ANALOG DEVICES AD5307, AD5317, AD5327 Service Manual

2.5 V to 5.5 V, 400 μA, Quad Voltage Output,

FEATURES

AD5307: 4 buffered 8-bit DACs in 16-lead TSSOP
A version: ±1 LSB INL; B version: ±0.625 LSB INL
AD5317: 4 buffered 10-bit DACs in 16-lead TSSOP
A version: ±4 LSB INL; B version: ±2.5 LSB INL
AD5327: 4 buffered 12-bit DACs in 16-lead TSSOP
A version: ±16 LSB INL; B version: ±10 LSB INL
Low power operation: 400 μA @ 3 V, 500 μA @ 5 V
2.5 V to 5.5 V power supply Guaranteed monotonic by design over all codes
Power down to 90 nA @ 3 V, 300 nA @ 5 V ( Double-buffered input logic Buffered/unbuffered reference input options Output range: 0 V to V
or 0 V to 2 V
REF
Power-on reset to 0 V
CLR
LDAC
pin)
Simultaneous update of outputs ( Asynchronous clear facility (
Low power, SPI®-, QSPI™-, MICROWIRE™-, and DSP-
compatible 3-wire serial interface SDO daisy-chaining option On-chip rail-to-rail output buffer amplifiers Temperature range of −40°C to +105°C

APPLICATIONS

Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators Industrial process control
LDAC
pin)
REF
pin)

FUNCTIONAL BLOCK DIAGRAM

AD5307/AD5317/AD5327
LDAC
8-/10-/12-Bit DACs in 16-Lead TSSOP
AD5307/AD5317/AD5327

GENERAL DESCRIPTION

The AD5307/AD5317/AD53271 are quad 8-,10-,12-bit buffered voltage-output DACs in 16-lead TSSOP that operate from single
2.5 V to 5.5 V supplies and consume 400 A at 3 V. Their on­chip output amplifiers allow the outputs to swing rail-to-rail with a slew rate of 0.7 V/s. The AD5307/AD5317/AD5327 utilize versatile 3-wire serial interfaces that operate at clock rates up to 30 MHz; these parts are compatible with standard SPI, QSPI, MICROWIRE, and DSP interface standards.
The references for the four DACs are derived from two reference pins (one per DAC pair). These reference inputs can be configured as buffered or unbuffered inputs. Each part incorporates a power­on reset circuit, ensuring that the DAC outputs power up to 0 V and remain there until a valid write to the device takes place.
CLR
LDAC
input. Each part
pin that clears all
INPUT
REGISTER
V
DD
There is also an asynchronous active low DACs to 0 V. The outputs of all DACs can be updated simul­taneously using the asynchronous contains a power-down feature that reduces the current consumption of the device to 300 nA @ 5 V (90 nA @ 3 V). The parts can also be used in daisy-chaining applications using the SDO pin.
All three parts are offered in the same pinout, allowing users to select the amount of resolution appropriate for their application without redesigning their circuit board.
V
AB
REF
GAIN-SELECT
LOGIC
DAC
REGISTER
STRING
DAC A
BUFFER
V
A
OUT
SCLK
SYNC
DIN
SDO
1
Protected by U.S. Patent No. 5,969,657; other patents pending.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
INTERFACE
LOGIC
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-ON
RESET
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
STRING
DAC B
STRING
DAC C
STRING
DAC D
V
REF
V
BUFFER
BUFFER
BUFFER
POWER-DOWN
LOGIC
CD
GND
PDLDAC CLRDCEN
B
OUT
V
C
OUT
V
D
OUT
02067-001
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
AD5307/AD5317/AD5327

TABLE OF CONTENTS

Features .............................................................................................. 1
Input Shift Register .................................................................... 17
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Characteristics........................................................................ 5
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Te r mi n ol o g y .................................................................................... 13
Transf e r Fu ncti o n ........................................................................... 14
Functional Description ..................................................................15
Digital-to-Analog Section ......................................................... 15
Resistor String............................................................................. 15
DAC Reference Inputs ............................................................... 15
Output Amplifier........................................................................ 16
Power-On Reset .......................................................................... 16
Control Bits................................................................................. 17
Low Power Serial Interface ....................................................... 18
Daisy Chaining ........................................................................... 18
Double-Buffered Interface........................................................ 18
Load DAC Input (
Power-Down Mode .................................................................... 18
Microprocessor Interfacing....................................................... 19
Applications..................................................................................... 20
Typical Applicat i o n C i rc uit ....................................................... 20
Driving V
Bipolar Operation....................................................................... 20
Opto-Isolated Interface for Process-Control Applications... 21
Decoding Multiple AD5307/AD5317/AD5327 Devices....... 21
AD5307/AD5317/AD5327 as Digitally Programmable
Window Detectors ..................................................................... 21
Daisy Chaining ........................................................................... 22
Power Supply Bypassing and Grounding................................ 22
Outline Dimensions ....................................................................... 24
Ordering Guide .......................................................................... 25
DD
LDAC
).......................................................... 18
from the Reference Voltage................................ 20
Serial Interface ................................................................................ 17

REVISION HISTORY

3/06—Rev. B to Rev. C
Changes to Table 3............................................................................ 5
Changes to Ordering Guide.......................................................... 25
10/05—Rev. A to Rev. B
Updated Format..................................................................Universal
Changes to Bipolar Operation Section ........................................ 21
Changes to Ordering Guide.......................................................... 25
Rev. C | Page 2 of 28
8/03—Rev. 0 to Rev. A
Added A Version ................................................................Universal
Changes to Features ..........................................................................1
Changes to Specifications.................................................................2
Changes to Absolute Maximum Ratings........................................6
Changes to Ordering Guide.............................................................6
Changes to TPC 21......................................................................... 12
Added Octals section to Table II.................................................. 20
Updated Outline Dimensions....................................................... 21
AD5307/AD5317/AD5327

SPECIFICATIONS

VDD = 2.5 V to 5.5 V, V
Table 1.
A Version Parameter
DC PERFORMANCE
DAC REFERENCE INPUTS
OUTPUT CHARACTERISTICS
2
3, 4
AD5307
Resolution 8 8 Bits Relative Accuracy ±0.15 ±1 ±0.15 ±0.625 LSB Differential Nonlinearity ±0.02 ±0.25 ±0.02 ±0.25 LSB Guaranteed monotonic by design
AD5317
Resolution 10 10 Bits Relative Accuracy ±0.5 ±4 ±0.5 ±2.5 LSB Differential Nonlinearity ±0.05 ±0.5 ±0.05 ±0.5 LSB Guaranteed monotonic by design
AD5327
Resolution 12 12 Bits Relative Accuracy ±2 ±16 ±2 ±10 LSB Differential Nonlinearity ±0.2 ±1 ±0.2 ±1 LSB Guaranteed monotonic by design
Offset Error ±5 ±60 ±5 ±60 mV VDD = 4.5 V, gain = 2; see Figure 29
Gain Error ±0.3 ±1.25 ±0.3 ±1.25 % FSR VDD = 4.5 V, gain = 2; see Figure 29
Lower Dead Band
Upper Dead Band 10 60 10 60 mV See Figure 30, upper dead band
Offset Error Drift
6
Gain Error Drift −5 −5 ppm of
DC Power Supply Rejection Ratio −60 −60 dB ∆VDD = ±10% DC Crosstalk 200 200 mV RL = 2 kΩ to GND or V
V
Input Range 1 V
REF
0.25 V V
Input Impedance (R
REF
74 90 74 90 Unbuffered reference mode,
37 45 37 45 Unbuffered reference mode,
Reference Feedthrough −90 −90 dB Frequency = 10 kHz Channel-to-Channel Isolation −75 −75 dB Frequency = 10 kHz
Minimum Output Voltage
Maximum Output Voltage V
DC Output Impedance 0.5 0.5 Ω Short-Circuit Current 25 25 mA VDD = 5 V 16 16 mA VDD = 3 V Power-Up Time 2.5 2.5 μs Coming out of power-down mode,
5 5 μs Coming out of power-down mode,
= 2 V, RL = 2 k to GND, CL = 200 pF to GND. All specifications T
REF
1
B Version
MIN
to T
, unless otherwise noted.
MAX
Min Typ Max Min Typ Max Unit Conditions/Comments
over all codes
over all codes
over all codes
Figure 30
and
Figure 30
5
10 60 10 60 mV See Figure 29, lower dead band
and
exists only if offset error is negative
exists only if V plus gain error is positive
−12 −12 ppm of FSR/°C
FSR/°C
DD
DD
) >10 >10 Buffered reference mode and
DAC
1 V
0.25 V
DD
DD
V Buffered reference mode V Unbuffered reference mode
power-down mode
0 V to V
0 V to 2 V
7
0.001 0.001 V A measure of the minimum drive
output range
REF
REF
capability of the output amplifier
DD
0.001
V
DD
0.001
V A measure of the maximum drive
capability of the output amplifier
V
= 5 V
DD
V
= 3 V
DD
= VDD and offset
REF
DD
output range
Rev. C | Page 3 of 28
AD5307/AD5317/AD5327
A Version Parameter
2
Min Typ Max Min Typ Max Unit Conditions/Comments
1
B Version
LOGIC INPUTS
Input Current ±1 ±1 mA Input Low Voltage, VIL 0.8 0.8 V VDD = 5 V ± 10%
0.6 0.6 V VDD = 3 V ± 10%
0.5 0.5 V VDD = 2.5 V Input High Voltage, VIH
(Excluding DCEN)
1.7 1.7 V VDD = 2.5 V to 5.5 V; TTL and
1.8 V CMOS compatible
Input High Voltage, VIH
2.4 2.4 VDD = 5 V ± 10%
(DCEN)
2.1 2.1 V VDD = 3 V ± 10%
2.0 2.0 V VDD = 2.5 V Pin Capacitance 3 3 pF
LOGIC OUTPUT (SDO)
VDD = 4.5 V to 5.5 V Output Low Voltage, VOL 0.4 0.4 V I Output High Voltage, VOH VDD − 1 VDD − 1 V I
= 2 mA
SINK
SOURCE
= 2 mA
VDD = 2.5 V to 3.6 V Output Low Voltage, VOL 0.4 0.4 V I Output High Voltage, VOH VDD −
0.5
V
DD
0.5
V I
= 2 mA
SINK
SOURCE
= 2 mA
Floating State Leakage Current ±1 ±1 μA DCEN = GND Floating State Output Capacitance 3 3 pF DCEN = GND
POWER REQUIREMENTS
VDD 2.5 5.5 2.5 5.5 V IDD (Normal Mode)8 V
VDD = 4.5 V to 5.5 V 500 900 500 900 μA
VDD = 2.5 V to 3.6 V 400 750 400 750 μA
= VDD and VIL = GND
IH
All DACs in unbuffered mode; in buffered mode, extra current is typically x mA per DAC, where x = 5 mA + V
REF/RDAC
IDD (Power-Down Mode) VIH = VDD and VIL = GND
VDD = 4.5 V to 5.5 V 0.3 1 0.3 1 μA
VDD = 2.5 V to 3.6 V 0.09 1 0.09 1 μA
1
Temperature range (A, B versions): −40°C to +105°C; typical at +25°C.
2
See the Terminology section.
3
DC specifications tested with the outputs unloaded, unless otherwise noted.
4
Linearity is tested using a reduced code range: AD5307 (Code 8 to Code 255); AD5317 (Code 28 to Code 1023); AD5327 (Code 115 to Code 4095).
5
This corresponds to x codes, where x = deadband voltage/LSB size.
6
Guaranteed by design and characterization; not production tested.
7
For the amplifier output to reach its minimum voltage, offset error must be negative. For the amplifier output to reach its maximum voltage, V
gain error must be positive.
8
Interface inactive. All DACs active. DAC outputs unloaded.
= VDD and offset plus
REF
Rev. C | Page 4 of 28
AD5307/AD5317/AD5327

AC CHARACTERISTICS

VDD = 2.5 V to 5.5 V, RL = 2 k to GND, CL = 200 pF to GND. All specifications T
Table 2.
A, B Versions Parameter
2, 3
Min Typ Max Unit Conditions/Comments
1
Output Voltage Settling Time V
AD5307 6 8 μs 1/4 scale to 3/4 scale change (0x40 to 0xC0) AD5317 7 9 μs 1/4 scale to 3/4 scale change (0x100 to 0x300)
AD5327 8 10 μs 1/4 scale to 3/4 scale change (0x400 to 0xC00) Slew Rate 0.7 V/μs Major-Code Change Glitch Energy 12 nV-s 1 LSB change around major carry Digital Feedthrough 0.5 nV-s SDO Feedthrough 4 nV-s Daisy-chain mode; SDO load is 10 pF Digital Crosstalk 0.5 nV-s Analog Crosstalk 1 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 200 kHz V Total Harmonic Distortion −70 dB V
1
Temperature range (A, B versions): −40°C to +105°C; typical at +25°C.
2
Guaranteed by design and characterization; not production tested.
3
See the Terminology section.
to T
MIN
= VDD = 5 V
REF
= 2 V ± 0.1 V p-p; unbuffered mode
REF
= 2.5 V ± 0.1 V p-p; frequency = 10 kHz
REF
, unless otherwise noted.
MAX

TIMING CHARACTERISTICS

VDD = 2.5 V to 5.5 V; all specifications T
Table 3.
A, B Versions Parameter
3
1, , 2
Limit at T
MIN
, T
MAX
t1 33 ns min SCLK cycle time t2 13 ns min SCLK high time t3 13 ns min SCLK low time t4 13 ns min t5 5 ns min Data set-up time t6 4.5 ns min Data hold time t7 5 ns min t8 50 ns min t9 20 ns min t10 20 ns min t11 20 ns min t12 0 ns min
4, 5
t
13
20 ns max SCLK rising edge to SDO valid (VDD = 3.6 V to 5.5 V) 25 ns max SCLK rising edge to SDO valid (VDD = 2.5 V to 3.5 V) t
14
t
15
t
16
1
Guaranteed by design and characterization; not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 3 and Figure 4.
4
This is measured with the load circuit of Figure 2. t13 determines maximum SCLK frequency in daisy-chain mode.
5
Daisy-chain mode only.
5 ns min
8 ns min
0 ns min
MIN
to T
, unless otherwise noted.
MAX
Unit Conditions/Comments
SYNC to SCLK falling edge set-up time
SCLK falling edge to Minimum
SYNC high time
SYNC rising edge
LDAC pulse width SCLK falling edge to
LDAC rising edge CLR pulse width SCLK falling edge to
SCLK falling edge to
LDAC falling edge
SYNC rising edge SYNC rising edge to SCLK rising edge SYNC rising edge to LDAC falling edge
Rev. C | Page 5 of 28
AD5307/AD5317/AD5327
2mA I
OL
SCLK
t
t
8
SYNC
DIN
1
LDAC
2
LDAC
CLR
NOTES
1
ASYNCHRONOUS LDAC UPDATE MODE.
2
SYNCHRONOUS LDAC UPDATE MODE.
DB15
TO OUTPUT
PIN
50pF
C
L
2mA I
OH
V
OH (MIN)
02067-002
Figure 2. Load Circuit for Digital Output (SDO) Timing Specifications
t
1
t
4
t
5
t
3
t
6
2
DB0
t
7
t
9
t
12
t
10
Figure 3. Serial Interface Timing Diagram
t
11
02067-003
t
1
SCLK
t
14
t
15
t
16
DB0
t
9
02067-004
SYNC
LDAC
DIN
SDO
t
t
t
8
4
t
DB15
INPUT WORD FOR DAC N INPUT WORD FOR DAC (N+1)
t
3
t
6
5
UNDEFINED INPUT WORD FOR DAC N
2
DB0 DB15' DB0'
t
13
DB15
Figure 4. Daisy-Chaining Timing Diagram
Rev. C | Page 6 of 28
AD5307/AD5317/AD5327

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to GND −0.3 V to +7 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Output Voltage to GND −0.3 V to VDD + 0.3 V Reference Input Voltage to GND −0.3 V to VDD + 0.3 V V
OUT
Operating Temperature Range
Industrial (A, B Versions) −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) 150°C 16-Lead TSSOP
Power Dissipation (TJ max − TA)/θ
θJA Thermal Impedance 150.4°C/W Reflow Soldering
Peak Temperature 220°C
Time at Peak Temperature 10 sec to 40 sec
1
Transient currents of up to 100 mA do not cause SCR latch-up.
1
A − V
D to GND −0.3 V to VDD + 0.3 V
OUT
Ratings
JA
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 7 of 28
AD5307/AD5317/AD5327

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

V
V
LDAC
V
OUT
V
OUT
V
OUT
REF
REF
CLR
V
DD
AB
CD
1
2
3
4
A
5
B
6
C
7
8
AD5307/ AD5317/
AD5327
TOP VIEW
(Not to Scale)
16
SDO
SYNC
15
SCLK
14
13
DIN
12
GND
11
V
D
OUT
10
PD
DCEN
9
02067-005
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic Description
1
CLR
2
LDAC Active Low Control Input. Transfers the contents of the input registers to their respective DAC registers. Pulsing this
Active Low Control Input. Loads all 0s to all input and DAC registers. Therefore, the outputs also go to 0 V.
pin low allows any or all DAC registers to be updated if the input registers have new data. This allows simultaneous update of all DAC outputs. Alternatively, this pin can be tied permanently low.
3 VDD
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be decoupled with a 10 μF
capacitor in parallel with a 0.1 μF capacitor to GND. 4 V 5 V 6 V 7 V
A Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
B Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
C Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
REF
AB
Reference Input Pin for DAC A and DAC B. It can be configured as a buffered or unbuffered input to each or both of
the DACs, depending on the state of the BUF bits in the serial input words to DAC A and DAC B. It has an input range
in unbuffered mode and 1 V to VDD in buffered mode.
DD
8 V
REF
CD
of 0.25 V to V
Reference Input Pin for DAC C and DAC D. It can be configured as a buffered or unbuffered input to each or both of
the DACs, depending on the state of the BUF bits in the serial input words to DAC C and DAC D. It has an input range
in unbuffered mode and 1 V to VDD in buffered mode.
DD
9 DCEN
of 0.25 V to V
Enables the Daisy-Chaining Option. It should be tied high if the part is being used in a daisy chain, and tied low if it is
being used in standalone mode. 10
PD Active Low Control Input. It acts like a hardware power-down option. All DACs go into power-down mode when this
pin is tied low. The DAC outputs go into a high impedance state, and the current consumption of the part drops to
300 nA @ 5 V (90 nA @ 3 V). 11 V
D Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
12 GND Ground Reference Point for All Circuitry on the Part. 13 DIN
Serial Data Input. These devices each have a 16-bit shift register. Data is clocked into the register on the falling edge of
the serial clock input. The DIN input buffer is powered down after each write cycle. 14 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be
transferred at rates of up to 30 MHz. The SCLK input buffer is powered down after each write cycle. 15
SYNC Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers
on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the
following 16 clocks. If SYNC is taken high before the 16th falling edge, the rising edge of SYNC acts as an interrupt and
the write sequence is ignored by the device. 16 SDO
Serial Data Output. Can be used for daisy-chaining a number of these devices together or for reading back the data in
the shift register for diagnostic purposes. The serial data is transferred on the rising edge of SCLK and is valid on the
falling edge of the clock.
Rev. C | Page 8 of 28
AD5307/AD5317/AD5327

TYPICAL PERFORMANCE CHARACTERISTICS

1.0
0.5
TA = 25°C V
= 5V
DD
0.3
0.2
0.1
TA = 25°C V
= 5V
DD
0
INL ERROR (LSB)
–0.5
–1.0
0 50 100 150 200
CODE
Figure 6. AD5307 INL
3
2
1
0
INL ERROR (LSB)
–1
–2
TA = 25°C V
= 5V
DD
250
02067-006
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
0 50 100 150 200
CODE
Figure 9. AD5307 DNL
0.6
TA = 25°C V
= 5V
0.4
0.2
–0.2
DNL ERROR (LSB)
–0.4
DD
0
02067-009
250
–3
0 200 400 600 900
CODE
Figure 7. AD5317 INL
12
TA = 25°C V
= 5V
DD
8
4
0
INL ERROR (LSB)
–4
–8
–12
0 1000 2000 3000
CODE
Figure 8. AD5327 INL
02067-007
1000
02067-008
4000
Rev. C | Page 9 of 28
–0.6
0 200 400 600 800
CODE
Figure 10. AD5317 DNL
1.0
TA = 25°C
= 5V
V
DD
0.5
0
DNL ERROR (LSB)
–0.5
–1.0
0 1000 2000 3000
CODE
Figure 11. AD5327 DNL
02067-010
1000
02067-011
4000
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