Datasheet AD5235 Datasheet (Analog Devices)

Nonvolatile Memory, Dual

FEATURES

Dual-channel, 1024-position resolution 25 kΩ, 250 kΩ nominal resistance Low temperature coefficient: 35 ppm/°C Nonvolatile memory stores wiper settings Permanent memory write protection Wiper setting readback Resistance tolerance stored in EEMEM Predefined linear increment/decrement instructions Predefined ±6 dB/step log taper increment/decrement
instructions SPI® compatible serial interface 3 V to 5 V single supply or ±2.5 V dual supply 26 bytes extra nonvolatile memory for user-defined
information 100-year typical data retention, T Power-on refreshed with EEMEM settings

APPLICATIONS

DWDM laser diode driver, optical supervisory systems Mechanical potentiometer replacement Instrumentation: gain, offset adjustment Programmable voltage to current conversion Programmable filters, delays, time constants Programmable power supply Low resolution DAC replacement Sensor calibration

GENERAL DESCRIPTION

The AD5235 is a dual-channel, nonvolatile memory,1 digitally controlled potentiometer performs the same electronic adjustment function as a mechanical potentiometer with enhanced resolution, solid state reliability, and superior low temperature coefficient perform­ance. The AD5235’s versatile programming via an SPI compatible serial interface allows 16 modes of operation and adjustment including scratchpad programming, memory storing and restoring, increment/decrement, ±6 dB/step log taper adjustment, wiper setting readback, and extra EEMEM for user-defined information such as memory data for other components, look-up table, or system identification information.
2
with 1024-step resolution. The device
= 55°C
A
1024-Position Digital Potentiometer
AD5235

FUNCTIONAL BLOCK DIAGRAM

CS
CLK
SDI
SDO
PR
WP
RDY
ADDR
DECODE
SERIAL
INTERFACE
POWER-ON
RESET
EEMEM
CONTROL
RTOL
REGISTER
REGISTER
26 BYTES
3
USER EEMEM
Figure 1.
RDAC1
EEMEM1
RDAC2
EEMEM2
In the scratchpad programming mode, a specific setting can be programmed directly to the RDAC resistance between Terminals W–A and W–B. This setting can be stored into the EEMEM and is restored automatically to the RDAC register during system power-on.
The EEMEM content can be restored dynamically or through
PR
external
strobing, and a WP function protects EEMEM contents. To simplif y the programming, the independent or simultaneous linear-step increment or decrement commands can be used to move the RDAC wiper up or down, one step at a time. For logarithmic ±6 dB changes in wiper setting, the left or right bit shift command can be used to double or half the RDAC wiper setting.
AD5235 patterned resistance tolerance is stored in the EEMEM. The actual end-to-end resistance can, therefore, be known by the host processor in readback mode. The host can execute the appropriate resistance step through a software routine that simplifies open-loop applications as well as precision calibration and tolerance matching applications.
The AD5235 is available in a thin TSSOP-16 package. The part is guaranteed to operate over the extended industrial tempera­ture range of −40°C to +85°C.
1
The terms nonvolatile memory and EEMEM are used interchangeably.
2
The terms digital potentiometer and RDAC are used interchangeably.
3
RAB tolerance.
AD5235
RDAC1
RDAC2
2
register, which sets the
V
DD
A1 W1
B1
A2 W2
B2
V
SS
GND
02816-B-001
Rev. B
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
AD5235
TABLE OF CONTENTS
Specifications..................................................................................... 3
AD5235EVAL Evaluation Kit................................................... 21
Electrical Characteristics—25 kΩ, 250 kΩ Versions................ 3
Interface Timing Characteristics—25 kΩ, 250 kΩ Versions... 5
Timing Diagrams.......................................................................... 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Test Circuits................................................................................. 12
Theory of Operation ...................................................................... 14
Scratchpad and EEMEM Programming.................................. 14
Basic Operation .......................................................................... 14
EEMEM Protection.................................................................... 15
Digital Input/Output Configuration........................................ 15
Serial Data Interface................................................................... 15
Daisy-Chain Operation .............................................................15
Terminal Voltage Operating Range.......................................... 16
Advanced Control Modes ......................................................... 18
RDAC Structure.......................................................................... 19
Programming the Variable Resistor .........................................20
Applications..................................................................................... 22
Bipolar Operation from Dual Supplies.................................... 22
Gain Control Compensation.................................................... 22
High Voltage Operation............................................................. 22
DAC.............................................................................................. 22
Bipolar Programmable Gain Amplifier ................................... 23
10-Bit Bipolar DAC.................................................................... 23
Programmable Voltage Source with Boosted Output............ 23
Programmable Current Source ................................................ 24
Programmable Bidirectional Current Source......................... 24
Programmable Low-Pass Filter ................................................ 24
Programmable Oscillator.......................................................... 25
Optical Transmitter Calibration with ADN2841................... 25
Resistance Scaling ...................................................................... 26
Resistance Tolerance, Drift, and Temperature Coefficient
Mismatch Considerations......................................................... 26
RDAC Circuit Simulation Model............................................. 27
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
Programming the Potentiometer Divider............................... 20
Programming Examples............................................................ 21
REVISION HISTORY
7/04—Data Sheet Changed from REV. A to REV. B
Updated Formatting........................................................... Universal
Edits to Features, General Description, and Block Diagram .......1
Changes to Specifications.................................................................3
Replaced Timing Diagrams..............................................................6
Changes to Absolute Maximum Ratings ........................................7
Changes to Pin Function Descriptions...........................................8
Changes to Typical Performance Characteristics..........................9
Additional Test Circuit (Figure 36).................................................9
Rev.B | Page 2 of 28
Edits to Theory of Operation.........................................................14
Edits to Applications .......................................................................23
Updated Outline Dimensions........................................................27
8/02—Data Sheet Changed from REV. 0 to REV. A
Change to Features and General Description................................ 1
Change to Specifications ..................................................................2
Change to Calculating Actual End-to-End Terminal
Resistance Section ..........................................................................14
AD5235

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—25 KΩ, 250 KΩ VERSIONS

VDD = 3 V to 5.5 V, VSS = 0 V, VA = VDD, VB = 0 V, −40°C < TA < +85°C, unless otherwise noted. The part can be operated at 2.7 V single supply, except from 0°C to −40°C, where a minimum of 3 V is needed.
Table 1.
Parameter Symbol Conditions Min Typ1 Max Unit
DC CHARACTERISTICS— RHEOSTAT MODE (All RDACs)
Resistor Differential Nonlinearity2 R-DNL RWB −2 +2 LSB Resistor Integral Nonlinearity2 R-INL RWB −4 +4 LSB Nominal Resistor Tolerance ∆RAB/RAB Dx = 0x3FF −30 +30 % Resistance Temperature Coefficient (∆RAB/RAB)/∆T × 106 35 ppm/°C Wiper Resistance RW
= 1 V/RWB, VDD = 5 V,
I
W
Code = 0x200
= 1 V/RWB, VDD = 3 V,
I
W
Code = 0x200
Channel Resistance Matching R
Ch 1 and 2 RWB, Dx = 0x3FF ±0.1 %
AB1/RAB2
DC CHARACTERISTICS— POTENTIOMETER DIVIDER MODE (All RDACs)
Resolution N 10 Bits Differential Nonlinearity3 DNL −2 +2 LSB Integral Nonlinearity3 INL −4 +4 LSB Voltage Divider Temperature
(∆V
)/∆T × 106 Code = half-scale 15 ppm/°C
W/VW
Coefficient Full-Scale Error V Zero-Scale Error V
Code = full scale −6 0 LSB
WFSE
Code = zero scale 0 4 LSB
WZSE
RESISTOR TERMINALS
Terminal Voltage Range4 V Capacitance5 Ax, Bx C
V
A, B, W
f = 1 MHz, measured to GND,
A, B
Code = half-scale
Capacitance5 Wx CW f = 1 MHz, measured to GND,
Code = half-scale
Common-Mode Leakage Current
5 , 6
ICM V
= VDD/2 0.01 ±2 µA
W
DIGITAL INPUTS AND OUTPUTS
Input Logic High VIH With respect to GND, VDD = 5 V 2.4 V Input Logic Low VIL With respect to GND, VDD = 5 V 0.8 V Input Logic High VIH With respect to GND, VDD = 3 V 2.1 V Input Logic Low VIL With respect to GND, VDD = 3 V 0.6 V Input Logic High VIH
Input Logic Low VIL
Output Logic High (SDO, RDY) VOH
With respect to GND, V +2.5 V, V
= −2.5 V
SS
With respect to GND, V +2.5 V, V
R
PULL-UP
= −2.5 V
SS
= 2.2 kΩ to 5 V
=
DD
=
DD
(see Figure 25)
Output Logic Low VOL
= 1.6 mA, V
I
OL
LOGIC
= 5 V
(see Figure 25) Input Current IIL V Input Capacitance5 C
5 pF
IL
= 0 V or VDD ±2.25 µA
IN
POWER SUPPLIES
Single-Supply Power Range VDD V
= 0 V 3.0 5.5 V
SS
Dual-Supply Power Range VDD/VSS ±2.25 ±2.75 V Positive Supply Current IDD V I
V
DD
Negative Supply Current ISS
= VDD or VIL = GND, TA = 25°C 2 4.5 µA
IH
= VDD or VIL = GND 3.5 6.0 µA
IH
= VDD or VIL = GND,
V
IH
V
= +2.5 V, VSS = −2.5 V
DD
50 100
200 Ω
VDD V
SS
11 pF
80 pF
2.0 V
0.5 V
4.9 V
0.4 V
3.5 6.0 µA
Rev. B | Page 3 of 28
AD5235
Parameter Symbol Conditions Min Typ1 Max Unit
EEMEM Store Mode Current IDD (store)
I EEMEM Restore Mode Current7 I
I Power Dissipation8 P Power Supply Sensitivity5 P
DYNAMIC CHARACTERISTICS
5, 9
(store) VDD = +2.5 V, VSS = −2.5 V −35 mA
SS
(restore)
DD
(restore) VDD = +2.5 V, VSS = −2.5 V −0.3 −3 −9 mA
SS
V
DISS
∆VDD = 5 V ± 10% 0.002 0.01 %/%
SS
Bandwidth BW
Total Harmonic Distortion THDW V
VW Settling Time tS
= VDD or VIL = GND,
V
IH
V
= GND, ISS 0
SS
= VDD or VIL = GND,
V
IH
= GND, ISS 0
V
SS
= VDD or VIL = GND 18 50 µW
IH
−3 dB, V = 25 kΩ/250 kΩ
R
AB
= 1 V rms, VB = 0 V, f = 1 kHz 0.05 %
A
= 1 V rms, VB = 0 V, f = 1 kHz,
V
A
= 50 kΩ, 100 kΩ
R
AB
= VDD, VB = 0 V,
V
A
V
= 0.50% error band,
W
DD/VSS
= ±2.5 V,
Code 0x000 to 0x200, R
= 25 kΩ/250 kΩ
AB
Resistor Noise Density e Crosstalk (CW1/CW2) CT
R
N_WB
= 25 kΩ/250 kΩ, TA = 25°C 20/64
AB
= VDD, VB = 0 V, measured VW1
V
A
with V
making full-scale
W2
change
Analog Crosstalk CTA
= VA1 = +2.5 V, VSS = VB1 =
V
DD
−2.5 V, measured V
W1
with VW2 = 5 V p-p @ f = 1 kHz, Code 1 = 0x200, Code 2 = 0x3FF, R
= 25 kΩ/250 kΩ
AB
1
Typicals represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper positions.
R-DNL measures the relative step change from ideal between successive tap positions. I
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output DAC. VA = VDD and VB = VSS. DNL specification limits of
±1 LSB maximum are guaranteed monotonic operating conditions (see Figure 26).
4
Resistor Terminals A, B, and W have no limitations on polarity with respect to each other. Dual-supply operation enables ground-referenced bipolar signal adjustment.
5
Guaranteed by design and not subject to production test.
6
Common-mode leakage current is a measure of the dc leakage from any Terminal B–W to a common-mode bias level of VDD/2.
7
EEMEM restore mode current is not continuous. Current consumed while EEMEM locations are read and transferred to the RDAC register (see Figure 22). To minimize
power dissipation, a NOP, Instruction 0 (0x0) should be issued immediately after Instruction 1 (0x1).
8
P
is calculated from (IDD × VDD) + (ISS × VSS).
DISS
9
All dynamic characteristics use VDD = +2.5 V and VSS = −2.5 V.
~ 50 µA for VDD = 2.7 V and IW ~ 400 µA for VDD = 5 V (see Figure 25).
W
35 mA
0.3 3 9 mA
125/12 kHz
0.045 %
4/36 µs
90/21
nV/√ nV-s
Hz
−81/−62 dB
Rev. B | Page 4 of 28
AD5235
INTERFACE TIMING AND EEMEM RELIABILITY CHARACTERISTICS—25 KΩ, 250 KΩ VERSIONS
Guaranteed by design and not subject to production test.
See the Timing Diagrams section for the location of measured values. All input control voltages are specified with t 90% of 3 V) and timed from a voltage level of 1.5 V. Switching characteristics are measured using both V
= 3 V and 5 V.
DD
= tF = 2.5 ns (10% to
R
Table 2.
Parameter Symbol Conditions Min Typ1 Max Unit
Clock Cycle Time (t CS Setup Time CLK Shutdown Time to CS Rise
) t1 20 ns
CYC
t
10 ns
2
t
1 t
3
CYC
Input Clock Pulse Width t4, t5 Clock level high or low 10 ns Data Setup Time t6 From positive CLK transition 5 ns Data Hold Time t7 From positive CLK transition 5 ns
t
CS to SDO-SPI Line Acquire CS to SDO-SPI Line Release CLK to SDO Propagation Delay2 t CLK to SDO Data Hold Time t11 R CS High Pulse Width3 CS High to CS High3 RDY Rise to CS Fall CS Rise to RDY Fall Time Store/Read EEMEM Time4 t CS Rise to Clock Rise/Fall Setup Preset Pulse Width (Asynchronous) t Preset Response Time to Wiper Setting t Power-On EEMEM Restore Time t
40 ns
8
t
50 ns
9
R
10
t
12
t
4 t
13
t
0 ns
14
t
0.15 0.3 ms
15
Applies to instructions 0x2, 0x3, and 0x9 30 ms
16
t
10 ns
17
Not shown in timing diagram 50 ns
PRW
PRESP
140 µs
EEMEM1
= 2.2 kΩ, CL < 20 pF 50 ns
P
= 2.2 kΩ, CL < 20 pF 0 ns
P
pulsed low to refresh wiper positions
PR
10 ns
140 µs
CYC
FLASH/EE MEMORY RELIABILITY
Endurance5 100 Data Retention6 100
kCycles Years
1
Typicals represent average readings at 25°C and VDD = 5 V.
2
Propagation delay depends on the value of VDD, R
3
Valid for commands that do not activate the RDY pin.
4
RDY pin low only for Instructions 2, 3, 8, 9, 10, and the PR hardware pulse: CMD_8 ~ 1 ms; CMD_9, 10 ~ 0.1 ms; CMD_2, 3 ~ 20 ms. Device operation at TA = −40°C and
V
< 3 V extends the save time to 35 ms.
DD
5
Endurance is qualified to 100,000 cycles per JEDEC Standard 22, Method A117 and measured at −40°C, +25°C, and +85°C; typical endurance at +25°C is 700,000 cycles.
6
Retention lifetime equivalent at junction temperature (TJ) = 55°C per JEDEC Standard 22, Method A117. Retention lifetime based on an activation energy of 0.6 eV
derates with junction temperature in the Flash/EE memory.
PULL-UP
, and CL.
Rev. B | Page 5 of 28
AD5235

TIMING DIAGRAMS

CPHA = 1
CS
CLK
CPOL = 1
SDI
SDO
RDY
t
t
t
2
HIGH OR LOW
t
8
B24* B23–MSB B0–LSB
t
14
*NOTE: EXTRA BIT THAT IS NOT DEFINED, BUT NORMALLY LSB OF CHARACTER PREVIOUSLY TRANSMITTED.
THE CPOL = 1 MICROCONTROLLER COMMAND ALIGNS THE INCOMING DATA TO THE POSITIVE EDGE OF THE CLOCK.
1
t
B23 B0
5
t
4
t
7
t
6
B23–MSB
t
10
B0–LSB
t
11
3
t
12
t
13
t
17
HIGH OR LOW
t
9
t
15
t
16
02816-B-002
Figure 2. CPHA = 1 Timing Diagram
CPHA = 0
CLK
CPOL = 0
SDI
CS
HIGH OR LOW
t
2
B23–MSB IN
t
1
t
B23 B0
5
t
4
t
7
t
6
B0–LSB
t
3
t
12
t
13
t
17
HIGH OR LOW
SDO
RDY
t
8
B23–MSB OUT B0–LSB
t
14
*NOTE: EXTRA BIT THAT IS NOT DEFINED, BUT NORMALLY MSB OF CHARACTER JUST RECEIVED.
THE CPOL = 0 MICROCONTROLLER COMMAND ALIGNS THE INCOMING DATA TO THE POSITIVE EDGE OF THE CLOCK.
t
10
t
11
t
9
*
t
15
t
16
02816-B-003
Figure 3. CPHA = 0 Timing Diagram
Rev. B | Page 6 of 28
AD5235

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND –0.3 V, +7 V VSS to GND +0.3 V, −7 V VDD to VSS 7 V VA, VB, VW to GND VSS − 0.3 V, VDD + 0.3 V IA, IB, IW
Pulsed1 ±20 mA
Continuous ±2 mA Digital Input and Output Voltage to GND −0.3 V, VDD + 0.3 V Operating Temperature Range2 −40°C to +85°C Maximum Junction Temperature (TJ max) 150°C Storage Temperature −65°C to +150°C Lead Temperature, Soldering
Vapor Phase (60 s) 215°C
Infrared (15 s) 220°C Thermal Resistance Junction-to-Ambient
θ
,TSSOP-16
JA
Thermal Resistance Junction-to-Case θJC,
TSSOP-16 Package Power Dissipation (TJ max − TA)/θJA
150°C/W
28°C/W
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance.
2
Includes programming of nonvolatile memory.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. B | Page 7 of 28
AD5235

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

CLK
SDI
SDO
GND
V
W1
SS
A1
B1
1
2
3
AD5235BRU
4
TOP VIEW
5
(Not to Scale)
6
7
8
16
RDY
15
CS
14
PR
13
WP V
12
DD
A2
11
10
W2
9
B2
02816-B-005
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 CLK Serial Input Register Clock. Shifts in one bit at a time on positive clock edges. 2 SDI Serial Data Input. Shifts in one bit at a time on positive clock CLK edges. MSB loads first. 3 SDO Serial Data Output. Serves readback and daisy-chain functions.
Commands 9 and 10 activate the SDO output for the readback function, delayed by 24 or 25 clock pulses, depending on the clock polarity before and after the data-word (see Figure 2, Figure 3, and Table 7).
In other commands, the SDO shifts out the previously loaded SDI bit pattern, delayed by 24 or 25 clock pulses depending on the clock polarity (see Figure 2 and Figure 3). This previously shifted-out SDI can be used for daisy­chaining multiple devices.
Whenever SDO is used, a pull-up resistor in the range of 1 kΩ to 10 kΩ is needed. 4 GND Ground Pin, Logic Ground Reference. 5 VSS
Negative Supply. Connect to 0 V for single-supply applications. If V
is used in dual supply, it must be able to sink
SS
35 mA for 30 ms when storing data to EEMEM. 6 A1 Terminal A of RDAC1. 7 W1 Wiper terminal of RDAC1. ADDR(RDAC1) = 0x0. 8 B1 Terminal B of RDAC1. 9 B2 Terminal B of RDAC2. 10 W2 Wiper terminal of RDAC2. ADDR(RDAC2) = 0x1. 11 A2 Terminal A of RDAC2. 12 VDD Positive Power Supply. 13
Optional Write Protect. When active low, WP prevents any changes to the present contents, except PR strobe.
WP
CMD_1 and COMD_8 refresh the RDAC register from EEMEM. Execute a NOP instruction before returning to WP
14
15
Optional Hardware Override Preset. Refreshes the scratchpad register with current contents of the EEMEM
PR
Serial Register Chip Select Active Low. Serial register operation takes place when CS returns to logic high.
CS
16 RDY
high. Tie WP
register. Factory default loads midscale 512
at the logic high transition. Tie PR
Ready. Active-high open-drain output. Identifies completion of Instructions 2, 3, 8, 9, 10, and PR
to VDD, if not used.
until EEMEM is loaded with a new value by the user. PR is activated
10
to VDD, if not used.
.
Rev. B | Page 8 of 28
AD5235
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
0.8
0.6
0.4
0.2
0.0
–0.2
INL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0 200 400 600 1000
Figure 5. INL vs. Code, T
1.0
0.8
0.6
0.4
0.2
0.0 –0.2 –0.4
DNL ERROR (LSB)
–0.6 –0.8 –1.0 –1.2 –1.4
0 200 400 600 1000
Figure 6. DNL vs. Code, T
1.0
0.8
0.6
0.4
0.2
0
R-INL ERROR (LSB)
–0.2
–0.4
–0.6
0 200 400 600 1000
Figure 7. R-INL vs. Code, T
DIGITAL CODE
= −40°C, +25°C, +85°C Overlay, RAB = 25 kΩ
A
DIGITAL CODE
= −40°C, +25°C, +85°C Overlay, RAB = 25 kΩ
A
DIGITAL CODE
= −40°C, +25°C, +85°C Overlay, RAB = 25 kΩ
A
800
800
800
+25°C –40°C +85°C
+25°C –40°C +85°C
+25°C –40°C +85°C
0.4
0.2
0.0
–0.2
R-DNL ERROR (LSB)
–0.4
–0.6
–0.8
0 200 400 600 1000
02816-B-006
Figure 8. R-DNL vs. Code, T
70
60
50
40
30
20
10
0
–10
–20
POTENTIOMETER MODE TEMPCO (ppm/°C)
–30
02816-B-007
0 128 256 512384 640 1023
25kVERSION
250kVERSION
Figure 9. (∆V
120
100
80
60
40
20
0
–20
–40
RHEOSTAT MODE TEMPCO (ppm/°C)
–60
–80
0 128 256 512384 640 1023
02816-B-008
25k VERSION
250k VERSION
Figure 10. (∆R
DIGITAL CODE
= −40°C, +25°C, +85°C Overlay, RAB = 25 kΩ
A
CODE (Decimal)
)/∆T × 106 Potentiometer Mode Tempco
W/VW
CODE (Decimal)
)/∆T × 106 Rheostat Mode Tempco
WB/RWB
+25°C –40°C +85°C
800
VDD/VSS = 5V/0V T
= 25°C
A
768 896
VDD/VSS = 5V/0V T
= 25°C
A
768 896
02816-B-009
02816-B-010
02816-B-011
Rev. B | Page 9 of 28
AD5235
36
VDD= 3V
34
= 0V
V
SS
= 25°C
T
A
32
30
28
26
24
22
20
18
16
0 200 400 800600 1000 1200
CODE (Decimal)
Figure 11. Wiper On Resistance vs. Code
4
0.28 V
= ±2.5V
DD/VSS
= 1V rms
V
0.24
A
0.20
0.16
0.12
THD + NOISE (%)
0.08
0.04
0.00
0.01k 0.1k 1k 10k 100k
02816-B-012
= 250k
R
AB
FREQUENCY (Hz)
25k
02816-B-015
Figure 14. Total Harmonic Distortion vs. Frequency
3
3
IDD@ VDD/VSS= 5V/0V
2
1
CURRENT ( µA)
0
I
@ VDD/VSS= 2.7V/0V
Figure 12. I
= 25k
Figure 13. I
SS
DD
vs. Clock Frequency, RAB = 25 kΩ
DD
–1
–40 –20 0 4020 60 10080
0.25 VDD/VSS= 5V/0V R
AR
0.20
0.15
(mA)
DD
I
0.10
0.05
0.00
0 2M 4M 6M 8M 10M 12M
I
@ VDD/VSS= 5V/0V
SS
I
@ VDD/VSS= 2.7V/0V
DD
CODE (Decimal)
vs. Temperature, RAB = 25 kΩ
FULL SCALE
MIDSCALE
ZERO SCALE
FREQUENCY (Hz)
0
–3
–6
GAIN (dB)
f
–3dB
–9
V
= ±2.5V
DD/VSS
= 1V rms
V
A
D = MIDSCALE
–12
1k 10k 100k 1M
02816-B-013
R
= 12kHz
FREQUENCY (Hz)
AB
= 250k
f
–3dB
R
= 25k
AB
= 125kHz
02816-B-016
Figure 15. −3 dB Bandwidth vs. Resistance ( Figure 31)
0
CODE 0x200
–10
0x100 0x080
–20
0x040
0x020
–30
GAIN (dB)
02816-B-014
0x010 0x008
–40
0x004 0x002
–50
0x001
–60
1k 10k 100k 1M
FREQUENCY (Hz)
Figure 16. Gain vs. Frequency vs. Code, R
= 25 kΩ ( Figure 31)
AB
02816-B-017
Rev. B | Page 10 of 28
AD5235
0
CODE 0x200
–10
0x100 0x080
–20
0x040
0x020
–30
GAIN (dB)
0x010
0x008
–40
0x004
–50
0x002 0x001
–60
1k 10k 100k 1M
FREQUENCY (Hz)
Figure 17. Gain vs. Frequency vs. Code, R
= 250 kΩ ( Figure 31)
AB
02816-B-018
2.64
2.62
2.60
2.58
2.56
2.54
2.52
2.50
AMPLITUDE (V)
2.48
2.46
2.44
2.42 0
10 20 30 5040
TIME (µS)
Figure 20. Midscale Glitch Energy, R
V
= VSS= 5V
DD
CODE = 0x200 TO 0x1FF
= 25 kΩ, Code 0x200 to 0x1FF
AB
02816-B-021
80
70
60
50
40
PSRR ( –dB)
30
20
= 5V ± 100mV AC
V
DD
V
= 0V, VA = 5V, VB = 0V
SS
10
MEASURED AT V T
= 25°C
A
0
0.01k 0.1k 1k 10k 100k 10M1M
RAB= 250k
WITH CODE = 0x200
W
FREQUENCY (Hz)
R
Figure 18. PSRR v s. Frequency
VDD= 5V
= 2.25V
V
A
= 0
V
B
= 25°C
T
A
0.5V/DIV
AB
VW(D)
= 25k
V
A
0.5V/DIV
0.5/DIV
2.65
2.60
2.55
2.50
AMPLITUDE (V)
2.45
2.40 0
02816-B-019
Figure 21. Midscale Glitch Energy, R
5V/DIV
5V/DIV
10 20 30 5040
TIME (µS)
= 250 kΩ, Code 0x200 to 0x1FF
AB
CS
CLK
02816-B-022
MIDSCALE
Figure 19. Power-On Reset, V
Previously Stored Code = 0x2AA
50µS/DIV
= 2.25 V,
DD
02816-B-020
Rev. B | Page 11 of 28
5V/DIV
Figure 22. I
4ms/DIV
vs. Time when Storing Data to EEMEM
DD
SDI
I
DD
20mA/DIV
02816-B-023
AD5235
V
100
5V/DIV
5V/DIV
5V/DIV
4ms/DIV
* SUPPLY CURRENT RETURNS TO MINIMUM POWER
CONSUMPTION, IF INSTRUCTION 0 (NOP) IS EXECUTED IIMMEDIATELY AFTER INSTRUCTION 1 (READ EEMEM).
Figure 23. I
vs. Time when Restoring Data from EEMEM
DD

TEST CIRCUITS

Figure 25 to Figure 35 define the test conditions used in the Specifications section.
NC
DUT A
W
B
NC = NO CONNECT
Figure 25. Resistor Position Nonlinearity Error
(Rheostat Operation; R-INL, R-DNL)
DUT A
V+
W
B
Figure 26. Potentiometer Divider Nonlinearity Error
(INL, DNL)
DUT A
V
W
MS2
W
B
V
MS1
Figure 27. Wiper Resistance
I
W
V
MS
V+ =V 1LSB =V+/2
= VDD/R
I
W
R
W
=
DD
V
MS
[
V
02816-B-026
N
NOMINAL
–V
MS1
02816-B-027
MS2
CS
10
– mA)
CLK
WB_MAX
1
SDI
0.1
IDD* 2mA/DIV
02816-B-024
THEORECTICAL (I
0.01
V+
]
/I
W
02816-B-028
V
~
OFFSET
OFFSET
GND
R
= 25k
AB
R
AB
CODE (Decimal)
Figure 24. I
V
A
A
DD
W
B
V
MS
vs. Code
WB_MAX
V+ = VDD±10%
PSRR (dB) = 20 LOG
PSS (%/%) =
Figure 28. Power Supply Sensitivity
(PSS, PSRR)
ABDUT
W
OP279
OFFSET BIAS
GND
V
IN
Figure 29. Inverting Gain
V
IN
ABDUT
OFFSET BIAS
OP279
W
Figure 30. Noninverting Gain
VA = VB = OPEN T
= 250k
5V
5V
= 25°C
A
VV
896768640512384128 2560
1024
02816-B-025
V
MS
)
(
V
DD
%
MS
%
DD
02816-B-029
V
OUT
02816-B-030
V
OUT
02816-B-031
Rev. B | Page 12 of 28
AD5235
RSW=
TO V
DD
0.1V I
SW
+15V
OP42
–15V
V
W1
DD
A2
W2
V
OUT
B2
V
SS
B1
]
OUT/VIN
02816-B-035
A1
V
OUT
02816-B-032
V
IN
RDAC1 RDAC2
NC
CTA = 20 LOG [V NC = NO CONNECT
Figure 34. Analog Crosstalk
+
0.1V
02816-B-033
TO OUTPUT
PIN
200µAI
C
L
50pF
200µAI
Figure 35. Load Circuit for Measuring V
circuit is equivalent to the application circuit with R
OL
VOH (MIN) OR V
(MAX)
OL
OH
and VOL (The diode bridge test
OH
PULL-UP
02816-B-036
of 2.2 kΩ.)
OFFSET
GND
A
V
IN
DUT
W
B
2.5V
Figure 31. Gain vs. Frequency
DUT
W
B
A = NC
CODE = 0x00
I
SW
V
SS
Figure 32. Incremental On Resistance
NC
GND
NC
A
B
NC = NO CONNECT
I
CM
W
V
CM
02816-B-034
V
DUT
V
DD
SS
Figure 33. Common-Mode Leakage Current
Rev. B | Page 13 of 28
AD5235

THEORY OF OPERATION

The AD5235 digital potentiometer is designed to operate as a true variable resistor. The resistor wiper position is determined by the RDAC register contents. The RDAC register acts as a scratchpad register, allowing unlimited changes of resistance settings. The scratchpad register can be programmed with any position setting using the standard SPI serial interface by loading the 24-bit data-word. In the format of the data-word, the first four bits are commands, the following four bits are addresses, and the last 16 bits are data. Once a specified value is set, this value can be stored in a corresponding EEMEM register. During subsequent power-up, the wiper setting is automatically loaded to that value.
Storing data to EEMEM takes about 25 ms and consumes approximately 35 mA. During this time, the shift register is locked, preventing any changes from taking place. The RDY pin pulses low to indicate the completion of this EEMEM storage. There are also 13 addresses with two bytes each of user-defined data that can be stored in EEMEM.
The following instructions facilitate the user’s programming needs (see Table 7 for details):
0. Do nothing.
1. Restore EEMEM content to RDAC.
2. Store RDAC setting to EEMEM.
3. Store RDAC setting or user data to EEMEM.
4. Decrement 6 dB.
5. Decrement all 6 dB.
6. Decrement one step.
7. Decrement all one step.
8. Reset EEMEM content to RDAC.
9. Read EEMEM content from SDO.
10. Read RDAC wiper setting from SDO.
11. Write d ata t o RDAC.
12. Increment 6 dB.
13. Increment all 6 dB.
14. Increment one step.
15. Increment all one step.

SCRATCHPAD AND EEMEM PROGRAMMING

The scratchpad RDAC register directly controls the position of the digital potentiometer wiper. For example, when the scratch­pad register is loaded with all zeros, the wiper is connected to Terminal B of the variable resistor. The scratchpad register is a standard logic register with no restriction on the number of changes allowed, but the EEMEM registers have a program erase/write cycle limitation.

BASIC OPERATION

The basic mode of setting the variable resistor wiper position (programming the scratchpad register) is accomplished by loading the serial data input register with Instruction 11 (0xB), Address 0, and the desired wiper position data. When the proper wiper position is determined, the user can load the serial data input register with Instruction 2 (0x2), which stores the wiper position data in the EEMEM register. After 25 ms, the wiper position is permanently stored in nonvolatile memory.
Table 5 provides a programming example listing the sequence of serial data input (SDI) words with the serial data output appearing at the SDO pin in hexadecimal format.
Table 5. Write and Store RDAC Settings to EEMEM Registers
SDI SDO Action
0xB00100 0xXXXXXX
0x20XXXX 0xB00100
0xB10200 0x20XXXX
0x21XXXX 0xB10200
At system power-on, the scratchpad register is automatically refreshed with the value previously stored in the corresponding EEMEM register. The factory-preset EEMEM value is midscale. The scratchpad register can also be refreshed with the contents of the EEMEM register in three different ways. First, executing Instruction 1 (0x1) restores the corresponding EEMEM value. Second, executing Instruction 8 (0x8) resets both channels’ EEMEM values. Finally, pulsing the EEMEM settings. Operating the hardware control requires a complete pulse signal. When logic sets the wiper at midscale. The EEMEM value is not loaded until
PR
returns high.
Writes data 0x100 to the RDAC1 register, Wiper W1 moves to 1/4 full­scale position.
Stores RDAC1 register content into the EEMEM1 register.
Writes 0x200 data into the RDAC2 register, Wiper W2 moves to 1/2 full­scale position.
Stores RDAC2 register contents into EEMEM2 register.
PR
pin refreshes both
PR
function
PR
goes low, the internal
Table 14 to Table 20 provide programming examples that use some of these commands.
Rev. B | Page 14 of 28
AD5235
K

EEMEM PROTECTION

The write protect (WP) pin disables any changes to the scratchpad register contents, except for the EEMEM setting, which can still be restored using Instruction 1, Instruction 8,
PR
and the hardware EEMEM protection feature. To disable
pulse. Therefore, WP can be used to provide a
WP
, it is recommended to execute a NOP instruction before returning WP
to logic high.

DIGITAL INPUT/OUTPUT CONFIGURATION

All digital inputs are ESD protected, high input impedance that can be driven directly from most digital sources. Active at logic
PR
low,
and WP must be tied to VDD, if they are not used. No internal pull-up resistors are present on any digital input pins. To avoid floating digital pins that might cause false triggering in a noisy environment, pull-up resistors should be added. This is applicable when the device is detached from the driving source once it is programmed.
The SDO and RDY pins are open-drain digital outputs that need pull-up resistors only if these functions are used. To optimize the speed and power trade-off, use 2.2 kΩ pull-up resistors.
V
DD
INPUT
WP
Figure 38. Equivalent
300
GND
WP
Input Protection
02816-B-039

SERIAL DATA INTERFACE

The AD5235 contains a 4-wire SPI compatible digital interface
CS
(SDI, SDO, loaded with MSB first. The format of the word is shown in Table 6. The command bits (C0 to C3) control the operation of the digital potentiometer according to the command shown in Table 7. A0 to A3 are the address bits. A0 is used to address RDAC1 or RDAC2. Addresses 2 to 14 are accessible by users for extra EEMEM. Address 15 is reserved for factory usage. Table 9 provides an address map of the EEMEM locations. The data bits (D0 to D9) are the values for the RDAC registers. The data bits (D0 to D15) are the values for the EEMEM registers.
, and CLK). The 24-bit serial data-word must be
The equivalent serial data input and output logic is shown in Figure 36. The open-drain output SDO is disabled whenever
CS
chip-select
is in logic high. ESD protection of the digital
inputs is shown in Figure 37 and Figure 38.
PR WP
VALID
COMMAND
COUNTER
CL
CS
SDI
Figure 36. Equivalent Digital Input-Output Logic
LOGIC
PINS
Figure 37. Equivalent ESD Digital Input Protection
COMMAND
PROCESSOR
AND ADDRESS
DECODE
SERIAL
REGISTER
AD5235
INPUTS
300
V
GND
5V
R
PULL-UP
(FOR DAISY CHAIN ONLY)
SDO
GND
DD
02816-B-038
The AD5235 has an internal counter that counts a multiple of 24 bits (a frame) for proper operation. For example, AD5235 works with a 24-bit or 48-bit word, but it cannot work properly with a 23-bit or 25-bit word. In addition, AD5235 has a subtle
CS
feature that, if
is pulsed without CLK and SDI, the part repeats the previous command (except during power-up). As a result, care must be taken to ensure that no excessive noise exists in the CLK or
CS
line that might alter the effective number-of-bits pattern. Also, to prevent data from mislocking (due to noise, for example), the counter resets, if the count is not a multiple of four when
CS
goes high.
The SPI interface can be used in two slave modes: CPHA = 1, CPOL = 1 and CPHA = 0, CPOL = 0. CPHA and CPOL refer to the control bits that dictate SPI timing in the following
02816-B-037
MicroConverters and microprocessors: ADuC812/ADuC824, M68HC11, and MC68HC16R1/MC68HC 916R1.

DAISY-CHAIN OPERATION

The serial data output pin (SDO) serves two purposes. It can be used to read the contents of the wiper setting and EEMEM values using Instructions 10 and 9, respectively. The remaining instructions (0 to 8, 11 to 15) are valid for daisy-chaining multiple devices in simultaneous operations. Daisy-chaining minimizes the number of port pins required from the controlling IC (Figure 39). The SDO pin contains an open-drain N-Ch FET that requires a pull-up resistor, if this function is used. As shown in Figure 39, users need to tie the SDO pin of one package to the SDI pin of the next package. Users might need to increase the clock period, because the pull-up resistor
Rev. B | Page 15 of 28
AD5235
and the capacitive loading at the SDO–SDI interface might require additional time delay between subsequent devices.
When two AD5235s are daisy-chained, 48 bits of data are required. The first 24 bits (formatted 4-bit command, 4-bit address, and 16-bit data) go to U2, and the second 24 bits with
CS
the same format go to U1. The 48 bits are clocked into their respective serial registers. The is then pulled high to complete the operation.
AD5235 AD5235
MOSI
µC
SCLK SS
SDI SDO
U1 U2
CS
CLK CLK
Figure 39. Daisy-Chain Configuration Using SDO

TERMINAL VOLTAGE OPERATING RANGE

The AD5235’s positive VDD and negative VSS power supplies define the boundary conditions for proper 3-terminal digital potentiometer operation. Supply signals present on Terminals A, B, and W that exceed V forward-biased diodes (see Figure 40).
or VSS are clamped by the internal
DD
should be kept low until all
V
DD
R
P
2.2k
SDI SDO
CS
V
DD
A
W
CS
02816-B-040
the common-mode voltage range of the three terminals extends from V
to VDD, regardless of the digital input level.
SS

Power-Up Sequence

Because there are diodes to limit the voltage compliance at Terminals A, B, and W (Figure 40), it is important to power
first before applying any voltage to Terminals A, B,
V
DD/VSS
and W. Otherwise, the diode is forward-biased such that V
DD/VSS
are powered unintentionally. For example, applying 5 V across Terminals A and B prior to V
causes the VDD terminal to
DD
exhibit 4.3 V. It is not destructive to the device, but it might affect the rest of the user’s system. The ideal power-up sequence is GND, V of powering V long as they are powered after V
, digital inputs, and VA, VB, and VW. The order
DD/VSS
, VB, VW, and digital inputs is not important as
A
.
DD/VSS
Regardless of the power-up sequence and the ramp rates of the power supplies, once V
are powered, the power-on preset
DD/VSS
activates, which restores the EEMEM values to the RDAC registers.

Layout and Power Supply Bypassing

It is a good practice to employ compact, minimum lead-length layout design. The leads to the input should be as direct as possible with a minimum conductor length. Ground paths should have low resistance and low inductance.
Similarly, it is good practice to bypass the power supplies with quality capacitors for optimum stability. Supply leads to the device should be bypassed with 0.01 µF to 0.1 µF disk or chip ceramic capacitors. Low ESR, 1 µF to 10 µF tantalum or electrolytic capacitors should also be applied at the supplies to minimize any transient disturbance (see Figure 41).
B
V
02816-B-041
SS
Figure 40. Maximum Terminal Voltages Set by V
DD
and V
SS
The ground pin of the AD5235 device is primarily used as a digital ground reference. To minimize the digital ground bounce, the AD5235 ground terminal should be joined remotely to the common ground (see Figure 41). The digital input control signals to the AD5235 must be referenced to the device ground pin (GND), and satisfy the logic level defined in the Specifications section. An internal level-shift circuit ensures that
Rev. B | Page 16 of 28
AD5235
V
DD
10µF
10µFC20.1µF
V
SS
+
C1
C3
0.1µF
+
C4
V
DD
V
SS
GND
02816-B-042
Figure 41. Power Supply Bypassing
AD5235
In Table 6, command bits are C0 to C3, address bits are A0 to A3, data bits D0 to D9 are applicable to RDAC, and D0 to D15 are applicable to EEMEM.
Table 6. 24-Bit Serial Data-Word
MSB Command Byte 0 Data Byte 1 Data Byte 0 LSB
RDAC C3 C2 C1 C0 0 0 0 A0 X X X X X X D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 EEMEM C3 C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Command instruction codes are defined in Table 7.
Table 7. Command Operation Truth Table
Command Byte 0 Data Byte 1 Data Byte 0
Command Number
B23 B16 B15 B8 B7 B0
C3 C2 C1 C0 A3 A2 A1 A0 X … D9 D8 D7 … D0
0 0 0 0 0 X X X X X … X X X … X NOP: Do nothing. See Table 16. 1 0 0 0 1 0 0 0 A0 X … X X X … X Restore EEMEM(A0) contents to RDAC(A0)
2 0 0 1 0 0 0 0 A0 X … X X X … X Store Wiper Setting: Store RDAC(A0) setting to
34 0 0 1 1 A3 A2 A1 A0 D15 … D8 D7 … D0 Store contents of Serial Register Data Bytes 0
45 0 1 0 0 0 0 0 A0 X … X X X … X Decrement 6 dB: Right-shift contents of
55 0 1 0 1 X X X X X … X X X … X Decrement all 6 dB: Right-shift contents of all
65 0 1 1 0 0 0 0 A0 X … X X X … X Decrement contents of RDAC(A0) by 1, stop at
75 0 1 1 1 X X X X X … X X X … X Decrement contents of all RDAC registers by 1,
8 1 0 0 0 0 0 0 0 X … X X X … X Reset: Refresh all RDACs with their correspond-
9 1 0 0 1 A3 A2 A1 A0 X … X X X … X Read contents of EEMEM (ADDR) from SDO
10 1 0 1 0 0 0 0 A0 X … X X X … X Read RDAC wiper setting from SDO output in
11 1 0 1 1 0 0 0 A0 X … D9 D8 D7 … D0 Write contents of Serial Register Data Bytes 0
125 1 1 0 0 0 0 0 A0 X … X X X … X Increment 6 dB: Left-shift contents of
135 1 1 0 1 X X X X X … X X X … X Increment all 6 dB: Left-shift contents of all
145 1 1 1 0 0 0 0 A0 X … X X X … X Increment contents of RDAC(A0) by 1, stop at
155 1 1 1 1 X X X X X … X X X … X Increment contents of all RDAC registers by 1,
1
The SDO output shifts out the last 24 bits of data clocked into the serial register for daisy-chain operation. Exception: for any instruction following Instruction 9 or 10,
the selected internal register data is present in Data Bytes 0 and 1. The instructions following Instructions 9 and 10 must also be a full 24-bit data-word to completely clock out the contents of the serial register.
2
The RDAC register is a volatile scratchpad register that is refreshed at power-on from the corresponding nonvolatile EEMEM register.
3
Execution of these operations takes place when the CS strobe returns to logic high.
4
Instruction 3 writes two data bytes (16 bits of data) to EEMEM. In the case of Addresses 0 and 1, only the last 10 bits are valid for wiper position setting.
5
The increment, decrement, and shift instructions ignore the contents of the shift register Data Bytes 0 and 1.
1, 2, 3
Operation
register. This command leaves the device in the read program power state. To return the part to the idle state, perform NOP instruction 0. See Table 16.
EEMEM(A0). See Table 15.
and 1 (total 16 bits) to EEMEM(ADDR). See Table 18.
RDAC(A0) register, stop at all 0s.
RDAC registers, stop at all 0s.
all 0s.
stop at all 0s.
ing EEMEM previously stored values.
output in the next frame. See Table 19.
the next frame. See Table 20.
and 1 (total 10 bits) to RDAC(A0). See Table 14.
RDAC(A0), stop at all 1s. See Table 17.
RDAC registers, stop at all 1s.
all 1s. See Table 15.
stop at all 1s.
Rev. B | Page 17 of 28
AD5235

ADVANCED CONTROL MODES

The AD5235 digital potentiometer includes a set of user programming features to address the wide number of applications for these universal adjustment devices.
Key programming features include:
Scratchpad programming to any desirable values
Nonvolatile memory storage of the scratchpad RDAC register
value in the EEMEM register
Increment and decrement instructions for the RDAC wiper
register
Left and right bit shift of the RDAC wiper register to achieve
±6 dB level changes
26 extra bytes of user-addressable nonvolatile memory

Linear Increment and Decrement Instructions

The increment and decrement instructions (14, 15, 6, and 7) are useful for linear step-adjustment applications. These commands simplify microcontroller software coding by allowing the controller to send just an increment or decrement command to the device. The adjustment can be individual or ganged control.
For an increment command, executing Instruction 14 automati­cally moves the wiper to the next resistance segment position. The master increment command, Instruction 15, moves all resistor wipers up by one position.

Logarithmic Taper Mode Adjustment

Four programming instructions produce logarithmic taper increment and decrement of the wiper position control by either individual or ganged control. The 6 dB increment is activated by Instructions 12 and 13, and the 6 dB decrement is activated by Instructions 4 and 5. For example, executing the increment Instruction 12 eleven times moves the wiper in 6 dB per step from 0% to full scale, R near the maximum setting, the last 6 dB increment instruction causes the wiper to go to the full-scale 1023 code position. Further 6 dB per increment instructions do not change the wiper position beyond its full scale (see Table 8).
. When the wiper position is
AB
data in the RDAC register is automatically set to full scale. This makes the left-shift function as ideal a logarithmic adjustment as possible.
The right-shift 4 and 5 instructions are ideal only if the LSB is 0 (ideal logarithmic = no error). If the LSB is a 1, the right-shift function generates a linear half-LSB error, which translates to a number-of-bits dependent logarithmic error, as shown in Figure
42. The plot shows the error of the odd numbers of bits for the AD5235.
Table 8. Detail Left-Shift and Right-Shift Functions for 6 dB Step Increment and Decrement
Left-Shift Right-Shift
00 0000 0000 11 1111 1111 00 0000 0001 01 1111 1111 00 0000 0010 00 1111 1111 00 0000 0100 00 0111 1111
Left-Shift (+6 dB/Step)
00 0000 1000 00 0011 1111 00 0001 0000 00 0001 1111 00 0010 0000 00 0000 1111 00 0100 0000 00 0000 0111
Right-Shift
(–6 dB/Step)
00 1000 0000 00 0000 0011 01 0000 0000 00 0000 0001 10 0000 0000 00 0000 0000 11 1111 1111 00 0000 0000 11 1111 1111 00 0000 0000
Actual conformance to a logarithmic curve between the data contents in the RDAC register and the wiper position for each right-shift 4 and 5 command execution contains an error only for odd numbers of bits. Even numbers of bits are ideal. The graph in Figure 42 shows plots of Log_Error [20 × log
10
(error/code)] for the AD5235. For example, Code 3 Log_Error = 20 × log
(0.5/3) = −15.56 dB, which is the worst case. The plot
10
of Log_Error is more significant at the lower codes.
0
–20
–40
dB
The 6 dB step increments and 6 dB step decrements are achieved by shifting the bit internally to the left or right, respectively. The following information explains the nonideal ±6 dB step adjustment under certain conditions. Table 8 illustrates the operation of the shifting function on the RDAC register data bits. Each table row represents a successive shift operation. Note that the left-shift 12 and 13 instructions were modified such that, if the data in the RDAC register is equal to zero and the data is shifted left, the RDAC register is then set to Code 1. Similarly, if the data in the RDAC register is greater than or equal to midscale and the data is shifted left, then the
Rev. B | Page 18 of 28
–60
–80
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
0
CODE (From 1 to 1023 by 2.0 × 103)
Figure 42. Plot of Log_Error Conformance for Odd Numbers of Bits Only
(Even Numbers of Bits Are Ideal)
02816-B-043
AD5235
Using CS to Re-Execute a Previous Command
Another subtle feature of the AD5235 is that a subsequent CS strobe, without clock and data, repeats a previous command.

Using Additional Internal Nonvolatile EEMEM

The AD5235 contains additional user EEMEM registers for storing any 16-bit data such as memory data for other compo­nents, look-up tables, or system identification information. Table 9 provides an address map of the internal storage registers shown in the functional block diagram as EEMEM1, EEMEM2, and 26 bytes (13 addresses × 2 bytes each) of USER EEMEM.
Table 9. EEMEM Address Map
EEMEM No. Address EEMEM Content for …
1 0000 RDAC1
1, 2
2 0001 RDAC2 3 0010 USER13 4 0011 USER2 … … … 15 1110 USER13 16 1111 R
1
RDAC data stored in EEMEM locations is transferred to the corresponding
RDAC register at power-on, or when Instruction 1, Instruction 8, and executed.
2
Execution of Instruction 1 leaves the device in the read mode power
consumption state. After the last Instruction 1 is executed, the user should perform a NOP, Instruction 0, to return the device to the low power idling state.
3
USERx are internal nonvolatile EEMEM registers available to store and
retrieve constants and other 16-bit information using Instruction 3 and Instruction 9, respectively.
4
Read only.
Tolerance4
AB1
PR
are

Calculating Actual End-to-End Terminal Resistance

The resistance tolerance is stored in the EEMEM register during factory testing. The actual end-to-end resistance can, therefore, be calculated, which is valuable for calibration, tolerance matching, and precision applications. Note that this value is read only and the R
matches with R
AB2
, typically 0.1%.
AB1
The resistance tolerance in percentage is contained in the last 16 bits of data in EEMEM Register 15. The format is the sign magnitude binary format with the MSB designate for sign (0 = negative and 1 = positive), the next 7 MSB designate the integer number, and the 8 LSB designate the decimal number (see Table 11).
For example, if R shows XXXX XXXX 1001 1100 0000 1111, R
= 250 kΩ and the data in the SDO
AB_RATED
AB_ACTUAL
can be
Table 11. Calculating End-to-End Terminal Resistance
Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Sign Mag Sign 2
7 Bits for Integer Number Decimal
6
25 24 23 22 21 20
calculated as follows:
MSB: 1 = Positive Next 7 LSB: 001 1100 = 28
−8
8 LSB: 0000 1111 = 15 × 2
= 0.06 % Tolerance = 28.06% Therefore, R
AB_ACTUAL
= 320.15 kΩ

RDAC STRUCTURE

The patent-pending RDAC contains multiple strings of equal resistor segments with an array of analog switches that acts as the wiper connection. The number of positions is the resolution of the device. The AD5235 has 1024 connection points, allowing it to provide better than 0.1% settability resolution. Figure 43 shows an equivalent structure of the connections among the three terminals of the RDAC. The SW while the switches SW(0) to SW(2 depending on the resistance position decoded from the data bits. Because the switch is not ideal, there is a 50 Ω wiper resistance, R
. Wiper resistance is a function of supply voltage
W
and temperature. The lower the supply voltage or the higher the temperature, the higher the resulting wiper resistance. Users should be aware of the wiper resistance dynamics, if accurate prediction of the output resistance is needed.
R
RDAC
WIPER
REGISTER
AND
DECODER
R
= RAB/2
S
DIGITAL CIRCUITRY OMITTED FOR CLARITY
S
R
S
R
S
N
Figure 43. Equivalent RDAC Structure
Table 10. Nominal Individual Segment Resistor Values
Device Resolution 25 kΩ 250 kΩ
1024-Step 24.4 244
.
2−1 2−2 2−3 2−4 2−5 2−6 2−7 2−8
Point
8 Bits for Decimal Number
and SWB are always on,
A
N
−1) are on one at a time,
SW
A
A
N
SW(2
1)
W
N
SW(2
2)
SW
(1)
SW
(0)
SW
B
B
02816-B-044
Rev. B | Page 19 of 28
AD5235

PROGRAMMING THE VARIABLE RESISTOR

Rheostat Operation

The nominal resistance of the RDAC between Terminals A and B, R 1024 positions (10-bit resolution). The final digits of the part number determine the nominal resistance value, for example, 25 kΩ = 25; 250 kΩ = 250.
The 10-bit data-word in the RDAC latch is decoded to select one of the 1024 possible settings. The following discussion describes the calculation of resistance R 25 kΩ part. The wiper’s first connection starts at Terminal B for data 0x000. R it is independent of the nominal resistance. The second connection is the first tap point where R 50 Ω = 74.4 Ω for data 0x001. The third connection is the next tap point representing R 0x002, and so on. Each LSB data value increase moves the wiper up the resistor ladder until the last tap point is reached at R
WB
the equivalent RDAC circuit. When R be left floating or tied to the wiper.
The general equation that determines the programmed output resistance between Wx and Bx is
where:
D is the decimal equivalent of the data contained in the RDAC
register.
R
AB
R
W
For example, the output resistance values in Table 12 are set for the given RDAC latch codes (applies to R potentiometers).
, is available with 25 kΩ and 250 kΩ with
AB
at different codes of a
WB
(0) is 50 Ω because of the wiper resistance, and
WB
(1) becomes 24.4 Ω +
WB
(2) = 48.8 Ω + 50 Ω = 98.8 Ω for data
WB
(1023) = 25026 Ω. See Figure 43 for a simplified diagram of
is used, Terminal A can
WB
100
75
)
WF
(D) (% R
50
WB
(D), R
WA
R
25
0
0 1023256
DR +×=
R
WA
Figure 44. R
D
)(
1024
512 768
CODE (Decimal)
(D) and RWB(D) vs. Decimal Code
WA
(1)
RR
W
ABWA
R
WB
is the nominal resistance between Terminals A and B.
is the wiper resistance.
= 25 kΩ digital
AB
02816-B-045
Table 12. RWB (D) at Selected Codes for RAB = 25 kΩ
D (DEC) RWB(D) (Ω) Output State
1023 25,026 Full scale 512 12,550 Midscale 1 74.4 1 LSB 0 50 Zero scale (wiper contact resistor)
Note that, in the zero-scale condition, a finite wiper resistance of 50 Ω is present. Care should be taken to limit the current flow between W and B in this state to no more than 20 mA to avoid degradation or possible destruction of the internal switches.
Like the mechanical potentiometer that the RDAC replaces, the AD5235 part is totally symmetrical. The resistance between Wiper W and Terminal A also produces a digitally controlled complementary resistance, R
. Figure 44 shows the symmetri-
WA
cal programmability of the various terminal connections. When
is used, Terminal B can be left floating or tied to the wiper.
R
WA
Setting the resistance value for R
starts at a maximum value
WA
of resistance and decreases as the data loaded in the latch is increased in value.
The general transfer equation for this operation is
1024
DR +×
=
)(
D
1024
ABWA
(2)
RR
W
For example, the output resistance values in Table 13 are set for the given RDAC latch codes (applies to R
= 25 kΩ digital
AB
potentiometers).
Table 13. RWA(D) at Selected Codes for R
= 25 kΩ
AB
D (DEC) RWA(D) (Ω) Output State
1023 74.4 Full scale 512 12,550 Midscale 1 25,026 1 LSB 0 25,050 Zero scale (wiper contact resistance)
The typical distribution of RAB from channel to channel is ±0.2% within the same package. Device-to-device matching is process lot dependent upon the worst case of ±30% variation. However, the change in R
with temperature has a 35 ppm/°C
AB
temperature coefficient.

PROGRAMMING THE POTENTIOMETER DIVIDER

Voltage Output Operation

The digital potentiometer can be configured to generate an output voltage at the wiper terminal that is proportional to the input voltages applied to Terminals A and B. For example, connecting Terminal A to 5 V and Terminal B to ground produces an output voltage at the wiper that can be any value from 0 V to 5 V. Each LSB of voltage is equal to the voltage applied across Terminal AB divided by the 2 resolution of the potentiometer divider.
N
position
Rev. B | Page 20 of 28
AD5235
Because AD5235 can also be supplied by dual supplies, the general equation defining the output voltage at V
with respect
W
to ground for any given input voltages applied to Terminals A and B is
W
1024
D
DV +×=
)( (3)
Equation 3 assumes that V
VV
B
AB
is buffered so that the effect of
W
wiper resistance is minimized. Operation of the digital potenti­ometer in divider mode results in more accurate operation over temperature. Here, the output voltage is dependent on the ratio of the internal resistors and not the absolute value; therefore, the drift improves to 15 ppm/°C. There is no voltage polarity restriction between Terminals A, B, and W as long as the terminal voltage (V
) stays within VSS < V
TERM
TERM
< VDD.

PROGRAMMING EXAMPLES

The following programming examples illustrate a typical sequence of events for various features of the AD5235. See Table 7 for the instructions and data-word format. The instruction numbers, addresses, and data appearing at the SDI and SDO pins are in hexadecimal format.
Table 14. Scratchpad Programming
SDI SDO Action
0xB00100 0xXXXXXX
0xB10200 0xB00100
Table 15. Incrementing RDAC Followed by Storing the Wiper Setting to EEMEM
SDI SDO Action
0xB00100 0xXXXXXX
0xE0XXXX 0xB00100
0xE0XXXX 0xE0XXXX
0x20XXXX 0xXXXXXX
The EEMEM values for the RDACs can be restored by power­on, by strobing the Table 16.
Writes data 0x100 into RDAC1 register, Wiper W1 moves to 1/4 full-scale position.
Loads data 0x200 into RDAC2 register, Wiper W2 moves to 1/2 full-scale position.
Writes data 0x100 into RDAC1 register, Wiper W1 moves to 1/4 full­scale position.
Increments RDAC1 register by one to 0x101.
Increments RDAC1 register by one to 0x102. Continue until desired wiper position is reached.
Stores RDAC2 register data into EEMEM1. Optionally tie WP protect EEMEM values.
PR
pin, or by the two commands shown in
to GND to
Table 16. Restoring the EEMEM Values to RDAC Registers
SDI SDO Action
0x10XXXX 0xXXXXXX
0x00XXXX 0x10XXXX
Restores the EEMEM1 value to the RDAC1 register.
NOP. Recommended step to minimize power consumption.
Table 17. Using Left-Shift by One to Increment 6 dB Steps
SDI SDO Action
0xC0XXXX 0xXXXXXX
0xC1XXXX 0xC0XXXX
Moves Wiper 1 to double the present data contained in the RDAC1 register.
Moves Wiper 2 to double the present data contained in the RDAC2 register.
Table 18. Storing Additional User Data in EEMEM
SDI SDO Action
0x32AAAA 0xXXXXXX
0x335555 0x32AAAA
Stores data 0xAAAA in the extra EEMEM location USER1. (Allowable to address in 13 locations with a maximum of 16 bits of data.)
Stores data 0x5555 in the extra EEMEM location USER2. (Allowable to address in 13 locations with a maximum of 16 bits of data.)
Table 19. Reading Back Data from Memory Locations
SDI SDO Action
0x92XXXX 0xXXXXXX
0x00XXXX 0x92AAAA
Prepares data read from USER1 EEMEM location.
NOP Instruction 0 sends a 24-bit word out of SDO, where the last 16 bits contain the contents in USER1 EEMEM location. The NOP command ensures that the device returns to the idle power dissipation state.
Table 20. Reading Back Wiper Settings
SDI SDO Action
0xB00200 0xXXXXXX Writes RDAC1 to midscale. 0xC0XXXX 0xB00200
0xA0XXXX 0xC0XXXX
0xXXXXXX 0xA003FF Reads back full-scale value from SDO.
Doubles RDAC1 from midscale to full scale.
Prepares reading wiper setting from RDAC1 register.

AD5235EVAL EVALUATION KIT

Analog Devices offers a user-friendly AD5235EVAL evaluation kit that can be controlled by a personal computer through a printer port. The driving program is self-contained; no programming languages or skills are needed.
Rev. B | Page 21 of 28
AD5235

APPLICATIONS

BIPOLAR OPERATION FROM DUAL SUPPLIES

The AD5235 can be operated from dual supplies ±2.5 V, which enables control of ground referenced ac signals or bipolar operation. AC signals as high as V across Terminals A to B with output taken from Terminal W. See Figure 45 for a typical circuit connection.
V
SS
DD
SCLK
µ
C
MOSI
GND
CS CLK SDI
GND
AD5235
Figure 45. Bipolar Operation from Dual Supplies

GAIN CONTROL COMPENSATION

A digital potentiometer is commonly used in gain control such as the noninverting gain amplifier shown in Figure 46.
R1
47k
C1
11pF
Vi
Figure 46. Typical Noninverting Gain Amplifier
When RDAC B terminal parasitic capacitance is connected to the op amp noninverting node, it introduces a zero for the 1/ϐ term with 20 dB/dec, while a typical op amp GBP has
−20 dB/dec characteristics. A large R2 and finite C1 can cause this zero’s frequency to fall well below the crossover frequency. Therefore, the rate of closure becomes 40 dB/dec, and the system has a 0° phase margin at the crossover frequency. The output can ring or oscillate, if an input is a rectangular pulse or step function. Similarly, it is also likely to ring when switching between two gain values; this is equivalent to a stop change at the input.
Depending on the op amp GBP, reducing the feedback resistor might extend the zero’s frequency far enough to overcome the problem. A better approach is to include a compensation capacitor, C2, to cancel the effect caused by C1. Optimum compensation occurs when R1 × C1 = R2 × C2. This is not an option because of the variation of R2. As a result, one can use the relationship above and scale C2 as if R2 were at its maxi-
DD/VSS
C2
2.2pF
U1
can be applied directly
V
DD
A
±
1.25V p-p
W
B
V
SS
R2
250k BA
W
D = MIDSCALE
V
O
02816-B-047
+2.5V
±
2.5V p-p
–2.5V
mum value. Doing this might overcompensate and compromise the performance when R2 is set at low values. On the other hand, it avoids the ringing or oscillation at the worst case. For critical applications, C2 should be found empirically to suit the need. In general, C2 in the range of a few pF to no more than a few tenths of pF is usually adequate for the compensation.
Similarly, W–A terminal capacitances are connected to the output (not shown); their effect at this node is less significant and the compensation can be avoided in most cases.

HIGH VOLTAGE OPERATION

The digital potentiometer can be placed directly in the feedback or input path of an op amp for gain control, provided that the voltage across Terminals A–B, W–A, or W–B does not exceed |5 V|. When high voltage gain is needed, users should set a fixed gain in an op amp and let the digital potentiometer control the
02816-B-046
adjustable input. Figure 47 shows a simple implementation.
C
2RR
15V
5V
A
AD5235
W
B
Figure 47. 15 V Voltage Span Control
V+
A1
V–
0V TO 15V
V
O
02816-A-048
Similarly, a compensation capacitor C might be needed to dampen the potential ringing when the digital potentiometer changes steps. This effect is prominent when stray capacitance at the inverted node is augmented by a large feedback resistor. Usually, a pF Capacitor C is adequate to combat the problem.
DAC
O
For DAC operation (Figure 48), it is common to buffer the output of the digital potentiometer unless the load is much larger than R
. The buffer serves the purpose of impedance
WB
conversion and can drive heavier loads.
5V
U11
V
GND
2
IN
V
OUT
AD1582
AD5235
3
A
B
5V
W
V+
AD8601
V–
A1
Figure 48. Unipolar 10-Bit DAC
V
O
02816-B-049
Rev. B | Page 22 of 28
AD5235
I

BIPOLAR PROGRAMMABLE GAIN AMPLIFIER

For applications requiring bipolar gain, Figure 49 shows one implementation. Digital potentiometer U1 sets the adjustment range; the wiper voltage V between V
and −KVi at a given U2 setting. Configure A2 as a
i
can, therefore, be programmed
W2
noninverting amplifier that yields a transfer function:
V
O
V
2
R
1 (4)
+= KK
1
R
where K is the ratio of R
AD5235
U2
A2
Vi
A1
AD5235
U1
Figure 49. Bipolar Programmable Gain Amplifier
⎞ ⎟ ⎠
W
B2
B1
W1
2
D
⎛ ⎜
1024
WB1/RWA 1
V
V+
OP2177
V–
A
V
DD
SS
)1(
+××
⎟ ⎠
set by U1.
OP2177
A2
–kVi
V
DD
V+
V–
R2
V
SS
R1
V
O
C
02816-B-050
In the simpler (and much more usual) case where K = 1, VO is simplified to
2
D
2
R
1
V ×
O
+= 1
1024
1
R
2
V
(5)
i
Table 21 shows the result of adjusting D2, with A2 configured as a unity gain, a gain of 2, and a gain of 10. The result is a bipolar amplifier with linearly programmable gain and 1024-step resolution.
Table 21. Result of Bipolar Gain Amplifier
D R1 = ∞, R2 = 0 R1 = R2 R2 = 9 R1
0 −1 −2 −10 256 −0.5 −1 −5 512 0 0 0 768 0.5 1 5 1023 0.992 1.984 9.92

10-BIT BIPOLAR DAC

If the circuit in Figure 49 is changed with the input taken from a precision reference, U1 is set to midscale, and A2 is configured as a buffer, a 10-bit bipolar DAC can be realized (Figure 48). Compared to the conventional DAC, this circuit offers comparable resolution, but not the precision because of the wiper resistance effects. Degradation of the nonlinearity and temperature coefficient is prominent near the low values of the adjustment range. On the other hand, this circuit offers a unique
nonvolatile memory feature that in some cases outweighs any shortfall in precision.
Without consideration of the wiper resistance, the output of this circuit is approximately
2
D
V ×
O
Vi 26U3
VINV
OUT
+2.5V
5
TRIM
GND
ADR421
U1 = MIDSCALE
1024
REF
2
= 1
V
(6)
REF
+2.5V
W2
U2
B2
A2
A1
B1
W1 U1
+2.5V
V+
AD8552
V–
A1
–2.5V
–2.5V
V+
AD8552
V–
A2
–2.5V
REF
U1 = U2 = AD5235
V
O
02816-B-051
Figure 50. 10-Bit Bipolar DAC

PROGRAMMABLE VOLTAGE SOURCE WITH BOOSTED OUTPUT

For applications that require high current adjustment, such as a laser diode driver or tunable laser, a boosted voltage source can be considered (see Figure 51).
V
IN
AD5235
A
W
B
U2
AD8601
2N7002
SIGNAL
V+
V–
Figure 51. Programmable Booster Voltage Source
In this circuit, the inverting input of the op amp forces the V to be equal to the wiper voltage set by the digital potentiometer. The load current is then delivered by the supply via the N-Ch FET N
. N1 power handling must be adequate to dissipate
1
(V
− VO) × IL power. This circuit can source a maximum of
i
100 mA with a 5 V supply.
For precision applications, a voltage reference such as ADR421, ADR03, or ADR370 can be applied at Terminal A of the digital potentiometer.
V
OUT
R
BIAS
C
C
I
L
LD
02816-B-052
OUT
Rev. B | Page 23 of 28
AD5235
A
5
+
V

PROGRAMMABLE CURRENT SOURCE

A programmable current source can be implemented with the circuit shown in Figure 52.
+5V
U1
2
V
IN
3
SLEEP
REF191
GND
4
–2.048VTO V
AD5235
V
OUT
L
0 TO (2.048 + VL)
6
C1
1
µ
F
+5V
V+
OP1177
V–
–5V
B
W
A
U2
+
100
R
S
102
V
L
R
L
I
L
02861-B-053
Figure 52. Programmable Current Source
REF191 is a unique low supply headroom and high current handling precision reference that can deliver 20 mA at 2.048 V. The load current is simply the voltage across Terminals B–W of the digital potentiometer divided by R
×
DV
REF
=
I (7)
L
1024×
R
S
:
S
The circuit is simple, but be aware that there are two issues. First, dual-supply op amps are ideal, because the ground potential of REF191 can swing from −2.048 V at zero scale to V
L
at full scale of the potentiometer setting. Although the circuit works under single supply, the programmable resolution of the system is reduced by half. Second, the voltage compliance at V
L
is limited to 2.5 V or equivalently a 125 Ω load. Should higher voltage compliance be needed, users can consider digital potentiometers AD5260, AD5280, and AD7376. Figure 53 shows an alternate circuit for high voltage compliance.
To achieve higher current, such as when driving a high power LED, the user can replace the U1 with an LDO, reduce R
, and
S
add a resistor in series with the digital potentiometer’s A terminal. This limits the potentiometer’s current and increases the current adjustment resolution.

PROGRAMMABLE BIDIRECTIONAL CURRENT SOURCE

For applications that require bidirectional current control or higher voltage compliance, a Howland current pump can be a solution (Figure 53). If the resistors are matched, the load current is
BRAR
+
22
R
I ×
=
1
BR
2
(8)
V
WL
D523
+2.5V
A
B
–2.5V
+15V
+
V+
W
OP2177
A1
–15V
Figure 53. Programmable Bidirectional Current S ource
R2B, in theory, can be made as small as necessary to achieve the current needed within the A2 output current-driving capability. In this circuit, OP2177 delivers ±5 mA in either direction, and the voltage compliance approaches 15 V. Without the additions of C1 and C2, the output impedance (looking into V shown as
=
Z
0
can be infinite, if resistors R1' and R2' match precisely with
Z
O
R1 and R2A + R2B, hand, Z
can be negative, if the resistors are not matched and
O
cause oscillation. As a result, C1, in the range of a few pF, is needed to prevent oscillation from the negative impedance.

PROGRAMMABLE LOW-PASS FILTER

In analog-to-digital conversions, it is common to include an antialiasing filter to band limit the sampling signal. The dual­channel AD5235 can, therefore, be used to construct a second­order Sallen-Key low-pass filter, as shown in Figure 54.
R1
B
A
i
The design equations are
V
O
V
i
W
R
ADJUSTED
CONCURRENTLY
Figure 54. Sallen-Key Low-Pass Filter
ω
= (10)
ω
2
+
S
Q
R1
150k
V–
respectively, which is desirable. On the other
R1
150k
)(
R2AR1R2BR1'
)(
R2BR2AR1'R2'R1
+
R2
15k
C1
+15V
10pF
V+
OP2177
V–
+
–15V
R2A
14.95k
R2B
A2
50
V
L
R
L
500
I
L
) can be
L
(9)
C1
+2.5V
R2
B
A
W
R
C2
2
f
f
2
ω+
S
f
V+
AD8601
V–
–2.5V
V
O
U1
02816-B-055
02816-B-054
Rev. B | Page 24 of 28
AD5235
2
C
C
=ω (11)
O
Q =
1
C2C1R2R1
1
1
+
C1R1
(12)
C2R2
Users can first select some convenient values for the capacitors. To achieve maximally flat bandwidth, where Q = 0.707, let C1 be twice the size of C2 and let R1 equal R2. As a result, the user can adjust R1 and R2 concurrently to the same setting to achieve the desirable bandwidth.

PROGRAMMABLE OSCILLATOR

In a classic Wien-bridge oscillator, shown in Figure 55, the Wien network (R, R
R2 provide negative feedback.
At the resonant frequency, fO, the overall phase shift is zero, and the positive feedback causes the circuit to oscillate. With R = R
', and R2 = R2A /(R2B + R
C = C is
where R is equal to R
R
At resonance, setting
'C, C') provides positive feedback, while R1 and
FREQUENCY
ADJUSTMENT
C
25k
.2nF
R = R' = AD5235 R2B = AD5231 D1 = D2 = 1N4148
VP
B
R
W
A
Figure 55. Programmable Oscillator with Amplitude Control
O
=
1
=ω
R
1024
1024
or
D
R
1
f
O
R
π=2
such that
WA
(14)
AB
R'
C'
25k
B
A
2.2nF W
+2.5V
U1
+
V+
OP1177
V–
R2A
2.1k
–2.5V
R2B
10k
BA
W
R1 1k
AMPLITUDE
ADJUSTMENT
), the oscillation frequency
DIODE
V
O
D1
D2
02816-B-056
(13)
',
Once the frequency is set, the oscillation amplitude can be turned by R2B, because
2
O
3
, ID, and VD are interdependent variables. With proper
V
O
selection of R2B, an equilibrium is reached such that V
(16)
VR2BIV +=
DD
WF
converges. R2B can be in series with a discrete resistor to increase the amplitude, but the total resistance cannot be too large to saturate the output.
In both circuits shown in Figure 54 and Figure 55, the frequency tuning requires that both RDACs be adjusted concurrently to the same settings. Because the two channels might be adjusted one at a time, an intermediate state occurs that might not be acceptable for some applications. Of course, the increment/ decrement instructions (5, 7, 13, and 15) can all be used. Different devices can also be used in daisy-chain mode so that parts can be programmed to the same settings simultaneously.

OPTICAL TRANSMITTER CALIBRATION WITH ADN2841

The AD5235, together with the multirate 2.7 Gbps laser diode driver ADN2841, forms an optical supervisory system in which the dual digital potentiometers can be used to set the laser average optical power and extinction ratio (Figure 56). AD5235 is particularly suited for the optical parameter settings because of its high resolution and superior temperature coefficient characteristics.
CLK
SDI
CS
AD5235
CONTROL
ADN2841
DIN
DINQ
IDTONE
W1
B1 W2
B2
PSET
ERSET
DIN
DINQ
EEMEM
EEMEM
RDAC1
A1
RDAC2
A2
Figure 56. Optical Supervisory System
V
CC
IMPD
IMODP
IBIAS
IDTONE
V
CC
02816-B-057
R2
(15)
2=
R1
balances the bridge. In practice, R2/R1 should be set slightly larger than 2 to ensure that the oscillation can start. On the other hand, the alternate turn-on of the diodes D1 and D2 ensures that R2/R1 is smaller than 2, momentarily stabilizing the oscillation.
Rev. B | Page 25 of 28
The ADN2841 is a 2.7 Gbps laser diode driver that uses a unique control algorithm to manage the laser’s average power and extinction ratio after the laser’s initial factory calibration. The ADN2841 stabilizes the laser’s data transmission by continuously monitoring its optical power and correcting the variations caused by temperature and the laser’s degradation over time. In the ADN2841, the I
monitors the laser diode
MPD
current. Through its dual loop power and extinction ratio
AD5235
A
+
×
control calibrated by the AD5235’s dual RDACs, the internal driver controls the bias current, I average power. It also regulates the modulation current, I
, and consequently the
BIAS
MODP
, by changing the modulation current linearly with slope efficiency. Any changes in the laser threshold current or slope efficiency are, therefore, compensated. As a result, this optical supervisory system minimizes the laser characterization efforts and, therefore, enables designers to apply comparable lasers from multiple sources.

RESISTANCE SCALING

The AD5235 offers 25 kΩ or 250 kΩ nominal resistance. For users who need lower resistance but must still maintain the number of adjustment steps, they can parallel multiple devices. For example, Figure 57 shows a simple scheme of paralleling two channels of RDACs. To adjust half the resistance linearly per step, users need to program both RDACs concurrently with the same settings.
A1
B1
Figure 57. Reduce Resistance by Half with Linear Adjustment Characteristics
In voltage divider mode, by paralleling a discrete resistor as shown in Figure 58, a proportionately lower voltage appears at Terminal A-to-B. This translates into a finer degree of precision, because the step size at Terminal W is smaller. The voltage can be found as follows:
W
+
RRR
AB
R2
Figure 58. Lowering the Nominal Resistance
)//(
RR
2
AB
)(
DV ××
=
Figure 57 and Figure 58 show that the digital potentiometers change steps linearly. On the other hand, pseudolog taper adjustment is usually preferred in applications such as audio control. Figure 59 shows another type of resistance scaling. In this configuration, the smaller the R2 with respect to R more the pseudolog taper characteristic of the circuit behaves.
A2
W1
1024//
23
R3
R1
W2
B2
02816-B-058
D
A
B
(17)
V
DD
V
DD
W
02816-B-059
0
AB
, the
1
W1
B1
Figure 59. Resistor Scaling with Pseudo Log Adjustment Characteristics
R
02816-B-060
The equation is approximated as
RD
51200
AB
AB
(18)
RRD
×++×
102451200
R
=
eq
Users should also be aware of the need for tolerance matching as well as for temperature coefficient matching of the components.
RESISTANCE TOLERANCE, DRIFT, AND TEMPERATURE COEFFICIENT MISMATCH CONSIDERATIONS
In a rheostat mode operation such as gain control (see Figure 60), the tolerance mismatch between the digital potenti­ometer and the discrete resistor can cause repeatability issues among various systems. Because of the inherent matching of the silicon process, it is practical to apply the dual-channel device in this type of application. As such, R1 can be replaced by one of the channels of the digital potentiometer and programmed to a specific value. R2 can be used for the adjustable gain. Although it adds cost, this approach minimizes the tolerance and temperature coefficient mismatch between R1 and R2. This approach also tracks the resistance drift over time. As a result, these less than ideal parameters become less sensitive to system variations.
R2
AB
W
R1*
*REPLACED WITH ANOTHER
CHANNEL OF RDAC
Figure 60. Linear Gain Control with Tracking Resistance Tolerance, Drift,
and Temperature Coefficient
Note that the circuit in Figure 61 can track tolerance, temperature coefficient, and drift in this particular application. The characteristic of the transfer function is, however, a pseudo­logarithmic rather than a linear gain function.
C1
AD8601
+
V
i
U1
V
O
02816-B-061
Rev. B | Page 26 of 28
AD5235
R
AB
C1
W
AD8601
+
V
i
U1
V
O
02816-B-062
Figure 61. Nonlinear Gain Control with Tracking Resistance Tolerance
and Drift

RDAC CIRCUIT SIMULATION MODEL

The internal parasitic capacitances and the external capacitive loads dominate the ac characteristics of the RDACs. Configured as a potentiometer divider, the −3 dB bandwidth of the AD5235 (25 kΩ resistor) measures 125 kHz at half-scale. Figure 14 provides the large signal BODE plot characteristics of the two available resistor versions, 25 kΩ and 250 kΩ. A parasitic simulation model is shown in Figure 62.
RDAC
A
11pF
C
25k
A
80pF
W
C
B
11pF
B
02816-B-063
Figure 62. RDAC Circuit Simulation Model (RDAC = 25 kΩ)
The following code provides a macro model net list for the 25 kΩ RDAC:
.PARAM D = 1024, RDAC = 25E3 * .SUBCKT DPOT (A, W, B) * CA A 0 11E-12 RWA A W {(1-D/1024)* RDAC + 50} CW W 0 80E-12 RWB W B {D/1024 * RDAC + 50} CB B 0 11E-12 * .ENDS DPOT
Rev. B | Page 27 of 28
AD5235

OUTLINE DIMENSIONS

5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153AB
0.10
0.30
0.19
9
81
1.20 MAX
SEATING PLANE
6.40
BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 63. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters

ORDERING GUIDE

R
Model
WB_FS
(kΩ) RDNL RINL
AD5235BRU25 25 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 96 5235B25 AD5235BRU25-RL7 25 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 1,000 5235B25 AD5235BRUZ252 25 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 96 5235B25 AD5235BRUZ25-RL72 25 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 1,000 5235B25 AD5235BRU250 250 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 96 5235B250 AD5235BRU250-RL7 250 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 1,000 5235B250 AD5235BRUZ2502 250 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 96 5235B250 AD5235BRUZ250-RL72 250 ±2 ±4 −40°C to +85°C TSSOP-16 RU-16 1,000 5235B250 AD5235EVAL25 25 1 AD5235EVAL250 250 1
1
Line 1 contains the ADI logo followed by the date code, YYWW. Line 2 contains the model number followed by the end-to-end resistance value (note: D = 250 kΩ). —OR— Line 1 contains the model number. Line 2 contains the ADI logo followed by the end-to-end resistance value. Line 3 contains the date code, YYWW.
2
Z = Pb-free part.
Temperature Range
Package Description
Package Option
Ordering Quantity Branding
1
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C02816–0–7/04(B)
Rev. B | Page 28 of 28
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