8/6/4 simultaneously sampled inputs
True bipolar analog input ranges: ±10 V, ±5 V
Single 5 V analog supply and 2.3 V to 5 V V
Fully integrated data acquisition solution
Analog input clamp protection
Input buffer with 1 MΩ analog input impedance
Second-order antialiasing analog filter
On-chip accurate reference and reference buffer
16-bit ADC with 200 kSPS on all channels
Oversampling capability with digital filter
Flexible parallel/serial interface
SPI/QSPI™/MICROWIRE™/DSP compatible
Performance
7 kV ESD rating on analog input channels
95.5 dB SNR, −107 dB THD
±0.5 LSB INL, ±0.5 LSB DNL
Low power: 100 mW
Standby mode: 25 mW
64-lead LQFP package
DRIVE
8-/6-/4-Channel DAS with 16-
APPLICATIONS
Power-line monitoring and protection systems
Multiphase motor control
Instrumentation and control systems
Multiaxis positioning systems
Data acquisition systems (DAS)
Table 1. High Resolution, Bipolar Input, Simultaneous
Sampling DAS Solutions
Information furnishe d by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
AD7606/AD7606-6/AD7606-4 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
/SER/BYTE SEL = 1) ............................. 27
REVISION HISTORY
1/12—Rev. B to Rev. C
Changes to Analog Input Ranges Section ................................... 22
10/11—Rev. A to Rev. B
Changes to Input High Voltage (V
(V
) Parameters and Endnote 6, Table 2 ..................................... 4
INL
Changes to Table 3 ............................................................................ 7
Changes to Table 4 .......................................................................... 11
Changes to Pin 32 Description, Table 6 ....................................... 13
Changes to Analog Input Clamp Protection Section ................. 22
Changes to Typical Connection Diagram Section ..................... 25
8/10—Rev. 0 to Rev. A
Changes to Note 1, Table 2 .............................................................. 6
5/10—Revision 0: Initial Versi o n
) and Input Low Voltage
INH
Rev. C | Page 2 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
GENERAL DESCRIPTION
The AD76061/AD7606-6/AD7606-4 are 16-bit, simultaneous
sampling, analog-to-digital data acquisition systems (DAS) with
eight, six, and four channels, respectively. Each part contains
analog input clamp protection, a second-order antialiasing filter,
a track-and-hold amplifier, a 16-bit charge redistribution successive
approximation analog-to-digital converter (ADC), a flexible
digital filter, a 2.5 V reference and reference buffer, and high
speed serial and parallel interfaces.
The AD7606/AD7606-6/AD7606-4 operate from a single 5 V
supply and can accommodate ±10 V and ±5 V true bipolar input
signals while sampling at throughput rates up to 200 kSPS for
all channels. The input clamp protection circuitry can tolerate
voltages up to ±16.5 V. The AD7606 has 1 MΩ analog input
impedance regardless of sampling frequency. The single supply
operation, on-chip filtering, and high input impedance eliminate
the need for driver op amps and external bipolar supplies. The
AD7606/AD7606-6/AD7606-4 antialiasing filter has a 3 dB cutoff
frequency of 22 kHz and provides 40 dB antialias rejection when
sampling at 200 kSPS. The flexible digital filter is pin driven, yields
improvements in SNR, and reduces the 3 dB bandwidth.
1
Patent pending.
Rev. C | Page 3 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
No oversampling; ±5 V range
87
89 dB
t
±10 V Range
11 µs
DC ACCURACY
Bipolar Zero Code Error2, 6
±10 V range
±1
±6
LSB
SPECIFICATIONS
V
= 2.5 V external/internal, AVCC = 4.75 V to 5.25 V, V
REF
Table 2.
Parameter Test Conditions/Comments Min Typ Max Unit
DYNAMIC PERFORMANCE fIN = 1 kHz sine wave unless otherwise noted
Signal-to-Noise Ratio (SNR)
2, 3
Oversampling by 16; ±10 V range; fIN = 130 Hz 94 95.5 dB
Oversampling by 16; ±5 V range; fIN = 130 Hz 93 94.5 dB
No oversampling; ±10 V Range 88.5 90 dB
No oversampling; ±5 V range 87.5 89 dB
Signal-to-(Noise + Distortion) (SINAD)2 No oversampling; ±10 V range 88 90 dB
Dynamic Range No oversampling; ±10 V range 90.5 dB
No oversampling; ±5 V range 90 dB
Total Harmonic Distortion (THD)2 −107 −95 dB
Peak Harmonic or Spurious Noise (SFDR)2 −108 dB
Intermodulation Distortion (IMD)2 fa = 1 kHz, fb = 1.1 kHz
Second-Order Terms −110 dB
Third-Order Terms −106 dB
Channel-to-Channel Isolation2 fIN on unselected channels up to 160 kHz −95 dB
ANALOG INPUT FILTER
Full Power Bandwidth −3 dB, ±10 V range 23 kHz
−3 dB, ±5 V range 15 kHz
−0.1 dB, ±10 V range 10 kHz
−0.1 dB, ±5 V range 5 kHz
GROUP DELAY
±5 V Range 15 µs
= 2.3 V to 5.25 V, f
DRIVE
= 200 kSPS, TA = T
SAMPLE
MIN
to T
, unless otherwise noted.1
MAX
Resolution No missing codes 16 Bits
Differential Nonlinearity2 ±0.5 ±0.99 LSB4
Integral Nonlinearity2 ±0.5 ±2 LSB
Total Unadjusted Error (TUE) ±10 V range ±6 LSB
±5 V range ±12 LSB
Positive Full-Scale Error
2, 5
External reference ±8 ±32 LSB
Internal reference ±8 LSB
Positive Full-Scale Error Drift External reference ±2 ppm/°C
Internal reference ±7 ppm/°C
Positive Full-Scale Error Matching2 ±10 V range 5 32 LSB
±5 V range 16 40 LSB
± 5 V range ±3 ±12 LSB
Bipolar Zero Code Error Drift ±10 V range 10 µV/°C
± 5 V range 5 µV/°C
Bipolar Zero Code Error Matching2 ±10 V range 1 8 LSB
±5 V range 6 22 LSB
Negative Full-Scale Error
2, 5
External reference ±8 ±32 LSB
Internal reference ±8 LSB
Negative Full-Scale Error Drift External reference ±4 ppm/°C
Internal reference ±8 ppm/°C
Negative Full-Scale Error Matching2 ±10 V range 5 32 LSB
±5 V range 16 40 LSB
Rev. C | Page 4 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
5 V; see Figure 31
2.5 µA
AD7606-4
12
17
mA
Parameter Test Conditions/Comments Min Typ Max Unit
ANALOG INPUT
Input Voltage Ranges RANGE = 1 ±10 V
RANGE = 0 ±5 V
Analog Input Current 10 V; see Figure 31 5.4 µA
Input Capacitance7 5 pF
Input Impedance See the Analog Input section 1 MΩ
REFERENCE INPUT/OUTPUT
Reference Input Voltage Range See the ADC Transfer Function section 2.475 2.5 2.525 V
DC Leakage Current ±1 µA
Input Capacitance7 REF SELECT = 1 7.5 pF
Reference Output Voltage REFIN/REFOUT 2.49/
2.505
Reference Temperature Coefficient ±10 ppm/°C
LOGIC INPUTS
Input High Voltage (V
Input Low Voltage (V
) 0.7 × V
INH
) 0.3 × V
INL
V
DRIVE
Input Current (IIN) ±2 µA
Input Capacitance (CIN)7 5 pF
LOGIC OUTPUTS
Output High Voltage (VOH) I
Output Low Voltage (VOL) I
Conversion Time All eight channels included; see Table 3 4 µs
Track-and-Hold Acquisition Time 1 µs
Throughput Rate Per channel, all eight channels included 200 kSPS
POWER REQUIREMENTS
AVCC 4.75 5.25 V
V
2.3 5.25 V
DRIVE
I
Digital inputs = 0 V or V
TOTAL
DRIVE
Normal Mode (Static) AD7606 16 22 mA
AD7606-6 14 20 mA
V
V
DRIVE
Normal Mode (Operational)8 f
= 200 kSPS
SAMPLE
AD7606 20 27 mA
AD7606-6 18 24 mA
AD7606-4 15 21 mA
Standby Mode 5 8 mA
Shutdown Mode 2 6 µA
Rev. C | Page 5 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
AD7606-6
90
126
mW
Parameter Test Conditions/Comments Min Typ Max Unit
Power Dissipation
Normal Mode (Static) AD7606 80 115.5 mW
Normal Mode (Operational)8 f
AD7606 100 142 mW
Temperature range for the B version is −40°C to +85°C. The AD7606 is operational up to 125°C with throughput rates ≤ 160 kSPS, and the SNR typically reduces by
0.7 dB at 125°C.
2
See the Terminology section.
3
This specification applies when reading during a conversion or after a conversion. If reading during a conversion in parallel mode with V
and THD by 3 dB.
4
LSB means least significant bit. With ±5 V input range, 1 LSB = 152.58 µV. With ±10 V input range, 1 LSB = 305.175 µV.
5
These specifications include the full temperature range variation and contribution from the internal reference buffer but do not include the error contribution from
the external reference.
6
Bipolar zero code error is calculated with respect to the analog input voltage. See the Analog Input Clamp Protection section.
7
Sample tested during initial release to ensure compliance.
8
Operational power/current figure includes contribution when running in oversampling mode.
= 200 kSPS
SAMPLE
= 5 V, SNR typically reduces by 1.5 dB
DRIVE
Rev. C | Page 6 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
PARALLEL/SERIAL/BYTE MODE
t
2
Conversion time
16.05
18.8
16.05
18.8
µs
Oversampling by 4; AD7606
t
100
100
µs
t
20
20
ns
BUSY to OS x pin setup time
t4 0 0
ns
21
24
ns
V
above 3.3 V
TIMING SPECIFICATIONS
AVCC = 4.75 V to 5.25 V, V
Table 3.
Parameter Min Typ Max Min Typ Max Unit Description
t
1/throughput rate
CYCLE
5 5 µs Parallel mode, reading during or after conversion; or
9.4 µs Serial mode reading after a conversion; V
9.7 10.7 µs Serial mode reading after a conversion; V
= 2.5 V external reference/internal reference, TA = T
REF
MIN
DRIVE
DRIVE
, T
MAX
and
Limit at T
(0.3 × V
0.7 × V
MIN
DRIVE
DRIVE
, T
MAX
and
Logic Input Levels)
to T
MIN
serial mode: V
DRIVE
conversion using D
D
A and D
OUT
OUT
B lines
, unless otherwise noted.1
MAX
= 3.3 V to 5.25 V, reading during a
A and D
OUT
OUT
B lines
DRIVE
DRIVE
= 2.7 V
= 2.3 V,
33 39 33 39 µs Oversampling by 8; AD7606
66 78 66 78 µs Oversampling by 16; AD7606
133 158 133 158 µs Oversampling by 32; AD7606
257 315 257 315 µs Oversampling by 64; AD7606
STBY
WAKE-UP STAND BY
rising edge to CONVST x rising edge; power-up
time from standby mode
t
WAKE-UP S HUTDOWN
Internal Reference 30 30 ms
STBY
rising edge to CONVST x rising edge; power-up
time from shutdown mode
External Reference 13 13 ms
STBY
rising edge to CONVST x rising edge; power-up
time from shutdown mode
t
50 50 ns RESET high pulse width
RESET
OS_SETUP
t
OS_HOLD
20 20 ns BUSY to OS x pin hold time
t1 40 45 ns CONVST x high to BUSY high
t2 25 25 ns Minimum CONVST x low pulse
t3 25 25 ns Minimum CONVST x high pulse
BUSY falling edge to CS falling edge setup time
3
t
0.5 0.5 ms Maximum delay allowed between CONVST A, CONVST
5
B rising edges
t6 25 25 ns
Maximum time between last
CS
rising edge and BUSY
falling edge
t7 25 25 ns Minimum delay between RESET low to CONVST x high
PARALLEL/BYTE READ
OPERATION
t8 0 0 ns
t9 0 0 ns
t10 16 19 ns V
25 30 ns V
32 37 ns V
t11 15 15 ns
t12 22 22 ns
CS
to RD setup time
CS
to RD hold time
RD
low pulse width
above 4.75 V
DRIVE
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
RD
high pulse width
CS
high pulse width (see Figure 5); CS and RD linked
Rev. C | Page 7 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
25
30
ns
V
above 2.7 V
17
15
MHz
V
above 3.3 V
t18
t
Data access time after SCLK rising edge
FRSTDATA OPERATION
20
23
ns
V
above 3.3 V
20
23
ns
V
above 3.3 V
Limit at T
(0.1 × V
0.9 × V
Logic Input Levels)
MIN
DRIVE
DRIVE
, T
MAX
and
Parameter Min Typ Max Min Typ Max Unit Description
t13 16 19 ns V
20 24 ns V
30 37 ns V
4
t
14
16 19 ns V
21 24 ns V
25 30 ns V
32 37 ns V
t15 6 6 ns
t16 6 6 ns
t17 22 22 ns
SERIAL READ OPERATION
f
Frequency of serial read clock
SCLK
23.5 20 MHz V
14.5 12.5 MHz V
11.5 10 MHz V
15 18 ns V
20 23 ns V
30 35 ns V
4
19
17 20 ns V
23 26 ns V
27 32 ns V
34 39 ns V
t20 0.4 t
t21 0.4 t
0.4 t
SCLK
0.4 t
SCLK
t22 7 7 SCLK rising edge to D
t23 22 22 ns
Limit at T
(0.3 × V
0.7 × V
MIN
DRIVE
DRIVE
, T
MAX
and
Logic Input Levels)
Delay from
above 4.75 V
DRIVE
above 3.3 V
DRIVE
DRIVE
above 2.3 V
DRIVE
Data access time after
above 4.75 V
DRIVE
above 3.3 V
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
Data hold time after
CS
to DB[15:0] hold time
Delay from
enabled
above 4.75 V
DRIVE
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
Delay from CS until D
disabled/delay from
above 4.75 V
DRIVE
above 3.3 V
DRIVE
= 2.3 V to 2.7 V
DRIVE
above 4.75 V
DRIVE
above 3.3 V
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
ns SCLK low pulse width
SCLK
ns SCLK high pulse width
SCLK
CS
rising edge to D
CS
until DB[15:0] three-state disabled
RD
falling edge
RD
falling edge
CS
rising edge to DB[15:0] three-state
A/D
B three-state
OUT
until MSB valid
A/D
B valid hold time
OUT
B three-state enabled
OUT
OUT
OUT
CS
OUT
A/D
t24
15 18 ns V
20 23 ns V
25 30 ns V
30 35 ns V
t25 ns
15 18 ns V
25 30 ns V
30 35 ns V
t26 16 19 ns V
25 30 ns V
30 35 ns V
Rev. C | Page 8 of 36
Delay from
CS
state disabled
above 4.75 V
DRIVE
above 3.3 V
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
Delay from
CS
serial mode
above 4.75 V
DRIVE
DRIVE
above 2.7 V
DRIVE
above 2.3 V
DRIVE
Delay from
DRIVE
DRIVE
DRIVE
DRIVE
RD
above 4.75 V
above 2.7 V
above 2.3 V
falling edge until FRSTDATA three-
falling edge until FRSTDATA high,
falling edge to FRSTDATA high
Data Sheet AD7606/AD7606-6/AD7606-4
t28 Delay from 16th SCLK falling edge to FRSTDATA low
t
CYCLE
t
3
t
5
t
2
t
4
t
1
t
7
t
RESET
t
CONV
CONVST A,
CONVST B
CONVST A,
CONVST B
BUSY
CS
RESET
08479-002
t
CYCLE
t
3
t
5
t
6
t
2
t
1
t
CONV
CONVST A,
CONVST B
CONVST A,
CONVST B
BUSY
CS
t
7
t
RESET
RESET
08479-003
Limit at T
(0.1 × V
0.9 × V
Logic Input Levels)
MIN
DRIVE
DRIVE
, T
MAX
and
Parameter Min Typ Max Min Typ Max Unit Description
t27 19 22 ns V
24 29 ns V
Limit at T
(0.3 × V
0.7 × V
MIN
DRIVE
DRIVE
, T
MAX
and
Logic Input Levels)
Delay from
= 3.3 V to 5.25V
DRIVE
= 2.3 V to 2.7V
DRIVE
RD
falling edge to FRSTDATA low
17 20 ns V
22 27 ns V
t29 24 29 ns
= 3.3 V to 5.25V
DRIVE
= 2.3 V to 2.7V
DRIVE
Delay from
CS
rising edge until FRSTDATA three-
state enabled
1
Sample tested during initial release to ensure compliance. All input signals are specified with tR = tF = 5 ns (10% to 90% of V
2
In oversampling mode, typical t
t
= 3 µs; and for the AD7606-4, t
CONV
3
The delay between the CONVST x signals was measured as the maximum time allowed while ensuring a <10 LSB performance matching between channel sets.
4
A buffer is used on the data output pins for these measurements, which is equivalent to a load of 20 pF on the output pins.
for the AD7606-6 and AD7606-4 can be calculated using ((N × t
CONV
= 2 µs.
CONV
) + ((N − 1) × 1 µs)). N is the oversampling ratio. For the AD7606-6,
CONV
) and timed from a voltage level of 1.6 V.
DRIVE
Timing Diagrams
Figure 2. CONVST Timing—Reading After a Conversion
Figure 3. CONVST Timing—Reading During a Conversion
Rev. C | Page 9 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
CS
t
9
t
16
t
17
t
29
08479-004
t
16
t
17
RD
DATA:
DB[15:0]
FRSTDATA
t
8
t
10
t
13
INVALIDV1V2V3V7V8V4
t
26
t
24
t
11
t
14
t
27
Figure 4. Parallel Mode, Separate
CS
and RD Pulses
t
15
t
12
CS AND RD
t
13
DATA:
DB[15:0]
V1V2V3V4V5V6V7V8
FRSTDATA
Figure 5.
CS
and RD, Linked Parallel Mode
8479-005
CS
t21t
SCLK
D
OUT
D
OUT
FRSTDATA
t
t
A,
B
18
19
DB15DB14DB13DB1DB0
t
25
20
t
22
t
28
t
23
t
29
08479-006
Figure 6. Serial Read Operation (Channel 1)
RD
DATA: DB[7:0]
FRSTDATA
CS
t
t
t
8
t
10
13
INVALID
24
HIGH
BYTE V1
t
26
t
14
LOW
BYTE V1
t
27
t
15
HIGH
BYTE V8
t
11
LOW
BYTE V8
t
29
t
9
t
16
t
17
08479-007
Figure 7. BYTE Mode Read Operation
Rev. C | Page 10 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
Input Current to Any Pin Except Supplies1
±10 mA
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
AVCC to AGND −0.3 V to +7 V
V
to AGND −0.3 V to AVCC + 0.3 V
DRIVE
Analog Input Voltage to AGND1 ±16.5 V
Digital Input Voltage to AGND −0.3 V to V
Digital Output Voltage to AGND −0.3 V to V
REFIN to AGND −0.3 V to AVCC + 0.3 V
Operating Temperature Range
B Version −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Pb/SN Temperature, Soldering
Transient currents of up to 100 mA do not cause SCR latch-up.
DRIVE
DRIVE
+ 0.3 V
+ 0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type θJA θJC Unit
64-Lead LQFP 45 11 °C/W
ESD CAUTION
Rev. C | Page 11 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
AD7606
TOP VIEW
(Not to S cale)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V5
V4V6V3
V2
V1
PIN 1
V7
V8
V2GND
V3GND
V4GND
V5GND
V6GND
V7GND
V8GND
DB13
DB12
DB11
DB14/HBEN
V
DRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/D
OUT
A
DB9
DB10
DB8/D
OUT
B
AGND
AV
CC
1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVST B
CONVST A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUPLI NG CAP PIN
DATA OUTPUT
POWER SUPPLY
ANALOG I NP UT
GROUND PIN
DIGITAL OUTPUT
DIGITAL INPUT
REFERENCE I NP UT/OUTPUT
DB15/BYTE SE L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AV
CC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AV
CC
AV
CC
REF SELECT
08479-008
AD7606-6
TOP VIEW
(Not to S cale)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V4
AGNDV5V3
V2
V1
PIN 1
V6
AGND
V2GND
V3GND
AGND
V4GND
V5GND
V6GND
AGND
DB13
DB12
DB11
DB14/HBEN
V
DRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/D
OUT
A
DB9
DB10
DB8/D
OUT
B
AGND
AV
CC
1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVST B
CONVST A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUPLI NG CAP PIN
DATA OUTPUT
POWER SUPPLY
ANALOG I NP UT
GROUND PIN
DIGITAL OUTPUT
DIGITAL INPUT
REFERENCE I NP UT/OUTPUT
DB15/BYTE SE L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AV
CC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AV
CC
AV
CC
REF SELECT
08479-009
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 8. AD7606 Pin Configuration
Figure 9. AD7606-6 Pin Configuration
Rev. C | Page 12 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
AD7606-4
TOP VIEW
(Not to S cale)
64 63 62 61 60 59 58 57
V1GND
56 55 54 53 52 51 50 49
V3
AGNDV4AGND
V2
V1
PIN 1
AGND
AGND
V2GND
AGND
AGND
V3GND
V4GND
AGND
AGND
DB13
DB12
DB11
DB14/HBEN
V
DRIVE
DB1
17 18 19 20 21 22 23 24 25
AGND
26 27 28 29 30 31 32
DB2
DB3
DB4
DB5
DB6
DB7/D
OUT
A
DB9
DB10
DB8/D
OUT
B
AGND
AV
CC
1
3
4
FRSTDATA
7
6
5
OS 2
2
8
9
10
12
13
14
15
16
11
DB0
BUSY
CONVST B
CONVST A
RANGE
RESET
RD/SCLK
CS
PAR/SER/BYTE SEL
OS 1
OS 0
STBY
DECOUPLI NG CAP PIN
DATA OUTPUT
POWER SUPPLY
ANALOG I NP UT
GROUND PIN
DIGITAL OUTPUT
DIGITAL INPUT
REFERENCE I NP UT/OUTPUT
DB15/BYTE SE L
REFIN/REFOUT
48
46
45
42
43
44
47
41
40
39
37
36
35
34
33
38
AGND
AV
CC
REFGND
REFCAPA
AGND
AGND
AGND
REFCAPB
REFGND
REGCAP
REGCAP
AV
CC
AV
CC
REF SELECT
08479-010
Mnemonic
Table 6. Pin Function Descriptions
Pin No. Typ e1
1, 37, 38,
48
2, 26, 35,
40, 41, 47
5, 4, 3 DI OS [2:0] OS [2:0] OS [2:0] Oversampling Mode Pins. Logic inputs. These inputs are used to select the
6 DI
7 DI
Figure 10. AD7606-4 Pin Configuration
Description AD7606 AD7606-6 AD7606-4
P AVCC AVCC AVCC Analog Supply Voltage, 4.75 V to 5.25 V. This supply voltage is applied to
the internal front-end amplifiers and to the ADC core. These supply pins
should be decoupled to AGND.
P AGND AGND AGND Analog Ground. These pins are the ground reference points for all analog
circuitry on the AD7606. All analog input signals and external reference
signals should be referred to these pins. All six of these AGND pins should
connect to the AGND plane of a system.
oversampling ratio. OS 2 is the MSB control bit, and OS 0 is the LSB control
bit. See the Digital Filter section for more details about the oversampling
mode of operation and Table 9 for oversampling bit decoding.
/SER/
PAR
BYTE SEL
/SER/
PAR
BYTE SEL
/SER/
PAR
BYTE SEL
Parallel/Serial/Byte Interface Selection Input. Logic input. If this pin is tied to
a logic low, the parallel interface is selected. If this pin is tied to a logic high,
the serial interface is selected. Parallel byte interface mode is selected when
this pin is logic high and DB15/BYTE SEL is logic high (see Table 8).
In serial mode, the RD/SCLK pin functions as the serial clock input. The
STBY
STBY
Standby Mode Input. This pin is used to place the AD7606/AD7606-6/
STBY
Rev. C | Page 13 of 36
DB7/D
A pin and the DB8/D
OUT
the serial interface is selected, the DB[15:9] and DB[6:0] pins should be tied to
ground.
In byte mode, DB15, in conjunction with
the parallel byte mode of operation (see Table 8). DB14 is used as the HBEN
pin. DB[7:0] transfer the 16-bit conversion results in two
with DB0 as the LSB of the data transfers.
AD7606-4 into one of two power-down modes: standby mode or shutdown
mode. The power-down mode entered depends on the state of the RANGE
pin, as shown in Table 7. When in standby mode, all circuitry, except the onchip reference, regulators, and regulator buffers, is powered down. When
in shutdown mode, all circuitry is powered down.
B pin function as serial data outputs. When
OUT
/SER/BYTE SEL, is used to select
PAR
operations,
RD
AD7606/AD7606-6/AD7606-4 Data Sheet
Mnemonic
Pin No. Typ e1
8 DI RANGE RANGE RANGE Analog Input Range Selection. Logic input. The polarity on this pin deter-
9, 10 DI CONVST A,
CONVST B
CONVST A,
CONVST B
CONVST A,
CONVST B
11 DI RESET RESET RESET Reset Input. When set to logic high, the rising edge of RESET resets the
12 DI
13 DI
RD
CS
/SCLK
RD
CS
/SCLK
/SCLK Parallel Data Read Control Input When the Parallel Interface Is Selected (RD)/
RD
Chip Select. This active low logic input frames the data transfer. When
CS
14 DO BUSY BUSY BUSY Busy Output. This pin transitions to a logic high after both CONVST A and
15 DO FRSTDATA F RSTDATA FRSTDATA Digital Output. The FRSTDATA output signal indicates when the first channel,
Description AD7606 AD7606-6 AD7606-4
mines the input range of the analog input channels. If this pin is tied to a
logic high, the analog input range is ±10 V for all channels. If this pin is tied to
a logic low, the analog input range is ±5 V for all channels. A logic change
on this pin has an immediate effect on the analog input range. Changing
this pin during a conversion is not recommended for fast throughput rate
applications. See the Analog Input section for more information.
Conversion Start Input A, Conversion Start Input B. Logic inputs. These
logic inputs are used to initiate conversions on the analog input channels.
For simultaneous sampling of all input channels, CONVST A and CONVST B
can be shorted together, and a single convert start signal can be applied.
Alternatively, CONVST A can be used to initiate simultaneous sampling: V1,
V2, V3, and V4 for the AD7606; V1, V2, and V3 for the AD7606-6; and V1
and V2 for the AD7606-4. CONVST B can be used to initiate simultaneous
sampling on the other analog inputs: V5, V6, V7, and V8 for the AD7606;
V4, V5, and V6 for the AD7606-6; and V3 and V4 for the AD7606-4. This is
possible only when oversampling is not switched on. When the CONVST A or
CONVST B pin transitions from low to high, the front-end track-and-hold
circuitry for the respective analog inputs is set to hold.
AD7606/AD7606-6/AD7606-4. The part should receive a RESET pulse after
power-up. The RESET high pulse should typically be 50 ns wide. If a RESET
pulse is applied during a conversion, the conversion is aborted. If a RESET
pulse is applied during a read, the contents of the output registers reset
to all zeros.
Serial Clock Input When the Serial Interface Is Selected (SCLK). When both
and RD are logic low in parallel mode, the output bus is enabled.
CS
In serial mode, this pin acts as the serial clock input for data transfers.
The
falling edge takes the D
CS
A and D
OUT
B data output lines out
OUT
of three-state and clocks out the MSB of the conversion result. The rising
edge of SCLK clocks all subsequent data bits onto the D
serial data outputs. For more information, see the
Conversion Control
A and D
OUT
OUT
B
section.
both
and RD are logic low in parallel mode, the DB[15:0] output bus is
CS
enabled and the conversion result is output on the parallel data bus lines.
In serial mode, CS is used to frame the serial read transfer and clock out
the MSB of the serial output data.
CONVST B rising edges and indicates that the conversion process has started.
The BUSY output remains high until the conversion process for all channels
is complete. The falling edge of BUSY signals that the conversion data is
being latched into the output data registers and is available to read after
a Time t
. Any data read while BUSY is high must be completed before the
4
falling edge of BUSY occurs. Rising edges on CONVST A or CONVST B have
no effect while the BUSY signal is high.
V1, is being read back on the parallel, byte, or serial interface. When the
input is high, the FRSTDATA output pin is in three-state. The falling
CS
edge of CS takes FRSTDATA out of three-state. In parallel mode, the falling
edge of
corresponding to the result of V1 then sets the FRSTDATA pin
RD
high, indicating that the result from V1 is available on the output data bus.
The FRSTDATA output returns to a logic low following the next falling edge
. In serial mode, FRSTDATA goes high on the falling edge of CS because
of
RD
this clocks out the MSB of V1 on D
falling edge after the
falling edge. See the Conversion Control section
CS
A. It returns low on the 16th SCLK
OUT
for more details.
Rev. C | Page 14 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
31 to 27
DO
DB[13:9]
DB[13:9]
DB[13:9]
Parallel Output Data Bits, DB13 to DB9. When
/SER/BYTE SEL = 0, these
34
DI
REF SELECT
REF SELECT
REF SELECT
Internal/External Reference Selection Input. Logic input. If this pin is set to
Mnemonic
Pin No. Typ e1
22 to 16 DO DB[6:0] DB[6:0] DB[6:0] Parallel Output Data Bits, DB6 to DB0. When
23 P V
24 DO DB7/D
25 DO DB8/D
32 DO/DI DB14/
33 DO/DI DB15/
V
DRIVE
OUT
OUT
HBEN
BYTE SEL
DRIVE
A DB7/D
B DB8/D
DB14/
HBEN
DB15/
BYTE SEL
V
A DB7/D
OUT
B DB8/D
OUT
Logic Power Supply Input. The voltage (2.3 V to 5.25 V) supplied at this pin
DRIVE
OUT
OUT
DB14/
HBEN
DB15/
BYTE SEL
Description AD7606 AD7606-6 AD7606-4
/SER/BYTE SEL = 0, these
PAR
pins act as three-state parallel digital input/output pins. When CS and RD
are low, these pins are used to output DB6 to DB0 of the conversion result.
When
/SER/BYTE SEL = 1, these pins should be tied to AGND. When
PAR
operating in parallel byte interface mode, DB[7:0] outputs the 16-bit conversion result in two
operations. DB7 (Pin 24) is the MSB; DB0 is the LSB.
RD
determines the operating voltage of the interface. This pin is nominally at the
same supply as the supply of the host interface (that is, DSP and FPGA).
A Parallel Output Data Bit 7 (DB7)/Serial Interface Data Output Pin (D
When
/SER/BYTE SEL = 0, this pins acts as a three-state parallel digital
PAR
input/output pin. When CS and RD are low, this pin is used to output DB7
of the conversion result. When
as D
A and outputs serial conversion data (see the Conversion Control
OUT
/SER/BYTE SEL = 1, this pin functions
PAR
section for more details). When operating in parallel byte mode, DB7 is
the MSB of the byte.
B Parallel Output Data Bit 8 (DB8)/Serial Interface Data Output Pin (D
When
/SER/BYTE SEL = 0, this pin acts as a three-state parallel digital
PAR
input/output pin. When CS and RD are low, this pin is used to output
DB8 of the conversion result. When
B and outputs serial conversion data (see the Conversion Control
as D
OUT
/SER/BYTE SEL = 1, this pin functions
PAR
section for more details).
PAR
pins act as three-state parallel digital input/output pins. When CS and RD
are low, these pins are used to output DB13 to DB9 of the conversion result.
When
/SER/BYTE SEL = 1, these pins should be tied to AGND.
PAR
Parallel Output Data Bit 14 (DB14)/High Byte Enable (HBEN). When
SER/BYTE SEL = 0, this pin acts as a three-state parallel digital output pin.
When
result. When
and RD are low, this pin is used to output DB14 of the conversion
CS
/SER/BYTE SEL = 1 and DB15/BYTE SEL = 1, the AD7606/
PAR
AD7606-6/AD7606-4 operate in parallel byte interface mode. In parallel
byte mode, the HBEN pin is used to select whether the most significant byte
(MSB) or the least significant byte (LSB) of the conversion result is output first.
When HBEN = 1, the MSB is output first, followed by the LSB.
When HBEN = 0, the LSB is output first, followed by the MSB.
In serial mode, this pin should be tied to GND.
Parallel Output Data Bit 15 (DB15)/Parallel Byte Mode Select (BYTE SEL).
When
/SER/BYTE SEL = 0, this pin acts as a three-state parallel digital
PAR
output pin. When CS and RD are low, this pin is used to output DB15 of the
conversion result. When
/SER/BYTE SEL = 1, the BYTE SEL pin is used to
PAR
select between serial interface mode and parallel byte interface mode
Table 8). When
(see
AD7606 operates in serial interface mode. When
/SER/BYTE SEL = 1 and DB15/BYTE SEL = 0, the
PAR
/SER/BYTE SEL = 1
PAR
and DB15/BYTE SEL = 1, the AD7606 operates in parallel byte interface mode.
OUT
OUT
PAR
A).
B).
/
36, 39 P REGCAP REGCAP REGCAP Decoupling Capacitor Pin for Voltage Output from Internal Regulator.
logic high, the internal reference is selected and enabled. If this pin is set to
logic low, the internal reference is disabled and an external reference
voltage must be applied to the REFIN/REFOUT pin.
These output pins should be decoupled separately to AGND using a 1 μF
capacitor. The voltage on these pins is in the range of 2.5 V to 2.7 V.
Rev. C | Page 15 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
GND
61
AI/GND
V7
V6
AGND
Analog Input Pins. For the AD7606-4, this is an AGND pin.
Mnemonic
Pin No. Typ e1
42 REF REFIN/
REFOUT
REFIN/
REFOUT
REFIN/
REFOUT
43, 46 REF REFGND REFGND REFGND Reference Ground Pins. These pins should be connected to AGND.
44, 45 REF REFCAPA,
REFCAPB
REFCAPA,
REFCAPB
REFCAPA,
REFCAPB
49 AI V1 V1 V1 Analog Input. This pin is a single-ended analog input. The analog input
50, 52 AI GND V1GND,
V2GND
V1GND,
V2GND
V1GND,
V2GND
51 AI V2 V2 V2 Analog Input. This pin is a single-ended analog input. The analog input
53 AI/GND V3 V3 AGND Analog Input 3. For the AD7606-4, this is an AGND pin.
54 AI GND/
V3GND V3GND AGND Analog Input Ground Pin. For the AD7606-4, this is an AGND pin.
Description AD7606 AD7606-6 AD7606-4
Reference Input (REFIN)/Reference Output (REFOUT). The on-chip reference
of 2.5 V is available on this pin for external use if the REF SELECT pin is set to
logic high. Alternatively, the internal reference can be disabled by setting
the REF SELECT pin to
logic low, and an external reference of 2.5 V can be
applied to this input (see the Internal/External Reference section).
Decoupling is required on this pin for both the internal and external
reference options. A 10 μF capacitor should be applied from this pin to
ground close to the REFGND pins.
Reference Buffer Output Force/Sense Pins. These pins must be connected
together and decoupled to AGND using a low ESR, 10 μF ceramic capacitor.
The voltage on these pins is typically 4.5 V.
range of this channel is determined by the RANGE pin.
Analog Input Ground Pins. These pins correspond to Analog Input Pin V1
and Analog Input Pin V2. All analog input AGND pins should connect to
the AGND plane of a system.
range of this channel is determined by the RANGE pin.
55 AI/GND V4 AGND AGND Analog Input 4. For the AD7606-6 and the AD7606-4, this is an AGND pin.
56 AI GND/
GND
V4GND AGND AGND Analog Input Ground Pin. For the AD7606-6 and AD7606-4, this is an
AGND pin.
57 AI V5 V4 V3 Analog Inputs. These pins are single-ended analog inputs. The analog
input range of these channels is determined by the RANGE pin.
58 AI GND V5GND V4GND V3GND Analog Input Ground Pins. All analog input AGND pins should connect to
the AGND plane of a system.
59 AI V6 V5 V4 Analog Inputs. These pins are single-ended analog inputs.
60 AI GND V6GND V5GND V4GND Analog Input Ground Pins. All analog input AGND pins should connect to
the AGND plane of a system.
62 AI GND/
V7GND V6GND AGND Analog Input Ground Pins. For the AD7606-4, this is an AGND pin.
GND
63 AI/GND V8 AGND AGND Analog Input Pin. For the AD7606-4 and AD7606-6, this is an AGND pin.
64 AI GND/
GND
1
P is power supply, DI is digital input, DO is digital output, REF is reference input/output, AI is analog input, GND is ground.
V8GND AGND AGND Analog Input Ground Pin. For the AD7606-4 and AD7606-6, this is an
AGND pin.
Rev. C | Page 16 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
TYPICAL PERFORMANCE CHARACTERISTICS
0
–20
–40
–60
–80
–100
AMPLI TUDE (d B )
–120
–140
–160
–180
0100k90k80k70k60k50k40k30k20k10k
INPUT FREQ UE NCY ( Hz )
AVCC, V
INTERNAL REF E RE NCE
±10V RANGE
F
SAMPLE
F
IN
16,384 POI NT FFT
SNR = 90.17dB
THD = –106.25dB
= 1kHz
= 5V
DRIVE
= 200kSPS
08479-011
Figure 11. AD7606 FFT, ±10 V Range
INL (LSB)
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
060k50k40k30k20k10k
CODE
Figure 14. AD7606 Typical INL, ±10 V Range
AVCC, V
F
SAMPLE
T
= 25°C
A
INTERNAL REF E RE NCE
±10V RANGE
= 5V
DRIVE
= 200kSPS
08479-013
0
–20
–40
–60
–80
–100
AMPLI TUDE (d B )
–120
–140
–160
–180
0100k90k80k70k60k50k40k30k20k10k
INPUT FREQ UE NCY ( Hz )
AVCC, V
INTERNAL REF E RE NCE
±5V RANGE
F
SAMPLE
F
= 1kHz
IN
16,384 POI NT FFT
SNR = 89.48dB
THD = –108.65dB
Figure 12. AD7606 FFT Plot, ±5 V Range
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
AMPLI TUDE (d B )
–120
–130
–140
–150
–160
–170
–180
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
FREQUENCY (kHz)
AVCC, V
INTERNAL REF E RE NCE
±10V RANGE
F
SAMPLE
T
= 25°C
A
F
= 133Hz
IN
8192 POINT FFT
OS BY 16
SNR = 96.01dB
THD = –108.05dB
Figure 13. FFT Plot Oversampling By 16, ±10 V Range
= 5V
DRIVE
= 200kSPS
= 5V
DRIVE
= 11.5kSPS
1.0
0.8
0.6
0.4
0.2
0
DNL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
060k50k40k30k20k10k
08479-012
AVCC, V
F
SAMPLE
T
= 25°C
A
INTERNAL REF E RE NCE
±10V RANGE
CODE
= 5V
DRIVE
= 200kSPS
08479-014
Figure 15. AD7606 Typical DNL, ±10 V Range
2.0
1.5
1.0
0.5
0
INL (LSB)
–0.5
–1.0
–1.5
–2.0
065,53657,34449,15240,96032,76824,57616,3848192
08479-031
Figure 16. AD7606 Typical INL, ±5 V Range
AVCC, V
INTERNAL REF E RE NCE
±5V RANGE
F
SAMPLE
T
A
CODE
= 25°C
= 5V
DRIVE
= 200kSPS
08479-015
Rev. C | Page 17 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
DNL (LSB)
–0.25
–0.50
–0.75
–1.00
1.00
0.75
0.50
0.25
0
AVCC, V
INTERNAL REFERENCE
±5V RANGE
F
T
065,53657,34449,15240,96032,76824,57616,3848192
CODE
Figure 17. AD7606 Typical DNL, ±5 V Range
SAMPLE
= 25°C
A
= 5V
DRIVE
= 200kSPS
08479-016
10
8
PFS ERROR
6
4
NFS ERROR
2
0
–2
–4
–6
NFS/PFS CHANNEL MATCHING ( LSB)
–9
–10
–40–25–1052035506580
TEMPERATURE (°C)
10V RANGE
AV
, V
CC
DRIVE
EXTERNAL REF ERENCE
Figure 20. NFS and PFS Error Matching
= 5V
08479-018
20
15
10
5
0
–5
NFS ERROR (LS B)
–10
–15
–20
–40–25–1052035506580
TEMPERATURE (°C)
±10V RANGE
200kSPS
AV
, V
CC
DRIVE
EXTERNAL REFERENCE
Figure 18. NFS Error vs. Temperature
20
15
10
5
0
–5
PFS ERROR (LSB)
–10
–15
–20
–40–25–1052035506580
TEMPERATURE (°C)
±10V RANGE
200kSPS
AV
, V
CC
DRIVE
EXTERNAL REFERENCE
Figure 19. PFS Error vs. Temperature
±5V RANGE
= 5V
±5V RANGE
= 5V
10
8
6
4
2
PFS/NFS ERROR (%FS)
0
–2
0120k100k80k60k40k20k
08479-017
AVCC, V
F
SAMPLE
T
= 25°C
A
EXTERNAL REF ERENCE
SOURCE RESIST ANCE IS MATCHED O N
THE VxGND INPUT
±10V AND ±5V RANGE
SOURCE RESIST ANCE (Ω)
= 5V
DRIVE
= 200 kSPS
08479-019
Figure 21. PFS and NFS Error vs. Source Resistance
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
BIPOLAR ZERO CODE ERROR (L SB)
–0.8
–1.0
–40–25–1052035506580
08479-118
5V RANGE
10V RANGE
200kSPS
AV
EXTERNAL REF ERENCE
TEMPERATURE (°C)
, V
= 5V
CC
DRIVE
08479-023
Figure 22. Bipolar Zero Code Error vs. Temperature
Rev. C | Page 18 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
4
3
2
1
0
–1
–2
–3
–40–25–1052035506580
–4
BIPOLAR ZERO CODE ERROR MATCHING ( LSB)
TEMPERATURE (°C)
08479-024
200kSPS
AV
CC
, V
DRIVE
= 5V
EXTERNAL RE FERENCE
5V RANGE
10V RANGE
–40
–50
–60
–70
–80
–90
–100
–110
1k100k10k
–120
THD (dB)
INPUT FRE QUENCY (Hz)
08479-021
±10V RANGE
AV
CC
, V
DRIVE
= +5V
F
SAMPLE
= 200kSPS
R
SOURCE
MATCHED ON Vx AND V xGND INPUTS
105kΩ
48.7kΩ
23.7kΩ
10kΩ
5kΩ
1.2kΩ
100Ω
51Ω
0Ω
1k100k10k
THD (dB)
INPUT FRE QUENCY (Hz)
08479-122
±5V RANGE
AV
CC
, V
DRIVE
= +5V
F
SAMPLE
= 200kSPS
R
SOURCE
MATCHED ON Vx AND V xGND INPUTS
105kΩ
48.7kΩ
23.7kΩ
10kΩ
5kΩ
1.2kΩ
100Ω
51Ω
0Ω
–40
–50
–60
–70
–80
–90
–100
–110
–120
98
96
94
92
90
88
86
84
82
10100k10k1k100
80
SNR (dB)
INPUT FRE QUENCY (Hz)
08479-020
NO OS
OS BY 2
OS BY 4
OS BY 8
OS BY 16
OS BY 32
OS BY 64
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
CHANGES WI TH OS RATE
T
A
= 25°C
INTERNAL RE FERENCE
±5V RANGE
100
98
96
94
92
90
88
86
84
82
10100k10k1k100
80
SNR (dB)
INPUT FRE QUENCY (Hz)
08479-121
NO OS
OS BY 2
OS BY 4
OS BY 8
OS BY 16
OS BY 32
OS BY 64
AVCC, V
DRIVE
= 5V
F
SAMPLE
CHANGES WI TH OS RATE
T
A
= 25°C
INTERNAL RE FERENCE
±10V RANGE
–50
–60
–70
–80
–90
–100
–110
–120
–130
016014012010080604020
–140
CHANNEL-TO - CHANNE L ISOLATION (dB)
NOISE F RE QUENCY (kHz)
08479-025
±10V RANGE
±5V RANGE
AV
CC
, V
DRIVE
= 5V
INTERNAL RE FERENCE
AD7606 RECOMMENDED DE COUPLING US E D
F
SAMPLE
= 150kSPS
T
A
= 25°C
INTERFE RE R ON ALL UNSEL E CTED CHANNELS
Figure 23. Bipolar Zero Code Error Matching Between Channels
Figure 24. THD vs. Input Frequency for Various Source Impedances,
±10 V Range
Figure 26. SNR vs. Input Frequency fo r Different Oversa mpling Rates, ±5 V Range
Figure 27. SNR vs. Input Frequency fo r Different Oversa mpling Rates, ±10 V Range
Figure 25. THD vs. Input Frequency for Various Source Impedances,
±5 V Range
Figure 28. Channel-to-Channel Isolation
Rev. C | Page 19 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
100
98
96
94
92
90
88
84
86
82
80
DYNAMIC RANGE ( dB)
OVERSAMPLING RATIO
08479-026
±10V RANGE
±5V RANGE
AV
CC
, V
DRIVE
= 5V
T
A
= 25°C
INTERNAL RE FERENCE
F
SAMPLE
SCALES WITH OS RATIO
OFFOS2OS4OS8OS16OS32OS64
2.5010
2.5005
2.5000
2.4995
2.4990
2.4985
–40–25–1052035506580
2.4980
REFOUT VOLTAGE (V)
TEMPERATURE (°C)
08479-029
AVCC = 4.75V
AV
CC
= 5V
AV
CC
= 5.25V
8
–10 –8–6–4–21086420
–10
–8
–6
–4
–2
0
2
4
6
INPUT CURRENT ( µ A)
INPUT VOLTAGE (V)
08479-028
–40°C
+25°C
+85°C
AV
CC
, V
DRIVE
= 5V
F
SAMPLE
= 200kSPS
22
20
18
16
14
12
10
8
AV
CC
SUPPLY CURRENT (mA)
OVERSAMPLING RATIO
08479-027
AV
CC
, V
DRIVE
= 5V
T
A
= 25°C
INTERNAL RE FERENCE
F
SAMPLE
VARIES WITH OS RATE
NO OSOS2OS4OS8OS16OS32OS64
140
011001000900800700600500400300200100
60
70
80
90
100
110
120
130
POWER SUP P LY REJECTION RATIO (dB)
AVCC NOISE F RE QUENCY (kHz)
08479-030
AVCC, V
DRIVE
= 5V
INTERNAL RE FERENCE
AD7606 RECOMMENDED DE COUPLING US E D
F
SAMPLE
= 200kSPS
T
A
= 25°C
±10V RANGE
±5V RANGE
Figure 29. Dynamic Range vs. Oversampling Rate
Figure 30. Reference Output Voltage vs. Temperature for
Different Supply Voltages
Figure 32. Supply Current vs. Oversampling Rate
Figure 33. PSRR
Figure 31. Analog Input Current vs. Temperature for Various Supply Voltages
Rev. C | Page 20 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
TERMINOLOGY
Integral Nonlinearity
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. The endpoints of
the transfer function are zero scale, at ½ LSB below the first
code transition; and full scale, at ½ LSB above the last code
transition.
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Bipolar Zero Code Error
The deviation of the midscale transition (all 1s to all 0s) from
the ideal, which is 0 V − ½ LSB.
Bipolar Zero Code Error Match
The absolute difference in bipolar zero code error between any
two input channels.
Positive Full-Scale Error
The deviation of the actual last code transition from the ideal
last code transition (10 V − 1½ LSB (9.99954) and 5 V − 1½ LSB
(4.99977)) after bipolar zero code error is adjusted out. The
positive full-scale error includes the contribution from the
internal reference buffer.
Positive Full-Scale Error Match
The absolute difference in positive full-scale error between any
two input channels.
Negative Full-Scale Error
The deviation of the first code transition from the ideal first
code transition (−10 V + ½ LSB (−9.99984) and −5 V + ½ LSB
(−4.99992)) after the bipolar zero code error is adjusted out.
The negative full-scale error includes the contribution from the
internal reference buffer.
Negative Full-Scale Error Match
The absolute difference in negative full-scale error between any
two input channels.
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal-to-(noise + distortion) at the
output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the sum of all nonfundamental signals
up to half the sampling frequency (f
/2, excluding dc).
S
The ratio depends on the number of quantization levels in
the digitization process: the more levels, the smaller the
quantization noise.
The theoretical signal-to-(noise + distortion) ratio for an ideal
N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB
Thus, for a 16-bit converter, the signal-to-(noise + distortion)
is 98 dB.
Rev. C | Page 21 of 36
Total Harmonic Distortion (THD)
The ratio of the rms sum of the harmonics to the fundamental.
For the AD7606/AD7606-6/AD7606-4, it is defined as
THD (dB) =
2
2
2
20log
22222
32
54
V
1
7
6
VVVVVVVV
9
8
where:
V
is the rms amplitude of the fundamental.
1
to V9 are the rms amplitudes of the second through ninth
V
2
harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to f
/2, excluding dc) to the rms value
S
of the fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is
determined by a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb, where m, n = 0,
1, 2, 3. Intermodulation distortion terms are those for which
neither m nor n is equal to 0. For example, the second-order
terms include (fa + fb) and (fa − ), and the third-order terms
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2).
The calculation of the intermodulation distortion is per the
THD specification, where it is the ratio of the rms sum of the
individual distortion products to the rms amplitude of the sum
of the fundamentals expressed in decibels (dB).
Power Supply Rejection Ratio (PSRR)
Variations in power supply affect the full-scale transition but not
the converter’s linearity. PSR is the maximum change in fullscale transition point due to a change in power supply voltage
from the nominal value. The PSR ratio (PSRR) is defined as the
ratio of the power in the ADC output at full-scale frequency, f,
to the power of a 100 mV p-p sine wave applied to the ADC’s
V
and VSS supplies of Frequency fS.
DD
PSRR (dB) = 10 log (Pf/Pf
)
S
where:
Pf is equal to the power at Frequency f in the ADC output.
Pf
is equal to the power at FrequencyfS coupled onto the AVCC
S
supply.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of crosstalk
between all input channels. It is measured by applying a full-scale
sine wave signal, up to 160 kHz, to all unselected input channels
and then determining the degree to which the signal attenuates
in the selected channel with a 1 kHz sine wave signal applied (see
Figure 28).
AD7606/AD7606-6/AD7606-4 Data Sheet
1MΩ
CLAMPVx
1MΩ
CLAMPVxGND
SECOND-
ORDER
LPF
R
FB
R
FB
08479-032
30
–50
–40
–30
–20
–10
0
10
20
–20–15–10–505101520
INPUT CLAM P CURRE NT (mA)
SOURCE VOLTAGE (V)
08479-033
AV
CC
, V
DRIVE
= 5V
T
A
= 25°C
THEORY OF OPERATION
CONVERTER DETAILS
The AD7606/AD7606-6/AD7606-4 are data acquisition systems
that employ a high speed, low power, charge redistribution,
successive approximation analog-to-digital converter (ADC)
and allow the simultaneous sampling of eight/six/four analog input
channels. The analog inputs on the AD7606/AD7606-6/AD7606-4
can accept true bipolar input signals. The RANGE pin is used to
select either ±10 V or ±5 V as the input range. The AD7606/
AD7606-6/AD7606-4 operate from a single 5 V supply.
The AD7606/AD7606-6/AD7606-4 contain input clamp
protection, input signal scaling amplifiers, a second-order antialiasing filter, track-and-hold amplifiers, an on-chip reference,
reference buffers, a high speed ADC, a digital filter, and high
speed parallel and serial interfaces. Sampling on the AD7606/
AD7606-6/AD7606-4 is controlled using the CONVST signals.
ANALOG INPUT
Analog Input Ranges
The AD7606/AD7606-6/AD7606-4 can handle true bipolar,
single-ended input voltages. The logic level on the RANGE pin
determines the analog input range of all analog input channels.
If this pin is tied to a logic high, the analog input range is ±10 V
for all channels. If this pin is tied to a logic low, the analog input
range is ±5 V for all channels. A logic change on this pin has an
immediate effect on the analog input range; however, there is
typically a settling time of approximately 80 µs, in addition to
the normal acquisition time requirement. The recommended
practice is to hardwire the RANGE pin according to the desired
input range for the system signals.
During normal operation, the applied analog input voltage
should remain within the analog input range selected via the
RANGE pin. A RESET pulse must be applied after power up to
ensure the analog input channels are configured for the range
selected.
When in a power-down mode, it is recommended to tie the
analog inputs to GND. Per the Analog Input Clamp Protection
section, the overvoltage clamp protection is recommended for
use in transient overvoltage conditions and should not remain
active for extended periods. Stressing the analog inputs outside
of the conditions mentioned here may degrade the bipolar zero
code error and THD performance of the AD7606/AD7606-6/
AD7606-4.
Analog Input Impedance
The analog input impedance of the AD7606/AD7606-6/
AD7606-4 is 1 MΩ. This is a fixed input impedance that does
not vary with the AD7606 sampling frequency. This high analog
input impedance eliminates the need for a driver amplifier in
front of the AD7606/AD7606-6/AD7606-4, allowing for direct
connection to the source or sensor. With the need for a driver
amplifier eliminated, bipolar supplies (which are often a source
of noise in a system) can be removed from the signal chain.
Analog Input Clamp Protection
Figure 34 shows the analog input structure of the AD7606/
AD7606-6/AD7606-4. Each analog input of the AD7606/
AD7606-6/AD7606-4 contains clamp protection circuitry.
Despite single 5 V supply operation, this analog input clamp
protection allows for an input over voltage of up to ±16.5 V.
Figure 34. Analog Input Circuitry
Figure 35 shows the voltage vs. current characteristic of the
clamp circuit. For input voltages of up to ±16.5 V, no current
flows in the clamp circuit. For input voltages that are above ±16.5 V,
the AD7606/AD7606-6/AD7606-4 clamp circuitry turns on.
Figure 35. Input Protection Clamp Profile
A series resistor should be placed on the analog input channels
to limit the current to ±10 mA for input voltages above ±16.5 V.
In an application where there is a series resistance on an analog
input channel, Vx, a corresponding resistance is required on the
analog input GND channel, VxGND (see Figure 36). If there is
no corresponding resistor on the VxGND channel, an offset
error occurs on that channel. It is recommended that the input
overvoltage clamp protection circuitry be used to protect the
AD7606/AD7606-6/AD7606-4 against transient overvoltage
events. It is not recommended to leave the AD7606/AD7606-6/
AD7606-4 in a condition where the clamp protection circuitry
is active in normal or power-down conditions for extended
periods because this may degrade the bipolar zero code error
performance of the AD7606/AD7606-6/AD7606-4.
Rev. C | Page 22 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
A
V
R
FB
R
FB
8479-034
NALOG
INPUT
SIGNAL
AD7606
R
R
Vx
C
VxGND
CLAMP
CLAMP
1MΩ
1MΩ
Figure 36. Input Resistance Matching on the Analog Input of the
AD7606/AD7606-6/AD7606-4
Analog Input Antialiasing Filter
An analog antialiasing filter (a second-order Butterworth) is also
provided on the AD7606/AD7606-6/AD7606-4. Figure 37 and
Figure 38 show the frequency and phase response, respectively,
of the analog antialiasing filter. In the ±5 V range, the −3 dB
frequency is typically 15 kHz. In the ±10 V range, the −3 dB
frequency is typically 23 kHz.
Figure 37. Analog Antialiasing Filter Frequency Response
18
16
±5V RANGE
14
12
±10V RANGE
10
8
6
4
2
PHASE DELAY (µs)
0
–2
–4
AVCC, V
F
SAMPLE
–6
T
= 25°C
A
–8
10100k10k1k
= 5V
DRIVE
= 200kSPS
INPUT FREQ UENCY (Hz)
08479-036
Figure 38. Analog Antialias Filter Phase Response
Track-and-Hold Amplifiers
The track-and-hold amplifiers on the AD7606/AD7606-6/
AD7606-4 allow the ADC to accurately acquire an input sine wave
of full-scale amplitude to 16-bit resolution. The track-and-hold
amplifiers sample their respective inputs simultaneously on the
rising edge of CONVST x. The aperture time for the track-and-
hold (that is, the delay time between the external CONVST x
signal and the track-and-hold actually going into hold) is well
matched, by design, across all eight track-and-holds on one
device and from device to device. This matching allows more
than one AD7606/AD7606-6/AD7606-4 device to be sampled
simultaneously in a system.
The end of the conversion process across all eight channels is
indicated by the falling edge of BUSY; and it is at this point that the
track-and-holds return to track mode, and the acquisition time
for the next set of conversions begins.
The conversion clock for the part is internally generated, and
the conversion time for all channels is 4 μs on the AD7606,
3 μs on the AD7606-6, and 2 μs on the AD7606-4. On the AD7606,
the BUSY signal returns low after all eight conversions to indicate
the end of the conversion process. On the falling edge of BUSY,
the track-and-hold amplifiers return to track mode. New data
can be read from the output register via the parallel, parallel
byte, or serial interface after BUSY goes low; or, alternatively,
data from the previous conversion can be read while BUSY is
high. Reading data from the AD7606/AD7606-6/AD7606-4
while a conversion is in progress has little effect on performance
and allows a faster throughput to be achieved. In parallel mode
at V
> 3.3 V, the SNR is reduced by ~1.5 dB when reading
DRIVE
during a conversion.
ADC TRANSFER FUNCTION
The output coding of the AD7606/AD7606-6/AD7606-4 is
twos complement. The designed code transitions occur midway
between successive integer LSB values, that is, 1/2 LSB and 3/2 LSB.
The LSB size is FSR/65,536 for the AD7606. The ideal transfer
characteristic for the AD7606/AD7606-6/AD7606-4 is shown
in Figure 39.
±10V CODE =× 32,768 ×
011...111
011...110
000...001
000...000
111...111
ADC CODE
100...010
100...001
100...000
±10V RANGE +10V0V–10V305µV
±5V RANGE +5V0V–5V152µV
±5V CODE =× 32,768 ×
–FS + 1/2LSB 0V – 1/2LSB + FS – 3/2LSB
+FSMI DSCALE –FSLSB
IN
10V
VIN
5V
ANALOG INPUT
Figure 39. AD7606/AD7606-6/AD7606-4 Transfer Characteristics
The LSB size is dependent on the analog input range selected.
REF
2.5V
REF
2.5V
LSB =
+FS – (–FS)
16
2
08479-037
Rev. C | Page 23 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
BUF
SAR
2.5V
REF
REFCAPA
REFIN/REFOUT
REFCAPB
10µF
08479-038
AD7606
REF SELECT
REFIN/REFOUT
AD7606
REF SELECT
REFIN/REFOUT
100nF
0.1µF
100nF
AD7606
REF SELECT
REFIN/REFOUT
100nF
ADR421
08479-040
AD7606
REF SELECT
REFIN/REFOUT
+
10µF
AD7606
REF SELECT
REFIN/REFOUT
100nF
AD7606
REF SELECT
REFIN/REFOUT
100nF
V
DRIVE
08479-039
INTERNAL/EXTERNAL REFERENCE
The AD7606/AD7606-6/AD7606-4 contain an on-chip 2.5 V
band gap reference. The REFIN/REFOUT pin allows access to
the 2.5 V reference that generates the on-chip 4.5 V reference
internally, or it allows an external reference of 2.5 V to be applied
to the AD7606/AD7606-6/AD7606-4. An externally applied
reference of 2.5 V is also gained up to 4.5 V, using the internal
buffer. This 4.5 V buffered reference is the reference used by the
SAR ADC.
The REF SELECT pin is a logic input pin that allows the user to
select between the internal reference and an external reference.
If this pin is set to logic high, the internal reference is selected
and enabled. If this pin is set to logic low, the internal reference
is disabled and an external reference voltage must be applied
to the REFIN/REFOUT pin. The internal reference buffer is
always enabled. After a reset, the AD7606/AD7606-6/AD7606-4
operate in the reference mode selected by the REF SELECT pin.
Decoupling is required on the REFIN/REFOUT pin for both
the internal and external reference options. A 10 µF ceramic
capacitor is required on the REFIN/REFOUT pin.
The AD7606/AD7606-6/AD7606-4 contain a reference buffer
configured to gain the REF voltage up to ~4.5 V, as shown in
Figure 40. The REFCAPA and REFCAPB pins must be shorted
together externally, and a ceramic capacitor of 10 μF applied to
REFGND, to ensure that the reference buffer is in closed-loop
operation. The reference voltage available at the REFIN/REFOUT
pin is 2.5 V.
When the AD7606/AD7606-6/AD7606-4 are configured in
external reference mode, the REFIN/REFOUT pin is a high
input impedance pin. For applications using multiple AD7606
devices, the following configurations are recommended,
depending on the application requirements.
External Reference Mode
One ADR421 external reference can be used to drive the
REFIN/REFOUT pins of all AD7606 devices (see Figure 41).
In this configuration, each REFIN/REFOUT pin of the
AD7606/AD7606-6/AD7606-4 should be decoupled with at
least a 100 nF decoupling capacitor.
Internal Reference Mode
One AD7606/AD7606-6/AD7606-4 device, configured to operate
in the internal reference mode, can be used to drive the remaining
AD7606/AD7606-6/AD7606-4 devices, which are configured to
operate in external reference mode (see Figure 42). The REFIN/
REFOUT pin of the AD7606/AD7606-6/AD7606-4, configured
in internal reference mode, should be decoupled using a 10 µF
ceramic decoupling capacitor. The other AD7606/AD7606-6/
AD7606-4 devices, configured in external reference mode,
should use at least a 100 nF decoupling capacitor on their
REFIN/REFOUT pins.
Figure 40. Reference Circuitry
Figure 41. Single External Reference Driving Multiple AD7606/AD7606-6/
PIN APPLIES TO EACH AVCC PIN (PIN 1, PIN 37, PI N 38, PIN 48).
DECOUPLI NG CAPACITOR CAN BE S HARE D BE TWEEN AV
CC
PIN 37 AND PIN 38.
2
DECOUPLI NG SHOWN ON THE REGCAP PI N AP P LIES TO E ACH RE GCAP PIN (PI N 36, PIN 39).
REGCAP
2
+
10µF
REFCAPA
REFCAPB
OS 2
OS 1
OS 0
OVERSAMPLING
100nF
V1
PAR/SER SEL
STBY
REF SELECT
RANGE
V2
V3
V4
V5
V6
V7
V8
REFGND
V1GND
V2GND
V3GND
V4GND
V5GND
V6GND
V7GND
V8GND
V
DRIVE
V
DRIVE
08479-041
MICROPROCESSOR/
MICROCONVERTER/
DSP
TYPICAL CONNECTION DIAGRAM
Figure 43 shows the typical connection diagram for the AD7606/
AD7606-6/AD7606-4. There are four AV
part, and each of the four pins should be decoupled using a 100 nF
capacitor at each supply pin and a 10 µF capacitor at the supply
source. The AD7606/AD7606-6/AD7606-4 can operate with the
internal reference or an externally applied reference. In this
configuration, the AD7606 is configured to operate with the
internal reference. When using a single AD7606/AD7606-6/
AD7606-4 device on the board, the REFIN/REFOUT pin
should be decoupled with a 10 µF capacitor. Refer to the
Internal/External Reference section when using an application
with multiple AD7606/AD7606-6/AD7606-4 devices. The
REFCAPA and REFCAPB pins are shorted together and
decoupled with a 10 µF ceramic capacitor.
The V
processor. The V
supply is connected to the same supply as the
DRIVE
voltage controls the voltage value of the
DRIVE
output logic signals. For layout, decoupling, and grounding
hints, see the Layout Guidelines section.
After supplies are applied to the AD7606/AD7606-6/AD7606-4,
a reset should be applied to the AD7606/AD7606-6/AD7606-4
to ensure that it is configured for the correct mode of operation.
supply pins on the
CC
The power-down mode is selected through the state of the
RANGE pin when the
STBY
pin is low. Tabl e 7 shows the
configurations required to choose the desired power-down mode.
When the AD7606/AD7606-6/AD7606-4 are placed in standby
mode, the current consumption is 8 mA maximum and powerup time is approximately 100 µs because the capacitor on the
REFCAPA and REFCAPB pins must charge up. In standby mode,
the on-chip reference and regulators remain powered up, and
the amplifiers and ADC core are powered down.
When the AD7606/AD7606-6/AD7606-4 are placed in shutdown
mode, the current consumption is 6 µA maximum and power-up
time is approximately 13 ms (external reference mode). In shutdown mode, all circuitry is powered down. When the AD7606/
AD7606-6/AD7606-4 are powered up from shutdown mode,
a RESET signal must be applied to the AD7606/AD7606-6/
AD7606-4 after the required power-up time has elapsed.
Table 7. Power-Down Mode Selection
Power-Down Mode
STBY
RANGE
Standby 0 1
Shutdown 0 0
POWER-DOWN MODES
Two power-down modes are available on the AD7606/AD7606-6/
STBY
AD7606-4: standby mode and shutdown mode. The
controls whether the AD7606/AD7606-6/AD7606-4 are in
normal mode or in one of the two power-down modes.
Figure 43. AD7606 Typical Connection Diagram
pin
Rev. C | Page 25 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
CONVST A
CONVST B
BUSY
CS/RD
DATA: DB[15:0]
FRSTDATA
V1V2V3V7
V8
t
5
t
CONV
V1 TO V4 T RACK- AND- HOLD
ENTER HOL D
V5 TO V8 T RACK- AND- HOLD
ENTER HOL D
AD7606 CONVERTS
ON ALL 8 CHANNELS
08479-042
CONVERSION CONTROL
Simultaneous Sampling on All Analog Input Channels
The AD7606/AD7606-6/AD7606-4 allow simultaneous sampling
of all analog input channels. All channels are sampled simultaneously when both CONVST pins (CONVST A, CONVST B)
are tied together. A single CONVST signal is used to control both
CONVST x inputs. The rising edge of this common CONVST
signal initiates simultaneous sampling on all analog input channels
(V1 to V8 for the AD7606, V1 to V6 for the AD7606-6, and V1
to V4 for the AD7606-4).
The AD7606 contains an on-chip oscillator that is used to
perform the conversions. The conversion time for all ADC
channels is t
conversions are in progress, so when the rising edge of CONVST
is applied, BUSY goes logic high and transitions low at the end
of the entire conversion process. The falling edge of the BUSY
signal is used to place all eight track-and-hold amplifiers back
into track mode. The falling edge of BUSY also indicates that
the new data can now be read from the parallel bus (DB[15:0]),
the D
OUT
DB[7:0].
Simultaneously Sampling Two Sets of Channels
The AD7606/AD7606-6/AD7606-4 also allow the analog input
channels to be sampled simultaneously in two sets. This can be
used in power-line protection and measurement systems to
compensate for phase differences introduced by PT and CT
. The BUSY signal indicates to the user when
CONV
A and D
B serial data lines, or the parallel byte bus,
OUT
transformers. In a 50 Hz system, this allows for up to 9° of phase
compensation; and in a 60 Hz system, it allows for up to 10° of
phase compensation.
This is accomplished by pulsing the two CONVST pins
independently and is possible only if oversampling is not in use.
CONVST A is used to initiate simultaneous sampling of the
first set of channels (V1 to V4 for the AD7606, V1 to V3 for the
AD7606-6, and V1 and V2 for the AD7606-4); and CONVST B
is used to initiate simultaneous sampling on the second set of
analog input channels (V5 to V8 for the AD7606, V4 to V6 for
the AD7606-6, and V3 and V4 for the AD7606-4), as illustrated
in Figure 44. On the rising edge of CONVST A, the track-andhold amplifiers for the first set of channels are placed into hold
mode. On the rising edge of CONVST B, the track-and-hold
amplifiers for the second set of channels are placed into hold
mode. The conversion process begins once both rising edges
of CONVST x have occurred; therefore BUSY goes high on the
rising edge of the later CONVST x signal. In Table 3, Time t
5
indicates the maximum allowable time between CONVST x
sampling points.
There is no change to the data read process when using two
separate CONVST x signals.
Connect all unused analog input channels to AGND. The results
for any unused channels are still included in the data read because
all channels are always converted.
Figure 44. AD7606 Simultaneous Sampling on Channel Sets While Using Independent CONVST A and CONVST B Signals—Parallel Mode
Rev. C | Page 26 of 36
AD7606
14
BUSY
12
RD/SCLK
[33:24]
[22:16]
DB[15:0]
13
CS
DIGITAL
HOST
INTERRUPT
08479-043
Data Sheet AD7606/AD7606-6/AD7606-4
DIGITAL INTERFACE
The AD7606/AD7606-6/AD7606-4 provide three interface
options: a parallel interface, a high speed serial interface, and
a parallel byte interface. The required interface mode is selected
Operation of the interface modes is discussed in the following
sections.
PARALLEL INTERFACE (
/SER/BYTE SEL = 0)
PAR
Data can be read from the AD7606/AD7606-6/AD7606-4 via
CS
the parallel data bus with standard
data over the parallel bus, the
CS
be tied low. The
and RD input signals are internally gated to
and RD signals. To read the
PAR
/SER/BYTE SEL pin should
enable the conversion result onto the data bus. The data lines,
DB15 to DB0, leave their high impedance state when both
CS
and RD are logic low.
Figure 45. AD7606 Interface Diagram—One AD7606 Using the Parallel Bus,
CS
and RD Shorted Together
with
The rising edge of the CS input signal three-states the bus, and
CS
the falling edge of the
high impedance state.
input signal takes the bus out of the
CS
is the control signal that enables the
data lines; it is the function that allows multiple AD7606/
AD7606-6/ AD7606-4 devices to share the same parallel
data bus.
CS
The
signal can be permanently tied low, and the RD signal
can be used to access the conversion results as shown in
Figure 4.
A read operation of new data can take place after the BUSY
signal goes low (see Figure 2); or, alternatively, a read operation
of data from the previous conversion process can take place
while BUSY is high (see Figure 3).
RD
The
results register. Applying a sequence of
pin is used to read data from the output conversion
RD
pulses to the RD pin
of the AD7606/AD7606-6/AD7606-4 clocks the conversion
results out from each channel onto the Parallel Bus DB[15:0] in
ascending order. The first
clocks out the conversion result from Channel V1. The next
RD
falling edge after BUSY goes low
RD
falling edge updates the bus with the V2 conversion result, and so
RD
on. On the AD7606, the eighth falling edge of
clocks out the
conversion result for Channel V8.
Rev. C | Page 27 of 36
When the RD signal is logic low, it enables the data conversion
result from each channel to be transferred to the digital host
(DSP, FPGA).
When there is only one AD7606/AD7606-6/AD7606-4 in
a system/board and it does not share the parallel bus, data can
be read using just one control signal from the digital host. The
CS
and RD signals can be tied together, as shown in Figure 5.
In this case, the data bus comes out of three-state on the falling
CS/RD
edge of
. The combined CS and RD signal allows the data
to be clocked out of the AD7606/AD7606-6/AD7606-4 and to
be read by the digital host. In this case,
CS
is used to frame the
data transfer of each data channel.
PARALLEL BYTE (
/SER/BYTE SEL = 1, DB15 = 1)
PAR
Parallel byte interface mode operates much like the parallel
interface mode, except that each channel conversion result is read
out in two 8-bit transfers. Therefore, 16
RD
pulses are required
to read all eight conversion results from the AD7606. For the
AD7606-6, 12
RD
eight
RD
pulses are required; and on the AD7606-4,
pulses are required to read all the channel results.
To configure the AD7606/AD76706-6/AD7606-4 to operate in
parallel byte mode, the
DB15 pins should be tied to logic high (see
PAR
/SER/BYTE SEL and BYTE SEL/
Tabl e 8). In parallel
byte mode, DB[7:0] are used to transfer the data to the digital
host. DB0 is the LSB of the data transfer, and DB7 is the MSB of
the data transfer. In parallel byte mode, DB14 acts as an HBEN
pin. When DB14/HBEN is tied to logic high, the most
significant byte (MSB) of the conversion result is output first,
followed by the LSB of the conversion result. When DB14 is tied
to logic low, the LSB of the conversion result is output first,
followed by the MSB of the conversion result. The FRSTDATA
pin remains high until the entire 16 bits of the conversion result
from V1 are read from the AD7606/AD7606-6/AD7606-4.
SERIAL INTERFACE (
/SER/BYTE SEL = 1)
PAR
To read data back from the AD7606 over the serial interface, the
PAR
/SER/BYTE SEL pin must be tied high. The CS and SCLK
signals are used to transfer data from the AD7606. The AD7606/
AD7606-6/AD7606-4 have two serial data output pins, D
and D
6/AD7606-4 using one or both of these D
B. Data can be read back from the AD7606/AD76706-
OUT
lines. For the
OUT
AD7606, conversion results from Channel V1 to Channel V4
first appear on D
to Channel V8 first appear on D
A, and conversion results from Channel V5
OUT
B. For the AD7606-6,
OUT
conversion results from Channel V1 to Channel V3 first appear
on D
A, and conversion results from Channel V4 to Channel
OUT
V6 first appear on D
from Channel V1 and Channel V2 first appear on D
B. For the AD7606-4, conversion results
OUT
OUT
conversion results from Channels V3 and Channel V4 first
appear on D
OUT
B.
OUT
A, and
A
AD7606/AD7606-6/AD7606-4 Data Sheet
The CS falling edge takes the data output lines, D
A and D
OUT
OUT
B,
out of three-state and clocks out the MSB of the conversion
result. The rising edge of SCLK clocks all subsequent data bits
onto the serial data outputs, D
A and D
OUT
B. The CS input
OUT
can be held low for the entire serial read operation, or it can be
pulsed to frame each channel read of 16 SCLK cycles. Figure 46
shows a read of eight simultaneous conversion results using two
D
lines on the AD7606. In this case, a 64 SCLK transfer is used
OUT
CS
to access data from the AD7606, and
is held low to frame the
entire 64 SCLK cycles. Data can also be clocked out using just
one D
line, in which case it is recommended that D
OUT
OUT
A be
used to access all conversion data because the channel data is
output in ascending order. For the AD7606 to access all eight
conversion results on one D
is required. These 128 SCLK cycles can be framed by one
line, a total of 128 SCLK cycles
OUT
CS
signal, or each group of 16 SCLK cycles can be individually
framed by the
D
line is that the throughput rate is reduced if reading occurs
OUT
after conversion. The unused D
in serial mode. For the AD7606, if D
D
line, the channel results are output in the following order:
OUT
CS
signal. The disadvantage of using just one
line should be left unconnected
OUT
B is to be used as a single
OUT
V5, V6, V7, V8, V1, V2, V3, and V4; however, the FRSTDATA
indicator returns low after V5 is read on D
and the AD7606-4, if D
B is to be used as a single D
OUT
B. For the AD7606-6
OUT
OUT
line,
the channel results are output in the following order: V4, V5, V6,
V1, V2, and V3 for the AD7606-6; and V3, V4, V1, and V2 for
the AD7606-4.
Figure 6 shows the timing diagram for reading one channel of
data, framed by the
CS
signal, from the AD7606/AD7606-6/
AD7606-4 in serial mode. The SCLK input signal provides the
clock source for the serial read operation. The
CS
goes low to
access the data from the AD7606/AD7606-6/AD7606-4.
The falling edge of
out the MSB of the 16-bit conversion result. This MSB is valid
on the first falling edge of the SCLK after the
The subsequent 15 data bits are clocked out of the AD7606/
AD7606-6/AD7606-4 on the SCLK rising edge. Data is valid on
the SCLK falling edge. To access each conversion result, 16 clock
cycles must be provided to the AD7606/AD7606-6/AD7606-4.
The FRSTDATA output signal indicates when the first channel,
V1, is being read back. When the
output pin is in three-state. In serial mode, the falling edge of
CS
takes FRSTDATA out of three-state and sets the FRSTDATA
pin high, indicating that the result from V1 is available on the
D
A output data line. The FRSTDATA output returns to
OUT
a logic low following the 16
are read on D
V1 is being output on this serial data output pin. It goes high
only when V1 is available on D
available on D
READING DURING CONVERSION
Data can be read from the AD7606/AD7606-6/AD7606-4 while
BUSY is high and the conversions are in progress. This has little
effect on the performance of the converter, and it allows a faster
throughput rate to be achieved. A parallel, parallel byte, or serial
read can be performed during conversions and when oversampling
may or may not be in use. Figure 3 shows the timing diagram for
reading while BUSY is high in parallel or serial mode. Reading
during conversions allows the full throughput rate to be achieved
when using the serial interface with V
Data can be read from the AD7606 at any time other than on
the falling edge of BUSY because this is when the output data
registers are updated with the new conversion data. Time t
outlined in Table 3, should be observed in this condition.
CS
takes the bus out of three-state and clocks
CS
falling edge.
CS
input is high, the FRSTDATA
th
SCLK falling edge. If all channels
B, the FRSTDATA output does not go high when
OUT
A (and this is when V5 is
OUT
B for the AD7606).
OUT
above 4.75 V.
DRIVE
, as
6
CS
64
SCLK
A
D
OUT
B
D
OUT
V1V4V2V3
V5V8V6V7
Figure 46. AD7606 Serial Interface with Two D
OUT
Lines
08479-044
Rev. C | Page 28 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
08479-046
CS
RD
DATA:
DB[15:0]
BUSY
CONVST A
AND
CONVST B
t
CYCLE
t
CONV
4µs
t
4
t
4
t
4
9µs
19µs
OS = 0 OS = 2 OS = 4
CONVST A
AND
CONVST B
BUSY
OS x
t
OS_SETUP
t
OS_HOLD
CONVERSION NCONVERSION N + 1
OVERSAMPLE RATE
LATCHED FOR CONVERSION N + 1
08479-045
100
16
95.5
96 6 6
12.5
DIGITAL FILTER
The AD7606/AD7606-6/AD7606-4 contain an optional digital
first-order sinc filter that should be used in applications where
slower throughput rates are used or where higher signal-to-noise
ratio or dynamic range is desirable. The oversampling ratio of the
digital filter is controlled using the oversampling pins, OS [2:0] (see
Tabl e 9). OS 2 is the MSB control bit, and OS 0 is the LSB control
bit. Table 9 provides the oversampling bit decoding to select the
different oversample rates. The OS pins are latched on the falling
edge of BUSY. This sets the oversampling rate for the next
conversion (see Figure 48). In addition to the oversampling
function, the output result is decimated to 16-bit resolution.
If the OS pins are set to select an OS ratio of eight, the next
CONVST x rising edge takes the first sample for each channel,
and the remaining seven samples for all channels are taken with
an internally generated sampling signal. These samples are then
averaged to yield an improvement in SNR performance. Tab l e 9
shows typical SNR performance for both the ±10 V and the ±5 V
range. As Tabl e 9 shows, there is an improvement in SNR as the
OS ratio increases. As the OS ratio increases, the 3 dB frequency
is reduced, and the allowed sampling frequency is also reduced.
In an application where the required sampling frequency is
10 kSPS, an OS ratio of up to 16 can be used. In this case, the
application sees an improvement in SNR, but the input 3 dB
bandwidth is limited to ~6 kHz.
The CONVST A and CONVST B pins must be tied/driven
together when oversampling is turned on. When the oversampling function is turned on, the BUSY high time for the
conversion process extends. The actual BUSY high time
depends on the oversampling rate that is selected: the higher the
oversampling rate, the longer the BUSY high, or total conversion
time (see Tab l e 3).
Figure 47. AD7606—No Oversampling, Oversampling × 2, and
Oversampling × 4 While Using Read After Conversion
Figure 47 shows that the conversion time extends as the oversampling rate is increased, and the BUSY signal lengthens for the
different oversampling rates. For example, a sampling frequency
of 10 kSPS yields a cycle time of 100 µs. Figure 47 shows OS × 2
and OS × 4; for a 10 kSPS example, there is adequate cycle time to
further increase the oversampling rate and yield greater improvements in SNR performance. In an application where the initial
sampling or throughput rate is at 200 kSPS, for example, and
oversampling is turned on, the throughput rate must be reduced
to accommodate the longer conversion time and to allow for the
read. To achieve the fastest throughput rate possible when oversampling is turned on, the read can be performed during the
BUSY high time. The falling edge of BUSY is used to update the
output data registers with the new conversion data; therefore, the
reading of conversion data should not occur on this edge.
Figure 49 to Figure 55 illustrate the effect of oversampling on
the code spread in a dc histogram plot. As the oversample rate
is increased, the spread of the codes is reduced.
Figure 49. Histogram of Codes—No OS (Six Codes)
Figure 50. Histogram of Codes—OS × 2 (Four Codes)
Figure 52. Histogram of Codes—OS × 8 (Three Codes)
Figure 53. Histogram of Codes—OS × 16 (Two Codes)
Figure 51. Histogram of Codes—OS × 4 (Four Codes)
Figure 54. Histogram of Codes—OS × 32 (Two Codes)
Figure 55. Histogram of Codes—OS × 64 (Two Codes)
Rev. C | Page 30 of 36
Data Sheet AD7606/AD7606-6/AD7606-4
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-051
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 2
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–100
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-052
AVCC = 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 4
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–100
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-053
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 8
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–100
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-154
AV
CC
= 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 16
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–100
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-155
AVCC = 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 32
0
–10
–20
–30
–40
–50
–60
–70
–80
1001k10k100k10M1M
–100
–90
ATTENUATI ON (dB)
FREQUENCY (Hz )
08479-156
AVCC = 5V
V
DRIVE
= 5V
T
A
= 25°C
10V RANGE
OS BY 64
When the oversampling mode is selected for the AD7606/
AD7606-6/AD7606-4, it has the effect of adding a digital filter
function after the ADC. The different oversampling rates and
the CONVST sampling frequency produce different digital filter
frequency profiles.
Figure 56 to Figure 61 show the digital filter frequency profiles for
the different oversampling rates. The combination of the analog
antialiasing filter and the oversampling digital filter can be used
to eliminate and reduce the complexity of the design of any filter
before the AD7606/AD7606-6/AD7606-4. The digital filtering
combines steep roll-off and linear phase response.
Figure 56. Digital Filter Response for OS 2
Figure 59. Digital Filter Response for OS 16
Figure 60. Digital Filter Response for OS 32
Figure 57. Digital Filter Response for OS 4
Figure 58. Digital Filter Response for OS 8
Figure 61. Digital Filter Response for OS 64
Rev. C | Page 31 of 36
AD7606/AD7606-6/AD7606-4 Data Sheet
08479-054
08479-055
LAYOUT GUIDELINES
The printed circuit board that houses the AD7606/AD7606-6/
AD7606-4 should be designed so that the analog and digital
sections are separated and confined to different areas of the board.
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the case of the
split plane, the digital and analog ground planes should be
joined in only one place, preferably as close as possible to the
AD7606/AD7606-6/AD7606-4.
If the AD7606/AD7606-6/AD7606-4 are in a system where
multiple devices require analog-to-digital ground connections,
the connection should still be made at only one point: a star
ground point that should be established as close as possible to the
AD7606/AD7606-6/AD7606-4. Good connections should be
made to the ground plane. Avoid sharing one connection for
multiple ground pins. Use individual vias or multiple vias to the
ground plane for each ground pin.
Avoid running digital lines under the devices because doing so
couples noise onto the die. The analog ground plane should be
allowed to run under the AD7606/AD7606-6/AD7606-4 to
avoid noise coupling. Fast switching signals like CONVST A,
CONVST B, or clocks should be shielded with digital ground
to avoid radiating noise to other sections of the board, and they
should never run near analog signal paths. Avoid crossover of
digital and analog signals. Traces on layers in close proximity on
the board should run at right angles to each other to reduce the
effect of feedthrough through the board.
The power supply lines to the AV
AD7606/AD7606-6/AD7606-4 should use as large a trace as
possible to provide low impedance paths and reduce the effect
of glitches on the power supply lines. Where possible, use supply
planes and make good connections between the AD7606 supply
pins and the power tracks on the board. Use a single via or multiple
vias for each supply pin.
Good decoupling is also important to lower the supply impedance
presented to the AD7606/AD7606-6/AD7606-4 and to reduce
the magnitude of the supply spikes. The decoupling capacitors
should be placed close to (ideally, right up against) these pins
and their corresponding ground pins. Place the decoupling
capacitors for the REFIN/REFOUT pin and the REFCAPA and
REFCAPB pins as close as possible to their respective AD7606/
AD7606-6/AD7606-4 pins; and, where possible, they should be
placed on the same side of the board as the AD7606 device.
and V
CC
pins on the
DRIVE
Rev. C | Page 32 of 36
Figure 62 shows the recommended decoupling on the top layer
of the AD7606 board. Figure 63 shows bottom layer decoupling,
which is used for the four AV
Where the ceramic 100 nF caps for the AV
pins and the V
CC
pin decoupling.
DRIVE
pins are placed
CC
close to their respective device pins, a single 100 nF capacitor
can be shared between Pin 37 and Pin 38.
Figure 62. Top Layer Decoupling REFIN/REFOUT,
REFCAPA, REFCAPB, and REGCAP Pins
Figure 63. Bottom Layer Decoupling
Data Sheet AD7606/AD7606-6/AD7606-4
AVCC
U2
U1
AVCC
U2
U1
08479-056
To ensure good device-to-device performance matching in
a system that contains multiple AD7606/AD7606-6/AD7606-4
devices, a symmetrical layout between the AD7606/AD7606-6/
AD7606-4 devices is important.
Figure 64 shows a layout with two AD7606/AD7606-6/AD7606-4
devices. The AV
and the V
The reference chip is positioned between the two devices, and
the reference voltage track runs north to Pin 42 of U1 and south
to Pin 42 of U2. A solid ground plane is used.
These symmetrical layout principles can also be applied to a system
that contains more than two AD7606/AD7606-6/AD7606-4
devices. The AD7606/AD7606-6/AD7606-4 devices can be placed
in a north-south direction, with the reference voltage located
midway between the devices and the reference track running in
the north-south direction, similar to Figure 64.
supply plane runs to the right of both devices,
CC
supply track runs to the left of the two devices.
DRIVE
Figure 64. Layout for Multiple AD7606 Devices—Top Layer and