Complete, dual, 12-/14-/16-bit digital-to-analog converter (DAC)
Operates from single/dual supplies
Software programmable output range
+5 V, +10 V, +10.8 V, ±5 V, ±10 V, ±10.8 V
INL error: ±16 LSB maximum, DNL error: ±1 LSB maximum
Total unadjusted error (TUE): 0.1% FSR maximum
Settling time: 10 μs typical
Integrated reference: 5 ppm/°C maximum
Integrated reference buffers
Output control during power-up/brownout
Simultaneous updating via
Asynchronous
to zero scale or midscale
CLR
DSP-/microcontroller-compatible serial interface
24-lead TSSOP
Operating temperature range: −40°C to +85°C
iCMOS process technology
APPLICATIONS
Industrial automation
Closed-loop servo control, process control
Automotive test and measurement
Programmable logic controllers
GENERAL DESCRIPTION
The AD5722R/AD5732R/AD5752R are dual, 12-/14-/16-bit,
serial input, voltage output digital-to-analog converters. They
operate from single supply voltages of +4.5 V up to +16.5 V or
dual supply voltages from ±4.5 V up to ±16.5 V. Nominal fullscale output range is software selectable from +5 V, +10 V,
BIN/2sCOMP
LDAC
1
AV
AD5722R/AD5732R/AD5752R
DV
CC
CLR
SDIN
SCLK
SYNC
SDO
INPUTSHIFT
REGISTER
AND
CONTROL
LOGIC
FUNCTIONAL BLOCK DIAGRAM
V
DD
SS
n
REGISTER A
REGISTER B
Unipolar/Bipolar, Voltage Output DACs
AD5722R/AD5732R/AD5752R
+10.8 V, ±5 V, ±10 V, or ±10.8 V. Integrated output amplifiers,
reference buffers, and proprietary power-up/power-down
control circuitry are also provided.
The parts offer guaranteed monotonicity, integral nonlinearity
(INL) of ±16 LSB maximum, low noise, 10 μs maximum settling
time, and an on-chip +2.5 V reference.
The AD5722R/AD5732R/AD5752R use a serial interface that
operates at clock rates up to 30 MHz and are compatible with
DSP and microcontroller interface standards. Double buffering
allows the simultaneous updating of all DACs. The input coding
is user-selectable twos complement or offset binary for a bipolar
2sComp
V
A
OUT
B
V
OUT
), and
2.5V
REFERENCE
INPUT
INPUT
output (depending on the state of Pin BIN/
straight binary for a unipolar output. The asynchronous clear
function clears all DAC registers to a user-selectable zero-scale
or midscale output. The parts are available in a 24-lead TSSOP
and offer guaranteed specifications over the −40°C to +85°C
industrial temperature range.
Table 1. Pin Compatible Devices
Part Number Description
AD5722/AD5732/AD5752
AD5722R/AD5732R/AD5752R
without internal reference.
AD5724/AD5734/AD5754
Complete, quad, 12-/14-/16-bit,
serial input, unipolar/bipolar,
voltage output DACs.
AD5724R/AD5734R/AD5754R
AD5724/AD5734/AD5754 with
internal reference.
REFIN/REFOUT
REFERENCE
BUFFERS
DAC
REGIS TER A
DAC
REGIS TER B
n
DAC A
n
DAC B
AD5722: n = 12-BIT
AD5732: n = 14-BIT
AD5752: n = 16-BIT
1
For analog systems designers within industrial/instrumentation equipment OEMs who need high performance ICs at higher voltage levels, iCMOS® is a technology
platform that enables the development of analog ICs capable of 30 V and operating at ±15 V supplies while allowing dramatic reductions in power consumption and
package size, as well as increased ac and dc performance.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Voltage Range −10.8 +10.8 V AVDD/AVSS = ±11.7 V min, REFIN = 2.5 V
−12 +12 V AVDD/AVSS = ±12.9 V min, REFIN = 3 V
Headroom 0.5 0.9 V
Output Voltage TC ±4 ppm FSR/°C
Short-Circuit Current 20 mA
Load 2 kΩ For specified performance
Capacitive Load Stability 4000 pF
DC Output Impedance 0.5 Ω
Rev. D | Page 3 of 32
LOAD
= 2 kΩ;
AD5722R/AD5732R/AD5752R
Parameter Min Typ Max Unit Test Conditions/Comments
DIGITAL INPUTS3 DV
Input High Voltage, VIH 2 V
Input Low Voltage, VIL 0.8 V
Input Current ±1 μA Per pin
Pin Capacitance 5 pF Per pin
DIGITAL OUTPUTS (SDO) 3
Output Low Voltage, VOL 0.4 V DVCC = 5 V ± 10%, sinking 200 μA
Output High Voltage, VOH DVCC − 1 V DV
Output Low Voltage, VOL 0.4 V DVCC = 2.7 V to 3.6 V, sinking 200 μA
Output High Voltage, VOH DVCC − 0.5 V DVCC = 2.7 V to 3.6 V, sourcing 200 μA
High Impedance Leakage Current ±1 μA
High Impedance Output
5 pF
Capacitance
POWER REQUIREMENTS
AVDD 4.5 16.5 V
AVSS −4.5 −16.5 V
DVCC 2.7 5.5 V
Power Supply Sensitivity3
Output Noise Spectral Density 320 nV/√Hz Measured at 10 kHz, 0x8000 DAC code
1
For specified performance, the headroom requirement is 0.9 V.
2
Guaranteed by design and characterization; not production tested.
LOAD
= 2 kΩ;
Rev. D | Page 5 of 32
AD5722R/AD5732R/AD5752R
TIMING CHARACTERISTICS
AVDD = 4.5 V to 16.5 V; AVSS = −4.5 V to −16.5 V, or AVSS = 0 V; GND = 0 V; REFIN = 2.5 V external; DVCC = 2.7 V to 5.5 V; R
C
= 200 pF; all specifications T
LOAD
MIN
to T
, unless otherwise noted.
MAX
LOAD
= 2 kΩ;
Table 4.
Parameter
1, 2, 3
Limit at t
, t
Unit Description
MIN
MAX
t1 33 ns min SCLK cycle time
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 13 ns min
t6 100 ns min
falling edge to SCLK falling edge setup time
SYNC
SCLK falling edge to SYNC
Minimum SYNC
high time (write mode)
t7 7 ns min Data setup time
t8 2 ns min Data hold time
t9 20 ns min
t10 130 ns min
t11 20 ns min
falling edge to SYNC falling edge
LDAC
rising edge to LDAC falling edge
SYNC
pulse width low
LDAC
t12 10 μs typ DAC output settling time
t13 20 ns min
t14 2.5 μs max
4
t
13 ns min
15
4
t
40 ns max SCLK rising edge to SDO valid (C
16
t17 200 ns min
1
Guaranteed by characterization; not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
See Figure 2, Figure 3, and Figure 4.
4
Daisy-chain and readback mode.
5
C
= capacitive load on SDO output.
L SDO
pulse width low
CLR
pulse activation time
CLR
rising edge to SCLK rising edge
SYNC
Minimum SYNC
high time (readback/daisy-chain mode)
rising edge
L SDO
5
= 15 pF)
Rev. D | Page 6 of 32
AD5722R/AD5732R/AD5752R
TIMING DIAGRAMS
t
1
SCLK
SYNC
SDIN
LDAC
V
OUT
V
OUT
CLR
V
OUT
t
6
t
4
t
7
DB23
t
9
x
x
x
t
3
t
8
t
13
t
14
4221
t
2
t
5
DB0
t
t
10
11
t
12
t
12
06466-002
Figure 2. Serial Interface Timing Diagram
t
1
SCLK
SYNC
SDIN
SDO
LDAC
t
17
t
4
t
7
t
3
t
8
t
2
INPUT WO RD FOR DAC N – 1INPUT WO RD F OR DAC N
t
16
DB23
INPUT WO RD FOR DAC NUNDEFINED
8442
t
5
t
15
D0BD32BD0BD32B
DB0
t
10
t
11
06466-003
Figure 3. Daisy-Chain Timing Diagram
Rev. D | Page 7 of 32
AD5722R/AD5732R/AD5752R
SCLK
SYNC
1
2424
t
1
17
SDIN
SDO
DB23DB0DB23DB0
REGISTE R T O BE READ
DB23DB0DB23DB0
UNDEFINED
NOP CONDITIONINPUT WORD SPECIFIES
SELECTED REGISTER DAT A
CLOCKED OUT
Figure 4. Readback Timing Diagram
06466-004
Rev. D | Page 8 of 32
AD5722R/AD5732R/AD5752R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
AVDD to GND −0.3 V to +17 V
AVSS to GND +0.3 V to −17 V
DVCC to GND −0.3 V to +7 V
Digital Inputs to GND
Digital Outputs to GND
REFIN/REFOUT to GND −0.3 V to +5 V
V
A or V
OUT
DAC_GND to GND −0.3 V to +0.3 V
SIG_GND to GND −0.3 V to +0.3 V
Operating Temperature Range, TA
Industrial −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature, TJ max 150°C
24-Lead TSSOP Package
θJA Thermal Impedance 42°C/W
θJC Thermal Impedance 9°C/W
Power Dissipation (TJ max − TA)/θJA
Lead Temperature JEDEC industry standard
Soldering J-STD-020
ESD (Human Body Model) 3.5 kV
B to GND AVSS to AVDD
OUT
−0.3 V to DV
7 V (whichever is less)
−0.3 V to DV
7 V (whichever is less)
+ 0.3 V or to
CC
+ 0.3 V or to
CC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 9 of 32
AD5722R/AD5732R/AD5752R
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
AV
SS
2
NC
3
V
A
OUT
4
NC
5
NC
CLR
NC
AD5722R/
AD5732R/
6
AD5752R
7
TOP VIEW
8
(Not to Scale)
9
10
11
12
BIN/2sCOMP
SYNC
SCLK
SDIN
LDAC
NOTES
1. NC = NO CONNECT
2. IT IS RECOMMENDED THAT THE EXPOSED PAD BE
THERMALLY CONNECTED TO A COPPER PLANE
FOR ENHANCED THERMAL PERFORMANCE.
AV
24
DD
23
V
B
OUT
22
NC
21
SIG_GND
SIG_GND
20
19
DAC_GND
18
DAC_GND
17
REFIN/REFOUT
16
SDO
15
GND
DV
14
CC
NC
13
06466-005
Figure 5. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1 AVSS
Negative Analog Supply. Voltage ranges from −4.5 V to −16.5 V. This pin can be connected to 0 V if output
ranges are unipolar.
2, 4, 6, 12,
NC Do not connect to these pins.
13, 22
3 V
5
A Analog Output Voltage of DAC A. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
BIN/2sCOMP
Determines the DAC coding for a bipolar output range. This pin should be hardwired to either DVCC or GND.
When hardwired to DV
, input coding is offset binary. When hardwired to GND, input coding is twos
CC
complement. (For unipolar output ranges, coding is always straight binary.)
7
Active Low Input. This is the frame synchronization signal for the serial interface. While SYNC is low, data is
SYNC
transferred on the falling edge of SCLK. Data is latched on the rising edge of SYNC.
8 SCLK
Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK. This operates at clock
speeds up to 30 MHz.
9 SDIN Serial Data Input. Data must be valid on the falling edge of SCLK.
10
Load DAC, Logic Input. This is used to update the DAC registers and, consequently, the analog output. When
LDAC
this pin is tied permanently low, the addressed DAC register is updated on the rising edge of SYNC. If LDAC is
held high during the write cycle, the DAC input register is updated, but the output update is held off until the
11
CLR
falling edge of LDAC
LDAC
. The LDAC pin should not be left unconnected.
Active Low Input. Asserting this pin sets the DAC registers to zero-scale code or midscale code (user selectable).
. In this mode, all analog outputs can be updated simultaneously on the falling edge of
14 DVCC Digital Supply. Voltage ranges from 2.7 V to 5.5 V.
15 GND Ground Reference.
16 SDO
Serial Data Output. Used to clock data from the serial register in daisy-chain or readback mode. Data is
clocked out on the rising edge of SCLK and is valid on the falling edge of SCLK.
17 REFIN/REFOUT
External Reference Voltage Input and Internal Reference Voltage Output. Reference input range is 2 V to 3 V.
REFIN = 2.5 V for specified performance. REFOUT = 2.5 V ± 2 mV.
18, 19 DAC_GND Ground Reference for the Four Digital-to-Analog Converters.
20, 21 SIG_GND Ground Reference for the Four Output Amplifiers.
23 V
B Analog Output Voltage of DAC B. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
24 AVDD Positive Analog Supply. Voltage ranges from 4.5 V to 16.5 V.
Exposed
Paddle
This exposed paddle should be connected to the potential of the AV
unconnected. It is recommended that the paddle be thermally connected to a copper plane for enhanced thermal
performance.
pin, or alternatively, it can be left electrically
SS
Rev. D | Page 10 of 32
AD5722R/AD5732R/AD5752R
TYPICAL PERFORMANCE CHARACTERISTICS
6
4
2
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
0.6
0.4
0.2
0
–2
INL ERROR (LSB)
–4
–6
–8
010,000 20,000 30,000 40,000 50,000 60,000
CODE
Figure 6. AD5752R Integral Nonlinearity Error vs. Code
1.5
1.0
0.5
0
–0.5
INL ERROR (LSB)
–1.0
–1.5
–2.0
02000 4000 6000 8000 10,000 12,000 14,000 16,000
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±1 0V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
CODE
Figure 7. AD5732R Integral Nonlinearity Error vs. Code
0
–0.2
DNL ERROR (LSB)
–0.4
AVDD/AVSS = +12V/0V, RANGE = +10V
–0.6
AV
/AVSS = ±12V, RANGE = ±10 V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
–0.8
06466-013
DD
010,000 20,000 30,000 40,000 50,000 60,000
CODE
06466-016
Figure 9. AD5752R Differential Nonlinearity Error vs. Code
0.15
0.10
0.05
0
–0.05
DNL ERROR (LSB)
–0.10
–0.15
–0.20
6466-014
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±1 0V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
02000 4000 6000 8000 10,000 12,000 14,000 16,000
CODE
06466-017
Figure 10. AD5732R Differential Nonlinearity Error vs. Code
0.3
0.2
0.1
0
–0.1
–0.2
INL ERROR (LSB)
–0.3
–0.4
–0.5
05001000 1500 2000 2500 3000 3500 4000
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10 V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
CODE
Figure 8. AD5722R Integral Nonlinearity Error vs. Code
06466-015
Rev. D | Page 11 of 32
0.04
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10V
0.03
0.02
0.01
–0.01
–0.02
DNL ERROR (LSB)
–0.03
–0.04
–0.05
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
0
05001000 1500 2000 2500 3000 3500 4000
CODE
Figure 11. AD5722R Differential Nonlinearity Error vs. Code
06466-018
AD5722R/AD5732R/AD5752R
8
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–40–20020406080
TEMPERATURE (°C)
Figure 12. AD5752R Integral Nonlinearity Error vs. Temperature
0.1
0
–0.1
–0.2
–0.3
DNL ERROR (LSB)
–0.4
–0.5
–0.6
–40–20020406080
TEMPERATURE (°C)
Figure 13. AD5752R Differential Nonlinearity Error vs. Temperature
MAX INL ±10V
MAX INL ±5V
MIN INL ±10V
MIN INL ±5V
MAX INL + 10V
MIN INL +10V
MAX INL +5V
MIN INL +5V
MAX DNL ±10V
MAX DNL ±5V
MIN DNL ±10V
MIN DNL ±5V
MAX DNL +10V
MIN DNL +10V
MAX DNL +5V
MIN DNL +5V
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
11.512.512.013.5 14.013.014.5 15.0 15.5 16.0 16.5
6466-044
SUPPLY VOLTAGE (V)
BIPOLAR 10V M IN
UNIPOLAR 10V M I N
BIPOLAR 10V M A X
UNIPOLAR 10V M AX
06466-032
Figure 15. AD5752R Differential Nonlinearity Error vs. Supply Voltage
10
8
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
5.58.56.5 7.510.5 11.59.512.513.514.515.516.5
06466-045
SUPPLY VOLTAGE (V)
BIPOLAR 5V M IN
UNIPOLAR 5V M IN
BIPOLAR 5V M AX
UNIPOLAR 5V M AX
06466-035
Figure 16. AD5752R Integral Nonlinearity Error vs. Supply Voltage
10
8
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
11.512.512.013.5 14.013.014.5 15.0 15.5 16.0 16.5
SUPPLY VOLT AGE ( V)
BIPOLAR 10V MIN
UNIPOLAR 10V M IN
BIPOLAR 10V MAX
UNIPOLAR 10V M AX
Figure 14. AD5752R Integral Nonlinearity Error vs. Supply Voltage
6466-034
Rev. D | Page 12 of 32
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
5.58.56.5 7.510.5 11.59.512.5 13.5 14.5 15.5 16.5
SUPPLY VOLTAGE (V)
BIPOLAR 5V MIN
UNIPOLAR 5V MIN
BIPOLAR 5V MAX
UNIPOLAR 5V MA X
Figure 17. AD5752R Differential Nonlinearity Error vs. Supply Voltage
06466-033
AD5722R/AD5732R/AD5752R
0.02
0.01
0
–0.01
TUE (%)
–0.02
–0.03
–0.04
11.512.512.013.5 14.013.014.5 15.0 15.5 16.0 16.5
SUPPLY VOLTAGE (V)
BIPOLAR 10V M IN
UNIPOLAR 10V M IN
BIPOLAR 10V M AX
UNIPOLAR 10V M AX
Figure 18. AD5752R Total Unadjusted Error vs. Supply Voltage
06466-036
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
BIPOLAR Z ERO-SCALE ERROR (mV)
–0.8
–1.0
–40–20020406080
±5V RANGE
±10V RANGE
TEMPERATURE (°C)
Figure 21. Bipolar Zero-Scale Error vs. Temperature
06466-047
0.04
0.03
0.02
0.01
0
–0.01
TUE (%)
–0.02
–0.03
–0.04
–0.05
5.58.56.5 7.510.5 11.59.512.5 13.5 14.5 15.5 16.5
SUPPLY VOLTAGE (V)
BIPOLAR 5V M IN
UNIPOLAR 5V M IN
BIPOLAR 5V M AX
UNIPOLAR 5V M AX
Figure 19. AD5752R Total Unadjusted Error vs. Supply Voltage
4
3
2
1
0
–1
ZERO-SCAL E E RROR (mV)
–2
–3
–40–20020406080
+10V
±10V
±5V
TEMPERATURE (°C)
Figure 20. Zero-Scale Error vs. Temperature
0.06
±5V
0.04
0.02
0
–0.02
GAIN E RROR (% F SR)
–0.04
–0.06
–40–20020406080
06466-037
±10V
+10V
TEMPERATURE (°C)
06466-048
Figure 22. Gain Error vs. Temperature
1000
900
800
700
600
500
(µA)
CC
400
DI
300
200
100
0
–100
0123456
06466-046
DV
CC
= 3V
V
LOGIC
DVCC = 5V
(V)
06466-043
Figure 23. Digital Current vs. Logic Input Voltage
Rev. D | Page 13 of 32
AD5722R/AD5732R/AD5752R
0.010
±5V RANGE, CODE = 0xFFFF
±10V RANGE, CODE = 0xFFFF
+10V RANGE, CO DE = 0xFFFF
+5V RANG E , CODE = 0 xFFFF
0.005
±5V RANGE, CODE = 0 x0000
±10V RANGE, CODE = 0x0000
0
12
10
8
–0.005
–0.010
OUTPUT VOLTAGE DELTA ( V)
–0.015
–0.020
–25 –20 –15 –10 –50510152025
OUTPUT CURRENT ( mA)
Figure 24. Output Source and Sink Capability
15
10
5
0
–5
OUTPUT VO LTAGE (V)
–10
6
4
OUTPUT VOLTAGE (V)
2
0
–3–11357911
06466-040
TIME (µs)
06466-024
Figure 27. Full-Scale Settling Time, +10 V Range
6
5
4
3
2
OUTPUT VOLTAGE (V)
1
–15
–3–11357911
TIME (µs)
Figure 25. Full-Scale Settling Time, ±10 V Range
7
5
3
1
–1
–3
OUTPUT VOLTAGE (V)
–5
–7
–3–11357911
TIME (µs)
Figure 26. Full-Scale Settling Time, ±5 V Range
0
–3–11357911
06466-022
TIME (µs)
06466-025
Figure 28. Full-Scale Settling Time, +5 V Range
0.020
0.015
0.010
0.005
0
–0.005
OUTPUT VOLTAGE (V)
–0.010
–0.015
–1012345
06466-023
±10V RANGE, 0x7FFF TO 0x8000
±10V RANGE, 0x8000 TO 0x7FFF
±5V RANGE, 0x7FFF TO 0x8000
±5V RANGE, 0x8000 TO 0x7FFF
+10V RANGE, 0x7 FFF TO 0x8000
+10V RANGE, 0x8 000 TO 0x7FFF
+5V RANGE, 0x7FFF TO 0x8000
+5V RANGE, 0x8000 TO 0x7FF F
TIME (µs)
±
±
±
±
06466-039
Figure 29. Digital-to-Analog Glitch Energy
Rev. D | Page 14 of 32
AD5722R/AD5732R/AD5752R
1
2
RANGE = ±5V
RANGE = +5V
CH1 5µVM 5sLINE 73.8V
RANGE = +10V
RANGE = ±10V
Figure 30. Peak-to-Peak Noise, 0.1 Hz to 10 Hz Bandwidth
Figure 38. AD5732R Total Unadjusted Error vs. Code
6466-020
Rev. D | Page 16 of 32
0
1.01.52.02.53.03.54.04.55.0
TEMPERATURE COEFFI CIENT (ppm/°C)
Figure 41. Reference Output TC (0°C to 85°C)
06466-052
AD5722R/AD5732R/AD5752R
2.50120
20 DEVICES SHOWN
2.50100
2.50120
20 DEVICES SHOWN
2.50100
2.50080
2.50060
2.50040
2.50020
REFERENCE OUT PUT VOLTAGE (V)
2.50000
2.49980
020–20–40406080
TEMPERATURE ( °C)
06466-051
2.50080
2.50060
2.50040
2.50020
REFERENCE OUT PUT VOLTAGE (V)
2.50000
2.49980
0 1020304050607080
TEMPERATURE ( °C)
Figure 42. Reference Output Voltage vs. Temperature (−40°C to+ 85°C) Figure 43. Reference Output Voltage vs. Temperature (0°C to 85°C)
06466-050
Rev. D | Page 17 of 32
AD5722R/AD5732R/AD5752R
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy, or integral nonlinearity, is a
measure of the maximum deviation in LSBs from a straight line
passing through the endpoints of the DAC transfer function. A
typical INL vs. code plot can be seen in Figure 6.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. Therefore, the AD5722R/AD5732R/
AD5752R DACs are guaranteed monotonic by design. A typical
DNL vs. code plot can be seen in Figure 9.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant for increasing digital input code. The AD5722R/
AD5732R/AD5752R are monotonic over the full operating
temperature range.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the DAC register is loaded
with 0x8000 (straight binary coding) or 0x0000 (twos complement
coding). A plot of bipolar zero error vs. temperature can be seen
in Figure 21.
Bipolar Zero Temperature Change (TC)
Bipolar zero TC is a measure of the change in the bipolar zero
error with a change in temperature. It is expressed in ppm FSR/°C.
Zero-Scale Error or Negative Full-Scale Error
Zero-scale error is the error in the DAC output voltage when
0x0000 (straight binary coding) or 0x8000 (twos complement
coding) is loaded to the DAC register. Ideally, the output voltage
should be negative full-scale − 1 LSB. A plot of zero-scale error
vs. temperature can be seen in Figure 20.
Zero-Scale TC
Zero-scale TC is a measure of the change in zero-scale error with a
change in temperature. Zero-scale TC is expressed in ppm FSR/°C.
Output Voltage Settling Time
Output voltage settling time is the amount of time required for
the output to settle to a specified level for a full-scale input change.
A plot of full-scale settling time can be seen in Figure 25.
Slew Rate
The slew rate of a device is a limitation in the rate of change of
the output voltage. The output slewing speed of a voltage output
DAC is usually limited by the slew rate of the amplifier used at
its output. Slew rate is measured from 10% to 90% of the output
signal and is given in V/μs.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation of the DAC transfer characteristic from the ideal slope
and is expressed in % FSR. A plot of gain error vs. temperature
can be seen in Figure 22.
Rev. D | Page 18 of 32
Gain TC
Gain TC is a measure of the change in gain error with changes
in temperature. Gain TC is expressed in ppm FSR/°C.
Tot a l U n ad ju s te d E rr o r ( TU E)
Total unadjusted error is a measure of the output error taking
all the various errors into account, namely, INL error, offset
error, gain error, and output drift over supplies, temperature,
and time. TUE is expressed in % FSR.
Power-On Glitch Energy
Power-on glitch energy is the impulse injected into the analog
output when the AD5722R/AD5732R/AD5752R power on. It is
normally specified as the area of the glitch in nV-sec (see Figure 32).
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state but the output voltage remains constant. It is normally
specified as the area of the glitch in nV-sec and is measured
when the digital input code is changed by 1 LSB at the major
carry transition (0x7FFF to 0x8000). See Figure 29.
Glitch Impulse Peak Amplitude
Glitch impulse peak amplitude is the peak amplitude of the
impulse injected into the analog output when the input code in
the DAC register changes state. It is specified as the amplitude
of the glitch in mV and is measured when the digital input code
is changed by 1 LSB at the major carry transition (0x7FFF to
0x8000). See Figure 29.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC and is measured when the DAC output is not updated. It
is specified in nV-sec and measured with a full-scale code
change on the data bus.
Power Supply Sensitivity
Power supply sensitivity indicates how the output of the DAC is
affected by changes in the power supply voltage.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is measured
with a full-scale output change on one DAC while monitoring
another DAC. It is expressed in LSBs.
Digital Crosstalk
Digital crosstalk is a measure of the impulse injected into the
analog output of one DAC from the digital inputs of another
DAC and is measured when the DAC output is not updated. It
is specified in nV-sec and measured with a full-scale code
change on the data bus.
AD5722R/AD5732R/AD5752R
DAC-to-DAC C rosst a l k
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and a subsequent
output change of another DAC. This includes both digital and
analog crosstalk. It is measured by loading one of the DACs
with a full-scale code change (all 1s to all 0s, and vice versa)
LDAC
with
The energy of the glitch is expressed in nV-sec.
low and monitoring the output of another DAC.
Volt ag e Ref e re n ce T C
Voltage reference TC is a measure of the change in the refer
ence output voltage with a change in temperature. This value
is expressed in ppm/°C.
Rev. D | Page 19 of 32
AD5722R/AD5732R/AD5752R
x
T
THEORY OF OPERATION
The AD5722R/AD5732R/AD5752R are dual, 12-/14-/16-bit,
serial input, unipolar/bipolar, voltage output DACs. They
operate from unipolar supply voltages of +4.5 V to +16.5 V or
bipolar supply voltages of ±4.5 V to ±16.5 V. In addition, the
parts have software-selectable output ranges of +5 V, +10 V,
+10.8 V, ±5 V, ±10 V, and ±10.8 V. Data is written to the
AD5722R/AD5732R/AD5752R in a 24-bit word format via a
3-wire serial interface. The devices also offer an SDO pin to
facilitate daisy chaining or readback.
The AD5722R/AD5732R/AD5752R incorporate a power-on
reset circuit to ensure that the DAC registers power up loaded
with 0x0000. When powered on, the outputs are clamped to 0 V
via a low impedance path. The parts also feature on-chip
reference and reference buffers.
ARCHITECTURE
The DAC architecture consists of a string DAC followed by an
output amplifier. Figure 44 shows a block diagram of the DAC
architecture. The reference input is buffered before being
applied to the DAC.
REFIN
REF (+)
DAC REGISTER
Figure 44. DAC Architecture Block Diagram
The resistor string structure is shown in Figure 45. It is a string
of resistors, each of value R. The code loaded to the DAC register
determines the node on the string where the voltage is to be
tapped off and fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the string
to the amplifier. Because it is a string of resistors, it is guaranteed
monotonic.
RESISTOR
STRING
REF (–)
GND
OUTPUT
RANGE CONTROL
V
OUT
CONFIGURABLE
OUTPUT
AMPLIFIER
06466-006
REFIN
R
R
06466-007
TO OUTPU
AMPLIFIER
R
R
R
Figure 45. Resistor String Structure
Output Amplifiers
The output amplifiers are capable of generating both unipolar
and bipolar output voltages. They are capable of driving a load
of 2 kΩ in parallel with 4000 pF to GND. The source and sink
capabilities of the output amplifiers can be seen in Figure 24.
The slew rate is 4.5 V/μs with a full-scale settling time of 10 μs.
Reference Buffers
The AD5722R/AD5732R/AD5752R can operate with either an
external or internal reference. The reference input has an input
range of 2 V to 3 V, with 2.5 V for specified performance. This
input voltage is then buffered before it is applied to the DAC cores.
SERIAL INTERFACE
The AD5722R/AD5732R/AD5752R are controlled over a
versatile 3-wire serial interface that operates at clock rates up to
30 MHz. It is compatible with SPI, QSPI™, MICROWIRE™, and
DSP standards.
Input Shift Register
The input shift register is 24 bits wide. Data is loaded into the
device MSB first as a 24-bit word under the control of a serial
clock input, SCLK. The input register consists of a read/write
bit, three register select bits, three DAC address bits, and 16 data
bits. The timing diagram for this operation is shown in Figure 2.
Rev. D | Page 20 of 32
AD5722R/AD5732R/AD5752R
*
Standalone Operation
The serial interface works with both a continuous and noncontinuous serial clock. A continuous SCLK source can be used
SYNC
only if
is held low for the correct number of clock cycles.
In gated clock mode, a burst clock containing the exact number
of clock cycles must be used, and
SYNC
must be taken high
after the final clock to latch the data. The first falling edge of
SYNC
starts the write cycle. Exactly 24 falling clock edges must
be applied to SCLK before
SYNC
is brought high before the 24th falling SCLK edge, the
SYNC
is brought high again. If
data written is invalid. If more than 24 falling SCLK edges are
SYNC
applied before
is brought high, the input data is also
invalid. The input register addressed is updated on the rising
edge of
SYNC
. For another serial transfer to take place,
SYNC
must be brought low again. After the end of the serial data
transfer, data is automatically transferred from the input shift
register to the addressed register.
When the data has been transferred into the chosen register of
the addressed DAC, all DAC registers and outputs can be
68HC11
MISO
LDAC
*
MOSI
SCK
PC7
PC6
low while
updated by taking
ADDITIONAL P INS OMIT TED FOR CLARITY.
Figure 46. Daisy Chaining the AD5722R/AD5732R/AD5752R
SYNC
SDIN
SCLK
SYNC
LDAC
SCLK
SYNC
LDAC
SCLK
SYNC
LDAC
is high.
AD5722R/
AD5732R/
AD5752R*
SDO
SDIN
AD5722R/
AD5732R/
AD5752R*
SDO
SDIN
AD5722R/
AD5732R/
AD5752R*
SDO
06466-008
Daisy-Chain Operation
For systems that contain several devices, the SDO pin can be
used to daisy-chain several devices together. Daisy-chain mode
can be useful in system diagnostics and in reducing the number
of serial interface lines. The first falling edge of
SYNC
starts the
write cycle. SCLK is continuously applied to the input shift
register when
SYNC
is low. If more than 24 clock pulses are
applied, the data ripples out of the shift register and appears on
the SDO line. This data is clocked out on the rising edge of
SCLK and is valid on the falling edge. By connecting the SDO
of the first device to the SDIN input of the next device in the
chain, a multidevice interface is constructed. Each device in the
system requires 24 clock pulses. Therefore, the total number of
clock cycles must equal 24 × N, where N is the total number of
AD5722R/AD5732R/AD5752R devices in the chain. When the
serial transfer to all devices is complete,
SYNC
is taken high.
This latches the input data in each device in the daisy chain and
prevents any further data from being clocked into the input shift
register. The serial clock can be a continuous or gated clock.
A continuous SCLK source can only be used if
SYNC
is held
low for the correct number of clock cycles. In gated clock mode,
a burst clock containing the exact number of clock cycles must
be used, and
SYNC
must be taken high after the final clock to
latch the data.
Readback Operation
Readback mode is invoked by setting the R/W bit = 1 in the write
operation to the serial input shift register. (If the SDO output is
disabled via the SDO disable bit in the control register, it is automatically enabled for the duration of the read operation, after
which it is disabled again). With R/
W
= 1, Bit A2 to Bit A0 in
association with Bit REG2 to Bit REG0 select the register to be
read. The remaining data bits in the write sequence are don’t
care bits. During the next SPI write, the data appearing on the
SDO output contains the data from the previously addressed
register. For a read of a single register, the NOP command can
be used in clocking out the data from the selected register on
SDO. The readback diagram in shows the readback
Figure 4
sequence. For example, to read back the DAC register of
Channel A, the following sequence should be implemented:
1. Write 0x800000 to the AD5722R/AD5732R/AD5752R
input register. This configures the part for read mode with
the DAC register of Channel A selected. Note that all the
data bits, DB15 to DB0, are don’t care bits.
2. Follow this with a second write, a NOP condition, 0x180000.
During this write, the data from the register is clocked out
on the SDO line.
Rev. D | Page 21 of 32
AD5722R/AD5732R/AD5752R
LOAD DAC (LDAC) CONFIGURING THE AD5722R/AD5732R/AD5752R
After data has been transferred into the input register of the
DACs, there are two ways to update the DAC registers and DAC
outputs. Depending on the status of both
SYNC
and
LDAC
, one
of two update modes is selected: individual DAC updating or
simultaneous updating of all DACs.
OUTPUT
AMPLIFIER
REFIN
LDAC
SCLK
SYNC
SDIN
Figure 47. Simplified Diagram of Input Loading Circuitry for One DAC
12-/14-/16-BIT
DAC
DAC
REGISTER
INPUT
REGISTER
INTERFACE
LOGIC
SDO
V
x
OUT
06466-009
Individual DAC Updating
In this mode,
LDAC
is held low while data is being clocked into
the input shift register. The addressed DAC output is updated
on the rising edge of
SYNC
.
Simultaneous Updating of All DACs
In this mode,
LDAC
is held high while data is being clocked
into the input shift register. All DAC outputs are asynchronously
updated by taking
LDAC
low after
The update now occurs on the falling edge of
SYNC
has been taken high.
LDAC
.
ASYNCHRONOUS CLEAR (CLR)
CLR
is an active low clear that allows the outputs to be cleared
to either zero-scale code or midscale code. The clear code value
is user selectable via the CLR select bit of the control register
(see the section). It is necessary to maintain Control Register
CLR
low for a minimum amount of time to complete the operation
(see ). When the Figure 2
remains at the cleared value until a new value is programmed. The
outputs cannot be updated with a new value while the
is low. A clear operation can also be performed via the clear
command in the control register.
CLR
signal is returned high, the output
CLR
pin
When the power supplies are applied to the AD5722R/AD5732R/
AD5752R, the power-on reset circuit ensures that all registers
default to 0. This places all channels and the internal reference
in power-down mode. The DV
should be brought high before
CC
any of the interface lines are powered. If this is not done the first
write to the device may be ignored. The first communication to
the AD5722R/AD5732R/AD5752R should be to set the required
output range on all channels (the default range is the 5 V unipolar
range) by writing to the output range select register. The user
should then write to the power control register to power on the
required channels and the internal reference, if required.
If an external reference source is being used, the internal
reference must remain in power-down mode. To program an
output value on a channel, that channel must first be powered
up; any writes to a channel while it is in power-down mode are
ignored. The AD5722R/AD5732R/AD5752R operate with a
wide power supply range. It is important that the power supply
applied to the parts provides adequate headroom to support the
chosen output ranges.
TRANSFER FUNCTION
Tabl e 8 to Ta bl e 16 show the relationships of the ideal input code
to output voltage for the AD5752R, AD5732R, and AD5722R,
respectively, for all output voltage ranges. For unipolar output
ranges, the data coding is straight binary. For bipolar output
ranges, the data coding is user selectable via the BIN/
pin and can be either offset binary or twos complement.
For a unipolar output range, the output voltage expression is
given by
D
⎡
OUT
REFIN
×=
GainVV
⎤
N
⎢
⎥
2
⎣
⎦
For a bipolar output range, the output voltage expression is given by
VGain
OUT
D
⎡
×=
GainVV
REFIN
⎤
N
⎢
⎥
⎣
⎦
×
−
REFIN
22
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the bit resolution of the DAC.
V
is the reference voltage applied at the REFIN pin.
REFIN
Gain is an internal gain whose value depends on the output
range selected by the user, as shown in Tabl e 7 .
2sCOMP
Table 7.
Output Range (V) Gain Value
+5 2
+10 4
+10.8
±5
±10
4.32
4
8
±10.8 8.64
Rev. D | Page 22 of 32
AD5722R/AD5732R/AD5752R
Ideal Output Voltage to Input Code Relationship—AD5752R
Table 8. Bipolar Output, Offset Binary Coding
Digital Input Analog Output
MSB LSB ±5 V Output Range ±10 V Output Range ±10.8 V Output Range
The input shift register is 24 bits wide and consists of a read/write bit (R/W); a reserved bit (ZERO), which must always be set to 0; three
register select bits (REG2, REG1, REG0); three DAC address bits (A2, A1, A0); and 16 data bits (data). The register data is clocked in MSB
first on the SDIN pin. shows the register format, while describes the function of each bit in the register. All registers are
read/write registers.
0 0 0 DAC register
0 0 1 Output range select register
0 1 0 Power control register
0 1 1 Control register
A2, A1, A0 These DAC address bits are used to decode the DAC channels.
0 0 0 DAC A
0 1 0 DAC B
1 0 0 Both DACs
Data Data bits.
Tabl e 1 7Tabl e 1 8
Zero REG2 REG1 REG0 A2 A1 A0 Data
Indicates a read from or a write to the addressed register.
Used in association with the address bits to determine if a write operation is to the DAC register, output range
select register, power control register, or control register.
REG2 REG1 REG0 Function
A2 A1 A0 Channel Address
Rev. D | Page 26 of 32
AD5722R/AD5732R/AD5752R
DAC REGISTER
The DAC register is addressed by setting the three REG bits to 000. The DAC address bits select the DAC channel where the data transfer
is to take place (see Tab l e 1 8 ). The data bits are in positions DB15 to DB0 for the AD5752R (see Tab l e 19 ), DB15 to DB2 for the AD5732R
(see Tabl e 2 0 ), and DB15 to DB4 for the AD5722R (see Tab le 2 1).
Table 19. Programming the AD5752R DAC Register
MSB LSB
R/W Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB0
0 0 0 0 0 DAC address 16-bit DAC data
Table 20. Programming the AD5732R DAC Register
MSB LSB
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB2 DB1 DB0
R/
W
0 0 0 0 0 DAC address 14-bit DAC data X X
Table 21. Programming the AD5722R DAC Register
MSB LSB
R/W Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB4 DB3 DB2 DB1 DB0
0 0 0 0 0 DAC address 12-bit DAC data X X X X
OUTPUT RANGE SELECT REGISTER
The output range select register is addressed by setting the three REG bits to 001. The DAC address bits select the DAC channel, and the
range bits (R2, R1, R0) select the required output range (see Tab l e 22 and Table 2 3).
Table 22. Programming the Required Output Range
MSB LSB
R/
W
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB3 DB2 DB1 DB0
The control register is addressed by setting the three REG bits to 011. The value written to the address and data bits determines the
control function selected. The control register options are shown in Ta bl e 24 and Ta bl e 25 .
Table 24. Programming the Control Register
MSB LSB
R/W Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB4 DB3 DB2 DB1 DB0
0 0 0 1 1 0 0 0 NOP, data = don’t care
0 0 0 1 1 0 0 1 Don’t care TSD enable Clamp enable CLR select SDO disable
0 0 0 1 1 1 0 0 Clear, data = don’t care
0 0 0 1 1 1 0 1 Load, data = don’t care
Table 25. Explanation of Control Register Options
Option Description
NOP No operation instruction used in readback operations.
Clear Addressing this function sets the DAC registers to the clear code and updates the outputs.
Load Addressing this function updates the DAC registers and, consequently, the DAC outputs.
SDO Disable Set by the user to disable the SDO output. Cleared by the user to enable the SDO output (default).
CLR Select See Table 26 for a description of the CLR select operation.
Clamp Enable
TSD Enable
Set by the user to enable the current limit clamp. The channel does not power down upon detection of an
overcurrent; the current is clamped at 20 mA (default).
Cleared by the user to disable the current-limit clamp. The channel powers down upon detection of an overcurrent.
Set by the user to enable the thermal shutdown feature. Cleared by the user to disable the thermal shutdown
feature (default).
Table 26. CLR Select Options
Output CLR Value
CLR Select Setting Unipolar Output Range Bipolar Output Range
0 0 V 0 V
1 Midscale Negative full scale
POWER CONTROL REGISTER
The power control register is addressed by setting the three REG bits to 010. This register allows the user to control and determine the power
and thermal status of the AD5722R/AD5732R/AD5752R. The power control register options are shown in Tabl e 27 and Ta bl e 28 .
Table 27. Programming the Power Control Register
MSB LSB
DB15
to
Zero REG2 REG1 REG0 A2 A1 A0
W
R/
0 0 0 1 0 0 0 0 X X OCB X OCA 0 TSD PU
Table 28. Power Control Register Functions
Option Description
PUA
DAC A power-up. When set, this bit places DAC A in normal operating mode. When cleared, this bit places DAC A in power-down
mode (default). After setting this bit to power DAC A, a power-up time of 10 μs is required. During this power-up time the DAC
register should not be loaded to the DAC output (see the Load DAC (LDAC
is cleared, DAC A powers down automatically on detection of an overcurrent, and PU
PUB
DAC B power-up. When set, this bit places DAC B in normal operating mode. When cleared, this bit places DAC B in power-down
mode (default). After setting this bit to power DAC B, a power-up time of 10 μs is required. During this power-up time the DAC
register should not be loaded to the DAC output (see the Load DAC (LDAC
is cleared, DAC B powers down automatically on detection of an overcurrent, and PUB is cleared to reflect this.
PU
Reference power-up. When set, this bit places the internal reference in normal operating mode. When cleared, this bit places the
REF
internal reference in power-down mode (default).
TSD Thermal shutdown alert. Read-only bit. In the event of an overtemperature situation, both DACs are powered down and this bit is set.
OCA DAC A overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC A, this bit is set.
OCB DAC B overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC B, this bit is set.
DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
X PUB X PUA
REF
) section). If the clamp enable bit of the control register
is cleared to reflect this.
A
) section). If the clamp enable bit of the control register
Rev. D | Page 28 of 32
AD5722R/AD5732R/AD5752R
DESIGN FEATURES
ANALOG OUTPUT CONTROL
In many industrial process control applications, it is vital that
the output voltage be controlled during power-up. When the
supply voltages change during power-up, the V
pins are
OUT
clamped to 0 V via a low impedance path (approximately 4 kΩ).
To prevent the output amplifiers from being shorted to 0 V
during this time, Transmission Gate G1 is also opened (see
Figure 48). These conditions are maintained until the power
supplies have stabilized and a valid word is written to a DAC
register. At this time, G2 opens and G1 closes.
VOLTAGE
MONITOR
AND
CONTROL
G1
G2
Figure 48. Analog Output Control Circuitry
V
A
OUT
6466-010
POWER-DOWN MODE
Each DAC channel of the AD5722R/AD5732R/AD5752R can
be individually powered down. By default, all channels are in
power-down mode. The power status is controlled by the power
control register (see Ta bl e 27 and Ta ble 28 for details). When a
channel is in power-down mode, its output pin is clamped to
ground through a resistance of approximately 4 kΩ, and the
output of the amplifier is disconnected from the output pin.
OVERCURRENT PROTECTION
Each DAC channel of the AD5722R/AD5732R/AD5752R
incorporates individual overcurrent protection. The user has
two options for the configuration of the overcurrent protection:
constant current clamp or automatic channel power-down. The
configuration of the overcurrent protection is selected via the
clamp enable bit in the control register.
Constant Current Clamp (Clamp Enable = 1)
If a short circuit occurs in this configuration, the current is
clamped at 20 mA. This event is signaled to the user by the
setting of the appropriate overcurrent (OC
) bit in the power
X
control register. Upon removal of the short-circuit fault, the
bit is cleared.
OC
X
Automatic Channel Power-Down (Clamp Enable = 0)
If a short circuit occurs in this configuration, the shorted
channel powers down, and its output is clamped to ground via a
resistance of approximately 4 kΩ. At this time, the output of the
amplifier is also disconnected from the output pin. The shortcircuit event is signaled to the user via the overcurrent (OC
bits, and the power-up (PU
) bits indicate which channels have
X
)
X
powered down. After the fault is rectified, the channels can be
powered up again by setting the PU
bits.
X
THERMAL SHUTDOWN
The AD5722R/AD5732R/AD5752R incorporate a thermal
shutdown feature that automatically shuts down the device if
the core temperature exceeds approximately 150°C. The thermal
shutdown feature is disabled by default and can be enabled via
the TSD enable bit of the control register. In the event of a
thermal shutdown, the TSD bit of the power control register is set.
INTERNAL REFERENCE
The on-chip voltage reference is powered down by default. If an
external voltage reference source is to be used, the internal
reference must remain powered down at all times. If the
internal reference is to be used as the reference source, it must
be powered up via the PU
The internal reference voltage is accessible at the REFIN/REFOUT
pin for use as a reference source for other devices within the
system. If the internal reference is to be used external to the
AD5722R/AD5732R/AD5752R, it must first be buffered.
bit of the power control register.
REF
Rev. D | Page 29 of 32
AD5722R/AD5732R/AD5752R
A
APPLICATIONS INFORMATION
+5 V/±5 V OPERATION
When operating from a single +5 V supply or a dual ±5 V
supply, an output range of +5 V or ±5 V is not achievable
because sufficient headroom for the output amplifier is not
available. In this situation, a reduced reference voltage can be
used. For example, a 2 V reference voltage produces an output
range of +4 V or ±4 V, and the 1 V of headroom is more than
enough for full operation. A standard value voltage reference
of 2.048 V can be used to produce output ranges of +4.096 V
and ±4.096 V. Refer to the plots in the Typical Per f o r mance
Characteristics section for performance data at a range of
voltage reference values.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5722R/AD5732R/AD5752R are mounted should
be designed so that the analog and digital sections are separated
and confined to certain areas of the board. If the AD5722R/
AD5732R/AD5752R are in a system where multiple devices
require an AGND-to-DGND connection, the connection should
be made at one point only. The star ground point should be
established as close as possible to the device.
The AD5722R/AD5732R/AD5752R should have ample supply
bypassing of a 10 μF capacitor in parallel with a 0.1 μF capacitor
on each supply located as close to the package as possible,
ideally right up against the device. The 10 μF capacitors are the
tantalum bead type. The 0.1 μF capacitor should have low
effective series resistance (ESR) and low effective series
inductance (ESI), such as the common ceramic types, which
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
The power supply lines of the AD5722R/AD5732R/AD5752R
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
Fast switching signals, such as clock signals, should be shielded
with digital ground to avoid radiating noise to other parts of the
board, and they should never be run near the reference inputs.
A ground line routed between the SDIN and SCLK lines helps
reduce crosstalk between these lines (this is not required on a
multilayer board that has a separate ground plane, but separating
the lines does help). It is essential to minimize noise on the
REFIN line because noise couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough on the board. A microstrip
technique is by far the best method, but it is not always possible
with a double-sided board. In this technique, the component side
of the board is dedicated to a ground plane, and signal traces
are placed on the solder side.
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur. The
iCoupler® family of products from Analog Devices, Inc., provides
voltage isolation in excess of 2.5 kV. The serial loading structure
of the AD5722R/AD5732R/AD5752R makes them ideal for
isolated interfaces because the number of interface lines is kept
to a minimum. Figure 49 shows a 4-channel isolated interface to
the AD5722R/AD5732R/AD5752R using an ADuM1400. For
more information, visit http://www.analog.com/icouplers.
MICROCONTROLLER
V
SERIAL CLO CK OUT
SERIAL DATA O UT
SYNC OUT
CONTROL OUT
*ADDITIONAL P INS OMIT TED FOR CLARITY.
IA
V
IB
V
IC
V
ID
Figure 49. Isolated Interface
DuM1400*
ENCODEDECODE
ENCODEDECODE
ENCODEDECODE
ENCODEDECODE
V
OA
TO SCLK
V
OB
TO SDIN
V
OC
TO SYNC
V
OD
TO LDAC
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5722R/AD5732R/AD5752R
is via a serial bus that uses standard protocol compatible with
microcontrollers and DSP processors. The communications
channel is a 3-wire (minimum) interface consisting of a clock
signal, a data signal, and a synchronization signal. Each AD5722R/
AD5732R/AD5752R requires a 24-bit data-word with data valid
on the falling edge of SCLK.
For all interfaces, the DAC output update can be initiated
automatically when all the data is clocked in, or it can be
LDAC
performed under the control of
registers can be read using the readback function.
AD5722R/AD5732R/AD5752R to Blackfin® DSP Interface
Figure 50 shows how the AD5722R/AD5732R/AD5752R can be
interfaced to Analog Devices Blackfin DSP. The Blackfin has an
integrated SPI port that can be connected directly to the SPI pins
of the AD5722R/AD5732R/AD5752R and the programmable I/O
pins that can be used to set the state of a digital input, such as