AD5330: single 8-bit DAC in 20-lead TSSOP
AD5331: single 10-bit DAC in 20-lead TSSOP
AD5340: single 12-bit DAC in 24-lead TSSOP
AD5341: single 12-bit DAC in 20-lead TSSOP
Low power operation: 115 μA @ 3 V, 140 μA @ 5 V
REF
PD
LDAC
pin
FUNCTIONAL BLOCK DIAGRAM
POWER-ON
RESET
Power-down to 80 nA @ 3 V, 200 nA @ 5 V via
2.5 V to 5.5 V power supply
Double-buffered input logic
Guaranteed monotonic by design over all codes
Buffered/unbuffered reference input options
Output range: 0 V to V
or 0 V to 2 × V
REF
Power-on reset to 0 V
Simultaneous update of DAC outputs via
Asynchronous
CLR
facility
Low power parallel data interface
On-chip rail-to-rail output buffer amplifiers
Temperature range: −40°C to +105°C
APPLICATIONS
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
Industrial process control
Pin
AD5330/AD5331/AD5340/AD5341
GENERAL DESCRIPTION
The AD5330/AD5331/AD5340/AD53411 are single 8-/10-/12bit DACs. They operate from a 2.5 V to 5.5 V supply consuming
just 115 μA at 3 V and feature a power-down mode that further
reduces the current to 80 nA. The devices incorporate an on-chip
output buffer that can drive the output to both supply rails, but
the AD5330, AD5340, and AD5341 allow a choice of buffered
or unbuffered reference input.
The AD5330/AD5331/AD5340/AD5341 have a parallel
interface.
input registers on the rising edge of
The GAIN pin allows the output range to be set at 0 V to V
0 V to 2 × V
Input data to the DACs is double-buffered, allowing simultaneous update of multiple DACs in a system using the
An asynchronous
contents of the input register and the DAC register to all zeros.
These devices also incorporate a power-on reset circuit that
ensures that the DAC output powers on to 0 V and remains
there until valid data is written to the device.
The AD5330/AD5331/AD5340/AD5341 are available in thin
shrink small outline packages (TSSOP).
1
Protected by U.S. Patent Number 5,969,657.
REF
312
CS
selects the device and data is loaded into the
WR
.
.
REF
CLR
input is also provided, which resets the
DD
AD5330
LDAC
REF
pin.
or
1
BUF
GAIN
8
DB
20
7
.
.
13
DB
0
6
CS
7
WR
9
CLR
10
LDAC
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Ordering Guide .......................................................... 25
4/00—Revision 0: Initial Version
from the Reference Voltage Section ..... 21
DD
Rev. A | Page 2 of 28
AD5330/AD5331/AD5340/AD5341
SPECIFICATIONS
VDD = 2.5 V to 5.5 V, V
Table 1.
Parameter
1
DC PERFORMANCE
AD5330
Resolution 8 Bits
Relative Accuracy ±0.15 ±1 LSB
Differential Nonlinearity ±0.02 ±0.25 LSB Guaranteed monotonic by design over all codes
AD5331
Resolution 10 Bits
Relative Accuracy ±0.5 ±4 LSB
Differential Nonlinearity ±0.05 ±0.5 LSB Guaranteed monotonic by design over all codes
AD5340/AD5341
Resolution 12 Bits
Relative Accuracy ±2 ±16 LSBs
Differential Nonlinearity ±0.2 ±1 LSB Guaranteed monotonic by design over all codes
Offset Error ±0.4 ±3 % of FSR
Gain Error ±0.15 ±1 % of FSR
Lower Deadband
Upper Deadband 10 60 mV VDD = 5 V; upper deadband exists only if V
Offset Error Drift
Gain Error Drift
6
DC Power Supply Rejection Ratio6 −60 dB ΔVDD = ±10%
DAC REFERENCE INPUT
V
Input Range 1 VDD V Buffered reference (AD5330, AD5340, and AD5341)
REF
0.25 VDD V Unbuffered reference
V
Input Impedance >10 MΩ Buffered reference (AD5330, AD5340, and AD5341)
REF
180 kΩ Unbuffered reference; gain = 1, input impedance = R
90 kΩ Unbuffered reference; gain = 2, input impedance = R
Reference Feedthrough −90 dB Frequency = 10 kHz
OUTPUT CHARACTERISTICS
Minimum Output Voltage
Maximum Output Voltage
DC Output Impedance 0.5 Ω
Short-Circuit Current 25 mA VDD = 5 V
15 mA VDD = 3 V
Power-Up Time 2.5 μs Coming out of power-down mode; VDD = 5 V
5 μs Coming out of power-down mode; VDD = 3 V
LOGIC INPUTS
6
Input Current ±1 μA
Input Low Voltage, VIL 0.8 V VDD = 5 V ± 10%
0.6 V VDD = 3 V ± 10%
0.5 V VDD = 2.5 V
Input High Voltage, VIH 2.4 V VDD = 5 V ± 10%
2.1 V VDD = 3 V ± 10%
2.0 V VDD = 2.5 V
Pin Capacitance 3 pF
= 2 V, RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
REF
B Version
2
Unit Conditions/Comments Min Typ Max
3, 4
5
6
−5 ppm of FSR/°C
6
6
4, 7
4, 7
10 60 mV Lower deadband exists only if offset error is negative
−12 ppm of FSR/°C
0.001 V min Rail-to-rail operation
V
− 0.001 V max
DD
MIN
to T
, unless otherwise noted.
MAX
REF
= VDD
DAC
DAC
Rev. A | Page 3 of 28
AD5330/AD5331/AD5340/AD5341
2
Unit Conditions/Comments Min Typ Max
Parameter
1
B Version
POWER REQUIREMENTS
VDD 2.5 5.5 V
IDD (Normal Mode) DACs active and excluding load currents. Unbuffered
VDD = 4.5 V to 5.5 V 140 250 μA Reference, VIH = VDD, VIL = GND
VDD = 2.5 V to 3.6 V 115 200 μA IDD increases by 50 μA at V
In buffered mode, extra current is (5 + V
where R
is the resistance of the resistor string.
DAC
> VDD − 100 mV.
REF
REF/RDAC
) μA,
IDD (Power-Down Mode)
VDD = 4.5 V to 5.5 V 0.2 1 μA
VDD = 2.5 V to 3.6 V 0.08 1 μA
1
See the Terminology section.
2
Temperature range: B Version: −40°C to +105°C; typical specifications are at 25°C.
3
Linearity is tested using a reduced code range: AD5330 (Code 8 to Code 255); AD5331 (Code 28 to Code 1023); AD5340/AD5341 (Code 115 to Code 4095).
4
DC specifications tested with output unloaded.
5
This corresponds to x codes. x = deadband voltage/LSB size.
6
Guaranteed by design and characterization, not production tested.
7
For the amplifier output to reach its minimum voltage, offset error must be negative. For the amplifier output to reach its maximum voltage, V
gain error must be positive.
= VDD and offset plus
REF
AC CHARACTERISTICS1
VDD = 2.5 V to 5.5 V. RL = 2 kΩ to GND, CL = 200 pF to GND; all specifications T
Table 2.
Parameter
2
Output Voltage Settling Time V
B Version
3
Unit Conditions/Comments Min Typ Max
REF
AD5330 6 8 μs ¼ scale to ¾ scale change (0x40 to 0xC0)
AD5331 7 9 μs ¼ scale to ¾ scale change (0x100 to 0x300)
AD5340 8 10 μs ¼ scale to ¾ scale change (0x400 to 0xC00)
AD5341 8 10 μs ¼ scale to ¾ scale change (0x400 to 0xC00)
Slew Rate 0.7 V/μs
Major Code Transition Glitch Energy 6 nV/s 1 LSB change around major carry
Digital Feedthrough 0.5 nV/s
Multiplying Bandwidth 200 kHz V
Total Harmonic Distortion −70 dB V
1
Guaranteed by design and characterization, not production tested.
2
See the Terminology section.
3
Temperature range: B Version: −40°C to +105°C; typical specifications are at 25°C.
REF
REF
MIN
to T
, unless otherwise noted.
MAX
= 2 V; see Figure 29
= 2 V ± 0.1 V p-p; unbuffered mode
= 2.5 V ± 0.1 V p-p; frequency = 10 kHz
Rev. A | Page 4 of 28
AD5330/AD5331/AD5340/AD5341
TIMING CHARACTERISTICS
VDD = 2.5 V to 5.5 V, all specifications T
1, 2, 3
MIN
to T
, unless otherwise noted.
MAX
Table 3.
Parameter Limit at T
t1 0 ns min
t2 0 ns min
t3 20 ns min
MIN
, T
Unit Condition/Comments
MAX
to WR setup time.
CS
to WR hold time.
CS
pulse width.
WR
t4 5 ns min Data, GAIN, BUF, HBEN setup time.
t5 4.5 ns min Data, GAIN, BUF, HBEN hold time.
t6 5 ns min
t7 5 ns min
t8 4.5 ns min
t9 5 ns min
t10 4.5 ns min
t11 20 ns min
t12 20 ns min
t13 50 ns min
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 2.
Synchronous mode; WR
Synchronous mode; LDAC
Synchronous mode; WR
Asynchronous mode; LDAC
Asynchronous mode; WR
pulse width.
LDAC
pulse width.
CLR
Time between WR
t
CS
WR
DATA,
GAIN,
BUF,
HBEN
1
LDAC
2
LDAC
CLR
NOTES:
1
SYNCHRONOUS LDAC UPDAT E MODE
2
ASYNCHRONOUS LDAC UPDAT E MODE
1
t
6
t
3
t
2
t
13
t
5
t
4
t
8
t
7
t
t
9
10
t
11
Figure 2. Parallel Interface Timing Diagram
falling to LDAC falling.
falling to WR rising.
rising to LDAC rising.
rising to WR rising.
rising to LDAC falling.
cycles.
t
12
06852-002
Rev. A | Page 5 of 28
AD5330/AD5331/AD5340/AD5341
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
Reference Input Voltage to GND −0.3 V to VDD + 0.3 V
V
to GND −0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
TSSOP Package
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1 BUF Buffer Control Pin. This pin controls whether the reference input to the DAC is buffered or unbuffered.
2 NC No Connect.
3 V
4 V
Reference Input.
REF
Output of DAC. Buffered output with rail-to-rail operation.
OUT
5 GND Ground reference point for all circuitry on the part.
6
7
Active Low Chip Select Input. This is used in conjunction with WR to write data to the parallel interface.
CS
Active Low Write Input. This is used in conjunction with CS to write data to the parallel interface.
WR
8 GAIN Gain Control Pin. This controls whether the output range from the DAC is 0 V to V
9
10
11
CLR
LDAC
PD
12 VDD
Asynchronous active low control input that clears all input registers and DAC registers to zero.
Active low control input that updates the DAC registers with the contents of the input registers.
Power-Down Pin. This active low control pin puts the DAC into power-down mode.
Power Supply Input. These parts can operate from 2.5 V to 5.5 V and the supply should be decoupled with a
10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
13 to 20 DB0 to DB7 Eight Parallel Data Inputs. DB7 is the MSB of these eight bits.
1 DB8 Parallel Data Input.
2 DB9 Most Significant Bit of Parallel Data Input.
3 V
4 V
Unbuffered Reference Input.
REF
Output of DAC. Buffered output with rail-to-rail operation.
OUT
5 GND Ground reference point for all circuitry on the part.
6
7
Active Low Chip Select Input. This is used in conjunction with WR to write data to the parallel interface.
CS
Active Low Write Input. This is used in conjunction with CS to write data to the parallel interface.
WR
8 GAIN Gain Control Pin. This controls whether the output range from the DAC is 0 V to V
9
10
11
CLR
LDAC
PD
12 VDD
Active low control input that clears all input registers and DAC registers to zero.
Active low control input that updates the DAC registers with the contents of the input registers.
Power-Down Pin. This active low control pin puts the DAC into power-down mode.
Power Supply Input. These parts can operate from 2.5 V to 5.5 V and the supply should be decoupled with a
10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
1 DB10 Parallel Data Input.
2 DB11 Most Significant Bit of Parallel Data Input.
3 BUF Buffer Control Pin. This pin controls whether the reference input to the DAC is buffered or unbuffered.
4 V
5 V
Reference Input.
REF
Output of DAC. Buffered output with rail-to-rail operation.
OUT
6 NC No Connect.
7 GND Ground reference point for all circuitry on the part.
8
9
Active Low Chip Select Input. This is used in conjunction with WR to write data to the parallel interface.
CS
Active Low Write Input. This is used in conjunction with CS to write data to the parallel interface.
WR
10 GAIN Gain Control Pin. This controls whether the output range from the DAC is 0 V to V
11
12
13
CLR
LDAC
PD
14 VDD
Asynchronous active low control input that clears all input registers and DAC registers to zero.
Active low control input that updates the DAC registers with the contents of the input registers.
Power-Down Pin. This active low control pin puts the DAC into power-down mode.
Power Supply Input. These parts can operate from 2.5 V to 5.5 V and the supply should be decoupled with a
10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
15 to 24 DB0 to DB9 Ten Parallel Data Inputs.
AD5340
BUFFER
DD
POWER-DOW N
LOGIC
137
PD GND
REF
24
DB
9
23
DB
8
22
DB
7
21
DB
6
20
DB
5
19
DB
4
18
DB
3
17
DB
2
16
DB
1
15
DB
0
14
V
DD
13
PD
06852-008
.
1
DB
10
2
DB
5
V
OUT
06852-007
11
3
BUF
4
V
REF
V
5
OUT
NC
6
7
GND
8
CS
9
WR
10
GAIN
11
CLR
12
LDAC
or 0 V to 2 × V
REF
12-BIT
AD5340
TOP VIEW
(Not to Scale)
Rev. A | Page 9 of 28
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