Four 12-bit DACs
14-lead/16-lead TSSOP
On-chip 1.25 V/2.5 V, 5 ppm/°C reference
Power down to 400 nA @ 5 V, 200 nA @ 3 V
2.7 V to 5.5 V power supply
Guaranteed monotonic by design
Power-on reset to zero scale
3 power-down functions
Hardware
function to programmable code
CLR
LDAC
and
Rail-to-rail operation
APPLICATIONS
Process control
Data acquisition systems
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage current sources
Programmable attenuators
GENERAL DESCRIPTION
override function
LDAC
On-Chip Reference in 14-Lead TSSOP
AD5678
FUNCTIONAL BLOCK DIAGRAM
AD5678
SCLK
SYNC
DIN
1
RU-16 PACKAGE ONLY
LDAC
INTERFACE
LOGIC
1
LDAC
CLR
V
DD
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-ON
RESET
1
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
Figure 1.
REFIN
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
STRING
DAC E
STRING
DAC F
STRING
DAC G
STRING
DAC H
REFOUT
1.25V/2.5V
REF
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
POWER-DOWN
LOGIC
GND
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
A
B
C
D
E
F
G
H
05299-001
The AD5678 is a low power, octal, buffered voltage-output
DAC with four 12-bit DACs and four 16-bit DACs in a single
package. All devices operate from a single 2.7 V to 5.5 V supply
and are guaranteed monotonic by design.
The AD5678 has an on-chip reference with an internal gain of 2.
The AD5678-1 has a 1.25 V 5 ppm/°C reference, giving a fullscale output of 2.5 V; the AD5678-2 has a 2.5 V 5 ppm/°C
reference, giving a full-scale output of 5 V. The on-board
reference is off at power-up, allowing the use of an external
reference. The internal reference is enabled via a software write.
The part incorporates a power-on reset circuit that ensures that
the DAC output powers up to 0 V and remains powered up at
this level until a valid write takes place. The part contains a
power-down feature that reduces the current consumption of
the device to 400 nA at 5 V and provides software-selectable
output loads while in power-down mode for any or all DAC
channels.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The outputs of all DACs can be updated simultaneously using
the
function, with the added functionality of user-
LDAC
selectable DAC channels to simultaneously update. There is
also an asynchronous
that clears all DACs to a software-
CLR
selectable code—0 V, midscale, or full scale.
The AD5678 utilizes a versatile 3-wire serial interface that
operates at clock rates of up to 50 MHz and is compatible with
standard SPI®, QSPI™, MICROWIRE™, and DSP interface
standards. The on-chip precision output amplifier enables railto-rail output swing.
PRODUCT HIGHLIGHTS
1. Octal DAC (four 12-bit DACs and four 16-bit DACs).
2. On-chip 1.25 V/2.5 V, 5 ppm/°C reference.
3. Available in 14-lead/16-lead TSSOP.
4. Power-on reset to 0 V.
5. Power-down capability. When powered down, the DAC
typically consumes 200 nA at 3 V and 400 nA at 5 V.
Differential Nonlinearity ±1 ±1 LSB Guaranteed monotonic by design (see Figure 6)
Zero-Code Error 6 19 6 19 mV All 0s loaded to DAC register (see Figure 17)
Zero-Code Error Drift ±2 ±2 µV/°C
Full-Scale Error −0.2 −1 −0.2 −1 % FSR All 1s loaded to DAC register (see Figure 18)
Gain Error ±1 ±1 % FSR
Gain Temperature
±2.5 ±2.5 ppm Of FSR/°C
Coefficient
Offset Error ±6 ±19 ±6 ±19 mV
DC Power Supply Rejection
–80 –80 dB V
Ratio
DC Crosstalk
10 10 µV
(External Reference)
5 5 µV/mA Due to load current change
10 10 µV Due to powering down (per channel)
DC Crosstalk
25 25 µV
(Internal Reference)
10 10 µV/mA Due to load current change
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 VDD 0 VDD V
Capacitive Load Stability 2 2 nF RL = ∞
10 10 nF RL = 2 kΩ
DC Output Impedance 0.5 0.5 Ω
Short-Circuit Current 30 30 mA VDD = 5 V
Power-Up Time 4 4 µs Coming out of power-down mode; VDD = 5 V
REFERENCE INPUTS
Reference Input Voltage VDD VDD V ±1% for specified performance
Reference Current 35 55 35 55 µA V
Reference Input Range 0 VDD 0 VDD V
Reference Input Impedance 14.6 14.6 kΩ Per DAC channel
Input Current ±3 ±3 µA All digital inputs
Input Low Voltage, V
Input High Voltage, V
0.8 0.8 V VDD = 5 V
INL
2 2 V VDD = 5 V
INH
Pin Capacitance 3 3 pF
= VDD. All specifications T
REFIN
MIN
to T
, unless otherwise noted.
MAX
Guaranteed monotonic by design
(see Figure 12)
± 10%
DD
Due to full-scale output change,
= 2 kΩ to GND or VDD
R
L
Due to full-scale output change,
R
= 2 kΩ to GND or VDD
L
= VDD = 5.5 V (per DAC channel)
REF
Rev. C | Page 3 of 28
AD5678
A Grade1 B Grade1
Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
POWER REQUIREMENTS
VDD 4.5 5.5 4.5 5.5 V
All digital inputs at 0 or V
DAC active, excludes load current
IDD (Normal Mode)4 V
= VDD and VIL = GND
IH
VDD = 4.5 V to 5.5 V 1.3 1.8 1.3 1.8 mA Internal reference off
VDD = 4.5 V to 5.5 V 2 2.6 2 2.6 mA Internal reference on
IDD (All Power-Down Modes)5
VDD = 4.5 V to 5.5 V 0.4 1 0.4 1 µA VIH = VDD and VIL = GND
1
Temperature range is −40°C to +105°C, typical at 25°C.
2
Linearity calculated using a reduced code range of AD5678 12-bit DACs (Code 32 to Code 4,064) and AD5678 16-bit DACs (Code 512 to Code 65,024). Output
unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All eight DACs powered down.
,
DD
Rev. C | Page 4 of 28
AD5678
VDD = 2.7 V to 3.6 V, RL = 2 kΩ to GND, CL = 200 pF to GND, V
Table 2.
A Grade1 B Grade1
Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
STATIC PERFORMANCE
2
AD5678 (DAC C, D, E, F)
Resolution 12 12 Bits
Relative Accuracy ±0.5 ±2 ±0.5 ±1 LSB See Figure 11
Differential Nonlinearity ±1 ±1 LSB
AD5678 (DAC A, B, G, H)
Resolution 16 16 Bits
Relative Accuracy ±32 ±16 LSB See Figure 5
Differential Nonlinearity ±1 ±1 LSB Guaranteed monotonic by design (See Figure 6)
Zero-Code Error 6 19 6 19 mV All 0s loaded to DAC register (See Figure 17)
Zero-Code Error Drift ±2 ±2 µV/°C
Full-Scale Error −0.2 −1 −0.2 −1 % FSR All 1s loaded to DAC register (See Figure 18)
Gain Error ±1 ±1 % FSR
Gain Temperature Coefficient ±2.5 ±2.5 ppm Of FSR/°C
Offset Error ±6 ±19 ±6 ±19 mV
Offset Temperature Coefficient 1.7 1.7 µV/°C
DC Power Supply Rejection
–80 –80 dB V
Ratio
DC Crosstalk
10 10 µV
(External Reference)
4.5 4.5 µV/mA Due to load current change
10 10 µV Due to powering down (per channel)
DC Crosstalk
25 25 µV
(Internal Reference)
4.5 4.5 µV/mA Due to load current change
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 VDD 0 VDD V
Capacitive Load Stability 2 2 nF RL = ∞
10 10 nF RL = 2 kΩ
DC Output Impedance 0.5 0.5 Ω
Short-Circuit Current 30 30 mA VDD = 3 V
Power-Up Time 4 4 µs Coming out of power-down mode; VDD = 3 V
REFERENCE INPUTS
Reference Input Voltage VDD V
Reference Current 20 55 20 55 µA V
Reference Input Range 0 VDD 0 VDD V
Reference Input Impedance 14.6 14.6 kΩ Per DAC channel
A Grade1 B Grade1
Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
LOGIC INPUTS3
Input Current ±3 ±3 µA All digital inputs
Input Low Voltage, V
Input High Voltage, V
Pin Capacitance 3 3 pF
POWER REQUIREMENTS
VDD 2.7 3.6 2.7 3.6 V
IDD (Normal Mode)4 V
VDD = 2.7 V to 3.6 V 1.2 1.7 1.2 1.7 mA Internal reference off
VDD = 2.7 V to 3.6 V 1.7 2.6 1.7 2.6 mA Internal reference on
IDD (All Power-Down Modes)5
VDD = 2.7 V to 3.6 V 0.2 1 0.2 1 µA VIH = VDD and VIL = GND
1
Temperature range is −40°C to +105°C, typical at 25°C.
2
Linearity calculated using a reduced code range of AD5678 12-bit DACs (Code 32 to Code 4,064) and AD5678 16-bit DACs (Code 512 to Code 65,024). Output
unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All eight DACs powered down.
0.8 0.8 V VDD = 3 V
INL
2 2 V VDD = 3 V
INH
All digital inputs at 0 or V
DAC active, excludes load current
= VDD and VIL = GND
IH
,
DD
Rev. C | Page 6 of 28
AD5678
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, V
Table 3.
Parameter
1, 2
Min Typ Max Unit Conditions/Comments3
Output Voltage Settling Time 6 10 µs ¼ to ¾ scale settling to ±2 LSB
Slew Rate 1.5 V/µs
Digital-to-Analog Glitch Impulse 4 nV-s 1 LSB change around major carry (see Figure 34)
Digital Feedthrough 0.1 nV-s
Reference Feedthrough −90 dB V
Digital Crosstalk 0.5 nV-s
Analog Crosstalk 2.5 nV-s
DAC-to-DAC Crosstalk 3 nV-s
Multiplying Bandwidth 340 kHz V
Total Harmonic Distortion −80 dB V
Output Noise Spectral Density 120 nV/√Hz DAC code = 0x8400, 1 kHz
100 nV/√Hz DAC code = 0x8400, 10 kHz
Output Noise 15 V p-p 0.1 Hz to 10 Hz
1
Guaranteed by design and characterization; not production tested.
2
See the Terminology section.
3
Temperature range is −40°C to +105°C, typical at 25°C.
= VDD. All specifications T
REFIN
= 2 V ± 0.1 V p-p, frequency = 10 Hz to 20 MHz
REF
= 2 V ± 0.2 V p-p
REF
= 2 V ± 0.1 V p-p, frequency = 10 kHz
REF
MIN
to T
, unless otherwise noted.
MAX
Rev. C | Page 7 of 28
AD5678
TIMING CHARACTERISTICS
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 2.
V
= 2.7 V to 5.5 V. All specifications T
DD
Table 4.
Limit at T
MIN
, T
Parameter VDD = 2.7 V to 5.5 V Unit Conditions/Comments
t1 1 20 ns min SCLK cycle time
t2 8 ns min SCLK high time
t3 8 ns min SCLK low time
t4 13 ns min
t5 4 ns min Data set-up time
t6 4 ns min Data hold time
t7 0 ns min
t8 15 ns min
t9 13 ns min
t10 0 ns min
t11 10 ns min
t12 15 ns min
t13 5 ns min
t14 0 ns min
t15 300 ns typ
1
Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V. Guaranteed by design and characterization; not production tested.
t
SCLK
t
8
SYNC
DIN
1
LDAC
to T
MIN
MAX
, unless otherwise noted.
MAX
to SCLK falling edge set-up time
SYNC
SCLK falling edge to SYNC
Minimum SYNC
rising edge to SCLK fall ignore
SYNC
SCLK falling edge to SYNC
pulse width low
LDAC
SCLK falling edge to LDAC
pulse width low
CLR
SCLK falling edge to LDAC
pulse activation time
CLR
10
t
4
t
6
t
5
DB31
t
1
t
t
3
2
DB0
t
9
t
7
t
11
t
14
rising edge
high time
fall ignore
rising edge
falling edge
2
LDAC
t
CLR
V
OUT
1
ASYNCHRONOUS LDAC UPDAT E MODE.
2
SYNCHRONOUS LDAC UPDAT E MODE.
13
t
12
t
15
05299-002
Figure 2. Serial Write Operation
Rev. C | Page 8 of 28
AD5678
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to VDD + 0.3 V
V
REFIN/VREFOUT
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ
TSSOP Package
Power Dissipation (TJ
θJA Thermal Impedance 150.4°C/W
Lead Temperature, Soldering
SnPb 240°C
Pb Free 260°C
to GND −0.3 V to VDD + 0.3 V
) 150°C
MAX
− TA)/θJA
MAX
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 9 of 28
AD5678
V
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
SYNC
2
V
DD
3
V
A
OUT
V
OUT
V
OUT
V
OUT
REFIN/VREFOUT
C
E
G
AD5678
4
TOP VIEW
(Not to Scale)
5
6
7
Figure 3. 14-Lead TSSOP (RU-14)
Table 6. Pin Function Descriptions
Pin No.
14-Lead
TSSOP
N/A
1 2
2 3 V
3 4 V
11 13 V
4 5 V
10 12 V
7 8 V
N/A 9
5 6 V
9 11 V
6 7 V
8 10 V
16-Lead
TSSOP Mnemonic
1
LDAC
Active Low Control Input. This is the frame synchronization signal for the input data. When
SYNC
DD
A Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
B Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
C Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
D Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
REFIN/VREFOUT
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC
CLR
OUT
OUT
OUT
OUT
E Analog Output Voltage from DAC E. The output amplifier has rail-to-rail operation.
F Analog Output Voltage from DAC F. The output amplifier has rail-to-rail operation.
G Analog Output Voltage from DAC G. The output amplifier has rail-to-rail operation.
H Analog Output Voltage from DAC H. The output amplifier has rail-to-rail operation.
12 14 GND
13 15 DIN
14 16 SCLK
1
LDAC
14
SCLK
13
DIN
12
GND
11
V
B
OUT
10
D
V
OUT
9
F
V
OUT
8
H
V
OUT
05299-003
V
REFIN/VREFOUT
SYNC
V
OUT
V
OUT
V
OUT
V
OUT
V
DD
A
C
E
G
2
3
AD5678
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
SCLK
15
DIN
14
GND
13
V
B
OUT
12
V
D
OUT
11
V
F
OUT
10
H
V
OUT
9
CLR
05299-004
Figure 4. 16-Lead TSSOP (RU-16)
Description
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have
new data. This allows all DAC outputs to simultaneously update. Alternatively, this pin can be
tied permanently low.
SYNC goes low, it powers on the SCLK and DIN buffers and enables the input shift register.
Data is transferred in on the falling edges of the next 32 clocks. If SYNC is taken high before
the 32nd falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is
ignored by the device.
Power Supply Input. These parts can be operated from 2.7 V to 5.5 V, and the supply should
be decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
The AD5678 has a common pin for reference input and reference output. When using the
internal reference, this is the reference output pin. When using an external reference, this is
the reference input pin. The default for this pin is as a reference input.
pulses are ignored. When CLR
is activated, the input register and the DAC register are
updated with the data contained in the CLR code register—zero, midscale, or full scale.
Default setting clears the output to 0 V.
Ground Reference Point for All Circuitry on the Part.
Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on
the falling edge of the serial clock input.
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz.
For the DAC, relative accuracy, or integral nonlinearity (INL), is
a measure of the maximum deviation in LSBs from a straight
line passing through the endpoints of the DAC transfer
function. Figure 5, Figure 7, and Figure 9 show plots of typical
INL vs. code.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale
code (0xFFFF) is loaded into the DAC register. Ideally, the
output should be V
− 1 LSB. Full-scale error is expressed as a
DD
percentage of the full-scale range. Figure 17 shows a plot of
typical full-scale error vs. temperature.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed monotonic by design. Figure 6, Figure 8, and Figure 10 show plots of
typical DNL vs. code.
Offset Error
Offset error is a measure of the difference between the actual
V
and the ideal V
OUT
, expressed in millivolts in the linear
OUT
region of the transfer function. Offset error is measured on the
AD5678 with Code 512 loaded into the DAC register. It can be
negative or positive and is expressed in millivolts.
Zero-Code Error
Zero-code error is a measure of the output error when zero
code (0x0000) is loaded into the DAC register. Ideally, the
output should be 0 V. The zero-code error is always positive in
the AD5678, because the output of the DAC cannot go below 0 V.
It is due to a combination of the offset errors in the DAC and
output amplifier. Zero-code error is expressed in millivolts.
Figure 18 shows a plot of typical zero-code error vs.
temperature.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal, expressed as a percentage of the full-scale range.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code
error with a change in temperature. It is expressed in V/°C.
Gain Error Drift
Gain error drift is a measure of the change in gain error with
changes in temperature. It is expressed in (ppm of full-scale
range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-s
and is measured when the digital input code is changed by
1 LSB at the major carry transition (0x7FFF to 0x8000). See
Figure 34.
DC Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affected by changes
in the supply voltage. PSRR is the ratio of the change in V
a change in V
in decibels. V
for full-scale output of the DAC. It is measured
DD
is held at 2 V, and VDD is varied ±10%.
REF
OUT
to
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is measured
with a full-scale output change on one DAC (or soft power-down
and power-up) while monitoring another DAC. It is expressed
in microvolts.
DC crosstalk due to load current change is a measure of the
impact that a change in load current on one DAC has to another
DAC kept at midscale. It is expressed in microvolts per milliamp.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal
at the DAC output to the reference input when the DAC output
is not being updated (that is,
is high). It is expressed in
LDAC
decibels.
Channel-to-Channel Isolation
Channel-to-channel isolation is the ratio of the amplitude of the
signal at the output of one DAC to a sine wave on the reference
input of another DAC. It is measured in decibels.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of a DAC from the digital input pins of the
device, but is measured when the DAC is not being written to
(
held high). It is specified in nV-s and measured with a
SYNC
full-scale change on the digital input pins, that is, from all 0s to
all 1s or vice versa.
Rev. C | Page 18 of 28
AD5678
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output
of one DAC at midscale in response to a full-scale code change
(all 0s to all 1s or vice versa) in the input register of another
DAC. It is measured in standalone mode and is expressed in
nV-s.
Multiplying Bandwidth
The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is a measure of this. A sine wave on the
reference (with full-scale code loaded to the DAC) appears on
the output. The multiplying bandwidth is the frequency at
which the output amplitude falls to 3 dB below the input.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC due to a change in the output of another DAC. It is
measured by loading one of the input registers with a full-scale
code change (all 0s to all 1s or vice versa) while keeping
high, and then pulsing
the DAC whose digital code has not changed. The area of the
glitch is expressed in nV-s.
DAC-to-DAC C rosst a l k
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
output change of another DAC. This includes both digital and
analog crosstalk. It is measured by loading one of the DACs
with a full-scale code change (all 0s to all 1s or vice versa) with
low and monitoring the output of another DAC. The
LDAC
energy of the glitch is expressed in nV-s.
low and monitoring the output of
LDAC
LDAC
Total Harmonic Distortion (THD)
Total harmonic distortion is the difference between an ideal
sine wave and its attenuated version using the DAC. The sine
wave is used as the reference for the DAC, and the THD is a
measure of the harmonics present on the DAC output. It is
measured in decibels.
Rev. C | Page 19 of 28
AD5678
V
THEORY OF OPERATION
D/A SECTION
The AD5678 DAC is fabricated on a CMOS process. The architecture consists of a string of DACs followed by an output buffer
amplifier. The parts include an internal 1.25 V/2.5 V, 5 ppm/°C
reference with an internal gain of 2. Figure 45 shows a block
diagram of the DAC architecture.
DD
REF (+)
DAC REGISTER
RESISTOR
STRING
REF (–)
GND
Figure 45. DAC Architecture
OUTPUT
AMPLIFIER
(GAI N = +2)
V
OUT
Because the input coding to the DAC is straight binary, the ideal
output voltage when using an external reference is given by
OUT
VV
REFIN
⎟
⎜
N
2
⎠
⎝
D
⎞
⎛
×=
the ideal output voltage when using an internal reference is
given by
D
⎞
⎛
VV
2
××=
⎟
REFOUTOUT
⎜
N
2
⎠
⎝
where:
D = decimal equivalent of the binary code that is loaded to the
DAC register.
0 to 4,095 for AD5678 DAC C, D, E, F (12 bits).
0 to 65,535 for AD5678 DAC A, B, G, H (16 bits).
N = the DAC resolution.
RESISTOR STRING
The resistor string section is shown in Figure 46. It is simply a
string of resistors, each of value R. The code loaded into the
DAC register determines at which node on the string the
voltage is tapped off to be fed into the output amplifier. The
voltage is tapped off by closing one of the switches connecting
the string to the amplifier. Because it is a string of resistors, it is
guaranteed monotonic.
05299-005
INTERNAL REFERENCE
The AD5678 has an on-chip reference with an internal gain of
2. The AD5678-1 has a 1.25 V 5 ppm/°C reference, giving a fullscale output of 2.5 V. The AD5678-2 has a 2.5 V 5 ppm/°C
reference, giving a full-scale output of 5 V. The on-board
reference is off at power-up, allowing the use of an external
reference. The internal reference is enabled via a write to a
control register. See Tabl e 7 .
The internal reference associated with each part is available at
the V
REFOUT
used to drive external loads. When using the internal reference,
it is recommended that a 100 nF capacitor be placed between
the reference output and GND for reference stability.
Individual channel power-down is not supported while using
the internal reference.
R
R
R
R
R
Figure 46. Resistor String
TO OUTP UT
AMPLIFIER
05299-006
pin. A buffer is required if the reference output is
Rev. C | Page 20 of 28
AD5678
OUTPUT AMPLIFIER
The output buffer amplifier can generate rail-to-rail voltages on
its output, which gives an output range of 0 V to V
DD
. The
amplifier is capable of driving a load of 2 kΩ in parallel with
1,000 pF to GND. The source and sink capabilities of the output
amplifier can be seen in Figure 24 and Figure 25. The slew rate
is 1.5 V/µs with a ¼ to ¾ scale settling time of 10 µs.
SERIAL INTERFACE
The AD5678 has a 3-wire serial interface (
DIN) that is compatible with SPI, QSPI, and MICROWIRE
interface standards as well as most DSPs. See for a
timing diagram of a typical write sequence.
The write sequence begins by bringing the
from the DIN line is clocked into the 32-bit shift register on the
falling edge of SCLK. The serial clock frequency can be as high
as 50 MHz, making the AD5678 compatible with high speed
nd
DSPs. On the 32
falling clock edge, the last data bit is clocked
in and the programmed function is executed, that is, a change
in DAC register contents and/or a change in the mode of
operation. At this stage, the
line can be kept low or be
SYNC
brought high. In either case, it must be brought high for a
minimum of 15 ns before the next write sequence so that a
falling edge of
Because the
SYNC
than it does when V
can initiate the next write sequence.
SYNC
buffer draws more current when VIN = 2 V
= 0.8 V,
IN
should be idled low
SYNC
between write sequences for even lower power operation of the
part. As is mentioned previously, however,
brought high again just before the next write sequence.
SYNC
Figure 2
SYNC
SYNC
, SCLK, and
line low. Data
must be
Table 7. Command Definitions
Command
C3 C2 C1 C0 Description
0 0 0 0 Write to Input Register n
0 0 0 1 Update DAC Register n
0 0 1 0
0 0 1 1 Write to and update DAC Channel n
0 1 0 0 Power down/power up DAC
0 1 0 1 Load clear code register
0 1 1 0
Write to Input Register n, update all
(software LDAC
Load LDAC
)
register
Table 8. Address Commands
Address (n)
A3 A2 A1 A0
0 0 0 0 DAC A (16 bits)
0 0 0 1 DAC B (16 bits)
0 0 1 0 DAC C (12 bits)
0 0 1 1 DAC D (12 bits)
0 1 0 0 DAC E (12 bits)
0 1 0 1 DAC F (12 bits)
0 1 1 0 DAC G (16 bits)
0 1 1 1 DAC H (16 bits)
1 1 1 1 All DACs
Selected DAC
Channel
Rev. C | Page 21 of 28
AD5678
INTERRUPT
INPUT SHIFT REGISTER
The input shift register is 32 bits wide. The first four bits are
don’t cares. The next four bits are the command bits, C3 to C0
(see Table 7), followed by the 4-bit DAC address bits, A3 to A0
(see Table 8), and finally the 16-/12-bit data-word. The dataword comprises the 16-/12-bit input code followed by four or
eight don’t care bits for the AD5678 DAC A, B, G, H and
AD5678 DAC C, D, E, F, respectively (See Figure 47 and
Figure 48). These data bits are transferred to the DAC register
on the 32
32 falling edges of SCLK, and the DAC is updated on the 32
falling edge and rising edge of
brought high before the 32
nd
falling edge, this acts as an
interrupt to the write sequence. The shift register is reset, and
the write sequence is seen as invalid. Neither an update of the
DAC register contents nor a change in the operating mode
occurs—see Figure 49.
DATA BITS
line is kept low for
SYNC
. However, if
SYNC
SYNC
nd
is
ADDRESS BITSCOMMAND BITS
Figure 47. AD5678 Input Register Content for DAC A, B, G , H
Figure 48. AD5678 Input Register Content for DAC C, D, E, F
SCLK
SYNC
DIN
DB31DB0
INVALID WRITE SEQUENCE:
SYNC HIGH BEFORE 32ND FALLING EDGE
Figure 49.
SYNC
Interrupt Facility
DB31DB0
VALID WRITE SEQUENCE , OUTPUT UPDATES
ON THE 32ND FALLING EDGE
05299-007
05299-008
05299-009
Rev. C | Page 22 of 28
AD5678
INTERNAL REFERENCE REGISTER
The on-board reference is off at power-up by default. This
allows the use of an external reference if the application requires
it. The on-board reference can be turned on/off by a userprogrammable internal REF register by setting Bit DB0 high or
low (see Tabl e 9). Command 1000 is reserved for this internal
REF set-up command (see Tabl e 7). Tab l e 1 1 shows the state of
the bits in the input shift register corresponds to the mode of
operation of the device.
POWER-ON RESET
The AD5678 contains a power-on reset circuit that controls the
output voltage during power-up. The AD5678 output powers up
to 0 V, and the output remains powered up at this level until a
valid write sequence is made to the DAC. This is useful in
applications where it is important to know the state of the
output of the DAC while it is in the process of powering up.
There is also a software executable reset function that resets the
DAC to the power-on reset code. Command 0111 is reserved
for this reset function—see Tabl e 7. Any events on
during power-on reset are ignored.
CLR
LDAC
or
POWER-DOWN MODES
The AD5678 contains four separate modes of operation.
Command 0100 is reserved for the power-down function. See
Tabl e 7 . These modes are software-programmable by setting
two bits, Bit DB9 and Bit DB8, in the control register.
Tabl e 1 1 shows how the state of the bits corresponds to the
mode of operation of the device. Any or all DACs (DAC H to
DAC A) can be powered down to the selected mode by setting
the corresponding eight bits (DB7 to DB0) to 1. See Tab l e 1 2 for
the contents of the input shift register during power-down/powerup operation. When using the internal reference, only all channel
power-down to the selected modes is supported.
When both bits are set to 0, the part works normally with its
normal power consumption of 1.3 mA at 5 V. However, for the
three power-down modes, the supply current falls to 400 nA at
5 V (200 nA at 3 V). Not only does the supply current fall, but
the output stage is also internally switched from the output of
the amplifier to a resistor network of known values. This has the
advantage that the output impedance of the part is known while
the part is in power-down mode. There are three different
options. The output is connected internally to GND through
either a 1 kΩ or a 100 kΩ resistor, or it is left open-circuited
(three-state). The output stage is illustrated in Figure 50.
The bias generator of the selected DAC(s), output amplifier,
resistor string, and other associated linear circuitry are shut
down when the power-down mode is activated. However, the
contents of the DAC register are unaffected when in powerdown. The time to exit power-down is typically 5 µs for
= 5 V and for VDD = 3 V, see Figure 33.
V
DD
Any combination of DACs can be powered up by setting PD1
and PD0 to 0 (normal operation). The output powers up to the
value in the input register (
DAC register before powering down (
low) or to the value in the
LDAC
high).
LDAC
CLEAR CODE REGISTER
The AD5678 has a hardware
clear input. The
the
DAC registers to the data contained in the user-configurable
CLR
function can be used in system calibration to load zero scale,
midscale, or full scale to all channels together. These clear code
values are user-programmable by setting two bits, Bit DB1 and Bit
DB0, in the
setting clears the outputs to 0 V. Command 0101 is reserved for
loading the clear code register, see .
The part exits clear code mode on the 32
next write to the part. If
sequence, the write is aborted.
The
the output starts to change—is typically 280 ns. However, if the
value is outside the linear region, it typically takes 520 ns after
executing
See Tab le 1 4 for contents of the input shift register during the
loading clear code register operation.
line low clears the contents of the input register and the
CLR
register and sets the analog outputs accordingly. This
CLR
pulse activation time—the falling edge of
CLR
CLR
input is falling edge sensitive . Bringing
CLR
control register. See . The default
CLR
for the output to start changing. See . Figure 43
pin that is an asynchronous
CLR
Tabl e 1 3
Tabl e 7
nd
falling edge of the
is activated during a write
CLR
to when
Rev. C | Page 23 of 28
AD5678
V
Table 9. Internal Reference Register
Internal REF Register (DB0)Action
0 Reference off (default)
1 Reference on
Table 10. 32-Bit Input Shift Register Contents for Reference Set-Up Function
MSB
DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 to DB1 DB0
X 1 0 0 0 X X X X X 1/0
Don’t cares Command bits (C3 to C0) Address bits (A3 to A0) Don’t cares
Table 11. Power-Down Modes of Operation
DB9 DB8 Operating Mode
0 0 Normal operation
Power-down modes
0 1 1 kΩ to GND
1 0 100 kΩ to GND
1 1 Three-state
Table 12. 32-Bit Input Shift Register Contents for Power-Down/Power-Up Function
Power-down/power-up channel selection—set bit to 1 to select
FB
LSB
Internal REF
register
A
RESISTOR
STRING DAC
AMPLIFIER
POWER-DOW N
CIRCUITRY
RESISTOR
NETWORK
V
OUT
05299-010
Figure 50. Output Stage During Power-Down
Table 13. Clear Code Register
Clear Code Register
DB1 DB0
CR1 CR0 Clears to Code
0 0 0x0000
0 1 0x8000
1 0 0xFFFF
1 1 No operation
Table 14. 32-Bit Input Shift Register Contents for Clear Code Function
MSB
LSB
DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 to DB2 DB1 DB0
X 0 1 0 1 X X X X X CR1 CR0
Don’t cares Command bits (C3 to C0) Address bits (A3 to A0)—don’t cares Don’t cares Clear code register
Rev. C | Page 24 of 28
AD5678
FUNCTION
LDAC
The outputs of all DACs can be updated simultaneously using
the hardware
Synchronous
are updated on the falling edge of the 32
pin.
LDAC
: After new data is read, the DAC registers
LDAC
nd
SCLK pulse.
LDAC
can be permanently low or pulsed as in . Figure 2
Asynchronous
time that the input registers are written to. When
: The outputs are not updated at the same
LDAC
LDAC
goes low,
the DAC registers are updated with the contents of the input register.
Alternatively, the outputs of all DACs can be updated simultaneously using the software
function by writing to Input
LDAC
Register n and updating all DAC registers. Command 0011 is
reserved for this software
An
over the hardware
register gives the user extra flexibility and control
LDAC
LDAC
function.
LDAC
pin. This register allows the user to
select which combination of channels to simultaneously update
when the hardware
pin is executed. Setting the
LDAC
LDAC
bit
register to 0 for a DAC channel means that this channel’s update
is controlled by the
pin. If this bit is set to 1, this channel
LDAC
updates synchronously; that is, the DAC register is updated
after new data is read, regardless of the state of the
effectively sees the
for the
register mode of operation.) This flexibility is
LDAC
pin as being tied low. (See
LDAC
LDAC
Tabl e 15
pin. It
useful in applications where the user wants to simultaneously
update select channels while the rest of the channels are
synchronously updating.
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5678 should
have separate analog and digital sections. If the AD5678 is in a
system where other devices require an AGND-to-DGND
connection, the connection should be made at one point only.
This ground point should be as close as possible to the AD5678.
The power supply to the AD5678 should be bypassed with 10 µF
and 0.1 µF capacitors. The capacitors should physically be as
close as possible to the device, with the 0.1 µF capacitor ideally
right up against the device. The 10 µF capacitors are the tantalum
bead type. It is important that the 0.1 µF capacitor has low effective
series resistance (ESR) and low effective series inductance (ESI),
such as is typical of common ceramic types of capacitors. This
0.1 µF capacitor provides a low impedance path to ground for
high frequencies caused by transient currents due to internal
logic switching.
The power supply line should have as large a trace as possible to
provide a low impedance path and reduce glitch effects on the
supply line. Clocks and other fast switching digital signals should
be shielded from other parts of the board by digital ground. Avoid
crossover of digital and analog signals if possible. When traces
cross on opposite sides of the board, ensure that they run at right
angles to each other to reduce feedthrough effects through the
board. The best board layout technique is the microstrip technique,
where the component side of the board is dedicated to the ground
plane only and the signal traces are placed on the solder side.
However, this is not always possible with a 2-layer board.
pin
pin. DAC channels see LDAC as 0.
DB19
to
DB8
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Don’t
cares
Setting
LDAC
bit to 1 overrides
LDAC
A
pin
Writing to the DAC using command 0110 loads the 8-bit
LDAC
register (DB7 to DB0). The default for each channel is 0; that is,
the
DAC channel is updated regardless of the state of the
pin. See for the contents of the input shift register
during the load
Table 15.
LDAC
0 1/0
1 X—don’t care
Table 16. 32-Bit Input Shift Register Contents for
MSB LSB
DB31
to
DB28
X 0 1 1 0 X X X X X DAC H DAC G DAC F DAC E DAC D DAC C DAC B DAC
Don’t
cares
pin works normally. Setting the bits to 1 means the
LDAC
LDAC
Tabl e 1 6
register mode of operation.
LDAC
Register
LDAC
Load DAC Register
Bits (DB7 to DB0)
LDAC
Pin
Operation
LDAC
Determined by LDAC
DAC channels update, overriding the LDAC
LDAC
DB27DB26DB25DB24DB23DB22DB21DB20
Command bits (C3 to C0) Address bits (A3 to A0)—
don’t cares
Overwrite Function
Rev. C | Page 25 of 28
AD5678
OUTLINE DIMENSIONS
5.10
5.00
4.90
4.50
4.40
4.30
PIN 1
1.05
1.00
0.80
0.15
0.05
COPLANARITY
0.10
4.50
4.40
4.30
PIN 1
0.15
0.05
14
1
0.65 BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
8
6.40
BSC
7
1.20
0.20
MAX
0.09
SEATING
PLANE
8°
0°
Figure 51. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
5.10
5.00
4.90
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.10
0.30
0.19
9
6.40
BSC
81
1.20
MAX
SEATING
PLANE
0.20
0.09
8°
0°
Figure 52. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.75
0.60
0.45
0.75
0.60
0.45
061908-A
ORDERING GUIDE
Package
Model1 Temperature Range Package Description
Option
AD5678BRUZ-1 −40°C to +105°C 14-Lead TSSOP RU-14 Zero ±16 LSB INL 1.25 V
AD5678BRUZ-1REEL7 −40°C to +105°C 14-Lead TSSOP RU-14 Zero ±16 LSB INL 1.25 V
AD5678BRUZ-2 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±16 LSB INL 2.5 V
AD5678BRUZ-2REEL7 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±16 LSB INL 2.5 V
AD5678ARUZ-2 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±32 LSB INL 2.5 V
AD5678ARUZ-2REEL7 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±32 LSB INL 2.5 V