Datasheet AD7304 Datasheet (Analog Devices)

3 V/5 V, Rail-to-Rail
A

FEATURES

Four 8-bit DACs in one package +3 V, +5 V, and ±5 V operation Rail-to-rail REF input to voltage output swing
2.6 MHz reference multiplying bandwidth Internal power-on reset SPI serial interface-compatible—AD7304 Fast parallel interface—AD7305 40 µA power shutdown

APPLICATIONS

Automotive output span voltage Instrumentation, digitally controlled calibration Pin-compatible AD7226 replacement when V

GENERAL DESCRIPTION

The AD7304/AD7305 a single +3 V to +5 V supply, or ±5 V supplies. The AD7304 has a serial interface, while the AD7305 has a parallel interface. Internal precision buffers swing rail-to-rail. The reference input range includes both supply rails, allowing for positive or negative full-scale output voltages. Operation is guaranteed over the supply voltage range of 2.7 V to 5.5 V, consuming less than 9 mW from a 3 V supply.
The full-scale voltage output is determined by the external reference input voltage applied. The rail-to-rail V DAC V supply, V
allows for a full-scale voltage set equal to the positive
OUT
, the negative supply, VSS, or any value in between.
DD
1
are quad, 8-bit DACs that operate from
< 5.5 V
DD
REF
input to
Quad, 8-Bit DAC
AD7304/AD7305

FUNCTIONAL BLOCK DIAGRAMS

B
8 8
DAC A
REG
8 8
DAC B
REG
8 8
DAC C
REG
DAC D
REG
LDAC
V
REF
V
REFCVREF
CS
SDI/SHDN
CLK
V
DD
PWR-ON
RESET
SERIAL
REG
V
SS
8
GND
INPUT REG A
INPUT
REG B
INPUT REG C
INPUT REG D
8 8
CLR
Figure 1.
DAC A
REG
DAC B
REG
DAC C
REG
DAC D
REG
LDAC
V
REF
DB0 DB1 DB2 DB3 DB4 DB5 DB6
WR
0/SHDN
V
DD
PWR-ON
RESET
8
8
DECODE
A1
INPUT REG A
INPUT
REG B
INPUT REG C
INPUT REG D
8 8
8 8
8 8
8 8
Figure 2.
When operating from less than 5.5 V, the AD7305 is pin-compatible with the popular industry-standard AD7226.
V
DAC A
DAC B
DAC C
DAC D
SS
V
REF
DAC A
DAC B
DAC C
DAC D
A
AD7304
D
AD7305
GND
V
OUT
V
OUT
V
OUT
V
OUT
01114-001
V
OUT
V
OUT
V
OUT
V
OUT
01114-002
A
B
C
D
A
B
C
D
The AD7304’s doubled-buffered serial data interface offers high speed, 3-wire, SPI®-, and microcontroller-compatible inputs using data in (SDI), clock (CLK), and chip select (
CS
) pins. Additionally, an internal power-on reset sets the output to zero scale.
The parallel input AD7305 uses a standard address decode
WR
along with the
control line to load data into the input
registers.
The double-buffered architecture allows all four input registers
LDAC
to be preloaded with new values, followed by an
control strobe that copies all the new data into the DAC registers, thereby updating the analog output values.
_______________________ ______________________________
1
Protected under Patent No. 5684481.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
An internal power-on reset places both parts in the zero-scale state at turn-on. A 40 µA power shutdown (SHDN) feature is activated on both parts by three-stating the SDI/SHDN pin on the AD7304 and three-stating the A0/SHDN address pin on the AD7305.
The AD7304/AD7305 are specified over the extended industrial
−40°C to +85°C and the automotive −40°C to +125°C temperature ranges. AD7304s are available in a wide-body 16-lead SOIC (R-16) package. The parallel input AD7305 is available in the wide-body 20-lead SOIC (R-20) surface-mount package. For ultracompact applications, the thin 1.1 mm, 16-lead TSSOP (RU-16) package is available for the AD7304, while the 20-lead TSSOP (RU-20) houses the AD7305.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
AD7304/AD7305
TABLE OF CONTENTS
Specifications..................................................................................... 3
Timing Specifications .................................................................. 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 8
Typical Performance Characteristics ........................................... 10
Circuit Operation ...........................................................................14
DAC Section................................................................................ 14
AD7304 Serial Data Interface ....................................................... 15
AD7304 Hardware Shutdown SHDN...................................... 15
Revision History
11/04—Data Sheet Changed from Rev. B to Rev. C
Update Format ....................................................................Universal
Update Features ................................................................................ 1
Changes to Figure 35...................................................................... 15
Add Power-Up Sequence............................................................... 15
Changes to Figure 36...................................................................... 16
Change to Figure 37 ....................................................................... 16
Updated Outline Dimensions....................................................... 18
AD7304/AD7305 Power-On Reset .......................................... 15
Power up sequence ..................................................................... 15
AD7305 Parallel Data Interface.................................................... 16
AD7226 Pin Compatibility ....................................................... 16
AD7305 Hardware Shutdown SHDN...................................... 16
ESD Protection Circuits ............................................................ 16
Applications..................................................................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 19
2/04—Data Sheet Changed from Rev. A to Rev. B
Renumber TPCs and Figures............................................Universal
Deleted N-16 and N-20 packages.....................................Universal
Changes to Absolute Maximum Ratings....................................... 3
Changes to Ordering Guide............................................................ 4
Updated Outline Dimensions....................................................... 14
3/98—Changed from Rev. 0 to Rev. A
2/98—Revision 0: Initial Version
Rev. C | Page 2 of 20
AD7304/AD7305

SPECIFICATIONS

@ VDD = 3 V or 5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, VSS ≤ V
Table 1.
Parameter Symbol Condition 3 V ± 10% 5 V ± 10% ±5 V ± 10% Unit
STATIC PERFORMANCE
Resolution
1
Integral Nonlinearity2 INL
N
Differential Nonlinearity DNL Monotonic, all codes 0 to 0xFF ±1 ±1 ±1 LSB max Zero-Scale Error V Full-Scale Voltage Error V Full-Scale Temperature
Coefficient
3
REFERENCE INPUT
V
Range V
REFIN
Input Resistance (AD7304) R Input Resistance (AD7305) R Input Capacitance
3
ANALOG OUTPUTS
Output Voltage Range V Output Current Drive I Shutdown Resistance R
Data = 0x00 15 15 ±15 mV max
ZSE
Data = 0xFF ±4 ±4 ±4 LSB max
FSE
TCV
FS
REFIN
REFIN
REFIN
C
REFIN
Code = 0x55 28 28 28 kΩ typ All DACs at code = 0x55 7.5 7.5 7.5 kΩ typ
OUT
Code = 0x80, ∆V
OUT
DAC outputs placed in shutdown
OUT
< 1 LSB ±3 ±3 ±3 mA typ
OUT
state
Capacitive Load
3
LOGIC INPUTS
Logic Input Low Voltage VIL Logic Input High Voltage VIH Input Leakage Current5 IIL Input Capacitance
AC CHARACTERISTICS
3
3
CL No oscillation 200 200 200 pF typ
CIL
Output Slew Rate SR Code = 0x00 to 0xFF to 0x00 1/2.7 1/3.6 1.0/3.6 V/µs min/typ Reference Multiplying BW Small signal, VSS = –5 V Total Harmonic Distortion THD V
= 4 V p-p, VSS = –5 V, f = 1 kHz
REF
Settling Time6 tS To ±0.1% of full scale 1.1/2 1.0/2 1.0/2 µs typ/max Shutdown Recovery Time t Time to Shutdown t
SDR
SDN
DAC Glitch Q Digital Feedthrough Q Feedthrough V
SUPPLY CHARACTERISTICS
OUT/VREF
Positive Supply Current IDD V
To ±0.1% of full scale 2 2 2 µs max
Code = 0x00, V
= 0 V or VDD, no load 6 6 6 mA max
LOGIC
= 1 V p-p, f = 100 kHz
REF
Negative Supply Current ISS VSS = –5 V Power Dissipation P Power Down I
V
DISS
SDI/SHDN = floating 40 40 40 µA typ
DD_SD
= 0 V or VDD, no load 15 30 60 mW max
LOGIC
Power Supply Sensitivity PSS ∆VDD = ±10% 0.004 0.004 0.004 %/%
1
One LSB = V
2
The first three codes (0x00, 0x01, 0x10) are excluded from the integral nonlinearity error measurement in single-supply operation 3 V or 5 V.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typical specifications represent average readings measured at 25°C.
5
The SDI/SHDN and A0/SHDN pins have a 30 µA maximum IIL input leakage current.
6
The settling time specification does not apply for negative going transitions within the last three LSBs of ground in single-supply operation.
REF
/256.
≤ VDD, −40°C < TA < +85°C/+125°C, unless otherwise noted.
REF
8 8 8 Bits ±1 ±1 ±1 LSB max
5 5 5 ppm/°C typ4
VSS/VDD VSS/VDD VSS/VDD V min/max
5 5 5 pF typ
VSS/VDD VSS/VDD VSS/VDD V min/max
120 120 120 kΩ typ
0.6 0.8 0.8 V min
2.1 2.4 2.4 V max ±10 ±10 ±10 µA max 8 8 8 pF max
2.6 MHz typ
0.025 %
15 15 15 µs typ 15 15 15 nVs typ 2 2 2 nVs typ
−65 dB
6 mA max
Rev. C | Page 3 of 20
AD7304/AD7305
+5V
= 10V p-p
V
REF
f = 20kHz
+5V
0V
0V
V
= 10V p-p
OUT
–5V
(OUT)
Figure 3. Rail-to-Rail Reference Input to Output at 20 kHz
–5V
(IN)
01114-003

TIMING SPECIFICATIONS

@ VDD = 3 V or 5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, VSS ≤ V
Table 2.
Parameter Symbol 3 V ± 10% 5 V ± 10% ±5 V ± 10% Unit INTERFACE TIMING SPECIFICATIONS AD7304 Only
1, 2
Clock Width High tCH 70 55 55 ns min Clock Width Low tCL 70 55 55 ns min Data Setup tDS 50 40 40 ns min Data Hold tDH 30 20 20 ns min Load Pulse Width t Load Setup t Load Hold t Clear Pulse Width t Select t Deselect t
AD7305 Only
70 60 60 ns min
LDW
40 30 30 ns min
LD1
40 30 30 ns min
LD2
60 60 60 ns min
CLWR
30 20 20 ns min
CSS
60 40 40 ns min
CSH
Data Setup tDS 60 40 40 ns min Data Hold tDH 30 20 20 ns min Address Setup tAS 60 40 40 ns min Address Hold tAH 30 20 20 ns min Write Width tWR 60 50 50 ns min Load Pulse Width t
60 50 50 ns min
LDW
Load Setup tLS 60 40 40 ns min Load Hold t
LH
1
These parameters are guaranteed by design and not subject to production testing.
2
All input control signals are specified with tR = tF = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
≤ VDD, –40°C < TA < +85°C/+125°C, unless otherwise noted.
REF
30 20 20 ns min
Rev. C | Page 4 of 20
AD7304/AD7305

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
VDD to GND
VSS to GND
V
to GND VSS, V
REFX
Logic Inputs to GND
V
to GND
OUTX
I
Short-Circuit to GND 50 mA
OUT
Package Power Dissipation
Thermal Resistance θ
JA
0.3 V, +8 V
+0.3 V, 8 V
DD
0.3 V, V
0.3 V, V
(T
J MAX
DD
DD
– TA)/θ
+ 0.3 V
+ 0.3 V
JA
16-Lead SOIC Package (R-16) 73°C/W 16-Lead TSSOP Package (RU-16) 180°C/W 20-Lead SOIC Package (R-20) 74°C/W
20-Lead TSSOP Package (RU-20) 155°C/W Maximum Junction Temperature (T Operating Temperature Range
Storage Temperature Range
Lead Temperature
) 150°C
J MAX
40°C to +85°C
65°C to +150°C
R-16, R-20, RU-16, RU-20 (Vapor Phase, 60 sec) 235°C
R-16, R-20, RU-16, RU-20 (Infrared, 15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 5 of 20
AD7304/AD7305
V
LDAC
LDAC
OUT
SDI
CLK
CS
SDI
CLK
CLR
SA SI A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
t
CSS
t
LD1
tDSt
t
CL
FS
ZS
DH
t
CH
t
LDW
t
S
Figure 4. AD7304 General Timing Diagram
t
CSH
±1 LSB
ERROR BAND
t
LD2
t
CLRW
t
S
01114-004
t
SDN
SDI/SHDN
I
DD
Figure 5. AD7304 Timing Diagram Zoom In
t
SDR
01114-005
Table 4. AD7304 Control Logic Truth Table
CS
1
CLK1
LDAC CLR
H X H H No effect No effect No effect L +
H H Data advanced 1 bit No effect No effect
+
L H H No effect Updated with SR contents2 No effect H X L H No effect H X H H X H
1
Serial Shift Register Function Input REG Function DAC Register Function
Latched with SR contents2
No effect Loaded with 0x00 Loaded with 0x00
No effect Latched with 0x00 Latched with 0x00
+
All input register contents transferred3
1
↑+ positive logic transition; – negative logic transition; X Don’t Care.
2
One input register receives the data bits D7–D0 decoded from the SR address bits (A1, A0), where REG A = (0, 0), B = (0, 1), C = (1, 0), and D = (1, 1).
3
LDAC
is a level-sensitive input.
Table 5. AD7304 Serial Input Register Data Format, Data is Loaded in MSB-First Format
MSB
B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1
LSB B0
AD7304 SAC SDC A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
If B11 (SAC), Shutdown All Channels, is set to logic low, all DACs are placed in a power shutdown mode, and all output voltages become high resistance. If B10 (SDC), Shutdown Decoded Channel, is set to logic low, only the DAC decoded by Address Bits A1 and A0 is placed in shutdown mode.
Rev. C | Page 6 of 20
AD7304/AD7305
Table 6. AD7305 Control Logic Truth Table
1
A1 A0
WR
L L L H Register A loaded with DB0 to DB7 Latched with previous contents, no change +
L L H Register A latched with DB0 to DB7 Latched with previous contents, no change L L H H Register B loaded with DB0 to DB7 Latched with previous contents, no change +
L H H Register B latched with DB0 to DB7 Latched with previous contents, no change L H L H Register C loaded with DB0 to DB7 Latched with previous contents, no change +
H L H Register C latched with DB0 to DB7 Latched with previous contents, no change L H H H Register D loaded with DB0 to DB7 Latched with previous contents, no change +
H H H Register D latched with DB0 to DB7 Latched with previous contents, no change H X X L No effect All input register contents loaded, register transparent L X X L Input register x transparent to DB0 to DB7 Register transparent H X X H X X H No effect, device not selected No effect, device not selected
1
+ positive logic transition; – negative logic transition; X don’t care.
2
LDAC
is a level-sensitive input.
LDAC
+
2
Input Register Function DAC Register Function
No effect All input register contents latched
A0/SHDN
I
A0, A1
D0–D7
LDAC
DD
t
WR
WR
t
t
AS
AH
t
t
DS
DH
t
LS
V
OUT
t
LH
t
S
Figure 6. AD7305 General Timing Diagram
t
SDN
Figure 7. AD7305 Timing Diagram Zoom In
t
LDW
±1 LSB
ERROR BAND
t
SDR
01114-006
01114-007
Rev. C | Page 7 of 20
AD7304/AD7305
V
V

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

OUT OUT
V
REF
V
REF
GND
LDAC
CLR
B A
V
SS
A B
1 2 3
AD7304
4
TOP VIEW
(Not to Scale)
5 6 7 8
16
V V
15
V
14
V
13
V
12 11
SDI/SHDN
10
CLK
9
CS
OUT OUT DD REF REF
C D
C D
01114-008
Figure 8. AD7304 Pin Configuration
Table 7. AD7304 Pin Function Descriptions
Pin No. Mnemonic Description
1 V
OUT
B
Channel B Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V Output is open circuit when SHDN is enabled.
2 V
OUT
A
Channel A Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V Output is open circuit when SHDN is enabled.
3 VSS
4 V 5 V
REF
REF
A Channel A Reference Input. Establishes V B Channel B Reference Input. Establishes V
Negative Power Supply Input. Specified range of operation is 0 V to 5.5 V.
full-scale voltage. Specified range of operation is VSS < V
OUTA
B full-scale voltage. Specified range of operation is VSS < V
OUT
6 GND Common Analog and Digital Ground. 7
LDAC Load DAC Register Strobe, Active Low. Simultaneously transfers data from all four input registers into the
corresponding DAC registers. Asynchronous active low input. DAC register is transparent when Table 4 for operation.
8
CLR Clears All Input and DAC Registers to the Zero Condition. Asynchronous active low input. The serial register is
not effected.
9
10 CLK 11 SDI/SHDN
CS Chip Select, Active Low Input. Disables shift register loading when high. Transfers serial input register data to
the decoded input register when
CS returns high. Does not effect LDAC operation. Clock Input, Positive Edge Clocks Data into Shift Register. Disabled by chip select Serial Data Input Loads Directly into the Shift Register, MSB First. Hardware shutdown (SHDN) control input,
active when pin is left floating by a three-state logic driver. Does not effect DAC register contents as long as
.
DD
full-scale voltage. Specified range of operation is VSS < V
OUTD
C full-scale voltage. Specified range of operation is VSS V
OUT
12 V 13 V
power is present on V
D Channel D Reference Input. Establishes V
REF
C Channel C Reference Input. Establishes V
REF
14 VDD Positive Power Supply Input. Specified range of operation is 2.7 V to 5.5 V. 15 V
OUT
D
Channel D Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V Output is open circuit when SHDN is enabled.
16 V
OUT
C
Channel C Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V Output is open circuit when SHDN is enabled.
CS.
B pin.
REF
A pin.
REF
A < VDD.
REF
B < VDD.
REF
LDAC = 0. See
D < VDD.
REF
C < VDD.
REF
D pin.
REF
C pin.
REF
Rev. C | Page 8 of 20
AD7304/AD7305
V
V
1
B
OUT
2
A
OUT
3
V
SS
AD7305
4
V
REF
GND
LDAC
DB7 DB6 DB5 DB4
(Not to Scale)
5
6
7
8
9
10
TOP VIEW
Figure 9. AD7305 Pin Configuration
Table 8. AD7305 Pin Function Description
Pin No. Mnemonic Description
1 V
OUT
B
Channel B Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V open circuit when SHDN is enabled.
2 V
OUT
A
Channel A Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled. 3 VSS Negative Power Supply Input. Specified range of operation is 0 V to –5.5 V. 4 V
Channel B Reference Input. Establishes V
REF
OUT
5 GND Common Analog and Digital Ground. 6
LDAC
Load DAC Register Strobe, Active Low. Simultaneously transfers data from all four input registers into the
corresponding DAC registers. Asynchronous active low input. DAC register is transparent when
for operation. 7 DB7 MSB Digital Input Data Bit. 8 DB6 Data Bit 6. 9 DB5 Data Bit 5. 10 DB4 Data Bit 4. 11 DB3 Data Bit 3. 12 DB2 Data Bit 2. 13 DB1 Data Bit 1. 14 DB0 LSB Digital Input Data Bit. 15
WR
Write Data into Input Register Control Line, Active Low. See Table 6 for operation. 16 A1 Address Bit 1.
17 A0/SHDN
Address Bit 0/Hardware Shutdown (SHDN) Control Input, Active When Pin Is Left Floating by a Three-State Logic
Driver. Does not effect DAC register contents as long as power is present on V 18 VDD Positive Power Supply Input. Specified range of operation is 2.7 V to 5.5 V. 19 V
OUT
D
Channel D Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled. 20 V
OUT
C
Channel C Rail-to-Rail Buffered DAC Voltage Output. Full-scale set by reference voltage applied to V
open circuit when SHDN is enabled.
20
C
V
OUT
19
D
V
OUT
18
V
DD
17
A0/SHDN
16
A1
15
WR
14
DB0
13
DB1
12
DB2
11
DB3
01114-009
full-scale voltage. Specified range of operation is VSS < V
LDAC = 0. See Table 6
.
DD
B pin. Output is
REF
A pin. Output is
REF
< VDD.
REF
D pin. Output is
REF
C pin. Output is
REF
Rev. C | Page 9 of 20
AD7304/AD7305

TYPICAL PERFORMANCE CHARACTERISTICS

144
VDD = +5V VSS = 5V
120
V
= V
REF
DD
DATA = 0x00
96
72
SINK CURRENT (mA)
48
OUT
I
24
INL (LSB)
1.0
0.6
0.2
–0.2
–0.6
VDD = +5V V
= –5V
SS
DATA = 0x80 T
= +25°C
A
DAC D
DAC B
DAC C
DAC A
0
015
3
Figure 10. I
–35
–28
–21
–14
SOURCE CURRENT (mA)
OUT
I
–7
0
4.0 5.04.2
INL (LSB)
Figure 11. I
+1
0 –1 +1
0 –1
+1
0 –1 +1
0 –1
0 25632
OUT
DAC A
DAC B
DAC C
DAC D
6912
V
(mV)
OUT
Sink vs. V
OUT
V
OUT
SOURCE vs. V
64 96 128 160 192 224
Rail-to-Rail Performance
OUT
VDD = +5V V
SS
V
REF
DATA = 0xFF
4.4 4.6 4.8
OUTPUT VOLTAGE (V)
Rail-to-Rail Performance
OUT
VDD = +5V V
SS
V
REF
T
A
CODE (Decimal)
= 5V
= V
= –5V
= +2.5V
= +25°C
DD
01114-010
01114-011
01114-012
–1.0
–5.0 5.0–3.0
0.500
0.375
0.250
0.125
0
DNL (LSB)
–0.125
–0.250
–0.375
–0.500
4.0
3.6
3.2
2.8
ZERO-SCALE VOLTAGE (mV)
2.4
2.0
0 25632
VDD = 5.5V V
SS
V
REF
–55 125–35
= 0V
–1.0 1.0 3.0
REFERENCE INPUT VOLTAGE (V)
Figure 13. INL vs. Reference Input Voltage
VDD = +5V V
SS
V
REF
64 96 128 160 192 224
CODE (Decimal)
Figure 14. DNL vs. Code
= 5.45V
–15 5 25 45 65 85 105
TEMPERATURE (°C)
= –5V
= +2.5V
01114-013
01114-014
01114-015
Figure 12. INL vs. Code, All DAC Channels
Figure 15. Zero-Scale Voltage vs. Temperature
Rev. C | Page 10 of 20
AD7304/AD7305
V
OUT
V
REFIN
(±5V @
50kHz)
V
OUT
CS
VDD = 5V
= 4V
V
REF
DATA = 0x00 0xFF
0V
5V
0V
2µs/DIV
01114-016
Figure 16. Large-Signal Settling Time
DATA = 0xFF
A
+5V
0V
5V
+5V
0V
5V
NO LOAD
RL = 70k
RL = 10k
5µs/DIV
Figure 19. Time to Shutdown
V C
V
DD
= 5V
DD
= 150pF
L
= 5V
CS
V
OUT
CS
I
DD
1mA/V
V
OUT
01114-019
2µs/DIV
Figure 17. Multiplying Mode Step Response and Output Slew Rate
6
4
0
GAIN (dB)
–4
–6
–8
10k 10M
FREQUENCY (Hz)
f
–3dB
VDD = +5V V
SS
DATA = 0xFF V
REF
= 2.6MHz
1M100k
= –5V
= 100mV rms
Figure 18. Multiplying Mode Gain vs. Frequency
01114-017
01114-018
0.1
THD (%)
0.01
0.001
Figure 20. Shutdown Recovery Time (Wakeup)
10
1
10m 101
23456789
V
AMPLITUDE (V p-p)
REF
Figure 21. THD vs. Reference Input Amplitude
VDD = +5V
= –5V
V
SS
01114-020
01114-021
Rev. C | Page 11 of 20
AD7304/AD7305
1
VDD = +5V
= –5V
V
SS
0.1
THD (%)
0.01
VDD = +5V
= 5V
V
SS
= +2.5V
V
REF
V
OUT
CS
F = 1MHz DATA = 0x80 0x7F
0.001 20 100k100
1k 10k
FREQUENCY (Hz)
Figure 22. THD vs. Frequency
3.0
2.4
V/ Hz)
µ
1.8
1.2
NOISE DENSITY (
0.6
0
1 100k10
100 1k 10k
FREQUENCY (Hz)
Figure 23. Output Noise Voltage Density vs. Frequency
VDD = +5V
= –5V
V
SS
V
= +4V
REF
DATA = 0xFF
01114-022
01114-023
40 20
0 –20
–40
–60
–80
CROSS TALK (dB)
–100
–120
–140 –160
100 10M1k
60
50
Figure 25. Midscale Transition Glitch
VDD = +5V V
= –5V
SS
V
= 50mV rms
REF
DAC A DATA = 0xFF DAC B, DAC C, DAC D DATA = 0x00
10k 1M
FREQUENCY (Hz)
100k
Figure 26. Cross talk vs. Frequency
–PSRR, VSS = –5V ±∆10%
+PSRR, VDD = +5V ±∆10%
CT = 20 LOG
01114-025
V
B
OUT
V
REF
01114-026
B
V
OUT
= +5V
V
DD
= 5V
V
SS
= +2.5V
V
REF
DAC A = 0xFF DAC B = 0x00 F = 2MHz
CLK
50ns/DIV
50ns/DIV
01114-024
Figure 24. Digital Feedthrough
40
30
PSRR (dB)
20
10
0
10 100
–PSRR, VSS = –3V ±∆10%
+PSRR, VDD = +3V ±∆10%
DATA = 0x80 T
A
1k 100k
FREQUENCY (Hz)
10k
Figure 27. Power-Supply Rejection vs. Frequency
= +25°C
01114-027
Rev. C | Page 12 of 20
AD7304/AD7305
12
VDD = +5V V
= –5V
10
8
SS
= +2.5V
V
REF
A0 = +5V ALL OTHER DIGITAL PINS VARYING
80
70
60
VDD = +5.5V
= –5.5V
V
SS
V
= +2.5V
REF
PIN A0 FLOATING
SUPPLY CURRENT (mA)
6
4
2
0
051
DIGITAL INPUT VOLTAGE (V)
I
DD
I
SS
234
Figure 28. Supply Current vs. Digital Input Voltage
10
1
VDD = +5V V
0.1
0.01
SUPPLY CURRENT (mA)
0.001
0.0001 051
I
DD
I
SS
234
DIGITAL INPUT VOLTAGE (V)
= –5V
SS
= +2.5V
V
REF
ALL DIGITAL PINS VARY, EXCEPT A0 = +5V
Figure 29. Shutdown Supply Current vs. Digital Input Voltage (A0 Only)
5.0 VDD = +5V
= –5V
V
SS
= +2.5V
V
4.4
REF
01114-028
01114-029
50
40
SHUTDOWN SUPPLY (µA)
30
20
–55 125–35
–15 5 25 45 65 85 105
TEMPERATURE (°C)
Figure 31. Shutdown Supply Current vs. Temperature
0.08 READING MADE AT TA = +25°C
SAMPLE SIZE = 924 UNITS
0.04
VDD = +2.7V
0
ERROR DRIFT (LSB)
–0.04
NORMALIZED TOTAL UNADJUSTED
–0.08
084
VDD = +5.5V
168 252 336 420 504
TEMPERATURE (°C)
Figure 32. Normalized TUE Drift Accelerated by Burn-In Hours
of Operation @ 150°C
01114-031
01114-032
3.8
3.2
SUPPLY CURRENT (mA)
2.6
2.0
IDD AND I
–55 125–35
–15 5 25 45 65 85 105
TEMPERATURE (°C)
Figure 30. Supply Current vs. Temperature
SS
01114-030
Rev. C | Page 13 of 20
AD7304/AD7305

CIRCUIT OPERATION

The AD7304/AD7305 are 4-channel, 8-bit, voltage output DACs, differing primarily in digital logic interface and number of reference inputs. Both parts share the same internal DAC design and true rail-to-rail output buffers. The AD7304 contains four independent multiplying reference inputs, while the AD7305 has one common reference input. The AD7304 uses a 3-wire SPI-compatible serial data interface, while the AD7305 offers an 8-bit parallel data interface.

DAC SECTION

Each part contains four voltage-switched R-2R ladder DACs. Figure 33 shows a typical equivalent DAC. These DACs are designed to operate both single-supply or dual-supply, depending on whether the user supplies a negative voltage on
pin. In a single-supply application, the VSS is tied to
the V
SS
ground. In either mode, the DAC output voltage is determined by the V the corresponding DAC register according to Equation 1.
Note that the output full-scale polarity is the same as the V polarity for dc reference voltages.
input voltage and the digital data (D) loaded into
REF
= V
V
OUT
D/256 (1)
REF
V
DD
V
REF
Figure 33. Typical Equivalent DAC Channel
DB7
DB6
DB0
2R
R
V
2R
2R
SS
2R
V
OUT
01114-033
REF
These DACs are also designed to accommodate ac reference input signals. As long as the ac signals are maintained between
< V
V
SS
< VDD, the user can expect 50 kHz of full power,
REF
multiplying bandwidth performance. In order to use negative input reference voltages, the V
pin must be biased with a
SS
negative voltage of equal or greater magnitude than the reference voltage.
The reference inputs are code dependent, exhibiting worst-case minimum resistance values specified in the parametric specifi­cation table. The DAC outputs V
OUT
OUT
C, and V
OUT
OUT
D
A, V
B, V are each capable of driving 2 kΩ loads in parallel with up to 500 pF loads. Output sink current and source current are shown in Figure 10 and Figure 11, respectively. The output slew rate is nominally 3.6 V/µs while operating from ±5 V supplies. The low output impedance of the buffers minimizes crosstalk between analog input channels. At 100 kHz, 65 dB of channel­to-channel isolation exists (Figure 26). Output voltage noise is plotted in Figure 23. In order to maintain good analog perform­ance, power supply bypassing of 0.01 µF in parallel with 1 µF is recommended. The true rail-to-rail capability of the AD7304/AD7305 allows the user to connect the reference inputs directly to the same supply as the V
or VSS pin (Figure 34). Under these
DD
conditions, clean power supply voltages (low ripple, avoid switching supplies) appropriate for the application should be used.
V
DD
Q1
V
X
120k
Q2
V
SS
Figure 34. Equivalent DAC Amplifier Output Circuit
OUT
01114-034
Rev. C | Page 14 of 20
AD7304/AD7305

AD7304 SERIAL DATA INTERFACE

The AD7304 uses a 3-wire (CS, SDI, CLK) SPI-compatible serial data interface. New serial data is clocked into the serial input register in a 12-bit data-word format. MSB bits are loaded first.
Table 5 defines the 12 data-word bits. Data is placed on the SDI/SHDN pin and clocked into the register on the positive clock edge of CLK subject to the data setup and data hold time requirements specified in the Timing Specifications section. Data can only be clocked in while the active low. Only the last 12-bits clocked into the serial register are interrogated when the
CS
pin returns to the logic high state, extra data bits are ignored. Since most microcontrollers output serial data in 8-bit bytes, two right-justified data bytes can be written to the AD7304. Keeping the first and second byte transfer results in a successful serial register update.
Once the data is properly aligned in the shift register, the positive edge of the
CS
initiates either the transfer of new data to the target DAC register, determined by the decoding of Address Bits A1 and A0, or the shutdown features is activated based on the SAC or SDC bits. When either SAC or SDC pins are set (Logic 0), the loading of new data determined by Bits B9 to B0 are still loaded, but the results do not appear on the buffer outputs until the device is brought out of the shutdown state. The selected DAC output voltages become high impedance with a nominal resistance of 120 kΩ to ground, see Figure 34. If both the SAC and SDC pins are set, all channels are still placed in shutdown mode. When the AD7304 has been programmed into the power shutdown state, the present DAC register data is maintained as long as V
remains greater than 2.7 V. The
DD
remaining characteristics of the software serial interface are defined by Table 4, Table 5, and Figure 5.
CLR
Two additional pins,
and hardware control over the clear function and the DAC register loading. If these functions are not needed, the tied to logic high, and the The asynchronous input
LDAC
CLR
pin forces all input and DAC registers to the zero-code state. The asynchronous can be strobed to active low when all DAC registers need to be updated simultaneously from their respective input registers.
LDAC
The
pin places the DAC register in a transparent mode
while in the logic low state.
CS
chip select pin is
CS
line low between the
LDAC
, on the AD7304 provide
CLR
pin can be
pin can be tied to logic low.
LDAC
pin
V
CLK
SDI
A
V
B
C
REF
INPUT
INPUT
INPUT
INPUT
ON
V
REF
AD7304
R
REGISTER
R
R
REGISTER
R
LDAC
DAC A
REGISTER
DAC B
DAC C
REGISTER
DAC D
REF
CS
EN
D0 D1 D2 D3
8 D4 D5 D6 D7
2:4
A0
DECODE
A1
SDC SAC
640k680k
80k
320k
280k
GND
DAC A
V
DD
B C D
REGISTER
DQ
REGISTER
DQ
REGISTER
DQ
REGISTER
DQ
POWER-
RESET
V
V
D
DD
REF
DAC A
R
DAC B
R
DAC C
R
DAC D
R
CLR
V
OUT
OE
V
OE
OUT
V
OE
OUT
V
OE
OUT
V
SS
Figure 35. AD7304 Equivalent Logic Interface

AD7304 HARDWARE SHUTDOWN SHDN

If a three-state driver is used on the SDI/SHDN pin, the AD7304 can be placed into a power shutdown mode when the SDI/ SHDN pin is placed in a high impedance state. For proper operation, no other termination voltages should be present on this pin. An internal window comparator detects when the logic voltage on the SHDN pin is between 28% and 36% of V
DD
. A high impedance internal bias generator provides this voltage on the SHDN pin. The four DAC output voltages become high impedance with a nominal resistance of 120 kΩ to ground (see Figure 34 for an equivalent circuit).

AD7304/AD7305 POWER-ON RESET

When the VDD power supply is turned on, an internal reset strobe forces all the input and DAC registers to the zero-code state. The V
power supply should have a monotonically
DD
increasing ramp in order to have consistent results, especially in the region of V
= 1.5 V to 2.3 V. The VSS supply has no effect
DD
on the power-on reset performance. The DAC register data stays at zero until a valid serial register software load takes place. In the case of the double-buffered AD7305, the output DAC register can only be changed once the
LDAC
strobe is
initiated.

POWER-UP SEQUENCE

It is recommended to power VDD/VSS first before applying any voltage to the reference terminals to avoid potential latch up. The ideal power-up sequence is in the following order: GND,
, VSS, Digital Inputs, and V
V
DD
digital inputs and reference inputs is not important as long as they are powered after V
DD/VSS
. The order of powering
REFx
.
A
B
C
D
01114-035
Rev. C | Page 15 of 20
AD7304/AD7305
L

AD7305 PARALLEL DATA INTERFACE

The AD7305 has an 8-bit parallel interface DB7 = MSB, DB0 = LSB. Two address bits, A1 and A0, are decoded when an active
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-
ON
RESET
WR
pin, see Table 6. The WR
V
V
REF
DD
AD7305
DAC A
REGISTER
R
DAC B
REGISTER
R
DAC C
REGISTER
R
DAC D
REGISTER
R
DAC A
OE
R
DAC B
OE
R
DAC C
OE
R
DAC D
OE
R
V
OUT
V
OUT
V
OUT
V
OUT
low write strobe is placed on the is a level-sensitive input pin, therefore, the data setup and data hold times defined in the Timing Specifications section need to be adhered to.
DATA
DB0–DB7
WR
A0/SHDN
A1
8
2:4 DECODE
640k
80k
280k
DAC A
V
DD
680k
320k
B C D
LDAC
is tied to Logic Low, the DAC registers become transparent and the input register data determines the DAC output voltage (see Figure 36 for an equivalent interface logic diagram).

AD7226 PIN COMPATIBILITY

By tying the configuration and functionality as the AD7226, with the exception of a lower power supply operating voltage.
LDAC
pin to ground, the AD7305 has the same pin

AD7305 HARDWARE SHUTDOWN SHDN

A
B
C
D
If a three-state driver is used on the A0/SHDN pin, the AD7305 can be placed into a power shutdown mode when the A0/SHDN pin is placed in a high impedance state. For proper operation, no other termination voltages should be present on this pin. An internal window comparator detects when the logic voltage on the SHDN pin is between 28% and 36% of V
. A high imped-
DD
ance, internal-bias generator provides this voltage on the SHDN pin. The four DAC output voltages become high impedance with a nominal resistance of 120 kΩ to ground.

ESD PROTECTION CIRCUITS

All logic input pins contain back-biased ESD protection Zeners connected to ground (GND). The V biased ESD protection Zener connected to V
pins also contain a back-
REF
(see Figure 37).
DD
GND
LDAC
V
SS
Figure 36. AD7305 Equivalent Logic Interface
LDAC
The
pin provides the capability of simultaneously updating all DAC registers with new data from the input registers at the same time. This results in the analog outputs all changing to their new values at the same time. The
LDAC
pin is a level-sensitive input. If the simultaneous update feature is not required, the
LDAC
pin can be tied to logic low. When the
01114-036
DIGITA INPUTS
V
DD
V
X
REF
GND
Figure 37. Equivalent ESD Protection Circuits
01114-037
Rev. C | Page 16 of 20
AD7304/AD7305

APPLICATIONS

The AD7304/AD7305 are inherently 2-quadrant multiplying DACs. That is, they can easily be set up for unipolar output operation. The full-scale output polarity is the same as the reference input voltage polarity.
In some applications, it may be necessary to generate the full 4-quadrant multiplying capability or a bipolar output swing. This is easily accomplished using an external true rail-to-rail op amp, such as the OP295. Connecting the external amplifier with two equal value resistors, as shown in Figure 38, results in a full 4-quadrant multiplying circuit. In this circuit, the amplifier provides a gain of two, which increases the output span magnitude to 10 V. The transfer equation of this circuit shows that both negative and positive output voltages are created as
the input data (D) is incremented from code zero (V to midscale (V
V ×
=
+5V
REF
Figure 38. 4-Quadrant Multiplying Application Circuit
= 0 V) to full scale (V
OUT
D
1128
10k 10k
AD7304
(2)
V
REFOUT
2.2pF
OUT
–5V < V
= +5 V).
< +5V
OUT
= –5 V)
OUT
01114-038
Rev. C | Page 17 of 20
AD7304/AD7305

OUTLINE DIMENSIONS

10.50 (0.4134)
10.10 (0.3976)
16
1
1.27 (0.0500) BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.51 (0.0201)
0.31 (0.0122)
COMPLIANT TO JEDEC STANDARDS MS-013AA
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Dimensions shown in millimeters and (inches)
9
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
8
10.00 (0.3937)
2.65 (0.1043)
2.35 (0.0925)
SEATING PLANE
0.33 (0.0130)
0.20 (0.0079)
Wide Body (R-16)
8° 0°
0.75 (0.0295)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
× 45°
5.10
5.00
4.90
16
4.50
4.40
4.30
PIN 1
0.15
0.05
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
6.40
BSC
81
1.20 MAX
SEATING PLANE
0.20
0.09 8°
0.75
0.60
0.45
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
13.00 (0.5118)
12.60 (0.4961)
20 11
1
0.30 (0.0118)
0.10 (0.0039)
1.27
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MS-013AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
(0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
7.60 (0.2992)
7.40 (0.2913)
10
2.65 (0.1043)
2.35 (0.0925)
SEATING PLANE
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
0.75 (0.0295)
0.25 (0.0098)
8° 0°
× 45°
1.27 (0.0500)
0.40 (0.0157)
6.60
6.50
6.40
PIN 1
0.15
0.05
COPLANARITY
0.10
20
1
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153AC
1.20 MAX
11
10
SEATING PLANE
4.50
4.40
4.30
6.40 BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Rev. C | Page 18 of 20
AD7304/AD7305

ORDERING GUIDE

Model Temperature Range Package Description Package Options
AD7304BR –40°C to +85°C 16-Lead SOIC R-16 AD7304BR-REEL –40°C to +85°C 16-Lead SOIC R-16 AD7304BRZ AD7304BRZ-REEL1 –40°C to +85°C 16-Lead SOIC R-16 AD7304YR –40°C to +125°C 16-Lead SOIC R-16 AD7304YRZ1 –40°C to +125°C 16-Lead SOIC R-16 AD7304BRU –40°C to +85°C 16-Lead TSSOP RU-16 AD7304BRU-REEL7 –40°C to +85°C 16-Lead TSSOP RU-16 AD7305BR –40°C to +85°C 20-Lead SOIC R-20 AD7305BR-REEL –40°C to +85°C 20-Lead SOIC R-20 AD7305YR –40°C to +125°C 20-Lead SOIC R-20 AD7305YR-REEL –40°C to +125°C 20-Lead SOIC R-20 AD7305BRU –40°C to +85°C 20-Lead TSSOP RU-20 AD7305BRU-REEL7 –40°C to +85°C 20-Lead TSSOP RU-20 AD7305BRUZ1 –40°C to +85°C 20-Lead TSSOP RU-20 AD7305BRUZ-REEL71 –40°C to +85°C 20-Lead TSSOP RU-20
1
Z = Pb-free part.
1
–40°C to +85°C 16-Lead SOIC R-16
Rev. C | Page 19 of 20
AD7304/AD7305
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective companies. Printed in the U.S.A.
C01114-0-11/04(C)
Rev. C | Page 20 of 20
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