ANALOG DEVICES AD6636 Service Manual

150 MSPS, Wideband,
S
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FEATURES

4/6 independent wideband processing channels Processes 6 wideband carriers (UMTS, CDMA2000) 4 single-ended or 2 LVDS parallel input ports
(16 linear bit plus 3-bit exponent) running at 150 MHz Supports 300 MSPS input using external interface logic Three 16-bit parallel output ports operating up to 200 MHz Real or complex input ports Quadrature correction and dc correction for complex inputs Supports output rate up to 34 MSPS per channel RMS/peak power monitoring of input ports Programmable attenuator control for external gain ranging 3 programmable coefficient FIR filters per channel 2 decimating half-band filters per channel 6 programmable digital AGC loops with 96 dB range

FUNCTIONAL BLOCK DIAGRAM

CLKA
ADC A/AI
NCO
CIC5
M = 1-32
FIR1 HB1
M = Byp, 2
FIR2 HB2
M = Byp, 2
Digital Downconverter (DDC)
AD6636
Synchronous serial I/O operation (SPI®-, SPORT-compatible) Supports 8-bit or 16-bit microport modes
3.3 V I/O, 1.8 V CMOS core User-configurable, built-in, self-test (BIST) capability JTAG boundary scan

APPLICATIONS

Multicarrier, multimode digital receivers GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000, TD-SCDMA,
WiMAX Micro and pico cell systems, software radios Broadband data applications Instrumentation and test equipment Wireless local loops In-building wireless telephony
MRCF DRCF
M = 1-16
CRCF
M = 1-16
LHB
L = Byp, 2
EXPA [2:0]
CLKB
NCO
INPUT MATRIX
ADC B/AQ
EXPB [2:0]
CMOS
CLKC
REAL
PORTS
CLKD
RESET
A, B,
C, D
CMOS
COMPLEX
PORTS (AI, AQ)
(BI, BQ)
LVDS PORTS AB, CD
PEAK/
RMS
MEAS.
I,Q
CORR.
PRN GEN
ADC C/CI
EXPC [2:0]
ADC D/CQ
EXPD [2:0]
SYNC [3:0]
NOTE: CHANNELS RENDERED A
NCO
NCO
NCO
NCO
MULTIPLIER
PLL CLOCK
CIC5
M = 1-32
CIC5
M = 1-32
CIC5
M = 1-32
CIC5
M = 1-32
CIC5
M = 1-32
16-BIT
FIR2 HB2
M = Byp, 2
FIR2 HB2
M = Byp, 2
FIR2 HB2
M = Byp, 2
FIR2 HB2
M = Byp, 2
FIR2 HB2
M = Byp, 2
FIR1 HB1
M = Byp, 2
FIR1 HB1
M = Byp, 2
FIR1 HB1
M = Byp, 2
FIR1 HB1
M = Byp, 2
FIR1 HB1
M = Byp, 2
MICROPORT INTERFACE
Figure 1.
MRCF DRCF
M = 1-16
MRCF DRCF
M = 1-16
MRCF DRCF
M = 1-16
DATA ROUTER MATRIX
MRCF DRCF
M = 1-16
MRCF DRCF
M = 1-16
SPORT/SPI INTERFACE JTAG
M = DECIMATION L = INTERPOLATIONARE AVAILABLE ONLY IN 6-CHANNEL PART
CRCF
M = 1-16
CRCF
M = 1-16
CRCF
M = 1-16
CRCF
M = 1-16
CRCF
M = 1-16
LHB
L = Byp, 2
LHB
L = Byp, 2
LHB
L = Byp, 2
LHB
L = Byp, 2
LHB
L = Byp, 2
PA
DATA ROUTING
AGC
PB
PC
PARALLEL PORTS
04998-0-001
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
AD6636
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TABLE OF CONTENTS

General Description......................................................................... 4
FIR Half-Band Block.................................................................. 30
Specifications..................................................................................... 6
Recommended Operating Conditions ...................................... 6
Electrical Characteristics............................................................. 6
General Timing Characteristics
Microport Timing Characteristics
Serial Port Timing Characteristics
Explanation of Test Levels for Specifications............................ 9
Absolute Maximum Ratings.......................................................... 10
Thermal Characteristics ............................................................ 10
ESD Caution................................................................................ 10
Pin Configuration and Function Descriptions........................... 11
Pin Listing for Power, Ground, Data, and Address Buses..... 13
Timing Diagrams............................................................................ 14
Theory of Operation ...................................................................... 20
ADC Input Port.......................................................................... 20
,
................................................ 7
,
............................................ 8
, ,
........................................... 9
Intermediate Data Router ......................................................... 33
MonoRate RAM Coefficient Filter (MRCF)........................... 33
Decimating RAM Coefficient Filter (DRCF) ......................... 34
Channel RAM Coefficient Filter (CRCF) ............................... 36
Interpolating Half-Band Filter.................................................. 38
Output Data Router ................................................................... 38
Automatic Gain Control............................................................ 40
Parallel Port Output ................................................................... 44
User-Configurable, Built-In Self-Test (BIST)......................... 48
Chip Synchronization................................................................ 48
Serial Port Control..................................................................... 49
Microport .................................................................................... 58
Memory Map .................................................................................. 60
Reading the Memory Map Table.............................................. 60
Global Register Map .................................................................. 62
PLL Clock Multiplier .................................................................21
ADC Gain Control ..................................................................... 22
ADC Input Port Monitor Function.......................................... 23
Quadrature I/Q Correction Block............................................ 25
Input Crossbar Matrix ............................................................... 27
Numerically Controlled Oscillator (NCO)............................. 27
Fifth-Order CIC Filter ............................................................... 29
Input Port Register Map ............................................................ 65
Channel Register Map ............................................................... 68
Output Port Register Map......................................................... 73
Design Notes................................................................................... 77
Outline Dimensions ....................................................................... 79
Ordering Guide .......................................................................... 79
Rev. A | Page 2 of 80
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REVISION HISTORY

6/05—Rev. 0 to Rev. A
Changes to Format............................................................. Universal
Changes to Figure 1...........................................................................1
Changes to Applications...................................................................1
Changes to General Description .....................................................4
Changes to Table 3 ............................................................................7
Changes to Table 5 ............................................................................9
Changes to Table 8 ..........................................................................11
Changes to Figure 17 ......................................................................18
Changes to Figure 18 and Figure 19 .............................................19
Changes to Figure 25 ......................................................................23
Changes to Mean Power Mode (Control Bits 01) Section.........24
Changes to NCO Frequency Section............................................27
Changes to Figure 30 ......................................................................28
Changes to 6-Tap Fixed Coefficient Filter (FIR2) Section ........32
Changes to Decimate-by-2, Half-Band Filter (HB2) Section....32
Changes to Table 17 ........................................................................32
Changes to Clock Rate Section......................................................34
Changes to Programming DRCF Register for a Symmetric
Filter Section ...................................................................................35
Changes to Channel RAM Coefficient Filter (CRCF)
Section ..............................................................................................36
Changes to Programming CRCF Register for a Symmetrical
Filter Section ....................................................................................37
Changes to Desired Signal Level Mode Section..........................41
C
hanges to Figure 41......................................................................45
Changes to Figure 42 and Figure 43 .............................................46
Changes to Start with Soft Sync Section ......................................48
Changes to Hop with Soft Sync Section.......................................49
Changes to Hop with Pin Sync Section........................................49
Replaced Serial Control Port Section ........................................... 49
Changes to Intel (INM) Mode Section......................................... 58
Changes to Motorola (MNM) Mode Section..............................59
Changes to Table 30........................................................................61
Changes to Channel Register Map Section .................................68
Changes to AGC Control Register <10:0> Section ....................71
Changes to BIST Control <15:0> Section.................................... 73
Changes to Parallel Port Output Control <23:0> .......................73
Changes to Table 44........................................................................74
Changes to Design Notes...............................................................77
Changes to Figure 59......................................................................77
8/04—Revision 0: Initial Version
Rev. A | Page 3 of 80
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GENERAL DESCRIPTION

The AD6636 is a digital downconverter intended for IF sampling or oversampled baseband radios requiring wide bandwidth input signals. The AD6636 has been optimized for the demanding filtering requirements of wideband standards, such as CDMA2000, UMTS, and TD-SCDMA, but is flexible enough to support wider standards such as WiMAX. The AD6636 is designed for radio systems that use either an IF sampling ADC or a baseband sampling ADC.
The AD6636 channels have the following signal processing s
tages: a frequency translator, a fifth-order cascaded integrated comb filter, two sets of cascaded fixed-coefficient FIR and half­band filters, three cascaded programmable coefficient sum-of­product FIR filters, an interpolating half-band filter (IHB), and a digital automatic gain control (AGC) block. Multiple modes are supported for clocking data into and out of the chip and provide flexibility for interfacing to a wide variety of digitizers. Programming and control are accomplished via serial or microport interfaces.
Input ports can take input data at up to 150 MSPS. Up to 300 MS
PS input data can be supported using two input ports (some external interface logic is required) and two internal channels processing in tandem. Biphase filtering in the output data router is selected to complete the combined filtering mode. The four input ports can operate in CMOS mode, or two ports can be combined for LVDS input mode. The maximum input data rate for each input port is 150 MHz.
Frequency translation is accomplished with a 32-bit complex n
umerically controlled oscillator (NCO). It has greater than 110 dBc SFDR. This stage translates either a real or complex input signal from intermediate frequency (IF) to a baseband complex digital output. Phase and amplitude dither can be enabled on-chip to improve spurious performance of the NCO. A 16-bit phase-offset word is available to create a known phase relationship between multiple AD6636 chips or channels. The NCO can also be bypassed so that baseband I and Q inputs can be provided directly from baseband sampling ADCs through input ports.
Following frequency translation is a fifth-order CIC filter with a
rogrammable decimation between 1 and 32. This filter is used
p to lower the sample rate efficiently, while providing sufficient alias rejection at frequencies with higher frequency offsets from the signal of interest.
Following the CIC5 are two sets of filters. Each set has a non-
cimating FIR filter and a decimate-by-2 half-band filter. The
de FIR1 filter provides about 30 dB of rejection, while the HB1 filter provides about 77 dB of rejection. They can be used together to achieve a 107 dB stop band alias rejection, or they can be individually bypassed to save power. The FIR2 filter provides about 30 dB of rejection, while the HB2 filter provides
about 65 dB of rejection. The filters can be used either together to achieve more than 95 dB stop band alias rejection, or can be individually bypassed to save power. FIR1 and HB1 filters can run with a maximum input rate of 150 MSPS. In contrast, FIR2 and HB2 can run with a maximum input rate of 75 MSPS (input rate to FIR2 and HB2 filters).
The programmable filtering is divided into three cascaded RAM c
oefficient filters (RCFs) for flexible and power efficient filtering. The first filter in the cascade is the MRCF, consisting of a programmable nondecimating FIR. It is followed by programmable FIR filters (DRCF) with decimation from 1 to
16. They can be used either together to provide high rejection filters, or independently to save power. The maximum input rate to the MRCF is one-fourth of the PLL clock rate.
The channel RCF (CRCF) is the last programmable FIR filter wi
th programmable decimation from 1 to 16. It typically is used to meet the spectral mask requirements for the air standard of interest. This could be an RRC, antialiasing filter or any other real data filter. Decimation in preceding blocks is used to keep the input rate of this stage as low as possible for the best filter performance.
The last filter stage in the chain is an interpolate-by-2 half-band
ilter, which is used to up-sample the CRCF output to produce
f higher output oversampling. Signal rejection requirements for this stage are relaxed because preceding filters have filtered the blockers and adjacent carriers already.
Each input port of the AD6636 has its own clock used for
tching onto the input data, but the Input Port A clock (CLKA)
la is also used as the input for an on-board PLL clock multiplier. The output of the PLL clock is used for processing all filters and processing blocks beyond the data router following the CIC filter. The PLL clock can be programmed to have a maximum clock rate of 200 MHz.
A data routing block (DR) is used to distribute data from the
Cs to the various channel filters. This block allows multiple
CI back-end filter chains to work together to process high bandwidth signals or to make even sharper filter transitions than a single channel can perform. It can also allow complex filtering operations to be achieved in the programmable filters.
The digital AGC provides the user with scaled digital outputs b
ased on the rms level of the signal present at the output of the digital filters. The user can set the requested level and time constant of the AGC loop for optimum performance of the postprocessor. This is a critical function in the base station for CDMA applications where the power level must be well controlled going into the RAKE receivers. It has programmable clipping and rounding control to provide different output resolutions.
Rev. A | Page 4 of 80
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The overall filter response for the AD6636 is the composite of
l the combined filter stages. Each successive filter stage is
al capable of narrower transition bandwidths but requires a greater number of CLK cycles to calculate the output. More decimation in the first filter stage minimizes overall power consumption. Data from the device is interfaced to a DSP/FPGA/baseband processor via either high speed parallel ports (preferred) or a DSP-compatible microprocessor interface.
The AD6636 is available both in 4-channel and 6-channel v
ersions. The data sheet primarily discusses the 6-channel part. The only difference between the 6-channel and 4-channel devices is that Channel 4 and Channel 5 are not available on the 4-channel version, (see t
he same input ports, output ports, and memory map. The memory map section for Channel 4 and Channel 5 can be programmed and read back, but it serves no purpose.
Figure 1). The 4-channel device still has

PRODUCT HIGHLIGHTS

Six independent digital filtering channels
101 dB S
performance
F
RMS/p
range AGCs before the output ports
Thr
band filters, two fixed coefficient filters, and one fifth­order CIC filter per channel
C
input) by combining filtering capability of multiple channels
T
200 MHz clock
Bl
microprocessor port
NR noise performance, 110 dB spurious
our input ports capable of 150 MSPS input data rates
eak power monitoring of input ports and 96 dB
ee programmable RAM coefficient filters, three half-
omplex filtering and biphase filtering (300 MSPS ADC
hree 16-bit parallel output ports operating at up to a
ackfin®-compatible and TigerSHARC®-compatible 16-bit
ynchronous serial communications port is compatible
S
with most serial interface standards, SPORT, SPI, and SSR
Rev. A | Page 5 of 80
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SPECIFICATIONS

RECOMMENDED OPERATING CONDITIONS

Table 1.
Parameter Temp Test Level Min Typ Max Unit
VDDCORE Full IV 1.7 1.8 1.9 V VDDIO Full IV 3.0 3.3 3.6 V T
AMBIENT

ELECTRICAL CHARACTERISTICS

1
Table 2.
Parameter Temp Test Level Min Typ Max Unit
LOGIC INPUTS (NOT 5 V TOLERANT)
Logic Compatibility Full IV 3.3 V CMOS Logic 1 Voltage Full IV 2.0 3.6 V Logic 0 Voltage Full IV −0.3 +0.8 V Logic 1 Current Full IV 1 10 μA Logic 0 Current Full IV 1 10 μA Input Capacitance 25°C V 4 pF
LOGIC OUTPUTS
Logic Compatibility Full IV 3.3 V CMOS Logic 1 Voltage (IOH = 0.25 mA) Full IV 2.0 VDDIO − 0.2 V Logic 0 Voltage (IOL = 0.25 mA) Full IV 0.2 0.4 V
SUPPLY CURRENTS
WCDMA (61.44 MHz) Example
I
VDDCORE
I
VDDIO
CDMA 2000 (61.44 MHz) Example
I
VDDCORE
I
VDDIO
TDS-CDMA (76.8 MHz) Example
I
VDDCORE
I
VDDIO
GSM (65 MHz) Example
I
VDDCORE
I
VDDIO
1
1
1, 2
1, 2
TOTAL POWER DISSIPATION
WCDMA (61.44 MHz)1 25°C V 975 mW CDMA2000 (61.44 MHz) TD-SCDMA (76.8 MHz) GSM (65 MHz)
1
One input port, all six channels, and the relevant signal processing blocks are active.
2
PLL is turned off for power savings.
1, 2
1
1, 2
Full IV −40 +25 +85 °C
25°C V 450 mA 25°C V 50 mA
25°C V 400 mA 25°C V 25 mA
25°C V 250 mA 25°C V 15 mA
25°C V 175 mA 25°C V 10 mA
25°C V 800 mW 25°C V 500 mW 25°C V 350 mW
Rev. A | Page 6 of 80
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GENERAL TIMING CHARACTERISTICS

Table 3.
Parameter Temp Test Level Min Typ Max Unit
CLK TIMING REQUIREMENTS
t
CLK
t
CLKL
t
CLKH
t
CLKSKEW
INPUT WIDEBAND DATA TIMING REQUIREMENTS Full IV
tSI t
HI
t
SEXP
t
HEXP
t
DEXP
PARALLEL OUTPUT PORT TIMING REQUIREMENTS (MASTER)
t
DPREQ
t
DPP
t
DPIQ
t
DPCH
t
DPGAIN
t
SPA
t
HPA
PARALLEL OUTPUT PORT TIMING REQUIREMENTS (SLAVE)
t
PCLK
t
PCLKL
t
PCLKH
t
DPREQ
t
DPP
t
DPIQ
t
DPCH
t
DPGAIN
t
SPA
t
HPA
MISC PINS TIMING REQUIREMENTS
t
RESET
t
DIRP
t
SSYNC
t
HSYNC
1
All timing specifications are valid over the VDDCORE range of 1.7 V to 1.9 V and the VDDIO range of 3.0 V to 3.6 V.
2
C
= 40 pF on all outputs, unless otherwise noted.
LOAD
CLKx Period (x = A, B, C, D) Full I 6.66 ns CLKx Width Low (x = A, B, C, D) Full IV 1.71 0.5 × t CLKx Width High (x = A, B, C, D) Full IV 1.70 0.5 × t CLKA to CLKx Skew (x = B, C, D) Full IV t
INx [15:0] to CLKx Setup Time (x = A, B, C, D) INx [15:0] to ↑CLKx Hold Time (x = A, B, C, D) EXPx [2:0] to CLKx Setup Time (x = A, B, C, D) EXPx [2:0] to ↑CLKx Hold Time (x = A, B, C, D)
CLKx to EXPx[2:0] Delay (x = A, B, C, D)
PCLK to Px REQ Delay (x = A, B, C) PCLK to Px [15:0] Delay (x = A, B, C) PCLK to Px IQ Delay (x = A, B, C) PCLK to Px CH[2:0] Delay (x = A, B, C) PCLK to Px Gain Delay (x = A, B, C)
Px ACK to PCLK Setup Time (x = A, B, C) Px ACK to PCLK Hold Time (x = A, B, C)
PCLK Period Full IV 5.0 ns PCLK Low Period Full IV 1.7 0.5 × t PCLK High Period Full IV 0.7 0.5 × t
PCLK to Px REQ Delay (x = A, B, C) PCLK to Px [15:0] Delay (x = A, B, C) PCLK to Px IQ Delay (x = A, B, C) PCLK to Px CH[2:0] Delay (x = A, B, C) PCLK to Px Gain Delay (x = A, B, C)
Px ACK to PCLK Setup Time (x = A, B, C) Px ACK to PCLK Hold Time (x = A, B, C)
RESET Width Low CPUCLK/SCLK to IRP Delay
SYNC(0, 1, 2, 3) to CLKA Setup Time SYNC(0, 1, 2, 3) to CLKA Hold Time
1, 2
ns
CLK
ns
CLK
− 1.3 ns
CLK
Full IV 0.75 ns Full IV 1.13 ns Full IV 3.37 ns Full IV 1.11 ns Full IV 5.98 10.74 ns
Full IV 1.77 3.86 ns Full IV 2.07 5.29 ns Full IV 0.48 5.49 ns Full IV 0.38 5.35 ns Full IV 0.23 4.95 ns Full IV 4.59 ns Full IV 0.90 ns
ns
PCLK
ns
PCLK
Full IV 4.72 8.87 ns Full IV 4.8 8.48 ns Full IV 4.83 10.94 ns Full IV 4.88 10.09 ns Full IV 5.08 11.49 ns Full IV 6.09 ns Full IV 1.0 ns
Full IV 30 ns Full V 7.5 ns Full IV 0.87 ns Full IV 0.67 ns
Rev. A | Page 7 of 80
AD6636
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MICROPORT TIMING CHARACTERISTICS

Table 4.
Parameter Temp Test Level Min Typ Max Unit
MICROPORT CLOCK TIMING REQUIREMENTS
t
CPUCLK
t
CPUCLKL
t
CPUCLKH
INM MODE WRITE TIMING (MODE = 0)
t
SC
t
HC
t
SAM
t
HAM
t
DRDY
t
ACC
INM MODE READ TIMING (MODE = 0)
t
SC
t
HC
t
SAM
t
HAM
t
DD
t
DRDY
t
ACC
MNM MODE WRITE TIMING (MODE = 1)
t
SC
t
HC
t
SAM
t
HAM
t
DDTACK
t
ACC
MNM MODE READ TIMING (MODE = 1)
t
SC
t
HC
t
SAM
t
HAM
t
DD
t
DDTACK
t
ACC
1
All timing specifications are valid over the VDDCORE range of 1.7 V to 1.9 V and the VDDIO range of 3.0 V to 3.6 V.
2
C
LOAD
3
Specification pertains to control signals: R/W (WR), DS (RD), and CS.
CPUCLK Period Full IV 10.0 ns CPUCLK Low Time Full IV 1.53 0.5 × t CPUCLK High Time Full IV 1.70 0.5 × t
Control3 to CPUCLK Setup Time Control3 to CPUCLK Hold Time Address/Data to CPUCLK Setup Time Address/Data to CPUCLK Hold Time CPUCLK to RDY (DTACK) Delay Write Access Time Full IV 3 × t
Control3 to CPUCLK Setup Time Control3 to CPUCLK Hold Time Address to CPUCLK Setup Time Address to CPUCLK Hold Time
CPUCLK to Data Delay CPUCLK to RDY (DTACK) Delay
Read Access Time Full IV 3 × t
Control3 to CPUCLK Setup Time Control3 to CPUCLK Hold Time Address/Data to CPUCLK Setup Time Address/Data to CPUCLK Hold Time CPUCLK to DTACK (RDY) Delay Write Access Time Full IV 3 × t
Control3 to CPUCLK Setup Time Control3 to CPUCLK Hold Time Address to CPUCLK Setup Time Address to CPUCLK Hold Time
CPUCLK to Data Delay Full V 5.0 ns CPUCLK to DTACK (RDY) Delay Read Access Time Full IV 3 × t
= 40 pF on all outputs, unless otherwise noted.
1, 2
CPUCLK
CPUCLK
ns ns
Full IV 0.80 ns Full IV 0.09 ns Full IV 0.76 ns Full IV 0.20 ns Full IV 3.51 6.72 ns
CPUCLK
9 × t
CPUCLK
ns
Full IV 1.00 ns Full IV 0.03 ns Full IV 0.80 ns Full IV 0.20 ns Full V 5.0 ns Full IV 4.50 6.72 ns
CPUCLK
9 × t
CPUCLK
ns
Full IV 1.00 ns Full IV 0.00 ns Full IV 0.00 ns Full IV 0.57 ns Full IV 4.10 5.72 ns
CPUCLK
9 × t
CPUCLK
ns
Full IV 1.00 ns Full IV 0.00 ns Full IV 0.00 ns Full IV 0.57 ns
Full IV 4.20 6.03 ns
CPUCLK
9 × t
CPUCLK
ns
Rev. A | Page 8 of 80
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SERIAL PORT TIMING CHARACTERISTICS

Table 5.
Parameter Temp Test Level Min Typ Max Unit
SERIAL PORT CLOCK TIMING REQUIREMENTS
t
SCLK
t
SCLKL
t
SCLKH
SPI PORT CONTROL TIMING REQUIREMENTS (MODE = 0)
t
SSDI
t
HSDI
t
SSCS
t
HSCS
t
DSDO
SPORT MODE CONTROL TIMING REQUIREMENTS (MODE = 1)
t
SSDI
t
HSDI
t
SSRFS
t
HSRFS
t
SSTFS
t
HSTFS
t
SSCS
t
HSCS
t
DSDO
1
All timing specifications are valid over the VDDCORE range of 1.7 V to 1.9 V and the VDDIO range of 3.0 V to 3.6 V.
2
C
= 40 pF on all outputs, unless otherwise noted.
LOAD
3
SCLK rise/fall time should be 3 ns maximum.
SCLK Period Full IV 10.0 ns SCLK Low Time Full IV 1.60 0.5 × t SCLK High Time Full IV 1.60 0.5 × t
SDI to SCLK Setup Time SDI to SCLK Hold Time SCS to SCLK Setup Time SCS to SCLK Hold Time
SCLK to SDO Delay Time
SDI to SCLK Setup Time SDI to SCLK Hold Time SRFS to SCLK Setup Time SRFS to ↓SCLK Hold Time STFS to SCLK Setup Time STFS to ↑SCLK Hold Time SCS to SCLK Setup Time SCS to SCLK Hold Time SCLK to SDO Delay Time
1, , 2 3
SCLK
SCLK
ns ns
Full IV 1.30 ns Full IV 0.40 ns Full IV 4.12 ns
Full IV −2.78 ns
Full IV 4.28 7.96 ns
Full IV 0.80 ns Full IV 0.40 ns Full IV 1.60 ns Full IV −0.13 ns Full IV 1.60 ns Full IV −0.30 ns Full IV 4.12 ns
Full IV −2.76 ns
Full IV 4.29 7.95 ns

EXPLANATION OF TEST LEVELS FOR SPECIFICATIONS

Table 6.
Test Level Description
I 100% production tested. II 100% production tested at 25°C, and sample tested at specified temperatures. III Sample tested only. IV Parameter guaranteed by design and analysis. V Parameter is typical value only. VI 100% production tested at 25°C, and sampled tested at temperature extremes.
Rev. A | Page 9 of 80
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ABSOLUTE MAXIMUM RATINGS

Table 7.
Parameter Rating
ELECTRICAL
VDDCORE Supply Voltage
(Core Supply)
VDDIO Supply Voltage
(Ring or IO Supply)
Input Voltage −0.3 to +3.6 V (Not 5 V Tolerant) Output Voltage −0.3 to VDDIO + 0.3 V Load Capacitance 200 pF
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
Maximum Junction
Temperature Under Bias
Storage Temperature
Range (Ambient)
2.2 V
4.0 V
−40°C to +85°C
125°C
−65°C to +150°C
S
tresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL CHARACTERISTICS

256-ball CSP_BGA package:
= 25.4°C /W, no airflow
θ
JA
θ
= 23.3°C /W, 0.5 m/s airflow
JA
= 22.6°C /W, 1.0 m/s airflow
θ
JA
= 21.9°C /W, 2.0 m/s airflow
θ
JA
Thermal measurements made in the horizontal position on a 4-l
ayer board with vias.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 10 of 80
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

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GND INC3 IND4 IND7 CLKD CLKC IND11 GND VDDCORE IND14 IND15 SYNC1 TDO PBGAIN PB11 GND
A
IND0 VDDIO INC2 IND5 IND6 IND8 IND10 IND12 IND13 INC14 SYNC3 SYNC0 TRST PBCH2 VDDIO PB12
B
EXPA1 EXPD1 INC0 INC1 IND3 INC5 IND9 INC10 INC13 SYNC2 TMS TCLK PBCH0 PB8 PB15 PB10
C
EXPB0 EXPC2 EXPC1 EXPD0 IND2 INC4 INC7 INC9 INC12 TDI PBCH1 PBIQ PB14 PB9 PB13 PACH1
D
A
B
C
D
MSB_ FIRST
LVDS_
RSET
R/W (WR,
STFS)
DS (RD,
SRFS)
EXT_
FILTER
INA14 INA15 EXPA0
E
INA12 INA13 EXPB1 EXPC0 EXPD2 GND VDDIO VDDIO VDDIO VDDIO GND PB6 PB0 PB7 PAREQ PA0
F
INA11 INB13 INB15 EXPB2 EXPA2 VDDCORE GND GND GND GND VDDCORE PB3 PAGAIN PB2 PACH0 PA2
G
VDDCORE INA10 INB12 INB11 INB14 VDDCORE GND GND GND GND VDDCORE PACH2 PAIQ PAACK PA1 GND
H
GND INA9 INB10 INB8 INB9 VDDCORE GND GND GND GND VDDCORE PA3 PA7 PA5 PA4 VDDCORE
J
CLKA INA8 INA7 INB6 INB7 VDDCORE GND GND GND GND VDDCORE PA12 PA15 PA9 PA8 PA6
K
CLKB INA6 INB4 INB1 INB3 GND VDDIO VDDIO VDDIO VDDIO GND PC3 PCACK PCCH1 PA13 PA10
L
INA5 INB5 INB2 INB0 GND D13 D15 D5 A5 PC12 PC7 PC2 PC0 PCCH0 PA11
M
INA4 INA3 INA0 CHIPID2 D12 D2 D1 A4 A0 (SDI) PC15 PC5 PC1 PCCH2 PA14
N
INA2 INA1 SMODE CHIPID3 GND D9 D4 A6 A2 PC11 PC10 PC4 PCIQ PCGAIN
P
R
T
CPUCLK
(SCLK)
VDDIO
GND MODE CHIPID0 D7 D8 D3 VDDCORE GND GND A7 PC14 PC13 PC8 GND GND
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RESET
IRP
GND IND1 INC6 INC8 INC11 INC15 PBREQ PBACK PB4 PB5 PB1 PCLK
DTACK
(RDY, SDO)
CS (SCS)
CHIPID1 D14 D10 D11 D6 D0 A3 A1 PC9 PC6 VDDIO PCREQ
= VDDCORE = VDDIO = GROUND
Figure 2. CSP_BGA Pin Configuration
Table 8. Pin Function Descriptions
Mnemonic Type Pin No. Function POWER SUPPLY
VDDCORE Power See Table 9 1.8 V Digital Core Supply. VDDIO Power See Table 9 3.3 V Digital I/O Supply. GND Ground See Table 9 Digital Core and I/O Ground.
INPUT (ADC) PORTS (CMOS/LVDS)
CLKA Input K1
Clock for Input Port A. Used to clock INA[15:0]
and EXPA[2:0] data. Additionally, this clock
is used to drive internal circuitry and PLL clock multiplier. CLKB Input L1 Clock for Input Port B. Used to clock INB[15:0] and EXPB[2:0] data. CLKC Input A6 Clock for Input Port C. Used to clock INC[15:0] and EXPC[2:0] data. CLKD Input A5 Clock for Input Port D. Used to clock IND[15:0] and EXPD[2:0] data. INA[0:15] Input See Table 9 Input Port A (Parallel). INB[0:15] Input See Table 9 Input Port B (Parallel). INC[0:15] Input See Table 9 Input Port C (Parallel). IND[0:15] Input See Table 9 Input Port D (Parallel). EXPA[0:2] Bidirectional E3, C1, G5 Exponent Bus Input Port A. Gain control output.
E
F
G
H
J
K
L
M
N
P
R
T
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Mnemonic Type Pin No. Function
EXPB[0:2] Bidirectional D1, F3, G4 Exponent Bus Input Port B. Gain control output. EXPC[0:2] Bidirectional F4, D3, D2 Exponent Bus Input Port C. Gain control output. EXPD[0:2] Bidirectional D4, C2, F5 Exponent Bus Input Port D. Gain control output. CLKA, CLKB Input K1, L1 LVDS Differential Clock for LVDS_A Input Port (LVDS_CLKA+, LVDS_CLKA−). CLKC, CLKD Input A6, A5 LVDS Differential Clock for LVDS_C Input Port (LVDS_CLKC+, LVDS_CLKC−). INA[0:15],
INB[0:15] INC[0:15],
IND[0:15] OUTPUT PORTS PCLK Bidirectional E16 Parallel Output Port Clock. Master mode output, and slave mode input. PA[0:15] Output See Table 9 Parallel Output Port A Data Bus. PACH[0:2] Output
PAIQ Output H13 Parallel Port A I/Q Data Indicator. Logic 1 indicates I data on data bus. PAGAIN Output G13 Parallel Port A Gain Word Output Indicator. Logic 1 indicates gain word on data bus. PAACK Input H14 Parallel Port A Acknowledge (Active High). PAREQ Output F15 Parallel Port A Request (Active High). PB[0:15] Output See Table 9 Parallel Output Port B Data Bus. PBCH[0:2] Output
PBIQ Output D12 Parallel Port B I/Q Data Indicator. Logic 1 indicates I data on data bus. PBGAIN Output A14 Parallel Port B Gain Word Output Indicator. Logic 1 indicates gain word on data bus. PBACK Input E12 Parallel Port B Acknowledge (Active High). PBREQ Output E11 Parallel Port B Request (Active High). PC[0:15] Output See Table 9 Parallel Output Port C Data Bus. PCCH[0:2] Output
PCIQ Output P15 Parallel Port C I/Q Data Indicator. Logic 1 indicates I data on data bus. PCGAIN Output P16 Parallel Port C Gain Word Output Indicator. Logic 1 indicates gain word on data bus. PCACK Input L13 Parallel Port C Acknowledge (Active High). PCREQ Output R16 Parallel Port C Request (Active High).
MISC PINS
RESET
1
IRP SYNC[0:3] Input
LVDS_RSET Input E4 LVDS Resistor Set Pin (Analog Pin). See Design Notes. EXT_FILTER Input R4 PLL Loop Filter (Analog Pin). See Design Notes.
MICROPORT CONTROL
D[0:15] Bidirectional See Table 9 A[0:7] Input See Table 9 Microport Address Bus.
DS (RD) DTACK (RDY)
R/W (WR) MODE Input T3
CS CPUCLK Input R1 Microport CLK Input (Input Only). CHIPID[0:3] Input
LVDS Input See Table 9
LVDS Input See Table 9
G15, D16, H12
C13, D11, B14
M15, L14, N15
Input P3 Master Reset (Active Low). Output T2 Interrupt Pin (Open Drain Output, Needs External Pull-Up Resistor 1 kΩ).
B12, A12, C10, B11
Input P4 Active Low Data Strobe when MODE = 1. Active low read
1
Output M6
Input N4 Read/Write Strobe when MODE = 1. Active low write strobe when MODE = 0.
Input N5 Active Low Chip Select. Logic 1 three-states the microport data bus.
T4, R5, N6, P6
In LVDS input mode, INA[0:15] and INB[0:15] form a differential pair LVDS_A+[0:15] (positive node) and LVDS_A–[0:15] (negative node), respectively.
In LVDS input mode, INC[0:15] and IND[0:15] form a differential pair LVDS_C+[0:15] (positive node) and LVDS_C–[0:15] (negative node), respectively.
Channel Indicator Output Port A.
Channel Indicator Output Port B.
Channel Indicator Output Port C.
Synchronization Inputs. SYNC pins are indepe independent of each other.
Bidirectional Microport Data. This bus is three-stated when CS is high.
Active Low Data Acknowledge when MODE = 1. Microport status pin when MO Open drain output, needs external pull-up resistor 1 kΩ.
Mode Select Pin. When SMODE = 0: Logic 0 = Intel mod When SMODE = 1: Logic 0 = SPI mode; Logic 1 = SPORT mode.
Chip ID Input Pins.
ndent of channels or input ports and
strobe when MODE = 0.
e; Logic 1 = Motorola mode.
DE = 0.
Rev. A | Page 12 of 80
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Mnemonic Type Pin No. Function SERIAL PORT CONTROL
SCLK Input R1 Serial Clock.
1
SDO
2
SDI STFS Input N4 Serial Transmit Frame Sync. SRFS Input P4 Serial Receive Frame Sync. SCS MSB_FIRST Input R3
SMODE Input P5 Serial Mode Select. Pull high when serial port is used and low when microport is used.
JTAG
1
TRST
2
TCLK
1
TMS TDO Output A13 Test Data Output. Three-stated when JTAG is in reset.
1
TDI
1
Pin with a pull-up resistor of nominal 70 kΩ.
2
Pin with a pull-down resistor of nominal 70 kΩ.
Output M6 Serial Port Data Output (Open drain output, needs external pull-up resistor 1KΩ). Input N11 Serial Port Data Input.
Input N5 Serial Chip Select.
Select MSB First into SDI Pin and MSB First Out of SDO Pin.
Logic 0 = MSB first; Logic 1 = LSB first.
Input B13 Test Reset Pin. Pull low when JTAG is not used. Input C12 Test Clock.
Input C11 Test Mode Select.
Input D10 Test Data Input.

PIN LISTING FOR POWER, GROUND, DATA, AND ADDRESS BUSES

Table 9.
Mnemonic Pin No.
VDDCORE A9, G6, G11, H1, H6, H11, J6, J11, J16, K6, K11, T8 VDDIO B2, B15, F7, F8, F9, F10, L7, L8, L9, L10, R2, R15 GND
INA[0:15] N3, P2, P1, N2, N1, M1, L2, K3, K2, J2, H2, G1, F1, F2, E1, E2 INB[0:15] M4, L4, M3, L5, L3, M2, K4, K5, J4, J5, J3, H4, H3, G2, H5, G3 INC[0:15] C3, C4, B3, A2, D6, C6, E7, D7, E8, D8, C8, E9, D9, C9, B10, E10 IND[0:15] B1, E6, D5, C5, A3, B4, B5, A4, B6, C7, B7, A7, B8, B9, A10, A11 PA[0:15] F16, H15, G16, J12, J15, J14, K16, J13, K15, K14, L16, M16, K12, L15, N16, K13 PB[0:15] F13, E15, G14, G12, E13, E14, F12, F14, C14, D14, C16, A15, B16, D15, D13, C15 PC[0:15] M14, N14, M13, L12, P14, N13, R14, M12, T14, R13, P13, P12, M11, T13, T12, N12 D[0:15] R10, N9, N8, T7, P9, M9, R9, T5, T6, P8, R7, R8, N7, M7, R6, M8 A[0:7] N11, R12, P11, R11, N10, M10, P10, T11
A1, A8, A16, E5, F6, F11, G7, G8, G9, G10, H7, H8, H9, H10, H16, J1, J7, J8, J9, J10, K7, K8, K9, K10, L6, L11, M5, P7, T1, T9,
T10, T15, T16
Rev. A | Page 13 of 80
AD6636
C
A
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TIMING DIAGRAMS

CLK
LKx
RESET
t
RESL
Figure 3. Reset Timing Requirements
t
CLKH
t
CLKL
Figure 4. CLK Switching Characteristics
(x = A
, B, C, D for Individual Input Ports)
t
CLK
t
CLKH
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t
CLKL
CLKx
CPUCLK
SCLK
CLKA
t
CLKSKEW
Figure 5. CLK Skew Characteristics
(x = B
, C, D for Individual Input Ports)
t
CPUCLKH
t
CPUCLKL
Figure 6. CPUCLK Switching Characteristics
t
SCLKH
t
SCLKL
Figure 7. SCLK Switching Characteristics
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04998-0-006
04998-0-007
t
HSYNC
YNC [3:0]
t
SSYNC
Figure 8. SYNC Tim ing Inputs
Rev. A | Page 14 of 80
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t
CLK
t
CLKx
EXPx[2:0]
t
CLKH
t
DEXP
Figure 9. Gain Control Word Output Switching Characteristics
(x = A
, B, C, D for Individual Input Ports)
CLKx
CLKL
04998-0-009
PCLK
PxACK
t
DPREQ
PxREQ
Px [15:0]
PxIQ
PxCH [2:0]
PxGAIN
INx[15:0]
EXPx[15:0]
t
SPA
t
SEXP
t
SI
t
HEXP
t
HI
Figure 10. Input Port Timing for Data
(x = A
, B, C, D for Individual Input Ports)
t
DPP
I [15:0] Q [15:0]
t
DPIQ
t
DPCH
t
DPP
RSSI [11:0]
PxCH [2:0] = CHANNEL #
t
DPGAIN
t
t
DPP
DPP
I [15:0] Q [15:0]
t
DPIQ
t
DPCH
PxCH [2:0] = CHANNEL #
Figure 11. Master Mode PxACK to PCLK Switching Characteristics
(x = A, B
, C, D for Individual Output Ports)
t
t
DPGAIN
DPP
04998-0-010
t
HPA
t
DPP
RSSI [11:0]
04998-0-011
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PCLK
PxACK
PxREQ
Px [15:0]
PxIQ
PxCH [2:0]
PxGAIN
CPUCLK
RD
WR
CS
t
t
DPIQ
DPREQ
TIED LOGIC HIGH ALL THE TIME
t
DPP
I [15:0] Q [15:0]
t
DPCH
t
DPP
PxCH [2:0] = CHANNEL #
t
DPGAIN
t
DPP
RSSI [11:0] RSSI [11:0]
Figure 12. Master Mode PxREQ to PCLK Switching Characteristics
t
SC
t
SC
t
DPP
I [15:0] Q [15:0]
t
DPIQ
t
DPCH
PxCH [2:0] = CHANNEL #
t
HC
t
HC
t
t
DPGAIN
DPP
t
DPP
04998-0-012
t
SAM
A [7:0]
t
SAM
D [15:0]
RDY
NOTE:
t
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. IT CAN VARY FROM 3 TO 9 CPUCLK CYCLES.
ACC
t
DRDY
VALID ADDRESS
VALID DATA
t
ACC
t
HAM
t
HAM
Figure 13. INM Microport Write Timing Requirements
04998-0-013
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AD6636
K
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CPUCLK
t
HC
t
HC
t
HAM
t
DD
RD
WR
CS
A [7:0]
t
SAM
t
SC
t
SC
VALID ADDRESS
D [15:0]
t
DRDY
RDY
t
ACC
NOTE:
t
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. IT CAN VARY FROM 3 TO 9 CPUCLK CYCLES.
ACC
VALID DATA
Figure 14. INM Microport Read Timing Requirements
CPUCL
t
HC
t
HC
t
HC
t
HAM
DS
R/W
CS
A [7:0]
t
SAM
t
SC
t
SC
t
SC
VALID ADDRESS
04998-0-014
t
SAM
D [15:0]
DTACK
NOTE:
t
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. IT CAN VARY FROM 3 TO 9 CPUCLK CYCLES.
ACC
VALID DATA
t
ACC
t
DDTACK
t
HAM
Figure 15. MNM Microport Write Timing Requirements
Rev. A | Page 17 of 80
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AD6636
t
K
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CPUCL
t
SC
DS
t
SC
R/W
t
SC
CS
t
SAM
A [7:0]
D [15:0]
DTACK
NOTE:
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. IT CAN VARY FROM 3 TO 9 CPUCLK CYCLES.
ACC
VALID ADDRESS
t
ACC
t
DD
VALID DATA
t
DDTACK
Figure 16. MNM Microport Read Timing Requirements
t
t
t
HC
t
HC
HC
HAM
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SCLK
SCS
SMODE
SDI
SRFS
MODE
t
SSCS
t
SSRFS
t
SSDI
t
HSDI
D0 D1 D2 D3 D4 D5 D6 D7
t
HSRFS
LOGIC 1
LOGIC 1
Figure 17. SPORT Mode Write Timing Characteristics
t
HSCS
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SCLK
t
SSCS
SCS
t
HSCS
SMODE
SDO
STFS
MODE
SCLK
SCS
MODE
SDI
t
SSTFS
t
SSDI
LOGIC 1
t
DSDO
D0 D1 D2 D3 D4 D5 D6 D7
t
HSTFS
LOGIC 1
Figure 18. SPORT Mode Read Timing Characteristics
t
SSCS
t
HSDI
D0 D1 D2 D3 D4 D5 D6 D7
LOGIC 1
t
HSCS
04998-0-018
MODE
LOGIC 0
04998-0-019
Figure 19. SPI Mode Write Timing Characteristics
SCLK
SCS
SMODE
SDO
MODE
t
SSCS
LOGIC 0
t
DSDO
D0 D1 D2 D3 D4 D5 D6 D7
LOGIC 0
t
HSCS
04998-0-020
Figure 20. SPI Mode Read Timing Characteristics
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THEORY OF OPERATION

ADC INPUT PORT

The AD6636 features four identical, independent high speed ADC input ports named A, B, C, and D. These input ports have the flexibility to allow independent inputs, diversity inputs, or complex I/Q inputs. Any of the ADC input ports can be routed to any of the six tuner channels; that is, any of the six. The AD6636 channels can receive input data from any of the input ports. Time-multiplexed inputs on a single port are not supported in the AD6636.
These four input ports can operate at up to 150 MSPS. Each in
put port has its own clock (CLKA, CLKB, CLKC, and CLKD) used for registering input data into the AD6636. To allow slow input rates while providing fast processing clock rates, the AD6636 contains an internal PLL clock multiplier that supplies the internal signal processing clock. CLKA is used as an input to the PLL clock multiplier. Additional programmability allows the input data to be clocked into the part either on the rising edge or the falling edge of the input clock.
In addition, the front end of the AD6636 contains circuitry that
bles high speed signal-level detection, gain control, and
ena quadrature I/Q correction. This is accomplished with a unique high speed level-detection circuit that offers minimal latency and maximum flexibility to control all four input signals (typically ADC inputs) individually. The input ports also provide input power-monitoring functions via various modes and magnitude and phase I/Q correction blocks. See the Quadrature I/Q Correction Block section for details.
The 3-exponent bits are shared with the gain range control bits i
n the hardware. When floating-point ADCs are not used, these three pins on each ADC input port can be used as gain range control output bits.

Input Timing

The data from each high speed input port is latched either on the rising edge or the falling edge of the port’s individual CLKx (where x stands for A, B, C, or D input ports). The ADC clock invert bit in ADC clock control register selects the edge of the clock (rising or falling) used to register input data into the AD6636.
CLKx
INx [15:0]
EXPx [2:0]
CLKx
INx [15:0]
EXPx [2:0]
t
SI
Figure 21. Input Data Timing Requirements
ising Edge of Clock, x = A, B, C, or D for Four Input Ports)
(R
t
Figure 22. Input Data Timing Requirements
(F
alling Edge of Clock, x = A, B, C, or D for Four Input Ports)
t
HI
DATA n DATA n + 1
t
SI
HI
DATA n DATA n + 1
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04998-0-022
Each individual processing channel can receive input data from
ny of the four input ports individually. This is controlled using
a 3-bit crossbar mux-select bit words in the ADC input control register. Each individual channel has a similar 3-bit selection. In addition to the four input ports, an internal test signal (PN— pseudorandom noise sequence) can also be selected. This internal test signal is discussed in the
Self-Test (BIST) section.
In
User-Configurable, Built-

Input Data Format

Each input port consists of a 16-bit mantissa and a 3-bit exponent (16 + 3 floating-point input, or up to 16-bit fixed­point input). When interfacing to standard fixed-point ADCs, the exponent bit should either be connected to ground or be programmed as outputs for gain control output. If connected to a floating-point ADC (also called gain ranging ADC), the exponent bits from the ADC can be connected to the input exponent bits of the AD6636. The mantissa data format is twos complement, and the exponent is unsigned binary.
Rev. A | Page 20 of 80
The clock signals (CLKA, CLKB, CLKC, and CLKD) can operate at up to 150 MHz. In applications using high speed ADCs, the ADC sample clock, data valid, or data-ready strobe are typically used to clock the AD6636.

Connection to Fixed-Point ADC

For fixed-point ADCs, the AD6636 exponent inputs, EXP[2:0], are not typically used and should be tied low. Alternatively, because these pins are shared with gain range control bits, if the gain ranging block is used, these pins can be used as outputs of the gain range control block. The ADC outputs are tied directly to the AD6636 inputs, MSB justified. Therefore, for fixed-point ADCs, the exponents are typically static and no input scaling is used in the AD6636.
Figure 23 shows a typical interconnection.
AD6636
A
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D13 (MSB)
AD6645
14-BIT ADC
D0 (LSB)
GAIN RANGING CONTROL
BITS OR GROUNDED
EXPONENT BITS
Figure 23. Typical Interconnection of the AD6645 Fixed-Point ADC and AD6636
IN15
AD6636
IN2 IN1 IN0
EXP2 EXP1 EXP0
04998-0-023

Scaling with Floating-Point ADC

An example of the exponent control feature combines the AD6600 and the AD6636. The AD6600 is an 11-bit ADC with three bits of gain ranging. In effect, the 11-bit ADC provides the mantissa, and the three bits of the relative signal strength indicator (RSSI) are the exponent. Only five of the eight available steps are used by the AD6600. See the she
et for details.
Table 10. Weighting Factors for Different E
ADC Input Level
AD6636 Exp[2:0]
Data Divide-By
AD6600 data
xp[2:0] Values
Signal Attenuation (dB)
Largest 000 (0) /1 (>> 0) 0
Smallest 111 (7) /128 (>> 7) 42
001 (1) /2 (>> 1) 6 010 (2) /4 (>> 2) 12 011 (3) /8 (>> 3) 18 100 (4) /16 (>> 4) 24 101 (5) /32 (>> 5) 30 110 (6) /64 (>> 6) 36

Complex (I/Q) Input Ports

The four individual ADC input ports of the AD6636 can be configured to function as two complex input ports. Additionally, if required, only two input ports can be made to function as a complex port, while the remaining two input ports function as real individual input ports.
In complex mode, Input Port A is paired with Input Port B to
ceive I and Q data, respectively. Similarly, Input Port C can be
re paired with Input Port D to receive I and Q data, respectively. These two pairings are controlled individually using Bit 24 and Bit 25 of the ADC input control register.
As explained previously, each individual channel can receive
put signals from any of the four input ports using the crossbar
in mux select bits in the ADC input control register. In addition to the three bits, a 1-bit selection is provided for choosing the complex input port option for any individual channel. For example, if Channel 0 needs to receive complex input from Input Port A and Input Port B, the mux select bits should
indicate Input Port A, and the complex input bit should be selected.
When the input ports are paired for complex input operation,
nly one set of exponent bits is driven externally with gain
o control output. Therefore, when Input Port A and Input Port B form a complex input, EXPA[2:0] are output and, similarly, for Input Port C and Input Port D, EXPC[2:0] are output.

LVDS Input Ports

The AD6636 input ports can be configured in CMOS mode or LVDS mode. In CMOS input mode, the four input ports can be configured as two complex input ports. In LVDS mode, two CMOS input ports are each combined to form one LVDS input port.
CMOS Input Port INA[15:0] and CMOS Input Port INB[15:0] fo
rm the positive and negative differential nodes, LVDS_A+[15:0] and LVDS_A−[15:0], respectively. Similarly, INC[15:0] and IND[15:0] form the positive and negative differential nodes, LVDS_C+[15:0] and LVDS_C− [15:0], respectively. CLKA and CLKB form the differential pair, Pin LVDS_CLKA+ and Pin LVDS_CLKA−. Similarly, CLKC and CLKD form the differential pair Pin LVDS_CLKC+ and Pin LVDS_CLKC−.
By default, the AD6636 powers up in CMOS mode and can be
rogrammed to CMOS mode by using the CMOS mode bit
p (Bit 10 of the LVDS control register). Writing Logic 1 to Bit 8 of the LVDS control register enables an autocalibrate routine that calibrates the impedance of the LVDS pads to match the output impedance of the LVDS signal source impedance. The LVDS pads in the AD6636 have an internal impedance of 100 Ω across the differential signals; therefore, an external resistor is not required.

PLL CLOCK MULTIPLIER

In the AD6636, the input clock rate must be the same as the input data rate. In a typical digital downconverter architecture, the clock rate is a limitation on the number of filter taps that can be calculated in the programmable RAM coefficient filters (MRCF, DRCF, and CRCF). For slower ADC clock rates (or for any clock rate), this limitation can be overcome by using a PLL clock multiplier to provide a higher clock rate to the RCF filters. Using this clock multiplier, the internal signal processing clock rate can be increased up to 200 MHz. The CLKA signal is used as an input to the PLL clock multiplier.
PLL CLOCK GENERATION
CLK
DIVIDE BY N (1, 2, 4 OR 8)
PLL CLOCK MULITPLIER
(4x TO 20x)
2 5
NM
Figure 24. PLL Clock Generation
1 0
0
1 BYPASS_PLL 1 FOR BYPASS
ADC_CLK
PLL_CLK
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The PLL clock multiplier is programmable and uses input clock rates between 4 MHz and 150 MHz to give a system clock rate (output) of as high as 200 MHz.
The output clock rate is given by
MCLKA
PLL_CLK×=
where:
CLKA is t
M i
N is a p
M is a 5-b
(predivide) can be 1, 2, 4, or 8. The multiplication factor M is programmed using a 5-bit PLL clock multiplier word in the ADC clock control register. A value outside the valid range of 4 to 20 bypasses the PLL clock multiplier and, therefore, the PLL clock is the same as the input clock. The predivide factor N is programmed using a 2-bit ADC pre-PLL clock divider word in the ADC clock control register, as listed in
Table 11. PLL Clock Generation Predivider Control
Predivide Word [1:0] Divide-by Value for the Clock
00 Divide-by-1, bypass 01 Divide-by-2 10 Divide-by-4 11 Divide-by-8
For the best signal processing advantage, the user should program the clock multiplier to give a system clock output as close as possible to, but not exceeding, 200 MHz. The internal blocks of the AD6636 that run off of the PLL clock are rated to run at a maximum of 200 MHz. The default power-up state for the PLL clock multiplier is the bypass state, where CLKA is passed on as the PLL clock.
he Input Port A clock rate.
s a 5-bit programmable multiplication factor.
redivide factor.
it number between 4 and 20 (both values included). N
Table 1 1.

Function

The gain-control block features a programmable upper threshold register and a lower threshold register. The ADC input data is compared to both these registers. If ADC input data is larger than the upper threshold register, then the gain control output is decremented by 1. If ADC input data is smaller than the lower threshold register, then the gain control output is incremented by 1. When decrementing the gain control output, the change is immediate. But when incrementing the output, a dwell-time register is used to delay the change. If the ADC input is larger than the upper threshold register value, the gain-control output is decremented to prevent overflow immediately.
When the ADC input is lower than the lower threshold register, a
dwell timer is loaded with the value in the programmable, 20-bit, dwell-time register. The counter decrements once every input clock cycle, as long as the input signal remains below the lower threshold register value. If the counter reaches 1, the gain control output is incremented by 1. If the signal goes above the lower threshold register value, the gain adjustment is not made, and the normal comparison to lower and upper threshold registers is initiated once again. Therefore, the dwell timer provides temporal hysteresis and prevents the gain from switching continuously.
In a typical application, if the ADC signal goes below the lower th
reshold for a time greater than the dwell time, then the gain control output is incremented by 1. Gain control bits control the gain ranging block, which appears before the ADC in the signal chain. With each increment of the gain control output, gain in the gain-ranging block is increased by 6.02 dB. This increases the dynamic range of the input signal into the ADC by 6.02 dB. This gain is compensated for in the AD6636 by relinearizing (see the in the gain-ranging block can support it.
Relinearization section). Therefore, the AD6636 can
crease the dynamic range of the ADC by 42 dB, provided that

ADC GAIN CONTROL

Each ADC input port has individual, high speed, gain-control logic circuitry. Such gain-control circuitry is useful in applica­tions that involve large dynamic range inputs or in which gain ranging ADCs are employed. The AD6636 gain-control logic allows programmable upper and lower thresholds and a programmable dwell-time counter for temporal hysteresis.
Each input port has a 3-bit output from the gain control block. Th
ese three output pins are shared with the 3-bit exponent input pins for each input port. The operation is controlled by the gain control enable bit in the gain control register of the individual input ports. Logic 1 in this bit programs the EXP[2:0] pins as gain-control outputs, and Logic 0 configures the pins as input exponent pins. To avoid bus contention, these pins are set, by default, as input exponent pins.
Rev. A | Page 22 of 80

Relinearization

The gain in the gain-ranging block (external) is compensated for by relinearizing, using the exponent bits, EXP[2:0], of the input port. For this purpose, the gain control bits are connected to the EXP[2:0] bits, providing an attenuation of 6.02 dB for every increase in the gain control output. After the gain in the external gain-ranging block and the attenuation in the AD6636 (using EXP bits), the signal gain is essentially unchanged. The only change is the increase in the dynamic range of the ADC.
External gain-ranging blocks or gain-ranging ADCs have a dela
y associated with changing the gain of the signal. Typically, these delays can be up to 14 clock cycles. The gain change in the AD6636 (via EXP[2:0]) must be synchronized with the gain change in the gain-ranging block (external). This is allowed in the AD6636 by providing a flexible delay, programmable 6-bit word in the gain control register. The value in this 6-bit word
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gives the delay in input clock cycles. A programmable pipeline delay given by the 6-bit value (maximum delay of 63 clock cycles) is placed between the gain control output and the EXP[2:0] input. Therefore, the external gain-ranging block’s settling delays are compensated for in the AD6636.
Note that any gain changes that are initiated during the r
elinearization period are ignored. For example, if the AD6636 detects that a gain adjustment is required during the relineariza­tion period of a previous gain adjustment, then the new adjustment is ignored.

Setting Up the Gain Control Block

To set up the gain control block for individual input ports, the individual upper threshold registers and lower threshold registers should be written with appropriate values. The 10-bit values written into upper and lower threshold registers are compared to the 10 MSB bits of the absolute magnitude calculated using the input port data. The 20-bit dwell timer register should have the appropriate number of clock cycles to provide temporal hysteresis.
A 6-bit relinearization pipeline delay word is set to synchronize wi
th the settling delay in the external gain ranging circuitry. Finally, the gain control enable bit is written with Logic 1 to activate the gain control block. On enabling, the gain control output bits are made 000 (output on EXP[2:0] pins), which represent the minimum gain for the external gain-ranging circuitry and corresponding minimum attenuation during relinearization. The normal functioning takes over, as explained previously in this section.

Complex Inputs

For complex inputs (formed by pairing two input ports), only one set of EXP[2:0] pins should be used as the gain control output. For the pair of Input Port A and Input Port B, gain control circuitry for Input Port A is active, and EXPA[2:0] should be connected externally as the gain control output. The gain control circuitry for Input Port B is not activated (shut down), and EXPB[2:0] is forced to be equal to EXP[2:0].
FROM
MEMORY
MAP
FROM INPUT
FROM
MEMORY
MAP
PORTS
UPPER
THRESHOLD
REGISTER
LOWER
THRESHOLD
REGISTER
Figure 25. AD6636 Gain Control Block Diagram
B A
A B
COMPARE
A > B
COMPARE
A < B
DECREASE
EXTERNAL GAIN
INCREASE
EXTERNAL GAIN
DWELL
TIMER
DEC
EXP GEN
INC
EXP [2:0]
04998-0-025

ADC INPUT PORT MONITOR FUNCTION

The AD6636 provides a power-monitor function that can monitor and gather statistics about the received signal in a signal chain. Each input port is equipped with an individual power-monitor function that can operate both in real and complex modes of the input port. This function block can operate in one of three modes, which measure the following over a programmable period of time:
ak power
Pe
an power
Me
N
umber of samples crossing a threshold
These functions are controlled via the 2-bit power-monitor f
unction select bits of the power monitor control register for each individual input port. The input ports can be set for different modes, but only one function can be active at a time for any given input port.
The three modes of operation can function continuously over a
rogrammable time period. This time period is programmed as
p the number of input clock cycles in a 24-bit ADC monitor period register (AMPR). This register is separate for each input port. An internal magnitude storage register (MSR) is used to monitor, accumulate, or count, depending on the mode of operation.

Peak Detector Mode (Control Bits 00)

The magnitude of the input port signal is monitored over a programmable time period (given by AMPR) to give the peak value detected. This mode is set by programming Logic 0 in the power-monitor function select bits of the power-monitor control register for each individual input port. The 24-bit AMPR must be programmed before activating this mode.
After enabling this mode, the value in the AMPR is loaded into a m
onitor period timer and the countdown is started. The magnitude of the input signal is compared to the MSR, and the greater of the two is updated back into the MSR. The initial value of the MSR is set to the current ADC input signal magnitude. This comparison continues until the monitor period timer reaches a count of 1.
When the monitor period timer reaches a count of 1, the value
he MSR is transferred to the power-monitor holding register,
in t which can be read through the microport or the serial port. The monitor period timer is reloaded with the value in the AMPR, and the countdown is started. Also, the first input sample’s magnitude is updated in the MSR, and the comparison and update procedure, as explained above, continues. If the interrupt is enabled, an interrupt is generated, and the interrupt status register is updated when the AMPR reaches a count of 1.
Rev. A | Page 23 of 80
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Figure 26 is a block diagram of the peak detector logic. The MSR contains the absolute magnitude of the peak detected by the peak detector logic.
FROM
MEMORY
MAP
FROM INPUT
PORTS
LOAD
CLEAR
DOWN
COUNTER
IS COUNT = 1?
POWER MONITOR
HOLDING
REGISTER
POWER MONITOR
PERIOD REGISTER
MAGNITUDE
STORAGE
REGISTER
LOAD LOAD
COMPARE
A>B
Figure 26. ADC Input Peak Detector Block Diagram
TO
INTERRUPT
CONTROLLER
TO
MEMORY
MAP

Mean Power Mode (Control Bits 01)

In this mode, the mean power of the input port signal is integrated (by adding an accumulator) over a programmable time period (given by AMPR) to give the mean power of the input signal. This mode is set by programming Logic 1 in the power monitor function select bits of the power monitor control register for each individual input port. The 24-bit AMPR, representing the period over which integration is performed, must be programmed before activating this mode.
After enabling this mode, the value in the AMPR is loaded into a m
onitor period timer, and the countdown is started immediately. The 15-bit mean power of input signal is right­shifted by nine bits to give 6-bit data. This 6-bit data is added to the contents of a 24-bit holding register, thus performing an accumulation. The integration continues until the monitor period timer reaches a count of 1.
When the monitor period timer reaches a count of 1, the value
he MSR is transferred to the power-monitor holding register
in t (after some formatting), which can be read through the microport or the serial port. The monitor period timer is reloaded with the value in the AMPR, and the countdown is started. Also, the first input sample signal power is updated in the MSR, and the accumulation continues with the subsequent input samples. If the interrupt is enabled, an interrupt is generated, and the interrupt status register is updated when the AMPR reaches a count of 1. po
wer-monitoring logic.
Figure 27 illustrates the mean
The value in the MSR is a floating-point number with 4 MSBs
nd 20 LSBs. If the 4 MSBs are EXP and the 20 LSBs are MAG,
a the value in dBFS can be decoded by
Mean Power = 10 log
⎛ ⎜
MAG
20
2
2
⎟ ⎠
EXP
)( 1
⎥ ⎦
FROM
MEMORY
MAP
FROM INPUT
PORTS
POWER MONITOR
PERIOD REGISTER
ACCUMULATOR
DOWN
COUNTER
LOAD
CLEAR LOAD
IS COUNT = 1?
POWER MONITOR
HOLDING
REGISTER
TO
INTERRUPT
CONTROLLER
TO
MEMORY
MAP
04998-0-027
Figure 27. ADC Input Mean Power-Monitoring Block Diagram

Threshold Crossing Mode (Control Bits 10)

In this mode of operation, the magnitude of the input port signal is monitored over a programmable time period (given by AMPR) to count the number of times it crosses a certain
04998-0-026
programmable threshold value. This mode is set by program­ming Logic 1x (where x is a don’t care bit) in the power-monitor function select bits of the power monitor control register for each individual input port. Before activating this mode, the user needs to program the 24-bit AMPR and the 10-bit upper threshold register for each individual input port. The same upper threshold register is used for both power monitoring and gain control (see the
ADC Gain Control section).
After entering this mode, the value in the AMPR is loaded into
onitor period timer, and the countdown is started. The
a m magnitude of the input signal is compared to the upper threshold register (programmed previously) on each input clock cycle. If the input signal has magnitude greater than the upper threshold register, then the MSR register is incremented by 1. The initial value of the MSR is set to 0. This comparison and increment of the MSR register continues until the monitor period timer reaches a count of 1.
When the monitor period timer reaches a count of 1, the value
he MSR is transferred to the power monitor holding register,
in t which can be read through the microport or the serial port. The monitor period timer is reloaded with the value in the AMPR, and the countdown is started. The MSR register is also cleared to a value of 0. If interrupts are enabled, an interrupt is generated, and the interrupt status register is updated when the AMPR reaches a count of 1.
ossing logic. The value in the MSR is the number of samples
cr
Figure 28 illustrates the threshold
that have an amplitude greater than the threshold register.
FROM
MEMORY
MAP
FROM INPUT
PORTS
FROM
MEMORY
MAP
POWER MONITOR
PERIOD REGISTER
A
COMPARE
A > B
UPPER
THRESHOLD
REGISTER
B
DOWN
COUNTER
LOAD
CLEAR
COMPARE
IS COUNT = 1?
A > B
Figure 28. ADC Input Threshold Crossing Block Diagram
LOAD
POWER MONITOR
HOLDING
REGISTER
TO
INTERRUPT
CONTROLLER
TO
MEMORY
MAP
04998-0-028
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