ANALOG DEVICES AD5235-EP Service Manual

Nonvolatile Memory, Dual
1024-Position Digital Potentiometer
Enhanced Product

FEATURES

Dual-channel, 1024-position resolution 25 kΩ nominal resistance Low temperature coefficient: 35 ppm/°C Nonvolatile memory stores wiper settings Permanent memory write protection Wiper setting readback Resistance tolerance stored in EEMEM Predefined linear increment/decrement instructions Predefined ±6 dB/step log taper increment/decrement
instructions
SPI-compatible serial interface
2.7 V to 5 V single supply or ±2.5 V dual supply 26 bytes extra nonvolatile memory for user-defined
information 100-year typical data retention, T Power-on refreshed with EEMEM settings Enhanced Features
Supports defense and aerospace applications (AQEC)
Temperature range: −40°C to +125°C
Controlled manufacturing baseline
1 assembly/test site
1 fabrication site
Enhanced product change notification
Qualification data available on request

APPLICATIONS

DWDM laser diode driver, optical supervisory systems Mechanical potentiometer replacement Instrumentation: gain, offset adjustment Programmable voltage-to-current conversion Programmable filters, delays, time constants Programmable power supply Low resolution DAC replacement Sensor calibration

GENERAL DESCRIPTION

The AD5235-EP is a dual-channel, nonvolatile memory,1 digitally controlled potentiometer The device performs the same electronic adjustment function as a mechanical potentiometer with enhanced resolution, solid state reliability, and superior low temperature coefficient performance. The AD5235-EP’s versatile programming via an SPI®-compatible serial interface allows 16 modes of operation and adjustment including scratchpad programming, memory storing and restoring, increment/decrement, ±6 dB/step log taper adjustment, wiper setting readback, and extra EEMEM memory data for other components, look-up tables, or system identification information.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
1
= 55°C
A
2
with 1024-step resolution.
for user-defined information such as
AD5235-EP

FUNCTIONAL BLOCK DIAGRAM

ADDR
CS
CLK
SDI
SDO
PR
WP
RDY
*RAB TOLERANCE
DECODE
SERIAL
INTERFACE
POWER-ON
RESET
EEMEM
CONTROL
RTOL*
RDAC1
REGISTER
EEMEM1
RDAC2
REGISTER
EEMEM2
26 BYTES
USER EEMEM
Figure 1.
In scratchpad programming mode, a specific setting can be programmed directly to the RDAC between Terminal W and Terminal A, and Terminal W and Terminal B. This setting can be stored into the EEMEM and is restored automatically to the RDAC register during system power-on.
The EEMEM content can be restored dynamically or through external
PR
strobing, and a WP function protects EEMEM contents. To simplify the programming, the independent or simultaneous linear-step increment or decrement commands can be used to move the RDAC wiper up or down, one step at a time. For logarithmic ±6 dB changes in the wiper setting, the left or right bit shift command can be used to double or halve the RDAC wiper setting.
The AD5235-EP patterned resistance tolerance is stored in the EEMEM. Therefore, in readback mode, the host processor can know the actual end-to-end resistance. The host can execute the appropriate resistance step through a software routine that simplifies open-loop applications as well as precision calibration and tolerance matching applications.
The AD5235-EP is available in a thin, 16-lead TSSOP package. The part is guaranteed to operate over the extended industrial temperature range of −40°C to +125°C.
Full details about this enhanced product, including theory of operation, register details, and applications information, are available in the AD5235 data sheet, which should be consulted in conjunction with this data sheet.
1
The terms nonvolatile memory and EEMEM are used interchangeably.
2
The terms digital potentiometer and RDAC are used interchangeably.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010–2012 Analog Devices, Inc. All rights reserved.
AD5235-EP
RDAC1
RDAC2
2
register that sets the resistance
V
DD
A1
W1
B1
A2 W2
B2
V
SS
GND
09185-001
AD5235-EP Enhanced Product
TABLE OF CONTENTS
Features .............................................................................................. 1
Applicat ions ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Characteristics ............................................................. 3
Interface Timing and EEMEM Reliability Characteristics ..... 5

REVISION HISTORY

7/12—Rev. 0 to Rev. A
Change to Features Section .............................................................. 1
Changes to Electrical Characteristics Section and Table 1 .......... 3
Changes to Interface Timing and EEMEM Reliability
Characteristics Section and Table 2 ................................................ 5
Changes to Typical Performance Characteristics Section ............ 9
Added Figure 14 and Figure 16, Renumbered Sequentially ...... 10
Deleted Figure 21 ............................................................................. 11
Added Figure 23 ............................................................................... 12
7/10—Revision 0: Initial Version
Absolute Maximum Ratings ............................................................7
ESD Caution...................................................................................7
Pin Configuration and Function Descriptions ..............................8
Typical Performance Characteristics ..............................................9
Test Circuits ..................................................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 14
Rev. A | Page 2 of 16
Enhanced Product AD5235-EP

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

VDD = 2.7 V to 5.5 V, VSS = 0 V; VDD = 2.5 V, VSS = −2.5 V, VA = VDD, VB = VSS, −40°C < TA < +125°C, unless otherwise noted.
Table 1.
Parameter Symbol Conditions Min Typ1 Max Unit
DC CHARACTERISTICS—RHEOSTAT MODE
(All RDACs) Resistor Differential Nonlinearity2 R-DNL RWB −1 +1 LSB Resistor Integral Nonlinearity2 R-INL RWB −2 +2 LSB Nominal Resistor Tolerance ∆RAB/RAB Code = full scale −8 +8 % Resistance Temperature Coefficient (∆RAB/RAB)/∆T × 106 35 ppm/°C Wiper Resistance RW
Nominal Resistance Match R
DC CHARACTERISTICS—POTENTIOMETER
DIVIDER MODE (All RDACs) Resolution N 10 Bits Differential Nonlinearity3 DNL −1 +1 LSB Integral Nonlinearity3 INL −1 +1 LSB Voltage Divider Temperature Coefficient (∆VW/VW)/∆T × 106 Code = half scale 15 ppm/°C Full-Scale Error V Zero-Scale Error V
RESISTOR TERMINALS
Terminal Voltage Range4 V Capacitance Ax, Bx5 C
Capacitance Wx5 C
Common-Mode Leakage Current
5, 6
DIGITAL INPUTS AND OUTPUTS
Input Logic High VIH With respect to GND, VDD = 5 V 2.4 V Input Logic Low VIL With respect to GND, VDD = 5 V 0.8 V Input Logic High VIH With respect to GND, VDD = 3 V 2.1 V Input Logic Low VIL With respect to GND, VDD = 3 V 0.6 V Input Logic High VIH
Input Logic Low VIL
Output Logic High (SDO, RDY) VOH R Output Logic Low VOL I Input Current IIL V Input Capacitance5 C
= 1 V/RWB, VDD = 5 V, code =
I
W
30 65 Ω
half scale
= 1 V/RWB, VDD = 3 V, code =
I
W
50 Ω
half scale
Code = full scale, TA = 25°C ±0.1 %
AB1/RAB2
Code = full scale −7 0 LSB
WFSE
Code = zero scale 0 5 LSB
WZSE
, VB, VW V
A
A
, CB
f = 1 MHz, measured to GND,
VDD V
SS
11 pF
code = half-scale
W
f = 1 MHz, measured to GND,
80 pF
code = half-scale
ICM V
5 pF
IL
= VDD/2 0.01 ±1 μA
W
With respect to GND, V
= −2.5 V
V
SS
With respect to GND, V
= −2.5 V
V
SS
= 2.2 kΩ to 5 V 4.9 V
PULL-UP
= 1.6 mA, V
OL
= 0 V or VDD ±2.25 μA
IN
LOGI C
= +2.5 V,
DD
= +2.5 V,
DD
= 5 V 0.4 V
2.0 V
0.5 V
Rev. A | Page 3 of 16
AD5235-EP Enhanced Product
Parameter Symbol Conditions Min Typ1 Max Unit
POWER SUPPLIES
Single-Supply Power Range VDD V Dual-Supply Power Range VDD/VSS ±2.25 ±2.75 V Positive Supply Current IDD V Negative Supply Current ISS
EEMEM Store Mode Current IDD (store)
I EEMEM Restore Mode Current7 I
I Power Dissipation8 P Power Supply Sensitivity5 P
DYNAMIC CHARACTERISTICS
5, 9
(store) VDD = +2.5 V, VSS = −2.5 V −2 mA
SS
(restore)
DD
(restore) VDD = +2.5 V, VSS = −2.5 V −320 μA
SS
V
DISS
ΔVDD = 5 V ± 10% 0.006 0.01 %/%
SS
Bandwidth BW −3 dB, VDD/VSS = ±2.5 V 125 kHz Total Harmonic Distortion THDW V VW Settling Time tS
Resistor Noise Density e
T
N_WB
Crosstalk (CW1/CW2) CT
Analog Crosstalk CTA
1
Typicals represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper
positions. R-DNL measures the relative step change from ideal between successive tap positions. IW ~ 50 μA for VDD = 2.7 V and IW ~ 400 μA for VDD = 5 V (see Figure 25).
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output DAC. VA = VDD and VB = VSS. DNL specification limits of
±1 LSB maximum are guaranteed monotonic operating conditions (see Figure 26).
4
Resistor Terminal A, Resistor Terminal B, and Resistor Terminal W have no limitations on polarity with respect to each other. Dual-supply operation enables ground-
referenced bipolar signal adjustment.
5
Guaranteed by design and not subject to production test.
6
Common-mode leakage current is a measure of the dc leakage from any Terminal A, Terminal B, or Terminal W to a common-mode bias level of VDD/2.
7
EEMEM restore mode current is not continuous. Current is consumed while EEMEM locations are read and transferred to the RDAC register (see Figure 22). To
minimize power dissipation, a NOP, Instruction 0 (0x0) should be issued immediately after Instruction 1 (0x1).
8
P
is calculated from (IDD × VDD) + (ISS × VSS).
DISS
9
All dynamic characteristics use VDD = +2.5 V and VSS = −2.5 V.
= 0 V 2.7 5.5 V
SS
= VDD or VIL = GND 2 7 μA
IH
= VDD or VIL = GND, VDD = +2.5 V,
V
IH
= −2.5 V
V
SS
= VDD or VIL = GND, VSS = GND,
V
IH
I
≈ 0
SS
= VDD or VIL = GND, VSS = GND,
V
IH
≈ 0
I
SS
= VDD or VIL = GND 10 40 μW
IH
= 1 V rms, VB = 0 V, f = 1 kHz 0.009 %
A
= VDD, VB = 0 V,
V
A
= 0.50% error band,
V
W
−6 −2 μA
2 mA
320 μA
4 μs
Code 0x000 to Code 0x200
= 25°C 20
A
= VDD, VB = 0 V, measured VW1
V
A
making full-scale change
with V
W2
= VA1 = +2.5 V,
V
DD
V
= VB1 = −2.5 V, measured
SS
with VW2 = 5 V p-p @ f = 1 kHz,
V
W1
30
−110
Code 1 = 0x200, Code 2 = 0x3FF
nV/√Hz nV-s
dB
Rev. A | Page 4 of 16
Enhanced Product AD5235-EP

INTERFACE TIMING AND EEMEM RELIABILITY CHARACTERISTICS

Guaranteed by design and not subject to production test. See the Timing Diagrams section for the location of measured values. All input control voltages are specified with t measured using both V
= 2.7 V and VDD = 5 V.
DD
Table 2.
Parameter Symbol Conditions Min Typ1 Max Unit
Clock Cycle Time (t
) t1 20 ns
CYC
CS Setup Time CLK Shutdown Time to CS Rise Input Clock Pulse Width t4, t5 Clock level high or low 10 ns
Data Setup Time t6 From positive CLK transition 5 ns Data Hold Time t7 From positive CLK transition 5 ns CS to SDO-SPI Line Acquire
CS to SDO-SPI Line Release CLK to SDO Propagation Delay2 t CLK to SDO Data Hold Time t11 R CS High Pulse Width3 CS High to CS High3 RDY Rise to CS Fall CS Rise to RDY Fall Time Store EEMEM Time
4, 5
Read EEMEM Time4 t CS Rise to Clock Rise/Fall Setup Preset Pulse Width (Asynchronous)6 t Preset Response Time to Wiper Setting6 t Power-On EEMEM Restore Time6 t FLASH/EE MEMORY RELIABILITY
Endurance7 T 100 Data Retention8 100
1
Typicals represent average readings at 25°C and VDD = 5 V.
2
Propagation delay depends on the value of VDD, R
3
Valid for commands that do not activate the RDY pin.
4
The RDY pin is low only for Instruction 2, Instruction 3, Instruction 8, Instruction 9, Instruction 10, and the PR hardware pulse: CMD_8 ~ 20 μs; CMD_9, CMD_10 ~ 7 μs;
CMD_2, CMD_3 ~ 15 ms; PR hardware pulse ~ 30 μs.
5
Store EEMEM time depends on the temperature and EEMEM writes cycles. Higher timing is expected at a lower temperature and higher write cycles.
6
Not shown in Figure 2 and Figure 3.
7
Endurance is qualified to 100,000 cycles per JEDEC Standard 22, Method A117 and measured at −40°C, +25°C, and +125°C.
8
Retention lifetime equivalent at junction temperature (TJ) = 85°C per JEDEC Standard 22, Method A117. Retention lifetime based on an activation energy of 1 eV
derates with junction temperature in the Flash/EE memory.
= tF = 2.5 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Switching characteristics are
R
t
10 ns
2
t
1 t
3
t
40 ns
8
t
50 ns
9
R
10
t
12
t
4 t
13
t
0 ns
14
t
0.15 0.3 ms
15
= 2.2 kΩ, CL < 20 pF 50 ns
P
= 2.2 kΩ, CL < 20 pF 0 ns
P
10 ns
CYC
CYC
t16 Applies to Instructions 0x2, 0x3 15 50 ms
Applies to Instructions 0x8, 0x9, 0x10 7 30 μs
16
t
10 ns
17
50 ns
PRW
PRESP
30 μs
EEMEM
, and CL.
PULL-UP
pulsed low to refresh wiper positions
PR
= 25°C 1
A
30 μs
MCycles kCycles Yea r s
Rev. A | Page 5 of 16
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