ANALOG DEVICES AD637 Service Manual

High Precision, Wideband
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FEATURES

High accuracy
0.02% maximum nonlinearity, 0 V to 2 V rms input
0.10% additional error to crest factor of 3
Wide bandwidth
8 MHz at 2 V rms input 600 kHz at 100 mV rms
Computes
True rms Square Mean square
Absolute value dB output (60 dB range) Chip select/power-down feature allows
Analog three-state operation
Quiescent current reduction from 2.2 mA to 350 μA 14-lead SBDIP, 14-lead low cost CERDIP, and 16-lead SOIC_W

GENERAL DESCRIPTION

BUFF IN
DEN INPUT
OUTPUT
OFFSET
COMMON
RMS-to-DC Converter

FUNCTIONAL BLOCK DIAGRAM

V
CS
ABSOLUTE
IN
VALUE
25k
SQUARER/
DIVIDE R
BIAS
Figure 1.
25k
AD637
AD637
BUFF OUT
RMS OUT
C
AV
dB OUTPUT
00788-001
The AD637 is a complete, high accuracy, monolithic rms-to-dc converter that computes the true rms value of any complex waveform. It offers performance that is unprecedented in integrated circuit rms-to-dc converters and comparable to discrete and modular techniques in accuracy, bandwidth, and dynamic range. A crest factor compensation scheme in the AD637 permits measurements of signals with crest factors of up to 10 with less than 1% additional error. The wide band­width of the AD637 permits the measurement of signals up to 600 kHz with inputs of 200 mV rms and up to 8 MHz when the input levels are above 1 V rms.
As with previous monolithic rms converters from Analog
vices, Inc., the AD637 has an auxiliary dB output available to
De users. The logarithm of the rms output signal is brought out to a separate pin, allowing direct dB measurement with a useful range of 60 dB. An externally programmed reference current allows the user to select the 0 dB reference voltage to correspond to any level between 0.1 V and 2.0 V rms.
A chip select connection on the AD637 permits the user to
ease the supply current from 2.2 mA to 350 μA during periods
decr when the rms function is not in use. This feature facilitates the addition of precision rms measurement to remote or handheld applications where minimum power consumption is critical. In addition, when the AD637 is powered down, the output goes to a high impedance state. This allows several AD637s to be tied together to form a wideband true rms multiplexer.
Rev. J
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The input circuitry of the AD637 is protected from overload
oltages in excess of the supply levels. The inputs are not
v damaged by input signals if the supply voltages are lost.
The AD637 is available in accuracy Grade J and Grade K for
mmercial temperature range (0°C to 70°C) applications, accuracy
co Grade A and Grade B for industrial range (−40°C to +85°C) appli­cations, and accuracy Grade S rated over the −55°C to +125°C temperature range. All versions are available in hermetically sealed, 14-lead SBDIP, 14-lead CERDIP, and 16-lead SOIC_W packages.
The AD637 computes the true root mean square, mean square, o
r absolute value of any complex ac (or ac plus dc) input waveform and gives an equivalent dc output voltage. The true rms value of a waveform is more useful than an average rectified signal because it relates directly to the power of the signal. The rms value of a statistical signal is also related to the standard deviation of the signal.
The AD637 is laser wafer trimmed to achieve rated performance
ithout external trimming. The only external component
w required is a capacitor that sets the averaging time period. The value of this capacitor also determines low frequency accuracy, ripple level, and settling time.
The on-chip buffer amplifier can be used either as an input
uffer or in an active filter configuration. The filter can be used
b to reduce the amount of ac ripple, thereby increasing accuracy.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
AD637
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TABLE OF CONTENTS

Features .............................................................................................. 1
Choosing the Averaging Time Constant....................................9
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Functional Description ....................................................................7
Standard Connection ................................................................... 8
Chip Select..................................................................................... 8
Optional Trims for High Accuracy............................................ 8

REVISION HISTORY

4/07—Rev. I to Rev. J
Added Evaluation Board Section ................................................. 16
Updated Outline Dimensions....................................................... 20
10/06—Rev. H to Rev. I
hanges to Table 1............................................................................ 3
C
Changes to Figure 4.......................................................................... 7
Changes to Figure 7.......................................................................... 9
Changes to Figure 16, Figure 18, and Figure 19......................... 12
Changes to Figure 20...................................................................... 13
12/05—Rev. G to Rev. H
pdated Format..................................................................Universal
U
Changes to Figure 1.......................................................................... 1
Changes to Figure 11...................................................................... 10
Updated Outline Dimensions....................................................... 16
Changes to Ordering Guide.......................................................... 17
Frequency Response .................................................................. 11
AC Measurement Accuracy and Crest Factor........................ 12
Connection for dB Output........................................................ 12
dB Calibration............................................................................. 13
Low Frequency Measurements................................................. 14
Vector Summation ..................................................................... 14
Evaluation Board ............................................................................ 16
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 20
4/05—Rev. F to Rev. G
pdated Format..................................................................Universal
U
Changes to Figure 1...........................................................................1
Changes to General Description .....................................................1
Deleted Product Highlights .............................................................1
Moved Figure 4 to Page ....................................................................8
Changes to Figure 5...........................................................................9
Changes to Figure 8........................................................................ 10
Changes to Figure 11, Figure 12, Figure 13, and Figure 14....... 11
Changes to Figure 19...................................................................... 14
Changes to Figure 20...................................................................... 14
Changes to Figure 21...................................................................... 16
Updated Outline Dimensions....................................................... 17
Changes to Ordering Guide.......................................................... 18
3/02—Rev. E to Rev. F
dits to Ordering Guide...................................................................3
E
Rev. J | Page 2 of 20
AD637
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SPECIFICATIONS

At 25°C and ±15 V dc, unless otherwise noted.
Table 1.
AD637J/AD637A AD637K/AD637B AD637S Parameter Min Typ Max Min Typ Max Min Typ Max Unit
TRANSFER FUNCTION
CONVERSION ACCURACY
Total Error, Internal Trim2
(Figure 5) T
to T
MIN
vs. Supply
vs. Supply
DC Reversal
Nonlinearity 2 V Full Scale3 Nonlinearity 7 V Full Scale Total Error, External Trim ±0.5 ± 0.1 ±0.25 ± 0.05 ±0.5 ± 0.1 mV ± % of
ERROR VS. CREST FACTOR
Crest Factor 1 to 2 Specified accuracy Specified accuracy Specified accuracy Crest Factor = 3 ±0.1 ±0.1 ±0.1 % of
Crest Factor = 10 ±1.0 ±1.0 ±1.0 % of
AVERAGING TIME CONSTANT 25 25 25 ms/μF C INPUT CHARACTERISTICS
Signal Range, ±15 V Supply
Continuous RMS Level 0 to 7 0 to 7 0 to 7 V rms Peak Transient Input ±15 ±15 ±15 V p-p
Signal Range, ±5 V Supply
Continuous RMS Level 0 to 4 0 to 4 0 to 4 V rms Peak Transient Input ±6 ±6 ±6 V p-p
Maximum Continuous
Nondestructive Input Level
(All Supply Voltages) Input Resistance 6.4 8 9.6 6.4 8 9.6 6.4 8 9.6 kΩ Input Offset Voltage ±0.5 ±0.2 ±0.5 mV
FREQUENCY RESPONSE5
Bandwidth for 1%
Additional Error
(0.09 dB)
VIN = 20 mV 11 11 11 kHz
VIN = 200 mV 66 66 66 kHz
VIN = 2 V 200 200 200 kHz ±3 dB Bandwidth
VIN = 20 mV 150 150 150 kHz
VIN = 200 mV 1 1 1 MHz
VIN = 2 V 8 8 8 MHz
MAX
= 300 mV
+V
IN
= −300 mV
−V
IN
Error at 2 V
4
V
=
OUT
30
100
±15 ±15 ±15 V p-p
1
2
)(V avg × V
IN
±1 ± 0.5 ±0.5 ± 0.2 ±1 ± 0.5
±3.0 ± 0.6 ±2.0 ± 0.3 ±6 ± 0.7
150
300
0.25
0.04
0.05
30
100
OUT
=
2
)(V avg × V
IN
150
300
0.1
0.02
0.05
30
100
OUT
=
)(V avg ×
IN
2
150
300
0.25
0.04
0.05
mV ±% of re
ading
mV ± % of reading
μV/V
μV/V
% of reading
% of FSR % of FSR
reading
reading
reading
AV
Rev. J | Page 3 of 20
AD637
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AD637J/AD637A AD637K/AD637B AD637S Parameter Min Typ Max Min Typ Max Min Typ Max Unit
OUTPUT CHARACTERISTICS
Offset Voltage
vs. Temperature ±0.05
Voltage Swing,
0 to 12.0
13.5
±1 ±0.089
±15 V Supply, 2 kΩ Load
Voltage Swing,
0 to 2
2.2
±3 V Supply, 2 kΩ Load
Output Current
6
Short-Circuit Current 20 20 20 mA Resistance
0.5 0.5 0.5 Ω
Chip Select High
Resistance
100 100 100 kΩ
Chip Select Low
dB OUTPUT
Error, VIN 7 mV to 7 V rms,
±0.5 ±0.3 ±0.5 dB
0 dB = 1 V rms Scale Factor −3 −3 −3 mV/dB Scale Factor Temperature
+0.33 +0.33 +0.33 % of
Coefficient
−0.033 −0.033 −0.033 dB/°C I
for 0 dB = 1 V rms 5 20
REF
I
Range 1 100 1 100 1 100 μA
REF
80
BUFFER AMPLIFIER
Input Output
−VS to (+VS − 2.5 V) −VS to (+VS − 2.5 V) −VS to (+VS − 2.5 V) V
Voltage Range Input Offset Voltage ±0.8 Input Current ±2 Input Resistance 10
8
±2 ±10
10 Output Current −0.13 +5 −0.13 +5 −0.13 +5 mA Short-Circuit Current 20 20 20 mA Small Signal Bandwidth 1 1 1 MHz Slew Rate
6
5 5 5 V/μs
DENOMINATOR INPUT
Input Range 0 to 10 0 to 10 0 to 10 V Input Resistance 20 25 30 20 25 30 20 25 30 kΩ Offset Voltage ±0.2 ±0.5 ±0.2 ±0.5 ±0.2 ±0.5 mV
CHIP SELECT (CS)
RMS On Level Open or 2.4 V < VC < +V RMS Off Level VC < 0.2 V VC < 0.2 V VC < 0.2 V I
of Chip Select
OUT
CS Low 10 10 10 μA
CS High 0 0 0 μA On Time Constant 10 + ((25 kΩ) × CAV) 10 + ((25 kΩ) × CAV) 10 + ((25 kΩ) × CAV) μs Off Time Constant 10 + ((25 kΩ) × CAV) 10 + ((25 kΩ) × CAV) 10 + ((25 kΩ) × CAV) μs
POWER SUPPLY
Operating Voltage Range
±3.0
Quiescent Current 2.2 Standby Current 350
1
Specifications shown in bold are tested on all production units at final electrical test. Results from those tests are used to calculate outgoing quality levels.
All minimum and maximum specifications are guaranteed, although only those shown in boldface are tested on all production units.
2
Accuracy specified 0 V rms to 7 V rms dc with AD637 connected, as shown in Figure 5.
3
Nonlinearity is defined as the maximum deviation from the straight line connecting the readings at 10 mV and 2 V.
4
Error vs. crest factor is specified as additional error for 1 V rms.
5
Input voltages are expressed in volts rms. Percent is in % of reading.
6
With external 2 kΩ pull-down resistor tied to −VS.
±18 ±3.0 3 450
±0.04
0 to 12.0
0 to 2
6
5 20
±0.5 ±2
S
Open or 2.4 V < VC < +V
2.2 350
±0.5 ±0.056
13.5
2.2
80
±1 ±5
8
10
S
±18 ±3.0 3 450
±0.04
0 to 12.0
0 to 2
6
13.5 V
2.2 V
mA
5 20
±0.8 ±2
8
±1 ±0.07
80
±2 ±10 Ω
Open or 2.4 V < VC < +V
2.2 350
±18 3 450
S
mV mV/°C
reading/°C
μA
mV nA
V mA μA
Rev. J | Page 4 of 20
AD637
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ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
ESD Rating 500 V
Supply Voltage ±18 V dc
Internal Quiescent Power Dissipation 108 mW
Output Short-Circuit Duration Indefinite
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering 10 sec) 300°C
Rated Operating Temperature Range
AD637J, AD637K 0°C to 70°C AD637A, AD637B −40°C to +85°C AD637S, 5962-8963701CA −55°C to +125°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. J | Page 5 of 20
AD637
T
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

1
BUFF IN
NC
2
COMMON
OUTPUT OFFSET
DEN INPUT
dB OUTPUT
3
AD637
TOP VIEW
4
(Not to Scale)
5
CS
6
7
NC = NO CONNECT
Figure 2. 14-Lead SBDIP/CERDIP Pin Configuration
14
BUFF OUT
V
13
NC
12
+V
11
10
–V
9
RMS OUT
C
8
BUFF IN
1
NC
IN
S
S
AV
00788-002
COMMON
OUTPUT OFFSET
DEN INPUT
dB OUTPUT
2
3
AD637
4
TOP VIEW
(Not to Scale)
5
CS
6
7
NC
8
NC = NO CONNECT
BUFF OU
16
V
15
NC
14
13
+V
12
–V
11
RMS OUT
C
10
NC
9
IN
S
S
AV
00788-003
Figure 3. 16-Lead SOIC_W Pin Configuration
Table 3. 14-Lead SBDIP/CERDIP Pin Function Descriptions Table 4. 16-Lead SOIC_W Pin Function Descriptions
Pin No. Mnemonic Description Pin No. Mnemonic Description
1 BUFF IN Buffer Input 1 BUFF IN Buffer Input 2, 12 NC No Connection 3 COMMON Analog Common 4 OUTPUT OFFSET Output Offset 5 CS Chip Select 6 DEN INPUT Denominator Input 7 dB OUTPUT dB Output 8 C
AV
Averaging Capacitor Connection 9 RMS OUT RMS Output 10 −V 11 +V 13 V
S
S
IN
Negative Supply Rail
Positive Supply Rail
Signal Input 14 BUFF OUT Buffer Output
2, 8, 9, 14 NC No Connection 3 COMMON 4 OUTPUT OFFSET 5 CS 6 DEN INPUT 7 dB OUTPUT 10 C
AV
11 RMS OUT 12 −V 13 +V 15 V
S
S
IN
Analog Common Output Offset Chip Select Denominator Input dB Output Averaging Capacitor Connection RMS Output Negative Supply Rail Positive Supply Rail Signal Input
16 BUFF OUT Buffer Output
Rev. J | Page 6 of 20
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