ANALOG DEVICES AD5316R Service Manual

Quad, 10-Bit nanoDAC with 2 ppm/°C
V
V
V
Data Sheet

FEATURES

Low drift 2.5 V on-chip reference: 2 ppm/°C typical Tiny package: 3 mm × 3 mm, 16-lead LFCSP
Total unadjusted error (TUE): ±0.1% of FSR maximum Offset error: ±1.5 mV maximum Gain error: ±0.1% of FSR maximum High drive capability: 20 mA, 0.5 V from supply rails User-selectable gain of 1 or 2 (GAIN pin) Reset to zero scale or midscale (RSTSEL pin)
1.8 V logic compatibility 400 kHz I 4 I Low glitch: 0.5 nV-sec Robust 3.5 kV HBM and 1.5 kV FICDM ESD rating Low power: 3.3 mW at 3 V
2.7 V to 5.5 V power supply
−40°C to +105°C temperature range

APPLICATIONS

Digital gain and offset adjustment Programmable attenuators Industrial automation Data acquisition systems

GENERAL DESCRIPTION

The AD5316R, a member of the nanoDAC® family, is a low power, quad, 10-bit buffered voltage output DAC. The device includes a 2.5 V, 2 ppm/°C internal reference (enabled by default) and a gain select pin giving a full-scale output of 2.5 V (gain = 1) or 5 V (gain = 2). The device operates from a single 2.7 V to 5.5 V supply, is guaranteed monotonic by design, and exhibits less than 0.1% FSR gain error and 1.5 mV offset error performance. The device is available in a 3 mm × 3 mm LFCSP package and in a TSSOP package.
The AD5316R also incorporates a power-on reset circuit and a RSTSEL pin; the RSTSEL pin ensures that the DAC outputs power up to zero scale or midscale and remain at that level until a valid write takes place. The part contains a per-channel power-down feature that reduces the current consumption of the device in power-down mode to 4 μA at 3 V.
The AD5316R uses a versatile 2-wire serial interface that operates at clock rates up to 400 kHz and includes a V for 1.8 V/3 V/5 V logic.
2
2
C-compatible serial interface
C addresses available
pin intended
LOGIC
2
Reference, I
C Interface
AD5316R

FUNCTIONAL BLOCK DIAGRAM

LOGIC
SCL
SDA
DD
AD5316R
REGISTER
REGISTER
A1
A0
REGISTER
INTERFACE LOGIC
REGISTER
INPUT
INPUT
INPUT
INPUT
GND
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
POWER-ON
RESET
RSTSEL GAINLDAC RESET
Figure 1.
Table 1. Related Devices
Interface Reference 12-Bit 10-Bit
SPI Internal AD5684R AD5317R External AD5684 AD5317 I2C Internal AD5694R External AD5694 AD53161
1
The AD5316R and the AD5316 are not pin-to-pin or software compatible.

PRODUCT HIGHLIGHTS

1. Precision DC Performance.
Total unadjusted error: ±0.1% of FSR maximum Offset error: ±1.5 mV maximum Gain error: ±0.1% of FSR maximum
2. Low Drift 2.5 V On-Chip Reference.
2 ppm/°C typical temperature coefficient 5 ppm/°C maximum temperature coefficient
3. Two Pa ckage Opti ons .
3 mm × 3 mm, 16-lead LFCSP 16-lead TSSOP
REF
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
GAIN =
×1/×2
2.5V
REFERENCE
BUFFER
BUFFER
BUFFER
BUFFER
POWER-
DOWN LOGIC
V
A
OUT
V
B
OUT
V
C
OUT
V
D
OUT
10819-001
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2012 Analog Devices, Inc. All rights reserved.
AD5316R Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
AC Characteristics ........................................................................ 4
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings ............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution .................................................................................. 6
Pin Configurations and Function Descriptions ........................... 7
Typical Performance Characteristics ............................................. 8
Term ino log y .................................................................................... 14
Theory of Operation ...................................................................... 16
Digital-to-Analog Converter .................................................... 16
Transfer Function ....................................................................... 16
DAC Architecture ....................................................................... 16
Serial Interface ............................................................................ 17
Write and Update Commands .................................................. 17
I2C Slave Address ........................................................................ 18
Serial Operation ......................................................................... 18
Write Operation.......................................................................... 18
Read Operation........................................................................... 19
Multiple DAC Readback Sequence .......................................... 19
Power-Down Operation ............................................................ 20
Load DAC (Hardware LDAC
Mask Register ................................................................. 21
Hardware Reset Pin (
Reset Select Pin (RSTSEL) ........................................................ 21
Internal Reference Setup ........................................................... 22
Solder Heat Reflow ..................................................................... 22
Long-Term Temperature Drift ................................................. 22
Thermal Hysteresis .................................................................... 22
Applications Information .............................................................. 23
Microprocessor Interfacing ....................................................... 23
AD5316R to ADSP-BF531 Interface ....................................... 23
Layout Guidelines....................................................................... 23
Galvanically Isolated Interface ................................................. 23
Outline Dimensions ....................................................................... 24
Ordering Guide .......................................................................... 24
LDAC
Pin) ........................................... 20
) ................................................... 21
RESET

REVISION HISTORY

7/12—Rev. 0 to R e v. A
Change to Features Section ............................................................. 1
Change to Relative Accuracy Parameter in Tabl e 2 ..................... 3
Change to Differential Nonlinearity Parameter in Table 2 ......... 3
Changes to Ordering Guide .......................................................... 24
7/12—Revision 0: Initial Version
Rev. A | Page 2 of 24
Data Sheet AD5316R
Resolution
10
Bits
Full-Scale Error
+0.01
±0.1
% of FSR
All 1s loaded to DAC register
DC Power Supply Rejection Ratio4
0.15 mV/V
DAC code = midscale; VDD = 5 V ± 10%
Capacitive Load Stability
2
nF
RL = ∞
Short-Circuit Current6
40 mA
Output Voltage Noise Density4
240 nV/√Hz
At TA, f = 10 kHz, CL = 10 nF
Thermal Hysteresis4
125 ppm
First cycle

SPECIFICATIONS

VDD = 2.7 V to 5.5 V; V
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
STATIC PERFORMANCE3
Relative Accuracy ±0.12 ±0.5 LSB Differential Nonlinearity ±0.5 LSB Guaranteed monotonic by design Zero-Code Error 0.4 1.5 mV All 0s loaded to DAC register Offset Error +0.1 ±1.5 mV
Gain Error ±0.02 ±0.1 % of FSR Total Unadjusted Error ±0.01 ±0.1 % of FSR External reference, gain = 2, TSSOP ±0.2 % of FSR Internal reference, gain = 1, TSSOP Offset Error Drift4 ±1 µV/°C Gain Temperature Coefficient4 ±1 ppm Of FSR/°C
= 2.5 V; 1.8 V ≤ V
REF
≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications T
LOGIC
MIN
to T
, unless otherwise noted.
MAX
1, 2
DC Crosstalk4 ±2 µV
Due to single channel, full-scale output
change ±3 µV/mA Due to load current change ±2 µV Due to power-down (per channel) OUTPUT CHARACTERISTICS4
Output Voltage Range 0 V 0 2 × V
V Gain = 1
REF
V Gain = 2 (see Figure 26)
REF
10 nF RL = 1 kΩ Resistive Load5 1 Load Regulation DAC code = midscale 80 µV/mA 5 V ± 10%; −30 mA ≤ I 80 µV/mA 3 V ± 10%; −20 mA ≤ I
≤ +30 mA
OUT
≤ +20 mA
OUT
Load Impedance at Rails7 25 Ω See Figure 26 Power-Up Time 2.5 µs Coming out of power-down mode; VDD = 5 V
REFERENCE OUTPUT
Output Voltage8 2.4975 2.5025 V At TA Reference TC9 2 5 ppm/°C See the Terminology section Output Impedance4 0.04 Ω Output Voltage Noise4 12 µV p-p 0.1 Hz to 10 Hz
Load Regulation, Sourcing4 20 µV/mA At TA Load Regulation, Sinking4 40 µV/mA At TA Output Current Load Capability4 ±5 mA VDD ≥ 3 V Line Regulation4 100 µV/V At TA Long-Term Stability/Drift4 12 ppm After 1000 hours at 125°C
25 ppm Additional cycles LOGIC INPUTS4
Input Current ±2 µA Per pin Input Low Voltage, V Input High Voltage, V Pin Capacitance 2 pF
0.3 × V
INL
0.7 × V
INH
V
LOGI C
Rev. A | Page 3 of 24
V
LOGI C
AD5316R Data Sheet
V
+ 1.5
5.5 V Gain = 2
Total Harmonic Distortion4
−80 dB
At TA, BW = 20 kHz, VDD = 5 V, f
= 1 kHz
Parameter Min Typ Max Unit Test Conditions/Comments
1, 2
LOGIC OUTPUTS (SDA)4
Output Low Voltage, VOL 0.4 V I
= 3 mA
SINK
Floating State Output Capacitance 4 pF
POWER REQUIREMENTS
V
1.8 5.5 V
LOGI C
I
3 µA
LOGI C
VDD 2.7 5.5 V Gain = 1
REF
IDD VIH = VDD, VIL = GND, VDD = 2.7 V to 5.5 V
Normal Mode10 0.59 0.7 mA Internal reference off
1.1 1.3 mA Internal reference on, at full scale All Power-Down Modes11 1 4 µA −40°C to +85°C
6 µA −40°C to +105°C
1
Temperature range is −40°C to +105°C.
2
The AD5316R and the AD5316 are not pin-to-pin or software compatible.
3
DC specifications are tested with the outputs unloaded, unless otherwise noted. Upper dead band (10 mV) exists only when V
with gain = 2. Linearity calculated using a reduced code range of 4 to 1020.
4
Guaranteed by design and characterization; not production tested.
5
Channel A and Channel B can have a combined output current of up to 30 mA. Similarly, Channel C and Channel D can have a combined output current of up to
30 mA up to a junction temperature of 110°C.
6
VDD = 5 V. The device includes current limiting that is intended to protect the device during temporary overload conditions. Junction temperature can be exceeded
during current limit. Operation above the specified maximum junction temperature may impair device reliability.
7
When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25 Ω typical channel resistance of the output
devices. For example, when sinking 1 mA, the minimum output voltage = 25 Ω × 1 mA = 25 mV (see Figure 26).
8
Initial accuracy presolder reflow is ±750 µV; output voltage includes the effects of preconditioning drift. See the Solder Heat Reflow section.
9
Reference is trimmed and tested at two temperatures and is characterized from −40°C to +105°C. Reference temperature coefficient is calculated as per the box method.
See the Terminology section for more information.
10
Interface inactive. All DACs active. DAC outputs unloaded.
11
All DACs powered down.
= VDD with gain = 1 or when V
REF
/2 = VDD
REF

AC CHARACTERISTICS

VDD = 2.7 V to 5.5 V; V
Table 3.
Parameter
1, 2
Min Typ Max Unit Test Conditions/Comments3
Output Voltage Settling Time 5 7 µs ¼ to ¾ scale settling to ±1 LSB Slew Rate 0.8 V/µs Digital-to-Analog Glitch Impulse 0.5 nV-sec 1 LSB change around major carry transition Digital Feedthrough 0.13 nV-sec Digital Crosstalk 0.1 nV-sec Analog Crosstalk 0.2 nV-sec DAC-to-DAC Crosstalk 0.3 nV-sec
Output Noise Spectral Density 300 nV/√Hz DAC code = midscale, 10 kHz, gain = 2 Output Noise 6 µV p-p 0.1 Hz to 10 Hz
1
Guaranteed by design and characterization; not production tested.
2
See the Terminology section.
3
Temperature range is −40°C to +105°C; typical at 25°C.
4
Digitally generated sine wave at 1 kHz.
= 2.5 V; 1.8 V ≤ V
REF
≤ 5.5 V; RL = 2 kΩ; CL = 200 pF; all specifications T
LOGIC
MIN
to T
, unless otherwise noted.
MAX
OUT
Rev. A | Page 4 of 24
Data Sheet AD5316R
t
3
0 0.9
µs
t
, data hold time
t12
20 ns
SCL
SDA
t
1
t
3
LDAC
1
LDAC
2
START CONDITION
REPEATED START CONDITION
STOP CONDITION
NOTES
1
ASYNCHRONOUS LDAC UPDATE MO DE .
2
SYNCHRONOUS LDAC UPDATE MO DE .
t
4
t
6
t
5
t
7
t
8
t
2
t
13
t
4
t
11
t
10
t
12
t
12
t
9
10819-002

TIMING CHARACTERISTICS

VDD = 2.7 V to 5.5 V; 1.8 V ≤ V
≤ 5.5 V; all specifications T
LOGIC
MIN
to T
, unless otherwise noted.
MAX
Table 4.
Parameter
1, 2
Min Max Unit Description
t1 2.5 µs SCL cycle time t2 0.6 µs t t3 1.3 µs t t4 0.6 µs t t5 100 ns t
6
t7 0.6 µs t t8 0.6 µs t t9 1.3 µs t
4
t
0 300 ns tR, rise time of SCL and SDA when receiving
10
4, 5
t
20 + 0.1CB 300 ns tF, fall time of SCL and SDA when transmitting/receiving
11
, SCL high time
HIGH
, SCL low time
LOW
, start/repeated start hold time
HD,STA
, data setup time
SU ,DAT
HD,DAT
, repeated start setup time
SU,STA
, stop condition setup time
SU,STO
, bus free time between a stop condition and a start condition
BUF
LDAC pulse width
t13 400 ns
6
t
0 50 ns Pulse width of suppressed spike
SP
5
C
400 pF Capacitive load for each bus line
B
1
See Figure 2.
2
Guaranteed by design and characterization; not production tested.
3
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of the SCL
falling edge.
4
tR and tF are measured from 0.3 × VDD to 0.7 × VDD.
5
CB is the total capacitance of one bus line in pF.
6
Input filtering on the SCL and SDA inputs suppresses noise spikes that are less than 50 ns.
SCL rising edge to
LDAC rising edge

Timing Diagram

Figure 2. 2-Wire Serial Interface Timing Diagram
Rev. A | Page 5 of 24
AD5316R Data Sheet
Human Body Model (HBM)
3.5 kV
16-Lead LFCSP
70
°C/W

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to GND −0.3 V to +7 V V
to GND −0.3 V to +7 V
LOGI C
V
to GND −0.3 V to VDD + 0.3 V
OUT
V
to GND −0.3 V to VDD + 0.3 V
REF
Digital Input Voltage to GND1 −0.3 V to V SDA and SCL to GND −0.3 V to +7 V Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature 125°C Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
ESD
260°C
LOGI C
+ 0.3 V

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. This value was measured using a JEDEC standard 4-layer board with zero airflow. For the LFCSP package, the exposed pad must be tied to GND.
Table 6. Thermal Resistance
Package Type θJA Unit
16-Lead TSSOP 112.6 °C/W

ESD CAUTION

Field-Induced Charged Device
Model (FICDM)
1
Excluding SDA and SCL.
1.5 kV
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Rev. A | Page 6 of 24
Data Sheet AD5316R
5 7 V
D
Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
14
16
RSTSEL
12 11 10
1
3 4
A1 SCL A0
9
V
LOGIC
V
OUT
A
V
DD
2
GND
V
OUT
C
6
SDA
5
V
OUT
D
7
LDAC
8
GAIN
16
V
OUT
B
15
V
REF
14
RSTSEL
13
RESET
AD5316R
NOTES
1. THE EXPOSED PAD MUST BE TIED TO GND.
TOP VIEW
(Not to S cale)
10819-006
1
2
3
4
5
6
7
8
V
OUT
B
V
OUT
A
GND
V
OUT
D
V
OUT
C
V
DD
V
REF
SDA
16
15
14
13
12
11
10
9
RESET A1 SCL
GAIN LDAC
V
LOGIC
A0
RSTSEL
TOP VIEW
(Not to S cale)
AD5316R
10819-007

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 3. 16-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
Mnemonic Description LFCSP TSSOP
1 3 V
A Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
2 4 GND Ground Reference Point for All Circuitry on the Part. 3 5 VDD
Power Supply Input. The part can be operated from 2.7 V to 5.5 V. The supply should be decoupled with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
4 6 V
6 8 SDA
C Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
OUT
Serial Data Input. This pin is used in conjunction with the SCL line to clock data into or out of the 24-bit input shift register. SDA is a bidirectional, open-drain data line that should be pulled to the supply with an external pull-up resistor.
7 9
LDAC LDAC can be operated in two modes, asynchronous update mode and synchronous update mode.
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data; all DAC outputs are simultaneously updated. This pin can also be tied permanently low.
8 10 GAIN
Gain Select Pin. When this pin is tied to GND, all four DAC outputs have a span of 0 V to V When this pin is tied to V
9 11 V
Digital Power Supply. Voltage ranges from 1.8 V to 5.5 V.
LOGI C
10 12 A0 Address Input. Sets the first LSB of the 7-bit slave address. 11 13 SCL
Serial Clock Line. This pin is used in conjunction with the SDA line to clock data into or out of the
24-bit input shift register. 12 14 A1 Address Input. Sets the second LSB of the 7-bit slave address. 13 15
RESET Asynchronous Reset Input. The RESET input is falling edge sensitive. When RESET is activated
(low), the input register and the DAC register are updated with zero scale or midscale, depending
on the state of the RSTSEL pin. When
15 1 V
16 2 V 17 N/A EPAD Exposed Pad. The exposed pad must be tied to GND.
REF
B Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
Power-On Reset Pin. When this pin is tied to GND, all four DACs are powered up to zero scale.
When this pin is tied to V
Reference Voltage. The AD5316R has an internal reference. When the internal reference is used,
V
is the reference output pin. When an external reference is used, V
REF
pin. By default, the internal reference is used, and this pin is a reference output.
Rev. A | Page 7 of 24
Figure 4. 16-Lead TSSOP Pin Configuration
, all four DAC outputs have a span of 0 V to 2 × V
DD
RESET is low, all LDAC pulses are ignored.
, all four DACs are powered up to midscale.
DD
.
REF
is the reference input
REF
REF
.
AD5316R Data Sheet
–40 –20 0 20 40 60 80 100 120
V
REF
(V)
TEMPERATURE (°C)
DEVICE 1 DEVICE 2 DEVICE 3 DEVICE 4 DEVICE 5
2.4980
2.4985
2.4990
2.4995
2.5000
2.5005
2.5010
2.5015
2.5020 V
DD
= 5V
10819-212
90
0
10
20
30
40
50
60
70
80
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
NUMBER OF UNI TS
TEMPERAT URE DRIFT (ppm/°C)
VDD = 5V
10819-250
60
0
10
20
30
40
50
2.498 2.499 2.500 2.501 2.502
HITS
V
REF
(V)
0 HOUR 168 HOURS 500 HOURS 1000 HOURS
VDD = 5.5V
10819-251
1600
0
200
400
600
800
1000
1200
1400
10 100 1k 10k 100k 1M
NSD (nV/ Hz)
FREQUENCY ( Hz )
V
DD
= 5V
T
A
= 25°C
10819-111
CH1 2µV M1.0s
1
V
DD
= 5V
T
A
= 25°C
10819-112
2.5000
2.4999
2.4998
2.4997
2.4996
2.4995
2.4994
2.4993 –0.005 –0.003 –0.001 0.001 0.003 0.005
V
REF
(V)
I
LOAD
(A)
VDD = 5V T
A
= 25°C
10819-113

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 5. Internal Reference Voltage vs. Temperature
Figure 6. Reference Output Temperature Drift Histogram
Figure 8. Internal Reference Noise Spectral Density vs. Frequency
Figure 9. Internal Reference Noise, 0.1 Hz to 10 Hz
Figure 7. Reference Long-Term Stability (Drift)
Figure 10. Internal Reference Voltage vs. Load Current
Rev. A | Page 8 of 24
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