IF sampling frequencies to 450 MHz
Internal ADC voltage reference
Integrated ADC sample-and-hold inputs
Flexible analog input range: 1 V p-p to 2 V p-p
ADC clock duty cycle stabilizer
95 dB channel isolation/crosstalk
Integrated wideband digital downconverter (DDC)
32-bit, complex, numerically controlled oscillator (NCO)
Decimating half-band filter and FIR filter
Supports real and complex output modes
Fast attack/threshold detect bits
Composite signal monitor
Energy-saving power-down modes
FUNCTIONAL BLOCK DIAGRAM
AVDDFD[0:3]
AD6653
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers (3G)
TD-SCDMA, WiMax, WCDMA,
CDMA20
I/Q demodulation systems
Smart antenna systems
General-purpose software radios
Broadband data applications
ast overrange detect and signal monitor with serial output.
roprietary differential input maintains excellent SNR
performance for input frequencies up to 450 MHz.
lexible output modes, including independent CMOS,
interleaved CMOS, IQ mode CMOS, and interleaved LVDS.
YNC input allows synchronization of multiple devices.
-bit SPI port for register programming and register readback.
DVDDDRVDD
FD BITS/T HRESHOLD
DETECT
VIN+A
VINβA
VREF
SENSE
CML
RBIAS
VINβB
VIN+B
NOTES
1. PIN NAMES ARE FOR THE CMO S PIN CONF IGURATIO N ONLY; SEE FIGURE 10 FOR LVDS PIN NAMES.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The AD6653 is a mixed-signal intermediate frequency (IF) receiver
consisting of dual, 12-bit, 125 MSPS/150 MSPS ADCs and a wideΒband digital downconverter (DDC). The AD6653 is designed to
support communications applications where low cost, small size,
and versatility are desired.
The dual ADC core features a multistage, differential pipelined
a
rchitecture with integrated output error correction logic. Each
ADC features wide bandwidth differential sample-and-hold
analog input amplifiers supporting a variety of user-selectable
input ranges. An integrated voltage reference eases design
considerations. A duty cycle stabilizer is provided to compenΒsate for variations in the ADC clock duty cycle, allowing the
converters to maintain excellent performance.
ADC data outputs are internally connected directly to the
tal downconverter (DDC) of the receiver, simplifying layout
digi
and reducing interconnection parasitics. The digital receiver has
two channels and provides processing flexibility. Each receive
channel has four cascaded signal processing stages: a 32-bit
frequency translator (numerically controlled oscillator (NCO)),
a decimating half-band filter, a fixed FIR filter, and an f
fixed-frequency NCO.
In addition to the receiver, DDC, the AD6653 has several functions
tha
t simplify the automatic gain control (AGC) function in the
system receiver. The fast detect feature allows fast overrange
detection by outputting four bits of input level information with
short latency.
ADC
/8
In addition, the programmable threshold detector allows
itoring of the incoming signal power using the four fast
mon
detect bits of the ADC with low latency. If the input signal level
exceeds the programmable threshold, the coarse upper threshold
indicator goes high. Because this threshold indicator has low
latency, the user can quickly turn down the system gain to avoid
an overrange condition.
The second AGC-related function is the signal monitor. This block
lows the user to monitor the composite magnitude of the
al
incoming signal, which aids in setting the gain to optimize the
dynamic range of the overall system.
After digital processing, data can be routed directly to the two
e
xternal 12-bit output ports. These outputs can be set from 1.8 V
to 3.3 V CMOS or as 1.8 V LVDS. The CMOS data can also be
output in an interleaved configuration at a double data rate,
using only Port A.
The AD6653 receiver digitizes a wide spectrum of IF frequencies.
ach receiver is designed for simultaneous reception of the main
E
channel and the diversity channel. This IF sampling architecture
greatly reduces component cost and complexity compared with
traditional analog techniques or less integrated digital methods.
Flexible power-down options allow significant power savings,
when desired.
Programming for setup and control is accomplished using a 3-bit
PI-compatible serial interface.
S
The AD6653 is available in a 64-lead LFCSP and is specified over
t
he industrial temperature range of β40Β°C to +85Β°C.
AVDD, DVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD (CMOS Mode) Full 1.7 3.3 3.6 1.7 3.3 3.6 V
DRVDD (LVDS Mode) Full 1.7 1.8 1.9 1.7 1.8 1.9 V
Supply Current
2, 3
I
AVDD
2, 3
I
DVDD
2
I
(3.3 V CMOS) Full 20 24 mA
DRVDD
2
I
(1.8 V CMOS) Full 12 15 mA
DRVDD
2
I
(1.8 V LVDS) Full 57 57 mA
DRVDD
Full 390 440 mA
Full 270
689
320
785
POWER CONSUMPTION
DC Input Full 770 800 870 905 mW
Sine Wave Input2 (DRVDD = 1.8 V) Full 1215 1395 mW
Sine Wave Input2 (DRVDD = 3.3 V) Full 1275 1450 mW
Standby Power
4
Full 77 77 mW
Power-Down Power Full 2.5 8 2.5 8 mW
1
Input capacitance refers to the effective capacitance between one differential input pin and AGND. See Figure 11 for the equivalent analog input structure.
2
Measured with a 9.7 MHz, full-scale sine wave input, NCO enabled with a frequency of 13 MHz, FIR filter enabled and the fS/8 output mix enabled with approximately
5 pF loading on each output bit.
3
The maximum limit applies to the combination of I
4
Standby power is measured with a dc input and with the CLK pin inactive (set to AVDD or AGND).
Data Propagation Delay (tPD)2 Full 1.6 3.9 6.2 1.6 3.9 6.2 ns
DCO Propagation Delay (t
Setup Time (tS) Full 9.5 8.16 ns
Hold Time (tH) Full 6.5 5.16 ns
CMOS Noninterleaved ModeβDRVDD = 3.3 V
Data Propagation Delay (tPD)2 Full 1.9 4.1 6.4 1.9 4.1 6.4 ns
DCO Propagation Delay (t
Setup Time (tS) Full 9.7 8.36 ns
Hold Time (tH) Full 6.3 4.96 ns
CMOS Interleaved and IQ ModeβDRVDD = 1.8 V
Data Propagation Delay (tPD)2 Full 1.6 3.9 6.2 1.6 3.9 6.2 ns
DCO Propagation Delay (t
Setup Time (tS) Full 4.9 4.23 ns
Hold Time (tH) Full 3.1 2.43 ns
CMOS Interleaved and IQ ModeβDRVDD = 3.3 V
Data Propagation Delay (tPD) 2 Full 1.9 4.1 6.4 1.9 4.1 6.4 ns
DCO Propagation Delay (t
Setup Time (tS) Full 5.1 4.43 ns
Hold Time (tH) Full 2.9 2.23 ns
LVDS ModeβDRVDD = 1.8 V
Data Propagation Delay (tPD)2 Full 2.5 4.8 7.0 2.5 4.8 7.0 ns
DCO Propagation Delay (t
Pipeline Delay (Latency) NCO, FIR, fS/8 Mix Disabled Full 38 38 Cycles
Pipeline Delay (Latency) NCO Enabled; FIR and fS/8
Mix Disabled (Complex Output Mode)
Pipeline Delay (Latency) NCO, FIR Filter, and fS/8 Mix
Enabled
Aperture Delay (tA) Full 1.0 1.0 ns
Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 ps rms
Wake-Up Time3 Full 350 350 ΞΌs
OUT-OF-RANGE RECOVERY TIME Full 44 44 Cycles
1
Conversion rate is the clock rate after the divider.
2
Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with a 5 pF load.
3
Wake-up time is dependent on the value of the decoupling capacitors.
)
CLKH
) Full 8 6.66 ns
CLK
Full 0.8 0.8 ns
) Full 4.0 5.4 7.3 4.0 5.4 7.3 ns
DCO
) Full 4.4 5.8 7.7 4.4 5.8 7.7 ns
DCO
) Full 3.4 4.8 6.7 3.4 4.8 6.7 ns
DCO
) Full 3.8 5.2 7.1 3.8 5.2 7.1 ns
DCO
) Full 3.7 5.3 7.3 3.7 5.3 7.3 ns
DCO
Full 38 38 Cycles
Full 109 109 Cycles
Min Typ Max Min Typ Max
Unit
Rev. 0 | Page 9 of 80
AD6653
www.BDTIC.com/ADI
TIMING SPECIFICATIONS
Table 5.
Parameter Conditions Min Typ Max Unit
SYNC TIMING REQUIREMENTS
t
SYNC to the rising edge of CLK setup time 0.24 ns
SSYNC
t
SYNC to the rising edge of CLK hold time 0.4 ns
HSYNC
SPI TIMING REQUIREMENTS
tDS Setup time between the data and the rising edge of SCLK 2 ns
tDH Hold time between the data and the rising edge of SCLK 2 ns
t
Period of the SCLK 40 ns
CLK
tS Setup time between CSB and SCLK 2 ns
tH Hold time between CSB and SCLK 2 ns
t
Minimum period that SCLK should be in a logic high state 10 ns
HIGH
t
Minimum period that SCLK should be in a logic low state 10 ns
LOW
t
EN_SDIO
Time required for the SDIO pin to swit
ch from an input to an output
relative to the SCLK falling edge
t
DIS_SDIO
Time required for the SDIO pin to switch from an output to an input
elative to the SCLK rising edge
r
SPORT TIMING REQUIREMENTS
t
Delay from rising edge of CLK+ to rising edge of SMI SCLK 3.2 4.5 6.2 ns
CSSCLK
t
Delay from rising edge of SMI SCLK to SMI SDO β0.4 0 +0.4 ns
SSLKSDO
t
Delay from rising edge of SMI SCLK to SMI SDFS β0.4 0 +0.4 ns
SSCLKSDFS
Timing Diagrams
10 ns
10 ns
CLK+
t
PD
FD BITS
t
CHANNEL A/B
DATA BITS
S
DECIMATED
CMOS DAT A
DECIMATED
FD DATA
DECIMATED
DCOA/DCOB
CHANNEL A/B
FD BITS
CHANNEL A/B
Figure 2. Decimated Noninterleaved CMOS Mode D
CLK+
t
PD
DECIMATED
CMOS DATA
DECIMATED
FD DATA
DECIMATED
DCOA/DCOB
Figure 3. Decimated Noninterleaved CMOS Mode Data and Fast Detect Out
CHANNEL A/B
CHANNEL A/B
t
S
DATA BITS
FD BITS
t
DCO
CHANNEL A/B
FD BITS
t
H
CHANNEL A/B
CHANNEL A/B
FD BITS
DATA BIT S
CHANNEL A/B
FD BITS
CHANNEL A/B
CHANNEL A/B
FD BITS
DATA BIT S
ata and Fast Detect Output Timing (Fast Detect Mode Select Bits = 000)
t
DCO
CHANNEL A/B
DATA BITS
CHANNEL A/B
FD BITS
t
H
CHANNEL A/B
DATA BITS
CHANNEL A/B
FD BITS
put Timing (Fast Detect Mode Select Bits = 001 Through Fast Detect Mode Select Bits = 100)
06708-109
06708-002
Rev. 0 | Page 10 of 80
AD6653
www.BDTIC.com/ADI
CLK+
t
PD
t
DCO
OUTPUT DATA
DECIMATED
INTERLEAVED
CMOS DATA
DECIMATED
INTERLEAVED
FD DATA
DECIMATED
DCO
CLK+
DECIMAT ED
CMOS IQ
CMOS FD
DATA
DECIMAT ED
DCOA/DCOB
CLKβ
CHANNEL A:
DATA
CHANNEL A:
FD BITS
CHANNEL A/B:
Q DATA
CHANNEL A/B:
FD BITS
CHANNEL B:
DATA
CHANNEL B:
FD BITS
Figure 4. Decimated Interleaved CMO
t
PD
CHANNEL A/B:
I DATA
CHANNEL A/B:
FD BITS
t
S
t
H
CHANNEL A:
DATA
CHANNEL A:
FD BITS
t
S
CHANNEL A/B:
Q DATA
CHANNEL A/B:
FD BITS
CHANNEL B:
DATA
CHANNEL B:
FD BITS
t
H
S Mode Data and Fast Detect Output Timing
t
DCO
CHANNEL A/B:
I DATA
CHANNEL A/B:
FD BITS
Figure 5. Decimated IQ Mode CMOS Data and Fast Detect Output Timing
CHANNEL A:
DATA
CHANNEL A:
FD BITS
CHANNEL A/B:
Q DATA
CHANNEL A/B:
FD BITS
CHANNEL B:
DATA
CHANNEL B:
FD BITS
CHANNEL A/ B:
I DATA
CHANNEL A/ B:
FD BITS
06708-003
06708-004
CLK+
LVDS
DATA
LVDS
FAST DET
DCOβ
DCO+
t
PD
CHANNEL A:
DATA
CHANNEL A:
FD
Figure 6. Decimated Interleaved
CHANNEL B:
DATA
CHANNEL B:
FD
CHANNEL A:
DATA
CHANNEL A:
FD
t
DCO
CHANNEL B:
DATA
CHANNEL B:
FD
LVDS Mode Data and Fast Detect Output Timing
CHANNEL A:
DATA
CHANNEL A:
FD
06708-005
CLK+
SYNC
t
SSYNC
t
HSYNC
06708-006
Figure 7. SYNC Timing Inputs
Rev. 0 | Page 11 of 80
AD6653
S
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CLK+
CLKβ
MI SCLK
SMI SDFS
SMI SDO
t
CSSCLK
t
SSCLKSDFS
Figure 8. Signal Monitor SPORT
t
SSCLKSDFS
Output Timing
DATADATA
06708-007
Rev. 0 | Page 12 of 80
AD6653
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
ELECTRICAL
AVDD, DVDD to AGND β0.3 V to +2.0 V
DRVDD to DRGND β0.3 V to +3.9 V
AGND to DRGND β0.3 V to +0.3 V
VIN+A/VIN+B, VINβA/VINβB to AGND β0.3 V to AVDD + 0.2 V
CLK+, CLKβ to AGND β0.3 V to +3.9 V
SYNC to AGND β0.3 V to +3.9 V
VREF to AGND β0.3 V to AVDD + 0.2 V
SENSE to AGND β0.3 V to AVDD + 0.2 V
CML to AGND β0.3 V to AVDD + 0.2 V
RBIAS to AGND β0.3 V to AVDD + 0.2 V
CSB to AGND β0.3 V to +3.9 V
SCLK/DFS to DRGND β0.3 V to +3.9 V
SDIO/DCS to DRGND β0.3 V to DRVDD + 0.3 V
SMI SDO/OEB to DRGND β0.3 V to DRVDD + 0.3 V
SMI SCLK/PDWN to DRGND β0.3 V to DRVDD + 0.3 V
SMI SDFS to DRGND β0.3 V to DRVDD + 0.3 V
D0A/D0B through D11A/D11B
to DRGND
FD0A/FD0B through FD3A/FD3B
to DRGND
DCOA/DCOB to DRGND β0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
β0.3 V to DRVDD + 0.3 V
β0.3 V to DRVDD + 0.3 V
β40Β°C to +85Β°C
150Β°C
β65Β°C to +125Β°C
Stresses above those listed under Absolute Maximum Ratings
y cause permanent damage to the device. This is a stress
ma
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
Package
Typ e
64-Lead LFCSP
9 mm Γ 9 mm
(CP-64-3)
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Ve
lo city
(m/s) ΞΈ
0 18.8 0.6 6.0 Β°C/W
1.0 16.5 Β°C/W
2.0 15.8 Β°C/W
1, 2
JA
1, 3
ΞΈ
JC
1, 4
ΞΈ
Unit
JB
Typical ΞΈJA is specified for a 4-layer PCB with a solid ground
plane. As shown, airflow increases heat dissipation, which
reduces ΞΈ
. In addition, metal in direct contact with the
JA
package leads from metal traces, through holes, ground, and
power planes, reduces the ΞΈ
Table 8. Pin Function Descriptions (Parallel CMOS Mode)
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
12, 13, 58, 59 DNC Do Not Connect.
ADC Analog
37 VIN+A Input Differential Analog Input Pin (+) for Channel A.
38 VINβA Input Differential Analog Input Pin (β) for Channel A.
44 VIN+B Input Differential Analog Input Pin (+) for Channel B.
43 VINβB Input Differential Analog Input Pin (β) for Channel B.
39 VREF Input/Output Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select. See Table 11 for details.
42 RBIAS Input/Output External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input ADC Clock InputβTrue.
50 CLKβ Input ADC Clock InputβComplement.
ADC Fast Detect Outputs
29 FD0A Output Channel A Fast Detect Indicator. See Ta ble 17 for details.
30 FD1A Output Channel A Fast Detect Indicator. See Ta ble 17 for details.
31 FD2A Output Channel A Fast Detect Indicator. See Ta ble 17 for details.
32 FD3A Output Channel A Fast Detect Indicator. See Ta ble 17 for details.
53 FD0B Output Channel B Fast Detect Indicator. See Table 17 for details.
54 FD1B Output Channel B Fast Detect Indicator. See Table 17 for details.
55 FD2B Output Channel B Fast Detect Indicator. See Table 17 for details.
56 FD3B Output Channel B Fast Detect Indicator. See Table 17 for details.
Rev. 0 | Page 14 of 80
AD6653
www.BDTIC.com/ADI
Pin No. Mnemonic Type Description
Digital Inputs
52 SYNC Input Digital Synchronization Pin. Slave mode only.
Digital Outputs
14 D0A (LSB) Output Channel A CMOS Output Data.
15 D1A Output Channel A CMOS Output Data.
16 D2A Output Channel A CMOS Output Data.
17 D3A Output Channel A CMOS Output Data.
18 D4A Output Channel A CMOS Output Data.
19 D5A Output Channel A CMOS Output Data.
22 D6A Output Channel A CMOS Output Data.
23 D7A Output Channel A CMOS Output Data.
25 D8A Output Channel A CMOS Output Data.
26 D9A Output Channel A CMOS Output Data.
27 D10A Output Channel A CMOS Output Data.
28 D11A (MSB) Output Channel A CMOS Output Data.
60 D0B (LSB) Output Channel B CMOS Output Data.
61 D1B Output Channel B CMOS Output Data.
62 D2B Output Channel B CMOS Output Data.
63 D3B Output Channel B CMOS Output Data.
2 D4B Output Channel B CMOS Output Data.
3 D5B Output Channel B CMOS Output Data.
4 D6B Output Channel B CMOS Output Data.
5 D7B Output Channel B CMOS Output Data.
6 D8B Output Channel B CMOS Output Data.
7 D9B Output Channel B CMOS Output Data.
8 D10B Output Channel B CMOS Output Data.
9 D11B (MSB) Output Channel B CMOS Output Data.
11 DCOA Output Channel A Data Clock Output.
10 DCOB Output Channel B Data Clock Output.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS Input/Output SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
51 CSB Input SPI Chip Select. Active low.
Signal Monitor Port
33 SMI SDO/OEB Input/Output Signal Monitor Serial Data Output/Output Enable Input (Active Low) in External Pin Mode.
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN Input/Output Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode.
Table 9. Pin Function Descriptions (Interleaved Parallel LVDS Mode)
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
2, 3, 62, 63 DNC Do Not Connect.
ADC Analog
37 VIN+A Input Differential Analog Input Pin (+) for Channel A.
38 VINβA Input Differential Analog Input Pin (β) for Channel A.
44 VIN+B Input Differential Analog Input Pin (+) for Channel B.
43 VINβB Input Differential Analog Input Pin (β) for Channel B.
39 VREF Input/Output Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select. See Table 1 1 for details.
42 RBIAS Input/Output External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input ADC Clock InputβTrue.
50 CLKβ Input ADC Clock InputβComplement.
ADC Fast Detect Outputs
54 FD0+ Output Channel A/Channel B LVDS Fast Detect Indicator 0βTrue. See Table 17 for details.
53 FD0β Output
Channel A/Channel B LVDS Fast Detect Indicator 0βComplement. See Table 1 7
r details.
fo
56 FD1+ Output Channel A/Channel B LVDS Fast Detect Indicator 1βTrue. See Table 17 for details.
55 FD1β Output
Channel A/Channel B LVDS Fast Detect Indicator 1βComplement. See Table 1 7
r details.
fo
59 FD2+ Output Channel A/Channel B LVDS Fast Detect Indicator 2βTrue. See Table 17 for details.
58 FD2β Output
Channel A/Channel B LVDS Fast Detect Indicator 2βComplement. See Table 1 7
r details.
fo
61 FD3+ Output Channel A/Channel B LVDS Fast Detect Indicator 3βTrue. See Table 17 for details.
60 FD3β Output
Channel A/Channel B LVDS Fast Detect Indicator 3βComplement. See Table 1 7
r details.
fo
Rev. 0 | Page 16 of 80
AD6653
www.BDTIC.com/ADI
Pin No. Mnemonic Type Description
Digital Inputs
52 SYNC Input Digital Synchronization Pin. Slave mode only.
Digital Outputs
5 D0+ (LSB) Output Channel A/Channel B LVDS Output Data 0βTrue.
4 D0β (LSB) Output Channel A/Channel B LVDS Output Data 0βComplement.
7 D1+ Output Channel A/Channel B LVDS Output Data 1βTrue.
6 D1β Output Channel A/Channel B LVDS Output Data 1βComplement.
9 D2+ Output Channel A/Channel B LVDS Output Data 2βTrue.
8 D2β Output Channel A/Channel B LVDS Output Data 2βComplement.
13 D3+ Output Channel A/Channel B LVDS Output Data 3βTrue.
12 D3β Output Channel A/Channel B LVDS Output Data 3βComplement.
15 D4+ Output Channel A/Channel B LVDS Output Data 4 βTrue.
14 D4β Output Channel A/Channel B LVDS Output Data 4βComplement.
17 D5+ Output Channel A/Channel B LVDS Output Data 5βTrue.
16 D5β Output Channel A/Channel B LVDS Output Data 5βComplement.
19 D6+ Output Channel A/Channel B LVDS Output Data 6βTrue.
18 D6β Output Channel A/Channel B LVDS Output Data 6βComplement.
23 D7+ Output Channel A/Channel B LVDS Output Data 7βTrue.
22 D7β Output Channel A/Channel B LVDS Output Data 7βComplement.
26 D8+ Output Channel A/Channel B LVDS Output Data 8βTrue.
25 D8β Output Channel A/Channel B LVDS Output Data 8βComplement.
28 D9+ Output Channel A/Channel B LVDS Output Data 9βTrue.
27 D9β Output Channel A/Channel B LVDS Output Data 9βComplement.
30 D10+ Output Channel A/Channel B LVDS Output Data 10βTrue.
29 D10β Output Channel A/Channel B LVDS Output Data 10βComplement.
32 D11+ (MSB) Output Channel A/Channel B LVDS Output Data 11βTrue.
31 D11β (MSB) Output Channel A/Channel B LVDS Output Data 11βComplement.
11 DCO+ Output Channel A/Channel B LVDS Data Clock OutputβTrue.
10 DCOβ Output Channel A/Channel B LVDS Data Clock OutputβComplement.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS Input/Output SPI Serial Data Input/Output/Duty Cycle Stabilizer in External Pin Mode.
51 CSB Input SPI Chip Select. Active low.
Signal Monitor Port
33 SMI SDO/OEB Input/Output
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN Input/Output
Signal Monitor Serial Data O
Pin Mode.
Signal Monitor Serial Clock Output/Power-D
Pin Mode.
utput/Output Enable Input (Active Low) in External
own Input (Active High) in External
Rev. 0 | Page 17 of 80
AD6653
V
C
S
A
V
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EQUIVALENT CIRCUITS
LK+
IN
06708-010
Figure 11. Equivalent Analog Input Circuit
AVDD
1.2V
10kβ¦10kβ¦
Figure 12. Equivalent Clock lnp
DRVDD
ut Circuit
CLKβ
SCLK/DFS
Figure 15. Equivalent SCLK
SENSE
06708-011
1kβ¦
26kβ¦
/DFS Input Circuit
1kβ¦
06708-014
06708-015
Figure 16. Equivalent SENSE Circuit
DRGND
6708-012
Figure 13. Equivalent Digital Output Circuit
DRVDD
DRVDD
26kβ¦
DIO/DCS
1kβ¦
06708-013
Figure 14. Equivalent SDIO/DCS Circuit or SMI SDFS Circuit
VDD
26kβ¦
CSB
1kβ¦
06708-016
Figure 17. Equivalent CSB Input Circuit
AVDD
REF
6kβ¦
06708-017
Figure 18. Equivalent VREF Circuit
Rev. 0 | Page 18 of 80
AD6653
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TYPICAL PERFORMANCE CHARACTERISTICS
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 1.8 V, sample rate = 150 MSPS, DCS enabled, 1.0 V internal reference, 2 V p-p differential
input, VIN = β1.0 dBFS, 64k sample, T
the location of the second and third harmonics is noted when they fall in the pass band of the filter.
0
β20
β40
β60
β80
AMPLITUDE ( dBFS)
β100
SECOND HARMONIC
THIRD HARMONIC
= 25Β°C, NCO enabled, FIR filter enabled, unless otherwise noted. In the FFT plots that follow,
Figure 34. AD6653-125 Single-Tone SNR/SFDR vs. Input Frequency (f
SFDR = +85Β°C
SNR = +25Β°C
SNR = +85Β°C
SNR = β40Β°C
INPUT FREQ UENCY (MHz)
SFDR = +25Β°C
50
06708-033
) and
IN
Temperature with DRVDD = 3.3 V
1.5
β2.0
OFFSET
β2.5
β3.0
GAIN ERROR (%F SR)
β3.5
β4.0
β40806040200β20
06708-031
GAIN
TEMPERATURE (Β° C)
0.5
0.4
0.3
0.2
0.1
0
OFFSET ERROR (%FSR)
06708-034
Figure 35. AD6653-150 Gain and Offset vs. Temperature
95
90
SFDR = +85Β°C
85
80
75
SNR/SFDR (dBc)
70
65
60
04
SFDR = β40Β°C
SNR = +25Β°C
SNR = +85Β°C
SNR = β40Β°C
INPUT FREQ UENCY (MHz)
25020015010050
SFDR = +25Β°C
Figure 33. AD6653-125 Single-Tone SNR/SFDR vs. Input Frequency (f
Temperature with DRVDD = 1.8 V
50400350300
06708-032
) and
IN
Rev. 0 | Page 21 of 80
0
β20
SFDR (dBc)
β40
β60
β80
SFDR/IMD3 (dBc AND dBFS )
β100
β120
β90β78β66β54β42β30β18β6
IMD3 (d Bc)
SFDR (dBFS)
IMD3 (dBFS)
INPUT AMPLITUDE (dBFS )
Figure 36. AD6653-150 Two-Tone SFDR/IMD3 vs. Input Amplitude (A
= 29.12 MHz, f
f
IN1
= 32.12 MHz, fS = 150 MSPS, f
IN2
= 22 MHz
NCO
) with
IN
06708-035
AD6653
www.BDTIC.com/ADI
0
β20
SFDR (dBc)
β40
IMD3 (d Bc)
β60
β80
SFDR/IMD3 (dBc AND dBFS )
SFDR (dBFS)
β100
IMD3 (dBFS)
0
β20
β40
β60
β80
AMPLITUDE ( dBFS)
β100
β120
150MSPS
169.12MHz @ β7dBF S
172.12MHz @ β7dBF S
SFDR = 83.6dBc (90.6dBFS )
f
= 177MHz
NCO
β120
β90β78β66β54β42β30β18β6
INPUT AMPLITUDE (dBFS )
Figure 37. AD6653-150 Two-Tone SFDR/IMD3 vs. Input Amplitude (A
= 169.12 MHz, f
f
IN1
0
β20
β40
β60
β80
AMPLITUDE ( dBFS)
β100
β120
β140
051015202530
Figure 38. AD6653-125, Two 64k WCDMA Carriers with f
0
150MSPS
29.12MHz @ β7dBF S
32.12MHz @ β7dBF S
β20
SFDR = 91.1dBc (98.1dBFS)
f
NCO
β40
= 172.12 MHz, fS = 150 MSPS, f
IN2
FREQUENCY ( MHz)
= 122.88 MHz, f
f
S
= 22MHz
= 168.96 MHz
NCO
= 177 MHz
NCO
= 170 MHz,
IN
) with
IN
β140
0330252015105
06708-036
Figure 40. AD6653-150 Two-Tone FFT with f
= 172.12 MHz, fS = 150 MSPS, f
f
IN2
0
β20
β40
β60
β80
AMPLITUDE ( dBFS)
β100
06708-037
β120
037.530.022.515.07. 5
FREQUENCY (MHz)
FREQUENCY (MHz )
= 169.12 MHz,
IN1
= 177 MHz
NCO
NPR = 61.9dBc
NOTCH @ 18.5MHz
NOTCH WIDT H = 3MHz
5
06708-039
06708-040
Figure 41. AD6653-150 Noise Power Ratio (NPR)
95
90
85
SFDR
β60
β80
AMPLITUDE ( dBFS)
β100
β120
β140
03
FREQUENCY (MHz)
Figure 39. AD6653-150 Two-Tone FFT with f
= 150 MSPS, f
f
S
NCO
= 29.12 MHz, f
IN1
= 22 MHz
30252015105
5
06708-038
= 32.12 MHz,
IN2
80
75
SNR/SFDR (dBc)
70
65
60
0150125100755025
SAMPLE RATE (MSPS)
Figure 42. AD6653-150 Single-Tone SNR/SFDR vs. Sample Rate (f
f
Rev. 0 | Page 22 of 80
= 2.3 MHz
IN
SNR
) with
S
06708-041
AD6653
www.BDTIC.com/ADI
12
0.21 LSB rms
90
10
8
6
4
NUMBER OF HIT S (1M)
2
0
N β 3N β 2N β 1NN + 1N + 2N + 3
OUTPUT CODE
Figure 43. AD6653 Grounded Input Histogram
90
85
SFDR DCS ON
80
SFDR DCS OFF
SNR DCS OFF
SNR/SFDR (dBc)
75
SNR DCS ON
70
85
SFDR
80
75
SNR/SFDR (dBc)
SNR
70
65
0.20.40. 60. 81. 01.21.41.6
06708-042
INPUT COMMON-MODE VOLTAGE (V)
06708-044
Figure 45. AD6653-150 SNR/SFDR vs. Input Common Mode (VCM) with
= 30.3 MHz, f
f
IN
= 45 MHz
NCO
65
20304050607080
DUTY CYCLE (%)
Figure 44. AD6653-150 SNR/SFDR vs. Duty Cycle with f
= 45 MHz
f
NCO
= 30.3 MHz,
IN
06708-043
Rev. 0 | Page 23 of 80
AD6653
www.BDTIC.com/ADI
THEORY OF OPERATION
The AD6653 has two analog input channels, two decimating
channels, and two digital output channels. The intermediate
frequency (IF) input signal passes through several stages before
appearing at the output port(s) as a filtered, decimated digital
signal.
The dual ADC design can be used for diversity reception of signals,
here the ADCs operate identically on the same carrier but from
w
two separate antennae. The ADCs can also be operated with indeΒpendent analog inputs. The user can sample any f
/2 frequency
S
segment from dc to 150 MHz, using appropriate low-pass or
band-pass filtering at the ADC inputs with little loss in ADC
performance. Operation to 450 MHz analog input is permitted
but occurs at the expense of increased ADC noise and distortion.
In nondiversity applications, the AD6653 can be used as a
b
aseband receiver, where one ADC is used for I input data,
and the other is used for Q input data.
Synchronization capability is provided to allow synchronized
timin
g between multiple channels or multiple devices. The
NCO phase can be set to produce a known offset relative to
another channel or device.
Programming and control of the AD6653 are accomplished
usin
g a 3-bit SPI-compatible serial interface.
ADC ARCHITECTURE
AD6653 architecture consists of a front-end sample-and-hold
amplifier (SHA), followed by a pipelined switched-capacitor ADC.
The quantized outputs from each stage are combined into a final
12-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate on a new input
sample and the remaining stages to operate on the preceding
samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
esolution flash ADC connected to a switched-capacitor digital-
r
to-analog converter (DAC) and an interstage residue amplifier
(MDAC). The residue amplifier magnifies the difference between
the reconstructed DAC output and the flash input for the next
stage in the pipeline. One bit of redundancy is used in each stage to
facilitate digital correction of flash errors. The last stage simply
consists of a flash ADC.
The input stage of each channel contains a differential SHA that
ca
n be ac- or dc-coupled in differential or single-ended modes.
The output staging block aligns the data, corrects errors, and
passes the data to the output buffers. The output buffers are
powered from a separate supply, allowing adjustment of the
output voltage swing. During power-down, the output buffers
go into a high impedance state.
ANALOG INPUT CONSIDERATIONS
The analog input to the AD6653 is a differential switchedΒcapacitor SHA that has been designed for optimum
performance while processing a differential input signal.
The clock signal alternatively switches the SHA between sample
mode and hold mode (see Figure 46). When the SHA is switched
in
to sample mode, the signal source must be capable of charging
the sample capacitors and settling within 1/2 of a clock cycle.
A small resistor in series with each input can help reduce the
eak transient current required from the output stage of the
p
driving source. A shunt capacitor can be placed across the inputs
to provide dynamic charging currents. This passive network
creates a low-pass filter at the ADC input; therefore, the precise
values are dependent on the application.
In IF undersampling applications, any shunt capacitors should
b
e reduced. In combination with the driving source impedance,
the shunt capacitors limit input bandwidth. Refer to Application
Note AN-742, Frequency Domain Response of Switched-
Capacitor ADCs; Application Note AN-827, A Resonant Approach
to Interfacing Amplifiers to Switched-Capacitor ADCs; and the
Analog Dialogue article, β
Wi
deband A/D Converters,β for more information on this subject
(see www.analog.com).
Transformer-Coupled Front-End for
In general, the precise values are
dependent on the application.
S
C
H
C
H
S
06708-048
VIN+
VINβ
C
PIN, PAR
C
PIN, PAR
Figure 46. Switched-Capac
S
S
C
S
H
C
S
itor SHA Input
For best dynamic performance, the source impedances driving
VIN+ and VINβ should be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC.
An internal differential reference buffer creates positive and
n
egative reference voltages that define the input span of the
ADC core. The output common mode of the reference buffer is
set to VCMREF (approximately 1.6 V).
Input Common Mode
The analog inputs of the AD6653 are not internally dc biased.
In ac-coupled applications, the user must provide this bias
externally. Setting the device so that V
= 0.55 Γ AVDD is
CM
recommended for optimum performance, but the device functions
over a wider range with reasonable performance (see Figure 45).
An o
n-board common-mode voltage reference is included in the
design and is available from the CML pin. Optimum performance
is achieved when the common-mode voltage of the analog input
is set by the CML pin voltage (typically 0.55 Γ AVDD).
Rev. 0 | Page 24 of 80
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