ANALOG DEVICES AD5412 Service Manual

Single Channel, 12-Bit, Serial Input,
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Preliminary Technical Data
FEATURES
12-Bit Resolution and Monotonicity Current Output Ranges: 4–20mA, 0–20mA or 0–24mA
0.1% Total Unadjusted Error (TUE)
5ppm/°C Output Drift Voltage Output Ranges: 0-5V, 0-10V, ±5V, ±10V, 10% over-range
0.05% Total Unadjusted Error (TUE)
3ppm/°C Output Drift Flexible Serial Digital Interface On-Chip Output Fault Detection On-Chip Reference (10 ppm/°C Max) Asynchronous CLEAR Function Power Supply Range
AV
: 10.8V to 40 V
DD
AV
: -26.4V to -3V/0V
SS
Output Loop Compliance to AV Temperature Range: -40°C to +85°C TSSOP and LFCSP Packages
APPLICATIONS
Process Control Actuator Control PLC
– 2.5 V
DD
Current Source & Voltage Output DAC
AD5412
GENERAL DESCRIPTION
The AD5412 is a low-cost, precision, fully integrated 12-bit converter offering a programmable current source and programmable voltage output designed to meet the requirements of industrial process control applications. The output current range is programmable to 4mA to 20 mA, 0mA to 20mA or an overrange function of 0mA to 24mA. Voltage output is provided from a separate pin that can be configured to provide 0V to 5V, 0V to 10V, ±5V or ±10V output ranges, an over-range of 10% is available on all ranges. Analog outputs are short and open circuit protected and can drive capacitive loads of 1uF and inductive loads of 1H. The device is specified to operate with a power supply range from 10.8 V to 40 V. Output loop compliance is 0 V to AV
2.5 V. The flexible serial interface is SPI compatible and can be operated in 3-wire mode to minimize the digital isolation required in isolated applications. The device also includes a power-on-reset function ensuring that the device powers up in a known state and an asynchronous CLEAR pin which sets the outputs to zero-scale / mid-scale voltage output or the low end of the selected current range. The total output error is typically ±0.1% in current mode and ±0.05% in voltage mode.
Table 1. Related Devices
Part Number Description
AD5422
AD5420
AD5410
and MICROWIRE
Single Channel, 16-Bit, Serial Input Current Source and Voltage Output DAC
Single Channel, 16-Bit, Serial Input Current Source DAC
Single Channel, 12-Bit, Serial Input Current Source DAC
DD
Rev. PrC
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
AD5412 Preliminary Technical Data
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TABLE OF CONTENTS
Features.............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Functional Block Diagram .............................................................. 3
Specifications..................................................................................... 4
AC Performance Characteristics ................................................ 7
Timing Characteristics ................................................................ 8
Absolute Maximum Ratings.......................................................... 10
ESD Caution................................................................................ 10
Pin Configuration and Function Descriptions........................... 11
Typical Performance Characteristics Voltage output............... 13
Typical Performance Characteristics current output............... 17
Typical Performance Characteristics general ............................20
Terminology .................................................................................... 22
Theory of Operation ...................................................................... 24
Architecture................................................................................. 24
Serial Interface ............................................................................ 24
Default configuration................................................................. 28
Transfer Function....................................................................... 28
Data Register............................................................................... 29
Control Register.......................................................................... 29
RESET register............................................................................ 29
Status register.............................................................................. 30
Features............................................................................................ 31
fault alert...................................................................................... 31
voltage output short circuit protection.................................... 31
Asynchronous Clear (CLEAR)................................................. 31
Internal Reference...................................................................... 31
External current setting resistor............................................... 31
Voltage ouTput over-range........................................................ 31
Digital Power Supply.................................................................. 31
External boost function............................................................. 31
digital Slew rate control............................................................. 32
I
Filtering Capacitors............................................................ 32
OUT
Applications Information.............................................................. 33
driving inductive loads.............................................................. 33
Transient voltage protection ..................................................... 33
Layout Guidelines....................................................................... 33
Galvanically Isolated Interface ................................................. 33
Microprocessor Interfacing....................................................... 33
Thermal and supply considerations......................................... 34
Outline Dimensions....................................................................... 35
Ordering Guide .......................................................................... 35
REVISION HISTORY
PrC – Preliminary Version. October 9, 2007
Rev. PrC | Page 2 of 37
Preliminary Technical Data AD5412
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FUNCTIONAL BLOCK DIAGRAM
DV
CC
SELECT
DV
CC
CAP1
CAP2
AV
SS
AV
DD
CLEAR SELECT
CLEAR
LATCH
SCLK
SDIN
SDO
AD5412
INPUT SHIFT
POWER
ON
RESET
DGND*
*LFCSP Package
REGISTER
AND
CONTROL
LOGIC
VREF
REFOUT
R2
12
12-BIT
/
DAC
R1
RANGE SCALING
REFIN
Figure 1.
AGND
C
COMP2
C
COMP1
R3
BOOST
I
OUT
FAULT
R
SET
+V
SENSE
V
OUT
-V
SENSE
Rev. PrC | Page 3 of 37
AD5412 Preliminary Technical Data
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SPECIFICATIONS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external; DV
= 2.7 V to 5.5 V, V
CC
all specifications T
Table 2.
Parameter Value1 Unit Test Conditions/Comments VOLTAGE OUTPUT
Output Voltage Ranges 0 to 5 V
0 to 10 V
-5 to +5 V
-10 to +10 V
ACCURACY Output unloaded
Bipolar Output
Resolution 12 Bits Total Unadjusted Error (TUE) 0.1 % FSR max
TUE TC2 ±3 ppm typ
Relative Accuracy (INL) ±0.012 % FSR max Differential Nonlinearity (DNL) ±1 LSB max Guaranteed monotonic Bipolar Zero Error ±5 mV max
Bipolar Zero TC2 ±3 ppm FSR/°C max Zero-Scale Error ±1 mV max
Zero-Scale TC2 ±3 ppm FSR/°C max Gain Error ±0.05 % FSR max
Gain TC2 ±8 ppm FSR/°C max Full-Scale Error 0.05 % FSR max
Full-Scale TC2 ±3 ppm FSR/°C max
Unipolar Output AVSS = 0 V
Resolution 12 Bits Total Unadjusted Error (TUE) 0.1 % FSR max
Relative Accuracy (INL) ±0.012 % FSR max Differential Nonlinearity (DNL) ±1 LSB max Guaranteed monotonic Zero Scale Error +10 mV max
Zero Scale TC2 ±3 ppm FSR/°C max Offset Error ±10 mV max Gain Error ±0.05 % FSR max
Gain TC2 ±3 ppm FSR/°C max Full-Scale Error 0.05 % FSR max
Full-Scale TC2 ±3 ppm FSR/°C max
OUTPUT CHARACTERISTICS2
Headroom 0.8 V max
0.5 V typ
Output Voltage TC ±3 ppm FSR/°C max
Output Voltage Drift vs. Time ±12 ppm FSR/500 hr typ Vout = ¾ of Full-Scale
±15 ppm FSR/1000 hr typ
Short-Circuit Current 12 mA typ
MIN
: RL = 2 kΩ, CL = 200 pF, I
OUT
to T
, ±10 V / 0 to 24 mA range unless otherwise noted.
MAX
: RL = 300, HL = 50mH;
OUT
Rev. PrC | Page 4 of 37
Over temperature, supplies, and time, typically 0.05% FSR
@ 25°C, error at other temperatures obtained using bipolar zero TC
@ 25°C, error at other temperatures obtained using zero scale TC
@ 25°C, error at other temperatures obtained using gain TC
@ 25°C, error at other temperatures obtained using gain TC
Over temperature, supplies, and time, typically 0.05% FSR
@ 25°C, error at other temperatures obtained using gain TC
@ 25°C, error at other temperatures obtained using gain TC
@ 25°C, error at other temperatures obtained using gain TC
Preliminary Technical Data AD5412
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Parameter Value1 Unit Test Conditions/Comments
Load 2 kΩ min For specified performance Capacitive Load Stability
RL = ∞ 20 nF max RL = 2 kΩ TBD nF max
RL = ∞ 1 µF max External compensation capacitor of 4nF connected. DC Output Impedance 0.3 Ω typ Power-On Time 10 µs typ DC PSRR TBD µV/V
CURRENT OUTPUT
Output Current Ranges 0 to 24 mA
0 to 20 mA
4 to 20 mA
ACCURACY
Resolution 12 Bits Total Unadjusted Error (TUE) ±0.3 % FSR max Over temperature, supplies, and time, typically 0.1% FSR TUE TC2 ±5 ppm/°C typ Relative Accuracy (INL) ±0.012 % FSR max Differential Nonlinearity (DNL) ±1 LSB max Guaranteed monotonic Offset Error ±0.05 % FSR max Offset Error Drift ±5 µv/°C typ Gain Error ±0.02 % FSR max
Gain TC2 ±8 ppm FSR/°C max Full-Scale Error 0.05 % FSR max
Full-Scale TC2 ±8 ppm FSR/°C
OUTPUT CHARACTERISTICS2
Current Loop Compliance Voltage AVDD - 2.5 V max Output Current Drift vs. Time TBD ppm FSR/500 hr typ TBD ppm FSR/1000 hr typ Resistive Load TBD Ω max Inductive Load 1 H max DC PSRR 10 µA/V max Output Impedance 50 MΩ typ
REFERENCE INPUT/OUTPUT
Reference Input2
Reference Input Voltage 5 V nom ±1% for specified performance
DC Input Impedance 30 kΩ min Typically 40 kΩ
Reference Range 4 to 5 V min to V max Reference Output
Output Voltage 4.998 to 5.002 V min to V max @ 25°C
Reference TC ±10 ppm/°C max
Output Noise (0.1 Hz to 10 Hz)2 18 µV p-p typ
Noise Spectral Density2 120 nV/√Hz typ @ 10 kHz
Output Voltage Drift vs. Time2 ±40 ppm/500 hr typ
±50 ppm/1000 hr typ
Capacitive Load TBD nF max
Load Current 5 mA typ
Short Circuit Current 7 mA typ
Line Regulation2 10 ppm/V typ
Load Regulation2 TBD ppm/mA
Thermal Hysteresis2 TBD ppm
@ 25°C, error at other temperatures obtained using gain TC
@ 25°C, error at other temperatures obtained using gain TC
Rev. PrC | Page 5 of 37
AD5412 Preliminary Technical Data
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Parameter Value1 Unit Test Conditions/Comments DIGITAL INPUTS2
VIH, Input High Voltage 2 V min VIL, Input Low Voltage 0.8 V max Input Current ±1 µA max Per pin Pin Capacitance 10 pF typ Per pin
DIGITAL OUTPUTS 2
SDO
VOL, Output Low Voltage 0.4 V max sinking 200 µA VOH, Output High Voltage DVCC − 0.5 V min sourcing 200 µA High Impedance Leakage
Current High Impedance Output
Capacitance
FAU LT
VOL, Output Low Voltage 0.4 V max VOL, Output Low Voltage 0.6 V typ @ 2.5 mA
VOH, Output High Voltage 3.6 V min
POWER REQUIREMENTS
AVDD 10.8 to 40 V min to V max AVSS -26.4 to 0 V min to V max DVCC
Input Voltage 2.7 to 5.5 V min to V max Internal supply disabled Output Voltage 4.5 V typ DVCC can be overdriven up to 5.5V Output Load Current 5 mA typ
Short Circuit Current 20 mA typ AIDD TBD mA Output unloaded AISS TBD mA Output unloaded DICC 1 mA max VIH = DVCC, VIL = GND, TBD mA typ Power Dissipation TBD mW typ AVDD = 40V, AVSS = 0 V, V TBD mW typ AVDD = 40V, AVSS = -15 V, V TBD mW typ AVDD = 15V, AVSS = -15 V, V
1
Temperature range: -40°C to +85°C; typical at +25°C.
2
Guaranteed by characterization. Not production tested.
DVCC = 2.7 V to 5.5 V, JEDEC compliant
±1 µA max
5
pF typ
10k pull-up resistor to DV
10k pull-up resistor to DV
OUT
CC
CC
unloaded
unloaded
OUT
unloaded
OUT
Rev. PrC | Page 6 of 37
Preliminary Technical Data AD5412
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AC PERFORMANCE CHARACTERISTICS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external; DV
= 2.7 V to 5.5 V, V
CC
all specifications T
Table 3.
Parameter1 Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
VOLTAGE OUTPUT
Output Voltage Settling Time 8 µs typ Full-scale step (10 V) to ±0.03% FSR 10 µs max 5 µs max 512 LSB step settling
Output Current Settling Time 10 µs max To 0.1% FSR
Slew Rate 1 V/µs typ Power-On Glitch Energy 10 nV-sec typ Digital-to-Analog Glitch Energy 10 nV-sec typ Glitch Impulse Peak Amplitude 20 mV typ Digital Feedthrough 1 nV-sec typ Output Noise (0.1 Hz to 10 Hz Bandwidth) 0.1 LSB p-p typ Output Noise (100 kHz Bandwidth) 80 µV rms max 1/f Corner Frequency 1 kHz typ Output Noise Spectral Density 100 nV/√Hz typ Measured at 10 kHz AC PSRR TBD dB
CURRENT OUTPUT
Output Current Settling Time TBD µs typ To 0.1% FSR , L = 1H
TBD µs typ To 0.1% FSR , L < 1mH
1
Guaranteed by characterization, not production tested.
MIN
: RL = 2 kΩ, CL = 200 pF, I
OUT
to T
, ±10 V / 0 to 24 mA range unless otherwise noted.
MAX
: RL = 300, HL = 50mH;
OUT
200mV 50/60Hz Sinewave superimposed on power supply voltage.
Rev. PrC | Page 7 of 37
AD5412 Preliminary Technical Data
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TIMING CHARACTERISTICS
AVDD = 10.8V to 40V, AVSS = -26.4V to -3V/0V, AVDD + |AVSS| < 52.8V, AGND = DGND = 0 V, REFIN= +5 V external; DV
= 2.7 V to 5.5 V, V
CC
all specifications T
MIN
: RL = 2 kΩ, CL = 200 pF, I
OUT
to T
, ±10 V / 0 to 24 mA range unless otherwise noted.
MAX
: RL = 300, HL = 50mH;
OUT
Table 4.
Parameter Write Mode
1, 2, 3
Limit at T
, T
MIN
Unit Description
MAX
t1 33 ns min SCLK cycle time t2 13 ns min SCLK low time t3 13 ns min SCLK high time t4 13 ns min LATCH delay time t5 40 ns min LATCH high time t5 5 µs min LATCH high time (After a write to the CONTROL register) t6 5 ns min Data setup time t7 5 ns min Data hold time t8 40 ns min LATCH low time t9 20 ns min CLEAR pulsewidth t10 5 µs max CLEAR activation time
Readback Mode
t11 82 ns min SCLK cycle time t12 33 ns min SCLK low time t13 33 ns min SCLK high time t14 13 ns min LATCH delay time t15 40 ns min LATCH high time t16 5 ns min Data setup time t17 5 ns min Data hold time t18 40 ns min LATCH low time t19 40 ns max Serial output delay time (C
L SDO
4
= 15pF)
t20 33 ns max LATCH rising edge to SDO tri-state
Daisychain Mode
t21 82 ns min SCLK cycle time t22 33 ns min SCLK low time t23 33 ns min SCLK high time t24 13 ns min LATCH delay time t25 40 ns min LATCH high time t26 5 ns min Data setup time t27 5 ns min Data hold time t28 40 ns min LATCH low time t29 40 ns max Serial output delay time (C
L SDO
4
= 15pF)
1
Guaranteed by characterization. Not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
See Figure 2, Figure 3, and Figure 4.
4
C
= Capacitive load on SDO output.
L SDO
Rev. PrC | Page 8 of 37
Preliminary Technical Data AD5412
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t
1
SCLK
SCLK
LATCH
SDIN
CLEAR
OUTPUT
t
12
2421
t
3
DB0
t
t
8
t
4
5
t
6
DB23
t
2
t
7
t
9
t
10
Figure 2. Write Mode Timing Diagram
t
11
2
2421
t
13
t
t
14
15
1
923
8
22
24
LATCH
SDIN
SDO
LATCH
SCLK
SDIN
t
16
DB23
t
17
INPUT WORD SPECIFIES REGISTER TO BE READ
UNDEFINED DATA
DB23
INPUT WORD F OR DAC N
t
18
DB0
DB23
FIRST 8 BITS ARE DON’T CARE B ITS
Figure 3. Readback Mode Timing Diagram
25
2421
t
26
DB0
DB23
t
29
NOP CONDITIO N
X
XXX
DB15
SELECTED REGISTER DATA CLOCKED OUT
t
t
22
t
27
INPUT WO RD F O R DAC N-1
t
23
DB0
t
t
19
DB0
20
21
4826
DB0
t
24
t
28
t
25
SDO
DB23 DB0
UNDEFINED
DB23 DB0
INPUT WO RD FOR DAC N
Figure 4. Daisychain Mode Timing Diagram
Rev. PrC | Page 9 of 37
AD5412 Preliminary Technical Data
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ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
AVDD to AGND, DGND −0.3V to 48V AVSS to AGND, DGND +0.3 V to −48 V AVDD to AVSS -0.3V to 60V DVCC to AGND, DGND −0.3 V to +7 V Digital Inputs to AGND, DGND
Digital Outputs to AGND, DGND
REFIN/REFOUT to AGND, DGND −0.3 V to +7 V V
to AGND, DGND AVSS to AVDD
OUT
I
to AGND, DGND −0.3V to AVDD
OUT
AGND to DGND -0.3V to +0.3V Operating Temperature Range
Industrial −40°C to +851°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) 125°C 24-Lead TSSOP Package
θJA Thermal Impedance 42°C/W 40-Lead LFCSP Package
θJA Thermal Impedance 28°C/W Power Dissipation (TJ max – TA)/ θJA Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
−0.3 V to DV (whichever is less)
−0.3 V to DV (whichever is less)
+ 0.3 V or 7 V
CC
+ 0.3 V or 7V
CC
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD CAUTION
1
Power dissipated on chip must be de-rated to keep junction temperature
below 125°C. Assumption is max power dissipation condition is sourcing 24mA into Ground from AVDD with a 3mA on-chip current.
Rev. PrC | Page 10 of 37
Preliminary Technical Data AD5412
T
E
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AV DV
FAULT
GND
CLEAR SELE CT
CLEAR
LATCH
SCLK
SDIN
SDO
AGND
GND
SS CC
1 2
AD5422
3 4 5
TOP VIEW
6
(Not to Scale)
7 8
9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
AV
DD
-V
SENSE
+V
SENSE
V
OUT
BOOST I
OUT
C
COMP2
C
COMP1
DV
CC
REFIN REFOUT R
SET
SELEC
CLEAR SELECT
CC
NC
DV
NC
40 39 38 37 36 35 34 33 32 31
NC
1 2
FAULT
3
GND
4 5
CLEAR
6
LATCH
SCLK
7
SDIN
8 9
SDO
NC
10
11 12 13 14 15 16 17 18 19 20
NC
DGND
AGND
AVSSAVDDNC
AD5422
TOP VIEW
(Not to Scale)
SS
AV
SENS
SENSE
OUT
-V
NC
+V
V
30
NC
29
CAP2
28
CAP1
27
BOOST
26
I
OUT
25
C
COMP2
24
C
COMP1
23
CC
SELECT
DV
22
NC
21
NC
SET
R
GND
NC
NC
REFIN
REFOUT
Figure 5. TSSOP Pin Configuration Figure 6. LFCSP Pin Configuration
Table 6. Pin Function Descriptions
TSSOP Pin No. LFCSP Pin No. Mnemonic Description
1 14,37 AVSS
Negative Analog Supply Pin. Voltage ranges from –3 V to –24 V. This pin can be
connected to 0V if output voltage range is unipolar. 2 39 DVCC Digital Supply Pin. Voltage ranges from 2.7 V to 5.5 V. 3 2
FAU LT
Fault alert, This pin is asserted low when an open circuit is detected in current mode or
an over temperature is detected. Open drain output, must be connected to a pull-up
resistor. 4,12 3,15 GND These pins must be connected to 0V. 1,10,11,19,
NC No Connection. 20,21,22,30, 31,35,38,40
5 4
CLEAR
Selects the voltage output clear value, either zero-scale or mid-scale code. See Table 20
SELECT
6 5 CLEAR
Active High Input. Asserting this pin will set the current output to the bottom of the selected range or will set the voltage output to the user selected value (zero-scale or mid-scale).
7 6 LATCH
Positive edge sensitive latch, a rising edge will parallel load the input shift register data into the DAC register, also updating the output.
8 7 SCLK
Serial Clock Input. Data is clocked into the shift register on the rising edge of SCLK. This
operates at clock speeds up to 30 MHz. 9 8 SDIN Serial Data Input. Data must be valid on the rising edge of SCLK. 10 9 SDO
Serial Data Output. Used to clock data from the serial register in daisy-chain or readback
mode. Data is clocked out on the falling edge of SCLK and is valid on the falling edge of
SCLK. 11 12 AGND Ground reference pin for analog circuitry. N/A 13 DGND
Ground reference pin for digital circuitry. (AGND and DGND are internally connected in
TSSOP package). 13 16 R
SET
An external, precision, low drift 15k current setting resistor can be connected to this
pin to improve the I
temperature drift performance. Refer to Features section.
OUT
14 17 REFOUT Internal Reference Voltage Output. REFOUT = 5 V ± 2 mV. 15 18 REFIN
External Reference Voltage Input. Reference input range is 4 V to 5 V. REFIN = 5 V for
specified performance. 16 23
DV
CC
SELECT
This pin when connected to GND disables the internal supply and an external supply
must be connected to the DV
pin. Leave this pin unconnected to enable the internal
CC
supply. Refer to features section. 17 24 C 18 25 C
COMP1
COMP2
Optional compensation capacitor connection for the voltage output buffer. Connecting
a 4nF capacitor between these pins will allow the voltage output to drive up to 1µF.
Rev. PrC | Page 11 of 37
AD5412 Preliminary Technical Data
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TSSOP Pin No. LFCSP Pin No. Mnemonic Description
19 26 I 20 27 BOOST
N/A 28 CAP1 Connection for optional output filtering capacitor. Refer to Features section. N/A 29 CAP2 Connection for optional output filtering capacitor. Refer to Features section. 21 32 V
22 33 +V 23 34 -V 24 36 AVDD Positive Analog Supply Pin. Voltage ranges from 10.8V to 60V. Paddle Paddle AVSS
Current output pin.
OUT
Optional external transistor connection. Connecting an external transistor will reduce the power dissipated in the AD5412. Refer to the features section.
OUT
Sense connection for the positive voltage output load connection.
SENSE
Sense connection for the negative voltage output load connection.
SENSE
Buffered Analog Output Voltage. The output amplifier is capable of directly driving a 2 kΩ, 2000 pF load.
Negative Analog Supply Pin. Voltage ranges from –3 V to –24 V. This pin can be connected to 0V if output voltage range is unipolar.
Rev. PrC | Page 12 of 37
Preliminary Technical Data AD5412
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TYPICAL PERFORMANCE CHARACTERISTICS
VOLTAGE OUTPUT
Figure 7. Integral Non Linearity Error vs DAC Code (Four Traces)
Figure 8. Differential Non Linearity Error vs. DAC Code (Four Traces)
Figure 10. Integral Non Linearity vs. Temperature (Four Traces)
Figure 11. Differential Non Linearity vs. Temperature (Four Traces)
Figure 9. Total Unadjusted Error vs. DAC Code (Four Traces)
Rev. PrC | Page 13 of 37
Figure 12. Integral Non Linearity vs. Supply Voltage (Four Traces)
AD5412 Preliminary Technical Data
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Figure 13.Differential Non Linearity Error vs. Supply Voltage (Four Traces)
Figure 14. Integral Non Linearity Error vs. Reference Voltage (Four traces)
Figure 16. Total Unadjusted Error vs.Reference Voltage (Four Traces)
Figure 17. Total Unadjusted Error vs. Supply Voltage (Four Traces)
Figure 15. Differential Non Linearity Error vs. Reference Voltage (Four Traces)
Figure 18. Offset Error vs.Temperature
Rev. PrC | Page 14 of 37
Preliminary Technical Data AD5412
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Figure 19. Bipolar Zero Error vs. Temperature
Figure 20. Gain Error vs. Temperature
Figure 22. Source and Sink Capability of Output Amplifier
Zero-Scale Loaded
Figure 23.Full-Scale Positive Step
Figure 21. Source and Sink Capability of Output Amplifier
Full-Scale Code Loaded
Figure 24. Full-Scale Negative Step
Rev. PrC | Page 15 of 37
AD5412 Preliminary Technical Data
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Figure 25. Digital-to-Analog Glitch Energy
Figure 26. Peak-to-Peak Noise (0.1Hz to 10Hz Bandwidth)
Figure 28. V
Figure 29. V
vs. Time on Power-up
OUT
vs, Time on Output Enabled
OUT
Figure 27. Peak-to-Peak Noise (100kHz Bandwidth)
Rev. PrC | Page 16 of 37
Preliminary Technical Data AD5412
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TYPICAL PERFORMANCE CHARACTERISTICS
CURRENT OUTPUT
Figure 30. Integral Non Linearity vs. Code
Figure 31.Differential Non Linearity vs. Code
Figure 33. Integral Non Linearity vs. Temperature
Figure 34. Differential Non Linearity vs. Temperature
Figure 32. Total Unadjusted Error vs. Code
Rev. PrC | Page 17 of 37
Figure 35. Integral Non Linearity vs. Supply
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Figure 36. Differential Non Linearity vs. Supply Voltage
Figure 37. Integral Non Linearity vs. Reference Voltage
Figure 39. Total Unadjusted Error vs. Reference Voltage
Figure 40. Total Unadjusted Error vs. Supply Voltage
Figure 38. Differential Non Linearity vs. Reference Voltage
Figure 41. Offset Error vs. Temperature
Rev. PrC | Page 18 of 37
Preliminary Technical Data AD5412
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Figure 42. Gain Error vs. Temperature
Figure 43. Voltage Compliance vs. Temperature
Figure 44. I
Figure 45. I
vs. Time on Power-up
OUT
vs. Time on Output Enabled
OUT
Rev. PrC | Page 19 of 37
AD5412 Preliminary Technical Data
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TYPICAL PERFORMANCE CHARACTERISTICS
GENERAL
Figure 46. DI
Figure 47. AI
vs.Logic Input Voltage
CC
/AISS vs AVDD/AVSS
DD
Figure 49. DV
Output Voltage vs. DICC Load Current
CC
Figure 50. Refout Turn-on Transient
Figure 48. AI
vs AVDD
DD
Figure 51. Refout Output Noise (0.1Hz to 10Hz Bandwidth)
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Figure 52. Refout Output Noise (100kHz Bandwidth)
Figure 53. Refout Line Transient
Figure 55. Refout Histogram of Thermal Hysteresis
Figure 56. Refout Voltage vs. Load Current
Figure 54. Refout Load Transient
Rev. PrC | Page 21 of 37
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TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy, or integral nonlinearity (INL), is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot can be seen in Figure 7.
Differential Nonlinearity (DNL)
Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical DNL vs. code plot can be seen in Figure 10.
Monotonicity
A DAC is monotonic if the output either increases or remains constant for increasing digital input code. The AD5724R/ AD5734R/AD5754R are monotonic over their full operating temperature range.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the ideal half-scale output of 0 V when the DAC register is loaded with 0x8000 (straight binary coding) or 0x0000 (twos complement coding). A plot of bipolar zero error vs. temperature can be seen in Table TBD.
Bipolar Zero TC
Bipolar zero TC is a measure of the change in the bipolar zero error with a change in temperature. It is expressed in ppm FSR/°C.
Full-Scale Error
Full-Scale error is a measure of the output error when full-scale code is loaded to the DAC register. Ideally, the output should be full-scale − 1 LSB. Full-scale error is expressed in percent of full-scale range (% FSR).
Negative Full-Scale Error/Zero-Scale Error
Negative full-scale error is the error in the DAC output voltage when 0x0000 (straight binary coding) or 0x8000 (twos complement coding) is loaded to the DAC register. Ideally, the output voltage should be negative full-scale zero-scale error vs. temperature can be seen in Table TBD
Zero-Scale TC
This is a measure of the change in zero-scale error with a change in temperature. Zero-scale error TC is expressed in ppm FSR/°C.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for the output to settle to a specified level for a full-scale input change. A plot of settling time can be seen in Table TBD
− 1 LSB. A plot of
Rev. PrC | Page 22 of 37
Slew Rate
The slew rate of a device is a limitation in the rate of change of the output voltage. The output slewing speed of a voltage­output D/A converter is usually limited by the slew rate of the amplifier used at its output. Slew rate is measured from 10% to 90% of the output signal and is given in V/µs.
Gain Error
This is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from ideal expressed in % FSR. A plot of gain error vs. temperature can be seen in Table TBD
Gain TC
This is a measure of the change in gain error with changes in temperature. Gain Error TC is expressed in ppm FSR/°C.
Tot a l U n ad ju s te d E rr o r
Total unadjusted error (TUE) is a measure of the output error taking all the various errors into account, namely INL error, offset error, gain error, and output drift over supplies, temperature, and time. TUE is expressed in % FSR.
Current Loop Voltage Compliance
The maximum voltage at the I currnet will be equal to the programmed value.
Power-On Glitch Energy
Power-on glitch energy is the impulse injected into the analog output when the AD5412 is powered-on. It is specified as the area of the glitch in nV-sec. See Table TBD
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state, but the output voltage remains constant. It is normally specified as the area of the glitch in nV-sec and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000). See Table TBD
Glitch Impulse Peak Amplitude
Glitch impulse peak amplitude is the peak amplitude of the impulse injected into the analog output when the input code in the DAC register changes state. It is specified as the amplitude of the glitch in mV and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000). See Table TBD.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but is measured when the DAC output is not updated. It is specified in nV-sec and measured with a full-scale code change on the data bus.
Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affected by changes in the power supply voltage.
Reference TC
pin for which the output
OUT
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Reference TC is a measure of the change in the reference output voltage with a change in temperature. It is expressed in ppm/°C.
Line Regulation
Line regulation is the change in reference output voltage due to a specified change in supply voltage. It is expressed in ppm/V.
Load Regulation
Load regulation is the change in reference output voltage due to a specified change in load current. It is expressed in ppm/mA.
Thermal Hysteresis
Thermal hysteresis is the change of reference output voltage after the device is cycled through temperatures from +25°C to
−40°C to +85°C and back to +25°C. This is a typical value from a sample of parts put through such a cycle. See Table TBDfor a histogram of thermal hysteresis.
VVV
C)25(−°
_
_
OHYSO
O
)( ×
=
ppmV
HYSO
TCO
_
C)25(
°
VV
TCO
_
6
C)25(
°
V
O
10
where:
V
(25°C) = VO at 25°C
O
V
= VO at 25°C after temperature cycle
O_TC
Rev. PrC | Page 23 of 37
AD5412 Preliminary Technical Data
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THEORY OF OPERATION
+V
V
-V
and C
SENSE
OUT
SENSE
COMP2
±3V
pins.
R
1
R
L
The AD5412 is a precision digital to current loop and voltage output converter designed to meet the requirements of industrial process control applications. It provides a high precision, fully integrated, low cost single-chip solution for generating current loop and unipolar/bipolar voltage outputs. The current ranges available are; 0 to 20mA, 0 to 24mA and 4 to 20mA, the voltage ranges available are; 0 to 5V, ±5V, 0 to 10V and ±10V, the current and voltage outputs are available on separate pins and only one is active at any one time. The desired output configuration is user selectable via the CONTROL register.
ARCHITECTURE
The DAC core architecture of the AD5412 consists of two matched DAC sections. A simplified circuit diagram is shown in Figure 57. The 4 MSBs of the 12-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects 1 of 15 matched resistors to either ground or the reference buffer output. The remaining 12 bits of the data-word drive switches S0 to S7 of an 8-bit voltage mode R-2R ladder network.
OUT
2R
2R
2R
2R
S1
S0
V
REF
8-BIT R-2R L ADDE R FOUR MSBs DECODED INTO
Figure 57. DAC Ladder Structure
2R
S7
15 EQUAL SEGMENTS
2R E2
E1
The voltage output from the DAC core is either converted to a current (see diagram, Figure 58) which is then mirrored to the supply rail so that the application simply sees a current source output with respect to ground or it is buffered and scaled to output a software selectable unipolar or bipolar voltage range (See diagram, Figure 59). The current and voltage are output on separate pins and cannot be output simultaneously.
AV
DD
2R E15
12-BIT DAC
REFIN
RANGE SCALING
Figure 59. Voltage Output
Voltage Output Amplifier
The voltage output amplifier is capable of generating both unipolar and bipolar output voltages. It is capable of driving a load of 2 kΩ in parallel with 1 µF to AGND. The source and sink capabilities of the output amplifier can be seen in Figure TBD. The slew rate is 1 V/µs with a full-scale settling time of 10 µs, (10V step). Figure 59 shows the voltage output drving a load,
on top of a common mode voltage of up to ±3V.
R
L
In output module applications where a cable could possibly become disconnected from +V
resulting in the amplifier
SENSE
loop being broken and most probably resulting in large destructive voltages on V
, a resistor, R1, of value 2k to 5k
OUT
should be included as shown to ensure the amplifier loop is kept closed.
Driving Large Capacitive Loads
The voltage output amplifier is capable of driving capacitive loads of up to 1uF with the addition of a non-polarised 4nF compensation capacitor between the C
COMP1
Without the compensation capacitor, up to 20nF capacitive loads can be driven.
Reference Buffers
The AD5412 can operate with either an external or internal reference. The reference input has an input range of 4 V to 5 V, 5 V for specified performance. This input voltage is then buffered before it is applied to the DAC.
R2
R3
SERIAL INTERFACE
The AD5412 is controlled over a versatile 3-wire serial interface that operates at clock rates up to 30 MHz. It is compatible with SPI®, QSPI™, MICROWIRE™, and DSP standards.
Input Shift Register
The input shift register is 24 bits wide. Data is loaded into the
12-BIT DAC
A1
T1
A2
T2
I
OUT
device MSB first as a 24-bit word under the control of a serial
R1
Figure 58. Voltage to Current conversion circuitry
clock input, SCLK. Data is clocked in on the rising edge of SCLK. The input register consists of 8 control bits and 16 data bits as shown in Table 7. The 24 bit word is unconditionally latched on the rising edge of LATCH. Data will continue to be clocked in irrespective of the state of LATCH, on the rising edge of LATCH the data that is present in the input register will be latched, in other words the last 24 bits to be clocked in before
Rev. PrC | Page 24 of 37
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the rising edge of LATCH will be the data that is latched. The timing diagram for this operation is shown in Figure 2.
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Table 7. Input Shift Register Format
MSB LSB
D23 D22 D21 D20 D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
ADDRESS WORD DATA WORD
Table 8. Control Word Functions
Address Word
00000000 No Operation (NOP) 00000001 DATA Register 00000010
01010101 CONTROL Register 01010110 RESET Register
Functio n
Readback register value as per Read Address (See Table 10)
Standalone Operation
The serial interface works with both a continuous and noncon­tinuous serial clock. A continuous SCLK source can only be used if LATCH is taken high after the correct number of data bits have been clocked in. In gated clock mode, a burst clock containing the exact number of clock cycles must be used, and LATCH must be taken high after the final clock to latch the data. The first rising edge of SCLK that clocks in the MSB of the dataword marks the beginning ot the write cycle. Exactly 24 rising clock edges must be applied to SCLK before LATCH is
th
brought high. If LATCH is brought high before the 24
rising
SCLK edge, the data written will be invalid. If more than 24 rising SCLK edges are applied before LATCH is brought high, the input data will also be invalid.
CONTROLLER
DATA OUT
SERIAL CLOCK
CONTROL OUT
DATA IN
AD5412*
SDIN SCLK LATCH
SDO
SDIN
AD5412*
SCLK LATCH
SDO
SDIN
AD5412*
SCLK LATCH
Rev. PrC | Page 26 of 37
SDO
*ADDITIONA L PINS OM ITTE D F OR CLARI TY
Figure 60. Daisy Chaining the AD5412
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Daisy-Chain Operation
For systems that contain several devices, the SDO pin can be used to daisy chain several devices together as shown in Figure
60. This daisy-chain mode can be useful in system diagnostics and in reducing the number of serial interface lines. Daisychain mode is enabled by setting the DCEN bit of the CONTROL register. The first rising edge of SCLK that clocks in the MSB of the dataword marks the beginning of the write cycle. SCLK is continuously applied to the input shift register. If more than 24 clock pulses are applied, the data ripples out of the shift register and appears on the SDO line. This data is clocked out on the falling edge of SCLK and is valid on the next rising edge. By connecting the SDO of the first device to the SDIN input of the next device in the chain, a multidevice interface is constructed. Each device in the system requires 24 clock pulses. Therefore, the total number of clock cycles must equal 24 × the total number of AD5412 devices in the chain. When the serial transfer to all devices is complete, LATCH is taken high. This latches the input data in each device in the daisy chain. The serial clock can be a continuous or a gated clock.
A continuous SCLK source can only be used if LATCH is taken high after the correct number of clock cycles. In gated clock
N, where N is
mode, a burst clock containing the exact number of clock cycles must be used, and LATCH must be taken high after the final clock to latch the data. See Figure 4 for a timing diagram.
Readback Operation
Readback mode is invoked by setting the control word and read address as shown in Table 9 and Table 10 when writing to the input register. The next write to the AD5412 should be a NOP command which will clock out the data from the previously addressed register as shown in Figure 3. By default the SDO pin is disabled, after having addressed the AD5412 for a read operation, a rising edge on LATCH will enable the SDO pin in anticipation of data being clocked out, after the data has been clocked out on SDO, a rising edge on LATCH will disable (tri-state) the SDO pin once again. To read back the data register for example, the following sequence should be implemented:
Write 0x020001 to the AD5412 input register. This
1. configures the part for read mode with the data register selected.
Follow this with a second write, a NOP condition, 0x000000
2. During this write, the data from the register is clocked out on the SDO line.
Table 9. Input Shift Register Contents for a read operation
MSB LSB
D23 D22 D21 D20 D19 D18 D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 1 0 X X X X X X X X X X X X X X
Table 10. Read Address Decoding
Read Address Function
00 Read Status Register 01 Read Data Register 10 Read Control Register
Read Address
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V
is the reference voltage applied at the REFIN pin.
DEFAULT CONFIGURATION
On initial power-up of the AD5412 the power-on-reset circuit ensures that all registers are loaded with zero-code, as such the default output is the current output with the 4mA to 20mA range selected, the current output until a value is programmed is 0mA. The voltage output pin will be in three-state. An alternative current range or a voltage output range may be selected via the CONTROL register.
TRANSFER FUNCTION
Voltage Output
For a unipolar voltage output range, the output voltage expression is given by
D
×=
GainVV
REFIN
OUT
For a bipolar voltage output range, the output voltage expression is given by
GainVV
×=
REFIN
OUT
where:
D is the decimal equivalent of the code loaded to the DAC. N is the bit resolution of the DAC.
N
2
VGain
D
N
×
REFIN
22
REFIN
Gain is an internal gain whose value depends on the output
range selected by the user as shown in Table 11.
Table 11.
Output Range Gain Value
+5 V 1 +10 V 2 ±5 V 2 ±10 V 4
Current Output
For the 0 to 20mA, 0 to 24mA and 4 to 20mA current output ranges the output current expressions are respectively given by
20
mA
24
2
2
N
mA
N
⎤ ⎥
D
×
⎥ ⎦
D
×
⎥ ⎦
mAD
4
+×
OUT
OUT
=
=
⎢ ⎣
=
⎢ ⎣
mA
16
N
2
I
I
I
OUT
where:
D is the decimal equivalent of the code loaded to the DAC. N is the bit resolution of the DAC.
Rev. PrC | Page 28 of 37
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DATA REGISTER
The DATA register is addressed by setting the control word of the input shift register to 0x01. The data to be written to the DATA registe r is entered in positions D15 to D0 as shown in Table 12,
Table 12. Programming the Data Register
MSB LSB D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DATA WORD X X X X
CONTROL REGISTER
The CONTROL register is addressed by setting the control word of the input shift register to 0x55. The data to be written to the CONTROL register is entered in positions D15 to D0 as shown in Table 13. The CONTROL register functions are shown in Table 14.
Table 13. Programming the CONTROL Register
MSB LSB D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
CLRSEL OVRRNG REXT OUTEN SR CLOCK SR STEP SREN DCEN R2 R1 R0
Table 14. Control Register Functions
Option Description
CRSEL
OVRRNG
REXT
OUTEN
SR CLOCK See Features Section. Digital Slew Rate Control SR STEP See Features Section. Digital Slew Rate Control SREN Digital Slew Rate Control enable DCEN Daisychain enable R2,R1,R0 Output range select. See Table 15
See Table 20 for a description of the CLRSEL operation
Setting this bit increases the voltage output range by 10%. Further details in Features section
Setting this bit selects the external current setting resistor, Further details in Features section
Output enable. This bit must be set to enable the outputs, The range bits select which output will be functional.
RESET REGISTER
The RESET register is addressed by setting the control word of the input shift register to 0x56. The data to be written to the RESET register is entered in positions D15 to D0 as shown in Table 16. The RESET register options are shown in Table 16 and Table 17.
Table 15. Output Range Options
R2 R1 R0 Output Range Selected
0 0 0 0 to +5V Voltage Range 0 0 1 0 to 10V Voltage Range 0 1 0 ±5V Voltage Range 0 1 1 ±10V Voltage Range 1 0 1 4 to 20 mA Current Range 1 1 0 0 to 20 mA Current Range 1 1 1 0 to 24 mA Current Range
Table 16. Programming the RESET Register
MSB LSB D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
RESET
Table 17. RESET register Functions
Option Description
RESET Setting this bit performs a reset operation, restoring the AD5412 to its initial power on state
Rev. PrC | Page 29 of 37
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STATUS REGISTER
The STATUS register is a read only register. The STATUS register functionality is shown in Table 18 and Table 19.
Table 18. Decoding the STATUS Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
I
Table 19. STATUS Register Functions
Option Description
I
FAULT This bit will be set if a fault is detected on the I
OUT
SLEW ACTIVE This bit will be set while the output value is slewing (slew rate control enabled) OVER TEMP This bit will be set if the AD5412 core temperature exceeds approx. 150°C.
OUT
pin.
FAULT SLEW ACTIVE OVER TEMP
OUT
Rev. PrC | Page 30 of 37
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FEATURES
FAULT ALERT
The AD5412 is equipped with a FAULT pin, this is an open­drain output allowing several AD5412 devices to be connected together to one pull-up resistor for global fault detection. The FAULT pin is forced active by any one of the following fault scenarios;
The Voltage at I
1) compliance range, due to an open-loop circuit or insufficient power supply voltage. The I controlled by a PMOS transistor and internal amplifier as shown in Figure 58. The internal circuitry that develops the fault output avoids using a comparator with “window limits” since this would require an actual output error before the FAULT output becomes active. Instead, the signal is generated when the internal amplifier in the output stage has less than approxiamately one volt of remaining drive capability (when the gate of the output PMOS transistor nearly reaches ground). Thus the FAULT output activates slightly before the compliance limit is reached. Since the comparison is made within the feedback loop of the output amplifier, the output accuracy is maintained by its open-loop gain and an output error does not occur before the FAULT output becomes active.
If the core temperature of the AD5412 exceeds approx.
2) 150°C.
The OPEN CCT and OVER TEMP bits of the STATUS register are used in conjunction with the FAULT pin to inform the user which one of the fault conditions caused the FAULT pin to be asserted. See Table 18 and Table 19.
attempts to rise above the
OUT
current is
OUT
VOLTAGE OUTPUT SHORT CIRCUIT PROTECTION
Under normal operation the voltage output will sink/source 5mA and maintain specified operation. The maximum current that the voltage output will deliver is 10mA, this is the short circuit current.
ASYNCHRONOUS CLEAR (CLEAR)
CLEAR is an active high clear that allows the voltage output to be cleared to either zero-scale code or mid-scale code, user­selectable via the CLEAR SELECT pin or the CLRSEL bit of the CONTROL register as described in Table 20. (The Clear select feature is a logical OR function of the CLEAR SELECT pin and the CLRSEL bit). The Current output will clear to the bottom of its programmed range. It is necessary to maintain CLEAR high for a minimum amount of time (see Figure 2) to complete the operation. When the CLEAR signal is returned low, the output remains at the cleared value until a new value is programmed. A clear operation can also be performed via the CLEAR command in the control register.
Rev. PrC | Page 31 of 37
Table 20. CLEAR SELECT Options
CLR SELECT Output CLR Value Unipolar Output Range Bipolar Output Range
0 0 V 0 V 1 Mid-Scale Negative Full-Scale
INTERNAL REFERENCE
The AD5412 contains an integrated +5V voltage reference with initial accuracy of ±2mV max and a temperature drift coefficient of ±10 ppm max. The reference voltage is buffered and externally available for use elsewhere within the system. See Figure 56 for a load regulation graph of the Integrated reference.
EXTERNAL CURRENT SETTING RESISTOR
Referring to Figure 58, R1 is an internal sense resistor as part of the voltage to current conversion circuitry. The stability of the output current over temperature is dependent on the stability of the value of R1. As a method of improving the stability of the output current over temperature an external precision 15k low drift resistor can be connected to the R be used instead of the internal resistor R1. The external resistor is selected via the CONTROL register. See Table 13.
pin of the AD5412 to
SET
VOLTAGE OUTPUT OVER-RANGE
An over-range facility is provided on the voltage output. When enabled via the CONTROL register, the selected output range will be over-ranged by 10%.
DIGITAL POWER SUPPLY
By default the DVCC pin accepts a power supply of 2.7V to 5.5V, alternatively, via the DV supply may be output on the DV supply for other devices in the system or as a termination for pull-up resistors. This facility offers the advantage of not having to bring a digital supply across an isolation barrier. The internal power supply is enabled by leaving the DV unconnected. To disable the internal supply DV should be tied to 0V.
SELECT pin an internal 4.5V power
CC
pin for use as a digital power
CC
SELECT pin
CC
SELECT
CC
EXTERNAL BOOST FUNCTION
The addition of an external boost transistor as shown in Figure 61 will reduce the power dissipated in the AD5412 by reducing the current flowing in the on-chip output transistor (dividing it by the current gain of the external circuit). A discrete NPN transistor with a breakdown voltage, BV can be used. The external boost capability has been developed for those users who may wish to use the AD5412 at the extremes of the supply voltage, load current and temperature range. The boost transistor can also be used to reduce the amount of temperature induced drift in the part. This will minimise the temperature induced drift of the on-chip voltage reference, which improves drift and linearity.
, greater than 60V
CEO
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BOOST
MJD31C
OR
PBSS8110Z
AD5412
I
OUT
0.022 F
1k
R
LOAD
Figure 61. External Boost Configuration
DIGITAL SLEW RATE CONTROL
The Slew Rate Control feature of the AD5412 allows the user to control the rate at which the output value changes. This feature is available on both the current and voltage outputs. With the slew rate control feature disabled the output value will change at a rate limited by the output drive circuitry and the attached load. If the user wishes to reduce the slew rate this can be achieved by enabling the slew rate control feature.With the feature enabled via the SREN bit of the CONTROL register, (See Table 13) the output, instead of slewing directly between two values, will step digitally at a rate defined by two parameters accessible via the CONTROL register as shown in Table 13. The parameters are SR CLOCK and SR STEP. SR CLOCK defines the rate at which the digital slew will be updated, e.g. if the selected update rate is 1MHz the output will update every 1µs, SR STEP defines by how much the output value will change at each update. Together both parameters define the rate of change of the output value.Table 21 and Table 22 outline the range of values for both the SR CLOCK and SR STEP parameters.
Table 21. Slew Rate Update Clock Options
SR CLOCK Update Clock Frequency (Hz)
0000 1000000 0001 500000 0010 333333 0011 250000 0100 200000 0101 100000 0110 50000 0111 33333 1000 25000 1001 20000 1010 12500 1011 10000 1100 8333 1101 6666 1110 5000 1111 3921
Table 22. Slew Rate Step Size Options
SR STEP Step Size (LSBs)
000 1 001 2 010 4 011 8 100 16 101 32 110 64 111 128
The following equation describes the slew rate as a function of the step size, the update clock frequency and the LSB size.
SlewRate
=
6
101×
LSBSizekFrequencyUpdateClocStepSize
Where:
Slew Rate is expressed in A/µs For I
or V/µs for V
OUT
OUT
LSBSize = Fullscale Range / 65536
When the slew rate control feature is enabled, all output changes will change at the programmed slew rate, i.e. if the CLEAR pin is asserted the output will slew to the clear value at the programmed slew rate. The output can be halted at its current value with a write to the CONTROL register. To avoid halting the output slew, the SLEW ACTIVE bit can be used to check that the slew has completed before writing to the AD5412 registers. See Table 18.
I
FILTERING CAPACITORS
OUT
Two capacitors may be placed between the pins CAP1, CAP2 and AV
as shown in Figure 62. The capacitors form a filter on
DD
the current output circuitry reducing the bandwidth and the rate of change of the output current.
AV
DD
C1C
2
AV
DD
CAP1
AGND
CAP2
I
OUT
AD5412
Figure 62. I
Filtering Capacitors
OUT
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APPLICATIONS INFORMATION
DRIVING INDUCTIVE LOADS
When driving inductive or poorly defined loads connect a
0.01µF capacitor between I
and GND. This will ensure
OUT
stability with loads beyond 50mH. There is no maximum capacitance limit. The capacitive component of the load may cause slower settling, though this may be masked by the settling time of the AD5412.
TRANSIENT VOLTAGE PROTECTION
The AD5412 contains ESD protection diodes which prevent damage from normal handling. The industrial control environment can, however, subject I/O circuits to much higher transients. In order to protect the AD5412 from excessively high voltage transients , external power diodes and a surge current limiting resistor may be required, as shown in Figure 63. The constraint on the resistor value is that during normal operation the output level at IOUT must remain within its voltage compliance limit of and resistor must have appropriate power ratings.
AVDD – 2.5V and the two protection diodes
AV
DD
AV
DD
AD5412
Figure 63. Output Transient Voltage Protection
AGND
I
OUT
R
P
R
LOAD
avoid radiating noise to other parts of the board and should never be run near the reference inputs. A ground line routed between the SDIN and SCLK lines helps reduce crosstalk between them (not required on a multilayer board that has a separate ground plane, but separating the lines helps). It is essential to minimize noise on the REFIN line because it couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feed through the board. A microstrip technique is by far the best, but not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground plane, while signal traces are placed on the solder side.
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide an isolation barrier between the controller and the unit being controlled to protect and isolate the controlling circuitry from any hazardous common-mode voltages that might occur. The
iCoupler® family of products from Analog Devices provides
voltage isolation in excess of 2.5 kV. The serial loading structure of the AD5412 make it ideal for isolated interfaces because the number of interface lines is kept to a minimum. Figure 64 shows a 4-channel isolated interface to the AD5412 using an
ADuM1400. For further information, visit http://www.analog.com/icouplers.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5412 is mounted should be designed so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5412 is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. The star ground point should be established as close as possible to the device.
The AD5412 should have ample supply bypassing of 10 µF in parallel with 0.1 µF on each supply located as close to the package as possible, ideally right up against the device. The 10 µF capacitors are the tantalum bead type. The 0.1 µF capacitor should have low effective series resistance (ESR) and low effective series inductance (ESI) such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching.
The power supply lines of the AD5412 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals such as clocks should be shielded with digital ground to
Controller
Serial Clock Out
Serial Data Out
SYNC Out
Control out
*ADDITIONAL PI NS O M ITTED FOR CLARITY
ADuM1400 *
V
IA
ENCODE DECODE
V
IB
ENCODE DECODE
V
IC
ENCODE DECODE
V
ID
ENCODE DECODE
Figure 64. Isolated Interface
V
OA
V
OB
V
OC
V
OD
To SCLK
To S DI N
To LAT C H
To CLEA R
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5412 is via a serial bus that uses protocol compatible with microcontrollers and DSP processors. The communications channel is a 3-wire (minimum) interface consisting of a clock signal, a data signal, and a latch signal. The AD5412 require a 24-bit data-word with data valid on the rising edge of SCLK.
For all interfaces, the DAC output update is initiated on the rising edge of LATCH. The contents of the registers can be read using the readback function.
Rev. PrC | Page 33 of 37
AD5412 Preliminary Technical Data
(
www.BDTIC.com/ADI
THERMAL AND SUPPLY CONSIDERATIONS
The AD5412 is designed to operate at a maximum junction temperature of 125°C. It is important that the device is not operated under conditions that will cause the junction temperature to exceed this value . Excessive junction temperature can occur if the AD5412 is operated from the maximum AV directly to ground. In this case the ambient temperature should be controlled or AV depend on the device package.
and driving the maximum current (24mA)
DD
should be reduced. The conditions will
DD
At maximum ambient temperature of 85°C the 24-lead TSSOP package can dissipate 950mW and the 40-lead LFCSP package can dissipate 1.42W. To ensure the junction temperature does not exceed 125°C while driving the maximum current of 24mA directly into ground (also adding an on-chip current of 3mA), AV
should
DD
be reduced from the maximum rating to ensure the package is not required to dissipate more power than stated above. See Table 23, Figure 65 and Figure 66.
2.5
2
1.5
1
Power Dissipation (W)
0.5
0
40 45 50 55 60 65 70 75 80 85
Figure 65. Maximum Power Dissipation Vs Ambient Temperature Figure 66. Maximum Supply Voltage Vs Ambient Temperature
Ambient Temperature (°C)
TSSOP LFCSP
45
43
41
39
37
35
33
Supply Voltage (V)
31
29
27
25
25 35 45 55 65 75 85
Ambient Temperature (°C)
TSSOP LFCSP
Table 23. Thermal and Supply considerations for each package
TSSOP LFCSP
Maximum allowed power dissipation when operating at an ambient temperature of 85°C
Maximum allowed ambient temperature when operating from a supply of 60V and driving 24mA directly to ground.
Maximum allowed supply voltage when operating at an ambient temperature of 85°C and driving 24mA directly to ground.
max
T
AI
T
J
Θ
max
JA
A
TT
AJ
Θ×
JADD
85125
=
=
mW
950
W
42
JADJ
85125
=
35
=
42027.0
×
)
V
V
CPT
°=××=Θ× 7942027.040125max
max
T
AI
T
J
Θ
max
JA
A
TT
AJ
Θ×
JADD
85125
=
=
42.1
28
JADJ
=
()
85125
53
=
28027.0
×
CPT
°>××=Θ× 8528027.040125max
Rev. PrC | Page 34 of 37
Preliminary Technical Data AD5412
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
7.90
7.80
7.70
5.02
5.00
4.95
24
1.20 MAX
0.15
0.05
0.10 COPLANARI TY
INDICATOR
1.00
0.85
0.80
PIN 1
SEATING PLANE
12° MAX
SEATING PLANE
13
TOP VIEW
0.65 BSC
4.50
4.40
4.30
1.05
1.00
0.80
6.40 BSC
8° 0°
121
0.30
0.19
COMPLI ANT TO JE DE C S TANDARDS MO-153-ADT
BOTTOM VIEW
0.20
0.09
EXPOSED
PAD
(Pins Up)
0.75
0.60
0.45
Figure 67. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
6.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.30
0.23
0.18
5.75
BCS SQ
0.20 REF
0.05 MAX
0.02 NOM
COPLANARITY
0.60 MAX
0.50 BSC
0.50
0.40
0.30
0.08
0.60 MAX
31
30
EXPOSED
(BOTTOM VIEW)
21
20
PAD
4.50 REF
40
1
10
11
3.25
3.20
3.15
PIN 1 INDICATOR
4.25
4.10 SQ
3.95
0.25 MIN
050806-A
COMPLI ANT TO JE DE C S TANDARDS MO-220-V JJD- 2
Figure 68. 40-Lead Lead Frame Chip Scale Package
(CP-40)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD5412BREZ -40°C to 85°C 24 Lead TSSOP_EP RE-24 AD5412BCPZ -40°C to 85°C 40 Lead LFCSP CP-40
Rev. PrC | Page 35 of 37
101306-A
AD5412 Preliminary Technical Data
www.BDTIC.com/ADI
NOTES
Rev. PrC | Page 36 of 37
Preliminary Technical Data AD5412
www.BDTIC.com/ADI
NOTES
©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR07028-0-11/07(PrC)
Rev. PrC | Page 37 of 37
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