16-bit resolution and monotonicity
Dynamic power control for thermal management
Current and voltage output pins connectable to a single
terminal
Current output ranges: 0 mA to 20 mA, 4 mA to 20 mA,
or 0 mA to 24 mA
±0.05% total unadjusted error (TUE) maximum
Voltage output ranges (with 20% overrange): 0 V to 5 V, 0 V
to 10 V, ±5 V, and ±10 V
±0.04% total unadjusted error (TUE) maximum
User programmable offset and gain
On-chip diagnostics
On-chip reference (±10 ppm/°C maximum)
−40°C to +105°C temperature range
APPLICATIONS
Process control
Actuator control
PLCs
GENERAL DESCRIPTION
The AD5755 is a quad, voltage and current output DAC that
operates with a power supply range from −26.4 V to +33 V.
AD5755
On-chip dynamic power control minimizes package power
dissipation in current mode. This is achieved by regulating the
voltage on the output driver from 7.4 V to 29.5 V using a dc-todc boost converter optimized for minimum on chip power
dissipation.
The part uses a versatile 3-wire serial interface that operates at
clock rates of up to 30 MHz and is compatible with standard
SPI, QSPI™, MICROWIRE™, DSP, and microcontroller interface standards. The interface also features optional CRC-8
packet error checking, as well as a watchdog timer that
monitors activity on the interface.
Additional companion products on the AD5755 product page
FUNCTIONAL BLOCK DIAGRAM
AV
SS
–15V AG ND
DV
DD
DGND
LDAC
SCLK
SDIN
SYNC
SDO
CLEAR
FAU LT
ALERT
AD1
AD0
REFOUT
REFIN
DIGITAL
INTERFACE
REFERENCE
AD5755
NOTES
1. x = A, B, C, AND D.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Current Drift vs. Time Drift after 1000 hours, ¾ scale output, TJ = 150°C
90 ppm FSR External R
140 ppm FSR Internal R
)
SET
Assumes ideal resistor; see the External Current
Setting Resistor section for more information.
ppm
FSR/°C
ppm
FSR/°C
ppm
FSR/°C
SET
)
SET
3, 4
ppm
FSR/°C
ppm
FSR/°C
−0.14 +0.14 % FSR
ppm
FSR/°C
SET
V
BOOST_x
− 2.4
V
BOOST_x
2.7
V
−
SET
SET
Rev. A | Page 6 of 52
Data Sheet AD5755
Parameter1 Min Typ Max Unit Test Conditions/Comments
Resistive Load 1000 Ω
Output Impedance 100 MΩ
DC PSRR 0.02 1 μA/V
REFERENCE INPUT/OUTPUT
Reference Input2
Reference Input Voltage 4.95 5 5.05 V For specified performance
DC Input Impedance 45 150 MΩ
Reference Output
Output Voltage 4.995 5 5.005 V TA = 25°C
Reference TC2 −10 ±5 +10 ppm/°C
Output Noise (0.1 Hz to 10 Hz)2 7 μV p-p
Noise Spectral Density2 100 nV/√Hz At 10 kHz
Output Voltage Drift vs. Time2 180 ppm Drift after 1000 hours, TJ = 150°C
Capacitive Load2 1000 nF
Load Current 9 mA See Figure 63
Short-Circuit Current 10 mA
Line Regulation2 3 ppm/V See Figure 64
Load Regulation2 95 ppm/mA See Figure 63
Thermal Hysteresis2 160 ppm First temperature cycle
5 ppm Second temperature cycle
DC-TO-DC
Switch
Switch On Resistance 0.425 Ω
Switch Leakage Current 10 nA
Peak Current Limit 0.8 A
Oscillator
Oscillator Frequency 11.5 13 14.5 MHz
Maximum Duty Cycle 89.6 % At 410 kHz dc-to-dc switching frequency
DIGITAL INPUTS2 JEDEC compliant
VIH, Input High Voltage 2 V
VIL, Input Low Voltage 0.8 V
Input Current −1 +1 μA Per pin
Pin Capacitance 2.6 pF Per pin
DIGITAL OUTPUTS2
SDO, ALERT
VOL, Output Low Voltage 0.4 V Sinking 200 μA
VOH, Output High Voltage
High Impedance Leakage
Current
High Impedance Output
Capacitance
FAU LT
VOL, Output Low Voltage 0.4 V 10 kΩ pull-up resistor to DVDD
VOL, Output Low Voltage 0.6 V At 2.5 mA
VOH, Output High Voltage 3.6 V 10 kΩ pull-up resistor to DVDD
POWER REQUIREMENTS
AVDD 9 33 V
AVSS −26.4 −10.8 V
DVDD 2.7 5.5 V
DVDD −
0.5
−1 +1 μA
2.5 pF
V Sourcing 200 μA
The dc-to-dc converter has been characterized
with a maximum load of 1 kΩ, chosen such that
compliance is not exceeded; see Figure 52 and
DC-DC MaxV bits in Table 25
This oscillator is divided down to give the dc-to-dc
converter switching frequency
Rev. A | Page 7 of 52
AD5755 Data Sheet
Parameter1 Min Typ Max Unit Test Conditions/Comments
AVCC 4.5 5.5 V
AIDD 8.6 10.5 mA
7 7.5 mA Current output mode on all channels,
AISS −11 −8.8 mA
−1.7 mA Current output mode on all channels
DICC 9.2 11 mA
AICC 1 mA Output unloaded, over supplies
5
I
2.7 mA
BOOST
1 mA Per channel, current output mode
Power Dissipation 173 mW
1
Temperature range: −40°C to +105°C; typical at +25°C.
2
Guaranteed by design and characterization; not production tested.
3
For current outputs with internal R
loaded with the same code.
4
See the Current Output Mode with Internal R
5
Efficiency plots in Figure 54, Figure 55, Figure 56, and Figure 57 include the I
, the offset, full-scale, and TUE measurements exclude dc crosstalk. The measurements are made with all four channels enabled
SET
section for more explanation of the dc crosstalk.
SET
quiescent current.
BOOST
AC PERFORMANCE CHARACTERISTICS
AVDD = V
GNDSW
otherwise noted.
= 15 V; AVSS = −15 V; DVDD = 2.7 V to 5.5 V; AVCC = 4.5 V to 5.5 V; dc-to-dc converter disabled; AGND = DGND =
BOOST_x
= 0 V; REFIN = 5 V; voltage outputs: RL = 2 kΩ, CL = 220 pF; current outputs: RL = 300 Ω; all specifications T
x
Voltage output mode on all channels, output
unloaded, over supplies
Voltage output mode on all channels, output
unloaded, over supplies
= DVDD, VIL = DGND, internal oscillator running,
V
IH
over supplies
Per channel, voltage output mode, output
unloaded, over supplies
= 15 V, AVSS = −15 V, dc-to-dc converter
AV
DD
enable, current output mode, outputs disabled
MIN
to T
MAX
, unless
Table 2.
Parameter1 Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Voltage Output
Output Voltage Settling Time 11 μs 5 V step to ±0.03% FSR, 0 V to 5 V range
18 μs 10 V step to ±0.03% FSR, 0 V to 10 V range
13 μs
100 mV step to 1 LSB (16-bit LSB), 0 V to 10 V
range
Slew Rate 1.9 V/μs 0 V to 10 V range
Power-On Glitch Energy 150 nV-sec
Digital-to-Analog Glitch Energy 6 nV-sec
Glitch Impulse Peak Amplitude 25 mV
Digital Feedthrough 1 nV-sec
DAC to DAC Crosstalk 2 nV-sec 0 V to 10 V range
Output Noise (0.1 Hz to 10 Hz
0.15 LSB p-p 16-bit LSB, 0 V to 10 V range
Bandwidth)
Output Noise Spectral Density 150 nV/√Hz
Measured at 10 kHz, midscale output, 0 V to 10 V
range
AC PSRR 83 dB
200 mV 50 Hz/60 Hz sine wave superimposed on
power supply voltage
Current Output
Output Current Settling Time 15 μs To 0.1% FSR (0 mA to 24 mA)
See test conditions/
ms See Figure 48, Figure 49, and Figure 50
comments
Output Noise (0.1 Hz to 10 Hz
0.15 LSB p-p 16-bit LSB, 0 mA to 24 mA range
Bandwidth)
Output Noise Spectral Density 0.5 nA/√Hz
Measured at 10 kHz, midscale output, 0 mA to
24 mA range
1
Guaranteed by design and characterization; not production tested.
Rev. A | Page 8 of 52
Data Sheet AD5755
TIMING CHARACTERISTICS
AVDD = V
GNDSW
otherwise noted.
= 15 V; AVSS = −15 V; DVDD = 2.7 V to 5.5 V; AVCC = 4.5 V to 5.5 V; dc-to-dc converter disabled; AGND = DGND =
BOOST_x
= 0 V; REFIN = 5 V; voltage outputs: RL = 1 kΩ, CL = 220 pF; current outputs: RL = 300 Ω; all specifications T
x
MIN
to T
MAX
, unless
Table 3.
Parameter
1, 2, 3
Limit at T
MIN
, T
Unit Description
MAX
t1 33 ns min SCLK cycle time
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 13 ns min
t6 198 ns min
falling edge to SCLK falling edge setup time
SYNC
th
/32nd SCLK falling edge to SYNC rising edge (see ) Figure 77
24
high time
SYNC
t7 5 ns min Data setup time
t8 5 ns min Data hold time
t9 20 μs min
rising edge to LDAC falling edge (all DACs updated or any channel has
SYNC
digital slew rate control enabled)
5 μs min
t10 10 ns min
t11 500 ns max
t12
See the AC Performance
μs max DAC output settling time
rising edge to LDAC falling edge (single DAC updated)
SYNC
pulse width low
LDAC
falling edge to DAC output response time
LDAC
Characteristics section
t13 10 ns min CLEAR high time
t14 5 μs max CLEAR activation time
t15 40 ns max SCLK rising edge to SDO valid
t16 21 μs min
5 μs min
t17 500 ns min
t18 800 ns min
4
t
20 μs min
19
5 μs min
rising edge to DAC output response time (LDAC = 0) (all DACs updated)
SYNC
rising edge to DAC output response time (LDAC = 0) (single DAC updated)
SYNC
falling edge to SYNC rising edge
LDAC
pulse width
RESET
high to next SYNC low (digital slew rate control enabled) (all DACs updated)
SYNC
high to next SYNC low (digital slew rate control disabled) (single DAC
SYNC
updated)
1
Guaranteed by design and characterization; not production tested.
2
All input signals are specified with t
3
See Figure 3, Figure 4, Figure 5, and Figure 6.
4
This specification applies if
LDAC
= t
= 5 ns (10% to 90% of DVDD) and timed from a voltage level of 1.2 V.
RISE
FALL
is held low during the write cycle; otherwise, see t9.
Rev. A | Page 9 of 52
AD5755 Data Sheet
Timing Diagrams
t
1
SCLK
SYNC
SDIN
LDAC
V
OUT_x
LDAC = 0
V
OUT_x
CLEAR
V
OUT_x
1224
t
6
t
4
t
7
MSB
t
13
t
t
3
t
8
14
t
2
t
10
t
5
t
19
LSB
t
t
9
t
17
t
16
10
t
t
11
t
12
12
t
RESET
18
07304-002
Figure 3. Serial Interface Timing Diagram
SCLK
SYNC
SDIN
SDO
11
MSBMSBLSBLSB
INPUT WORD SPECIFIES
REGISTER TO BE READ
UNDEFINEDSELECTED REGISTER DATA
2424
t
6
NOP CONDIT ION
MSBLSB
t
15
CLOCKED OUT
Figure 4. Readback Timing Diagram
07304-203
Rev. A | Page 10 of 52
Data Sheet AD5755
SCLK
SYNC
SDIN
SDO
LSBMSB
1216
DUT_
R/W
DUT_
AD1
SDO DISABLED
XXXD15D14D1D0
AD0
SDO_
ENAB
STATUSSTATUSSTATUSSTATUS
07304-204
Figure 5. Status Readback During Write
TO OUTPUT
PIN
50pF
C
200µAI
L
200µAI
OL
OH
VOH (MIN) OR
(MAX)
V
OL
07304-005
Figure 6. Load Circuit for SDO Timing Diagram
Rev. A | Page 11 of 52
AD5755 Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter Rating
AVDD, V
to AGND, DGND −0.3 V to +33 V
BOOST_x
AVSS to AGND, DGND +0.3 V to −28 V
AVDD to AVSS −0.3 V to +60 V
AVCC to AGND −0.3 V to +7 V
DVDD to DGND −0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to DV
+ 0.3 V or +7 V
DD
(whichever is less)
Digital Outputs to DGND
−0.3 V to DV
+ 0.3 V or +7 V
DD
(whichever is less)
REFIN, REFOUT to AGND
−0.3 V to AV
+ 0.3 V or +7 V
DD
(whichever is less)
V
OUT_x
to AGND
AV
SS
to V
or 33 V if using
BOOST_x
the dc-to-dc circuitry
+V
SENSE_x
, −V
SENSE_x
to AGND
AV
SS
to V
or 33 V if using
BOOST_x
the dc-to-dc circuitry
I
OUT_x
to AGND
AV
SS
to V
or 33 V if using
BOOST_x
the dc-to-dc circuitry
SWx to AGND −0.3 to +33 V
AGND, GNDSWx to DGND −0.3 V to +0.3 V
Operating Temperature Range ( TA)
Industrial1 −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 125°C
64-Lead LFCSP
θJA Thermal Impedance2 20°C/W
Power Dissipation (TJ max − TA)/θJA
Lead Temperature JEDEC industry standard
Soldering J-STD-020
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C.
2
Based on a JEDEC 4-layer test board.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 12 of 52
Data Sheet AD5755
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
LV_D
PIN 1
INDICATO R
DCDC_D
SENSE_D
SET_CRSET_D
R
646362616059585756555453525150
SENSE_D
REFOUT
REFIN
COMP
–V
+V
COMP
V
BOOST_DVOUT_D
LV_C
SENSE_C
SENSE_C
AVSSCOMP
OUT_C
–V
+V
V
49
OUT_D
I
R
1
SET_B
2
R
SET_A
REFGND
REFGND
NOTES
1. THIS EXPOSED PADDLE SHOULD BE CO NNECTED TO THE PO TENTIALOF T HE
AV
IT IS RE COMMENDED T HAT THE P ADDLE BE THERMALLY CO NNECTED TO A
COPPER PLANE FOR ENHANCED THERMAL PE RFORMANCE.
3
4
5
AD0
6
AD1
7
SYNC
8
SCLK
9
SDIN
10
SDO
DV
11
DD
12
DGND
13
LDAC
14
CLEAR
15
ALERT
16
FAULT
171819202122232425262728293031
POC
PIN, OR, ALTERNAT IVELY, IT CAN BE LEFT ELECTRI CALLY UNCO NNECTED.
SS
AV
RESET
DD
LV_A
–V
COMP
AD5755
TOP VIEW
(Not to Scale)
OUT_AIOUT_A
DCDC_A
V
SENSE_A+VSENSE_A
BOOST_A
V
COMP
AV
SS
32
LV_B
OUT_B
DCDC_B
V
SENSE_B+VSENSE_B
–V
COMP
COMP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
COMP
I
OUT_C
V
BOOST_C
AV
CC
SW
C
GNDSW
GNDSW
SW
D
AV
SS
SW
A
GNDSW
GNDSW
SW
B
AGND
V
BOOST_B
I
OUT_B
DCDC_C
C
D
A
B
07304-006
Figure 7. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 R
SET_B
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the I
temperature drift performance. See the Device Features section.
2 R
SET_A
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the I
temperature drift performance. See the Device Features section.
3 REFGND Ground Reference Point for Internal Reference.
4 REFGND Ground Reference Point for Internal Reference.
5 AD0 Address Decode for the Device Under Test (DUT) on the Board.
6 AD1 Address Decode for the DUT on the Board.
7
Active Low Input. This is the frame synchronization signal for the serial interface. While SYNC is low, data is
SYNC
transferred in on the falling edge of SCLK.
8 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of SCLK. This operates at clock
speeds of up to 30 MHz.
9 SDIN Serial Data Input. Data must be valid on the falling edge of SCLK.
10 SDO Serial Data Output. Used to clock data from the serial register in readback mode. See Figure 4 and Figure 5.
11 DVDD Digital Supply. The voltage range is from 2.7 V to 5.5 V.
12 DGND Digital Ground.
13
Load DAC, Active Low Input. This is used to update the DAC register and consequently the DAC outputs. When
LDAC
tied permanently low, the addressed DAC data register is updated on the rising edge of SYNC. If LDAC is held
high during the write cycle, the DAC input register is updated, but the DAC output update only takes place at
14 CLEAR
the falling edge of LDAC
LDAC
pin must not be left unconnected.
Active High, Edge Sensitive Input. Asserting this pin sets the output current and voltage to the preprogrammed
(see ). Using this mode, all analog outputs can be updated simultaneously. The Figure 3
clear code bit setting. Only channels enabled to be cleared are cleared. See the Device Features section for more
information. When CLEAR is active, the DAC output register cannot be written to.
OUT_B
OUT_A
Rev. A | Page 13 of 52
AD5755 Data Sheet
Pin No. Mnemonic Description
15 ALERT
16
FAU LT
17 POC
18
RESET
19 AVDD Positive Analog Supply. The voltage range is from 9 V to 33 V.
20 COMP
21 −V
22 +V
23 COMP
24 V
25 V
26 I
LV_A
SENSE_A
SENSE_A
DCDC_A
BOOST_A
Buffered Analog Output Voltage for DAC Channel A.
OUT_A
Current Output Pin for DAC Channel A.
OUT_A
27 AVSS Negative Analog Supply Pin. Voltage range is from −10.8 V to −26.4 V.
28 COMP
29 −V
30 +V
31 V
32 COMP
33 I
34 V
LV_B
SENSE_B
SENSE_B
Buffered Analog Output Voltage for DAC Channel B.
OUT_B
DCDC_B
Current Output Pin for DAC Channel B.
OUT_B
BOOST_B
35 AGND Ground Reference Point for Analog Circuitry. This must be connected to 0 V.
36 SWB
37 GNDSWB Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
38 GNDSWA Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
39 SWA
40 AVSS Negative Analog Supply Pin. The voltage range is from −10.8 V to −26.4 V.
41 SWD
42 GNDSWD Ground Connections for DC-to-DC Switching Circuit. This pin should always be connected to ground.
43 GNDSWC Ground Connections for DC-to-DC Switching Circuit. This pin should always be connected to ground.
Active High Output. This pin is asserted when there has been no SPI activity on the interface pins for a
predetermined time. See the Device Features section for more information.
Active Low Output. This pin is asserted low when an open circuit in current mode is detected, a short circuit in
voltage mode is detected, a PEC error is detected, or an overtemperature is detected (see the Device Features
section). Open-drain output.
Power-On Condition. This pin determines the power-on condition and is read during power-on or, alternatively,
after a device reset. If POC = 0, the device is powered up with the voltage and current channels in tristate mode.
If POC = 1, the device is powered up with a 30 kΩ pull-down resistor to ground on the voltage output channel,
and the current channel is in tristate mode.
Hardware Reset, Active Low Input.
Optional Compensation Capacitor Connection for V
this pin and the V
pin allows the voltage output to drive up to 2 μF. Note that the addition of this capacitor
OUT_A
Output Buffer. Connecting a 220 pF capacitor between
OUT_A
reduces the bandwidth of the output amplifier, increasing the settling time.
Sense Connection for the Negative Voltage Output Load Connection for V
. This pin must stay within ±3.0 V
OUT_A
of AGND for specified operation.
Sense Connection for the Positive Voltage Output Load Connection for V
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
OUT_A
.
feedback loop of the Channel A dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation
Capacitors and the AICC Supply Requirements—Slewing sections in the Device Features section for more
information).
Supply for Channel A Current Output Stage (see Figure 72). This is also the supply for the V
stage, which is
OUT_x
regulated to 15 V by the dc-to-dc converter. To use the dc-to-dc feature of the device, connect as shown in
Figure 78.
Optional Compensation Capacitor Connection for V
this pin and the V
pin allows the voltage output to drive up to 2 μF. Note that the addition of this capacitor
OUT_B
Output Buffer. Connecting a 220 pF capacitor between
OUT_B
reduces the bandwidth of the output amplifier, increasing the settling time.
Sense Connection for the Negative Voltage Output Load Connection for V
. This pin must stay within ±3.0 V
OUT_B
of AGND for specified operation.
Sense Connection for the Positive Voltage Output Load Connection for V
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
OUT_B
.
feedback loop of the Channel B dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation
Capacitors and the AICC Supply Requirements—Slewing sections in the Device Features section for more
information).
Supply for Channel B Current Output Stage (see Figure 72). This is also the supply for the V
stage, which is
OUT_x
regulated to 15 V by the dc-to-dc converter. To use the dc-to-dc feature of the device, connect as shown in
Figure 78.
Switching Output for Channel B DC-to-DC Circuitry. To use the dc-to-dc feature of the device, connect as shown
in Figure 78.
Switching Output for Channel A DC-to-DC Circuitry. To use the dc-to-dc feature of the device, connect as shown
in Figure 78.
Switching Output for Channel D DC-to-DC Circuitry. To use the dc-to-dc feature of the device, connect as shown
in Figure 78.
Rev. A | Page 14 of 52
Data Sheet AD5755
Pin No. Mnemonic Description
44 SWC
45 AVCC Supply for DC-to-DC Circuitry.
46 V
47 I
48 COMP
49 V
50 +V
51 −V
52 COMP
BOOST_C
Current Output Pin for DAC Channel C.
OUT_C
DCDC_C
Buffered Analog Output Voltage for DAC Channel C.
OUT_C
SENSE_C
SENSE_C
LV_C
53 AVSS Negative Analog Supply Pin.
54 I
55 V
56 V
57 COMP
58 +V
59 −V
60 COMP
Current Output Pin for DAC Channel D.
OUT_D
Buffered Analog Output Voltage for DAC Channel D.
OUT_D
BOOST_D
DCDC_D
SENSE_D
SENSE_D
LV_D
61 REFIN External Reference Voltage Input.
62 REFOUT
63 R
64 R
SET_D
SET_C
EPAD
Switching Output for Channel C DC-to-DC Circuitry. To use the dc-to-dc feature of the device, connect as shown
in Figure 78.
Supply for Channel C Current Output Stage (see Figure 72). This is also the supply for the V
stage, which is
OUT_x
regulated to 15 V by the dc-to-dc converter. To use the dc-to-dc feature of the device, connect as shown in
Figure 78.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel C dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation
Capacitors and AICC Supply Requirements—Slewing sections in the Device Features section for more
information).
Sense Connection for the Positive Voltage Output Load Connection for V
Sense Connection for the Negative Voltage Output Load Connection for V
.
OUT_C
. This pin must stay within ±3.0 V
OUT_C
of AGND for specified operation.
Optional Compensation Capacitor Connection for V
this pin and the V
pin allows the voltage output to drive up to 2 μF. Note that the addition of this capacitor
OUT_C
Output Buffer. Connecting a 220 pF capacitor between
OUT_C
reduces the bandwidth of the output amplifier, increasing the settling time.
Supply for Channel D Current Output Stage (see Figure 72). This is also the supply for the V
OUT_x
regulated to 15 V by the dc-to-dc converter. To use the dc-to-dc feature of the device, connect as shown in
Figure 78.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of Channel D dc-to-dc converter. Alternatively, if using an external compensation resistor, place a
resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation Capacitors
and AICC Supply Requirements—Slewing sections in the Device Features section for more information).
Sense Connection for the Positive Voltage Output Load Connection for V
Sense Connection for the Negative Voltage Output Load Connection for V
.
OUT_D
. This pin must stay within ±3.0 V
OUT_D
of AGND for specified operation.
Optional Compensation Capacitor Connection for V
this pin and the V
pin allows the voltage output to drive up to 2 μF. Note that the addition of this capacitor
OUT_D
Output Buffer. Connecting a 220 pF capacitor between
OUT_D
reduces the bandwidth of the output amplifier, increasing the settling time.
Internal Reference Voltage Output. It is recommended to place a 0.1 μF capacitor between REFOUT and
REFGND.
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the I
temperature drift performance. See the Device Features section.
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the I
temperature drift performance. See the Device Features section.
Exposed Pad. This exposed pad should be connected to the potential of the AV
pin, or, alternatively, it can be
SS
left electrically unconnected. It is recommended that the pad be thermally connected to a copper plane for
enhanced thermal performance.
stage, which is
OUT_D
OUT_C
Rev. A | Page 15 of 52
AD5755 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VOLTAGE OUTPUTS
0.0015
0.0010
0.0005
INL ERRO R (%FSR)
–0.0005
±10V RANGE
±5V RANGE
+10V RANGE
+5V RANGE
+10V RANGE W ITH DCDC
0
AVDD = +15V
AVSS = –15V
= 25°C
T
A
0.0015
0.0010
0.0005
INL (%FSR)
–0.0005
–0.0010
+5V RANGE MAX INL+10V RANG E MAX INL
±5V RANGE MAX INL±10V RANGE MAX IN L
+5V RANGE MIN INL+ 10V RANGE MIN INL
±5V RANGE MIN INL±10V RANGE M IN INL
0
AV
= +15V
DD
AV
= –15V
SS
OUTPUT UNLOADED
–0.0010
010k20k30k40k50k60k
CODE
Figure 8. Integral Nonlinearity Error vs. DAC Code
1.0
0.8
0.6
0.4
0.2
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
±10V RANGE
±5V RANGE
+10V RANGE
+5V RANGE
+10V RANGE W ITH DCDC
0
010k20k30k40k50k60k
CODE
AVDD = +15V
= –15V
AV
SS
= 25°C
T
A
Figure 9. Differential Nonlinearity Error vs. DAC Code
–0.002
–0.004
–0.006
TOTAL UNADJUSTED ERROR (%F SR)
–0.008
–0.010
0.006
0.004
0.002
0
0
10k20k30k40k50k60k
±10V RANGE
±5V RANGE
+10V RANGE
+5V RANGE
+10V RANGE WITH DCDC
CODE
Figure 10. Total Unadjusted Error vs. DAC Code
AVDD = +15V
= –15V
AV
SS
= 25°C
T
A
–0.0015
–40–20020406080100
07304-023
TEMPERATURE (°C)
07304-127
Figure 11. Integral Nonlinearity Error vs. Temperature
1.0
0.8
0.6
0.4
0.2
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
07304-024
AVDD = +15V
= –15V
AV
SS
ALL RANGES
0
–40–20020406080100
DNL ERROR MAX
DNL ERROR MIN
TEMPERATURE (°C)
07304-128
Figure 12. Differential Nonlinearity Error vs. Temperature
0.012
0.010
0.008
0.006
0.004
0.002
0
–0.002
TOTAL UNADJUSTED ERROR (%F SR)
–0.004
–0.006
–40–20020406080100
07304-025
+5V RANGE
+10V RANGE
±5V RANGE
±10V RANGE
AVDD = +15V
AV
= –15V
SS
OUTPUT UNLOADED
TEMPERATURE (°C)
07304-129
Figure 13. Total Unadjusted Error vs. Temperature
Rev. A | Page 16 of 52
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