2.5 V to 5.5 V power supply
Guaranteed monotonic by design over all codes
Power down to 90 nA @ 3 V, 300 nA @ 5 V (
Double-buffered input logic
Buffered/unbuffered reference input options
Output range: 0 V to V
or 0 V to 2 V
REF
Power-on reset to 0 V
CLR
LDAC
pin)
Simultaneous update of outputs (
Asynchronous clear facility (
Low power, SPI®-, QSPI™-, MICROWIRE™-, and DSP-
compatible 3-wire serial interface
SDO daisy-chaining option
On-chip rail-to-rail output buffer amplifiers
Temperature range of −40°C to +105°C
APPLICATIONS
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
Industrial process control
LDAC
pin)
REF
pin)
FUNCTIONAL BLOCK DIAGRAM
AD5307/AD5317/AD5327
LDAC
8-/10-/12-Bit DACs in 16-Lead TSSOP
AD5307/AD5317/AD5327
GENERAL DESCRIPTION
The AD5307/AD5317/AD53271 are quad 8-,10-,12-bit buffered
voltage-output DACs in 16-lead TSSOP that operate from single
2.5 V to 5.5 V supplies and consume 400 A at 3 V. Their onchip output amplifiers allow the outputs to swing rail-to-rail with
a slew rate of 0.7 V/s. The AD5307/AD5317/AD5327 utilize
versatile 3-wire serial interfaces that operate at clock rates up to
30 MHz; these parts are compatible with standard SPI, QSPI,
MICROWIRE, and DSP interface standards.
The references for the four DACs are derived from two reference
pins (one per DAC pair). These reference inputs can be configured
as buffered or unbuffered inputs. Each part incorporates a poweron reset circuit, ensuring that the DAC outputs power up to 0 V
and remain there until a valid write to the device takes place.
CLR
LDAC
input. Each part
pin that clears all
INPUT
REGISTER
V
DD
There is also an asynchronous active low
DACs to 0 V. The outputs of all DACs can be updated simultaneously using the asynchronous
contains a power-down feature that reduces the current
consumption of the device to 300 nA @ 5 V (90 nA @ 3 V). The
parts can also be used in daisy-chaining applications using the
SDO pin.
All three parts are offered in the same pinout, allowing users to
select the amount of resolution appropriate for their application
without redesigning their circuit board.
V
AB
REF
GAIN-SELECT
LOGIC
DAC
REGISTER
STRING
DAC A
BUFFER
V
A
OUT
SCLK
SYNC
DIN
SDO
1
Protected by U.S. Patent No. 5,969,657; other patents pending.
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Offset Error ±5 ±60 ±5 ±60 mV VDD = 4.5 V, gain = 2; see Figure 29
Gain Error ±0.3 ±1.25 ±0.3 ±1.25 % FSR VDD = 4.5 V, gain = 2; see Figure 29
Lower Dead Band
Upper Dead Band 10 60 10 60 mV See Figure 30, upper dead band
Offset Error Drift
6
Gain Error Drift −5 −5 ppm of
DC Power Supply Rejection Ratio −60 −60 dB ∆VDD = ±10%
DC Crosstalk 200 200 mV RL = 2 kΩ to GND or V
V
Input Range 1 V
REF
0.25 V
V
Input Impedance (R
REF
74 90 74 90 kΩ Unbuffered reference mode,
37 45 37 45 kΩ Unbuffered reference mode,
Reference Feedthrough −90 −90 dB Frequency = 10 kHz
Channel-to-Channel Isolation −75 −75 dB Frequency = 10 kHz
Minimum Output Voltage
Maximum Output Voltage V
DC Output Impedance 0.5 0.5 Ω
Short-Circuit Current 25 25 mA VDD = 5 V
16 16 mA VDD = 3 V
Power-Up Time 2.5 2.5 μs Coming out of power-down mode,
5 5 μs Coming out of power-down mode,
= 2 V, RL = 2 k to GND, CL = 200 pF to GND. All specifications T
REF
1
B Version
MIN
to T
, unless otherwise noted.
MAX
Min Typ Max Min Typ Max Unit Conditions/Comments
over all codes
over all codes
over all codes
Figure 30
and
Figure 30
5
10 60 10 60 mV See Figure 29, lower dead band
and
exists only if offset error is negative
exists only if V
plus gain error is positive
−12 −12 ppm of
FSR/°C
FSR/°C
DD
DD
) >10 >10 MΩ Buffered reference mode and
DAC
1 V
0.25 V
DD
DD
V Buffered reference mode
V Unbuffered reference mode
power-down mode
0 V to V
0 V to 2 V
7
0.001 0.001 V A measure of the minimum drive
output range
REF
REF
capability of the output amplifier
−
DD
0.001
V
−
DD
0.001
V A measure of the maximum drive
capability of the output amplifier
V
= 5 V
DD
V
= 3 V
DD
= VDD and offset
REF
DD
output range
Rev. C | Page 3 of 28
AD5307/AD5317/AD5327
A Version
Parameter
2
Min Typ Max Min Typ Max Unit Conditions/Comments
1
B Version
LOGIC INPUTS
Input Current ±1 ±1 mA
Input Low Voltage, VIL 0.8 0.8 V VDD = 5 V ± 10%
0.6 0.6 V VDD = 3 V ± 10%
0.5 0.5 V VDD = 2.5 V
Input High Voltage, VIH
(Excluding DCEN)
1.7 1.7 V VDD = 2.5 V to 5.5 V; TTL and
1.8 V CMOS compatible
Input High Voltage, VIH
2.4 2.4 VDD = 5 V ± 10%
(DCEN)
2.1 2.1 V VDD = 3 V ± 10%
2.0 2.0 V VDD = 2.5 V
Pin Capacitance 3 3 pF
LOGIC OUTPUT (SDO)
VDD = 4.5 V to 5.5 V
Output Low Voltage, VOL 0.4 0.4 V I
Output High Voltage, VOH VDD − 1 VDD − 1 V I
= 2 mA
SINK
SOURCE
= 2 mA
VDD = 2.5 V to 3.6 V
Output Low Voltage, VOL 0.4 0.4 V I
Output High Voltage, VOH VDD −
0.5
V
−
DD
0.5
V I
= 2 mA
SINK
SOURCE
= 2 mA
Floating State Leakage Current ±1 ±1 μA DCEN = GND
Floating State Output Capacitance 3 3 pF DCEN = GND
POWER REQUIREMENTS
VDD 2.5 5.5 2.5 5.5 V
IDD (Normal Mode)8 V
VDD = 4.5 V to 5.5 V 500 900 500 900 μA
VDD = 2.5 V to 3.6 V 400 750 400 750 μA
= VDD and VIL = GND
IH
All DACs in unbuffered mode; in
buffered mode, extra current is
typically x mA per DAC, where
x = 5 mA + V
REF/RDAC
IDD (Power-Down Mode) VIH = VDD and VIL = GND
VDD = 4.5 V to 5.5 V 0.3 1 0.3 1 μA
VDD = 2.5 V to 3.6 V 0.09 1 0.09 1 μA
1
Temperature range (A, B versions): −40°C to +105°C; typical at +25°C.
2
See the Terminology section.
3
DC specifications tested with the outputs unloaded, unless otherwise noted.
4
Linearity is tested using a reduced code range: AD5307 (Code 8 to Code 255); AD5317 (Code 28 to Code 1023); AD5327 (Code 115 to Code 4095).
5
This corresponds to x codes, where x = deadband voltage/LSB size.
6
Guaranteed by design and characterization; not production tested.
7
For the amplifier output to reach its minimum voltage, offset error must be negative. For the amplifier output to reach its maximum voltage, V
gain error must be positive.
8
Interface inactive. All DACs active. DAC outputs unloaded.
= VDD and offset plus
REF
Rev. C | Page 4 of 28
AD5307/AD5317/AD5327
AC CHARACTERISTICS
VDD = 2.5 V to 5.5 V, RL = 2 k to GND, CL = 200 pF to GND. All specifications T
Table 2.
A, B Versions
Parameter
2, 3
Min Typ Max Unit Conditions/Comments
1
Output Voltage Settling Time V
AD5307 6 8 μs 1/4 scale to 3/4 scale change (0x40 to 0xC0)
AD5317 7 9 μs 1/4 scale to 3/4 scale change (0x100 to 0x300)
AD5327 8 10 μs 1/4 scale to 3/4 scale change (0x400 to 0xC00)
Slew Rate 0.7 V/μs
Major-Code Change Glitch Energy 12 nV-s 1 LSB change around major carry
Digital Feedthrough 0.5 nV-s
SDO Feedthrough 4 nV-s Daisy-chain mode; SDO load is 10 pF
Digital Crosstalk 0.5 nV-s
Analog Crosstalk 1 nV-s
DAC-to-DAC Crosstalk 3 nV-s
Multiplying Bandwidth 200 kHz V
Total Harmonic Distortion −70 dB V
1
Temperature range (A, B versions): −40°C to +105°C; typical at +25°C.
2
Guaranteed by design and characterization; not production tested.
3
See the Terminology section.
to T
MIN
= VDD = 5 V
REF
= 2 V ± 0.1 V p-p; unbuffered mode
REF
= 2.5 V ± 0.1 V p-p; frequency = 10 kHz
REF
, unless otherwise noted.
MAX
TIMING CHARACTERISTICS
VDD = 2.5 V to 5.5 V; all specifications T
Table 3.
A, B Versions
Parameter
3
1, , 2
Limit at T
MIN
, T
MAX
t1 33 ns min SCLK cycle time
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 5 ns min Data set-up time
t6 4.5 ns min Data hold time
t7 5 ns min
t8 50 ns min
t9 20 ns min
t10 20 ns min
t11 20 ns min
t12 0 ns min
4, 5
t
13
20 ns max SCLK rising edge to SDO valid (VDD = 3.6 V to 5.5 V)
25 ns max SCLK rising edge to SDO valid (VDD = 2.5 V to 3.5 V)
t
14
t
15
t
16
1
Guaranteed by design and characterization; not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 3 and Figure 4.
4
This is measured with the load circuit of Figure 2. t13 determines maximum SCLK frequency in daisy-chain mode.
5
Daisy-chain mode only.
5 ns min
8 ns min
0 ns min
MIN
to T
, unless otherwise noted.
MAX
Unit Conditions/Comments
SYNC to SCLK falling edge set-up time
SCLK falling edge to
Minimum
SYNC high time
SYNC rising edge
LDAC pulse width
SCLK falling edge to
LDAC rising edge
CLR pulse width
SCLK falling edge to
SCLK falling edge to
LDAC falling edge
SYNC rising edge
SYNC rising edge to SCLK rising edge
SYNC rising edge to LDAC falling edge
Rev. C | Page 5 of 28
AD5307/AD5317/AD5327
2mAI
OL
SCLK
t
t
8
SYNC
DIN
1
LDAC
2
LDAC
CLR
NOTES
1
ASYNCHRONOUS LDAC UPDATE MODE.
2
SYNCHRONOUS LDAC UPDATE MODE.
DB15
TO OUTPUT
PIN
50pF
C
L
2mAI
OH
V
OH (MIN)
02067-002
Figure 2. Load Circuit for Digital Output (SDO) Timing Specifications
t
1
t
4
t
5
t
3
t
6
2
DB0
t
7
t
9
t
12
t
10
Figure 3. Serial Interface Timing Diagram
t
11
02067-003
t
1
SCLK
t
14
t
15
t
16
DB0
t
9
02067-004
SYNC
LDAC
DIN
SDO
t
t
t
8
4
t
DB15
INPUT WORD FOR DAC NINPUT WORD FOR DAC (N+1)
t
3
t
6
5
UNDEFINEDINPUT WORD FOR DAC N
2
DB0 DB15'DB0'
t
13
DB15
Figure 4. Daisy-Chaining Timing Diagram
Rev. C | Page 6 of 28
AD5307/AD5317/AD5327
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
Reference Input Voltage to GND −0.3 V to VDD + 0.3 V
V
OUT
Operating Temperature Range
Industrial (A, B Versions) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 150°C
16-Lead TSSOP
Power Dissipation (TJ max − TA)/θ
θJA Thermal Impedance 150.4°C/W
Reflow Soldering
Peak Temperature 220°C
Time at Peak Temperature 10 sec to 40 sec
1
Transient currents of up to 100 mA do not cause SCR latch-up.
1
A − V
D to GND −0.3 V to VDD + 0.3 V
OUT
Ratings
JA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 7 of 28
AD5307/AD5317/AD5327
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
V
V
LDAC
V
OUT
V
OUT
V
OUT
REF
REF
CLR
V
DD
AB
CD
1
2
3
4
A
5
B
6
C
7
8
AD5307/
AD5317/
AD5327
TOP VIEW
(Not to Scale)
16
SDO
SYNC
15
SCLK
14
13
DIN
12
GND
11
V
D
OUT
10
PD
DCEN
9
02067-005
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin
No.
Mnemonic Description
1
CLR
2
LDAC Active Low Control Input. Transfers the contents of the input registers to their respective DAC registers. Pulsing this
Active Low Control Input. Loads all 0s to all input and DAC registers. Therefore, the outputs also go to 0 V.
pin low allows any or all DAC registers to be updated if the input registers have new data. This allows simultaneous
update of all DAC outputs. Alternatively, this pin can be tied permanently low.
3 VDD
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be decoupled with a 10 μF
capacitor in parallel with a 0.1 μF capacitor to GND.
4 V
5 V
6 V
7 V
A Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
B Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
C Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
REF
AB
Reference Input Pin for DAC A and DAC B. It can be configured as a buffered or unbuffered input to each or both of
the DACs, depending on the state of the BUF bits in the serial input words to DAC A and DAC B. It has an input range
in unbuffered mode and 1 V to VDD in buffered mode.
DD
8 V
REF
CD
of 0.25 V to V
Reference Input Pin for DAC C and DAC D. It can be configured as a buffered or unbuffered input to each or both of
the DACs, depending on the state of the BUF bits in the serial input words to DAC C and DAC D. It has an input range
in unbuffered mode and 1 V to VDD in buffered mode.
DD
9 DCEN
of 0.25 V to V
Enables the Daisy-Chaining Option. It should be tied high if the part is being used in a daisy chain, and tied low if it is
being used in standalone mode.
10
PD Active Low Control Input. It acts like a hardware power-down option. All DACs go into power-down mode when this
pin is tied low. The DAC outputs go into a high impedance state, and the current consumption of the part drops to
300 nA @ 5 V (90 nA @ 3 V).
11 V
D Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
12 GND Ground Reference Point for All Circuitry on the Part.
13 DIN
Serial Data Input. These devices each have a 16-bit shift register. Data is clocked into the register on the falling edge of
the serial clock input. The DIN input buffer is powered down after each write cycle.
14 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be
transferred at rates of up to 30 MHz. The SCLK input buffer is powered down after each write cycle.
15
SYNC Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers
on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the
following 16 clocks. If SYNC is taken high before the 16th falling edge, the rising edge of SYNC acts as an interrupt and
the write sequence is ignored by the device.
16 SDO
Serial Data Output. Can be used for daisy-chaining a number of these devices together or for reading back the data in
the shift register for diagnostic purposes. The serial data is transferred on the rising edge of SCLK and is valid on the
falling edge of the clock.
Rev. C | Page 8 of 28
AD5307/AD5317/AD5327
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
0.5
TA = 25°C
V
= 5V
DD
0.3
0.2
0.1
TA = 25°C
V
= 5V
DD
0
INL ERROR (LSB)
–0.5
–1.0
050100150200
CODE
Figure 6. AD5307 INL
3
2
1
0
INL ERROR (LSB)
–1
–2
TA = 25°C
V
= 5V
DD
250
02067-006
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
050100150200
CODE
Figure 9. AD5307 DNL
0.6
TA = 25°C
V
= 5V
0.4
0.2
–0.2
DNL ERROR (LSB)
–0.4
DD
0
02067-009
250
–3
0200400600900
CODE
Figure 7. AD5317 INL
12
TA = 25°C
V
= 5V
DD
8
4
0
INL ERROR (LSB)
–4
–8
–12
0100020003000
CODE
Figure 8. AD5327 INL
02067-007
1000
02067-008
4000
Rev. C | Page 9 of 28
–0.6
0200400600800
CODE
Figure 10. AD5317 DNL
1.0
TA = 25°C
= 5V
V
DD
0.5
0
DNL ERROR (LSB)
–0.5
–1.0
0100020003000
CODE
Figure 11. AD5327 DNL
02067-010
1000
02067-011
4000
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