12-bit successive approximation ADC
16 inputs with sequencer
Fast throughput rate: 1 MSPS
Wide input bandwidth: 70 dB SNR at f
Output channels
16 outputs with 12-bit DACs
On-chip 2.5 V reference
Hardware
function to programmable code
CLR
Rail-to-rail operation
Operational amplifiers
LDAC
and
DSCLK
DSYNC1
DSYNC2
DDIN
LDAC
CLR
override function
LDAC
POWER-ON
INTERFACE
ADCV
RESET
DAC
LOGIC
= 50 kHz
IN
DD
DACVDD (×2)
with Integrated Amplifiers
Offset voltage: 2.2 mV maximum
Low input bias current: 1 pA maximum
Single supply operation
Low noise: 22 nV/√Hz
Unity gain stable
Flexible serial interface
SPI-/QSPI-/MICROWIRE-/DSP-compatible
−40°C to +85°C operation
APPLICATIONS
Optical line cards
Base stations
General-purpose analog I/O
Monitoring and control
FUNCTIONAL BLOCK DIAGRAM
REFIN1/VREFOUT1
1.25V/2.5V
STRING
DAC 0
STRING
DAC 7
STRING
DAC 8
REF
BUFFER
BUFFER
BUFFER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGIS TER
V1+
V2+
LDAC
REGIS TER
REGIS TER
REGISTER
V1– V2–
DAC
DAC
DAC
POWER-DOWN
LOGIC
AD5590
VOUT0
VOUT7
VOUT8
INPUT
REGIS TER
V
DRIVE
ASCLK
ASYNC
ADIN
ADOUT
IN0(–)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The AD5590 is a 16-channel input and 16-channel output
analog I/O port with eight uncommitted amplifiers, operating
from a single 4.5 V to 5.25 V supply. The AD5590 comprises
16 input channels multiplexed into a 1 MSPS, 12-bit successive
approximation ADC with a sequencer to allow a preprogrammed
selection of channels to be converted sequentially. The ADC
contains a low noise, wide bandwidth track-and-hold amplifier
that can handle input frequencies in excess of 1 MHz.
The conversion process and data acquisition are controlled using
ASYNC
and the serial clock signal, allowing the device to easily
interface with microprocessors or DSPs. The input signal is
sampled on the falling edge of
initiated at this point. There are no pipeline delays associated
with the ADC. By setting the relevant bits in the control register,
the analog input range for the ADC can be selected to be a 0 V
to V
input or a 0 V to 2 × V
REFA
or twos complement output coding. The conversion time is
determined by the ASCLK frequency because it is also used
as the master clock to control the conversion.
ASYNC
and conversion is also
with either straight binary
REFA
The DAC section of the AD5590 comprises sixteen 12-bit DACs
divided into two groups of eight. Each group has an on-chip
reference. The on-board references are off at power-up, allowing
the use of external references. The internal references are enabled
via a software write.
The AD5590 incorporates a power-on reset circuit that ensures
that the DAC outputs power up to 0 V and remain powered up
at this level until a valid write takes place. The DAC contains a
power-down feature that reduces the current consumption of
the device and provides software-selectable output loads while
in power-down mode for any or all DAC channels. The outputs
of all DACs can be updated simultaneously using the
function, with the added functionality of user-selectable DAC
channels to simultaneously update. There is also an asynchronous
CLR
that updates all DACs to a user-programmable code: zero
scale, midscale, or full scale.
The AD5590 contains eight low noise, single-supply amplifiers.
These amplifiers can be used for signal conditioning for the
ADCs, DACs, or other independent circuitry, if required.
LDAC
Rev. 0 | Page 3 of 44
AD5590
www.BDTIC.com/ADI
SPECIFICATIONS
ADC SPECIFICATIONS
ADCVDD = V
= 2.7 V to 5.25 V
DRIVE
= 2.5 V, f
REFA
1
= 20 MHz, TA = T
SCLK
MIN
to T
, unless otherwise noted.
MAX
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE fIN = 50 kHz sine wave, f
2
= 20 MHz
SCLK
Signal-to-(Noise + Distortion) (SINAD)3 68.5 70 dB @ 5 V
70.5 dB @ 3 V
Signal-to-Noise Ratio (SNR)3 69 70 dB @ 5 V
70.5 dB @ 3 V
Total Harmonic Distortion (THD)
3
−74 −82 dB @ 5 V
−82 dB @ 3 V
Peak Harmonic or Spurious Noise (SFDR)
Resolution 12 Bits
Integral Nonlinearity −1 +1 LSB
Differential Nonlinearity −1 +1.5 LSB Guaranteed no missing codes to 12 bits
0 V to V
Input Range Straight binary output coding
REFA
Offset Error −10 ±0.6 +10 LSB
Offset Error Match 3.5 LSB
Gain Error −2 +2 LSB
Gain Error Match −0.8 +0.8 LSB
0 V to 2 × V
Input Range
REFA
−V
REFA
to +V
biased about V
REFA
REFA
with
twos complement output coding offset
Positive Gain Error −2 +2 LSB
Positive Gain Error Match −0.8 +0.8 LSB
Zero-Code Error −8 ±0.6 +8 LSB
Zero-Code Error Match 2 LSB
Negative Gain Error −1 +1 LSB
Negative Gain Error Match −0.8 +0.8 LSB
ANALOG INPUT
Input Voltage Ranges 0 to V
0 to 2 × V
V Range bit set to 1
REFA
V
REFA
Range bit set to 0, ADCV
to 5.25 V for 0 V to 2 × V
DD/VDRIVE
REFAS
= 4.75 V
DC Leakage Current −1 +1 µA
4
Input Capacitance
20 pF
REFERENCE INPUT
V
Input Voltage 2.5 V ±1% specified performance
REFA
DC Leakage Current −1 +1 µA
V
Input Impedance
REFA
4
36 kΩ f
SAMPLE
= 1 MSPS
Rev. 0 | Page 4 of 44
AD5590
www.BDTIC.com/ADI
Parameter Min Typ Max Unit Test Conditions/Comments
2
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
IN
Input Capacitance, C
0.7 × V
INH
0.3 × V
INL
V
DRIVE
V
DRIVE
−1 +1 µA Typically 10 nA
1, 4
IN
10 pF
LOGIC OUTPUTS
Output High Voltage, VOH V
Output Low Voltage, VOL 0.4 V I
Floating State Leakage Current ±10 µA
Floating State Output Capacitance4 10 pF
− 0.2 V I
DRIVE
= 200 µA; VDD = 2.7 V to 5.25 V
SOURCE
= 200 µA
SINK
weak/TRI
weak/TRI
bit set to 0
bit set to 0
Output Coding Straight (Natural) Binary coding bit set to 1
Twos Complement coding bit set to 0
CONVERSION RATE4
Conversion Time 800 ns 16 ASCLK cycles, ASCLK = 20 MHz
Track-and-Hold Acquisition Time
3
300 ns Sine wave input
300 ns Full-scale step input
Throughput Rate 1 MSPS @ 5 V (see the Serial Interface section)
POWER REQUIREMENTS
ADCVDD 2.7 5.25 V
V
2.7 5.25 V
DRIVE
I
0.15 µA
DRIVE
5
I
DD
Digital inputs = 0 V or V
DRIVE
Normal Mode, Static 750 µA VDD = 4.75 V to 5.25 V, ASCLK on or off
Normal Mode, Operational
= Maximum Throughput)
(f
S
2.5 mA V
Autostandby Mode 1.55 mA f
= 4.75 V to 5.25 V, f
DD
= 500 kSPS
SAMPLE
= 20 MHz
SCLK
100 µA Static
Autoshutdown Mode 960 µA f
= 250 kSPS
SAMPLE
0.5 µA Static
Full Shutdown Mode 0.02 0.5 µA ASCLK on or off
Power Dissipation
Normal Mode, Operational 12.5 mW ADCVDD = 5 V, f
= 20 MHz
SCLK
Autostandby Mode, Static 500 µW ADCVDD = 5 V
Autoshutdown Mode, Static 2.5 µW ADCVDD = 5 V
Full Shutdown Mode 2.5 µW ADCVDD = 5 V
1
Specifications apply for f
2
Temperature range: −40°C to +85°C.
3
See the Terminology section.
4
Guaranteed by design and characterization. Not production tested.
5
See the ADC Power vs. Throughput Rate section.
up to 20 MHz. For serial interfacing requirements, see the Timing Specifications section.
SCLK
Rev. 0 | Page 5 of 44
AD5590
www.BDTIC.com/ADI
DAC SPECIFICATIONS
DACVDD = 4.5 V to 5.25 V, RL = 2 kΩ to DACGND, CL = 200 pF to DACGND, V
unless otherwise noted.
REFIN1
= V
= DACVDD. All specifications T
REFIN1
MIN
to T
MAX
,
Table 2.
Parameter Min Typ Max Unit Conditions/Comments
2
STATIC PERFORMANCE
1
Resolution 12 Bits
Integrated Nonlinearity (INL) −3 ±0.5 +3 LSB See Figure 6
Differential Nonlinearity (DNL) −0.25 +0.25 LSB Guaranteed monotonic by design; see Figure 7
Zero-Code Error 1 12 mV All 0s loaded to DAC register; see Figure 11
Zero-Code Error Drift
3
±2 µV/°C
Full-Scale Error −1 −0.2 % FSR All 1s loaded to DAC register
Gain Error −1 +1 % FSR
Gain Temperature Coefficient
3
±2.5 ppm Of FSR/°C
Offset Error −11 ±5 +11 mV
3
DC Power Supply Rejection Ratio
DC Crosstalk
3
External Reference 10 µV
–80 dB DACVDD ± 10%
Due to full-scale output change, R
DACV
= 2 kΩ to DACGND or
DD
L
5 µV/mA Due to load current change
10 µV Due to powering down (per channel)
Internal Reference 25 µV
Due to full-scale output change, R
DACV
DD
= 2 kΩ to DACGND or
L
10 µV/mA Due to load current change
OUTPUT CHARACTERISTICS
3
Output Voltage Range 0 DACVDD V
Capacitive Load Stability 2 nF RL = ∞
10 nF RL = 2 kΩ
DC Output Impedance 0.5 Ω
Short-Circuit Current 30 mA DACVDD = 5 V
Power-Up Time 4 µs Coming out of power-down mode, DACVDD = 5 V
REFERENCE INPUTS
Reference Current 40 50 µA V
= DACVDD = 5.5 V (per DAC channel)
REFINx
Reference Input Range 0 DACVDD V
Reference Input Impedance
3
14.6 kΩ
REFERENCE OUTPUT
Output Voltage 2.495 2.505 V At ambient
Reference Temperature Coefficient
Reference Output Impedance
3
±10 ppm/°C
3
7.5 kΩ
LOGIC INPUTS
Input Current −3 +3 µA All digital inputs
Input Low Voltage, V
Input High Voltage, V
Pin Capacitance
0.8 V DACVDD = 5 V
INL
2 V DACVDD = 5 V
INH
3
5 pF
Rev. 0 | Page 6 of 44
AD5590
www.BDTIC.com/ADI
Parameter Min Typ Max Unit Conditions/Comments
1
POWER REQUIREMENTS
DACVDD 4.5 5.5 V
All digital inputs at 0 or DACV
, DAC active, excludes load
DD
current
IDD (Normal Mode)
4
V
= DACVDD = 4.5 V to 5.5 V, VIL = DACGND
IH
2.6 3.2 mA Internal reference off
4 5 mA Internal reference on
DACIDD (All Power-Down Modes)
5
DACVDD 0.8 2 µA VIH = DACVDD = 4.5 V to 5.5 V, VIL = DACGND
1
Temperature range is −40°C to +85°C, typical at 25°C.
2
Linearity calculated using a reduced code range of Code 32 to Code 4064. Output unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All sixteen DACs powered down.
DAC AC Characteristics
DACVDD = 4.5 V to 5.25 V, RL = 2 kΩ to DACGND, CL = 200 pF to DACGND, V
REFIN1
= V
= DACVDD. All specifications T
REFIN1
unless otherwise noted.
Table 3.
Parameter
1, 2
Min Typ Max Unit Conditions/Comments
3
Output Voltage Settling Time 6 10 µs ¼ to ¾ scale settling to ±2 LSB
Slew Rate 1.5 V/µs
Digital-to-Analog Glitch Impulse 4 nV-sec 1 LSB change around major carry (see Figure 17)
Digital Feedthrough 0.1 nV-sec
Reference Feedthrough −90 dB V
REFIN1
= V
= 2 V ± 0.1 V p-p, frequency = 10 Hz to 20 MHz
REFIN2
Digital Crosstalk 0.5 nV-sec
Analog Crosstalk 2.5 nV-sec
DAC-to-DAC Crosstalk 3 nV-sec
Multiplying Bandwidth 340 kHz V
Total Harmonic Distortion −80 dB V
Offset Voltage VOS 0.4 2.2 mV −0.3 V < VCM < +5.3 V
2.2 mV −40°C < TA < +85°C, −0.3 V < VCM < +5.2 V
Offset Voltage Drift
Input Bias Current
110 pA −40°C < TA < +85°C
Input Offset Current
50 pA −40°C < TA < +85°C
Common-Mode Rejection Ratio CMRR 95 dB 0 V < VCM < 5 V
68 dB −40°C < TA < +85°C
Large Signal Voltage Gain AVO 235 400 V/mV RL = 10 kΩ, 0.5 V < V
Input Capacitance1 C
C
OUTPUT CHARACTERISTICS
Output Voltage High VOH 4.95 4.98 V IL = 1 mA
4.9 V −40°C to +85°C
4.7 V IL = 10 mA
4.50 V −40°C to +85°C
Output Voltage Low VOL 20 30 mV IL = 1 mA
50 mV −40°C to +85°C
190 275 mV IL = 10 mA
335 mV −40°C to +85°C
Short-Circuit Current
Closed-Loop Output Impedance
POWER SUPPLY
Power Supply Span (V+ to V−) 5 V
Power Supply Rejection Ratio PSRR 67 94 dB 1.8 V < VSY < 5 V
64 dB −40°C < TA < +85°C
Supply Current per Amplifier ISY 38 µA V
50 60 µA −40°C <TA < +85°C
DYNAMIC PERFORMANCE1
Guaranteed by design and characterization. Not production tested.
1
1
I
1
I
1
I
1
Z
VOS/T 1 4.5 µV/°C −40°C < TA < +85°C
0.2 1 pA
B
0.1 0.5 pA
OS
2 pF
DIFF
7 pF
CM
±80 mA
SC
15 Ω f = 10 kHz, AV = 1
OUT
= VSY/2
OUT
S
23 s G = ±1, 2 V step, CL = 20 pF, RL = 1 kΩ
OUT
< 4.5 V
Rev. 0 | Page 8 of 44
AD5590
A
T
www.BDTIC.com/ADI
TIMING SPECIFICATIONS
ADC Timing Characteristics
ADCVDD = 2.7 V to 5.25 V, V
Table 5.
Parameter
f
SCLK
1
Limit at T
2 10 kHz min
20 MHz min
t
16 × t
CONVER T
t
50 ns min
QUIET
t2 10 ns min
3
t
14 ns max
3
t3b4 20 ns min Data hold time
3
t
40 ns max Data access time after ASCLK falling edge
4
t5 0.4 × t
t6 0.4 × t
t7 15 ns min ASCLK to ADOUT valid hold time
5
t
8
15/50 ns min/max ASCLK falling edge to ADOUT high impedance
t9 20 ns min ADIN setup time prior to ASCLK falling edge
t10 5 ns min ADIN Hold time prior to ASCLK falling edge
t11 20 ns min
t12 1 µs max
1
Guaranteed by design and characterization. Not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of ADCVDD) and timed from a voltage
level of 1.6 V.
2
Maximum ASCLK frequency is 50 MHz at ADCVDD = 2.7 V to 5.5 V. Guaranteed by design and characterization; not production tested.
3
Measured with the load circuit of Figure 3 and defined as the time required for the output to cross 0.4 V or 0.7 × V
4
t3b represents a worst-case figure for having ADD3 available on the ADOUT line, that is, if the ADC goes back into three-state at the end of a conversion and some
other device takes control of the bus between conversions, the user needs to wait a maximum time of t3b before having ADD3 valid on the ADOUT line. If the ADOUT
line is weakly driven to ADD3 between conversions, then the user typically needs to wait 17 ns at 3 V and 12 ns at 5 V after the
valid on ADOUT.
5
t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 3. The measured number is then extrapolated
back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t8, quoted in the timing characteristics, is the true bus relinquish
time of the part and is independent of bus loading.
≤ ADCVDD, V
DRIVE
, T
MIN
MHz max
ASCLK
; ADCVDD = 5 V Unit Conditions/Comments
MAX
= 2.5 V; All specifications T
REFA
to T
MIN
to ASCLK setup time
ASYNC
MAX
Delay from ASYNC
ns min ASCLK low pulse width
ASCLK
ns min ASCLK high pulse width
ASCLK
th
ASCLK falling edge to ASYNC high
16
Power-up time from full power-down/autoshutdown/
autostandby modes
, unless otherwise noted.
until ADOUT three-state disabled
.
DRIVE
ASYNC
falling edge before seeing ADD3
ASYNC
ASCLK
DOUT
ADIN
t
THREE-
STATE
t
t
2
12345613141516
t
b
3
ADD3
3
ADD2ADD1ADD0DB 11DB10DB2DB1DB0
t
FOUR IDENTIFICATION BITS
9
WRITESEQADD3ADD2ADD1ADD0DONTCDONTCDONTC
t
4
t
6
CONVERT
t
10
t
7
B
t
5
Figure 2. ADC Timing Characteristics
200µAI
O OUTPUT
PIN
C
L
25pF
200µAI
Figure 3. Load Circuit for ADC Digital Output Timing Specifications
Rev. 0 | Page 9 of 44
OL
1.6V
OH
07691-003
t
11
t
8
t
QUIET
THREE-
STATE
07691-002
AD5590
www.BDTIC.com/ADI
DAC Timing Characteristics
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 4.
DACV
Table 6.
Parameter
t
1
t2 8 ns min DSCLK high time
t3 8 ns min DSCLK low time
t4 13 ns min
t5 4 ns min Data setup time
t6 4 ns min Data hold time
t7 0 ns min
t8 15 ns min
t9 13 ns min
t10 0 ns min
t11 10 ns min
t12 15 ns min
t13 5 ns min
t14 0 ns min
t15 300 ns typ
1
Sample tested at 25°C to ensure compliance.
2
Maximum DSCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V. Guaranteed by design and characterization; not production tested.
= 4.5 V to 5.5 V. All specifications T
DD
1
2
Limit at T
20 ns min DSCLK cycle time
MIN
, T
; DACVDD = 2.7 V to 5.5 V Unit Conditions/Comments
MAX
MIN
to T
, unless otherwise noted.
MAX
to DSCLK falling edge setup time
DSYNC
DSCLK falling edge to DSYNC
Minimum DSYNC
rising edge to DSCLK fall ignore
DSYNC
DSCLK falling edge to DSYNC
pulse width low
LDAC
DSCLK falling edge to LDAC
pulse width low
CLR
DSCLK falling edge to LDAC
pulse activation time
CLR
t
DSCLK
DSYNCx
DDIN
LDAC
10
t
8
1
DB31
t
4
t
6
t
5
t
1
t
t
3
2
DB0
t
9
t
7
t
11
t
14
rising edge
high time
fall ignore
rising edge
falling edge
t
12
2
LDAC
t
CLR
VOUTx
1
ASYNCHRONOUS LDAC UPDAT E MODE.
2
SYNCHRONOUS LDAC UPDAT E MODE.
13
t
15
Figure 4. DAC Timing Characteristics
Rev. 0 | Page 10 of 44
07691-004
AD5590
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. VDD refers to DACVDD or
ADCV
. GND refers to DACGND or ADCGND.
DD
Table 7.
Parameter Rating
VDD to GND −0.3 V to +7 V
V
to GND −0.3 V to VDD + 0.3 V
DRIVE
Op Amp Supply Voltage 6 V
Op Amp Input Voltage
Op Amp Differential Input Voltage ±6 V
Op Amp Output Short-Circuit
Duration to GND
Analog Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to VDD +0.3 V
V
to GND −0.3 V to VDD +0.3 V
REFA
V
REFIN/VREFOUT
Input Current to Any ADC Pin
Except Supplies
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 150°C
to GND −0.3 V to VDD +0.3 V
(V1− or V2−) − 0.3 V to
(V1+ or V2+) + 0.3 V
Indefinite
±10 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC thermal test board for surfacemount packages.
Table 8. Thermal Resistance
Package Type θJA Unit
80-Ball CSP_BGA 40 °C/W
Table 9. Junction Temperature
Parameter
Junction Temperature
1
P
TOTAL
2
θ
JA
is the sum of ADC, DAC, and operational amplifier supply currents.
is the package thermal resistance.
MaxUnitComments
1, 2
130 °C TJ = TA + P
TOTAL
× θ
JA
ESD CAUTION
Rev. 0 | Page 11 of 44
AD5590
www.BDTIC.com/ADI
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
121110987654321
VOUT14
VIN12
OUT7
IN7(–)
IN7(+)
IN6(+)
IN6(–)
V2–
OUT6
OUT5
IN5(–)
VOUT10
VIN10
VOUT9
VOUT11
VOUT13
VOUT15
V
REFIN2
V
REFOUT2
VIN15
V
REFA
VIN14
VIN11
/
VOUT8
VOUT12
VIN13
DACGND
VOUT1
V2+
LDAC
DACV
ADIN
DD
DDIN
DSYNC2
ASCLK
DSCLK
CLR
V
DRIVE
DSYNC1
DACGND
VIN1
DACV
VOUT3
VIN3
VOUT5
VOUT7
VIN8
VOUT2
VOUT4
VOUT6
V
REFIN1
REFOUT1
VIN5
V1–
VIN7
VIN6
VIN4
VOUT0
/
DD
VIN9
V
VIN2
OUT2
IN2(+)
IN2(–)
IN3(+)
IN3(–)
OUT3
OUT1
IN1(–)
IN1(+)
OUT0
A
B
C
D
E
F
G
H
J
K
L
IN5(+)
IN4(+)
IN4(–)
OUT4
Table 10. Pin Function Descriptions
Pin No. Mnemonic Description
M7
Frame Synchronization Signal. Active low logic input. This input provides the dual function of
ASYNC
initiating ADC conversions and also frames the serial data transfer.
J11 V
REFA
Reference Input for the ADC Block. An external reference must be applied to this input. The voltage
range for the external reference is 2.5 V ± 1% for specified performance.
M8 ADCVDD
Power Supply Input for the ADC Block. The ADC can operate from 4.5 V to 5.25 V, and the supply
should be decoupled with a 10 µF in parallel with a 0.1 µF capacitor to ADCGND.
M5 ADCGND
Ground Reference Point for the ADC Block. All ADC analog/digital input/output signals and any
external reference signal should be referred to this ADCGND voltage.
Analog Input 0 through Analog Input 15. Sixteen single-ended analog input channels that are
multiplexed into the on-chip track and hold. The analog input channel to be converted is selected by
using the ADD3 through ADD0 address bits of the control register. The address bits in conjunction
with the SEQ and shadow bits allow the sequence register to be programmed. The input range for all
input channels can extend from 0 V to V
control register. Any unused input channels should be connected to GND to avoid noise pickup.
L8 ADIN
ADC Data In. Logic input. Data to be written to the control register of the ADC is provided on this input and
is clocked into the register on the falling edge of ASCLK (see the Accessing the ADC Block section).
M6 ADOUT
Data Out. Logic output. The conversion result from the ADC block is provided on this output as a serial
data stream. The bits are clocked out on the falling edge of the ASCLK input. The data stream consists
of four address bits indicating which channel the conversion result corresponds to, followed by the
12 bits of conversion data, which is provided MSB first. The output coding can be selected as straight
binary or twos complement via the coding bit in the control register.
ASYNC
ADCV
DD
Figure 5. Pin Configuration
ADOUT
ADCGND
or 0 V to 2 × V
REFA
VIN0
V1+
IN0(+)
IN0(–)
M
7691-005
, as selected via the range bit in the
REFA
Rev. 0 | Page 12 of 44
AD5590
www.BDTIC.com/ADI
Pin No. Mnemonic Description
L7 ASCLK
L6 V
DRIVE
A4, B8 DACVDD
A9, B5 DACGND
A8
A5
B7
B6
LDAC
DSYNC1
DSYNC2
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are
CLR
A7 DDIN
A6 DSCLK
A1, B9, C2, B4, D2,
A3, E2, A2
A10, C11, B11, D11,
B10, E11, A12, F11
F2
G11
VOUT0 to
VOUT7
VOUT8 to
VOUT15
/
V
REFIN1
V
REFOUT1
/
V
REFIN2
V
REFOUT2
M3 V1+
H2 V1− Negative Supply Input for Amplifier 0 to Amplifier 3.
L9 V2+
H12 V2− Negative Supply Input for Amplifier 4 to Amplifier 7.
M1, J1, D1, F1, M10,
L12, G12, D12
M2, K1, C1, E1, M11,
M12, F12, E12
L1, H1, B1, G1, M9,
K12, J12, C12
IN0(−) to
IN7(−)
IN0(+) to
IN7(+)
OUT0 to
OUT7
Serial Clock. Logic input. ASCLK provides the serial clock for accessing data from the ADC block. This
clock input is also used as the clock source for the conversion process of the ADC.
Logic Power Supply Input. The voltage supplied at this pin determines at what voltage the serial
interface of the ADC block operates.
Power Supply Input for the DAC Block. The DAC can operate from 4.5 V to 5.25 V, and the supply
should be decoupled with a 10 µF in parallel with a 0.1 µF capacitor to DACGND. The two DACV
DD
must be connected together.
Ground Reference Point for the DAC Block. All DAC analog/digital input/output signals and any
external reference signal should be referred to this DACGND voltage. The two DACGND pins should be
connected together.
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data.
This allows all DAC outputs to simultaneously update. Alternatively, this pin can be tied permanently
low.
Active Low Control Input. This is the frame synchronization signal for the input data of DAC channels
VOUT0 to VOUT7. When DSYNC1
input shift register. Data is transferred in on the falling edges of the next 32 clocks. If DSYNC1
nd
high before the 32
falling edge, the rising edge of DSYNC1 acts as an interrupt and the write
goes low, it powers on the DSCLK and DDIN buffers and enables the
is taken
sequence is ignored by the device.
Active Low Control Input. This is the frame synchronization signal for the input data of DAC channels
VOUT8 to VOUT15. When DSYNC2
input shift register. Data is transferred in on the falling edges of the next 32 clocks. If DSYNC2
high before the 32
nd
falling edge, the rising edge of DSYNC2 acts as an interrupt and the write
goes low, it powers on the DSCLK and DDIN buffers and enables the
is taken
sequence is ignored by the device.
ignored. When CLR
is activated, the input register and the DAC register are updated with the data
contained in the CLR code register—zero scale, midscale, or full scale. Default setting clears the output
to 0 V.
DAC Data Input. This DAC has a 32-bit shift register. Data is clocked into the register on the falling
edge of the serial clock input.
DAC Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. Data can be transferred at rates of up to 50 MHz.
Analog Output Voltage from DAC0 to DAC7. DSYNC1 is the frame synchronization signal for writing
data to these DACs. The DAC is updated automatically if LDAC
is low, or on the falling edge of LDAC if
it is high. The output amplifiers have rail-to-rail operation.
Analog Output Voltage from DAC8 to DAC15. DSYNC2 is the frame synchronization signal for writing
data to these DACs. The DAC is updated automatically if LDAC
is low, or on the falling edge of LDAC if
it is high. The output amplifiers have rail to rail operation.
Reference Input/Output Pin for DAC0 to DAC7. The DACs have a common pin for reference input and
reference output. When using the internal reference, this is the reference output pin. When using an
external reference, this is the reference input pin. The default for this pin is as a reference input.
Reference Input/Output Pin for DAC8 to DAC15. The DACs have a common pin for reference input and
reference output. When using the internal reference, this is the reference output pin. When using an
external reference, this is the reference input pin. The default for this pin is as a reference input.
Positive Supply Input for the amplifier 0 to amplifier 3. The supply for these amplifiers is independent
of other supplies and can be operated with a different supply if required. The pin should be decoupled
to V1− with a 10 µF in parallel with a 0.1 µF capacitor.
Positive Supply Input for Amplifier 4 to Amplifier 7. The supply for these amplifiers is independent of
other supplies and can be operated with a different supply if required. The pin should be decoupled
to V2− with a 10 µF in parallel with a 0.1 µF capacitor.
Inverting Input Terminals for Operational Amplifier 0 to Amplifier 7.
Noninverting Input Terminals for Operational Amplifier 0 to Amplifier 7.
Output Terminals for Operational Amplifier 0 to Amplifier 7.