AD5346: octal 8-bit DAC
AD5347: octal 10-bit DAC
AD5348: octal 12-bit DAC
Low power operation: 1.4 mA (max) @ 3.6 V
Power-down to 120 nA @ 3 V, 400 nA @ 5 V
Guaranteed monotonic by design over all codes
BUF
GAIN
DB11
DB0
WR
CLR
LDAC
REF
.
.
.
CS
RD
A2
A1
A0
or 0 V to 2 × V
LDAC
pin
FUNCTIONAL BLOCK DIAGRAM
V
DD
INTERFACE
LOGIC
REF
AGND
AD5348
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
DGND
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
Rail-to-rail output range: 0 V to V
Power-on reset to 0 V
Simultaneous update of DAC outputs via
time
38-lead TSSOP/6 mm × 6 mm 40-lead LFCSP packaging
Temperature range: –40°C to +105°C
APPLICATIONS
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Optical networking
Automatic test equipment
Mobile communications
Programmable attenuators
Industrial process control
1
Protected by U.S. Patent No. 5,969,657; other patents pending.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
DAC
DAC
DAC
DAC
DAC
DAC
DAC
DAC
Figure 1.
AD5346/AD5347/AD5348
GENERAL DESCRIPTION
The AD5346/AD5347/AD53481 are octal 8-, 10-, and 12-bit
DACs, operating from a 2.5 V to 5.5 V supply. These devices
incorporate an on-chip output buffer that can drive the output
to both supply rails, and also allow a choice of buffered or
unbuffered reference input.
The AD5346/AD5347/AD5348 have a parallel interface.
selects the device and data is loaded into the input registers on
the rising edge of
DAC registers to be read back through the digital port.
The GAIN pin on these devices allows the output range to be
set at 0 V to V
Input data to the DACs is double-buffered, allowing simultaneous update of multiple DACs in a system using the
An asynchronous
contents of the input register and the DAC register to all zeros.
These devices also incorporate a power-on reset circuit that
ensures that the DAC output powers on to 0 V and remains
there until valid data is written to the device.
All three parts are pin compatible, which allows users to select
the amount of resolution appropriate for their application
without redesigning their circuit board.
Table 1. VDD = 2.5 V to 5.5 V; V
unless otherwise noted
B Version
Parameter
DC PERFORMANCE
2
3,4
AD5346
Resolution 8 Bits
Relative Accuracy ±0.15 ±1 LSB
Differential Nonlinearity ±0.02 ±0.25 LSB Guaranteed monotonic by design over all codes
AD5347
Resolution 10 Bits
Relative Accuracy ±0.5 ±4 LSB
Differential Nonlinearity ±0.05 ±0.5 LSB Guaranteed monotonic by design over all codes
AD5348
Resolution 12 Bits
Relative Accuracy ±2 ±16 LSB
Differential Nonlinearity ±0.2 ±1 LSB Guaranteed monotonic by design over all codes
Offset Error ±0.4 ±3 % of FSR
Gain Error ±0.1 ±1 % of FSR
Lower Deadband5 10 60 mV Lower deadband exists only if offset error is negative
Upper Deadband
Offset Error Drift
Gain Error Drift
DC Power Supply Rejection
6
Ratio
DC Crosstalk
DAC REFERENCE INPUT
V
Input Range 1 VDD V Buffered reference mode
REF
V
Input Range 0.25 VDD V Unbuffered reference mode
REF
V
Input Impedance >10 MΩ Buffered reference mode and power-down mode
REF
5
6
6
6
6
90 kΩ Gain = +1; input impedance = R
45 kΩ Gain = +2; input impedance = R
Reference Feedthrough –90 dB Frequency = 10 kHz
Channel-to-Channel Isolation –75 dB Frequency = 10 kHz
OUTPUT CHARACTERISTICS
6
Minimum Output Voltage
Maximum Output Voltage
DC Output Impedance 0.5 Ω
Short Circuit Current 25 mA VDD = 5 V
16 mA VDD = 3 V
Power-Up Time 2.5 µs Coming out of power-down mode; VDD = 5 V
5 µs Coming out of power-down mode; VDD = 3 V
LOGIC INPUTS6
Input Current ±1 µA
VIL, Input Low Voltage 0.8 V VDD = 5 V ±10%
0.7 V VDD = 3 V ±10%
0.6 V VDD = 2.5 V
VIH, Input High Voltage 1.7 V VDD = 2.5 V to 5.5 V
Pin Capacitance 5 pF
= 2 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
REF
1
MIN
Min Typ Max Unit Conditions/Comments
10 60 mV VDD = 5 V; upper deadband exists only if V
–12 ppm of FSR/°C
–5 ppm of FSR/°C
–60 dB ∆VDD = ±10%
200 µV
= 2 kΩ to GND, 2 kΩ to VDD; CL = 200 pF to GND;
R
L
Gain = +1
4, 7
0.001 V min Rail-to-rail operation
4, 7
V
V max
–
DD
0.001
to T
DAC
DAC
MAX
,
= V
REF
DD
Rev. 0 | Page 3 of 24
AD5346/AD5347/AD5348
B Version
Parameter
LOGIC OUTPUTS
2
6
Min Typ Max Unit Conditions/Comments
1
VDD = 4.5 V to 5.5 V
Output Low Voltage, VOL 0.4 V I
Output High Voltage, VOH VDD – 1 V I
= 200 µA
SINK
SOURCE
= 200 µA
VDD = 2.5 V to 3.6 V
Output Low Voltage, VOL 0.4 V I
Output High Voltage, VOH VDD – 0.5 V I
= 200 µA
SINK
SOURCE
= 200 µA
POWER REQUIREMENTS
VDD 2.5 5.5 V
IDD (Normal Mode) VIH = VDD, VIL = GND
VDD = 4.5 V to 5.5 V 1 1.65 mA All DACs in unbuffered mode. In buffered mode,
VDD = 2.5 V to 3.6 V 0.8 1.4 mA
extra current is typically x µA per DAC, where x = 5 µA +
V
REF/RDAC
IDD (Power-Down Mode) VIH = VDD, VIL = GND
VDD = 4.5 V to 5.5 V 0.4 1 µA
VDD = 2.5 V to 3.6 V 0.12 1 µA
See footnotes after the AC Characteristics table.
AC CHARACTERISTICS
Table 2. VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
B Version
6
to T
1
MIN
, unless otherwise noted
MAX
Parameter2 Min Typ Max Unit Conditions/Comments
Output Voltage Settling Time V
REF
= 2 V
AD5346 6 8 µs 1/4 scale to 3/4 scale change (40 H to C0 H)
AD5347 7 9 µs 1/4 scale to 3/4 scale change (100 H to 300 H)
AD5348 8 10 µs 1/4 scale to 3/4 scale change (400 H to C00 H)
Slew Rate 0.7 V/µs
Major Code Transition Glitch
Energy
8 nV-s 1 LSB change around major carry
Digital Feedthrough 0.5 nV-s
Digital Crosstalk 1 nV-s
Analog Crosstalk 1 nV-s
DAC-to-DAC Crosstalk 3.5 nV-s
Multiplying Bandwidth 200 kHz V
Total Harmonic Distortion –70 dB V
= 2 V ±0.1 V p-p; unbuffered mode
REF
= 2. V ±0.1 V p-p; frequency = 10 kHz; unbuffered mode
REF
1
Temperature range: B Version: –40°C to +105°C; typical specifications are at 25°C.
2
See Terminology section.
3
Linearity is tested using a reduced code range: AD5346 (Code 8 to 255); AD5347 (Code 28 to 1023); AD5348 (Code 115 to 4095).
4
DC specifications tested with outputs unloaded.
5
This corresponds to x codes. x = deadband voltage/LSB size.
6
Guaranteed by design and characterization, not production tested.
7
For the amplifier output to reach its minimum voltage, offset error must be negative. For the amplifier output to reach its maximum voltage, V
the offset plus gain error must be positive.
200µA
I
OL
= VDD and
REF
TO OUTPUT
PIN
50pF
C
L
200µA
I
OH
VOH(min) + VOL(max)
Figure 2. Load Circuit for Digital Output Timing Specifications
Rev. 0 | Page 4 of 24
2
03331-0-002
AD5346/AD5347/AD5348
TIMING CHARACTERISTICS
Table 3. VDD = 2.5 V to 5.5 V; all specifications T
Parameter Limit at T
Data Write Mode (Figure 3)
t1 0 ns min
t2 0 ns min
t3 20 ns min
t4 5 ns min Data, GAIN, BUF setup time
t5 4.5 ns min Data, GAIN, BUF hold time
t6 5 ns min
t7 5 ns min
t8 4.5 ns min Synchronous mode. WR rising to LDAC rising.
t9 5 ns min
t10 4.5 ns min
t11 20 ns min
t12 10 ns min
t13 20 ns min
t14 20 ns min A0, A1, A2 setup time
t15 0 ns min A0, A1, A2 hold time
Data Readback Mode (Figure 4)
t16 0 ns min
t17 0 ns min
t18 0 ns min CS to falling edge of RD
t19 20 ns min
30 ns min
t20 0 ns min
t21 22 ns max
30 ns max
t22 4 ns min
30 ns max
t23 22 ns max
30 ns max
t
24
t
25
t
26
50 ns min
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
RD pulse width; VDD = 3.6 V to 5.5 V
RD pulse width; VDD = 2.5 V to 3.6 V
CS to RD hold time
Data access time after falling edge of
Data access time after falling edge of
Bus relinquish time after rising edge of
CS falling edge to data; VDD = 3.6 V to 5.5 V
CS falling edge to data; VDD = 2.5 V to 3.6 V
Time between
Time from
Time from
Time from
A0–A2
CS
RD
DATA
WR
03331-0-003
WR falling to LDAC falling.
LDAC falling to WR rising.
LDAC rising to WR rising.
WR rising to LDAC falling.
WR cycles
CS
setup time
CS
hold time
RD; VDD = 3.6 V to 5.5 V
RD VDD = 2.5 V to 3.6 V
RD
cycles
RD to WR
WR to RD, VDD = 3.6 V to 5.5 V
WR to RD, VDD = 2.5 V to 3.6 V
t
16
t
18
t
21
t
23
t
26
t
20
t
19
t
22
RD
t
17
t
24
t
25
03331-0-004
Rev. 0 | Page 5 of 24
AD5346/AD5347/AD5348
ABSOLUTE MAXIMUM RATINGS
Table 4. TA = 25°C, unless otherwise noted
Parameter Rating
VDD to GND –0.3 V to +7 V
Digital Input Voltage to GND –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND –0.3 V to VDD + 0.3 V
V
to GND –0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Industrial (B Version) –40°C to +105°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
38-Lead TSSOP Package
Power Dissipation (TJ max − TA)/ θJA mW
θJA Thermal Impedance 98.3°C/W
θJC Thermal Impedance 8.9°C/W
40-Lead LFCSP Package
Power Dissipation (TJ max − TA)/ θJA mW
θJA Thermal Impedance (3-layer
board)
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature 220°C
29.6°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 24
AD5346/AD5347/AD5348
AD5346 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
CD
EF
V
REF
V
V
V
V
REF
REF
V
REF
V
OUT
V
OUT
V
OUT
V
OUT
AGND
V
OUT
V
OUT
OUT
V
OUT
DGND
BUF
LDAC
GH
EF
CD
DD
AB
A
B
C
D
E
F
G
H
A0
A1
1
2
3
4
5
6
8-BIT
AD5346
7
TOP VIEW
8
(Not to Scale)
9
10
11
12
13
14
15
16
17
18
19
38
PD
37
CLR
36
GAIN
35
WR
34
RD
33
CS
32
DB
7
31
DB
6
30
DB
5
29
DB
4
28
DB
3
DB
27
2
DB
26
1
DB
25
0
DGND
24
23
DGND
DGND
22
DGND
21
20
A2
03331-0-005
V
OUT
V
OUT
V
OUT
V
OUT
AGND
AGND
V
OUT
V
OUT
V
OUT
V
OUT
AB
REF
DD
DD
V
V
V
40 39 38 37 36 35 34 33 32 31
A
1
2
B
C
3
D
4
5
6
E
7
F
8
9
G
H
10
11 12 13 14 15 16 17 18 19 20
BUF
LDAC
DGND
Figure 6. AD5346 Pin Configuration—LFCSP
Figure 5. AD5346 Pin Configuration—TSSOP
Table 5. AD5346 Pin Function Descriptions
Pin Number
TSSOP LFCSP Mnemonic Function
1 35 V
2 36 V
3 37 V
4 38, 39 VDD
GH Reference Input for DACs G and H.
REF
EF Reference Input for DACs E and F.
REF
CD Reference Input for DACs C and D.
REF
Power Supply Pin(s). This part can operate from 2.5 V to 5.5 V, and the supply should be decoupled
with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND. Both V
package must be at the same potential.
5 40 V
6–9,
11–14
1–4,
7–10
AB Reference Input for DACs A and B.
REF
X Output of DAC X. Buffered output with rail-to-rail operation.
V
OUT
10 5, 6 AGND Analog Ground. Ground reference for analog circuitry.
15,
21–24
11,
17–20
DGND Digital Ground. Ground reference for digital circuitry.
16 12 BUF Buffer Control Pin. Controls whether the reference input to the DAC is buffered or unbuffered.
17 13
LDAC
Active Low Control Input. Updates the DAC registers with the contents of the input registers, which
allows all DAC outputs to be simultaneously updated.
18 14 A0 LSB Address Pin. Selects which DAC is to be written to.
19 15 A1 Address Pin. Selects which DAC is to be written to.
20 16 A2 MSB Address Pin. Selects which DAC is to be written to.
25–32 21–28 DB0–DB
33 29
34 30
35 31
CS
RD
WR
7
Eight Parallel Data Inputs. DB7 is the MSB of these eight bits.
Active Low Chip Select Input. Used in conjunction with
RD to read back data from a DAC.
with
Active Low Read Input. Used in conjunction with
Active Low Write Input. Used in conjunction with
WR to write data to the parallel interface, or
CS to read data back from the internal DACs.
CS to write data to the parallel interface.
36 32 GAIN Gain Control Pin. Controls whether the output range from the DAC is 0 V to V
37 33
38 34
CLR
PD
Asynchronous Active Low Control Input. Clears all input registers and DAC registers to zeros.
Power-Down Pin. This active low control pin puts all DACs into power-down mode.
GH
REF
REF
REF
V
V
V
8-BIT
AD5346
TOP VIEW
(Not to Scale)
A2
A1
A0
DD
PD
CLR
GAIN
WR
30
RD
29
CS
28
DB
7
27
DB
6
26
DB
5
25
DB
4
24
DB
3
23
DB
2
22
DB
1
21
DB
0
DGND
DGND
DGND
DGND
pins on the LFCSP
or 0 V to 2 × V
REF
03331-0-006
REF.
Rev. 0 | Page 7 of 24
AD5346/AD5347/AD5348
AD5347 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
CD
EF
V
V
V
V
REF
REF
REF
V
REF
V
OUT
V
OUT
V
OUT
V
OUT
AGND
V
OUT
V
OUT
V
OUT
V
OUT
DGND
BUF
LDAC
GH
EF
CD
DD
AB
A
B
C
D
E
F
G
H
A0
A1
1
2
3
4
5
6
10-BIT
AD5347
7
TOP VIEW
8
(Not to Scale)
9
10
11
12
13
14
15
16
17
18
19
38
PD
37
CLR
36
GAIN
35
WR
34
RD
33
CS
32
DB
9
31
DB
8
30
DB
7
29
DB
6
28
DB
5
DB
27
4
DB
26
3
DB
25
2
DB
24
1
23
DB
0
DGND
22
DGND
21
20
A2
03331-0-007
V
OUT
V
OUT
V
OUT
V
OUT
AGND
AGND
V
OUT
V
OUT
V
OUT
V
OUT
AB
REF
DD
DD
V
V
V
40 39 38 37 36 35 34 33 32 31
A
1
2
B
C
3
D
4
5
6
E
7
F
8
9
G
H
10
11 12 13 14 15 16 17 18 19 20
BUF
LDAC
DGND
Figure 8. AD5347 Pin Configuration—LFCSP
Figure 7. AD5347 Pin Configuration—TSSOP
Table 6. AD5347 Pin Function Descriptions
Pin Number
TSSOP LFCSP Mnemonic Function
1 35 V
2 36 V
3 37 V
4 38, 39 V
GH Reference Input for DACs G and H.
REF
EF Reference Input for DACs E and F.
REF
CD Reference Input for DACs C and D.
REF
DD
Power Supply Pin(s). This part can operate from 2.5 V to 5.5 V, and the supply should be decoupled
with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND. Both V
must be at the same potential.
5 40 V
6–9,
11–14
1–4,
7–10
AB Reference Input for DACs A and B.
REF
X Output of DAC X. Buffered output with rail-to-rail operation.
V
OUT
10 5, 6 AGND Analog Ground. Ground reference for analog circuitry.
15, 21–22
11,
DGND Digital Ground. Ground reference for digital circuitry.
17–18
16 12 BUF Buffer Control Pin. Controls whether the reference input to the DAC is buffered or unbuffered.
17 13
LDACActive Low Control Input. Updates the DAC registers with the contents of the input registers, which
allows all DAC outputs to be simultaneously updated.
18 14 A0 LSB Address Pin. Selects which DAC is to be written to.
19 15 A1 Address Pin. Selects which DAC is to be written to.
20 16 A2 MSB Address Pin. Selects which DAC is to be written to.
23–32 19–28 DB0–DB
33 29
34 30
35 31
CSActive Low Chip Select Input. Used in conjunction with WR to write data to the parallel interface, or
RDActive Low Read Input. Used in conjunction with CS to read data back from the internal DACs.
WRActive Low Write Input. Used in conjunction with CS to write data to the parallel interface.
Ten Parallel Data Inputs. DB9 Is the MSB of these ten bits.
9
RD to read back data from a DAC.
with
36 32 GAIN Gain Control Pin. Controls whether the output range from the DAC is 0 V to V
37 33
38 34
CLR
PD
Asynchronous Active Low Control Input. Clears all input registers and DAC registers to zeros.
Power-Down Pin. This active low control pin puts all DACs into power-down mode.
GH
REF
REF
REF
V
V
V
10-BIT
PD
CLR
GAIN
AD5347
TOP VIEW
(Not to Scale)
A2
A1
A0
pins on the LFCSP package
DD
0
DGND
DGND
or 0 V to 2 × V
REF
WR
DB1DB
30
RD
29
CS
28
DB
9
27
DB
8
26
DB
7
25
DB
6
24
DB
5
23
DB
4
22
DB
3
21
DB
2
03331-0-008
.
REF
Rev. 0 | Page 8 of 24
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