ANALOG DEVICES AD5678 Service Manual

4 × 12-Bit and 4 × 16-Bit Octal DAC with
V
/
V

FEATURES

Low power octal DAC with
Four 16-bit DACs
Four 12-bit DACs 14-lead/16-lead TSSOP On-chip 1.25 V/2.5 V, 5 ppm/°C reference Power down to 400 nA @ 5 V, 200 nA @ 3 V
2.7 V to 5.5 V power supply Guaranteed monotonic by design Power-on reset to zero scale 3 power-down functions Hardware
function to programmable code
CLR
LDAC
and
Rail-to-rail operation

APPLICATIONS

Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage current sources Programmable attenuators

GENERAL DESCRIPTION

override function
LDAC
On-Chip Reference in 14-Lead TSSOP
AD5678

FUNCTIONAL BLOCK DIAGRAM

AD5678
SCLK
SYNC
DIN
1
RU-16 PACKAGE ONLY
LDAC
INTERFACE
LOGIC
1
LDAC
CLR
V
DD
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-ON
RESET
1
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
Figure 1.
REFIN
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
STRING
DAC E
STRING
DAC F
STRING
DAC G
STRING
DAC H
REFOUT
1.25V/2.5V REF
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
POWER-DOWN
LOGIC
GND
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
V
OUT
A
B
C
D
E
F
G
H
05299-001
The AD5678 is a low power, octal, buffered voltage-output DAC with four 12-bit DACs and four 16-bit DACs in a single package. All devices operate from a single 2.7 V to 5.5 V supply and are guaranteed monotonic by design.
The AD5678 has an on-chip reference with an internal gain of 2. The AD5678-1 has a 1.25 V 5 ppm/°C reference, giving a full­scale output of 2.5 V; the AD5678-2 has a 2.5 V 5 ppm/°C reference, giving a full-scale output of 5 V. The on-board reference is off at power-up, allowing the use of an external reference. The internal reference is enabled via a software write.
The part incorporates a power-on reset circuit that ensures that the DAC output powers up to 0 V and remains powered up at this level until a valid write takes place. The part contains a power-down feature that reduces the current consumption of the device to 400 nA at 5 V and provides software-selectable output loads while in power-down mode for any or all DAC channels.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The outputs of all DACs can be updated simultaneously using the
function, with the added functionality of user-
LDAC
selectable DAC channels to simultaneously update. There is also an asynchronous
that clears all DACs to a software-
CLR
selectable code—0 V, midscale, or full scale.
The AD5678 utilizes a versatile 3-wire serial interface that operates at clock rates of up to 50 MHz and is compatible with standard SPI®, QSPI™, MICROWIRE™, and DSP interface standards. The on-chip precision output amplifier enables rail­to-rail output swing.

PRODUCT HIGHLIGHTS

1. Octal DAC (four 12-bit DACs and four 16-bit DACs).
2. On-chip 1.25 V/2.5 V, 5 ppm/°C reference.
3. Available in 14-lead/16-lead TSSOP.
4. Power-on reset to 0 V.
5. Power-down capability. When powered down, the DAC
typically consumes 200 nA at 3 V and 400 nA at 5 V.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005–2011 Analog Devices, Inc. All rights reserved.
AD5678
TABLE OF CONTENTS
Features.............................................................................................. 1
D/A Section................................................................................. 20
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Characteristics........................................................................ 7
Timing Characteristics ................................................................ 8
Absolute Maximum Ratings............................................................ 9
ESD Caution.................................................................................. 9
Pin Configuration and Function Descriptions........................... 10
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 18
Theory of Operation ...................................................................... 20
Resistor String............................................................................. 20
Internal Reference...................................................................... 20
Output Amplifier........................................................................ 21
Serial Interface............................................................................ 21
Input Shift Register .................................................................... 22
Interrupt .......................................................................... 22
SYNC
Internal Reference Register....................................................... 23
Power-On Reset.......................................................................... 23
Power-Down Modes .................................................................. 23
Clear Code Register ................................................................... 23
Function .......................................................................... 25
LDAC
Power Supply Bypassing and Grounding................................ 25
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26

REVISION HISTORY

2/11—Rev. B to Rev. C
Changes to Zero-Code Error Parameter and Offset Error
Parameter, Table 1............................................................................. 3
Changes to Zero-Code Error Parameter and Offset Error
Parameter, Table 2............................................................................. 5
2/09—Rev. A to Rev. B
Changes to Reference Current Parameter, Table 1....................... 3
Change to I
Changes to Reference Current Parameter, Table 2....................... 5
Change to I
11/05—Rev. 0 to Rev. A
Change to General Description...................................................... 1
Change to Specifications.................................................................. 3
Replaced Figure 48 .........................................................................22
Change to the Power-Down Modes Section ............................... 23
10/05—Revision 0: Initial Version
(Normal Mode) Parameter, Table 1 ...................... 4
DD
(Normal Mode) Parameter, Table 2 ...................... 6
DD
Rev. C | Page 2 of 28
AD5678

SPECIFICATIONS

VDD = 4.5 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, V
Table 1.
A Grade1 B Grade1 Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
STATIC PERFORMANCE
2
AD5678 (DAC C, D, E, F)
Resolution 12 12 Bits Relative Accuracy ±0.5 ±2 ±0.5 ±1 LSB See Figure 11 Differential Nonlinearity ±0.25 ±0.25 LSB
AD5678 (DAC A, B, G, H)
Resolution 16 16 Bits Relative Accuracy ±8 ±32 ±8 ±16 LSB See Figure 5
Differential Nonlinearity ±1 ±1 LSB Guaranteed monotonic by design (see Figure 6) Zero-Code Error 6 19 6 19 mV All 0s loaded to DAC register (see Figure 17) Zero-Code Error Drift ±2 ±2 µV/°C Full-Scale Error −0.2 −1 −0.2 −1 % FSR All 1s loaded to DAC register (see Figure 18) Gain Error ±1 ±1 % FSR Gain Temperature
±2.5 ±2.5 ppm Of FSR/°C
Coefficient Offset Error ±6 ±19 ±6 ±19 mV DC Power Supply Rejection
–80 –80 dB V
Ratio DC Crosstalk
10 10 µV
(External Reference) 5 5 µV/mA Due to load current change 10 10 µV Due to powering down (per channel) DC Crosstalk
25 25 µV
(Internal Reference) 10 10 µV/mA Due to load current change
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 VDD 0 VDD V Capacitive Load Stability 2 2 nF RL = ∞ 10 10 nF RL = 2 kΩ DC Output Impedance 0.5 0.5 Short-Circuit Current 30 30 mA VDD = 5 V Power-Up Time 4 4 µs Coming out of power-down mode; VDD = 5 V
REFERENCE INPUTS
Reference Input Voltage VDD VDD V ±1% for specified performance Reference Current 35 55 35 55 µA V Reference Input Range 0 VDD 0 VDD V Reference Input Impedance 14.6 14.6 kΩ Per DAC channel
REFERENCE OUTPUT
Output Voltage
AD5678-2 2.495 2.505 2.495 2.505 V At ambient Reference TC3 ±5 ±10 ±5 ±10 ppm/°C Reference Output Impedance 7.5 7.5 kΩ
LOGIC INPUTS3
Input Current ±3 ±3 µA All digital inputs Input Low Voltage, V Input High Voltage, V
0.8 0.8 V VDD = 5 V
INL
2 2 V VDD = 5 V
INH
Pin Capacitance 3 3 pF
= VDD. All specifications T
REFIN
MIN
to T
, unless otherwise noted.
MAX
Guaranteed monotonic by design (see Figure 12)
± 10%
DD
Due to full-scale output change,
= 2 kΩ to GND or VDD
R
L
Due to full-scale output change, R
= 2 kΩ to GND or VDD
L
= VDD = 5.5 V (per DAC channel)
REF
Rev. C | Page 3 of 28
AD5678
A Grade1 B Grade1 Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
POWER REQUIREMENTS
VDD 4.5 5.5 4.5 5.5 V
All digital inputs at 0 or V DAC active, excludes load current
IDD (Normal Mode)4 V
= VDD and VIL = GND
IH
VDD = 4.5 V to 5.5 V 1.3 1.8 1.3 1.8 mA Internal reference off VDD = 4.5 V to 5.5 V 2 2.6 2 2.6 mA Internal reference on
IDD (All Power-Down Modes)5
VDD = 4.5 V to 5.5 V 0.4 1 0.4 1 µA VIH = VDD and VIL = GND
1
Temperature range is −40°C to +105°C, typical at 25°C.
2
Linearity calculated using a reduced code range of AD5678 12-bit DACs (Code 32 to Code 4,064) and AD5678 16-bit DACs (Code 512 to Code 65,024). Output
unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All eight DACs powered down.
,
DD
Rev. C | Page 4 of 28
AD5678
VDD = 2.7 V to 3.6 V, RL = 2 kΩ to GND, CL = 200 pF to GND, V
Table 2.
A Grade1 B Grade1 Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
STATIC PERFORMANCE
2
AD5678 (DAC C, D, E, F)
Resolution 12 12 Bits
Relative Accuracy ±0.5 ±2 ±0.5 ±1 LSB See Figure 11
Differential Nonlinearity ±1 ±1 LSB
AD5678 (DAC A, B, G, H)
Resolution 16 16 Bits
Relative Accuracy ±32 ±16 LSB See Figure 5
Differential Nonlinearity ±1 ±1 LSB Guaranteed monotonic by design (See Figure 6) Zero-Code Error 6 19 6 19 mV All 0s loaded to DAC register (See Figure 17) Zero-Code Error Drift ±2 ±2 µV/°C Full-Scale Error −0.2 −1 −0.2 −1 % FSR All 1s loaded to DAC register (See Figure 18) Gain Error ±1 ±1 % FSR Gain Temperature Coefficient ±2.5 ±2.5 ppm Of FSR/°C Offset Error ±6 ±19 ±6 ±19 mV Offset Temperature Coefficient 1.7 1.7 µV/°C DC Power Supply Rejection
–80 –80 dB V
Ratio DC Crosstalk
10 10 µV
(External Reference)
4.5 4.5 µV/mA Due to load current change 10 10 µV Due to powering down (per channel) DC Crosstalk
25 25 µV
(Internal Reference)
4.5 4.5 µV/mA Due to load current change
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 VDD 0 VDD V Capacitive Load Stability 2 2 nF RL = ∞ 10 10 nF RL = 2 kΩ DC Output Impedance 0.5 0.5 Ω Short-Circuit Current 30 30 mA VDD = 3 V Power-Up Time 4 4 µs Coming out of power-down mode; VDD = 3 V
REFERENCE INPUTS
Reference Input Voltage VDD V Reference Current 20 55 20 55 µA V Reference Input Range 0 VDD 0 VDD V Reference Input Impedance 14.6 14.6 kΩ Per DAC channel
REFERENCE OUTPUT
Output Voltage
AD5678-1 1.247 1.253 1.247 1.253 V At ambient Reference TC3 ±5 ±15 ±5 ±15 ppm/°C Reference Output Impedance 7.5 7.5 kΩ
= VDD. All specifications T
REFIN
MIN
to T
, unless otherwise noted.
MAX
Guaranteed monotonic by design (see Figure 12)
± 10%
DD
Due to full-scale output change,
= 2 kΩ to GND or VDD
R
L
Due to full-scale output change,
= 2 kΩ to GND or VDD
R
L
V ±1% for specified performance
DD
= VDD = 3.6 V (per DAC channel)
REF
Rev. C | Page 5 of 28
AD5678
A Grade1 B Grade1 Parameter Min Typ Max Min Typ Max Unit Conditions/Comments
LOGIC INPUTS3
Input Current ±3 ±3 µA All digital inputs Input Low Voltage, V Input High Voltage, V Pin Capacitance 3 3 pF
POWER REQUIREMENTS
VDD 2.7 3.6 2.7 3.6 V
IDD (Normal Mode)4 V
VDD = 2.7 V to 3.6 V 1.2 1.7 1.2 1.7 mA Internal reference off VDD = 2.7 V to 3.6 V 1.7 2.6 1.7 2.6 mA Internal reference on
IDD (All Power-Down Modes)5
VDD = 2.7 V to 3.6 V 0.2 1 0.2 1 µA VIH = VDD and VIL = GND
1
Temperature range is −40°C to +105°C, typical at 25°C.
2
Linearity calculated using a reduced code range of AD5678 12-bit DACs (Code 32 to Code 4,064) and AD5678 16-bit DACs (Code 512 to Code 65,024). Output
unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All eight DACs powered down.
0.8 0.8 V VDD = 3 V
INL
2 2 V VDD = 3 V
INH
All digital inputs at 0 or V DAC active, excludes load current
= VDD and VIL = GND
IH
,
DD
Rev. C | Page 6 of 28
AD5678

AC CHARACTERISTICS

VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, V
Table 3.
Parameter
1, 2
Min Typ Max Unit Conditions/Comments3
Output Voltage Settling Time 6 10 µs ¼ to ¾ scale settling to ±2 LSB Slew Rate 1.5 V/µs Digital-to-Analog Glitch Impulse 4 nV-s 1 LSB change around major carry (see Figure 34) Digital Feedthrough 0.1 nV-s Reference Feedthrough −90 dB V Digital Crosstalk 0.5 nV-s Analog Crosstalk 2.5 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 340 kHz V Total Harmonic Distortion −80 dB V Output Noise Spectral Density 120 nV/√Hz DAC code = 0x8400, 1 kHz 100 nV/√Hz DAC code = 0x8400, 10 kHz Output Noise 15 V p-p 0.1 Hz to 10 Hz
1
Guaranteed by design and characterization; not production tested.
2
See the Terminology section.
3
Temperature range is −40°C to +105°C, typical at 25°C.
= VDD. All specifications T
REFIN
= 2 V ± 0.1 V p-p, frequency = 10 Hz to 20 MHz
REF
= 2 V ± 0.2 V p-p
REF
= 2 V ± 0.1 V p-p, frequency = 10 kHz
REF
MIN
to T
, unless otherwise noted.
MAX
Rev. C | Page 7 of 28
AD5678

TIMING CHARACTERISTICS

All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 2. V
= 2.7 V to 5.5 V. All specifications T
DD
Table 4.
Limit at T
MIN
, T
Parameter VDD = 2.7 V to 5.5 V Unit Conditions/Comments
t1 1 20 ns min SCLK cycle time t2 8 ns min SCLK high time t3 8 ns min SCLK low time t4 13 ns min
t5 4 ns min Data set-up time t6 4 ns min Data hold time t7 0 ns min
t8 15 ns min t9 13 ns min t10 0 ns min t11 10 ns min t12 15 ns min t13 5 ns min t14 0 ns min t15 300 ns typ
1
Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V. Guaranteed by design and characterization; not production tested.
t
SCLK
t
8
SYNC
DIN
1
LDAC
to T
MIN
MAX
, unless otherwise noted.
MAX
to SCLK falling edge set-up time
SYNC
SCLK falling edge to SYNC Minimum SYNC
rising edge to SCLK fall ignore
SYNC SCLK falling edge to SYNC
pulse width low
LDAC SCLK falling edge to LDAC
pulse width low
CLR SCLK falling edge to LDAC
pulse activation time
CLR
10
t
4
t
6
t
5
DB31
t
1
t
t
3
2
DB0
t
9
t
7
t
11
t
14
rising edge
high time
fall ignore
rising edge
falling edge
2
LDAC
t
CLR
V
OUT
1
ASYNCHRONOUS LDAC UPDAT E MODE.
2
SYNCHRONOUS LDAC UPDAT E MODE.
13
t
12
t
15
05299-002
Figure 2. Serial Write Operation
Rev. C | Page 8 of 28
AD5678

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to GND −0.3 V to +7 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V V
REFIN/VREFOUT
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C Junction Temperature (TJ TSSOP Package
Power Dissipation (TJ θJA Thermal Impedance 150.4°C/W
Lead Temperature, Soldering
SnPb 240°C Pb Free 260°C
to GND −0.3 V to VDD + 0.3 V
) 150°C
MAX
− TA)/θJA
MAX
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 9 of 28
AD5678
V

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

1
SYNC
2
V
DD
3
V
A
OUT
V
OUT
V
OUT
V
OUT
REFIN/VREFOUT
C
E
G
AD5678
4
TOP VIEW
(Not to Scale)
5
6
7
Figure 3. 14-Lead TSSOP (RU-14)
Table 6. Pin Function Descriptions
Pin No.
14-Lead TSSOP
N/A
1 2
2 3 V
3 4 V 11 13 V 4 5 V 10 12 V 7 8 V
N/A 9
5 6 V 9 11 V 6 7 V 8 10 V
16-Lead TSSOP Mnemonic
1
LDAC
Active Low Control Input. This is the frame synchronization signal for the input data. When
SYNC
DD
A Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
B Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
C Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
D Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
REFIN/VREFOUT
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC
CLR
OUT
OUT
OUT
OUT
E Analog Output Voltage from DAC E. The output amplifier has rail-to-rail operation. F Analog Output Voltage from DAC F. The output amplifier has rail-to-rail operation. G Analog Output Voltage from DAC G. The output amplifier has rail-to-rail operation.
H Analog Output Voltage from DAC H. The output amplifier has rail-to-rail operation. 12 14 GND 13 15 DIN
14 16 SCLK
1
LDAC
14
SCLK
13
DIN
12
GND
11
V
B
OUT
10
D
V
OUT
9
F
V
OUT
8
H
V
OUT
05299-003
V
REFIN/VREFOUT
SYNC
V
OUT
V
OUT
V
OUT
V
OUT
V
DD
A
C
E
G
2
3
AD5678
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
SCLK
15
DIN
14
GND
13
V
B
OUT
12
V
D
OUT
11
V
F
OUT
10
H
V
OUT
9
CLR
05299-004
Figure 4. 16-Lead TSSOP (RU-16)
Description
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data. This allows all DAC outputs to simultaneously update. Alternatively, this pin can be tied permanently low.
SYNC goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the next 32 clocks. If SYNC is taken high before the 32nd falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device.
Power Supply Input. These parts can be operated from 2.7 V to 5.5 V, and the supply should be decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
The AD5678 has a common pin for reference input and reference output. When using the internal reference, this is the reference output pin. When using an external reference, this is the reference input pin. The default for this pin is as a reference input.
pulses are ignored. When CLR
is activated, the input register and the DAC register are updated with the data contained in the CLR code register—zero, midscale, or full scale. Default setting clears the output to 0 V.
Ground Reference Point for All Circuitry on the Part. Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on
the falling edge of the serial clock input. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz.
Rev. C | Page 10 of 28
AD5678

TYPICAL PERFORMANCE CHARACTERISTICS

10
VDD = V
8
T
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
0 5k 10k 15k 20k 25k 30k 35k 40k 45k 50k 55k 60k 65k
= 25°C
A
REF
= 5V
CODE
Figure 5. INL—16-Bit DAC
1.0 VDD = V T
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0 10k 20k 30k 40k 50k 60k
= 25°C
A
REF
= 5V
CODE
Figure 6. DNL—16-Bit DAC
05299-011
05299-012
1.0 VDD = 5V
0.8
V
= 2.5V
REFOUT
TA = 25°C
0.6
0.4
0.2
0
–0.2
DNL ERRO R (LSB)
–0.4
–0.6
–0.8
–1.0
0
5000
20000
15000
10000
35000
30000
25000
CODE
Figure 8. DNL 16-Bit DAC, 2.5 V Internal Reference
10
VDD = 3V
8
V
= 1.25V
REFOUT
T
= 25°C
A
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
0
5000
25000
20000
15000
10000
30000
CODE
40000
35000
Figure 9. INL—16-Bit DAC, 1.25 V Internal Reference
05299-014
65000
60000
55000
50000
45000
40000
05299-015
65000
60000
55000
50000
45000
10
VDD = 5V
8
V
= 2.5V
REFOUT
TA = 25°C
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
0
5000
20000
15000
10000
35000
30000
25000
CODE
Figure 7. INL—16-Bit DAC, 2.5 V Internal Reference
1.0
VDD = 3V
0.8
V
= 1.25V
REFOUT
T
= 25°C
A
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
05299-013
65000
60000
55000
50000
45000
40000
–1.0
0
5000
10000
CODE
40000
35000
30000
25000
20000
15000
55000
50000
45000
05299-016
65000
60000
Figure 10. DNL—16-Bit DAC, 1.25 V Internal Reference
Rev. C | Page 11 of 28
AD5678
1.0 VDD = V
T
0.8
0.6
0.4
0.2
0
–0.2
INL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0 500 1000 1500 2000 2500 3000 3500 4000
0.20 V
T
0.15
0.10
0.05
0
–0.05
DNL ERROR (LSB)
–0.10
–0.15
–0.20
0 500 1000 1500 2000 2500 300
= 5V
REF
= 25°C
A
Figure 11. INL—12-Bit DAC
= V
= 5V
DD
REF
= 25°C
A
Figure 12. DNL—12-Bit DAC
CODE
CODE
0 3500 4000
0.20 VDD = 5V V
= 2.5V
REFOUT
0.15
TA = 25°C
0.10
0.05
0
–0.05
DNL ERRO R (LSB)
–0.10
05299-045
–0.15
–0.20
0 1000500 20001500 350030002500 4000
CODE
05299-048
Figure 14. DNL 12-Bit DAC, 2.5 V Internal Reference
1.0 VDD = 3V
0.8
V
= 1.25V
REFOUT
T
= 25°C
A
0.6
0.4
0.2
0
–0.2
INL ERROR (LSB)
–0.4
–0.6
05299-046
–0.8
–1.0
0 500 1000 1500 2000 2500 3000 350 0 4000
CODE
05299-049
Figure 15. INL—12-Bit DAC, 1.25 V Internal Reference
1.0 VDD = 5V V
REFOUT
T
= 25°C
A
= 2.5V
CODE
0.8
0.6
0.4
0.2
0
–0.2
INL ERRO R (LS B)
–0.4
–0.6
–0.8
–1.0
0 1000500 20001500 350030002500 4000
Figure 13. INL—12-Bit DAC, 2.5 V Internal Reference
05299-047
Rev. C | Page 12 of 28
0.20 VDD = 3V
V
= 1.25V
REFOUT
0.15 T
= 25°C
A
0.10
0.05
0
–0.05
DNL ERROR (LSB)
–0.10
–0.15
–0.20
0 500 1000 1500 2000 2500 3000 350 0 4000
CODE
Figure 16. DNL—12-Bit DAC, 1.25 V Internal Reference
05299-050
AD5678
0
VDD = 5V
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
ERROR (% F SR)
–0.14
–0.16
–0.18
–0.20
–40 –20 40200 1008060
GAIN ERROR
FULL-SCALE ERROR
TEMPERATURE (°C)
Figure 17. Gain Error and Full-Scale Error vs. Temperature
1.5
1.0
0.5
0
–0.5
ERROR (mV)
–1.0
–1.5
–2.0
–2.5
–40 –20 402008060 100
ZERO-SCALE ERROR
OFFSET ERROR
TEMPERATURE (°C)
Figure 18. Zero-Scale Error and Offset Error vs. Temperature
1.0
= 25°C
T
A
0.5
0
–0.5
–1.0
ERROR (mV)
–1.5
–2.0
05299-017
–2.5
2.7 3.2 4.23.7 5.24.7
ZERO-SCALE ERROR
VDD (V)
OFFSET ERROR
05299-020
Figure 20. Zero-Scale Error and Offset Error vs. Supply Voltage
20
VDD = 3.6V V
18
16
14
12
10
FREQUENCY
05299-018
= 5.5V
DD
8
6
4
2
0
1.20 1.22 1.24 1. 26 1.28 1.30 1. 32 1.34 1. 36 1.38 1.40 1. 42
Figure 21. I
Histogram with External Reference
DD
IDD (mA)
1.44
05299-021
1.0
0.5
GAIN ERROR
0
–0.5
ERROR (% FSR)
–1.0
–1.5
–2.0
FULL-SCAL E ERROR
2.7 3.2 3.7 4.74.2 5.2 VDD (V)
Figure 19. Gain Error and Full-Scale Error vs. Supply Voltage
05299-019
Rev. C | Page 13 of 28
14
VDD = 3.6V V
= 5.5V
DD
12
10
V
= 1.25V V
REFOUT
8
6
FREQUENCY
4
2
0
2.02
2.04 2.06 2.08 2.10 2.12 2. 14 2.16 2.18 2.20 2.22 2.24 2. 26 2.28
Figure 22. I
Histogram with Internal Reference
DD
IDD (mA)
REFOUT
= 2.5V
05299-022
AD5678
(
m
0.50 DAC LOADED WIT H FULL-SCAL E
0.40 SOURCING CURRENT
0.30
0.20
VDD= 3V
0.10
V
= 1.25V
REFOUT
0
–0.10
ERROR VOLTAGE (V)
–0.20
–0.30
–0.40
–0.50
–10 –8 –6 –4 –2 0 2 4 861
VDD= 5V V
REFOUT
= 2.5V
CURRENT (mA)
DAC LOADED WIT H ZERO-SCALE SINKING CURRENT
Figure 23. Headroom at Rails vs. Source and Sink
05299-023
0
2.0 TA = 25°C
1.8
1.6
1.4
1.2
1.0
(mA)
DD
I
0.8
0.6
0.4
0.2
0
512 10512 20512 30512 40512 50512 60512
VDD = V
VDD = V
= 3V
REF
REF
CODE
= 5V
Figure 26. Supply Current vs. Code
05299-026
6.00 VDD= 5V
V
= 2.5V
REFOUT
5.00 T
= 25°C
A
4.00
3.00
(V)
OUT
V
2.00
1.00
0
–1.00
–30 –20 –10 0 10 20 30
CURRENT (mA)
FULL SCALE
3/4 SCALE
MIDSCALE
1/4 SCALE
ZERO SCALE
Figure 24. AD5678-2 Source and Sink Capability
4.00 VDD= 3V
V
= 1.25V
REFOUT
T
= 25°C
A
3.00
FULL SCALE
1.6
1.4
1.2
1.0
0.8
(mA)
DD
I
0.6
0.4
0.2
05299-024
0
–40 –20 0 20 40 60 80 100
VDD = V
VDD = V
TEMPERATURE ( °C)
REFIN
= 3.6V
REFIN
= 5.5V
05299-027
Figure 27. Supply Current vs. Temperature
1.6
TA=25°C
1.4
1.2
2.00
(V)
OUT
V
1.00
0
–1.00
–30 –20 –10 0 10 20 30
3/4 SCALE
MIDSCALE
1/4 SCALE
ZERO SCALE
CURRENT (mA)
Figure 25. AD5678-1 Source and Sink Capability
05299-025
1.0
A)
0.8
DD
I
0.6
0.4
0.2
0
2.7
3.2 4.23.7 5.24.7
VDD(V)
05299-028
Figure 28. Supply Current vs. Supply Voltage
Rev. C | Page 14 of 28
AD5678
8
TA = 25°C
7
6
VDD = V T
= 25°C
A
REF
= 5V
5
4
(mA)
DD
I
3
2
1
VDD = 3V
0
012345
VDD = 5V
V
LOGIC
(V)
Fi e gure 29. Supply Current vs. Logic Input Voltag
VDD = V T FULL-SCALE CODE CHANGE 0x0000 TO 0xFFFF OUTPUT L OADED WIT H 2k AND 200pF TO G ND
V
= 909mV/DIV
OUT
1
= 25°C
A
REF
= 5V
05299-029
6
V
1
2
DD
V
OUT
CH1 2.0V CH2 1.0V M100 μs 125MS/s
A CH1 1.28V
Fig le ure 32. Power-On Reset to Midsca
SYNC
1
3
2
SLCK
V
OUT
8.0ns/p t
VDD = 5V
05299-032
TIME BASE = 4μs/DIV
Figure 30. Full-Scale Settling Time, 5 V
V
1
2
DD
V
OUT
CH1 2.0V CH2 500mV M100 μs 125MS/s
A CH1 1.28V
Figure 31. Power-On Reset to 0 V
VDD = V T
= 25°C
A
= 5V
REF
MAX(C2)*
420.0mV
8.0ns/p t
05299-030
CH1 5.0V CH3 5.0V
CH2 500mV M400ns A CH1 1.4V
05299-033
Figure 33. Exiting Power-Down to Midscale
2.505
2.504
2.503
2.502
2.501
2.500
2.499
2.498
2.497
2.496
(V)
2.495
OUT
2.494
V
2.493
2.492
2.491
2.490
2.489
2.488
2.487
05299-031
2.486
2.485 0 512
64 128 192 256 320 384 448
VDD = 5V
= 2.5V
V
REFOUT
= 25°C
T
A
4ns/SAMPL E NUMBER
GLITCH IMPULSE = 3.55nV- s 1 LSB CHANGE AROUND
MIDSCALE ( 0x8000 TO 0x7FF F)
SAMPLE
05299-034
Figure 34. Digital-to-Analog Glitch Impulse (Negative)
Rev. C | Page 15 of 28
AD5678
2.5000
2.4995
2.4990
2.4985
2.4980
(V)
2.4975
OUT
V
2.4970
2.4965
2.4960
2.4955
2.4950 0 512
64 128 192 256 320 384 448
SAMPLE
VDD = 5V V
REFOUT
= 25°C
T
A
4ns/SAMPL E NUMBER
Figure 35. Analog Crosstalk
2.4900
2.4895
2.4890
2.4885
2.4880
(V)
OUT
2.4875
V
2.4870
2.4865
2.4860
2.4855 0 512
64 128 192 256 320 384 448
SAMPLE
VDD = 5V V
REFO
= 2
T
A
4ns/SAMPL E NUMBER
Figure 36. DAC-to-DAC Crosstalk
UT
5°C
= 2.5V
05299-035
= 2.5V
05299-036
VDD = 5V
= 2.5V
V
REFOUT
T
= 25°C
A
DAC LOADED WITH MIDSCALE
1
10μV/DIV
5s/DIV
Figure 38. 0.1 Hz to 10 Hz Output Noise Plot, Internal Reference
VDD = 3V
= 1.25V
V
REFOUT
= 25°C
T
A
DAC LOADED WITH MIDSCALE
1
5μV/DIV
4s/DIV
Figure 39. 0.1 Hz to 10 Hz Output Noise Plot, Internal Reference
05299-038
05299-039
VDD = V T DAC LOADED WITH MIDSCALE
1
Y AXIS = 2μV/DIV X AXIS = 4s/DIV
= 25°C
A
REF
= 5V
Figure 37. 0.1 Hz to 10 Hz Output Noise Plot, External Reference
05299-037
Rev. C | Page 16 of 28
800
TA=25°C MIDSCALE L OADED
700
600
500
400
300
OUTPUT NOISE (nV/ Hz)
200
VDD=3V
100
V = 1.25V
REFOUT
0
100 100001000 100000 1000000
VDD=5V V
=2.5V
REFOUT
FREQUE NCY ( Hz)
Figure 40. Noise Spectral Density, Internal Reference
9-040 0529
AD5678
20
VDD=5V T
=25°C
A
–30
DAC LOADED W ITH FULL SCALE V
= 2V ± 0.3V p-p
REF
–40
–50
–60
(dB)
–70
–80
–90
–100
2k 4k 6k 8k 10k
FREQUENCY (Hz)
Figure 41. Total Harmonic Distortion
16
V
= V
REF
DD
TA = 25°C
14
V
3V
=
12
s)
μ
10
TIME (
8
6
4
012 34 567 981
CAPACITANCE (nF)
DD
V
5V
=
DD
Figure 42. Settling Time vs. Capacitive Load
05299-041
05299-042
0
3
V
F
OUT
V
B
OUT
4
4
2
CH3 5.0V CH4 1.0V
CH2 1.0V M200n s A CH3 1.10V
Figure 43. Hardware
5
0
5
10
15
(dB)
20
25
30
35
–40
10k 100k 1M 10M
Figure 44. Multiplying Bandwidth
CLR
CLR
FREQUENCY (Hz)
05299-043
VDD = 5V T
= 25°C
A
05299-044
Rev. C | Page 17 of 28
AD5678

TERMINOLOGY

Relative Accuracy
For the DAC, relative accuracy, or integral nonlinearity (INL), is a measure of the maximum deviation in LSBs from a straight line passing through the endpoints of the DAC transfer function. Figure 5, Figure 7, and Figure 9 show plots of typical INL vs. code.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded into the DAC register. Ideally, the output should be V
− 1 LSB. Full-scale error is expressed as a
DD
percentage of the full-scale range. Figure 17 shows a plot of typical full-scale error vs. temperature.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed mono­tonic by design. Figure 6, Figure 8, and Figure 10 show plots of typical DNL vs. code.
Offset Error
Offset error is a measure of the difference between the actual V
and the ideal V
OUT
, expressed in millivolts in the linear
OUT
region of the transfer function. Offset error is measured on the AD5678 with Code 512 loaded into the DAC register. It can be negative or positive and is expressed in millivolts.
Zero-Code Error
Zero-code error is a measure of the output error when zero code (0x0000) is loaded into the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5678, because the output of the DAC cannot go below 0 V. It is due to a combination of the offset errors in the DAC and output amplifier. Zero-code error is expressed in millivolts. Figure 18 shows a plot of typical zero-code error vs. temperature.
Gain Error
Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as a percentage of the full-scale range.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code error with a change in temperature. It is expressed in V/°C.
Gain Error Drift
Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000). See Figure 34.
DC Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in V a change in V in decibels. V
for full-scale output of the DAC. It is measured
DD
is held at 2 V, and VDD is varied ±10%.
REF
OUT
to
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC (or soft power-down and power-up) while monitoring another DAC. It is expressed in microvolts.
DC crosstalk due to load current change is a measure of the impact that a change in load current on one DAC has to another DAC kept at midscale. It is expressed in microvolts per milliamp.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (that is,
is high). It is expressed in
LDAC
decibels.
Channel-to-Channel Isolation
Channel-to-channel isolation is the ratio of the amplitude of the signal at the output of one DAC to a sine wave on the reference input of another DAC. It is measured in decibels.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of a DAC from the digital input pins of the device, but is measured when the DAC is not being written to (
held high). It is specified in nV-s and measured with a
SYNC
full-scale change on the digital input pins, that is, from all 0s to all 1s or vice versa.
Rev. C | Page 18 of 28
AD5678
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s or vice versa) in the input register of another DAC. It is measured in standalone mode and is expressed in nV-s.
Multiplying Bandwidth
The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s or vice versa) while keeping
high, and then pulsing
the DAC whose digital code has not changed. The area of the glitch is expressed in nV-s.
DAC-to-DAC C rosst a l k
DAC-to-DAC crosstalk is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s or vice versa) with
low and monitoring the output of another DAC. The
LDAC energy of the glitch is expressed in nV-s.
low and monitoring the output of
LDAC
LDAC
Total Harmonic Distortion (THD)
Total harmonic distortion is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measure of the harmonics present on the DAC output. It is measured in decibels.
Rev. C | Page 19 of 28
AD5678
V

THEORY OF OPERATION

D/A SECTION

The AD5678 DAC is fabricated on a CMOS process. The archi­tecture consists of a string of DACs followed by an output buffer amplifier. The parts include an internal 1.25 V/2.5 V, 5 ppm/°C reference with an internal gain of 2. Figure 45 shows a block diagram of the DAC architecture.
DD
REF (+)
DAC REGISTER
RESISTOR
STRING
REF (–)
GND
Figure 45. DAC Architecture
OUTPUT AMPLIFIER (GAI N = +2)
V
OUT
Because the input coding to the DAC is straight binary, the ideal output voltage when using an external reference is given by
OUT
VV
REFIN
N
2
D
×=
the ideal output voltage when using an internal reference is given by
D
VV
2
××=
REFOUTOUT
N
2
where:
D = decimal equivalent of the binary code that is loaded to the
DAC register. 0 to 4,095 for AD5678 DAC C, D, E, F (12 bits). 0 to 65,535 for AD5678 DAC A, B, G, H (16 bits).
N = the DAC resolution.

RESISTOR STRING

The resistor string section is shown in Figure 46. It is simply a string of resistors, each of value R. The code loaded into the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic.
05299-005

INTERNAL REFERENCE

The AD5678 has an on-chip reference with an internal gain of
2. The AD5678-1 has a 1.25 V 5 ppm/°C reference, giving a full­scale output of 2.5 V. The AD5678-2 has a 2.5 V 5 ppm/°C reference, giving a full-scale output of 5 V. The on-board reference is off at power-up, allowing the use of an external reference. The internal reference is enabled via a write to a control register. See Tabl e 7 .
The internal reference associated with each part is available at the V
REFOUT
used to drive external loads. When using the internal reference, it is recommended that a 100 nF capacitor be placed between the reference output and GND for reference stability.
Individual channel power-down is not supported while using the internal reference.
R
R
R
R
R
Figure 46. Resistor String
TO OUTP UT AMPLIFIER
05299-006
pin. A buffer is required if the reference output is
Rev. C | Page 20 of 28
AD5678

OUTPUT AMPLIFIER

The output buffer amplifier can generate rail-to-rail voltages on its output, which gives an output range of 0 V to V
DD
. The amplifier is capable of driving a load of 2 kΩ in parallel with 1,000 pF to GND. The source and sink capabilities of the output amplifier can be seen in Figure 24 and Figure 25. The slew rate is 1.5 V/µs with a ¼ to ¾ scale settling time of 10 µs.

SERIAL INTERFACE

The AD5678 has a 3-wire serial interface ( DIN) that is compatible with SPI, QSPI, and MICROWIRE
interface standards as well as most DSPs. See for a timing diagram of a typical write sequence.
The write sequence begins by bringing the from the DIN line is clocked into the 32-bit shift register on the
falling edge of SCLK. The serial clock frequency can be as high as 50 MHz, making the AD5678 compatible with high speed
nd
DSPs. On the 32
falling clock edge, the last data bit is clocked in and the programmed function is executed, that is, a change in DAC register contents and/or a change in the mode of operation. At this stage, the
line can be kept low or be
SYNC
brought high. In either case, it must be brought high for a minimum of 15 ns before the next write sequence so that a falling edge of
Because the
SYNC
than it does when V
can initiate the next write sequence.
SYNC
buffer draws more current when VIN = 2 V
= 0.8 V,
IN
should be idled low
SYNC
between write sequences for even lower power operation of the part. As is mentioned previously, however,
brought high again just before the next write sequence.
SYNC
Figure 2
SYNC
SYNC
, SCLK, and
line low. Data
must be
Table 7. Command Definitions
Command
C3 C2 C1 C0 Description
0 0 0 0 Write to Input Register n 0 0 0 1 Update DAC Register n 0 0 1 0
0 0 1 1 Write to and update DAC Channel n 0 1 0 0 Power down/power up DAC 0 1 0 1 Load clear code register 0 1 1 0
0 1 1 1 Reset (power-on reset) 1 0 0 0 Set up internal REF register 1 0 0 1 Reserved – – – – Reserved 1 1 1 1 Reserved
Write to Input Register n, update all (software LDAC
Load LDAC
)
register
Table 8. Address Commands
Address (n)
A3 A2 A1 A0
0 0 0 0 DAC A (16 bits) 0 0 0 1 DAC B (16 bits) 0 0 1 0 DAC C (12 bits) 0 0 1 1 DAC D (12 bits) 0 1 0 0 DAC E (12 bits) 0 1 0 1 DAC F (12 bits) 0 1 1 0 DAC G (16 bits) 0 1 1 1 DAC H (16 bits) 1 1 1 1 All DACs
Selected DAC Channel
Rev. C | Page 21 of 28
AD5678
INTERRUPT

INPUT SHIFT REGISTER

The input shift register is 32 bits wide. The first four bits are don’t cares. The next four bits are the command bits, C3 to C0 (see Table 7), followed by the 4-bit DAC address bits, A3 to A0 (see Table 8), and finally the 16-/12-bit data-word. The data­word comprises the 16-/12-bit input code followed by four or eight don’t care bits for the AD5678 DAC A, B, G, H and AD5678 DAC C, D, E, F, respectively (See Figure 47 and Figure 48). These data bits are transferred to the DAC register on the 32
DB31 (MSB) DB0 (LSB)
X
XXX
nd
falling edge of SCLK.
C3 C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X
SYNC
In a normal write sequence, the
32 falling edges of SCLK, and the DAC is updated on the 32 falling edge and rising edge of
brought high before the 32
nd
falling edge, this acts as an interrupt to the write sequence. The shift register is reset, and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs—see Figure 49.
DATA BITS
line is kept low for
SYNC
. However, if
SYNC
SYNC
nd
is
ADDRESS BITSCOMMAND BITS
Figure 47. AD5678 Input Register Content for DAC A, B, G , H
DB31 (MSB) DB0 (LSB)
X
XXX
C3C2C1C0A3A2A1A0D11D10D9D8D7D6D5D4D3D2D1D0XXXXXXXX
DATA BITS
ADDRESS BITSCOMMAND BITS
Figure 48. AD5678 Input Register Content for DAC C, D, E, F
SCLK
SYNC
DIN
DB31 DB0
INVALID WRITE SEQUENCE:
SYNC HIGH BEFORE 32ND FALLING EDGE
Figure 49.
SYNC
Interrupt Facility
DB31 DB0
VALID WRITE SEQUENCE , OUTPUT UPDATES
ON THE 32ND FALLING EDGE
05299-007
05299-008
05299-009
Rev. C | Page 22 of 28
AD5678

INTERNAL REFERENCE REGISTER

The on-board reference is off at power-up by default. This allows the use of an external reference if the application requires it. The on-board reference can be turned on/off by a user­programmable internal REF register by setting Bit DB0 high or low (see Tabl e 9). Command 1000 is reserved for this internal REF set-up command (see Tabl e 7). Tab l e 1 1 shows the state of the bits in the input shift register corresponds to the mode of operation of the device.

POWER-ON RESET

The AD5678 contains a power-on reset circuit that controls the output voltage during power-up. The AD5678 output powers up to 0 V, and the output remains powered up at this level until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up. There is also a software executable reset function that resets the DAC to the power-on reset code. Command 0111 is reserved for this reset function—see Tabl e 7. Any events on
during power-on reset are ignored.
CLR
LDAC
or

POWER-DOWN MODES

The AD5678 contains four separate modes of operation. Command 0100 is reserved for the power-down function. See Tabl e 7 . These modes are software-programmable by setting two bits, Bit DB9 and Bit DB8, in the control register.
Tabl e 1 1 shows how the state of the bits corresponds to the mode of operation of the device. Any or all DACs (DAC H to DAC A) can be powered down to the selected mode by setting the corresponding eight bits (DB7 to DB0) to 1. See Tab l e 1 2 for the contents of the input shift register during power-down/power­up operation. When using the internal reference, only all channel power-down to the selected modes is supported.
When both bits are set to 0, the part works normally with its normal power consumption of 1.3 mA at 5 V. However, for the three power-down modes, the supply current falls to 400 nA at 5 V (200 nA at 3 V). Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while
the part is in power-down mode. There are three different options. The output is connected internally to GND through either a 1 kΩ or a 100 kΩ resistor, or it is left open-circuited (three-state). The output stage is illustrated in Figure 50.
The bias generator of the selected DAC(s), output amplifier, resistor string, and other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power­down. The time to exit power-down is typically 5 µs for
= 5 V and for VDD = 3 V, see Figure 33.
V
DD
Any combination of DACs can be powered up by setting PD1 and PD0 to 0 (normal operation). The output powers up to the value in the input register (
DAC register before powering down (
low) or to the value in the
LDAC
high).
LDAC

CLEAR CODE REGISTER

The AD5678 has a hardware clear input. The the
DAC registers to the data contained in the user-configurable CLR function can be used in system calibration to load zero scale, midscale, or full scale to all channels together. These clear code values are user-programmable by setting two bits, Bit DB1 and Bit DB0, in the
setting clears the outputs to 0 V. Command 0101 is reserved for loading the clear code register, see .
The part exits clear code mode on the 32 next write to the part. If
sequence, the write is aborted.
The
the output starts to change—is typically 280 ns. However, if the value is outside the linear region, it typically takes 520 ns after executing
See Tab le 1 4 for contents of the input shift register during the loading clear code register operation.
line low clears the contents of the input register and the
CLR
register and sets the analog outputs accordingly. This
CLR
pulse activation time—the falling edge of
CLR
CLR
input is falling edge sensitive . Bringing
CLR
control register. See . The default
CLR
for the output to start changing. See . Figure 43
pin that is an asynchronous
CLR
Tabl e 1 3
Tabl e 7
nd
falling edge of the
is activated during a write
CLR
to when
Rev. C | Page 23 of 28
AD5678
V
Table 9. Internal Reference Register
Internal REF Register (DB0) Action 0 Reference off (default) 1 Reference on
Table 10. 32-Bit Input Shift Register Contents for Reference Set-Up Function
MSB DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 to DB1 DB0
X 1 0 0 0 X X X X X 1/0 Don’t cares Command bits (C3 to C0) Address bits (A3 to A0) Don’t cares
Table 11. Power-Down Modes of Operation
DB9 DB8 Operating Mode
0 0 Normal operation Power-down modes 0 1 1 kΩ to GND 1 0 100 kΩ to GND 1 1 Three-state
Table 12. 32-Bit Input Shift Register Contents for Power-Down/Power-Up Function
MSB LSB
DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20
X 0 1 0 0 X X X X X PD1 PD0 DAC H DAC G DAC F DAC E DAC D DAC C DAC B DAC
Don’t cares
DB19 to DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Command bits (C3 to C0) Address bits (A3 to A0)—
don’t cares
Don’t cares
Power-
down mode
Power-down/power-up channel selection—set bit to 1 to select
FB
LSB
Internal REF register
A
RESISTOR
STRING DAC
AMPLIFIER
POWER-DOW N
CIRCUITRY
RESISTOR NETWORK
V
OUT
05299-010
Figure 50. Output Stage During Power-Down
Table 13. Clear Code Register
Clear Code Register DB1 DB0 CR1 CR0 Clears to Code
0 0 0x0000 0 1 0x8000 1 0 0xFFFF 1 1 No operation
Table 14. 32-Bit Input Shift Register Contents for Clear Code Function
MSB
LSB
DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB19 to DB2 DB1 DB0
X 0 1 0 1 X X X X X CR1 CR0 Don’t cares Command bits (C3 to C0) Address bits (A3 to A0)—don’t cares Don’t cares Clear code register
Rev. C | Page 24 of 28
AD5678
FUNCTION
LDAC
The outputs of all DACs can be updated simultaneously using the hardware
Synchronous are updated on the falling edge of the 32
pin.
LDAC
: After new data is read, the DAC registers
LDAC
nd
SCLK pulse.
LDAC
can be permanently low or pulsed as in . Figure 2
Asynchronous time that the input registers are written to. When
: The outputs are not updated at the same
LDAC
LDAC
goes low,
the DAC registers are updated with the contents of the input register.
Alternatively, the outputs of all DACs can be updated simulta­neously using the software
function by writing to Input
LDAC Register n and updating all DAC registers. Command 0011 is reserved for this software
An over the hardware
register gives the user extra flexibility and control
LDAC
LDAC
function.
LDAC
pin. This register allows the user to
select which combination of channels to simultaneously update when the hardware
pin is executed. Setting the
LDAC
LDAC
bit
register to 0 for a DAC channel means that this channel’s update is controlled by the
pin. If this bit is set to 1, this channel
LDAC
updates synchronously; that is, the DAC register is updated after new data is read, regardless of the state of the
effectively sees the for the
register mode of operation.) This flexibility is
LDAC
pin as being tied low. (See
LDAC
LDAC
Tabl e 15
pin. It
useful in applications where the user wants to simultaneously update select channels while the rest of the channels are synchronously updating.

POWER SUPPLY BYPASSING AND GROUNDING

When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5678 should have separate analog and digital sections. If the AD5678 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5678.
The power supply to the AD5678 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should physically be as close as possible to the device, with the 0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the 0.1 µF capacitor has low effective series resistance (ESR) and low effective series inductance (ESI), such as is typical of common ceramic types of capacitors. This
0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching.
The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board.
pin
pin. DAC channels see LDAC as 0.
DB19 to DB8
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Don’t cares
Setting
LDAC
bit to 1 overrides
LDAC
A
pin
Writing to the DAC using command 0110 loads the 8-bit
LDAC register (DB7 to DB0). The default for each channel is 0; that is, the DAC channel is updated regardless of the state of the
pin. See for the contents of the input shift register during the load
Table 15.
LDAC
0 1/0 1 X—don’t care
Table 16. 32-Bit Input Shift Register Contents for
MSB LSB
DB31 to DB28
X 0 1 1 0 X X X X X DAC H DAC G DAC F DAC E DAC D DAC C DAC B DAC
Don’t cares
pin works normally. Setting the bits to 1 means the
LDAC
LDAC
Tabl e 1 6
register mode of operation.
LDAC
Register
LDAC
Load DAC Register
Bits (DB7 to DB0)
LDAC
Pin
Operation
LDAC
Determined by LDAC DAC channels update, overriding the LDAC
LDAC
DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20
Command bits (C3 to C0) Address bits (A3 to A0)—
don’t cares
Overwrite Function
Rev. C | Page 25 of 28
AD5678

OUTLINE DIMENSIONS

5.10
5.00
4.90
4.50
4.40
4.30
PIN 1
1.05
1.00
0.80
0.15
0.05
COPLANARITY
0.10
4.50
4.40
4.30
PIN 1
0.15
0.05
14
1
0.65 BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
8
6.40 BSC
7
1.20
0.20
MAX
0.09
SEATING
PLANE
8° 0°
Figure 51. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
5.10
5.00
4.90
16
0.65 BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.10
0.30
0.19
9
6.40 BSC
81
1.20 MAX
SEATING
PLANE
0.20
0.09 8°
Figure 52. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.75
0.60
0.45
0.75
0.60
0.45
061908-A

ORDERING GUIDE

Package
Model1 Temperature Range Package Description
Option
AD5678BRUZ-1 −40°C to +105°C 14-Lead TSSOP RU-14 Zero ±16 LSB INL 1.25 V AD5678BRUZ-1REEL7 −40°C to +105°C 14-Lead TSSOP RU-14 Zero ±16 LSB INL 1.25 V AD5678BRUZ-2 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±16 LSB INL 2.5 V AD5678BRUZ-2REEL7 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±16 LSB INL 2.5 V AD5678ARUZ-2 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±32 LSB INL 2.5 V AD5678ARUZ-2REEL7 −40°C to +105°C 16-Lead TSSOP RU-16 Zero ±32 LSB INL 2.5 V
1
Z = RoHS Compliant Part.
Rev. C | Page 26 of 28
Power-On Reset to Code
Accuracy
Internal Reference
AD5678
NOTES
Rev. C | Page 27 of 28
AD5678
NOTES
©2005–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05299–0–2/11(C)
Rev. C | Page 28 of 28
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