Datasheet AD5678 Datasheet (Analog Devices)

4 x12-Bit and 4 x16-Bit Octal DAC with

On-Chip Reference in 14 Lead TSSOP

Preliminary Technical Data

FEATURES

Low Power Octal DAC with
4 DACs x 16 Bits

4 DACs x 12 Bits
14/16-Lead TSSOP Package
On-chip 1.25/2.5V, 10ppm/°C Reference
Power-Down to 200 nA @ 5V, 50 nA @ 3V
3V/5V Power Supply
Guaranteed Monotonic by Design
Power-On-Reset to Zero
Three Power-Down Functions
Hardware /LDAC and /CLR functions
Rail-to-Rail Operation
Temperature Range -40°C to +125°C

APPLICATIONS

ProcessControl
Data Acquisition Systems
Portable Battery Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources

GENERAL DESCRIPTION

The AD5678 is a low power, octal buffered voltage-out DAC; 4
DACs with 12-bits of resolution and 4 DACs with16-bits of
resolution, in a single package. All devices operate from a
single +2.7V to +5.5V, and are guaranteed monotonic by
design.

The AD5678 has an on-chip reference with an internal gain of
two. The AD5678-1 has a 1.25V 10ppm/°C max reference and
the AD5678-2, has a 2.5V 10ppm/°C max reference. The on­board reference is off at power-up allowing the use of an
external reference. The internal reference is turned on by
writing to the DAC. The part incorporates a power-on-reset
circuit that ensures that the DAC output powers up to zero
volts and remains there until a valid write takes place. The part
contains a power-down feature that reduces the current
consumption of the device to 200nA at 5V and provides
software selectable output loads while in power-down mode for
any or all DACs channels.

AD5678

Programmable Attenuators

V

I

NPUT

REGISTER

I

NPUT

REGISTER

I

NPUT

REGISTER

I

NPUT

REGISTER

I

NPUT

REGIS-

TER

I

NPUT

REGISTER

I

NPUT

REGISTER

I

NPUT

REGISTER

POWER-ON

DD

REGISTER

REGISTER

REGISTER

REGISTER

REGISTER

REGISTER

REGISTER

RESET

SCLK

SYNC

DIN

*RU-16 PACKAGE ONLY

AD5678

LDAC

INTERFACE

LOGIC

LDAC*

CLR*

Figure 1. Functional Block Diagram

The outputs of all DACs may be updated simultaneously using
the /LDAC function, with the added functionality of selecting
through software any number of DAC channels to synchronize.
There is also an asynchronous active low /CLR that clears all
DACs to a software selectable code - 0 V, midscale or fullscale .

The AD5678 utilizes a versatile three-wire serial interface that
operates at clock rates up to 50 MHz and is compatible with
standard SPI™, QSPI™, MICROWIRE™ and DSP interface
standards. Its on-chip precision output amplifier allows rail-to­rail output swing to be achieved.

PRODUCT HIGHLIGHTS

1. Octal – 4x12-/4x16-Bit DAC; 12-Bit Accuracy

Guaranteed.

2. On-chip 1.25/2.5V, 10ppm/°C max Reference.

3. Available in 14/16-lead TSSOP package.

4. Power-On-Reset to Zero volts.

5. Power-down capability. When powered down, the

DAC typically consumes 50nA at 3V and 200nA at 5V.

DAC

DAC

DAC

D

AC

REGISTER

D

AC

D

AC

D

AC

D

AC

V

STRING

DAC A

STRING

DAC B

STRING

DAC C

STRING
DAC D

STRING
DAC E

STRING

DAC F

STRING
DAC G

STRING

DAC H

REF

1.25/2.5V
Ref

BUFFER

BUFFER

BUFFER

BUFFER

BUFFER

BUFFER

BUFFER

BUFFER

POWER-DOWN

GND

LOGIC

V

A

OUT

V

B

OUT

V

C

OUT

V

D

OUT

V

E

OUT

V

F

OUT

V

G

OUT

V

H

OUT

Rev. PrB

Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] © 2005 Analog Devices, Inc. All rights reserved.

AD5678

TABLE OF CONTENTS

Features.......................................................................................... 1

Preliminary Technical Data

Terminology................................................................................ 10

Applications................................................................................... 1

General Description..................................................................... 1

Product Highlights....................................................................... 1

AD5678–Specifications.................................................................... 3

Timing Characteristics..................................................................... 8

Pin Configuration and Function Descriptions............................. 9

Absolute Maximum Ratings.......................................................... 10

ESD Caution................................................................................ 10

REVISION HISTORY

Revision 0: Initial Version

AD5678–Typical Performance Characteristics .......................... 12

General Description................................................................... 15

Serial Interface............................................................................ 15

Microprocessor Interfacing............................................................

Applications .....................................................................................

Outline Dimensions....................................................................... 22

Ordering Guide ...............................................................................

Rev.PrB | Page 2 of 22

Preliminary Technical Data

AD5678

AD5678–SPECIFICATIONS

(VDD = +4.5 V to +5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; External REFIN = VDD; all specifications T
noted)

Table 1.

A Grade

B Version

Parameter Min Typ Max Unit

STATIC PERFORMANCE

3,4

Conditions/Comments

1,2

AD5678 (DAC C, D, E, F)
Resolution 12 Bits
Relative Accuracy ±0.5 ±6 LSB See Figure 4
Differential Nonlinearity ±1 LSB Guaranteed Monotonic by Design. See Figure 5.
AD5678 (DAC A, B, G, H)
Resolution 16 Bits
Relative Accuracy ±32 LSB See Figure 4
Differential Nonlinearity ±1 LSB Guaranteed Monotonic by Design. See Figure 5.
Load Regulation 2 LSB/mA

VDD=Vref=5V, Midscale

sourcing/sinking
Zero Code Error +1 +9 mV All Zeroes Loaded to DAC Register. See Figure 8.
Zero Code Error Drift3 ±20 µV/°C
Full-Scale Error -0.15 -1.25 % of FSR All Ones Loaded to DAC Register. See Figure 8.
Gain Error ±0.7 % of FSR
Gain Temperature Coefficient ±5 ppm of FSR/°C
Offset Error ±1 ±9 mV
Offset Temperature Coefficient 1.7 µV/°C

DC Power Supply Rejection Ratio6

DC Crosstalk6 (Ext Ref)

DC Crosstalk6 (Int Ref)

10

4.5

10

20

4.5

20

–80

dB VDD ±10%

µV
µV/mA
µV
µV
µV/mA
µV

RL = 2 k. to GND or VDD

Due to Load current change

Due to Powering Down (per channel)

RL = 2 k. to GND or VDD

Due to Load current change

Due to Powering Down (per channel)

OUTPUT CHARACTERISTICS6
Output Voltage Range 0 VDD V
Capacitive Load Stability 2 pF RL=∞
10 pF RL=2 kΩ
DC Output Impedance 0.5 Ω
Short Circuit Current 30 mA VDD=+5V
Power-Up Time 4 µs Coming out of Power-Down Mode. VDD=+5V

REFERENCE INPUTS3

Reference Input voltage

Reference Current 35 45 µ A V

VDD

V ±1% for specified performance

= VDD = +5.5V (per DAC channel)

REF

1

Temperature ranges are as follows: B Version: -40°C to +125°C, typical at 25°C.

2

Linearity calculated using a reduced code range of 485 to 64714. Output unloaded.

3

DC specifications tested with the outputs unloaded unless stated otherwise.

4

Linearity is tested using a reduced code range: AD5628 (Code 48 to Code 4047), AD5648 (Code / to Code /), and AD5678 (Code 485 to 64714).

6

Guaranteed by design and characterization; not production tested.

8

Interface inactive. All DACs active. DAC outputs unloaded.

9

All eight DACs powered down.

Specifications subject to change without notice.

MIN

to T

unless otherwise

MAX

Iout=0mA to 15mA

Rev. PrB| Page 3 of 22

AD5678

A Grade

Parameter Min Typ Max Unit

Reference Input Range 0 VDD

Reference Input Impedance 14.6

REFERENCE OUTPUT
Output Voltage
AD5678x-2/3 2.495 2.5 2.505 V
Reference TC ±10 ppm/°C
Reference Output Impedance 2

LOGIC INPUTS3
Input Current ±1 µA
V

, Input Low Voltage 0.8 V VDD=+5 V

INL

V

, Input High Voltage 2 V VDD=+5 V

INH

Pin Capacitance 3 pF
POWER REQUIREMENTS
VDD 4.5 5.5 V All Digital Inputs at 0 or VDD
IDD (Normal Mode)8 DAC Active and Excluding Load Current
VDD=4.5 V to +5.5 V 2 4 mA VIH=VDD and VIL=GND
IDD (All Power-Down Modes)9
VDD=4.5 V to +5.5 V 0.2 1 µA VIH=VDD and VIL=GND
POWER EFFICIENCY
I

89 % I

OUT/IDD

kΩ

kΩ

Preliminary Technical Data

B Version
Conditions/Comments

Per DAC channel

LOAD

1,2

=2 mA, VDD=+5 V

Rev.PrB | Page 4 of 22

Preliminary Technical Data

1

AC CHARACTERISTICS

specifications T

MIN

to T

unless otherwise noted)

MAX

(VDD = +4.5 V to +5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; External REFIN = VDD; all

AD5678

Parameter2 Min Typ Max Unit

Output Voltage Settling Time
AD5678 (DAC C, D, E, F) 6 8 µs ¼ to ¾ scale settling to ±2LSB
AD5678 (DAC A, B, G, H) 8 10 µs ¼ to ¾ scale settling to ±2LSB
Settling Time for 1LSB Step
Slew Rate 1.5 V/µs
Digital-to-Analog Glitch Impulse 5 nV-s 1 LSB Change Around Major Carry. See Figure 21.
Channel –to-Channel Isolation 100 dB
Digital Feedthrough 0.1 nV-s
Digital Crosstalk 0.5 nV-s
Analog Crosstalk 1 nV-s
DAC-to-DAC Crosstalk 3 nV-s
Multiplying Bandwidth 200 kHz VREF = 2V ± 0.1 V p-p.
Total Harmonic Distortion -80 dB VREF = 2V ± 0.1 V p-p. Frequency = 10kHz
Output Noise Spectral Density 120 nV/√Hz DAC code=8400H, 1kHz
100 nV/√Hz DAC code=8400H, 10kHz
Output Noise 15

1

µVp-p

B Version
Conditions/Comments

0.1Hz to 10Hz;

NOTES

1Guaranteed by design and characterization; not production tested.
2See the Terminology section.
3Temperature range (Y Version): –40°C to +125°C; typical at +25°C.

Specifications subject to change without notice.

Rev. PrB| Page 5 of 22

AD5678

Preliminary Technical Data

AD5678–SPECIFICATIONS

(VDD = +2.7 V to +3.6 V; RL = 2 kΩ to GND; CL = 200 pF to GND; External REFIN = VDD; all specifications T
noted)

Table 2

A Grade

B Version

Parameter Min Typ Max Unit

STATIC PERFORMANCE
AD5678 (DAC C, D, E, F)
Resolution 12 Bits
Relative Accuracy ±0.5 ±6 LSB See Figure 4
Differential Nonlinearity ±1 LSB Guaranteed Monotonic by Design. See Figure 5.
AD5678 (DAC A, B, G, H)
Resolution 16 Bits
Relative Accuracy ±32 LSB See Figure 4
Differential Nonlinearity ±1 LSB Guaranteed Monotonic by Design. See Figure 5.
Load Regulation 4 LSB/mA

Zero Code Error +1 +9 mV All Zeroes Loaded to DAC Register. See Figure 8.
Zero Code Error Drift1 ±20 µV/°C
Full-Scale Error -0.15 -1.25 % of FSR All Ones Loaded to DAC Register. See Figure 8.
Gain Error ±0.7 % of FSR
Gain Temperature Coefficient ±5 ppm of FSR/°C
Offset Error ±1 ±9 mV
Offset Temperature Coefficient 1.7 µV/°C

DC Power Supply Rejection Ratio6

DC Crosstalk6 (Ext Ref)

DC Crosstalk6 (Int Ref)

OUTPUT CHARACTERISTICS6
Output Voltage Range 0 VDD V
Capacitive Load Stability 2 pF RL=∞
10 pF RL=2 kΩ
DC Output Impedance 0.5 Ω
Short Circuit Current 30 mA VDD=+3V
Power-Up Time 5 µs Coming Out of Power-Down Mode. VDD=+3V

REFERENCE INPUTS3

Reference Input voltage VDD V ±1% for specified performance

Reference Current 20 20 µ A V

Reference Input Range 0 VDD

Reference Input Impedance 14.6

REFERENCE OUTPUT
Output Voltage
AD5678x-1 1.248 1.25 1.252 V
Reference TC ±10 ppm/°C

3,4

–80

10

4.5

10

20

4.5

20

dB VDD = ±10%

µV
µV/mA
µV
µV
µV/mA
µV

kΩ

Conditions/Comments

VDD=Vref=3V, Midscale

sourcing/sinking

RL = 2 k. to GND or VDD

Due to Load current change

Due to Powering Down (per channel)

RL = 2 k. to GND or VDD

Due to Load current change

Due to Powering Down (per channel)

REF

Per DAC channel

1,1

= VDD = +3.6V (per DAC channel)

MIN

to T

unless otherwise

MAX

Iout=0mA to 7.5mA

Rev.PrB | Page 6 of 22

Preliminary Technical Data

AD5678

Reference Output Impedance 2

kΩ

LOGIC INPUTS3
Input Current ±1 µA
V

, Input Low Voltage 0.8 V VDD=+3 V

INL

V

, Input High Voltage 2 V VDD=+3 V

INH

Pin Capacitance 3 pF
POWER REQUIREMENTS
VDD 2.7 3.6 V All Digital Inputs at 0 or VDD
IDD (Normal Mode)8 DAC Active and Excluding Load Current
VDD=2.7 V to +3.6 V 2 4 mA VIH=VDD and VIL=GND
IDD (All Power-Down Modes)9
VDD=2.7 V to +3.6 V 0.2 1 µA VIH=VDD and VIL=GND
POWER EFFICIENCY
I

89 % I

OUT/IDD

=2 mA, VDD=+5 V

LOAD

AC CHARACTERISTICS1

(VDD = +2.7 V to +3.6 V; RL = 2 kΩ to GND; CL = 200 pF to GND; External REFIN = VDD; all specifications T
noted)

B Version

Parameter2 Min Typ Max Unit

Conditions/Comments

1

Output Voltage Settling Time
AD5678 (DAC C, D, E, F) 6 8 µs ¼ to ¾ scale settling to ±2LSB
AD5678 (DAC A, B, G, H) 8 10 µs ¼ to ¾ scale settling to ±2LSB
Settling Time for 1LSB Step
Slew Rate 1.5 V/µs
Digital-to-Analog Glitch Impulse 10 nV-s 1 LSB Change Around Major Carry. See Figure 21.
Channel –to-Channel Isolation 100 dB
Digital Feedthrough 0.5 nV-s
Digital Crosstalk 0.5 nV-s
Analog Crosstalk 1 nV-s
DAC-to-DAC Crosstalk 3 nV-s
Multiplying Bandwidth 200 kHz VREF = 2V ± 0.1 V p-p.
Total Harmonic Distortion -80 dB VREF = 2V ± 0.1 V p-p. Frequency = 10kHz
Output Noise Spectral Density 120 nV/√Hz DAC code=8400H, 1kHz
100 nV/√Hz DAC code=8400H, 10kHz
Output Noise 15

NOTES

1Guaranteed by design and characterization; not production tested.
2See the Terminology section.
3Temperature range (Y Version): –40°C to +125°C; typical at +25°C.

Specifications subject to change without notice.

µVp-p

0.1Hz to 10Hz;

MIN

to T

unless otherwise

MAX

Rev. PrB| Page 7 of 22

AD5678

Preliminary Technical Data

TIMING CHARACTERISTICS

All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.

See Figure 2.

= +2.7 V to +5.5 V; all specifications T

(V

DD

Limit at T

Parameter V

= 2.7 V to 3.6 V VDD= 3.6 V to 5.5 V Unit Conditions/Comments

DD

MIN

to T

MIN

unless otherwise noted)

MAX

, T

MAX

t1 1 20 20 ns min SCLK Cycle Time
t2 11 9 ns min SCLK High Time

t3 9 9 ns min SCLK Low Time
t4 13 13 ns min

SYNC

to SCLK Falling Edge Setup Time
t5 4 4 ns min Data Setup Time
t6 4 4 ns min Data Hold Time
t7 0 0 ns min

t8 25 20 ns min
t9 13 13 ns min
t10 0 0 ns min
t11 20 20 ns min
t12 20 20 ns min

SCLK Falling Edge to
Minimum
SYNC

SYNC

Rising Edge to SCLK Fall Ignore

SCLK Falling Edge to

LDAC Pulsewidth Low

SCLK Falling Edge to LDAC Rising Edge

SYNC

High Time

SYNC

Rising Edge

Fall Ignore

t13 20 20 ns min /CLR Pulse Width Low
t14 0 0 ns min

SCLK Falling Edge to LDAC Falling Edge

t15 tbd tbd ns min /CLR Pulse Activation Time (AD5380?)

t

10

SCLK

t

8

SYNC

DIN

LDAC1

LDAC2

CLR

NOTES

1. ASYNCHRONOUS LDAC UPDATE MODE.

2. SYNCHRONOUS LDAC UPDATE MODE.

DB31

t

4

t

6

t

5

t

1

t

t

3

2

DB0

t

t14

t

9

7

t11

Figure 2. Serial Write Operation

1

3Maximum SCLK frequency is 50 MHz at VDD = +3.6 V to +5.5 V and 20 MHz at VDD = +2.7 V to +3.6 V.

t12

t13

Rev.PrB | Page 8 of 22

Preliminary Technical Data

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

AD5678

V
V
V

V

SYNC

V

OUT
OUT
OUT

OUT

V

REF

DD

A
C
E

G

1
2

AD5678

3
4

TOP VIEW

(Not to Scale)

5
6
7

14

SCLK

13

DIN

12

GND

11

V

B

OUT

V

D

10

OUT

9

V

F

OUT

8

V

H

OUT

V

V
V
V

OUT

LDAC

SYNC

V
OUT
OUT

OUT

V

REF

DD

A
C
E

G

1

AD5678

2
3

4

TOP VIEW

(Not to Scale)

5
6
7
8

16

SCLK

15

DIN

14

GND

V

B

13

OUT

V

D

12

OUT

11

V

F

OUT

V

H

10

OUT

9

CLR

Figure 3. 14-Lead TSSOP (RU-14) Figure 4. 16-Lead TSSOP (RU-16)

Table 2. Pin Function Descriptions

Pin No. Mnemonic Function

1 /LDAC Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data.

This allows simultaneous update of all DAC outputs. Alternatively, this pin can be tied permanently
low.

2 /SYNC

Active Low-Control Input. This is the frame synchronization signal for the input data. When SYNC
goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is
transferred in on the falling edges of the following 32 clocks. If SYNC is taken high before the 32nd
falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the
device.

3 VDD Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be

decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.

4 VOUTA Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.

13 VOUTB Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.

5 VOUTC Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.

12 VOUTD Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.

8 VREF Reference Input/Output Pin

9 /CLR

Active Low Control Input that Loads Software selectable code – Zero, midscale, fullscale - to All Input and
DAC Registers. Therefore, the outputs also go to selected code. Default clears the output to 0V.

6 VOUTE Analog Output Voltage from DAC E. The output amplifier has rail-to-rail operation.

11 VOUTF Analog Output Voltage from DAC F. The output amplifier has rail-to-rail operation.

7 VOUTG Analog Output Voltage from DAC G. The output amplifier has rail-to-rail operation.

10 VOUTH Analog Output Voltage from DAC H. The output amplifier has rail-to-rail operation.

14 GND Ground Reference Point for All Circuitry on the Part.

15 DIN Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on the falling

edge of the serial clock input.

16 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock

input. Data can be transferred at rates up to 50 MHz.

Rev. PrB| Page 9 of 22

AD5678

Preliminary Technical Data

ABSOLUTE MAXIMUM RATINGS

V

to GND -0.3 V to VDD + 0.3 V

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

= +25°C unless otherwise noted)

(T

A

Parameter Rating

VDD to GND -0.3 V to +7 V
Digital Input Voltage to GND -0.3 V to VDD + 0.3 V

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.

TERMINOLOGY

Relative Accuracy

For the DAC, relative accuracy or Integral Nonlinearity (INL) is a
measure of the maximum deviation, in LSBs, from a straight line
passing through the endpoints of the DAC transfer function. A
typical INL vs. code plot can be seen in Figure 2.

Differential Nonlinearity

Differential Nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. A typical DNL vs. code plot can be seen in
Figure 3.

OUT

Operating Temperature Range
Industrial (B Version) -40°C to +105°C
Storage Temperature Range -65°C to +150°C
Junction Temperature (TJ Max) +150°C
TSSOP Package
Power Dissipation (TJ Max-TA)/θJA
θJA Thermal Impedance 150.4°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) +215°C
Infrared (15 sec) +220°C

(0000Hex) is loaded to the DAC register. Ideally the output should
be 0 V. The zero-code error is always positive in the AD5660
because the output of the DAC cannot go below 0 V. It is due to a
combination of the offset errors in the DAC and output amplifier.
Zero-code error is expressed in mV. A plot of zero-code error vs.
temperature can be seen in Figure 6.

Gain Error

This is a measure of the span error of the DAC. It is the deviation
in slope of the DAC transfer characteristic from ideal expressed as
a percent of the full-scale range.

Zero-Code Error Drift

This is a measure of the change in zero-code error with a change in
temperature. It is expressed in µV/°C.

Offset Error

Offset error is a measure of the difference between VOUT
(actual) and VOUT (ideal) expressed in mV in the linear
region of the transfer function. Offset error is measured on
the AD5678 with Code 512 loaded into the DAC register.

This is a measure of the offset error of the DAC and the output
amplifier (see Figures 2 and 3). It can be negative or positive, and is
expressed in mV.

Zero-Code Error

Zero-code error is a measure of the output error when zero code

Rev.PrB | Page 10 of 22

Gain Error Drift

This is a measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.

Full-Scale Error

Full-scale error is a measure of the output error when full-scale
code (FFFF Hex) is loaded to the DAC register. Ideally the output
should be VDD – 1 LSB. Full-scale error is expressed in percent of

full-scale range. A plot of full-scale error vs. temperature can be
seen in Figure 6.

Total Unadjusted Error

Total Unadjusted Error (TUE) is a measure of the output error

Preliminary Technical Data

taking the various offset and gain errors into account. A typical
TUE vs. code plot can be seen in Figure 4.

AD5678

change on the digital input pins, i.e., from all 0s to all 1s and vice
versa.

Digital-to-Analog Glitch Impulse

Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV secs and
is measured when the digital input code is changed by 1 LSB at the
major carry transition (7FFF Hex to 8000 Hex). See Figure 19.

DC Power Supply Rejection Ratio (PSRR)

This indicates how the output of the DAC is affected by changes in
the supply voltage. PSRR is the ratio of the change in VOUT
to a change in VDD for full-scale output of the DAC. It is
measured in dB. VREF is held at 2 V and VDD is varied ±10%.

DC Crosstalk

This is the dc change in the output level of one DAC in response to
a change in the output of another DAC. It is measured with a full-
scale output change on one DAC while monitoring another DAC.
It is expressed in µV.

Reference Feedthrough

This is the ratio of the amplitude of the signal at the DAC output to
the reference input when the DAC output is not being updated
(i.e., LDAC is high). It is expressed in dB.

Channel-to-Channel Isolation

This is the ratio of the amplitude of the signal at the output of one
DAC to a sine wave on the reference input of another DAC. It is
measured in dB.

Digital Feedthrough

Digital feedthrough is a measure of the impulse injected into the
analog output of a DAC from the digital input pins of the device,
but is measured when the DAC is not being written to (SYNC held
high). It is specified in nV-s and is measured with a fullscale

Digital Crosstalk

This is the glitch impulse transferred to the output of one DAC at
midscale in response to a full-scale code change (all 0s to all 1s and
vice versa) in the input register of another DAC. It is measured in
standalone mode and is expressed in nV-s.

Analog Crosstalk

This is the glitch impulse transferred to the output of one DAC due
to a change in the output of another DAC. It is measured by
loading one of the input registers with a full-scale code change (all
0s to all 1s and vice versa) while keeping LDAC high. Then pulse
LDAC low and monitor the output of the DAC whose digital code
was not changed. The area of the glitch is expressed in nV-s.

DAC-to-DAC Crosstalk

This is the glitch impulse transferred to the output of one DAC due
to a digital code change and subsequent output change of another
DAC. This includes both digital and analog crosstalk. It is
measured by loading one of the DACs with a full-scale code change
(all 0s to all 1s and vice versa) with LDAC low and monitoring the
output of another DAC. The energy of the glitch is expressed in
nV-s.

Multiplying Bandwidth

The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is a measure of this. A sine wave on the
reference (with full-scale code loaded to the DAC) appears on the
output. The multiplying bandwidth is the frequency at which the
output amplitude falls to 3 dB below the input.

Total Harmonic Distortion

This is the difference between an ideal sine wave and its attenuated
version using the DAC. The sine wave is used as the reference for
the DAC, and the THD is a measure of the harmonics present on
the DAC output. It is measured in dB.

Rev. PrB| Page 11 of 22

AD5678

AD5678–TYPICAL PERFORMANCE CHARACTERISTICS

Figure 4. Typical INL Plot

Preliminary Technical Data

Figure 7. INL Error and DNL Error vs. Temperature

Figure 5. Typical DNL Plot

Figure 6. Typical Total Unadjusted Error Plot

Rev.PrB | Page 12 of 22

Figure 8. Zero-Scale Error and Full-Scale Error vs. Temperature

Figure 9. I

Histogram with VDD=3V and VDD=5V

DD

Preliminary Technical Data

AD5678

Figure 10. Source and Sink Current Capability with V

Figure 11. Source and Sink Current Capability with V

DD

DD

=3V

=5 V

Figure 13. Supply Current vs. Temperature

Figure 14. Supply Current vs. Supply Voltage

Figure 12. Supply Current vs. Code

Rev. PrB| Page 13 of 22

Figure 15. Power-Down Current vs. Supply Voltage

AD5678

Figure 16. Supply Current vs. Logic Input Voltage

Preliminary Technical Data

Figure 19. Power-On Reset to 0V

Figure 20. Exiting Power-Down (800 Hex Loaded)

Figure 17. Full-Scale Settling Time

Figure 18. Half-Scale Settling Time

Figure 21. Digital-to-Analog Glitch Impulse

Rev.PrB | Page 14 of 22

Preliminary Technical Data

GENERAL DESCRIPTION

D/A Section

The AD5678 DACs are fabricated on a CMOS process. The
architecture consists of a string DAC followed by an output
buffer amplifier. The parts include an internal 1.25/2.5V,
10ppm/°C reference with an internal gain of two. Figure 22
shows a block diagram of the DAC architecture.

V

DD

REF (+)

DAC REGISTER

Figure 22. DAC Architecture

Since the input coding to the DAC is straight binary, the ideal
output voltage is given by:

OUT

OUT

where D = decimal equivalent of the binary code that is loaded
to the DAC register;
0 - 4095 for AD5678 -DAC C, D, E, F (12 bit)
0 - 65535 for AD5678 -DAC A, B, G, H (16 bit)

N = the DAC resolution

RESISTOR

STRING

REF ()

GND

⎛

extVrefV

)(

×=

⎜
⎝

VrefV

(int)2

×∗=

OUTPUT

AMPLIFIER

(Gain=2)

D

⎞
⎟

^2

N

⎠

D

⎛
⎜

⎝

⎞
⎟

^2

N

⎠

V

OUT

AD5678

Figure 23. Resistor String

Resistor String

The resistor string section is shown in Figure 23. It is simply a
string of resistors, each of value R. The code loaded to the DAC
register determines at which node on the string the voltage is
tapped off to be fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the string
to the amplifier. Because it is a string of resistors, it is
guaranteed monotonic.

Output Amplifier

The output buffer amplifier is capable of generating rail-to-rail
voltages on its output which gives an output range of 0 V to
V

DD

pF to GND. The source and sink capabilities of the output
amplifier can be seen in Figure 10 and Figure 11. The slew rate
is 1.5 V/µs with a half-scale settling time of 8 µs with the output
unloaded.

SERIAL INTERFACE

The AD5678 has a three-wire serial interface (
DIN), which is compatible with SPI, QSPI and MICROWIRE
interface standards as well as most DSPs. See Figure 2 for a
timing diagram of a typical write sequence.

The write sequence begins by bringing the
from the DIN line is clocked into the 32-bit shift register on the
falling edge of SCLK. The serial clock frequency can be as high
as 50 MHz, making the AD5678 compatible with high speed
DSPs. On the 32nd falling clock edge, the last data bit is clocked
in and the programmed function is executed (i.e., a change in

Rev. PrB| Page 15 of 22

. It is capable of driving a load of 2 kΩ in parallel with 1000

SYNC

, SCLK and

SYNC

line low. Data

AD5678

DAC register contents and/or a change in the mode of
operation). At this stage, the

SYNC

line may be kept low or be
brought high. In either case, it must be brought high for a
minimum of 33 ns before the next write sequence so that a
falling edge of

SYNC

the
does when V

SYNC

can initiate the next write sequence. Since

buffer draws more current when VIN = 2V than it

= 0.8 V,

IN

SYNC

should be idled low between
write sequences for even lower power operation of the part. As
is mentioned above, however, it must be brought high again just
before the next write sequence.

C3 C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D1 2 D11 D10 D9 D8 D 7 D6 D5 D4 D3 D2 D1 D 0 X X X XXXX X

Preliminary Technical Data

Input Shift Register

The input shift register is 32 bits wide (see Figure 24, 25). The
first four bits are “don’t cares.” The next four bits are the
Command bits C3-C0, (see Table 1) followed by the 4-bit DAC
address A3-A0, (see Table 2) and finally the 16 /12bit data word.
The data word comprises the 16- 12- bit input code followed by
4 or 8 don’t care bits, for the AD5678 (DAC A, B, G, H) and
AD5628 (DAC C, D, E, F) respectively. See figure 24 and 25.
These data bits are transferred to the DAC register on the 32nd
falling edge of SCLK.

DB0 (LSB)

COMMAND BITS

ADDRE SS BITS

Figure 24 AD5678. Input Register Content for DAC A, B, G , H

C3 C2 C1 C0 A3 A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X X XXXX X

COMMAND BITS

ADDRE SS BITS

Figure 25 AD5678. Input Register Content for DAC C, D, E, F

Command

C3 C2 C1 C0

0 0 0 0 Write to Input Register n

0 0 0 1 Update DAC Register n

0 0 1 0 Write to Input Register n,

Update All

DB0 (LSB)

0 0 1 1 Write to and Update DAC

channel n

0 1 0 0 Power Down DAC

(Power-up)

Rev.PrB | Page 16 of 22

Preliminary Technical Data

0 1 0 1 Load Clear Code Register

0 1 1 0 Load LDAC Register

(LDAC overwrite)

0 1 1 1 Reset (Power-on-Reset)

1 0 0 0 REF Setup Register

1 0 0 1 Reserved

* * * * Reserved

1 1 1 1 Reserved

Table 1. Command Definition

ADDRESS (n)

A3 A2 A1 A0

0 0 0 0 DAC A (16 bit)

AD5678

0 0 0 1 DAC B (16 bit)

0 0 1 0 DAC C (12 bit)

0 0 1 1 DAC D (12 bit)

0 1 0 0 DAC E (12 bit)

0 1 0 1 DAC F (12 bit)

0 1 1 0 DAC G (16 bit)

0 1 1 1 DAC H (16 bit)

1 1 1 1 All DACs

Table2. Address Command

SYNC

Interrupt

In a normal write sequence, the
rising edge of SYNC . However, if

SYNC

line is kept low for 32 falling edges of SCLK and the DAC is updated on the 32nd falling edge and

SYNC

is brought high before the 32nd falling edge this acts as an interrupt to the write sequence. The
shift register is reset and the write sequence is seen as invalid. Neither an update of the DAC register contents or a change in the operating
mode occurs—see Figure 25.

SCLK

SYN C

DIN

DB31

INVALID WRITE SEQUENCE:

SYN C HIGH BEFORE 32NDFALLING EDGE

DB0

DB31 DB0

VALID WRITE SEQUENCE, OUTPUT UPDATES

ON THE 32NDFALLING EDGE

Figure 25. SYNC Interrupt Facility

Rev. PrB| Page 17 of 22

AD5678

Reference Setup –External to Internal

The on-board reference is turned off at power-up by default, allowing the use of an external reference. The AD5678 has an on-chip
reference with an internal gain of two. The AD56x8-1 has a 1.25V 10ppm/°C max reference and the AD56x8-2, has a 2.5V 10ppm/°C
max reference. The on-board reference can be turned on/off through a software executable REF Setup function, Command 1000 is
reserved for this REF Setup function, see Table 3. The reference mode is software-programmable by setting a bit (DB0) in the REF
Setup register. Table 4 shows how the state of the bits corresponds to the mode of operation of the device.

Table 3. Reference Set-up Register

Preliminary Technical Data

REF Setup Register
(DB0)

0 Ref Off (Default)

1 Ref On

MSB LSB

DB31 –
DB28

x 1 0 0 0 x x x x x 1/0

Don’t
Cares

Table 4 32-Bit Input Shift Register Contents for Reference Setup Function

DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB1-

COMMAND BITS (C3-C0) ADDRESS BITS (A3 – A0) Don’t

Action

DB19

Cares

DB0

REF Setup
Register

Power-On-Reset

The AD5678 family contains a power-on-reset circuit that controls the output voltage during power-up. The AD5678 output powers up
to zero and the output remains there until a valid write sequence is made to the DAC. This is useful in applications where it is important
to know the state of the output of the DAC while it is in the process of powering up.
There is also a software executable Reset function that will reset the DAC to the Power-on -Reset code. Command 0111 is reserved for
this Reset function, see Table 1.

Power-Down Modes

The AD5678 contains four separate modes of operation. Command 0100 is reserved for the Power-Down function. See Table 1. These
modes are software-programmable by setting two bits (DB9 and DB8) in the control register. Table 5 shows how the state of the bits
corresponds to the mode of operation of the device. Any or all DACs, (DacH to DacA) may be powered down to the selected mode by
setting the corresponding 8 bits (DB7 to DB0) to a “1”. See Table 6 for contents of the Input Shift Register during power down/up
operation.

When both bits are set to 0, the part works normally with its normal power consumption of 250 µA at 5 V. However, for the three power­down modes, the supply current falls to 200 nA at 5 V (50 nA at 3 V). Not only does the supply current fall but the output stage is also
internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output
impedance of the part is known while the part is in power-down mode. There are three different options. The output is connected

Rev.PrB | Page 18 of 22

Preliminary Technical Data

AD5678

internally to GND through a 1 kΩ resistor, a 100 kΩ resistor or it is left open-circuited (Three-State). The output stage is illustrated in
figure 24.

The bias generator of selected DAC(s), the output amplifier, the resistor string and other associated linear circuitry are all shut down
when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit
power-down is typically (2.5 µs for V

= 5 V and 5 µs for VDD = 3 V). See Figure 20 for a plot.

DD

Any combination of DACs can be powered up by setting PD1 and PD0 to “0” (normal operation). Output powers-up to value in input
register (/LDAC Low) or to value in DAC register before Power-Down (/LDAC High).

DB9 DB8 Operating Mode

0 0 Normal Operation
Power Down Modes
0 1 1 kΩ to GND
1 0 100 kΩ to GND
1 1 Three State

Table 5. Modes of Operation for the AD5678

MSB LSB

DB31
–
DB28

x 0 1 0 0 x x x x x PD1 PD0 DacH DacG DacF DacE DacD DacC DacB DacA

Don’t
Cares

DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB10—

COMMAND BITS (C2-C0) ADDRESS BITS (A3 – A0)

Don’t cares

DB19

Don’t
Cares

DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

Power
Down Mode

Power Down/Up Channel Selection – Set Bit to a “1” to select

Table 6. 32-Bit Input Shift Register Contents for Power Down/Up Function

Clear Code Register

The AD5678 gives the option of clearing all DAC channels to 0, midscale or fullscale code. Command 0101 is reserved for the Clear
Code function. See Table1. These clear code values are software-programmable by setting two bits (DB1 and DB0) in the control
register. Table shows how the state of the bits corresponds to the clear code values of the device. Upon execution of the hardware /CLR
pin (active LOW), the DAC output is cleared to the clear code register value (default setting is zero). See Table 8 for contents of the
Input Shift Register during the Clear Code Register operation

Clear Code Register

CR1 CR0 Clears to code

Rev. PrB| Page 19 of 22

AD5678

0 0 0000h

0 1 8000h

1 0 FFFFh

1 1 No operation

Table 7. Clear Code Register

MSB LSB

Preliminary Technical Data

DB31 –
DB28

X 0 1 0 1 1/0 1/0 1/0 1/0 x 1/0 1/0

Don’t
Cares

Table 8. 32-Bit Input Shift Register Contents Clear Code Function

LDAC Function

The outputs of all DACs may be updated simultaneously using the hardware /LDAC pin.
Synchronous LDAC: The DAC registers are updated after new data is read in on the falling edge of the 32nd SCLK pulse. LDAC can be
permanently low or pulsed as in Figure 1.
Asynchronous LDAC: The outputs are not updated at the same time that the input registers are written to. When LDAC goes low, the
DAC registers are updated with the contents of the input register.

The outputs of all DACs may be updated simultaneously using the /LDAC function, with the added functionality of selecting through
software any number of DAC channels to synchronize.
Writing to the DAC using command 110, the hardware /LDAC pin can be overwritten by setting the bits of the 8-bit /LDAC register
(DB7-DB0) . SeeTable 9 for the /LDAC mode of operation. The default for each channel is “0” ie /LDAC pin works normally. Setting the
bits to a “1” means the DAC channel will be updated regardless of the state of the /LDAC pin. This gives the added benefit of allowing
any combination of channels to be synchronously updated. See Table 10 for contents of the Input Shift Register during the /LDAC
overwrite mode of operation.

DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB2-

DB19

COMMAND BITS (C2-C0) ADDRESS BITS (A3 – A0)

Don’t
Cares

DB1 DB0

Clear Code
Register (CR1­CR0)

Load DAC OVERWRITE

/LDACBITS (DB7­DB0)

0 1/0

1 x – Don’t Care

Table 9. LDAC Overwrite Definition

/LDAC PIN /LDAC Operation

Determined by
/LDAC pin

DAC channels will
update, overwriting
the /LDAC pin

Rev.PrB | Page 20 of 22

Preliminary Technical Data

MSB LSB

AD5678

DB3

DB2
1 –
DB2
8

x 0 1 1 0 x x x x x DacH DacG DacF DacE DacD DacC DacB DacA

Don’t
Cares

DB26 DB25 DB24 DB23 DB22 DB21 DB2

7

COMMAND BITS (C2-C0) ADDRESS BITS (A3 – A0)

Don’t cares

DB8

DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

–

0

DB1
9

Don’t

Setting /LDAC bit to “1” overwrites /LDAC pin

Cares

Table 10. 32-Bit Input Shift Register Contents for /LDAC Overwrite Function

Power Supply Bypassing and Grounding

Inductance (ESI), e.g., common ceramic types of capacitors.

This 0.1 µF capacitor provides a low impedance path to ground
When accuracy is important in a circuit it is helpful to carefully
consider the power supply and ground return layout on the

for high frequencies caused by transient currents due to internal

logic switching.
board. The printed circuit board containing the AD5678 should
have separate analog and digital sections, each having its own
area of the board. If the AD5678 is in a system where other
devices require an AGND to DGND connection, the
connection should be made at one point only. This ground
point should be as close as possible to the AD5678.

The power supply line itself should have as large a trace as

possible to provide a low impedance path and reduce glitch

effects on the supply line. Clocks and other fast switching

digital signals should be shielded from other parts of the board

by digital ground. Avoid crossover of digital and analog signals

if possible. When traces cross on opposite sides of the board,
The power supply to the AD5678 should be bypassed with 10
µF and 0.1 µF capacitors. The capacitors should be physically as
close as possible to the device with the 0.1 µF capacitor ideally
right up against the device. The 10 µF capacitors are the
tantalum bead type. It is important that the 0.1 µF capacitor has
low Effective Series Resistance (ESR) and Effective Series

ensure that they run at right angles to each other to reduce

feedthrough effects through the board. The best board layout

technique is the microstrip technique where the component

side of the board is dedicated to the ground plane only and the

signal traces are placed on the solder side. However, this is not

always possible with a two-layer board.

Rev. PrB| Page 21 of 22

AD5678

© 2005

PR05299-0-2/05(PrB)

OUTLINE DIMENSIONS

Preliminary Technical Data

0.201 (5.10)

0.193 (4.90)

0.177 (4.50)

0.006 (0.15)

0.002 (0.05)

SEATING

PLANE

14

0.169 (4.30)

1

PIN 1

0.0256
(0.65)

BSC

8

7

0.0118 (0.30)

0.0075 (0.19)

0.256 (6.50)

0.246 (6.25)

0.0433
(1.10)
MAX

0.0079 (0.20)

0.0035 (0.090)

8°
0°

0.028 (0.70)

0.020 (0.50)

Figure 26. 14-Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimensions shown in millimeters

0.201 (5.10)

0.193 (4.90)

16 9

0.177 (4.50)

0.006 (0.15)

0.002 (0.05)

SEATING

PLANE

0.169 (4.30)

1

PIN
1

0.0256
(0.65)

BSC

0.0118 (0.30)

0.0075 (0.19)

8

0.256 (6.50)

0.246 (6.25)

0.0433
(1.10)
MAX

0.0079 (0.20)

0.0035 (0.090)

8°
0°

0.028 (0.70)

0.020 (0.50)

Figure 27. 16-Thin Shrink Small Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

ORDERING GUIDE

1 Thin Shrink Small Outline Package (TSSOP)

© 2003 Analog Devices, Inc. All rights reserved. Trademarks and registered

trademarks are the property of their respective companies.
Printed in the U.S.A.

Model INL (LSB) Power-On-Reset Internal Reference Package

Option1

AD5678ARUZ-2 ±32 Zero 2.5V RU-16

Rev.PrB | Page 22 of 22