Datasheet AD5602, AD5612, AD5622 Datasheet (ANALOG DEVICES)

I2C®-Compatible Interface in LFCSP and SC70
AD5602/AD5612/AD5622
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
Trademarks and registered trademarks are the property of their respective owners.
Fax: 781.461.3113 ©2005–2012 Analog Devices, Inc. All rights reserved.
AD5602/AD5612/AD5622
V
DD
V
OUT
GND
POWER-ON
RESET
DAC
REGISTER
8-/10-/12-BIT
DAC
INPUT
CONTROL
LOGIC
POWER-DOWN
CONTROL LOGIC
OUTPUT BUFFER
RESISTOR NETWORK
REF(+)
SCL SDA
ADDR
05446-001
2.7 V to 5.5 V, <100 µA, 8-/10-/12-Bit nanoDACs® with
Data Sheet

FEATURES

Single 8-, 10-, 12-bit DACs, 2 LSB INL 6-lead LFCSP and SC70 packages Micropower operation: 100 µA max @ 5 V Power-down to <150 nA @ 3 V
2.7 V to 5.5 V power supply Guaranteed monotonic by design Power-on reset to 0 V with brownout detection 3 power-down functions
2
I
C-compatible serial interface supports standard (100 kHz),
fast (400 kHz), and high speed (3.4 MHz) modes On-chip output buffer amplifier, rail-to-rail operation Qualified for automotive applications

APPLICATIONS

Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators

GENERAL DESCRIPTION

The AD5602/AD5612/AD5622, members of the nanoDAC family, are single 8-, 10-, 12-bit buffered voltage-out DACs that operate from a single 2.7 V to 5.5 V supply, consuming <100 µA at 5 V. These DACs come in tiny LFCSP and SC70 packages. Each DAC contains an on-chip precision output amplifier that allows rail-to-rail output swing to be achieved.
The AD5602/AD5612/AD5622 use a 2-wire I serial interface that operates in standard (100 kHz), fast (400 kHz), and high speed (3.4 MHz) modes.
The references for AD5602/AD5612/AD5622 are derived from the power supply inputs to give the widest dynamic output range. Each part incorporates a power-on reset circuit that ensures the DAC output powers up to 0 V and remains there until a valid write takes place to the device. The parts contain a power-down feature that reduces the current consumption of the devices to <150 nA at 3 V and provides software-selectable output loads while in power-down mode. The parts are put into power-down mode over the serial interface. The low power consumption of the AD5602/AD5612/AD5622 in normal operation makes them ideally suited for use in portable battery-operated equipment. The typical power consumption is 0.4 mW at 5 V.
2
C-compatible

FUNCTIONAL BLOCK DIAGRAM

Figure 1.
Table 1. Related Devices
Part No. Description
AD5601/AD5611/AD5621 2.7 V to 5.5 V, <100 µA, 8-, 10-, 12-bit
nanoDAC with SPI® interface in tiny LFCSP and SC70 packages

PRODUCT HIGHLIGHTS

1. Available in 6-lead LFCSP and SC70 packages.
2. Maximum 100 µA power consumption, single-supply
operation. These parts operate from a single 2.7 V to 5.5 V supply, typically consuming 0.2 mW at 3 V and 0.4 mW at 5 V, making them ideal for battery-powered applications.
3. The on-chip output buffer amplifier allows the output of
the DAC to swing rail-to-rail with a typical slew rate of
0.5 V/µs.
4. Reference derived from the power supply.
5. Standard, fast, and high speed mode I
6. Designed for very low power consumption.
7. Power-down capability. When powered down, the DAC
typically consumes <150 nA at 3 V.
8. Power-on reset and brownout detection.
2
C interface.
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may res ult from its use. Specifications subject to chang e without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700
www.analog.com
AD5602/AD5612/AD5622 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
2
I
C Timing Specifications ............................................................ 4
Timing Diagram ........................................................................... 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Terminology .................................................................................... 14
Theory of Operation ...................................................................... 15
D/A Section ................................................................................. 15
Resistor String ............................................................................. 15
Output Amplifier ........................................................................ 15
Serial Interface ................................................................................ 16
Input Register .............................................................................. 16
Power-On Reset .......................................................................... 17
Power-Down Modes .................................................................. 17
Write Operation.......................................................................... 18
Read Operation........................................................................... 19
High Speed Mode ....................................................................... 20
Applications ..................................................................................... 21
Choosing a Reference as Power Supply ................................... 21
Bipolar Operation....................................................................... 21
Power Supply Bypassing and Grounding ................................ 21
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 23

REVISION HISTORY

5/12—Rev. B to Rev. C
Added 6-lead LFCSP Package ........................................... Universal
Changes to Product Title ................................................................. 1
Changes to Ordering Guide .......................................................... 23
3/0
6—Rev. A to Rev. B
Changes to Table 2 ............................................................................ 3
Updates to Outline Dimensions ................................................... 22
Changes to Ordering Guide .......................................................... 23
8/05—Rev. 0 to Rev. A
Changes to Ordering Guide .......................................................... 22
6/05—Revision 0: Initial Version
Rev. C | Page 2 of 24
Data Sheet AD5602/AD5612/AD5622
AD5622
±2
LSB
B, Y versions
±6
LSB
A, W versions
1000
pF
RL = 2 kΩ
Output Noise Spectral Density
120 nV/Hz
DAC code = midscale, 10 kHz
IIN, Input Current
±1
µA
Floating-State Output Capacitance
2
pF

SPECIFICATIONS

VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND; all specifications T
Table 2.
A, B, W, Y Versions1 Parameter Min Typ Max Unit Test Conditions/Comments
STATIC PERFORMANCE DAC output unloaded
Resolution Bits
AD5602 8 AD5612 10 AD5622 12
Relative Accuracy2
AD5602 ±0.5 LSB B, Y versions AD5612 ±0.5 LSB B, Y versions ±4 LSB A version
Differential Nonlinearity2 ±1 LSB Guaranteed monotonic by design Zero Code Error 0.5 10 mV All 0s loaded to DAC register Offset Error ±0.063 ±10 mV Full-Scale Error 0.5 mV All 1s loaded to DAC register Gain Error ±0.0004 ±0.037 % of FSR Zero Code Error Drift 5 µV/°C Gain Temperature Coefficient 2 ppm of FSR/°C
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 VDD V Output Voltage Settling Time 6 10 µs Code ¼ to ¾ Slew Rate 0.5 V/µs Capacitive Load Stability 470 pF RL = ∞
MIN
to T
, unless otherwise noted.
MAX
Noise 2 DAC code = midscale, 0.1 Hz to 10 Hz
bandwidth Digital-to-Analog Glitch Impulse 5 nV-s 1 LSB change around major carry Digital Feedthrough 0.2 nV-s DC Output Impedance 0.5 Short Circuit Current 15 mA VDD = 3 V/5 V
LOGIC INPUTS (SDA, SCL)
V
, Input Low Voltage 0.3 × VDD V
INL
V
, Input High Voltage 0.7 × VDD V
INH
CIN, Pin Capacitance 2 pF V
, Input Hysteresis 0.1 × VDD V
HYST
LOGIC OUTPUTS (OPEN DRAIN)
VOL, Output Low Voltage 0.4 V I
0.6 V I
= 3 mA
SINK
= 6 mA
SINK
Floating-State Leakage Current ±1 µA
Rev. C | Page 3 of 24
AD5602/AD5612/AD5622 Data Sheet
High speed mode, CB = 400 pF
320 ns
t6
Standard mode
4 µs
t
, hold time (repeated) start condition
A, B, W, Y Versions1 Parameter Min Typ Max Unit Test Conditions/Comments
POWER REQUIREMENTS
VDD 2.7 5.5 V IDD (Normal Mode) DAC active and excluding load current
VDD = 4.5 V to 5.5 V 75 100 µA VIH = VDD and VIL = GND VDD = 2.7 V to 3.6 V 60 90 µA VIH = VDD and VIL = GND
IDD (All Power-Down Modes)
VDD = 4.5 V to 5.5 V 0.3 1 µA VIH = VDD and VIL = GND VDD = 2.7 V to 3.6 V 0.15 1 µA VIH = VDD and VIL = GND
POWER EFFICIENCY
I
96 % I
OUT/IDD
1
Temperature ranges for A, B versions: 40°C to +125°C, typical at 25°C.
2
Linearity calculated using a reduced code range 64 to 4032.
3
Guaranteed by design and characterization, not production tested.

I2C TIMING SPECIFICATIONS

VDD = 2.7 V to 5.5 V; all specifications T
Table 3.
Limit at T Parameter Conditions2 Min Max Unit Description
3
f
Standard mode 100 KHz Serial clock frequency
SCL
Fast mode 400 KHz High speed mode, CB = 100 pF 3.4 MHz High speed mode, CB = 400 pF 1.7 MHz t1 Standard mode 4 µs t Fast mode 0.6 µs High speed mode, CB = 100 pF 60 ns High speed mode, CB = 400 pF 120 ns t2 Standard mode 4.7 µs t Fast mode 1.3 µs High speed mode, CB = 100 pF 160 ns
MIN
to T
, f
= 3.4 MHz, unless otherwise noted.1
MAX
SCL
, T
MIN
MAX
HIGH
LOW
= 2 mA, VDD = 5 V
LOAD
, SCL high time
, SCL low time
t3 Standard mode 250 ns t Fast mode 100 ns High speed mode 10 ns t4 Standard mode 0 3.45 µs t Fast mode 0 0.9 µs High speed mode, CB = 100 pF 0 70 ns High speed mode, CB = 400 pF 0 150 ns t5 Standard mode 4.7 µs t Fast mode 0.6 µs High speed mode 160 ns
Fast mode 0.6 µs High speed mode 160 ns t7 Standard mode 4.7 µs t
Fast mode 1.3 µs
Rev. C | Page 4 of 24
, data setup time
SU ;D AT
, data hold time
HD ;D AT
set-up time for a repeated start condition
SU;STA,
HD ;STA
, bus free time between a stop and a start
BUF
condition
Data Sheet AD5602/AD5612/AD5622
High speed mode, CB = 400 pF
20
80
ns
High speed mode
0
10
ns
SCL
SDA
P S S P
t
8
t
6
t
5
t
3
t
10
t
9
t
4
t
6
t
1
t
7
t
2
t
11
t
12
05446-002
Limit at T Parameter Conditions2 Min Max Unit Description
t8 Standard mode 4 µs t Fast mode 0.6 µs High speed mode 160 ns t9 Standard mode 1000 ns t Fast mode 300 ns High speed mode, CB = 100 pF 10 80 ns High speed mode, CB = 400 pF 20 160 ns t10 Standard mode 300 ns t Fast mode 300 ns High speed mode, CB = 100 pF 10 80 ns High speed mode, CB = 400 pF 20 160 ns t11 Standard mode 1000 ns t Fast mode 300 ns High speed mode, CB = 100 pF 10 40 ns
t
Standard mode 1000 ns t
11A
Fast mode 300 ns High speed mode, CB = 100 pF 10 80 ns High speed mode, CB = 400 pF 20 160 ns t12 Standard mode 300 ns t Fast mode 300 ns High speed mode, CB = 100 pF 10 40 ns High speed mode, CB = 400 pF 20 80 ns
4
t
Fast mode 0 50 ns Pulse width of spike suppressed
SP
MIN
, T
MAX
, setup time for a stop condition
SU;STO
, rise time of SDA signal
RDA
, fall time of SDA signal
FDA
, rise time of SCL signal
RCL
, rise time of SCL signal after a repeated start
RCL1
condition and after an acknowledge bit
, fall time of SCL signal
FCL
1
See Figure 2. High speed mode timing specification applies to the AD5602-1/AD5612-1/AD5622-1 only. Standard and fast mode timing specifications apply to the
AD5602-1/AD5612-1/AD5622-1 and AD5602-2/AD5612-2/AD5622-2.
2
CB refers to the capacitance on the bus line.
3
The SDA and SCL timing is measured with the input filters enabled. Switching off the input filters improves the transfer rate but has a negative effect on EMC behavior
of the part.
4
Input filtering on the SCL and SDA inputs suppress noise spikes that are less than 50 ns for fast mode or 10 ns for high speed mode.

TIMING DIAGRAM

Figure 2. 2-Wire Serial Interface Timing Diagram
Rev. C | Page 5 of 24
AD5602/AD5612/AD5622 Data Sheet
human body and test equipment and can discharge without detection. Although this product features
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND –0.3 V to + 7.0 V Digital Input Voltage to GND –0.3 V to VDD + 0.3 V V
to GND –0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Extended Automotive (W, Y Versions) –40°C to +125°C Extended Industrial (A, B Versions)
Storage Temperature Range –65°C to +160°C Maximum Junction Temperature 150°C SC70 Package
θJA Thermal Impedance 332°C/W θJC Thermal Impedance 120°C/W
LFCSP Package
θJA Thermal Impedance 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C
ESD 2.0 kV
40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
degradation or loss of functionality.
Rev. C | Page 6 of 24
Data Sheet AD5602/AD5612/AD5622
ADDR
1
SCL
2
SDA
3
V
OUT
6
GND
5
V
DD
4
AD5602/ AD5612/
AD5622
TOP VIEW
(Not to Scale)
05446-003
AD5602/ AD5612/
A
D5622
TOP VIEW
(Not to S cale)
05446-051
3V
OUT
1ADDR
2GND
4 V
DD
6 SDA
5 SCL
NOTES
1. THE EXP OSED PAD SHOULD BE CONNECTED TO GRO UND ( GND).

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 3. SC70 Pin Configuration
Table 5. SC79 Pin Function Descriptions
Pin N o. Mnemonic Description
1 ADDR Three-State Address Input. Sets the two
least significant bits (Bit A1, Bit A0) of the 7-bit slave address (see Table 7).
2 SCL Serial Clock Line. This is used in
conjunction with the SDA line to clock data into or out of the 16-bit input register.
3 SDA Serial Data Line. This is used in
conjunction with the SCL line to clock data into or out of the 16-bit input register. It is a bidirectional, open-drain data line that should be pulled to the supply with an external pull-up resistor.
4 VDD Power Supply Input. These parts can be
operated from 2.7 V to 5.5 V, and VDD should be decoupled to GND.
5 GND Ground. The ground reference point for
all circuitry on the part.
6 V
Analog Output Voltage from the DAC.
OUT
The output amplifier has rail-to-rail operation.
Figure 4. LFCSP Pin Configuration
Table 6. LFCSP Pin Function Descriptions
Pin No. Mnemonic Description
1 ADDR Three-State Address Input. Sets the
two least significant bits (Bit A1, Bit A0) of the 7-bit slave address (see Table 7).
2 GND Ground. The ground reference point for
all circuitry on the part.
3 V
Analog Output Voltage from the DAC.
OUT
The output amplifier has rail-to-rail operation.
4 VDD Power Supply Input. These parts can be
operated from 2.7 V to 5.5 V, and VDD should be decoupled to GND.
5 SCL Serial Clock Line. This is used in
conjunction with the SDA line to clock data into or out of the 16-bit input register.
6 SDA Serial Data Line. This is used in
conjunction with the SCL line to clock data into or out of the 16-bit input register. It is a bidirectional, open-drain data line that should be pulled to the supply with an external pull-up resistor.
EPAD Exposed Pad. The exposed pad should
be connected to ground (GND).
Rev. C | Page 7 of 24
AD5602/AD5612/AD5622 Data Sheet
DAC CODE
INL ERROR ( LSB)
1.0
0.8
0.6
0.4
0.2 0
–1.0
–0.8
–0.6
–0.4
–0.2
0 1000500 20001500 350030002500 4000
V
DD
= 5V
T
A
= 25°C
05446-004
DAC CODE
DNL ERROR (L S B)
0.15
0
–0.20
–0.15
–0.10
0.10
–0.05
0.05
0 1000500 20001500 350030002500 4000
VDD= 5V T
A
= 25°C
05446-005
DAC CODE
INL ERROR ( LSB)
0.25
0.20
0.15
0.10
0.05 0
–0.25
–0.20
–0.15
–0.10
–0.05
0 400200 600 800 1000
VDD= 5V T
A
= 25°C
05446-047
DAC CODE
DNL ERROR (L S B)
0.05
0.04
0.03
0.02
0.01 0
–0.05
–0.04
–0.03
–0.02
–0.01
0 400200 600 800 1000
VDD= 5V T
A
= 25°C
05446-048
DAC CODE
INL ERROR ( LSB)
0.06
0.04
0.02
0
–0.06
–0.04
–0.02
0 10050 150 200 250
VDD= 5V T
A
= 25°C
05446-049
DAC CODE
DNL ERROR (L S B)
0.015
0.010
0.005
0
–0.015
–0.005
–0.010
0 10050 150 200 250
V
DD
= 5V
T
A
= 25°C
05446-050

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 5. Typical AD5622 Integral Nonlinearity Error
Figure 6. Typical AD5622 Differential Nonlinearity Error
Figure 8. Typical AD5612 Differential Nonlinearity Error
Figure 9. Typical AD5602 Integral Nonlinearity Error
Figure 7. Typical AD5612 Integral Nonlinearity Error
Figure 10. Typical AD5602 Differential Nonlinearity Error
Rev. C | Page 8 of 24
Data Sheet AD5602/AD5612/AD5622
DAC CODE
TUE (LSB)
1
0
–7
–6
–5
–4
–3
–2
–1
0 1000500 20001500 350030002500 4000
V
DD
= 5V
T
A
= 25°C
05446-006
V
DD
(V)
INL ERROR ( LSB)
0.8
0.6
–0.8
–0.6
–0.4
–0.2
0
0.2
0.4
2.7 3.2 4.23.7 5.24
.7
T
A
= 25°C
MAX INL
MIN INL
05446-007
VDD(V)
TUE (LSB)
0
–8
–7
–6
–5
–4
–3
–2
–1
2.7 3.2 4.23.7 5.24.7
TA= 25°C
MAX TUE
MIN TUE
05446-008
V
DD
(V)
DNL ERROR (L S B)
0.5
0.4
0.3
0.2
0.1
0
–0.3
–0.2
–0.1
2.7 3.2 4.23.7 5.24.7
TA= 25°C
MAX DNL
MIN DNL
05446-009
TEMPERATURE (°C)
INL ERROR ( LSB)
0.5
0.4
0.3
0.2
0.1
0
–0.3
–0.2
–0
.1
–40 0–20 604020 12010080
MAX INL = 5V
MAX INL = 3V
MIN INL = 5V MIN INL = 3V
05446-010
TEMPERATURE (°C)
TUE (LSB)
8
7
6
5
4
3
0
1
2
–40 0–20 604020 12010080
MAX TUE = 5V
MAX TUE = 3V
MIN TUE = 5V
MIN TUE = 3V
05446-011
Figure 11. Typical AD5622 Total Unadjusted Error
Figure 12. AD5622 INL Error vs. Supply
Figure 14. AD5622 DNL Error vs. Supply
Figure 15. AD5622 INL Error vs. Temperature (3 V/5 V Supply)
Figure 13. AD5622 Total Unadjusted Error vs. Supply
Figure 16. AD5622 Total Unadjusted Error vs. Temperature (3 V/5 V Supply)
Rev. C | Page 9 of 24
AD5602/AD5612/AD5622 Data Sheet
TEMPERATURE (°C)
DNL ERROR (L S B)
0.6
0.5
0.4
0.3
0.2
0.1
0
–0.3
–0.2
–0.1
–40 0–20 604020 12010080
MAX DNL = 5V
MAX DNL = 3V
MIN DNL = 5V
MIN DNL = 3V
05446-012
TEMPERATURE (°C)
ERROR (mV)
4
0
2
–2
–4
–8
–10
–6
–40 –20 0 604020 100 12080
ZERO CODE ERROR = 3V
FULL-SCALE ERROR = 3V
FULL-SCALE ERROR = 5V
ZERO CODE ERROR = 5V
05446-013
VDD(V)
ERROR (mV)
1
0
–1
–2
–3
–4
–5
–8
–7
–6
2.7 3.2 4.23.7 5.24.7
ZERO CODE ERROR
TA= 25°C
FULL-SCALE ERROR
05446-014
TEMPERATURE (°C)
ERROR (mV)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0
0.2
0.4
–40 0–20 604020 12010080
OFFSET ERROR = 5V
OFFSET ERROR = 3V
05446-015
TEMPERATURE (°C)
ERROR (%FSR)
0.00025
0.00020
0.00015
0.00010
0
0.00005
–40 0–20 604020 12010080
GAIN ERROR = 5V
GAIN ERROR = 3V
05446-016
0
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.
09
0.10
2.7 3.2 3.7 4.2 4.7 5.2 V
DD
(V)
I
DD
(µA)
T
A
= 25°C
0.01
05446-017
Figure 17. AD5622 DNL Error vs. Temperature (3 V/5 V Supply)
Figure 18. Zero Code/Full-Scale Error vs. Temperature (3 V/5 V Supply)
Figure 20. Offset Error vs. Temperature (3 V/5 V Supply)
Figure 21. Gain Error vs. Temperature ( 3 V/5 V Supply)
Figure 19. Zero Code/Full-Scale Error vs. Supply Voltage
Figure 22. Supply Current vs. Supply Voltage
Rev. C | Page 10 of 24
Data Sheet AD5602/AD5612/AD5622
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
–40 –20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
I
DD
(µA)
V
DD
= 3V
V
DD
= 5V
05446-018
0
10
20
30
40
50
60
70
0 2000 4000 6000 8000 10000 12000 14000 16000
DAC CODE
I
DD
(µA)
V
DD
= 5V
V
DD
= 3V
T
A
= 25°C
05446-019
V
LOGIC
(V)
I
DD
(µA)
900
800
700
600
500
400
0
100
200
300
0 0.5 1.0 2.52.01.5 5.04.54.03.53.0
SCL/SDA DECREASING V
DD
= 5V
SCL/SDA DECREASING V
DD
= 3V
SCL/SDA INCREASING V
DD
= 3V
SCL/SDA INCREASING V
DD
= 5V
05446-020
0
2
4
6
8
10
12
0.05456
0.05527
0.05599
0.05671
0.05742
0.05814
0.05885
0.06648
0.06710
0.06773
0.06835
0.06897
0.06960
0.07022
0.07084
0.07147
0.07209
0.07271
0.07334
IDD(µA)
FREQUENCY
VDD= 5V V
IH
= V
DD
VIL= GND T
A
= 25°C
V
DD
= 3V
V
IH
= V
DD
VIL= GND T
A
= 25°C
05446-021
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–15 –10 –5 0 5 10 15
I (mA)
ΔV
O
(V)
DAC LOADED WITH ZERO-SCALE CODE
V
DD
= 5V
T
A
= 25°C
DAC LOADED WITH FULL-SCALE CODE
05446-037
CH2
CH1
VDD= 5V T
A
= 25°C
V
DD
V
OUT
= 70mV
CH1 = 1V/DIV, CH2 = 20mV/DIV, TIME BASE = 20µs/DIV
05446-038
Figure 23. Supply Current vs. Temperature (3 V/5 V Supply)
Figure 24. Supply Current vs. Digital Input Code
Figure 26. I
Histogram (3 V/5 V Supply)
DD
Figure 27. Sink and Source Capability
Figure 25. Supply Current vs. SCL/SDA Logic Voltage
Figure 28. Power-On Reset to 0 V
Rev. C | Page 11 of 24
AD5602/AD5612/AD5622 Data Sheet
CH1 = 5V/DIV, CH2 = 1V/DIV, TIME BASE = 2µs/DIV
CH1
CH2
VDD= 5V T
A
= 25°C
05446-039
CH1 = 5V/DIV, CH2 = 1V/DIV, TIME BASE = 2µs/DIV
CH1
CH2
VDD= 5V T
A
= 25°C
05446-040
CH1 = 5V/DIV, CH2 = 1V/DIV, TIME BASE = 2µs/DIV
CH1
CH2
V
DD
= 5V
T
A
= 25°C
05446-041
CH1 = 1V/DIV, CH2 = 3V/DIV, TIME BASE = 50µs/DIV
CH2
CH1
V
DD
V
OUT
V
DD
= 5V
T
A
= 25°C
05446-042
SAMPLE NUMBER
AMPLITUDE (V)
0 100 200 300 400 500
2.458
2.456
2.454
2.452
2.450
2.448
2.446
2.444
2.442
2.440
2.438
2.436
V
DD
= 5V
T
A
= 25°C LOAD = 2kAND 220pF CODE 0x800 TO 0x7FF 10ns/SAMPLE NUMBER
05446-043
SAMPLE NUMBER
AMPLITUDE (V)
2.4278
2.4276
2.4274
2.4272
2.4270
2.4268
2.4266
2.4264
2.4262
2.4260 0 200100 300 400 500
V
DD
= 5V
T
A
= 25°C LOAD = 2kAND 220pF 10ns/SAMPLE NUMBER
05446-044
Figure 29. Exiting Power-Down Mode
Figure 30. Full-Scale Settling Time
Figure 32. V
OUT
vs. VDD
Figure 33. Digital-to-Analog Glitch Impulse
Figure 31. Half-Scale Settling Time
Figure 34. Digital Feedthrough
Rev. C | Page 12 of 24
Data Sheet AD5602/AD5612/AD5622
CH1
V
DD
= 5V
T
A
= 25°C
MIDSCALE LOADED
CH1 = 5µV/DIV
05446-045
0
100
200
300
400
500
600
700
100 1000 10000 100000
FREQUENCY (Hz)
OUTPUT NOISE SPECTRAL DENSITY (nV/ Hz)
FULL SCALE
ZERO SCALE
V
DD
= 5V
T
A
= 25°C
UNLOADED OUTPUT
MIDSCALE
05446-046
Figure 35. 1/f Noise, 0.1 Hz to 10 Hz Bandwidth
Figure 36. Output Noise Spectral Density
Rev. C | Page 13 of 24
AD5602/AD5612/AD5622 Data Sheet

TERMINOLOGY

Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot can be seen in Figure 5.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical DNL vs. code plot can be seen in Figure 6.
Zero Code Error Zero-code error is due to a combination of the offset errors in the DAC and output amplifier; it is a measure of the output error when zero code (0x0000) is loaded to the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5602/AD5612/AD5622 because the output of the DAC cannot go below 0 V. Zero-code error is expressed in m V. A plot of zero-code error vs. temperature can be seen in Figure 18.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded to the DAC register; it is expressed in percent of full-scale range. Ideally, the output should be V 1 LSB. A plot of full-scale error vs. temperature can be seen in Figure 18.
DD
Gain Error
Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from ideal expressed as a percent of the full-scale range.
Total Unadjusted Error (TUE)
Total unadjusted error is a measure of the output error taking all the various errors into account. A typical TUE vs. code plot can be seen in Figure 11.
Zero Code Error Drift
Zero code error drift is a measure of the change in zero code error with a change in temperature. It is expressed in µV/°C.
Gain Error Drift
Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000) (see Figure 33).
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but is measured when the DAC output is not updated. It is specified in nV-s and measured with a full-scale code change on the data bus, that is, from all 0s to all 1s, and vice versa (see Figure 34).
Rev. C | Page 14 of 24
Data Sheet AD5602/AD5612/AD5622
V
DD
V
OUT
GND
RESISTOR NETWORK
REF (+)
REF (–)
OUTPUT
AMPLIFIER
DAC REGISTER
05446-022
 
 
×=
n
DDOUT
D
VV
2
R
R
R
R
R
TO OUTPUT AMPLIFIER
05446-023

THEORY OF OPERATION

D/A SECTION

The AD5602/AD5612/AD5622 DACs are fabricated on a CMOS process. The architecture consists of a string DACs followed by an output buffer amplifier. Figure 37 shows a block diagram of the DAC architecture.
tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic.
Figure 37. DAC Architecture
Since the input coding to the DAC is straight binary, the ideal output voltage is given by
where: D is the decimal equivalent of the binary code that is loaded to the DAC register; it can range from 0 to 255 (AD5602), 0 to 1023 (AD5612), or 0 to 4095 (AD5622). n is the bit resolution of the DAC.

RESISTOR STRING

The resistor string structure is shown in Figure 38. It is simply a string of resistors, each of value R. The code loaded to the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is
Figure 38. Resistor String Structure

OUTPUT AMPLIFIER

The output buffer amplifier is capable of generating rail-to-rail voltages on its output, giving an output range of 0 V to V capable of driving a load of 2 kΩ in parallel with 1000 pF to GND. The source and sink capabilities of the output amplifier can be seen in Figure 27. The slew rate is 0.5 V/µs with a half­scale settling time of 5 µs with the output unloaded.
DD
. It is
Rev. C | Page 15 of 24
AD5602/AD5612/AD5622 Data Sheet
VDD 0 0
DATA
BITS
DB15 (MSB) DB0 (LSB)
0 0 PD1 PD0 D7 D6 D5 D4 D3 D2 D1 D0 X X X X
05446-024
DATA BITS
DB15 (MSB) DB0 (LSB)
0 0 PD1 PD0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X
05446-025
DATA BITS
DB15 (MSB) DB0 (LSB)
0 0 PD1 PD0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
05446-026

SERIAL INTERFACE

The AD5602/AD5612/AD5622 have 2-wire I2C-compatible serial interfaces (refer to I
2
C-Bus Specification, Version 2.1,
January 2000, available from Philips Semiconductor). The AD5602/AD5612/AD5622 can be connected to an I
2
C bus as a slave device, under the control of a master device. See Figure 2 for a timing diagram of a typical write sequence.
The AD5602/AD5612/AD5622 support standard (100 kHz), fast (400 kHz), and high speed (3.4 MHz) data transfer modes. Support is not provided for 10-bit addressing and general call addressing.
The AD5602/AD5612/AD5622 each have a 7-bit slave address. The five MSBs are 00011 and the two LSBs are determined by the state of the ADDR pin. The facility to make hardwired changes to ADDR allows the user to incorporate up to three of these devices on one bus as outlined in Table 7.
The 2-wire serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a start
condition, which is when a high-to-low transition on the SDA line occurs while SCL is high. The following byte is the address byte, which consists of the 7-bit slave address. The slave address corresponding to the transmitted address responds by pulling SDA low during the ninth clock pulse (this is termed the acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to, or read from, its shift register.
2. Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of SCL and remain stable during the high period of SCL.
3. When all data bits have been read or written, a stop
condition is established. In write mode, the master pulls the SDA line high during the 10th clock pulse to establish a stop condition. In read mode, the master issues a no acknowledge for the ninth clock pulse (that is, the SDA line remains high). The master then brings the SDA line low before the 10th clock pulse, and then high during the 10th clock pulse to establish a stop condition.
Table 7. Device Address Selection
ADDR A1 A0
GND 1 1
NC (No Connection) 1 0

INPUT REGISTER

The input register is 16 bits wide. Figure 39, Figure 40, and Figure 41 illustrate the contents of the input register for each part. Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCL. The timing diagram for this operation is shown in Figure 2. The 16-bit word consists of four control bits followed by 8, 10, or 12 bits of data, depending on the device type. MSB (DB15) is loaded first. The first two bits are reserved bits that must be set to zero, the next two bits are control bits that select the mode of operation of the device (normal mode or any one of three power-down modes). See the Power-Down Modes section for a complete description. The remaining bits are left-justified DAC data bits, starting with the MSB and ending with the LSB.
Figure 39. AD5602 Input Register Contents
Figure 40. AD5612 Input Register Contents
Figure 41. AD5622 Input Register Contents
Rev. C | Page 16 of 24
Data Sheet AD5602/AD5612/AD5622
POWER-DOWN
CIRCUITRY
RES
ISTOR
NETWORK
V
OUT
RESISTOR
STRING DAC
AMPLIFIER
05446-027

POWER-ON RESET

The AD5602/AD5612/AD5622 each contain a power-on reset circuit that controls the output voltage during power-up. The DAC register is filled with zeros and the output voltage is 0 V where it remains until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the DAC output while it is in the process of powering up.

POWER-DOWN MODES

The AD5602/AD5612/AD5622 each contain four separate modes of operation. These modes are software-programmable by setting Bit PD1 and Bit PD0 in the control register. Table 8 shows how the state of the bits corresponds to the mode of operation of the device.
Table 8. Modes of Operation
PD1 PD0 Operating Mode
0 0 Normal operation 0 1 Power-down (1 kΩ load to GND) 1 0 Power-down (100 kΩ load to GND) 1 1 Power-down (Three-state output)
When both bits are set to 0, the part works normally with its usual power consumption of 100 µA maximum at 5 V. However, for the three power-down modes, the supply current falls to <150 nA (at 3 V). Not only does the supply current fall, but the output stage is internally switched from the output of the amplifier to a resistor network of known values. This gives the advantage of knowing the output impedance of the part while the part is in power-down mode. There are three different options. The output is connected internally to GND through a 1 kΩ resistor, a 100 kΩ resistor, or it is left open-circuited (three-state). Figure 42 shows the output stage.
Figure 42. Output Stage During Power-Down
The bias generator, output amplifier, resistor string, and other associated linear circuitry are all shut down when the power­down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power-down is typically 14 µs for V
= 5 V and 17 µs for VDD =
DD
3 V (see Figure 29).
Rev. C | Page 17 of 24
AD5602/AD5612/AD5622 Data Sheet
SCL
SDA
START BY
MASTER
ACK. BY
AD5602
ACK. BY
AD5602
ACK. BY
AD5602
STOP BY
MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1
9 9
91
0 0 1 1 A1 A0 R/W 0 0 PD1 PD0 D7 D6 D5 D4
D3 D2 D1 D0 X X X X
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE
05446-028
SCL
SDA
START BY
MASTER
ACK. BY
AD5612
ACK. BY
AD5612
ACK. BY
AD5612
STOP BY
MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1
9 9
91
0 0 1 1 A1 A0 R/W 0 0 PD1 PD0 D9 D8 D7 D6
D5 D4 D3 D2 D1 D0 X X
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE
05446-029
SCL
SDA
START BY
MASTER
ACK. BY
AD5622
ACK. BY
AD5622
ACK. BY
AD5622
STOP BY
MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1
9 9
91
0 0 1 1 A1 A0 R/W 0 0 PD1 PD0 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE
05446-030

WRITE OPERATION

When writing to the AD5602/AD5612/AD5622, the user must begin with a start command followed by an address byte (R/
0), after which the DAC acknowledges that it is prepared to receive data by pulling SDA low.
W
=
Two bytes of data are then written to the DAC, the most significant byte followed by the least significant byte as shown in Figure 40; both of these data bytes are acknowledged by the AD5602/AD5612/AD5622. A stop condition follows. The write operations for the three DACs are shown in Figure 43, Figure 44, and Figure 45.
Figure 43. AD5602 Write Sequence
Figure 44. AD5612 Write Sequence
Figure 45. AD5622 Write Sequence
Rev. C | Page 18 of 24
Data Sheet AD5602/AD5612/AD5622
SCL
SDA
START BY
MASTER
ACK. BY
AD5602
ACK. BY MASTER
NO ACK. BY
MASTER
STOP BY MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE FROM AD5602
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1 9
91
0 0 1 1 A1 A0 R/W PD1 PD0 D7 D6 D5 D4 D3 D2
D1 D0 0 0 0 0 0 0
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE FROM AD5602
05446-031
SCL
SDA
START BY
MASTER
ACK. BY
AD5612
ACK. BY MASTER
NO ACK. BY
MASTER
STOP BY MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE FROM AD5612
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1 9
91
0 0 1 1 A1 A0 R/W PD1 PD0 D9 D8 D7 D6 D5 D4
D3 D2 D1 D0 0 0
0 0
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE FROM AD5612
05446-032
SCL
SDA
START BY
MASTER
ACK. BY
AD5622
ACK. BY MASTER
NO ACK. BY
MASTER
STOP BY MASTER
FRAME 2
MOST SIGNIFICANT DATA BYTE FROM AD5622
FRAME 1
SERIAL BUS ADDRESS BYTE
0
1 9
1 9
91
0 0 1 1 A1 A0 R/W PD1 PD0 D11 D10 D9 D8 D7 D6
D5 D4 D3 D2 D1 D0
0 0
SCL (CONTINUED)
SDA (CONTINUED)
FRAME 3
LEAST SIGNIFICANT DATA BYTE FROM AD5622
05446-033

READ OPERATION

When reading data back from the AD5602/AD5612/AD5622, the user begins with a start command followed by an address byte (R/
= 1), after which the DAC acknowledges that it is
W
prepared to transmit data by pulling SDA low. Two bytes of data are then read from the DAC, which are both acknowledged by the master as shown in Figure 46, Figure 47, and Figure 48. A stop condition follows.
Figure 46. AD5602 Read Sequence
Figure 47. AD5612 Read Sequence
Figure 48. AD5622 Read Sequence
Rev. C | Page 19 of 24
AD5602/AD5612/AD5622 Data Sheet
1 9
91
0 0 0 0 1 X X X 0 0 0 1 1 A1 A0
START BY
MASTER
ACK. BY
AD56x2
NACK. SR
SERIAL BUS ADDR
ESS BYTEHS-MODE MASTER CODE
HIGH-SPEED MODE
FAST M
ODE
SCL
SDA
R/W
05446-034

HIGH SPEED MODE

High speed mode communication commences after the master addresses all devices connected to the bus with the Master Code 00001XXX to indicate that a high speed mode transfer is to begin. No device connected to the bus is permitted to acknowledge the high speed master code, therefore, the code is followed by a no acknowledge. The master must then issue a
repeated start followed by the device address. The selected device then acknowledges its address. All devices continue to operate in high speed mode until the master issues a stop condition. When the stop condition is issued, the devices return to standard/fast mode.
Figure 49. Placing the AD5602/AD5612/AD5622 into High Speed Mode
Rev. C | Page 20 of 24
Data Sheet AD5602/AD5612/AD5622
AD5602/ AD5612/
AD5622
SCL SDA
7V
5V
V
OUT
= 0V TO 5V
ADR425
05446-035
ADR395
±6
25
5
 
 
 
 
×
 
 
+
×
 
 
×=
R1
R2
V
R1
R2R1D
VV
DD
n
DDO
2
V5
2
10
 
 
×
=
n
O
D
V
+5V
–5V
AD820/ OP295
+5V
AD5602/ AD5612/
AD5622
10µF
0.1µF
V
DD
V
OUT
R1
10k
SDA SCL
R2
10k
±5V OUT
05446-036

APPLICATIONS

CHOOSING A REFERENCE AS POWER SUPPLY

The AD5602/AD5612/AD5622 come in tiny LFCSP and SC70 packages with less than 100 µA supply current, thereby making the choice of reference dependent upon the application requirement. For space-saving applications, the ADR425 is available in an SC70 package with excellent drift at 3ppm/°C. It also provides very good noise performance at 3.4 µV p-p in the
0.1 Hz to 10 Hz range.
Because the supply current required by the AD5602/AD5612/ AD5622 DACs is extremely low, they are ideal for low supply applications. The ADR293 voltage reference is recommended in this case. This requires 15 µA of quiescent current and can therefore drive multiple DACs in the one system, if required.
With V
This is an output voltage range of ±5 V with 0x000 corresponding to a −5 V output, and 0xFFF corresponding to a +5 V output.
= 5 V, R1 = R2 = 10 kΩ
DD
Figure 51. Bipolar Operation with the AD5602/AD5612/AD5622

POWER SUPPLY BYPASSING AND GROUNDING

When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5602/
Figure 50. ADR425 as Power Supply
Examples of some recommended precision references for use as supplies to the AD5602/AD5612/AD5622 are shown in Table 9.
Table 9. Recommended Precision References
Part No.
Initial Accuracy (mV max)
Temper ature Drift (ppm/°C max)
0.1 Hz to 10 Hz Noise (µV p-p typ)
ADR435 ±6 3 3.4 ADR425 ±6 3 3.4 ADR02 ±5 3 15

BIPOLAR OPERATION

The AD5602/AD5612/AD5622 have been designed for single­supply operation, but a bipolar output range is also possible using the circuit in Figure 51. The circuit in Figure 51 gives an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an AD820 or an OP295 as the output amplifier.
The output voltage for any input code can be calculated as
where:
D represents the input code in decimal. n represents the bit resolution of the DAC.
Rev. C | Page 21 of 24
AD5612/AD5622 should have separate analog and digital sections, each having its own area of the board. If the AD5602, AD5612, or AD5622 is in a system where other devices require an AGND to DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5602/AD5612/AD5622.
The power supply to the AD5602/AD5612/AD5622 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should be physically as close as possible to the device with the
0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the
0.1 µF capacitor has low effective series resistance (ESR) and effective series inductance (ESI), such as common ceramic types. This 0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching.
The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, the microstrip technique is not always possible with a 2-layer board.
AD5602/AD5612/AD5622 Data Sheet
1.30BSC
C
OMPLIANT TO JEDEC STANDARDS MO-203-AB
1.
00
0.90
0.70
0.46
0.36
0.26
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
072809-A
0.10 MAX
1.10
0.80
0.40
0.10
0.22
0.08
3
1 2
46
5
0.65BSC
COPLANARITY
0.10
SEATING PLANE
0.30
0.15
1.50
1.40
1.30
0.45
0.40
0.35
TOP VIEW
6
1
4
3
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.00 MIN
0.65 REF
EXPOSED
PAD
PIN 1 INDICATOR (R 0.15)
FOR PROP E R CONNECTION O F THE EXPOSED PAD, REFER TO THE PIN CO NFIGURATION AND FUNCTIO N DE S CRIPTIONS SECTION OF THIS DATA SHEET.
03-29-2012-B
2.10
2.00
1.90
3.10
3.00
2.90
COMPLIANTTOJEDEC STANDARDS MO-229
COPLANARITY
0.08
0.20 MIN
0.35
0.30
0.25

OUTLINE DIMENSIONS

Figure 52. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
Figure 53. 6-Lead Lead Frame Chip Scale Package [LFCSP_WD]
2.00 x 3.00 mm Body, Very Very Thin, Dual Lead (CP-6-5)
Dimensions shown in millimeters
Rev. C | Page 22 of 24
Data Sheet AD5602/AD5612/AD5622
I2C Interface
Power
AD5602BCPZ-2-RL7
±0.5 LSB
Standard, fast
−40°C to +85°C
2.7 V to 5.5 V
6 Lead LFCSP_WD
CP-6-5
D0
AD5612YKSZ-1REEL7
±0.5 LSB
Standard, fast, and
−40°C to +125°C
2.7 V to 5.5 V
6-Lead SC70
KS-6
D5T AD5612ACPZ-2-RL7
±4 LSB
Standard, fast
−40°C to +85°C
2.7 V to 5.5 V
6 Lead LFCSP_WD
CP-6-5
D2
high speed

ORDERING GUIDE

Modes Supported
Model
1, 2
INL (max)
AD5602YKSZ-1500RL7 ±0.5 LSB Standard, fast and
Temperature Range
Supply Range
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5W
Package Description
Package Option
Branding
high speed
AD5602YKSZ-1REEL7 ±0.5 LSB Standard, fast and
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5W
high speed AD5602BKSZ-2500RL7 ±0.5 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5X AD5602BKSZ-2REEL7 ±0.5 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5X
AD5602YKSZ-2500RL7 ±0.5 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5Y AD5602YKSZ-2REEL7 ±0.5 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5Y AD5612YKSZ-1500RL7 ±0.5 LSB Standard, fast, and
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5T
high speed
high speed AD5612BKSZ-2500RL7 ±0.5 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5U AD5612BKSZ-2REEL7 ±0.5 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5U AD5612AKSZ-2500RL7 ±4 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D60 AD5612AKSZ-2REEL7 ±4 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D60
AD5612YKSZ-2500RL7 ±0.5 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5S AD5612YKSZ-2REEL7 ±0.5 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5S AD5622YKSZ-1500RL7 ±2 LSB Standard, fast, and
AD5622YKSZ-1REEL7 ±2 LSB Standard, fast, and
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5M
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5M
high speed AD5622BKSZ-2500RL7 ±2 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5N AD5622BKSZ-2REEL7 ±2 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5N AD5622ACPZ-2-RL7 ±6 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6 Lead LFCSP_WD CP-6-5 D1 AD5622YKSZ-2500RL7 ±2 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5P AD5622YKSZ-2REEL7 ±2 LSB Standard, fast −40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5P AD5622WKSZ-1500RL7 ±6 LSB Standard, fast, and
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5Q
high speed AD5622WKSZ-1REEL7 ±6 LSB Standard, fast, and
−40°C to +125°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5Q
high speed AD5622AKSZ-2500RL7 ±6 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5R AD5622AKSZ-2REEL7 ±6 LSB Standard, fast −40°C to +85°C 2.7 V to 5.5 V 6-Lead SC70 KS-6 D5R
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications

AUTOMOTIVE PRODUCTS

The AD5622WKSZ models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.
Rev. C | Page 23 of 24
AD5602/AD5612/AD5622 Data Sheet
©2005–2012 Analog Devices, Inc. All rights reserved. Trademarks and
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I
2
C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
registered trademarks are the property of their respective owners. D05446-0-5/12(D)
Rev. C | Page 24 of 24
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