Guaranteed monotonic
INL error: ±4 LSB max
On-chip 1.25 V/2.5 V, 10 ppm/°C reference
Temperature range: –40°C to +85°C
Rail-to-rail output amplifier
Power-down
Package type: 100-lead CSPBGA (10 mm × 10 mm)
User Interfaces:
Serial (SPI-®/QSPI-™/MICROWIRE-™/DSP-compatible,
featuring data readback)
2
C-®compatible
I
FUNCTIONAL BLOCK DIAGRAM
DVDD (×3)DGND (×4)AVDD (×5)AGND (×5)DAC GND (×5)REFGNDREFOUT/REFIN SIGNAL GND (×5)
PD
SYNC/AD 0
DCEN/AD 1
AD5384
Serial, 14-Bit Voltage Output DAC
AD5384
INTEGRATED FUNCTIONS
Channel monitor
Simultaneous output update via
Clear function to user-programmable code
Amplifier boost mode to optimize slew rate
User-programmable offset and gain adjust
Toggle mode enables square wave generation
Thermal monitor
APPLICATIONS
Variable optical attenuators (VOA)
Level setting (ATE)
Optical micro-electro-mechanical systems (MEMS)
Control systems
Instrumentation
1.25V/2.5V
REFERENCE
LDAC
INPUT
REG 0
SDO
DIN/SDA
SCLK/SCL
SPI/I2C
RESET
BUSY
CLR
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
INTERFACE
CONTROL
LOGIC
POWER-ON
RESET
VOUT0……VOUT38
39-TO-1
MUX
VOUT39/MON_OUTLDAC
STATE
MACHINE
+
CONTROL
LOGIC
14
14
INPUT
REG 1
14
14
INPUT
REG 6
14
14
INPUT
REG 7
14
14
m REG 0
c REG 0
m REG 1
c REG 1
m REG 6
c REG 6
m REG 7
c REG 7
Figure 1.
14141414
×5
DAC
REG 0
DAC
REG 1
DAC
REG 6
DAC
REG 7
DAC 0
R
R
14141414
DAC 1
R
R
14141414
DAC 6
R
R
14141414
DAC 7
R
R
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
VOUT7
VOUT8
VOUT38
04652-0-001
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
The AD5384 is a complete single-supply, 40-channel, 14-bit
DAC available in a 100-lead CSPBGA package. All 40 channels
have an on-chip output amplifier with rail-to-rail operation.
The AD5384 includes an internal 1.25 V/2.5 V, 10 ppm/°C
reference, an on-chip channel monitor function that multiplexes
the analog outputs to a common MON_OUT pin for external
monitoring, and an output amplifier boost mode that allows the
amplifier slew rate to be optimized. The AD5384 contains a
serial interface compatible with SPI, QSPI, MICROWIRE, and
Table 1. Complete Family of High Channel Count, Low Voltage, Single-Supply DACs in Portfolio
Model Resolution AVDD Range Output Channels Linearity Error (LSB) Package Description Package Option
AD5380BST-5 14 Bits 4.5 V to 5.5 V 40 ±4 100-Lead LQFP ST-100
AD5380BST-3 14 Bits 2.7 V to 3.6 V 40 ±4 100-Lead LQFP ST-100
AD5381BST-5 12 Bits 4.5 V to 5.5 V 40 ±1 100-Lead LQFP ST-100
AD5381BST-3 12 Bits 2.7 V to 3.6 V 40 ±1 100-Lead LQFP ST-100
AD5384BBC-5 14 Bits 4.5 V to 5.5 V 40 ±4 100-Lead CSPBGA BC-100
AD5384BBC-3 14 Bits 2.7 V to 3.6 V 40 ±4 100-Lead CSPBGA BC-100
AD5382BST-5 14 Bits 4.5 V to 5.5 V 32 ±4 100-Lead LQFP ST-100
AD5382BST-3 14 Bits 2.7 V to 3.6 V 32 ±4 100-Lead LQFP ST-100
AD5383BST-5 12 Bits 4.5 V to 5.5 V 32 ±1 100-Lead LQFP ST-100
AD5383BST-3 12 Bits 2.7 V to 3.6 V 32 ±1 100-Lead LQFP ST-100
AD5390BST-5 14 Bits 4.5 V to 5.5 V 16 ±3 52-Lead LQFP ST-52
AD5390BCP-5 14 Bits 4.5 V to 5.5 V 16 ±3 64-Lead LFCSP CP-64
AD5390BST-3 14 Bits 2.7 V to 3.6 V 16 ±4 52-Lead LQFP ST-52
AD5390BCP-3 14 Bits 2.7 V to 3.6 V 16 ±4 64-Lead LFCSP CP-64
AD5391BST-5 12 Bits 4.5 V to 5.5 V 16 ±1 52-Lead LQFP ST-52
AD5391BCP-5 12 Bits 4.5 V to 5.5 V 16 ±1 64-Lead LFCSP CP-64
AD5391BST-3 12 Bits 2.7 V to 3.6 V 16 ±1 52-Lead LQFP ST-52
AD5391BCP-3 12 Bits 2.7 V to 3.6 V 16 ±1 64-Lead LFCSP CP-64
AD5392BST-5 14 Bits 4.5 V to 5.5 V 8 ±3 52-Lead LQFP ST-52
AD5392BCP-5 14 Bits 4.5 V to 5.5 V 8 ±3 64-Lead LFCSP CP-64
AD5392BST-3 14 Bits 2.7 V to 3.6 V 8 ±4 52-Lead LQFP ST-52
AD5392BCP-3 14 Bits 2.7 V to 3.6 V 8 ±4 64-Lead LFCSP CP-64
DSP interface standards with interface speeds in excess of
2
30 MHz and an I
C-compatible interface supporting 400 kHz
data transfer rate. An input register followed by a DAC register
provides double buffering, allowing the DAC outputs to be
updated independently or simultaneously. using the
LDAC
input. Each channel has a programmable gain and offset adjust
register letting the user fully calibrate any DAC channel. Power
consumption is typically 0.25 mA/channel with boost mode off.
Table 2. 40-Channel, Bipolar Voltage Output DAC
Model Resolution Analog Supplies Output Channels Linearity Error (LSB) Package Package Option
AD5379ABC 14 Bits ±11.4 V to ±16.5 V 40 ±3 108-Lead CSPBGA BC-108
Rev. A | Page 3 of 36
AD5384
SPECIFICATIONS
AD5384-5 SPECIFICATIONS
AVDD = 4.5 V to 5.5 V; DVDD = 2.7 V to 5.5 V, AGND = DGND = 0 V; external REFIN = 2.5 V; all specifications T
otherwise noted.
Table 3.
Parameter AD5384-51 Unit Test Conditions/Comments
ACCURACY
Resolution 14 Bits
Relative Accuracy2 (INL) ±4 LSB max ±1 LSB typical
Differential Nonlinearity (DNL) –1/+2 LSB max Guaranteed monotonic by design over temperature
Zero-Scale Error 4 mV max
Offset Error ±4 mV max Measured at code 32 in the linear region
Offset Error TC ±5 µV/°C typ
Gain Error ±0.024 % FSR max At 25°C
±0.06 % FSR max T
Gain Temperature Coefficient
DC Crosstalk
3
3
2 ppm FSR/°C typ
0.5 LSB max
MIN
to T
MAX
REFERENCE INPUT/OUTPUT
Reference Input
3
Reference Input Voltage 2.5 V ±1% for specified performance, AVDD = 2 × REFIN + 50 mV
DC Input Impedance 1 MΩ min Typically 100 MΩ
Input Current ±1 µA max Typically ±30 nA
Reference Range 1 to VDD/2 V min/max
Reference Output
4
Enabled via CR10 in the AD5384 control register, CR12,
selects the output voltage.
Output Voltage 2.495/2.505 V min/max At ambient; CR12 = 1; optimized for 2.5 V operation
1.22/1.28 V min/max CR12 = 0
Reference TC ±10 ppm/°C max Temperature range: +25°C to +85°C
±15 ppm/°C max Temperature range: −40°C to +85°C
OUTPUT CHARACTERISTICS
Output Voltage Range
3
2
0/AV
DD
V min/max
Short-Circuit Current 40 mA max
Load Current ±1 mA max
Capacitive Load Stability
RL = ∞ 200 pF max
RL = 5 kΩ 1000 pF max
DC Output Impedance 0.5 Ω max
MONITOR PIN
Output Impedance 500 Ω typ
Three-State Leakage Current 100 nA typ
LOGIC INPUTS (EXCEPT SDA/SCL)
3
DVDD = 2.7 V to 5.5 V
VIH, Input High Voltage 2 V min
VIL, Input Low Voltage 0.8 V max
Input Current ±10 µA max Total for all pins. TA = T
MIN
to T
Pin Capacitance 10 pF max
LOGIC INPUTS (SDA, SCL ONLY)
VIH, Input High Voltage 0.7 DVDD V min SMBus-compatible at DVDD < 3.6 V
VIL, Input Low Voltage 0.3 DVDD V max SMBus-compatible at DVDD < 3.6 V
IIN, Input Leakage Current ±1 µA max
V
, Input Hysteresis 0.05 DVDD V min
HYST
CIN, Input Capacitance 8 pF typ
Glitch Rejection 50 ns max Input filtering suppresses noise spikes of less than 50 ns
MAX
MIN
to T
MAX
, unless
Rev. A | Page 4 of 36
AD5384
Parameter AD5384-51 Unit Test Conditions/Comments
LOGIC OUTPUTS (BUSY, SDO)3
VOL, Output Low Voltage 0.4 V max DVDD = 5 V ± 10%, sinking 200 µA
VOH, Output High Voltage DVDD – 1 V min DVDD = 5 V ± 10%, sourcing 200 µA
VOL, Output Low Voltage 0.4 V max DVDD = 2.7 V to 3.6 V, sinking 200 µA
VOH, Output High Voltage DVDD – 0.5 V min DVDD = 2.7 V to 3.6 V, sourcing 200 µA
High Impedance Leakage Current ±1 µA max SDO only
High Impedance Output Capacitance 5 pF typ SDO only
LOGIC OUTPUT (SDA)3
VOL, Output Low Voltage 0.4 V max I
0.6 V max I
Three-State Leakage Current ±1 µA max
Three-State Output Capacitance 8 pF typ
POWER REQUIREMENTS
AVDD 4.5/5.5 V min/max
DVDD 2.7/5.5 V min/max
Power Supply Sensitivity3
∆Midscale/∆ΑVDD –85 dB typ
AIDD 0.375 mA/channel max Outputs unloaded, boost off; 0.25 mA/channel typ
0.475 mA/channel max Outputs unloaded, boost on; 0.32 5mA/channel typ
DIDD 1 mA max VIH = DVDD, VIL = DGND
AIDD (Power-Down) 2 µA max Typically 200 nA
DIDD (Power-Down) 20 µA max Typically 3 µA
Power Dissipation 80 mW max Outputs unloaded, boost off, AVDD = DVDD = 5 V
1
AD5384-5 is calibrated using an external 2.5 V reference. Temperature range for all versions: –40°C to +85°C.
2
Accuracy guaranteed from V
3
Guaranteed by characterization, not production tested.
4
Default on the AD5384-5 is 2.5 V. Programmable to 1.25 V via CR12 in the AD5384 control register; operating the AD5384-5 with a 1.25 V reference will lead to
degraded accuracy specifications.
= 10 mV to AVDD – 50 mV.
OUT
= 3 mA
SINK
= 6 mA
SINK
Rev. A | Page 5 of 36
AD5384
AC CHARACTERISTICS
AVDD = 2.7 V to 3.6 V; DVDD = 2.7 V to 5.5 V, AGND = DGND = 0 V.
Table 4.
Parameter AD5384-5 Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time
8 µs typ
10 µs max
Slew Rate
3 V/µs typ Boost mode on, CR11 = 1
Digital-to-Analog Glitch Energy 12 nV-s typ
Glitch Impulse Peak Amplitude 15 mV typ
Channel-to-Channel Isolation 100 dB typ See the Terminology section
DAC-to-DAC Crosstalk 1 nV-s typ See the Terminology section
Digital Crosstalk 0.8 nV-s typ
Digital Feedthrough 0.1 nV-s typ Effect of input bus activity on DAC output under test
Output Noise 0.1 Hz to 10 Hz 15 µV p-p typ External reference, midscale loaded to DAC
40 µV p-p typ Internal reference, midscale loaded to DAC
Output Noise Spectral Density
1
Guaranteed by design and characterization, not production tested.
2
The slew rate can be programmed via the current boost control bit (CR11) in the AD5384 control register.
2
@ 1 kHz 150 nV/√Hz typ
@ 10 kHz 100 nV/√Hz typ
1
Boost mode off, CR11 = 0
1/4 scale to 3/4 scale change settling to ±1 LSB
2 V/µs typ Boost mode off, CR11 = 0
Rev. A | Page 6 of 36
AD5384
AD5384-3 SPECIFICATIONS
AVDD = 2.7 V to 3.6 V; DVDD = 2.7 V to 5.5 V, AGND = DGND = 0 V; external REFIN = 1.25 V; all specifications T
unless otherwise noted.
Table 5.
Parameter AD5384-31Unit Test Conditions/Comments
ACCURACY
Resolution 14 Bits
Relative Accuracy2 ±4 LSB max
Differential Nonlinearity –1/+2 LSB max Guaranteed monotonic over temperature
Zero-Scale Error 4 mV max
Offset Error ±4 mV max Measured at Code 64 in the linear region
Offset Error TC ±5 µV/°C typ
Gain Error ±0.024 % FSR max At 25°C
±0.1 % FSR max T
Gain Temperature Coefficient
DC Crosstalk
3
3
2 ppm FSR/°C typ
0.5 LSB max
MIN
to T
MAX
REFERENCE INPUT/OUTPUT
Reference Input
3
Reference Input Voltage 1.25 V ±1% for specified performance
DC Input Impedance 1 MΩ min Typically 100 MΩ
Input Current ±1 µA max Typically ±30 nA
Reference Range 1 to AVDD/2 V min/max
Reference Output
4
Output Voltage 1.245/1.255 V min/max At ambient; CR12 = 0; optimized for 1.25 V operation
2.47/2.53 V min/max CR12 = 1
Reference TC ±10 ppm/°C max Temperature range: +25°C to +85°C
OUTPUT CHARACTERISTICS
Output Voltage Range
2
±15 ppm/°C max
3
0/AV
DD
V min/max
Temperature range: −40°C to +85°C
Short-Circuit Current 40 mA max
Load Current ±1 mA max
Capacitive Load Stability
RL = ∞ 200 pF max
RL = 5 kΩ 1000 pF max
DC Output Impedance 0.5 Ω max
MONITOR PIN
Output Impedance 500 Ω typ
Three-State Leakage Current 100 nA typ
LOGIC INPUTS (EXCEPT SDA/SCL)3 DVDD = 2.7 V to 3.6 V
VIH, Input High Voltage 2 V min
V
Input Low Voltage 0.8 V max
IL,
Input Current ±10 µA max Total for all pins; TA = T
MIN
to T
MAX
Pin Capacitance 10 pF max
LOGIC INPUTS (SDA, SCL ONLY)
VIH, Input High Voltage 0.7 DV
VIL, Input Low Voltage 0.3 DV
DD
DD
V min SMBus-compatible at DVDD < 3.6 V
V max SMBus-compatible at DVDD < 3.6 V
IIN, Input Leakage Current ±1 µA max
V
, Input Hysteresis 0.05 DV
HYST
V min
DD
CIN, Input Capacitance 8 pF typ
Glitch Rejection 50 ns max Input filtering suppresses noise spikes of less than 50 ns
MIN
to T
MAX
,
Rev. A | Page 7 of 36
AD5384
Parameter AD5384-31Unit Test Conditions/Comments
LOGIC OUTPUTS (BUSY, SDO)3
VOL, Output Low Voltage 0.4 V max Sinking 200 µA
VOH, Output High Voltage DVDD – 0.5 V min Sourcing 200 µA
High Impedance Leakage Current ±1 µA max SDO only
High Impedance Output Capacitance 5 pF typ SDO only
LOGIC OUTPUT (SDA)
3
VOL, Output Low Voltage 0.4 V max I
0.6 V max I
Three-State Leakage Current ±1 µA max
Three-State Output Capacitance 8 pF typ
POWER REQUIREMENTS
AV
DD
DV
DD
Power Supply Sensitivity
∆Midscale/∆ΑV
AI
DD
3
DD
0.475 mA/channel max Outputs unloaded, boost on; 0.325 mA/channel typ
DI
DD
AIDD (Power-Down) 2 µA max Typically 200 nA
DIDD (Power-Down) 20 µA max Typically 1 µA
Power Dissipation 48 mW max Outputs unloaded, boost off, AVDD = DVDD = 3 V
1
AD5384-3 is calibrated using an external 1.25 V reference. Temperature range is –40°C to +85°C.
2
Accuracy guaranteed from V
3
Guaranteed by characterization, not production tested.
4
Default on the AD5384-3 is 1.25 V. Programmable to 2.5 V via CR12 in the AD5384 control register; operating the AD5384-3 with a 2.5 V reference will lead to degraded
accuracy specifications and limited input code range.
= 10 mV to AVDD – 50 mV.
OUT
= 3 mA
SINK
= 6 mA
SINK
2.7/3.6 V min/max
2.7/3.6 V min/max
–85 dB typ
0.375 mA/channel max Outputs unloaded, boost off; 0.25 mA/channel typ
1 mA max VIH = DVDD, VIL = DGND
Rev. A | Page 8 of 36
AD5384
AC CHARACTERISTICS
AVDD = 2.7 V to 3.6 V and 4.5 V to 5.5 V; DVDD = 2.7 V to 5.5 V; AGND = DGND = 0 V.
Table 6.
Parameter AD5384-3 Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time
8 µs typ
10 µs max
Slew Rate
3 V/µs typ Boost mode on, CR11 = 1
Digital-to-Analog Glitch Energy 12 nV-s typ
Glitch Impulse Peak Amplitude 15 mV typ
Channel-to-Channel Isolation 100 dB typ See the Terminology section
DAC-to-DAC Crosstalk 1 nV-s typ See the Terminology section
Digital Crosstalk 0.8 nV-s typ
Digital Feedthrough 0.1 nV-s typ Effect of input bus activity on DAC output under test
Output Noise 0.1 Hz to 10 Hz 15 µV p-p typ External reference, midscale loaded to DAC
40 µV p-p typ Internal reference, midscale loaded to DAC
Output Noise Spectral Density
1
Guaranteed by design and characterization, not production tested.
2
The slew rate can be programmed via the current boost control bit (CR11 ) in the AD5384 control register.
2
@ 1 kHz 150 nV/√Hz typ
@ 10 kHz 100 nV/√Hz typ
1
Boost mode off, CR11 = 0
1/4 scale to 3/4 scale change settling to ±1 LSB
2 V/µs typ Boost mode off, CR11 = 0
Rev. A | Page 9 of 36
AD5384
T
TIMING CHARACTERISTICS
SERIAL INTERFACE
DVDD = 2.7 V to 5.5 V; AVDD = 4.5 V to 5.5 V or 2.7 V to 3.6 V; AGND = DGND = 0 V; all specifications T
unless otherwise noted.
MIN
to T
MAX
,
Table 7.
Parameter
1, 2, 3
Limit at T
MIN
, T
MAX
Unit Description
t1 33 ns min SCLK cycle time
t
2
13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 4 13 ns min
4
t
6
33 ns min
t7 10 ns min
t7A 50 ns min
SYNC falling edge to SCLK falling edge setup time
th
SCLK falling edge to SYNC falling edge
24
Minimum
Minimum
Minimum
SYNC low time
SYNC high time
SYNC high time in readback mode
t8 5 ns min Data setup time
t9 4.5 ns min Data hold time
4
t
30 ns max
10
t11 670 ns max
4
t
12
20 ns min
t13 20 ns min
t14 100 ns max
t15 0 ns min
t16 100 ns min
24th SCLK falling edge to
BUSY pulse width low (single channel update)
24th SCLK falling edge to
LDAC pulse width low
BUSY rising edge to DAC output response time
BUSY rising edge to LDAC falling edge
LDAC falling edge to DAC output response time
BUSY falling edge
LDAC falling edge
t17 8 µs typ DAC output settling time boost mode off
t18 20 ns min
t
19
5
t
20
5
t
21
5
t
22
t
23
12 µs max
20 ns max SCLK rising edge to SDO valid
5 ns min
8 ns min
20 ns min
CLR pulse width low
CLR pulse activation time
SCLK falling edge to
SYNC rising edge
SYNC rising edge to SCLK rising edge
SYNC rising edge to LDAC falling edge
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with t
3
See , F, and . Figure 2 igure 3 Figure 5,Figure 6
4
Standalone mode only.
5
Daisy-chain mode only.
= t
= 5 ns (10% to 90% of DVDD), and are timed from a voltage level of 1.2 V.
r
f
O OUTPUT PIN
Figure 2. Load Circuit for Digital Output Timing
200µA
C
L
50pF
200µA
Rev. A | Page 10 of 36
I
OL
I
OH
V
OH
V
OL
(MIN) OR
(MAX)
04652-0-003
AD5384
t
1
SCLK
SYNC
t
DIN
BUSY
1
LDAC
1
V
OUT
2
LDAC
2
V
OUT
CLR
V
OUT
1
LDAC ACTIVE DURING BUSY
2
LDAC ACTIVE AFTER BUSY
7
t
4
DB23
t8t
t
3
t
6
9
t
2
t
5
DB0
t
10
t
11
t
12
t
18
t
19
t
13
t
15
242412
t
17
t
14
t
13
t
17
t
16
04652-0-004
Figure 3. Serial Interface Timing Diagram (Standalone Mode)
2448SCLK
t
7A
SYNC
DIN
SDO
SCLK
SYNC
DIN
SDO
DB23DB0DB23DB0
INPUT WORD SPECIFIES
REGISTER TO BE READ
NOP CONDITION
DB23DB0
UNDEFINED
SELECTED REGISTER
DATA CLOCKED OUT
Figure 4. Serial Interface Timing Diagram (Data Readback Mode)
t
1
t
t
7
t
4
t8t
3
9
DB23DB0 DB23DB0
INPUT WORD FOR DAC N
2448
t
2
INPUT WORD FOR DAC N + 1
t
20
DB23DB0
03731-0-005
t
t
22
21
UNDEFINED
INPUT WORD FOR DAC N
LDAC
Figure 5. Serial Interface Timing Diagram (Daisy-Chain Mode)
t
13
t
23
04652-0-005
Rev. A | Page 11 of 36
AD5384
I2C SERIAL INTERFACE
DVDD = 2.7 V to 5.5 V; AVDD = 4.5 V to 5.5 V or 2.7 V to 3.6 V; AGND = DGND = 0 V; all specifications T
unless otherwise noted.
MIN
to T
MAX
,
Table 8.
Parameter
F
SCL
t
1
t
2
t
3
t
4
t
5
2
t
6
0 µs min t
t7 0.6 µs min t
t8 0.6 µs m0in t
t9 1.3 µs min t
1
Limit at T
MIN
, T
Unit Description
MAX
400 kHz max SCL clock frequency
2.5 µs min SCL cycle time
0.6 µs min t
1.3 µs min t
0.6 µs min t
100 ns min t
0.9 µs max t
, SCL high time
HIGH
, SCL low time
LOW
, start/repeated start condition hold time
HD,STA
, data setup time
SU,DAT
, data hold time
HD,DAT
, data hold time
HD,DAT
, setup time for repeated start
SU,STA
, stop condition setup time
SU,STO
, bus free time between a STOP and a START condition
BUF
t10 300 ns max tR, rise time of SCL and SDA when receiving
0 ns min tR, rise time of SCL and SDA when receiving (CMOS-compatible)
t11 300 ns max tF, fall time of SDA when transmitting
0 ns min tF, fall time of SDA when receiving (CMOS-compatible)
300 ns max tF, fall time of SCL and SDA when receiving
20 + 0.1Cb
3
ns min tF, fall time of SCL and SDA when transmitting
Cb 400 pF max Capacitive load for each bus line
1
See . Figure 6
2
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the V
falling edge.
3
Cb is the total capacitance, in pF, of one bus line. tR and tF are measured between 0.3 DVDD and 0.7 DVDD.
min of the SCL signal) in order to bridge the undefined region of SCL’s
IH
SDA
SCL
t
9
START
CONDITION
t
3
t
4
t
10
t
6
Figure 6. I
t
2
C-Compatible Serial Interface Timing Diagram
t
11
t
2
5
REPEATED
CONDITION
t
7
START
t
4
t
1
t
8
STOP
CONDITION
04652-0-006
Rev. A | Page 12 of 36
AD5384
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.1
Table 9.
Parameter Rating
AVDD to AGND –0.3 V to +7 V
DVDD to DGND –0.3 V to +7 V
Digital Inputs to DGND –0.3 V to DVDD + 0.3 V
SDA/SCL to DGND –0.3 V to + 7 V
Digital Outputs to DGND –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND –0.3 V to AVDD + 0.3 V
AGND to DGND –0.3 V to +0.3 V
VOUTx to AGND –0.3 V to AVDD + 0.3 V
Analog Inputs to AGND –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Commercial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
JunctionTemperature (TJ max) 150°C
100-lead CSPBGA Package
θJAThermal Impedance 40°C/W
Reflow Soldering
Peak Temperature 230°C
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REF GND Ground Reference Point for the Internal Reference.
REFOUT/REFIN
VOUT39/MON_OUT
SYNC/AD0 Serial Interface Mode. This is the frame synchronization input signal for the serial clocks before the addressed register
DCEN/ AD1
SDO
LDAC Load DAC Logic Input (Active Low). If LDAC is taken low while BUSY is inactive (high), the contents of the input
CLR Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is activated, all channels are updated
RESETAsynchronous Digital Reset Input (Falling Edge Sensitive). The function of this pin is equivalent to that of the power-
Buffered Analog Outputs for Channel x. Each analog output is driven by a rail-to-rail output amplifier operating at a
gain of 2. Each output is capable of driving an output load of 5 kΩ to ground. Typical output impedance is 0.5 Ω.
Analog Ground Reference Points for Each Group of Eight Output Channels. All SIGNAL_GND pins are tied together
internally and should be connected to the AGND plane as close as possible to the AD5384.
Each group of eight channels contains a DAC_GND pin. This is the ground reference point for the internal 14-bit DAC.
These pins shound be connected to the AGND plane.
Analog Ground Reference Point. Each group of eight channels contains an AGND pin. All AGND pins should be
connected externally to the AGND plane.
Analog Supply Pins. Each group of eight channels has a separate AVDD pin. These pins are shorted internally and
should be decoupled with a 0.1 µF ceramic capacitor and a 10 µF tantalum capacitor. Operating range for the
AD5384-5 is 4.5 V to 5.5 V; operating range for the AD5384-3 is 2.7 V to 3.6 V.
Logic Power Supply. Guaranteed operating range is 2.7 V to 5.5 V. It is recommended that these pins be decoupled
with 0.1 µF ceramic and 10 µF tantalum capacitors to DGND.
The AD5384 contains a common REFOUT/REFIN pin. The default for this pin is a reference input. When the internal
reference is selected, this pin is the reference output. If the application requires an external reference, it can be
applied to this pin. The internal reference is enabled/disabled via the control register.
This pin has a dual function. It acts a a buffered output for Channel 39 in default mode. But when the monitor
function is enabled, this pin acts as the output of a 39-to-1 channel multiplexer that can be programmed to multiplex
one of Channels 0 to 38 to the MON_OUT pin. The MON_OUT pin output impedance typically is 500 Ω and is
intended to drive a high input impedance like that exhibited by SAR ADC inputs.
is updated.
2
I
C Mode. This pin acts as a hardware address pin used in conjunction with AD1 to determine the software address
for the device on the I
Multifunction Pin. In serial interface mode, this pin acts as a daisy-chain enable in SPI mode and as a hardware
address pin in I
2
C mode.
2
C bus.
Serial Interface. Daisy-chain select input (level sensitive, active high). When high, this signal is used in conjunction
with SPI/
2
I
for this device on the I
I2C high to enable the SPI serial interface daisy-chain mode.
C Mode. This pin acts as a hardware address pin used in conjunction with AD0 to determine the software address
2
C bus.
Serial Data Output in Serial Interface Mode. Three-stateable CMOS output. SDO can be used for daisy-chaining a
number of devices together. Data is clocked out on SDO on the rising edge of SCLK, and is valid on the falling edge of
SCLK.
Digital CMOS Output.
BUSY goes low during internal calculations of the data (x2) loaded to the DAC data register.
During this time, the user can continue writing new data to the x1, c, and m registers, but no further updates to the
DAC registers and DAC outputs can take place. If
goes low during power-on reset, and when the
events on
LDAC are ignored. A CLR operation also brings BUSY low.
registers are transferred to the DAC registers, and the DAC outputs are updated. If
active and internal calculations are taking place, the
LDAC is taken low while BUSY is low, this event is stored. BUSY also
BUSY pin is low. During this time, the interface is disabled and any
LDAC is taken low while BUSY is
LDAC event is stored and the DAC registers are updated when
BUSY goes inactive. However, any events on LDAC during power-on reset or on RESET are ignored.
with the data in the
the
CLR code.
CLR code register. BUSY is low for a duration of 35 µs while all channels are being updated with
on reset generator. When this pin is taken low, the state machine initiates a reset sequence to digitally reset the x1, m,
c, and x2 registers to their default power-on values. This sequence typically takes 270 µs. The falling edge of
initiates the
is low, all interfaces are disabled and all
operation and the status of the
RESET process and BUSY goes low for the duration, returning high when RESET is complete. While BUSY
LDAC pulses are ignored. When BUSY returns high, the part resumes normal
RESET pin is ignored until the next falling edge is detected.
RESET
Rev. A | Page 15 of 36
AD5384
Mnemonic Function
PD
NC No Connect. The user is advised not to connect any signals to these pins.
SPI/ I2C
SCLK/SCL
DIN/SDA
Power Down (Level Sensitive, Active High). PD is used to place the device in low power mode, where AI
2 µA and DI
to 20 µA. In power-down mode, all internal analog circuitry is placed in low power mode, and the
DD
analog output is configured as a high impedance output or provides a 100 kΩ load to ground, depending on how
the power-down mode is configured. The serial interface remains active during power-down.
This pin acts as serial interface mode select. When this input is high SPI mode is selected. When low, I2C is selected.
Serial Interface Mode. In serial interface mode, data is clocked into the shift register on the falling edge of SCLK. This
operates at clock speeds up to 30 MHz.
2
I
C Mode. In I2C mode, this pin performs the SCL function, clocking data into the device. The data transfer rate in I2C
mode is compatible with both 100 kHz and 400 kHz operating modes.
Serial Interface Mode. In serial interface mode, this pin acts as the serial data input. Data must be valid on the falling
edge of SCLK.
2
C Mode. In I2C mode, this pin is the serial data pin (SDA) operating as an open-drain input/output.
I
reduces to
DD
Rev. A | Page 16 of 36
AD5384
TERMINOLOGY
Relative Accuracy
DC Output Impedance
Relative accuracy or endpoint linearity is a measure of the
maximum deviation from a straight line passing through the
endpoints of the DAC transfer function. It is measured after
adjusting for zero-scale error and full-scale error, and is
expressed in LSB.
Differential Nonlinearity
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of 1 LSB maximum
ensures monotonicity.
Zero-Scale Error
Zero-scale error is the error in the DAC output voltage when all
0s are loaded into the DAC register. Ideally, with all 0s loaded to
the DAC and m = all 1s, c = 2
VOUT
(Zero-Scale)
= 0 V
n – 1
Zero-scale error is a measure of the difference between VOUT
(actual) and VOUT (ideal), expressed in mV. It is mainly due to
offsets in the output amplifier.
Offset Error
Offset error is a measure of the difference between VOUT
(actual) and VOUT (ideal) in the linear region of the transfer
function, expressed in mV. Offset error is measured on the
AD5384-5 with Code 32 loaded into the DAC register, and on
the AD5384-3 with Code 64.
Gain Error
Gain Error is specified in the linear region of the output range
between V
= 10 mV and V
OUT
= AVDD – 50 mV. It is the
OUT
deviation in slope of the DAC transfer characteristic from the
ideal and is expressed in %FSR with the DAC output unloaded.
DC Crosstalk
This is the dc change in the output level of one DAC at midscale
in response to a full-scale code (all 0s to all 1s, and vice versa)
and output change of all other DACs. It is expressed in LSB.
This is the effective output source resistance. It is dominated by
package lead resistance.
Output Voltage Settling Time
This is the amount of time it takes for the output of a DAC to
settle to a specified level for a ¼ to ¾ full-scale input change,
and is measured from the
BUSY
rising edge.
Digital-to-Analog Glitch Energy
This is the amount of energy injected into the analog output at
the major code transition. It is specified as the area of the glitch
in nV-s. It is measured by toggling the DAC register data
between 0x1FFF and 0x2000.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse that appears at the
output of one DAC due to both the digital change and the subsequent analog output change at another DAC. The victim
channel is loaded with midscale. DAC-to-DAC crosstalk is
specified in nV-s.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output
of one converter due to a change in the DAC register code of
another converter. It is specified is specified in nV-s.
Digital Feedthrough
When the device is not selected, high frequency logic activity
on the device’s digital inputs can be capacitively coupled both
across and through the device to show up as noise on the VOUT
pins. It can also be coupled along the supply and ground lines.
This noise is digital feedthrough.
Output Noise Spectral Density
This is a measure of internally generated random noise. Random
noise is characterized as a spectral density (voltage per √Hertz).
It is measured by loading all DACs to midscale and measuring
noise at the output. It is measured in nV/√Hz in a 1 Hz bandwidth at 10 kHz.
Rev. A | Page 17 of 36
AD5384
TYPICAL PERFORMANCE CHARACTERISTICS
2.0
1.5
1.0
AVDD = DVDD = 5.5V
V
= 2.5V
REF
= 25°C
T
A
2.0
1.5
1.0
AVDD = DVDD = 3V
V
= 1.25V
REF
= 25°C
T
A
INL ERROR (LSB)
2.539
2.538
2.537
2.536
2.535
2.534
2.533
2.532
2.531
2.530
2.529
AMPLITUDE (V)
2.528
2.527
2.526
2.525
2.524
2.523
0.5
–0.5
–1.0
–1.5
–2.0
0.5
0
INPUT CODE
1638404096819212288
03731-0-033
Figure 8. Typical AD5384-5 INL Plot
AVDD = DVDD = 5V
= 2.5V
V
REF
T
= 25°C
A
14ns/SAMPLE NUMBER
1 LSB CHANGE AROUND MIDSCALE
GLITCH IMPULSE = 10nV-s
SAMPLE NUMBER
5500100 150 200 250 30050350 400500450
03731-0-034
Figure 9. AD5384-5 Glitch Impulse
0
–0.5
INL ERROR (LSB)
–1.0
–1.5
–2.0
INPUT CODE
Figure 11. Typical AD5384-3 INL Plot
40
35
30
25
20
15
FREQUENCY
10
5
0
–5.0
–4.0
–1.03.0–3.01.004.0 5.0
–2.02.0
–1.52.5–3.5–4.5
REFERENCE DRIFT (ppm/°C)
0.5–0.53.5–2.51.5
Figure 12. AD5384-REFOUT Temperature Coefficient
4.5
1638404096819212288
03731-0-035
03731-0-048
AVDD = DVDD = 5V
= 2.5V
V
REF
= 25°C
T
A
V
OUT
Figure 10. Slew Rate with Boost Off
03731-0-012
Rev. A | Page 18 of 36
AVDD = DVDD = 5V
V
= 2.5V
REF
= 25°C
T
A
Figure 13. Slew Rate with Boost On
V
OUT
03731-0-015
AD5384
14
12
10
8
6
AVDD = 5.5V
= 2.5V
V
REF
= 25°C
T
A
AVDD = DVDD = 5V
V
= 2.5V
REF
T
= 25°C
A
POWER SUPPLY RAMP RATE = 10ms
V
OUT
4
PERCENTAGE OF UNITS (%)
2
10
8
6
4
NUMBER OF UNITS
2
0
AIDD (mA)
Figure 14. Histogram with Boost Off
DIDD (mA)
Figure 15. DI
Histogram
DD
DVDD = 5.5V
V
IH
VIL = DGND
T
A
0.80.90.40.50.60.7
118910
= DV
= 25°C
AV
DD
04598-0-049
03731-0-011
Figure 17. AD5384 Power-Up Transient
DD
04598-0-050
14
12
10
8
6
NUMBER OF UNITS
4
2
0
INL ERROR DISTRIBUTION (LSB)
AVDD = 5.5V
REFIN = 2.5V
T
= 25°C
A
2–2–101
04652-0-039
Figure 18. INL Distribution
WR
BUSY
AVDD = DVDD = 5V
= 2.5V
V
REF
T
= 25°C
A
EXITS SOFT PD
TO MIDSCALE
Figure 16. Exiting Soft Power Down
PD
V
OUT
03731-0-045
V
OUT
AVDD = DVDD = 5V
V
= 2.5V
REF
T
= 25°C
EXITS HARDWARE PD
A
TO MIDSCALE
03731-0-038
Figure 19. Exiting Hardware Power Down
Rev. A | Page 19 of 36
AD5384
6
FULL-SCALE
5
4
3
(V)
OUT
2
V
1
0
–1
–40 –20 –10 –5–2025102040
3/4 SCALE
MIDSCALE
1/4 SCALE
ZERO-SCALE
CURRENT (mA)
Figure 20. AD5384-5 Output Amplifier Source and Sink Capability
0.20
0.15
–0.05
ERROR VOLTAGE (V)
–0.10
–0.15
0.10
0.05
0
ERROR AT ZERO SINKING CURRENT
(VDD–V
) AT FULL-SCALE SOURCING CURRENT
OUT
AVDD = DVDD= 5V
V
= 2.5V
REF
= 25°C
T
A
AVDD = 5V
V
T
REF
= 25°C
A
= 2.5V
04652-0-030
6
AVDD = DVDD= 3V
= 1.25V
V
REF
= 25°C
T
A
5
4
3
MIDSCALE
(V)
OUT
2
V
1
0
–1
–40 –20 –10 –5–20251020 –40
3/4 SCALE
ZERO-SCALE
FULL-SCALE
1/4 SCALE
CURRENT (mA)
Figure 23. AD5384-3 Output Amplifier Source and Sink Capability
AMPLITUDE (V)
2.456
2.455
2.454
2.453
2.452
2.451
2.450
AVDD = DVDD = 5V
V
= 2.5V
REF
= 25°C
T
A
14ns/SAMPLE NUMBER
04652-0-031
–0.20
I
SOURCE/ISINK
(mA)
Figure 21. Headroom at Rail vs. Source/Sink Current
OUTPUT NOISE (nV/ Hz)
600
500
400
300
200
100
0
REFOUT = 1.25V
FREQUENCY (Hz)
AVDD = 5V
T
A
REFOUT DECOUPLED
WITH 100nF CAPACITOR
REFOUT = 2.5V
Figure 22. REFOUT Noise Spectral Density
= 25°C
2.0000.250.500.751.001.251.501.75
04652-0-040
100k1001k10k
04652-0-035
2.449
SAMPLE NUMBER
Figure 24. Adjacent Channel DAC to DAC Crosstalk
AVDD = DVDD = 5V
T
= 25°C
A
DAC LOADED WITH MIDSCALE
EXTERNAL REFERENCE
Y AXIS = 5µV/DIV
X AXIS = 100ms/DIV
Figure 25. 0.1 Hz to 10 Hz Noise Plot
AVDD = DVDD = 5V
= 2.5V
V
REF
T
= 25°C
A
EXITS SOFT PD
TO MIDSCALE
5500100 150 200 250 30050350 400500450
04652-0-034
04652-0-032
Rev. A | Page 20 of 36
AD5384
FUNCTIONAL DESCRIPTION
DAC ARCHITECTURE—GENERAL
The AD5384 is a complete single-supply, 40-channel, voltage
output DAC offering 14-bit resolution, available in a 100-lead
CSPBGA package. It features two serial interfaces, SPI and I
This family includes an internal1.25/2.5 V, 10 ppm/°C
reference that can be used to drive the buffered reference
inputs. Alternatively, an external reference can be used to drive
these inputs. Reference selection is via a bit in the control
register. Internal/external reference selection is via the CR10 bit
in the control register; CR12 selects the reference magnitude if
the internal reference is selected. All channels have an on-chip
output amplifier with rail-to-rail output capable of driving 5 kΩ
in parallel with a 200 pF load.
V
(+)AVDD
REF
×1 INPUT
REG
m REG
c REG
14-BIT
×2INPUT DATA
DAC
AGND
Figure 26. Single-Channel Architecture
V
OUT
R
R
04652-0-014
The architecture of a single DAC channel consists of a14-bit
resistor-string DAC followed by an output buffer amplifier
operating at a gain of 2. This resistor-string architecture
guarantees DAC monotonicity. The 14-bitbinary digital code
loaded to the DAC register determines at which node on the
string the voltage is tapped off before being fed to the output
amplifier.
Each channel on these devices contains independent offset and
gain control registers allowing the user to digitally trim offset
and gain. These registers let the user calibrate out errors in the
complete signal chain including the DAC using the internal m
and c registers which hold the correction factors. All channels
are double buffered allowing synchronous updating of all
channels using the
pin. Figure 26 shows a block diagram
LDAC
of a single channel on the AD5384. The digital input transfer
function for each DAC can be represented as
x2 = [(m + 2)/ 2
n
× x1] + (c – 2
n – 1
)
where:
x2 is the data-word loaded to the resistor string DAC.
x1 is the 14-bit data-word written to the DAC input register.
m is the gain coefficient (default is 0x3FFE on the AD5384).
The gain coefficient is written to the 13 most significant bits
(DB13 to DB1) and the LSB (DB0) is 0.
n is the DAC resolution (n = 14 for AD5384).
c is the14-bit offset coefficient (default is 0x2000).
2
C.
The complete transfer function for these devices can be
represented as
V
= 2 × V
OUT
REF
× x2/2
n
where:
x2 is the data-word loaded to the resistor string DAC.
V
is the internal reference voltage or the reference voltage
REF
externally applied to the DAC REFOUT/REFIN pin. For
specified performance, an external reference voltage of 2.5 V is
recommended for the AD5384-5, and 1.25 V for the AD5384-3.
DATA DECODING
The AD5384 contains a 14-bit data bus, DB13-DB0. Depending
on the value of REG1 and REG0 outlined in Table 12, this data
is loaded into the addressed DAC input register(s), offset (c)
register(s), or gain (m) register(s). The format data, offset (c)
and gain (m) register contents are outlined in Table 13, Table 14,
and Table 15.
Table 12. Register Selection
REG1 REG0 Register Selected
1 1 Input Data Register (x1)
1 0 Offset Register (c)
0 1 Gain Register (m)
0 0 Special Function Registers (SFRs)
Table 13. DAC Data Format (REG1 = 1, REG0 = 1)
DB13 to DB0 DAC Output (V)
11 1111 1111 1111 2 V
11 1111 1111 1110 2 V
10 0000 0000 0001 2 V
10 0000 0000 0000 2 V
01 1111 1111 1111 2 V
00 0000 0000 0001 2 V
00 0000 0000 0000 0
The AD5384 contains a number of special function registers
(SFRs), as outlined in Table 16. SFRs are addressed with
REG1 = REG0 = 0 and are decoded using Address Bits A5 to A0.
Performs no operation but is useful in serial readback mode to
clock out data on D
for diagnostic purposes.
OUT
low during a NOP operation.
Write CLR Code
REG1 = REG0 = 0, A5–A0 = 000001
DB13–DB0 = Contain the CLR data
Bringing the
line low or exercising the soft clear function
CLR
loads the contents of the DAC registers with the data contained
in the user-configurable CLR register, and sets VOUT0 to
VOUT39, accordingly. This can be very useful for setting up a
specific output voltage in a clear condition. It is also beneficial
for calibration purposes; the user can load full scale or zero
scale to the clear code register and then issue a hardware or
software clear to load this code to all DACs, removing the need
for individual writes to each DAC. Default on power-up is all 0s.
Executing this instruction performs a global power-down that
puts all channels into a low power mode that reduces the analog
supply current to 2 µA maximum and the digital current to
20 µA maximum. In power-down mode, the output amplifier
can be configured as a high impedance output or can provide a
100 kΩ load to ground. The contents of all internal registers are
retained in power-down mode. No register can be written to
while in power-down.
This instruction is used to power up the output amplifiers and
the internal reference. The time to exit power-down is 8 µs. The
hardware power-down and software function are internally
combined in a digital OR function.
This instruction is used to implement a software reset. All
internal registers are reset to their default values, which
correspond to m at full scale and c at zero. The contents of the
DAC registers are cleared, setting all analog outputs to 0 V. The
soft reset activation time is 135 µs.
REG1 = REG0 = 0, A5–A0 = 001100, R/
the operation is a write (R/
= 0) or a read (R/W = 1). DB13 to
W
DB0 contain the control register data.
status determines if
W
CR8: Thermal Monitor Function. This function is used to
monitor the AD5384 internal die temperature, when enabled.
The thermal monitor powers down the output amplifiers when
the temperature exceeds 130°C. This function can be used to
Control Register Contents
CR13: Power-Down Status. This bit is used to configure the
output amplifier state in power-down.
CR13 = 1: Amplifier output is high impedance (default on
power-up).
CR13 = 0: Amplifier output is 100 kΩ to ground.
CR12: REF Select. This bit selects the operating internal
reference for the AD5384. CR12 is programmed as follows:
CR12 = 1: Internal reference is 2.5 V (AD5384-5 default), the
recommended operating reference for AD5384-5.
CR12 = 0: Internal reference is 1.25 V (AD5384-3 default),
the recommended operating reference for AD5384-3.
protect the device when power dissipation might be exceeded if
a number of output channels are simultaneously short-circuited.
A soft power-up re-enables the output amplifiers if the die
temperature drops below 130°C.
CR8 = 1: Thermal Monitor Enabled.
CR8 = 0: Thermal Monitor Disabled (default on power-up).
CR7: Don’t Care.
CR6 to CR2: Toggle Function Enable. This function allows the
user to toggle the output between two codes loaded to the A
and B register for each DAC. Control register bits CR6 to CR2
are used to enable individual groups of eight channels for
operation in toggle mode. A Logic 1 written to any bit enables a
group of channels; a Logic 0 disables a group.
LDAC
is used to
toggle between the two registers. Table 18 shows the decoding
CR11: Current Boost Control. This bit is used to boost the
current in the output amplifier, thereby altering its slew rate.
This bit is configured as follows:
for toggle mode operation. For example, CR6 controls group w,
which contains Channels 32 to 39, CR6 = 1 enables these
channels.
CR11 = 1: Boost Mode On. This maximizes the bias current
in the output amplifier, optimizing its slew rate but increasing
the power dissipation.
CR11 = 0: Boost Mode Off (default on power-up). This
reduces the bias current in the output amplifier and reduces
the overall power consumption.
CR10: Internal/External Reference. This bit determines if the
DAC uses its internal reference or an externally applied
reference.
CR10 = 1: Internal Reference Enabled. The reference output
depends on data loaded to CR12.
CR10 = 0: External Reference Selected (default on power-up).
CR9: Channel Monitor Enable (see Channel Monitor Function).
CR9 = 1: Monitor Enabled. This enables the channel monitor
function. After a write to the monitor channel in the SFR
register, the selected channel output is routed to the
MON_OUT pin. VOUT39 operates as the MON_OUT pin.
CR9 = 0: Monitor Disabled (default on power-up). When the
monitor is disabled, the MON_OUT pin assumes its normal
DAC output function.
DB13–DB8 = Contain data to address the monitored channel.
A channel monitor function is provided on the AD5384. This
feature, which consists of a multiplexer addressed via the
interface, allows any channel output to be routed to the
MON_OUT pin for monitoring using an external ADC. In
channel monitor mode, VOUT39 becomes the MON_OUT pin,
to which all monitored pins are routed. The channel monitor
function must be enabled in the control register before any
channels are routed to MON_OUT. On the AD5384, DB13 to
DB8 contain the channel address for the monitored channel.
Selecting Channel Address 63 three-states MON_OUT.
Bringing the
registers to their power-on reset state. Reset is a negative edge-
sensitive input. The default corresponds to m at full scale and to
c at zero. The contents of the DAC registers are cleared, setting
VOUT0 to VOUT39 to 0 V. The hardware reset activation time
takes 270 µs. The falling edge of
process;
RESET
disabled and all
high, the part resumes normal operation and the status of the
RESET
BUSY
is complete. While
pin is ignored until the next falling edge is detected.
line low resets the contents of all internal
RESET
initiates the reset
RESET
goes low for the duration, returning high when
is low, all interfaces are
BUSY
pulses are ignored. When
LDAC
BUSY
returns
ASYNCHRONOUS CLEAR FUNCTION
Bringing the
registers to the data contained in the user configurable CLR
register and sets VOUT0 to VOUT39 accordingly. This function
can be used in system calibration to load zero scale and full
scale to all channels. The execution time for a CLR is 35 µs.
line low clears the contents of the DAC
CLR
BUSY AND LDAC FUNCTIONS
is a digital CMOS output that indicates the status of the
BUSY
AD5384. The value of x2, the internal data loaded to the DAC
data register, is calculated each time the user writes new data to
the corresponding x1, c ,or m registers. During the calculation
of x2, the
can continue writing new data to the x1, m, or c registers, but
no DAC output updates can take place. The DAC outputs are
updated by taking the
is active, the
BUSY
update immediately after
the
LDAC
output goes low. While
BUSY
input low. If
LDAC
event is stored and the DAC outputs
LDAC
goes high. The user can hold
BUSY
input permanently low, in which case the DAC
is low, the user
BUSY
LDAC
goes low while
outputs update immediately after
goes low during power-on reset and when a falling edge is
detected on the
disabled and any events on
contains an extra feature whereby a DAC register is not updated
unless its x2 register has been written to since the last time
was brought low. Normally, when
LDAC
the DAC registers are filled with the contents of the x2 registers.
However, the AD5384 updates the DAC register only if the x2
data has changed, thereby removing unnecessary digital
crosstalk.
pin. During this time, all interfaces are
RESET
LDAC
POWER-ON RESET
The AD5384 contains a power-on reset generator and state
machine. The power-on reset resets all registers to a predefined
state and configures the analog outputs as high impedance. The
pin goes low during the power-on reset sequencing,
BUSY
preventing data writes to the device.
POWER-DOWN
The AD5384 contains a global power-down feature that puts all
channels into a low power mode and reduces the analog power
consumption to 2 µA maximum and digital power consumption
to 20 µA maximum. In power-down mode, the output amplifier
can be configured as a high impedance output or it can provide
a 100 kΩ load to ground. The contents of all internal registers
are retained in power-down mode. When exiting power-down,
the settling time of the amplifier elapses before the outputs
settles to their correct values.
goes high.
BUSY
are ignored. The AD5384
is brought low,
LDAC
BUSY
also
Rev. A | Page 25 of 36
AD5384
INTERFACES
The AD5384 contains a serial interface that can be
programmed either as DSP-, SPI-, MICROWIRE-, or I
compatible. The SPI/
MICROWIRE, or I
pin is used to select DSP, SPI,
I2C
2
C interface mode. To minimize both the
power consumption of the device and the on-chip digital noise,
the active interface powers up fully only when the device is
being written to, i.e., on the falling edge of
SYNC
DSP-, SPI-, MICROWIRE-COMPATIBLE SERIAL
INTERFACES
The serial interface can be operated with a minimum of three
wires in standalone mode or five wires in daisy-chain mode.
Daisy chaining allows many devices to be cascaded together to
increase system channel count. The SPI/
tied high to enable the DSP-, SPI-, MICROWIRE-compatible
serial interface. The serial interface control pins are
, DIN, SCLK—Standard 3-Wire Interface Pins.
SYNC
DCEN—Selects Standalone Mode or Daisy-Chain Mode.
SDO—Data Out Pin for Daisy-Chain Mode.
Figure 3 and Figure 5 show the timing diagrams for a serial
write to the AD5384 in standalone and in daisy-chain modes.
The 24-bit data-word format for the serial interface is shown in
Table 20.
(Ball B8) should be
I2C
2
C-
.
/B. When toggle mode is enabled, this selects whether the
A
data write is to the A or B register, with Toggle disabled this bit
should be set to zero to select the A data register.
R/
is the read or write control bit.
W
A5–A0 are used to address the input channels.
REG1 and REG0 select the register to which data is written, as
shown in Table 12.
DB13–DB0 contain the input data-word.
X is a don’t care condition.
Standalone Mode
By connecting DCEN (daisy-chain enable) pin low, standalone
mode is enabled. The serial interface works with both a
continuous and a noncontinuous serial clock. The first falling
edge of
starts the write cycle and resets a counter that
SYNC
counts the number of serial clocks to ensure that the correct
number of bits are shifted into the serial shift register. Any
further edges on
, except for a falling edge, are ignored
SYNC
until 24 bits are clocked in. Once 24 bits are shifted in, the
SCLK is ignored. For another serial transfer to take place, the
counter must be reset by the falling edge of
SYNC
.
Table 20. 40-Channel, 14-Bit DAC Serial Input Register Configuration
For systems that contain several devices, the SDO pin can be
used to daisy-chain several devices together. This daisy-chain
mode can be useful in system diagnostics and in reducing the
number of serial interface lines.
By connecting DCEN (daisy-chain enable) pin high, the daisychain mode is enabled. The first falling edge of
SYNC
starts the
write cycle. The SCLK is applied continuously to the input shift
register when
is low. If more than 24 clock pulses are
SYNC
applied, the data ripples out of the shift register and appears on
the SDO line. This data is clocked out on the rising edge of
SCLK and is valid on the falling edge. By connecting the SDO
of the first device to the DIN input on the next device in the
chain, a multidevice interface is constructed. 24 clock pulses are
required for each device in the system. Therefore, the total
number of clock cycles must equal 24N where N is the total
number of AD5384 devices in the chain.
When the serial transfer to all devices is complete,
SYNC
is
taken high. This latches the input data in each device in the
daisy-chain and prevents any further data being clocked into
the input shift register.
If the
is taken high before 24 clocks are clocked into the
SYNC
part, this is considered a bad frame and the data is discarded.
The serial clock may be either a continuous or a gated clock. A
continuous SCLK source can be used only if it can be arranged
that
is held low for the correct number of clock cycles. In
SYNC
gated clock mode a burst clock containing the exact number of
clock cycles must be used and
taken high after the final
SYNC
clock to latch the data.
Readback Mode
Readback mode is invoked by setting the R/
serial input register write. With R/
= 1, Bits A5 to A0, in
W
bit = 1 in the
W
association with Bits REG1 and REG0, select the register to be
read. The remaining data bits in the write sequence are don’t
cares. During the next SPI write, the data appearing on the SDO
output contains the data from the previously addressed register.
For a read of a single register, the NOP command can be used
in clocking out the data from the selected register on SDO.
Figure 28 shows the readback sequence.
For example, to read back the m register of Channel 0 on the
AD5384, the following sequence should be followed. First, write
0x404XXX to the AD5384 input register. This configures the
AD5384 for read mode with the m register of Channel 0
selected. Note that Data Bits DB13 to DB0 are don’t cares.
Follow this with a second write, a NOP condition, 0x000000.
During this write, the data from the m register is clocked out on
the SDO line, i.e., data clocked out contains the data from the m
register in Bits DB13 to DB0, and the top 10 bits contain the
address information as previously written. In readback mode,
the
signal must frame the data. Data is clocked out on
SYNC
the rising edge of SCLK and is valid on the falling edge of the
SCLK signal. If the SCLK idles high between the write and read
operations of a readback operation, the first bit of data is
clocked out on the falling edge of
SYNC
.
SCLK
SYNC
DIN
SDO
DB23DB0DB0DB23
UNDEFINEDSELECTED REGISTER DATA CLOCKED OUT
2448
NOP CONDITIONINPUT WORD SPECIFIES REGISTER TO BE READ
Figure 28. Serial Readback Operation
DB0DB23
04652-0-016
Rev. A | Page 27 of 36
AD5384
I2C SERIAL INTERFACE
The AD5384 features an I2C-compatible 2-wire interface
consisting of a serial data line (SDA) and a serial clock line
(SCL). SDA and SCL facilitate communication between the
AD5384 and the master at rates up to 400 kHz. Figure 6 shows
the 2-wire interface timing diagrams that incorporate three
different modes of operation.
2
C mode by configuring the SPI/
Select I
The device is connected to this bus as slave devices, i.e., no
clock is generated by the AD5384. The AD5384 has a 7-bit slave
address 1010 1(AD1)(AD0). The 5 MSBs are hard coded, and
the two LSBs are determined by the state of the AD1 AD0 pins.
The ability to hardware-configure AD1 and AD0 allows four of
these devices to be configured on the bus.
2
C Data Transfer
I
One data bit is transferred during each SCL clock cycle. The
data on SDA must remain stable during the high period of the
SCL clock pulse. Changes in SDA while SCL is high are control
signals, which configure start and stop conditions. Both SDA
and SCL are pulled high by the external pull-up resistors when
2
C bus is not busy.
the I
Start and Stop Conditions
A master device initiates communication by issuing a start
condition. A start condition is a high-to-low transition on SDA
with SCL high. A stop condition is a low-to-high transition on
SDA while SCL is high. A start condition from the master
signals the beginning of a transmission to the AD5384. The stop
condition frees the bus. If a repeated start condition (Sr) is
generated instead of a stop condition, the bus remains active.
Repeated START Conditions
A repeated start (Sr) condition may indicate a change of data
direction on the bus. Sr may be used when the bus master is
2
writing to several I
C devices and wants to maintain control of
the bus.
Acknowledge Bit (ACK)
The acknowledge bit (ACK) is the ninth bit attached to any
8-bit data-word. ACK is always generated by the receiving
device. The AD5384 devices generate an ACK when receiving
an address or data by pulling SDA low during the ninth clock
period. Monitoring ACK allows detection of unsuccessful data
transfers. An unsuccessful data transfer occurs if a receiving
device is busy or if a system fault occurs. In the event of an
unsuccessful data transfer, the bus master should re-attempt
communication.
pin to a Logic 0.
I2C
Slave Addresses
A bus master initiates communication with a slave device by
issuing a start condition followed by the 7-bit slave address.
When idle, the AD5384 waits for a start condition followed by
its slave address. The LSB of the address word is the Read/Write
) bit. The AD5384 devices are receive-only devices; when
(R/
W
communicating with these, R/
= 0. After receiving the proper
W
address 1010 1(AD1)(AD0), the AD5384 issues an ACK by
pulling SDA low for one clock cycle.
The AD5384 has four different user programmable addresses
determined by the AD1 and AD0 bits.
Write Operation
There are three specific modes in which data can be written to
the AD5384 family of DACs.
4-Byte Mode
When writing to the AD5384 DACs, the user must begin with
an address byte (R/
= 0), after which the DAC acknowledges
W
that it is prepared to receive data by pulling SDA low. The
address byte is followed by the pointer byte; this addresses the
specific channel in the DAC to be addressed and also is
acknowledged by the DAC. Two bytes of data are then written
to the DAC, as shown in Figure 29. A stop condition follows.
This lets the user update a single channel within the AD5384 at
any time and requires four bytes of data to be transferred from
the master.
3-Byte Mode
In 3-byte mode, the user can update more than one channel in a
write sequence without having to write the device address byte
each time. The device address byte is required only once; subsequent channel updates require the pointer byte and the data
bytes. In 3-byte mode, the user begins with an address byte
= 0), after which the DAC acknowledges that it is prepared
(R/
W
to receive data by pulling SDA low. The address byte is followed
by the pointer byte. This addresses the specific channel in the
DAC to be addressed and also is acknowledged by the DAC.
This is then followed by the two data bytes, REG1 and REG0,
which determine the register to be updated.
If a stop condition does not follow the data bytes, another
channel can be updated by sending a new pointer byte followed
by the data bytes. This mode requires only three bytes to be sent
to update any channel once the device is initially addressed, and
reduces the software overhead in updating the AD5384 channels.
A stop condition at any time exits this mode. Figure 30 shows a
typical configuration.
Rev. A | Page 28 of 36
AD5384
A
A
SDA
SDA
SDA
SDA
SCL
SD
START COND
BY MASTER
SCL
SD
SCL
START COND
BY MASTER
10101AD1AD0R/W00A5A4A3A2A1A0
ACK BY
ADDRESS BYTE
REG1 REG0 MSBLSBMSBLSB
MOST SIGNIFICANT BYTELEAST SIGNIFICANT BYTE
AD538x
Figure 29. 4-Byte AD5384, I
MSBACK BY
POINTER BYTE
ACK BY
AD538x
2
C Write Operation
AD538x
1
01000A5A4A3A2A1A01AD1AD0R/W
ACK BY
ADDRESS BYTEPOINTER BYTE FOR CHANNEL "N"
AD538x
MSB
ACK BY
AD538x
ACK BY
AD538x
STOP
COND
BY
MASTER
04652-0-017
SCL
REG1 REG0 MSBLSBMSBLSB
SCL
SCL
ACK BY
MOST SIGNIFICANT DATA BYTE
00A5A4A3A2A1A0
MSBACK BY
POINTER BYTE FOR CHANNEL "NEXT CHANNEL"
REG1 REG0 MSBLSBMSBLSB
MOST SIGNIFICANT DATA BYTELEAST SIGNIFICANT DATA BYTE
DATA FOR CHANNEL "NEXT CHANNEL"
Figure 30. 3-Byte AD5384, I
AD538x
DATA FOR CHANNEL "N"
AD538x
ACK BY
AD538x
2
C Write Operation
LEAST SIGNIFICANT DATA BYTE
ACK BY
AD538x
ACK BY
AD538x
STOP COND
BY MASTER
04652-0-018
Rev. A | Page 29 of 36
AD5384
2-Byte Mode
Following initialization of 2-byte mode, the user can update
channels sequentially. The device address byte is required only
once, and the pointer address pointer is configured for autoincrement or burst mode.
The user must begin with an address byte (R/
which the DAC acknowledges that it is prepared to receive data
by pulling SDA low. The address byte is followed by a specific
pointer byte (0xFF) that initiates the burst mode of operation.
The address pointer initializes to Channel 0,and, upon receiving
the two data bytes for the present address, automatically
increments to the next address.
SCL
= 0), after
W
The REG0 and REG1 bits in the data byte determine which
register is updated. In this mode, following the initialization,
only the two data bytes are required to update a channel. The
channel address automatically increments from Address 0. This
mode allows transmission of data to all channels in one block
and reduces the software overhead in configuring all channels.
A stop condition at any time exits this mode. Toggle mode is
not supported in 2-byte mode. Figure 31 shows a typical
configuration.
The serial peripheral interface (SPI) on the MC68HC11 is
configured for master mode (MSTR = 1), the Clock Polarity bit
(CPOL) = 0, and the Clock Phase bit (CPHA) = 1. The SPI is
configured by writing to the SPI control register (SPCR)—see
the 68HC11 User Manual. SCK of the 68HC11 drives the SCLK
of the AD5384, the MOSI output drives the serial data line (D
of the AD5384, and the MISO input is driven from D
The
signal is derived from a port line (PC7). When data
SYNC
OUT
IN
.
is being transmitted to the AD5384, the SYNC line is taken low
(PC7). Data appearing on the MOSI output is valid on the
falling edge of SCK. Serial data from the 68HC11 is transmitted
in 8-bit bytes with only eight falling clock edges occurring in
the transmit cycle.
MC68HC11
MISO
MOSI
SCK
PC7
Figure 32. AD5384-toMC68HC11 Interface
DVDD
SPI/I
RESET
SDO
DIN
SCLK
SYNC
AD5384
2
C
AD5384 to PIC16C6x/7x
The PIC16C6x/7x synchronous serial port (SSP) is configured
as an SPI master with the Clock Polarity bit = 0. This is done by
writing to the synchronous serial port control register
(SSPCON). See the PIC16/17 Microcontroller User Manual. In
this example I/O, port RA1 is being used to pulse
SYNC
and
enable the serial port of the AD5384. This microcontroller
transfers only eight bits of data during each serial transfer
operation; therefore, three consecutive read/write operations
could be needed, depending on the mode. Figure 33 shows the
connection diagram.
PIC16C6X/7X
SDI/RC4
SDO/RC5
SCK/RC3
RA1
DVDD
SPI/I
RESET
SDO
DIN
SCLK
SYNC
AD5384
2
C
)
04652-0-020
AD5384 to 8051
The AD5384 requires a clock synchronized to the serial data.
The 8051 serial interface must therefore be operated in Mode 0.
In this mode, serial data enters and exits through RxD, and a
shift clock is output on TxD. Figure 34 shows how the 8051 is
connected to the AD5384. Because the AD5384 shifts data out
on the rising edge of the shift clock and latches data in on the
falling edge, the shift clock must be inverted. The AD5384
requires its data to be MSB first. Since the 8051 outputs the LSB
first, the transmit routine must take this into account.
8XC51
DVDD
RxD
TxD
P1.1
Figure 34. AD5384-to-8051 Interface
DVDD
SPI/I
RESET
SDO
DIN
SCLK
SYNC
AD5384
2
C
AD5384 to ADSP-2101/ADSP-2103
Figure 35 shows a serial interface between the AD5384 and the
ADSP-2101/ADSP-2103. The ADSP-2101/ADSP-2103 should
be set up to operate in SPORT transmit alternate framing mode.
The ADSP-2101/ADSP-2103 SPORT is programmed through
the SPORT control register and should be configured as follows:
internal clock operation, active low framing, and 16-bit word
length. Transmission is initiated by writing a word to the Tx
register after the SPORT has been enabled.
In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to
ensure the rated performance. The printed circuit board on
which the AD5384 is mounted should be designed so that the
analog and digital sections are separated and confined to
certain areas of the board. If the AD5384 is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only, a star ground
point established as close to the device as possible.
For supplies with multiple pins (AV
be tied together. The AD5384 should have ample supply bypassing of 10 µF in parallel with 0.1 µF on each supply, located as
close to the package as possible and ideally right up against the
device. The 10 µF capacitors are the tantalum bead type. The
0.1 µF capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), like the common
ceramic types that provide a low impedance path to ground at
high frequencies, to handle transient currents due to internal
logic switching.
The power supply lines of the AD5384 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching
signals, such as clocks, should be shielded with digital ground
to avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. A ground line routed
between the D
and SCLK lines helps to reduce crosstalk
IN
between them (this is not required on a multilayer board
because there is a separate ground plane, but separating the
lines helps). It is essential to minimize noise on the V
REFIN lines.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is by far the best, but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to the ground
plane while signal traces are placed on the solder side.
, AVCC), these pins should
DD
and
IN
MONITOR FUNCTION
The AD5384 contains a channel monitor function that consists
of a multiplexer addressed via the interface, allowing any
channel output to be routed to this pin for monitoring using an
external ADC. In channel monitor mode, VOUT39 becomes
the MON_OUT pin, to which all monitored signals are routed.
The channel monitor function must be enabled in the control
register before any channels are routed to MON_OUT. contains
the decoding information required to route any channel to
MON_OUT. Selecting Channel Address 63 three-states
MON_OUT. Figure 36 shows a typical monitoring circuit
implemented using a 12-bit SAR ADC in a 6-lead SOT package.
The controller output port selects the channel to be monitored,
and the input port reads the converted data from the ADC.
VOUT0
VOUT38
DAC_GND SIGNAL_GND
AVCC
AD5384
VOUT39/MON_OUT
Figure 36. Typical Channel Monitoring Circuit
DIN
SYNC
SCLK
AGND
AD7476
V
IN
AVCC
SCLK
SDATA
GND
OUTPUT PORT
CS
INPUT PORT
CONTROLLER
TOGGLE MODE FUNCTION
The toggle mode function allows an output signal to be generated using the
two DAC data registers. This function is configured using the
SFR control register as follows. A write with REG1 = REG0 = 0
and A5–A0 = 001100 specifies a control register write. The
toggle mode function is enabled in groups of eight channels
using Bits CR6 to CR2 in the control register (see Table 17).
Figure 37 shows a block diagram of toggle mode
implementation.
control signal, which switches between
LDAC
04652-0-024
DATA
REGISTER
A
INPUT
INPUT
DATA
REGISTER
A/B
DATA
REGISTER
B
Figure 37. Toggle Mode Function
DAC
REGISTER
Rev. A | Page 32 of 36
14-BIT DAC
V
OUT
LDAC
CONTROL INPUT
04652-0-025
AD5384
Each of the 40 DAC channels on the AD5384 contains an A and
B data register. Note that the B registers can be loaded only
when toggle mode is enabled. The sequence of events when
configuring the AD5384 for toggle mode is
1. Enable toggle mode for the required channels via the
control register.
2. Load data to A registers.
THERMAL MONITOR FUNCTION
The AD5384 contains a temperature shutdown function to
protect the chip if multiple outputs are shorted. The shortcircuit current of each output amplifier is typically 40 mA.
Operating the AD5384 at 5 V leads to a power dissipation of
200 mW per shorted amplifier. With five channels shorted, this
leads to an extra watt of power dissipation. For the 100-lead
CSPBGA, the θ
is typically 44°C/W.
JA
3. Load data to B registers.
4. Apply
The
LDAC
determining the analog output. The first
.
LDAC
is used to switch between the A and B registers in
configures the
LDAC
output to reflect the data in the A registers. This mode offers
significant advantages if the user wants to generate a square
wave at the output of all 40 channels, as might be required to
drive a liquid crystal-based variable optical attenuator. In this
case, the user writes to the control register and enables the
toggle function by setting CR6 to CR2 = 1, thus enabling the
five groups of eight for toggle mode operation. The user must
then load data to all 40 A and B registers. Toggling
LDAC
sets
the output values to reflect the data in the A and B registers.
The frequency of the
determines the frequency of the
LDAC
square wave output.
Toggle mode is disabled via the control register. The first
LDAC
following the disabling of the toggle mode updates the outputs
with the data contained in the A registers.
5V
0.01µF
OUTPUT RANGE
0V–200V
The thermal monitor is enabled by the user via CR8 in the
control register. The output amplifiers on the AD5384 are
automatically powered down if the die temperature exceeds
approximately 130°C. After a thermal shutdown has occurred,
the user can re-enable the part by executing a soft power-up if
the temperature drops below 130°C, or by turning off the
thermal monitor function via the control register.
AD5384 IN A MEMS-BASED OPTICAL SWITCH
In their feed-forward control paths, MEMS based optical
switches require high resolution DACs that offer high channel
density with 14-bit monotonic behavior. The 40-channel, 14-bit
AD5384 DAC satisfies these requirements. In the circuit in
Figure 38, the 0 V to 5 V outputs of the AD5384 are amplified
to achieve an output range of 0 V to 200 V, which is used to
control actuators that determine the position of MEMS mirrors
in an optical switch. The exact position of each mirror is
measured using sensors. The sensor outputs are multiplexed
into a high resolution ADC in determining the mirror position.
The control loop is closed and driven by an ADSP-21065L, a
32-bit SHARC® DSP with an SPI-compatible SPORT interface.
The ADSP-21065L writes data to the DAC, controls the multiplexer, and reads data from the ADC via the serial interface.
REFOUT REFINA AVDD
14-BIT DAC
14-BIT DAC
AD5384
VOUT1
VOUT40
Figure 38. AD5384 in a MEMS-Based Optical Switch
ACTUATORS
G = 50
FOR MEMS
MIRROR
ARRAY
G = 50
Rev. A | Page 33 of 36
ADSP-21065L
SENSOR
AND
MULTIPLEXER
8-CHANNEL ADC
(AD7856)
OR
SINGLE-CHANNEL
ADC (AD7671)
04652-0-026
AD5384
OPT I CAL AT T ENUATOR S
Based on its high channel count, high resolution, monotonic
behavior, and high level of integration, the AD5384 is ideally
targeted at optical attenuation applications used in dynamic
gain equalizers, variable optical attenuators (VOA), and optical
add-drop multiplexers (OADMs). In these applications, each
wavelength is individually extracted using an arrayed wave
guide; its power is monitored using a photodiode, transimpedance amplifier, and an ADC in a closed-loop control system.
DWDM
IN
AWG
11
12
1n–1
1n
ADD
PORTS
OPTICAL
SWITCH
DROP
PORTS
ATTENUATOR
ATTENUATOR
ATTENUATOR
ATTENUATOR
The AD5384 controls the optical attenuator for each
wavelength, ensuring that the power is equalized in all
wavelengths before being multiplexed onto the fiber. This
prevents information loss and saturation from occurring at
amplification stages further along the fiber.
PHOTODIODES
DWDM
AWG
OUT
FIBREFIBRE
TIA/LOG AMP
(AD8304/AD8305)
AD5384,
N:1 MULTIPLEXER
ADG731
(40:1 MUX)
40-CHANNEL,
14-BIT DAC
16-BIT ADCCONTROLLER
AD7671
(0-5V, 1MSPS)
04652-0-027
Figure 39. OADM Using the AD5384 as Part of an Optical Attenuator
AD5384BBC-5 14 Bits –40°C to +85°C 4.5 V to 5.5 V 40 ±4 100-Lead CSPBGA BC-100-2
AD5384BBC-5REEL7 14 Bits –40°C to +85°C 4.5 V to 5.5 V 40 ±4 100-Lead CSPBGA BC-100-2
AD5384BBC-3 14 Bits –40°C to +85°C 2.7 V to 3.6 V 40 ±4 100-Lead CSPBGA BC-100-2
AD5384BBC-3REEL7 14 Bits –40°C to +85°C 2.7 V to 3.6 V 40 ±4 100-Lead CSPBGA BC-100-2
Output
Channels
Linearity
Error (LSB)
Package
Description
Package
Option
Rev. A | Page 35 of 36
AD5384
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I