs
IN+1, IN−, REF, REFBUFIN, TEMP,
INGND, REFGND to AGND
AVDD + 0.3 V to
AGND − 0.3 V
Ground Voltage Differences
AGND, DGND, OGND ±0.3 V
Supply Voltages
AVDD, DVDD −0.3 V to +2.7 V
OVDD −0.3 V to +3.8 V
AVDD to DVDD ±2.8 V
AVDD, DVDD to OVDD −3.8 V to +2.8 V
Digital Inputs −0.3 V to +5.5 V
PDREF, PDBUF
Internal Power Dissipation
Internal Power Dissipation
2
3
4
±20 mA
700 mW
2.5 W
Junction Temperature 125°C
Storage Temperature Range –65°C to +125°C
1
See Analog Inputs section.
2
See Voltage Reference Input section.
3
Specification is for the device in free air:
48-Lead LQFP; θJA = 91°C/W, θJC = 30°C/W.
4
Specification is for the device in free air:
48-Lead LFCSP; θJA = 26°C/W.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 7 of 28
AD7622
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PDBUF
PDREF
REFBUFIN
TEMP
AVD D
IN+
AGND
AGNDNCIN–
REFGND
48 47 46 45 4439 38 3743 42 41 40
1
AGND
AVD D
DGND
BYTESWAP
OB/2C
WAR P
NORMAL
SER/PAR
D0
D1
D2/DIVSCL K[0]
D3/DIVSCL K[1]
NC = NO CONNECT
PIN 1
IDENTIFIER
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
D4/EXT/INT
D6/INVSCLK
D5/INVSYNC
AD7622
TOP VIEW
(Not to Scale)
DVDD
OVDD
OGND
D7/RDC/SDIN
Figure 5. Pin Configuration
Table 6. Pin Function Descriptions
Pin
No.
1, 36,
Mnemonic Type
AGND P Analog Power Ground.
1
Description
41, 42
2, 44 AVDD P Input Analog Power Pins. Nominally 2.5 V.
3 DGND P Digital Power Ground.
4 BYTESWAP DI
Parallel Mode Selection (8-Bit/16-Bit). When high, the LSB is output on D[15:8] and the MSB is output
on D[7:0]; when low, the LSB is output on D[7:0] and the MSB is output on D[15:8].
5
OB/
2C
DI
Straight Binary/Binary Twos Complement Output. When high, the digital output is straight binary;
when low, the MSB is inverted resulting in a twos complement output from its internal shift register.
6 WARP DI
Conversion Mode Selection. When WARP = high and
mode with slightly improved linearity and THD. When WARP = high and
warp mode. In either mode, these are the fastest modes; maximum throughput is achievable, and
a minimum conversion rate must be applied to guarantee full specified accuracy.
7
NORMAL
DI
Conversion Mode Selection. When
NORMAL = low and WARP = low, this input selects normal mode
where full accuracy is maintained independent of the minimum conversion rate.
8
SER/
PA R
DI/O Serial/Parallel Selection Input.
When SER/
PA R = high, the serial interface is selected and some bits of the data bus are used as a
serial port; the remaining data bits are high impedance outputs.
9, 10 D[0:1] DO
When SER/
Bit 0 and Bit 1 of the Parallel Port Data Output Bus. These pins are always outputs, regardless of
PA R = low, the parallel port is selected.
the interface mode.
11, 12 D[2:3] DI/O
or DIVSCLK[0:1]
When SER/
When SER/
(EXT/
PA R = low, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus.
PA R = high, serial clock division selection. When using serial master read after convert mode
INT = low, RDC/SDIN = low), these inputs can be used to slow down the internally generated
serial clock that clocks the data output. In other serial modes, these pins are high impedance outputs.
13 D4 DI/O
or EXT/
INT
When SER/
When SER/
PA R = low, this output is used as Bit 4 of the parallel port data output bus.
PA R = high, serial clock source select. This input is used to select the internally generated
(master) or external (slave) serial data clock.
When EXT/
When EXT/
INT = low, master mode. The internal serial clock is selected on SCLK output.
INT = high, slave mode. The output data is synchronized to an external clock signal,
gated by CS, connected to the SCLK input.
DGND
REF
36
AGND
CNVST
35
34
PD
33
RESET
32
CS
31
RD
30
DGND
29
BUSY
28
D15
27
D14
26
D13
25
D12
D9/SCLK
D10/SYNC
D8/SDOUT
06023-004
D11/RDERROR
NORMAL = high, this selects wideband warp
NORMAL = low, this selects
Rev. 0 | Page 8 of 28
AD7622
Pin
No. Mnemonic Type
14 D5 DI/O
or INVSYNC
15 D6 DI/O
or INVSCLK
16 D7 DI/O
or RDC
or SDIN
17 OGND P Input/Output Interface Digital Power Ground.
18 OVDD P
19 DVDD P Digital Power. Nominally at 2.5 V.
20 DGND P Digital Power Ground.
21 D8 DO
or SDOUT
22 D9 DI/O
or SCLK
23 D10 DO
or SYNC
24 D11 DO
or RDERROR
25 to
D[12:15] DO
28
29 BUSY DO
30 DGND P Digital Power Ground.
1
Description
When SER/
When SER/
PA R = low, this output is used as Bit 5 of the parallel port data output bus.
PA R = high, invert sync select. In serial master mode (EXT/INT = low), this input is used
to select the active state of the SYNC signal.
When INVSYNC = low, SYNC is active high.
When INVSYNC = high, SYNC is active low.
When SER/
When SER/
PA R = low, this output is used as Bit 6 of the parallel port data output bus.
PA R] = high, invert SCLK select. In all serial modes, this input is used to
invert the SCLK signal.
When SER/
When SER/
PA R = low, this output is used as bit 7 of the parallel port data output bus.
PA R = high, read during convert. When using serial master mode (EXT/INT = low),
RDC is used to select the read mode.
When RDC = high, the previous conversion result is output on SDOUT during conversion and
the period of SCLK changes (see the
Master Serial Interface section).
When RDC = low (read after convert), the current result can be output on SDOUT only when
the conversion is complete.
When SER/
PA R = low, serial data in. When using serial slave mode, (EXT/INT = high), SDIN could be
used as a data input to daisy-chain the conversion results from two or more ADCs onto a single
SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after
the initiation of the read sequence. If not used, connect to OVDD or OGND.
Input/Output Interface Digital Power. Nominally at the same supply as the supply of the
host interface (2.5 V or 3 V).
When SER/
When SER/
PA R = low, this output is used as Bit 8 of the parallel port data output bus.
PA R = high, serial data output. In serial mode, this pin is used as the serial data output
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7622 provides the
conversion result, MSB first, from its internal shift register. The data format is determined by the logic
level of OB/2C.
In master mode, EXT/
In slave mode, EXT/
INT = low, SDOUT is valid on both edges of SCLK.
INT = high:
When INVSCLK = low, SDOUT is updated on SCLK rising edge and valid on the next falling edge.
When INVSCLK = high, SDOUT is updated on SCLK falling edge and valid on the next rising edge.
When SER/
When SER/
data clock input or output, depending upon the logic state of the EXT/
PA R = low, this output is used as Bit 9 of the parallel port data output bus.
PA R = high, serial clock. In all serial modes, this pin is used as the serial
INT pin. The active edge
where the data SDOUT is updated, depends on the logic state of the INVSCLK pin.
When SER/
When SER/
PA R = low, this output is used as Bit 10 of the parallel port data output bus.
PA R = high, frame synchronization. In serial master mode (EXT/INT= low),
this output is used as a digital output frame synchronization for use with the internal data clock.
When a read sequence is initiated and INVSYNC = low, SYNC is driven high and remains high
while SDOUT output is valid.
When a read sequence is initiated and INVSYNC = high, SYNC is driven low and remains low
while SDOUT output is valid.
When SER/
When SER/
PA R = low, this output is used as Bit 11 of the parallel port data output bus.
PA R = high, read error. In serial slave mode (EXT/INT = high), this output
is used as an incomplete read error flag. If a data read is started and not completed when the
current conversion is complete, the current data is lost and RDERROR is pulsed high.
Bit 12 to Bit 15 of the parallel port data output bus. These pins are always outputs, regardless of
the interface mode.
Busy Output. Transitions high when a conversion is started and remains high until the conversion
is complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be
used as a data-ready clock signal.
2
2
Rev. 0 | Page 9 of 28
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