Four 8-bit DACs in one package
+3 V, +5 V, and ±5 V operation
Rail-to-rail REF input to voltage output swing
2.6 MHz reference multiplying bandwidth
Internal power-on reset
SPI serial interface-compatible—AD7304
Fast parallel interface—AD7305
40 µA power shutdown
APPLICATIONS
Automotive output span voltage
Instrumentation, digitally controlled calibration
Pin-compatible AD7226 replacement when V
GENERAL DESCRIPTION
The AD7304/AD7305
a single +3 V to +5 V supply, or ±5 V supplies. The AD7304 has
a serial interface, while the AD7305 has a parallel interface.
Internal precision buffers swing rail-to-rail. The reference input
range includes both supply rails, allowing for positive or negative
full-scale output voltages. Operation is guaranteed over the
supply voltage range of 2.7 V to 5.5 V, consuming less than
9 mW from a 3 V supply.
The full-scale voltage output is determined by the external
reference input voltage applied. The rail-to-rail V
DAC V
supply, V
allows for a full-scale voltage set equal to the positive
OUT
, the negative supply, VSS, or any value in between.
DD
1
are quad, 8-bit DACs that operate from
< 5.5 V
DD
REF
input to
Quad, 8-Bit DAC
AD7304/AD7305
FUNCTIONAL BLOCK DIAGRAMS
B
88
DAC A
REG
88
DAC B
REG
88
DAC C
REG
DAC D
REG
LDAC
V
REF
V
REFCVREF
CS
SDI/SHDN
CLK
V
DD
PWR-ON
RESET
SERIAL
REG
V
SS
8
GND
INPUT
REG A
INPUT
REG B
INPUT
REG C
INPUT
REG D
88
CLR
Figure 1.
DAC A
REG
DAC B
REG
DAC C
REG
DAC D
REG
LDAC
V
REF
DB0
DB1
DB2
DB3
DB4
DB5
DB6
WR
0/SHDN
V
DD
PWR-ON
RESET
8
8
DECODE
A1
INPUT
REG A
INPUT
REG B
INPUT
REG C
INPUT
REG D
88
88
88
88
Figure 2.
When operating from less than 5.5 V, the AD7305 is
pin-compatible with the popular industry-standard AD7226.
V
DAC A
DAC B
DAC C
DAC D
SS
V
REF
DAC A
DAC B
DAC C
DAC D
A
AD7304
D
AD7305
GND
V
OUT
V
OUT
V
OUT
V
OUT
01114-001
V
OUT
V
OUT
V
OUT
V
OUT
01114-002
A
B
C
D
A
B
C
D
The AD7304’s doubled-buffered serial data interface offers high
speed, 3-wire, SPI®-, and microcontroller-compatible inputs
using data in (SDI), clock (CLK), and chip select (
CS
) pins.
Additionally, an internal power-on reset sets the output to zero
scale.
The parallel input AD7305 uses a standard address decode
WR
along with the
control line to load data into the input
registers.
The double-buffered architecture allows all four input registers
LDAC
to be preloaded with new values, followed by an
control
strobe that copies all the new data into the DAC registers,
thereby updating the analog output values.
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
An internal power-on reset places both parts in the zero-scale
state at turn-on. A 40 µA power shutdown (SHDN) feature is
activated on both parts by three-stating the SDI/SHDN pin on
the AD7304 and three-stating the A0/SHDN address pin on the
AD7305.
The AD7304/AD7305 are specified over the extended industrial
−40°C to +85°C and the automotive −40°C to +125°C
temperature ranges. AD7304s are available in a wide-body
16-lead SOIC (R-16) package. The parallel input AD7305 is
available in the wide-body 20-lead SOIC (R-20) surface-mount
package. For ultracompact applications, the thin 1.1 mm,
16-lead TSSOP (RU-16) package is available for the AD7304,
while the 20-lead TSSOP (RU-20) houses the AD7305.
@ VDD = 3 V or 5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, VSS ≤ V
Table 1.
Parameter Symbol Condition 3 V ± 10% 5 V ± 10% ±5 V ± 10% Unit
STATIC PERFORMANCE
Resolution
1
Integral Nonlinearity2 INL
N
Differential Nonlinearity DNL Monotonic, all codes 0 to 0xFF ±1 ±1 ±1 LSB max
Zero-Scale Error V
Full-Scale Voltage Error V
Full-Scale Temperature
Coefficient
3
REFERENCE INPUT
V
Range V
REFIN
Input Resistance (AD7304) R
Input Resistance (AD7305) R
Input Capacitance
3
ANALOG OUTPUTS
Output Voltage Range V
Output Current Drive I
Shutdown Resistance R
Data = 0x00 15 15 ±15 mV max
ZSE
Data = 0xFF ±4 ±4 ±4 LSB max
FSE
TCV
FS
REFIN
REFIN
REFIN
C
REFIN
Code = 0x55 28 28 28 kΩ typ
All DACs at code = 0x55 7.5 7.5 7.5 kΩ typ
OUT
Code = 0x80, ∆V
OUT
DAC outputs placed in shutdown
OUT
< 1 LSB ±3 ±3 ±3 mA typ
OUT
state
Capacitive Load
3
LOGIC INPUTS
Logic Input Low Voltage VIL
Logic Input High Voltage VIH
Input Leakage Current5 IIL
Input Capacitance
AC CHARACTERISTICS
3
3
CL No oscillation 200 200 200 pF typ
CIL
Output Slew Rate SR Code = 0x00 to 0xFF to 0x00 1/2.7 1/3.6 1.0/3.6 V/µs min/typ
Reference Multiplying BW Small signal, VSS = –5 V
Total Harmonic Distortion THD V
= 4 V p-p, VSS = –5 V, f = 1 kHz
REF
Settling Time6 tS To ±0.1% of full scale 1.1/2 1.0/2 1.0/2 µs typ/max
Shutdown Recovery Time t
Time to Shutdown t
SDR
SDN
DAC Glitch Q
Digital Feedthrough Q
Feedthrough V
SUPPLY CHARACTERISTICS
OUT/VREF
Positive Supply Current IDD V
To ±0.1% of full scale 2 2 2 µs max
Code = 0x00, V
= 0 V or VDD, no load 6 6 6 mA max
LOGIC
= 1 V p-p, f = 100 kHz
REF
Negative Supply Current ISS VSS = –5 V
Power Dissipation P
Power Down I
The first three codes (0x00, 0x01, 0x10) are excluded from the integral nonlinearity error measurement in single-supply operation 3 V or 5 V.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typical specifications represent average readings measured at 25°C.
5
The SDI/SHDN and A0/SHDN pins have a 30 µA maximum IIL input leakage current.
6
The settling time specification does not apply for negative going transitions within the last three LSBs of ground in single-supply operation.
REF
/256.
≤ VDD, −40°C < TA < +85°C/+125°C, unless otherwise noted.
REF
8 8 8 Bits
±1 ±1 ±1 LSB max
5 5 5 ppm/°C typ4
VSS/VDD VSS/VDD VSS/VDD V min/max
5 5 5 pF typ
VSS/VDD VSS/VDD VSS/VDD V min/max
120 120 120 kΩ typ
0.6 0.8 0.8 V min
2.1 2.4 2.4 V max
±10 ±10 ±10 µA max
8 8 8 pF max
2.6 MHz typ
0.025 %
15 15 15 µs typ
15 15 15 nVs typ
2 2 2 nVs typ
−65 dB
6 mA max
Rev. C | Page 3 of 20
AD7304/AD7305
+5V
= 10V p-p
V
REF
f = 20kHz
+5V
0V
0V
V
= 10V p-p
OUT
–5V
(OUT)
Figure 3. Rail-to-Rail Reference Input to Output at 20 kHz
–5V
(IN)
01114-003
TIMING SPECIFICATIONS
@ VDD = 3 V or 5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, VSS ≤ V
Table 2.
ParameterSymbol3 V ± 10%5 V ± 10%±5 V ± 10%Unit
INTERFACE TIMING SPECIFICATIONS
AD7304 Only
1, 2
Clock Width High tCH 70 55 55 ns min
Clock Width Low tCL 70 55 55 ns min
Data Setup tDS 50 40 40 ns min
Data Hold tDH 30 20 20 ns min
Load Pulse Width t
Load Setup t
Load Hold t
Clear Pulse Width t
Select t
Deselect t
AD7305 Only
70 60 60 ns min
LDW
40 30 30 ns min
LD1
40 30 30 ns min
LD2
60 60 60 ns min
CLWR
30 20 20 ns min
CSS
60 40 40 ns min
CSH
Data Setup tDS 60 40 40 ns min
Data Hold tDH 30 20 20 ns min
Address Setup tAS 60 40 40 ns min
Address Hold tAH 30 20 20 ns min
Write Width tWR 60 50 50 ns min
Load Pulse Width t
60 50 50 ns min
LDW
Load Setup tLS 60 40 40 ns min
Load Hold t
LH
1
These parameters are guaranteed by design and not subject to production testing.
2
All input control signals are specified with tR = tF = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
≤ VDD, –40°C < TA < +85°C/+125°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 20
AD7304/AD7305
V
LDAC
LDAC
OUT
SDI
CLK
CS
SDI
CLK
CLR
SASIA1A0D7D6D5D4D3D2D1D0
t
CSS
t
LD1
tDSt
t
CL
FS
ZS
DH
t
CH
t
LDW
t
S
Figure 4. AD7304 General Timing Diagram
t
CSH
±1 LSB
ERROR BAND
t
LD2
t
CLRW
t
S
01114-004
t
SDN
SDI/SHDN
I
DD
Figure 5. AD7304 Timing Diagram Zoom In
t
SDR
01114-005
Table 4. AD7304 Control Logic Truth Table
CS
1
CLK1
LDAC CLR
H X H H No effect No effect No effect
L
↑+
H H Data advanced 1 bit No effect No effect
↑
+
L H H No effect Updated with SR contents2 No effect
H X L H No effect
H X H
H X H
1
Serial Shift Register Function Input REG Function DAC Register Function
One input register receives the data bits D7–D0 decoded from the SR address bits (A1, A0), where REG A = (0, 0), B = (0, 1), C = (1, 0), and D = (1, 1).
3
LDAC
is a level-sensitive input.
Table 5. AD7304 Serial Input Register Data Format, Data is Loaded in MSB-First Format
MSB
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1
LSB
B0
AD7304 SAC SDC A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
If B11 (SAC), Shutdown All Channels, is set to logic low, all DACs are placed in a power shutdown mode, and all output voltages become
high resistance. If B10 (SDC), Shutdown Decoded Channel, is set to logic low, only the DAC decoded by Address Bits A1 and A0 is placed
in shutdown mode.
Rev. C | Page 6 of 20
AD7304/AD7305
Table 6. AD7305 Control Logic Truth Table
1
A1 A0
WR
L L L H Register A loaded with DB0 to DB7 Latched with previous contents, no change
↑+
L L H Register A latched with DB0 to DB7 Latched with previous contents, no change
L L H H Register B loaded with DB0 to DB7 Latched with previous contents, no change
↑+
L H H Register B latched with DB0 to DB7 Latched with previous contents, no change
L H L H Register C loaded with DB0 to DB7 Latched with previous contents, no change
↑+
H L H Register C latched with DB0 to DB7 Latched with previous contents, no change
L H H H Register D loaded with DB0 to DB7 Latched with previous contents, no change
↑+
H H H Register D latched with DB0 to DB7 Latched with previous contents, no change
H X X L No effect All input register contents loaded, register transparent
L X X L Input register x transparent to DB0 to DB7 Register transparent
H X X
H X X H No effect, device not selected No effect, device not selected
Channel B Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
Output is open circuit when SHDN is enabled.
2 V
OUT
A
Channel A Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
Output is open circuit when SHDN is enabled.
3 VSS
4 V
5 V
REF
REF
A Channel A Reference Input. Establishes V
B Channel B Reference Input. Establishes V
Negative Power Supply Input. Specified range of operation is 0 V to −5.5 V.
full-scale voltage. Specified range of operation is VSS < V
OUTA
B full-scale voltage. Specified range of operation is VSS < V
OUT
6 GND Common Analog and Digital Ground.
7
LDAC Load DAC Register Strobe, Active Low. Simultaneously transfers data from all four input registers into the
corresponding DAC registers. Asynchronous active low input. DAC register is transparent when
Table 4 for operation.
8
CLR Clears All Input and DAC Registers to the Zero Condition. Asynchronous active low input. The serial register is
not effected.
9
10 CLK
11 SDI/SHDN
CS Chip Select, Active Low Input. Disables shift register loading when high. Transfers serial input register data to
the decoded input register when
CS returns high. Does not effect LDAC operation.
Clock Input, Positive Edge Clocks Data into Shift Register. Disabled by chip select
Serial Data Input Loads Directly into the Shift Register, MSB First. Hardware shutdown (SHDN) control input,
active when pin is left floating by a three-state logic driver. Does not effect DAC register contents as long as
.
DD
full-scale voltage. Specified range of operation is VSS < V
OUTD
C full-scale voltage. Specified range of operation is VSS V
OUT
12 V
13 V
power is present on V
D Channel D Reference Input. Establishes V
REF
C Channel C Reference Input. Establishes V
REF
14 VDD Positive Power Supply Input. Specified range of operation is 2.7 V to 5.5 V.
15 V
OUT
D
Channel D Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
Output is open circuit when SHDN is enabled.
16 V
OUT
C
Channel C Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
Output is open circuit when SHDN is enabled.
CS.
B pin.
REF
A pin.
REF
A < VDD.
REF
B < VDD.
REF
LDAC = 0. See
D < VDD.
REF
C < VDD.
REF
D pin.
REF
C pin.
REF
Rev. C | Page 8 of 20
AD7304/AD7305
V
V
1
B
OUT
2
A
OUT
3
V
SS
AD7305
4
V
REF
GND
LDAC
DB7
DB6
DB5
DB4
(Not to Scale)
5
6
7
8
9
10
TOP VIEW
Figure 9. AD7305 Pin Configuration
Table 8. AD7305 Pin Function Description
Pin No. Mnemonic Description
1 V
OUT
B
Channel B Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled.
2 V
OUT
A
Channel A Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled.
3 VSS Negative Power Supply Input. Specified range of operation is 0 V to –5.5 V.
4 V
Channel B Reference Input. Establishes V
REF
OUT
5 GND Common Analog and Digital Ground.
6
LDAC
Load DAC Register Strobe, Active Low. Simultaneously transfers data from all four input registers into the
corresponding DAC registers. Asynchronous active low input. DAC register is transparent when
for operation.
7 DB7 MSB Digital Input Data Bit.
8 DB6 Data Bit 6.
9 DB5 Data Bit 5.
10 DB4 Data Bit 4.
11 DB3 Data Bit 3.
12 DB2 Data Bit 2.
13 DB1 Data Bit 1.
14 DB0 LSB Digital Input Data Bit.
15
WR
Write Data into Input Register Control Line, Active Low. See Table 6 for operation.
16 A1 Address Bit 1.
17 A0/SHDN
Address Bit 0/Hardware Shutdown (SHDN) Control Input, Active When Pin Is Left Floating by a Three-State Logic
Driver. Does not effect DAC register contents as long as power is present on V
18 VDD Positive Power Supply Input. Specified range of operation is 2.7 V to 5.5 V.
19 V
OUT
D
Channel D Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled.
20 V
OUT
C
Channel C Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled.
20
C
V
OUT
19
D
V
OUT
18
V
DD
17
A0/SHDN
16
A1
15
WR
14
DB0
13
DB1
12
DB2
11
DB3
01114-009
full-scale voltage. Specified range of operation is VSS < V
LDAC = 0. See Table 6
.
DD
B pin. Output is
REF
A pin. Output is
REF
< VDD.
REF
D pin. Output is
REF
C pin. Output is
REF
Rev. C | Page 9 of 20
AD7304/AD7305
TYPICAL PERFORMANCE CHARACTERISTICS
144
VDD = +5V
VSS = –5V
120
V
= V
REF
DD
DATA = 0x00
96
72
SINK CURRENT (mA)
48
OUT
I
24
INL (LSB)
1.0
0.6
0.2
–0.2
–0.6
VDD = +5V
V
= –5V
SS
DATA = 0x80
T
= +25°C
A
DAC D
DAC B
DAC C
DAC A
0
015
3
Figure 10. I
–35
–28
–21
–14
SOURCE CURRENT (mA)
OUT
I
–7
0
4.05.04.2
INL (LSB)
Figure 11. I
+1
0
–1
+1
0
–1
+1
0
–1
+1
0
–1
025632
OUT
DAC A
DAC B
DAC C
DAC D
6912
V
(mV)
OUT
Sink vs. V
OUT
V
OUT
SOURCE vs. V
6496128160192224
Rail-to-Rail Performance
OUT
VDD = +5V
V
SS
V
REF
DATA = 0xFF
4.44.64.8
OUTPUT VOLTAGE (V)
Rail-to-Rail Performance
OUT
VDD = +5V
V
SS
V
REF
T
A
CODE (Decimal)
= –5V
= V
= –5V
= +2.5V
= +25°C
DD
01114-010
01114-011
01114-012
–1.0
–5.05.0–3.0
0.500
0.375
0.250
0.125
0
DNL (LSB)
–0.125
–0.250
–0.375
–0.500
4.0
3.6
3.2
2.8
ZERO-SCALE VOLTAGE (mV)
2.4
2.0
025632
VDD = 5.5V
V
SS
V
REF
–55125–35
= 0V
–1.01.03.0
REFERENCE INPUT VOLTAGE (V)
Figure 13. INL vs. Reference Input Voltage
VDD = +5V
V
SS
V
REF
6496128160192224
CODE (Decimal)
Figure 14. DNL vs. Code
= 5.45V
–15525456585105
TEMPERATURE (°C)
= –5V
= +2.5V
01114-013
01114-014
01114-015
Figure 12. INL vs. Code, All DAC Channels
Figure 15. Zero-Scale Voltage vs. Temperature
Rev. C | Page 10 of 20
AD7304/AD7305
V
OUT
V
REFIN
(±5V @
50kHz)
V
OUT
CS
VDD = 5V
= 4V
V
REF
DATA = 0x00 0xFF
0V
5V
0V
2µs/DIV
01114-016
Figure 16. Large-Signal Settling Time
DATA = 0xFF
A
+5V
0V
–5V
+5V
0V
–5V
NO LOAD
RL = 70kΩ
RL = 10kΩ
5µs/DIV
Figure 19. Time to Shutdown
V
C
V
DD
= 5V
DD
= 150pF
L
= 5V
CS
V
OUT
CS
I
DD
1mA/V
V
OUT
01114-019
2µs/DIV
Figure 17. Multiplying Mode Step Response and Output Slew Rate
6
4
0
GAIN (dB)
–4
–6
–8
10k10M
FREQUENCY (Hz)
f
–3dB
VDD = +5V
V
SS
DATA = 0xFF
V
REF
= 2.6MHz
1M100k
= –5V
= 100mV rms
Figure 18. Multiplying Mode Gain vs. Frequency
01114-017
01114-018
0.1
THD (%)
0.01
0.001
Figure 20. Shutdown Recovery Time (Wakeup)
10
1
10m101
23456789
V
AMPLITUDE (V p-p)
REF
Figure 21. THD vs. Reference Input Amplitude
VDD = +5V
= –5V
V
SS
01114-020
01114-021
Rev. C | Page 11 of 20
AD7304/AD7305
1
VDD = +5V
= –5V
V
SS
0.1
THD (%)
0.01
VDD = +5V
= –5V
V
SS
= +2.5V
V
REF
V
OUT
CS
F = 1MHz
DATA = 0x80 0x7F
0.001
20100k100
1k10k
FREQUENCY (Hz)
Figure 22. THD vs. Frequency
3.0
2.4
V/ Hz)
µ
1.8
1.2
NOISE DENSITY (
0.6
0
1100k10
1001k10k
FREQUENCY (Hz)
Figure 23. Output Noise Voltage Density vs. Frequency
VDD = +5V
= –5V
V
SS
V
= +4V
REF
DATA = 0xFF
01114-022
01114-023
40
20
0
–20
–40
–60
–80
CROSS TALK (dB)
–100
–120
–140
–160
10010M1k
60
50
Figure 25. Midscale Transition Glitch
VDD = +5V
V
= –5V
SS
V
= 50mV rms
REF
DAC A DATA = 0xFF
DAC B, DAC C, DAC D DATA = 0x00
10k1M
FREQUENCY (Hz)
100k
Figure 26. Cross talk vs. Frequency
–PSRR, VSS = –5V ±∆10%
+PSRR, VDD = +5V ±∆10%
CT = 20 LOG
01114-025
V
B
OUT
V
REF
01114-026
B
V
OUT
= +5V
V
DD
= –5V
V
SS
= +2.5V
V
REF
DAC A = 0xFF
DAC B = 0x00
F = 2MHz
CLK
50ns/DIV
50ns/DIV
01114-024
Figure 24. Digital Feedthrough
40
30
PSRR (dB)
20
10
0
10100
–PSRR, VSS = –3V ±∆10%
+PSRR, VDD = +3V ±∆10%
DATA = 0x80
T
A
1k100k
FREQUENCY (Hz)
10k
Figure 27. Power-Supply Rejection vs. Frequency
= +25°C
01114-027
Rev. C | Page 12 of 20
AD7304/AD7305
12
VDD = +5V
V
= –5V
10
8
SS
= +2.5V
V
REF
A0 = +5V
ALL OTHER DIGITAL
PINS VARYING
80
70
60
VDD = +5.5V
= –5.5V
V
SS
V
= +2.5V
REF
PIN A0 FLOATING
SUPPLY CURRENT (mA)
6
4
2
0
051
DIGITAL INPUT VOLTAGE (V)
I
DD
I
SS
234
Figure 28. Supply Current vs. Digital Input Voltage
10
1
VDD = +5V
V
0.1
0.01
SUPPLY CURRENT (mA)
0.001
0.0001
051
I
DD
I
SS
234
DIGITAL INPUT VOLTAGE (V)
= –5V
SS
= +2.5V
V
REF
ALL DIGITAL PINS VARY,
EXCEPT A0 = +5V
Figure 29. Shutdown Supply Current vs. Digital Input Voltage (A0 Only)
5.0
VDD = +5V
= –5V
V
SS
= +2.5V
V
4.4
REF
01114-028
01114-029
50
40
SHUTDOWN SUPPLY (µA)
30
20
–55125–35
–15525456585105
TEMPERATURE (°C)
Figure 31. Shutdown Supply Current vs. Temperature
0.08
READING MADE AT TA = +25°C
SAMPLE SIZE = 924 UNITS
0.04
VDD = +2.7V
0
ERROR DRIFT (LSB)
–0.04
NORMALIZED TOTAL UNADJUSTED
–0.08
084
VDD = +5.5V
168252336420504
TEMPERATURE (°C)
Figure 32. Normalized TUE Drift Accelerated by Burn-In Hours
of Operation @ 150°C
01114-031
01114-032
3.8
3.2
SUPPLY CURRENT (mA)
2.6
2.0
IDD AND I
–55125–35
–15525456585105
TEMPERATURE (°C)
Figure 30. Supply Current vs. Temperature
SS
01114-030
Rev. C | Page 13 of 20
AD7304/AD7305
CIRCUIT OPERATION
The AD7304/AD7305 are 4-channel, 8-bit, voltage output
DACs, differing primarily in digital logic interface and number
of reference inputs. Both parts share the same internal DAC
design and true rail-to-rail output buffers. The AD7304 contains
four independent multiplying reference inputs, while the
AD7305 has one common reference input. The AD7304 uses a
3-wire SPI-compatible serial data interface, while the AD7305
offers an 8-bit parallel data interface.
DAC SECTION
Each part contains four voltage-switched R-2R ladder DACs.
Figure 33 shows a typical equivalent DAC. These DACs are
designed to operate both single-supply or dual-supply,
depending on whether the user supplies a negative voltage on
pin. In a single-supply application, the VSS is tied to
the V
SS
ground. In either mode, the DAC output voltage is determined
by the V
the corresponding DAC register according to Equation 1.
Note that the output full-scale polarity is the same as the V
polarity for dc reference voltages.
input voltage and the digital data (D) loaded into
REF
= V
V
OUT
D/256 (1)
REF
V
DD
V
REF
Figure 33. Typical Equivalent DAC Channel
DB7
DB6
DB0
2R
R
V
2R
2R
SS
2R
V
OUT
01114-033
REF
These DACs are also designed to accommodate ac reference
input signals. As long as the ac signals are maintained between
< V
V
SS
< VDD, the user can expect 50 kHz of full power,
REF
multiplying bandwidth performance. In order to use negative
input reference voltages, the V
pin must be biased with a
SS
negative voltage of equal or greater magnitude than the
reference voltage.
The reference inputs are code dependent, exhibiting worst-case
minimum resistance values specified in the parametric specification table. The DAC outputs V
OUT
OUT
C, and V
OUT
OUT
D
A, V
B, V
are each capable of driving 2 kΩ loads in parallel with up to 500 pF
loads. Output sink current and source current are shown in
Figure 10 and Figure 11, respectively. The output slew rate is
nominally 3.6 V/µs while operating from ±5 V supplies. The
low output impedance of the buffers minimizes crosstalk
between analog input channels. At 100 kHz, 65 dB of channelto-channel isolation exists (Figure 26). Output voltage noise is
plotted in Figure 23. In order to maintain good analog performance, power supply bypassing of 0.01 µF in parallel with 1 µF is
recommended. The true rail-to-rail capability of the AD7304/AD7305
allows the user to connect the reference inputs directly to the
same supply as the V
or VSS pin (Figure 34). Under these
DD
conditions, clean power supply voltages (low ripple, avoid
switching supplies) appropriate for the application should be
used.
The AD7304 uses a 3-wire (CS, SDI, CLK) SPI-compatible
serial data interface. New serial data is clocked into the serial
input register in a 12-bit data-word format. MSB bits are loaded
first.
Table 5 defines the 12 data-word bits. Data is placed on the
SDI/SHDN pin and clocked into the register on the positive
clock edge of CLK subject to the data setup and data hold time
requirements specified in the Timing Specifications section.
Data can only be clocked in while the
active low. Only the last 12-bits clocked into the serial register
are interrogated when the
CS
pin returns to the logic high state,
extra data bits are ignored. Since most microcontrollers output
serial data in 8-bit bytes, two right-justified data bytes can be
written to the AD7304. Keeping the
first and second byte transfer results in a successful serial
register update.
Once the data is properly aligned in the shift register, the
positive edge of the
CS
initiates either the transfer of new data
to the target DAC register, determined by the decoding of
Address Bits A1 and A0, or the shutdown features is activated
based on the SAC or SDC bits. When either SAC or SDC pins
are set (Logic 0), the loading of new data determined by Bits B9
to B0 are still loaded, but the results do not appear on the buffer
outputs until the device is brought out of the shutdown state.
The selected DAC output voltages become high impedance with
a nominal resistance of 120 kΩ to ground, see Figure 34. If
both the SAC and SDC pins are set, all channels are still placed
in shutdown mode. When the AD7304 has been programmed
into the power shutdown state, the present DAC register data is
maintained as long as V
remains greater than 2.7 V. The
DD
remaining characteristics of the software serial interface are
defined by Table 4, Table 5, and Figure 5.
CLR
Two additional pins,
and
hardware control over the clear function and the DAC register
loading. If these functions are not needed, the
tied to logic high, and the
The asynchronous input
LDAC
CLR
pin forces all input and DAC
registers to the zero-code state. The asynchronous
can be strobed to active low when all DAC registers need to be
updated simultaneously from their respective input registers.
LDAC
The
pin places the DAC register in a transparent mode
while in the logic low state.
CS
chip select pin is
CS
line low between the
LDAC
, on the AD7304 provide
CLR
pin can be
pin can be tied to logic low.
LDAC
pin
V
CLK
SDI
A
V
B
C
REF
INPUT
INPUT
INPUT
INPUT
ON
V
REF
AD7304
R
REGISTER
R
R
REGISTER
R
LDAC
DAC A
REGISTER
DAC B
DAC C
REGISTER
DAC D
REF
CS
EN
D0
D1
D2
D3
8
D4
D5
D6
D7
2:4
A0
DECODE
A1
SDC
SAC
640kΩ 680kΩ
80kΩ
320kΩ
280kΩ
GND
DAC A
V
DD
B
C
D
REGISTER
DQ
REGISTER
DQ
REGISTER
DQ
REGISTER
DQ
POWER-
RESET
V
V
D
DD
REF
DAC A
R
DAC B
R
DAC C
R
DAC D
R
CLR
V
OUT
OE
V
OE
OUT
V
OE
OUT
V
OE
OUT
V
SS
Figure 35. AD7304 Equivalent Logic Interface
AD7304 HARDWARE SHUTDOWN SHDN
If a three-state driver is used on the SDI/SHDN pin, the
AD7304 can be placed into a power shutdown mode when the
SDI/ SHDN pin is placed in a high impedance state. For proper
operation, no other termination voltages should be present on
this pin. An internal window comparator detects when the logic
voltage on the SHDN pin is between 28% and 36% of V
DD
. A
high impedance internal bias generator provides this voltage on
the SHDN pin. The four DAC output voltages become high
impedance with a nominal resistance of 120 kΩ to ground (see
Figure 34 for an equivalent circuit).
AD7304/AD7305 POWER-ON RESET
When the VDD power supply is turned on, an internal reset
strobe forces all the input and DAC registers to the zero-code
state. The V
power supply should have a monotonically
DD
increasing ramp in order to have consistent results, especially in
the region of V
= 1.5 V to 2.3 V. The VSS supply has no effect
DD
on the power-on reset performance. The DAC register data
stays at zero until a valid serial register software load takes
place. In the case of the double-buffered AD7305, the output
DAC register can only be changed once the
LDAC
strobe is
initiated.
POWER-UP SEQUENCE
It is recommended to power VDD/VSS first before applying any
voltage to the reference terminals to avoid potential latch up.
The ideal power-up sequence is in the following order: GND,
, VSS, Digital Inputs, and V
V
DD
digital inputs and reference inputs is not important as long as
they are powered after V
DD/VSS
. The order of powering
REFx
.
A
B
C
D
01114-035
Rev. C | Page 15 of 20
AD7304/AD7305
L
AD7305 PARALLEL DATA INTERFACE
The AD7305 has an 8-bit parallel interface DB7 = MSB, DB0 =
LSB. Two address bits, A1 and A0, are decoded when an active
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-
ON
RESET
WR
pin, see Table 6. The WR
V
V
REF
DD
AD7305
DAC A
REGISTER
R
DAC B
REGISTER
R
DAC C
REGISTER
R
DAC D
REGISTER
R
DAC A
OE
R
DAC B
OE
R
DAC C
OE
R
DAC D
OE
R
V
OUT
V
OUT
V
OUT
V
OUT
low write strobe is placed on the
is a level-sensitive input pin, therefore, the data setup and data
hold times defined in the Timing Specifications section need to
be adhered to.
DATA
DB0–DB7
WR
A0/SHDN
A1
8
2:4
DECODE
640k
Ω
80kΩ
280k
Ω
DAC A
V
DD
680k
320k
B
C
D
Ω
Ω
LDAC
is tied to Logic Low, the DAC registers become
transparent and the input register data determines the DAC
output voltage (see Figure 36 for an equivalent interface logic
diagram).
AD7226 PIN COMPATIBILITY
By tying the
configuration and functionality as the AD7226, with the
exception of a lower power supply operating voltage.
LDAC
pin to ground, the AD7305 has the same pin
AD7305 HARDWARE SHUTDOWN SHDN
A
B
C
D
If a three-state driver is used on the A0/SHDN pin, the AD7305
can be placed into a power shutdown mode when the A0/SHDN
pin is placed in a high impedance state. For proper operation,
no other termination voltages should be present on this pin. An
internal window comparator detects when the logic voltage on
the SHDN pin is between 28% and 36% of V
. A high imped-
DD
ance, internal-bias generator provides this voltage on the SHDN
pin. The four DAC output voltages become high impedance
with a nominal resistance of 120 kΩ to ground.
ESD PROTECTION CIRCUITS
All logic input pins contain back-biased ESD protection Zeners
connected to ground (GND). The V
biased ESD protection Zener connected to V
pins also contain a back-
REF
(see Figure 37).
DD
GND
LDAC
V
SS
Figure 36. AD7305 Equivalent Logic Interface
LDAC
The
pin provides the capability of simultaneously
updating all DAC registers with new data from the input
registers at the same time. This results in the analog outputs all
changing to their new values at the same time. The
LDAC
pin is
a level-sensitive input. If the simultaneous update feature is not
required, the
LDAC
pin can be tied to logic low. When the
01114-036
DIGITA
INPUTS
V
DD
V
X
REF
GND
Figure 37. Equivalent ESD Protection Circuits
01114-037
Rev. C | Page 16 of 20
AD7304/AD7305
APPLICATIONS
The AD7304/AD7305 are inherently 2-quadrant multiplying
DACs. That is, they can easily be set up for unipolar output
operation. The full-scale output polarity is the same as the
reference input voltage polarity.
In some applications, it may be necessary to generate the full
4-quadrant multiplying capability or a bipolar output swing.
This is easily accomplished using an external true rail-to-rail op
amp, such as the OP295. Connecting the external amplifier with
two equal value resistors, as shown in Figure 38, results in a full
4-quadrant multiplying circuit. In this circuit, the amplifier
provides a gain of two, which increases the output span
magnitude to 10 V. The transfer equation of this circuit shows
that both negative and positive output voltages are created as
the input data (D) is incremented from code zero (V
to midscale (V
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.51 (0.0201)
0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-013AA
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Dimensions shown in millimeters and (inches)
9
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
8
10.00 (0.3937)
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
0.33 (0.0130)
0.20 (0.0079)
Wide Body (R-16)
8°
0°
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
× 45°
5.10
5.00
4.90
16
4.50
4.40
4.30
PIN 1
0.15
0.05
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
6.40
BSC
81
1.20
MAX
SEATING
PLANE
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
13.00 (0.5118)
12.60 (0.4961)
2011
1
0.30 (0.0118)
0.10 (0.0039)
1.27
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-013AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
(0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
7.60 (0.2992)
7.40 (0.2913)
10
2.65 (0.1043)
2.35 (0.0925)
SEATING
PLANE
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
0.75 (0.0295)
0.25 (0.0098)
8°
0°
× 45°
1.27 (0.0500)
0.40 (0.0157)
6.60
6.50
6.40
PIN 1
0.15
0.05
COPLANARITY
0.10
20
1
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153AC
1.20 MAX
11
10
SEATING
PLANE
4.50
4.40
4.30
6.40 BSC
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Rev. C | Page 18 of 20
AD7304/AD7305
ORDERING GUIDE
Model Temperature Range Package Description Package Options
AD7304BR –40°C to +85°C 16-Lead SOIC R-16
AD7304BR-REEL –40°C to +85°C 16-Lead SOIC R-16
AD7304BRZ
AD7304BRZ-REEL1 –40°C to +85°C 16-Lead SOIC R-16
AD7304YR –40°C to +125°C 16-Lead SOIC R-16
AD7304YRZ1 –40°C to +125°C 16-Lead SOIC R-16
AD7304BRU –40°C to +85°C 16-Lead TSSOP RU-16
AD7304BRU-REEL7 –40°C to +85°C 16-Lead TSSOP RU-16
AD7305BR –40°C to +85°C 20-Lead SOIC R-20
AD7305BR-REEL –40°C to +85°C 20-Lead SOIC R-20
AD7305YR –40°C to +125°C 20-Lead SOIC R-20
AD7305YR-REEL –40°C to +125°C 20-Lead SOIC R-20
AD7305BRU –40°C to +85°C 20-Lead TSSOP RU-20
AD7305BRU-REEL7 –40°C to +85°C 20-Lead TSSOP RU-20
AD7305BRUZ1 –40°C to +85°C 20-Lead TSSOP RU-20
AD7305BRUZ-REEL71 –40°C to +85°C 20-Lead TSSOP RU-20