Datasheet AD5066 Datasheet (ANALOG DEVICES)

Fully Accurate, 16-Bit, Unbuffered V
V
A
V
, Quad SPI
OUT

FEATURES

Low power quad 16-bit nanoDAC, ±1 LSB INL Low total unadjusted error of ±0.1 mV typically Low zero code error of 0.05 mV typically Individually buffered reference pins
2.7 V to 5.5 V power supply Specified over full code range of 0 to 65535 Power-on reset to zero scale or midscale Per channel power-down with 3 power-down functions Hardware
function to programmable code
CLR Small 16-lead TSSOP

APPLICATIONS

Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources

GENERAL DESCRIPTION

The AD5066 is a low power, 16-bit quad-channel, unbuffered voltage output nanoDAC offering relative accuracy specifica­tions of ±1 LSB INL with individual reference pins and can operate from a single 2.7 V to 5.5 V supply. The AD5066 also offers a differential accuracy specification of ±1 LSB DNL. Reference buffers are also provided on-chip. The part uses a versatile 3-wire, low power Schmitt trigger serial interface that operates at clock rates up to 50 MHz and is compatible with standard SPI®, QSPI™, MICROWIRE™, and most DSP interface standards. The AD5066 incorporates a power-on reset circuit that ensures the DAC output powers up to zero scale or midscale and remains there until a valid write to the device takes place.
with software
LDAC
override function
LDAC
Interface, 2.7 V to 5.5 V nanoDAC in a TSSOP
AD5066
Total unadjusted error for the part is <0.8 mV. Zero code error for the part is 0.05 mV typically.
The AD5066 contains a power-down feature that reduces the current consumption of the device to typically 400 nA at 5 V and provides software selectable output loads while in power­down mode.
The outputs of all DACs can be updated simultaneously using the hardware user software selectable DAC channels to update simultaneously. There is also an asynchronous software-selectable code—0 V, midscale, or full scale.

PRODUCT HIGHLIGHTS

1. Quad channel available in 16-lead TSSOP, ±1 LSB INL.
2. Individually buffered voltage reference pins.
3. TUE = ±0.8 mV max and zero code error = 0.1 mV max.
4. High speed serial interface with clock speeds up to 50 MHz.
5. Three power-down modes available to the user.
6. Reset to known output voltage (zero scale or midscale).
Table 1. Related Devices
Part No. Description
AD5666 Quad,16-bit buffered DAC,16 LSB INL, TSSOP AD5025/AD5045/AD5065
AD5024/AD5044/AD5064 AD50621 Single, 16-bit nanoDAC, SOT-23 AD5063 AD5061 Single,16-bit nanoDAC, ±4 LSB INL, SOT-23 AD5040/AD5060
1
±1 LSB INL
LDAC
function, with the added functionality of
CLR
that clears all DACs to a
1
Dual,12-/14-/16-bit buffered nanoDAC, TSSOP
1
Quad 16-bit nanoDAC, TSSOP
1
1
Single, 16-bit nanoDAC, MSOP
14-/16-bit nanoDAC, SOT-23

FUNCTIONAL BLOCK DIAGRAM

V
DD
AD5066
SCLK
SYNC
DIN
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
LDAC
INTERFACE
LOGIC
LDAC
CLR
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
POWER-ON RESET
POR
DAC
REGIS TER
DAC
REGIS TER
DAC
REGIS TER
DAC
REGIS TER
Figure 1.
REF
V
REF
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
B
REF
DAC A
DAC B
DAC C
DAC D
POWER-DOW N LOGI C
C V
D
REF
GND
V
A
OUT
B
V
OUT
V
C
OUT
V
D
OUT
06845-001
AD5066

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
AC Characteristics ........................................................................ 4
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Terminolog y .................................................................................... 14
Theory of Operation ...................................................................... 15
Digital-to-Analog Converter .................................................... 15
DAC Architecture ....................................................................... 15
Reference Buffer ......................................................................... 15
Serial Interface ............................................................................ 15
Input Shift Register .................................................................... 15
Power-On Reset .......................................................................... 17
Clear Code Register ................................................................... 18
LDAC
Function ........................................................................... 18
Power Supply Bypassing and Grounding ................................ 19
Microprocessor Interfacing ....................................................... 19
Applications Information .............................................................. 21
Using a Reference as a Power Supply ....................................... 21
Bipolar Operation....................................................................... 21
Using the AD5066 with a Galvanically Isolated Interface .... 21
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 22

REVISION HISTORY

7/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
AD5066

SPECIFICATIONS

VDD = 2.7 V to 5.5 V, 2.0 V ≤ V
REF
A, V
REF
B, V
REF
C, V
D ≤ VDD − 0.4 V, all specifications T
REF
MIN
to T
, unless otherwise noted.
MAX
Table 2.
1
Parameter
STATIC PERFORMANCE
A Grade
Min Typ Max Min Typ Max
2
Resolution 16 16 Bits Relative Accuracy (INL) ±0.5 ±4 ±0.5 ±1 LSB TA = −40°C to +105°C ±0.5 ±4 ±0.5 ±2 TA = −40°C to +125°C Differential Nonlinearity (DNL) ±0.2 ±1 ±0.2 ±1 LSB Total Unadjusted Error (TUE) ±0.1 ±0.8 ±0.1 ±0.8 mV VDD = 2.7 V, V Zero-Code Error 0.05 0.1 0.05 0.1 mV All 0s loaded to the DAC register Zero-Code Error Drift
3
±0.5 ±0.5 µV/°C Full-Scale Error ±0.01 ±0.05 ±0.01 ±0.05 % FSR All 1s loaded to the DAC register Gain Error ±0.005 ±0.05 ±0.005 ±0.05 % FSR Gain Error Drift3 DC Crosstalk3
±0.5 ±0.5 ppm ppm of FSR/°C
1 5 1 5 V Due to single-channel full-scale
5 25 5 25 V Due to powering down (per channel)
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 V DC Output Impedance (Normal
0 V
REF
8 8 kΩ Output impedance tolerance ± 10%
Mode)
DC Output Impedance DAC in power-down mode
Output Connected to 100 kΩ
100 100 kΩ Output impedance tolerance ± 20 kΩ
Network
Output Connected to 1 kΩ
1 1 kΩ Output impedance tolerance ± 400 Ω
Network Power-Up Time4 2.9 2.9 µs DC PSRR −120 −120 dB VDD ± 10%, DAC = full scale
REFERENCE INPUTS
Reference Input Range 2 V
− 0.4 2 VDD − 0.4 V
DD
Reference Current 0.002 ±1 0.002 ±1 µA Per DAC channel Reference Input Impedance 40 40 MΩ Per DAC channel
LOGIC INPUTS3
Input Current5 ±1 ±1 µA Input Low Voltage, V Input High Voltage, V
0.8 0.8 V
INL
2.2 2.2 V
INH
Pin Capacitance 4 4 pF
POWER REQUIREMENTS
VDD 2.7 5.5 2.7 5.5 V All digital inputs at 0 V or VDD DAC active, excludes load current IDD V Normal Mode6 2.5 3 2.5 3 mA All Power-Down Modes7 0.4 0.4 µA
1
Temperature range is −40°C to +125°C, typical at 25°C.
2
Linearity calculated using a code range of 0 to 65,535; output unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Time taken to exit power-down mode and enter normal mode, 32nd clock edge to 90% of DAC midscale value, output unloaded.
5
Current flowing into individual digital pins. VDD = 5.5 V; VREF = 4.096 V; Code = midscale.
6
Interface inactive. All DACs active. DAC outputs unloaded.
7
All four DACs powered down.
B Grade
1
Unit Conditions/Comments
V
REF
= 2 V
REF
output change
= VDD and VIL = GND
IH
Rev. 0 | Page 3 of 24
AD5066

AC CHARACTERISTICS

VDD = 2.7 V to 5.5 V, 2.0 V ≤ V
REF
A, V
REF
B, V
REF
C, V
D ≤ VDD − 0.4 V all specifications T
REF
MIN
to T
, unless otherwise noted.
MAX
Table 3.
Parameter
1, 2
Min Ty p Max Unit Conditions/Comments3
DYNAMIC PERFORMACE
Output Voltage Settling Time 7.5 10 µs
¼ to ¾ scale settling to ±2 LSB, single channel update, output unloaded
Output Voltage Settling Time 12 15 µs
¼ to ¾ scale settling to ±2 LSB, all channel update, output
unloaded Slew Rate 1.7 V/µs Digital-to-Analog Glitch Impulse 3 nV-sec 1 LSB change around major carry Reference Feedthrough −70 dB V
= 3 V ± 0.5 V p-p, frequency = 60 Hz to 20 MHz
REF
Digital Feedthrough 0.02 nV-sec Digital Crosstalk 1.7 nV-sec Analog Crosstalk 3.7 nV-sec DAC-to-DAC Crosstalk 5.4 nV-sec Total Harmonic Distortion −83 dB V
= 3 V ± 0.2 V p-p, frequency = 10 kHz
REF
Output Noise Spectral Density 30 nV/√Hz DAC code = 0x8000, 1 kHz 25 nV/√Hz DAC code = 0x8000, 10 kHz Output Noise 4.7 V p-p 0.1 Hz to 10 Hz
1
Temperature range is −40°C to +125°C, typical at +25°C.
2
See the Terminology section.
3
Guaranteed by design and characterization; not production tested.
Rev. 0 | Page 4 of 24
AD5066

TIMING CHARACTERISTICS

All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2, VDD = 2.7 V to
5.5 V, all specifications T
Table 4.
Parameter1 Symbol Min Typ M ax Uni t SCLK Cycle Time t1 20 ns SCLK High Time t2 10 ns SCLK Low Time t3 10 ns SYNC to SCLK Falling Edge Set-Up Time Data Set-Up Time t5 5 ns Data Hold Time t6 5 ns SCLK Falling Edge to SYNC Rising Edge Minimum SYNC high time
Single Channel Update 2 µs
All Channel Update 8 µs SYNC Rising Edge to SCLK Fall Ignore LDAC Pulse Width Low SCLK Falling Edge to LDAC Rising Edge CLR Pulse Width Low SCLK Falling Edge to LDAC Falling Edge CLR Pulse Activation Time
1
Maximum SCLK frequency is 50 MHz. Guaranteed by design and characterization; not production tested.
SCLK
SYNC
DIN
LDAC
to T
MIN
1
, unless otherwise noted. See Figure 2.
MAX
t
1
t
t
8
DB31
t
4
t
t
3
t
6
5
2
DB0
t
17 ns
4
t
5 30 ns
7
t
8
t
17 ns
9
t
20 ns
10
t
20 ns
11
t
10 ns
12
t
10 ns
13
t
10.6 µs
14
t
9
t
7
t
10
t
13
t
11
2
LDAC
t
CLR
V
OUT
1
ASYNCHRONOUS LDAC UPDATE MODE.
2
SYNCHRONOUS LDAC UPDATE MODE.
12
t
14
06845-003
Figure 2. Serial Write Operation
Rev. 0 | Page 5 of 24
AD5066

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to GND −0.3 V to +7 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V V
x to GND −0.3 V to VDD + 0.3 V
OUT
V
x to GND −0.3 V to VDD + 0.3 V
REF
Operating Temperature Range
Industrial −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ TSSOP Package
Power Dissipation (TJ
θJA Thermal Impedance 150.4°C/W Reflow Soldering Peak Temperature
SnPb 240°C
Pb-Free 260°C
) +150°C
MAX
− TA)/θJA
MAX
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. 0 | Page 6 of 24
AD5066
V

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

LDAC
SYNC
V
REF
V
REF
V
OUT
OUT
POR
V
DD
B
A
A
C
1
2
3
AD5066
4
TOP VIEW
5
(Not to Scal e)
6
7
8
16
SCLK
15
DIN
14
GND
13
B
V
OUT
12
V
D
OUT
11
V
D
REF
10
CLR
9
C
V
REF
06845-004
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1
LDAC
Load DAC. Logic input. This is used to update the DAC register and, consequently, the analog outputs. When tied permanently low, the addressed DAC register is updated on the falling edge of the 32 clock. If LDAC
is held high during the write cycle, the addressed DAC input shift register is updated but the output is held off until the falling edge of LDAC. In this mode, all analog outputs can be updated simultaneously on the falling edge of LDAC.
2
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes
SYNC
low, it powers on the SCLK and DIN buffers and enables the shift register. Data is transferred in on the falling edges of the next 32 clocks. If SYNC
is taken high before the 32nd falling edge, the rising edge of
SYNC acts as an interrupt, and the write sequence is ignored by the device.
3 VDD
Power Supply Input. The AD5066 can be operated from 2.7 V to 5.5 V. Decouple the supply with a 10 µF capacitor in parallel with a 0.1 µF capacitor to GND.
4 V 5 V 6 V 7 V 8 POR
B External Reference Voltage Input for DAC B.
REF
A External Reference Voltage Input for DAC A.
REF
A Unbuffered Analog Output Voltage from DAC A.
OUT
C Unbuffered Analog Output Voltage from DAC C.
OUT
Power-On Reset Pin. Tying this pin to GND powers the DAC outputs to zero scale on power-up. Tying this pin to VDD powers the DAC outputs to midscale.
9 V 10
11 V 12 V 13 V
C External Reference Voltage Input for DAC C.
REF
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are
CLR
ignored. When CLR contained in the CLR
D External Reference Voltage Input for DAC D.
REF
D Unbuffered Analog Output Voltage from DAC D.
OUT
B Unbuffered Analog Output Voltage from DAC B.
OUT
is activated, the input register and the DAC register are updated with the data
code register—zero, midscale, or full scale. Default setting clears the output to 0 V.
14 GND Ground Reference Point for All Circuitry on the Part. 15 DIN
Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on the falling edge of the serial clock input.
16 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates of up to 50 MHz.
nd
Rev. 0 | Page 7 of 24
AD5066

TYPICAL PERFORMANCE CHARACTERISTICS

0.3
0.2
0.1
0
–0.1
–0.2
INL ERROR (LSB)
–0.3
VDD = 5V V
= 4.096V
–0.4
–0.5
REF
T
= 25°C
A
0 10,000 20,000 30, 000 40,000 50,000 60,000
CODE
Figure 4. INL Error vs. Code
0.3 VDD = 5V
= 4.096V
V
REF
0.2
= 25°C
T
A
0.1
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
–0.4
0 10,000 20,000 30,000 40, 000 50, 000 60,000
CODE
Figure 5. DNL Error vs. Code
0.5
0.4
0.3
0.2
0.1
0
INL (LSB)
–0.1
–0.2
–0.3
VDD = 5V T
–0.4
–0.5
6845-105
= 25°C
A
2345
MAX INL
MIN INL
REFERENCE VOLTAGE (V)
06845-108
Figure 7. INL vs. Reference Input Voltage
0.5
0.4
0.3
0.2
0.1
0
DNL (LSB)
–0.1
–0.2
–0.3
VDD = 5.5V
–0.4
T
= 25°C
A
–0.5
2345
06845-106
MAX DNL
MIN DNL
REFERENCE VOLTAGE (V)
06845-109
Figure 8. DNL vs. Reference Input Voltage
0.03
0.02
0.01
0
–0.01
–0.02
–0.03
TOTAL UNADJUSTED ERROR (mV)
–0.04
–0.05
–0.06
–0.07
VDD = 5V V
= 4.096V
REF
T
= 25°C
A
0 10,000 20,000 30,000 40,000 50, 000 60,000
CODE
Figure 6. Total Unadjusted Error vs. Code
06845-107
Rev. 0 | Page 8 of 24
100
80
60
40
20
0
–20
–40
–60
TOTAL UNADJUST ED ERROR (µV)
VDD = 5.5V
–80
T
= 25°C
A
–100
234
MAX TUE
MIN TUE
REFERENCE VOL TAGE (V)
Figure 9. Total Unadjusted Error vs. Reference Input Voltage
5
6845-110
AD5066
0.010
0.005
0
GAIN ERROR (%FSR)
–0.005
V
= 5.5V
DD
T
= 25°C
A
–0.010
2345
REFERENCE VOLTAGE (V)
Figure 10. Gain Error Vs. Reference Input Voltage
06845-111
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL (LSB)
–0.4
–0.6
–0.8
–1.0
–1.2
VDD = 5V V
= 4.096V
REF
–40 –20 0 20 40 60 80 100 120
MAX DNL
MIN DNL
TEMPERATURE (° C)
Figure 13. DNL vs. Temperature
06845-114
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
ZERO-SCALE ERROR (mV)
VDD = 5.5V
0.02
T
= 25°C
A
0.01
0
2345
REFERENCE VOL TAGE (V)
6845-112
Figure 11. Zero-Code Error Vs. Reference Input Voltage
1.2
1.0
0.8
0.6
0.4
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
= 5V
V
DD
V
= 4.096V
REF
–40 –20 0 20 40 60 80 100 120
MAX INL
MIN INL
TEMPERATURE (° C)
06845-113
Figure 12. INL vs. Temperature
100
80
60
40
20
0
–20
–40
–60
TOTAL UNADJUSTED ERROR (µV )
–80
–100
VDD = 5V V
= 4.096V
REF
–40 –20 0 20 40 60 80 100 120
MAX TUE
MIN TUE
TEMPERATURE (° C)
Figure 14. Total Unadjusted Error vs. Temperature
50
40
30
20
10
0
–10
–20
–30
ZERO-SCALE ERROR (µV)
–40
–50
VDD = 5V
= 4.096V
V
REF
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (° C)
Figure 15. Zero-Code Error vs. Temperature
06845-115
6845-116
Rev. 0 | Page 9 of 24
AD5066
R %
0.0020
0.0015
0.0010
0.0005
0
–0.0005
GAIN ERROR (%F SR)
–0.0010
–0.0015
–0.0020
VDD = 5V V
= 4.096V
REF
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (° C)
Figure 16. Gain Error vs. Temperature
06845-117
7
VDD = 5V DAC OUTPUT UNLOADED
6
T
= 25°C
A
5
4
HITS
3
2
1
0
2.45
2.50 2.55 2.60 2. 65 2.70
Figure 19. IDD Histogram VDD = 5.5 V
IDD POWER-UP (mA)
06845-120
0.010
0.005
FSR)
0
OR (
ER
–0.005
–0.010
VDD = 5V V
= 4.096V
REF
T
= 25°C
A
2.7 3.2 3.7 4.2 4. 7 5.2 VDD (V)
FULL-SCALE ERROR
GAIN ERROR
Figure 17. Gain Error and Full-Scale Error vs. Supply Voltage
20
15
10
VDD = 5V
ZERO-SCALE Error (µV)
5
V
= 4.096V
REF
T
= 25°C
A
60
50
40
30
HITS
20
10
0
0.2 0.4 0.6
06845-118
I
POWERDOWN (µA)
DD
= 5V
V
DD
T
= 25°C
A
DAC OUTPUT UNLO ADED
+125°C IDD POWERDOW N +25°C I
POWERDOWN
DD
–40°C I
POWERDOWN
DD
0.8 1.0
06845-139
Figure 20. IDD Power-Down Histogram
5
VDD = 5.5V V
= 4.096V
REF
T
= 25°C
A
4
3
(mA)
DD
I
2
1
0
2.7 3.7 4.7 VDD (V)
Figure 18. Zero-Code Error vs. Supply Voltage
06845-119
0
0 10,000 20, 000 30,000 40,00 0
DAC CODE
Figure 21. IDD vs. Code
50,000 60,000
06845-121
Rev. 0 | Page 10 of 24
AD5066
5
VDD = 5.5V V
= 4.096V
REF
T
= 25°C
A
CODE = MIDSCALE
4
3
(mA)
DD
I
2
1
0
–40 –20 0 20 40
TEMPERATURE (° C)
Figure 22. IDD vs. Temperature
5
V
= 4.096V
REF
= 25°C
T
A
CODE = MIDSCALE
4
3
(mA)
DD
I
2
1
0
2.7 3.0 3.5 4. 0 4.5 SUPPLY VOLTAGE (V)
Figure 23. IDD vs. Supply Voltage
60 80 100 120
06845-122
5.0 5.5
06845-123
3.5
1/4 TO 3/ 4
3.0
2.5
2.0
1.5
OUTPUT VOLTAGE (V)
1.0 VDD = 4.5V
= 4.096V
V
REF
0.5
OUTPUT AMPLIFIER = AD797
= 25°C
T
A
DAC LOAD = 9pF
0
012345678910
3/4 TO 1/ 4
TIME (µs)
Figure 25. Settling Time
V
DD
V
REF
V
OUT
V
= 4.096V
REF
T
= 25°C
A
CH1 2.00V
CH3 2.00V
CH2 2.00V M10.00ms A CH1 640mV
T 30.20%
Figure 26. POR to 0 V
6845-125
06845-126
10
VDD = 5.5V
= 4.096V
V
REF
= 25°C
T
A
8
6
(mA)
DD
I
4
2
0
0123456
DIGITAL INPUT VOLTAGE (V)
Figure 24. IDD vs. Digital Input Voltage
06845-124
Rev. 0 | Page 11 of 24
VDD = 5.5V V
= 4.096V
REF
CH1 2.00V
CH3 2.00V
V
DD
V
REF
V
OUT
CH2 2.00V M10.00ms A CH1 640mV
T 30.20%
Figure 27. POR to MS
06845-127
AD5066
15
CH1 = SCLK
1
CH2 = V
OUT
2
CH1 5V CH2 500mV M2µs A CH2 1.2V
VDD = 5V POWER-UP T O MIDSCALE OUTPUT UNLOADED
T 55%
Figure 28. Exiting PD to MS
15
10
5
10
5
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
20246810
06845-128
TIME (µs)
Figure 31. Digital Crosstalk
20
15
10
5
VDD = 5V V
= 4.096V
REF
T
= 25°C
A
VDD = 5V V
= 4.096V
REF
T
= 25°C
A
06845-131
0
–5
VDD = 5V
GLITCH AM PLITUDE (mV)
V
= 4.096V
REF
T
= 25°C
–10
A
CODE = 0x8000 TO 0x7FFF OUTPUT UNLO ADED WITH 5k AND 200pF
–15
20246810
TIME (µs)
Figure 29. Glitch
15
VDD = 5V V
10
5
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
20246810
TIME (µs)
REF
T
A
= 4.096V
= 25°C
Figure 30. Analog Crosstalk
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
–20
20246810
06845-129
TIME (µs)
06845-132
Figure 32. DAC-to-DAC Crosstalk
4
3
2
1
0
–1
OUTPUT VOLTAGE (µV)
–2
VDD = 5V
–3
V
= 4.096V
REF
T
= 25°C
A
–4
0147
6845-130
25836910
Time (Seco nds)
06845-133
Figure 33. 1/f Noise
Rev. 0 | Page 12 of 24
AD5066
0
–10
–20
–30
–40
–50
LEVEL (dB)
–60
OUT
V
–70
–80
–90
–100
5 10 30 40 55
20 50
Figure 34. Total Harmonic Distortion
VDD= 5V, T
= 25ºC
A
DAC LOADED WITH MIDSCALE V
= 3.0V ± 200mV p -p
REF
FREQUENCY (kHz)
CLR
V
OUT
CH1 PEAK TO PEAK 155mV
V
OUT
LAST SCLK
VDD = 5V V
= 4.096V
REF
T
= 25°C
06845-016
CH1 50.0mV CH2 5.00V M4.00µs A CH2 1.80V
T 9.800%
A
06845-137
Figure 37. Glitch Upon Entering Power Down
CH1 PEAK TO PEAK 159mV
V
OUT
CH1 5.00V CH2 2. 00V M2.00ms A CH1 1.80V
T 10.20%
Figure 35. Hardware
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
OUTPUT VOLTAGE (V)
1.4
VDD = 4.5V V
= 4.096V
REF
1.2
T
= 25°C
A
1.0
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4
1/4 TO 3/4
3/4 TO 1/4
TIME (µs)
Figure 36. Slew Rate
CLR
LAST SCLK
VDD = 5V V
= 4.096V
REF
T
= 25°C
A
CH1 50.0mV CH2 5.00V M4.00µs A CH2 1.80V
06845-135
Figure 38. Glitch Upon Exiting Power Down
T 9.800%
06845-138
06845-136
Rev. 0 | Page 13 of 24
AD5066

TERMINOLOGY

Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or INL is a measure of the maximum deviation in LSBs from a straight line passing through the endpoints of the DAC transfer function. Figure 4, Figure 5, and Figure 6 show typical INL vs. code plots.
Differential Nonlinearity (DNL)
DNL is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures mono­tonicity. Figure 7, Figure 8, and Figure 9 show typical DNL vs. code plots.
Zero-Code Error
Zero-code error is a measure of the output error when zero code (0x0000) is loaded into the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5066, because the output of the DAC cannot go below 0 V. Zero-code error is expressed in millivolts. Figure 17 shows a typical zero-code error vs. supply voltage plot.
Gain Error
Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as a percentage of the full-scale range.
Gain Error Drift
Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code error with a change in temperature. It is expressed in microvolts per degrees Celsius.
Full-Scale Error
Full-scale error is a measure of the output error when a full­scale code (0xFFFF) is loaded into the DAC register. Ideally, the output should be V percentage of the full-scale range.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nanovolts per second and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x7FFF to 0x8000). See Figure 28.
DC Power Supply Rejection Ratio (PSRR)
DC PSRR indicates how the output of the DAC is affected by changes in the supply voltage. DC PSRR is the ratio of the change in V DAC. It is measured in decibels.
OUT
− 1 LSB. Full-scale error is expressed as a
REF
to a change in VDD for full-scale output of the
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC (or soft power-down and power-up) while monitoring another DAC kept at midscale. It is expressed in microvolts.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (that is, decibels.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of a DAC from the digital input pins of the device but is measured when the DAC is not being written to
SYNC
(
held high). It is specified in nanovolts per second and measured with one simultaneous DIN and SCLK pulse loaded to the DAC.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s or vice versa) in the input register of another DAC. It is measured in standalone mode and is expressed in nanovolts per second.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s or vice versa) while keeping
high and then pulsing the DAC whose digital code has not changed. The area of the glitch is expressed in nanovolts per second.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s or vice versa) with LDAC
low and monitoring the output of another DAC. The
energy of the glitch is expressed in nanovolts per second.
Total Harmonic Distortion (THD)
THD is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measure of the harmonics present on the DAC output. It is measured in decibels.
LDAC
is high). It is expressed in
LDAC
low and monitoring the output of
LDAC
Rev. 0 | Page 14 of 24
AD5066
V
V

THEORY OF OPERATION

DIGITAL-TO-ANALOG CONVERTER

The AD5066 is a quad 16-bit, serial input, voltage output nanoDAC. The part operates from supply voltages of 2.7 V to
5.5 V. Data is written to the AD5066 in a 32-bit word format via a 3-wire serial interface. The AD5066 incorporates a power-on reset circuit to ensure the DAC output powers up to a known output state. The devices also have a software power-down mode that reduces the typical current consumption to typically 400 nA.
Because the input coding to the DAC is straight binary, the ideal output voltage when using an external reference is given by
D
OUT
VV
REFIN
×=
N
2
where: D is the decimal equivalent of the binary code that is loaded to the DAC register (0 to 65,535). N is the DAC resolution.

DAC ARCHITECTURE

The DAC architecture of the AD5066 consists of two matched DAC sections. A simplified circuit diagram is shown in Figure 39. The four MSBs of the 16-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of 15 matched resistors to either GND or the V
output.
The remaining 12 bits of the data word drive the S0 to
buffer
REF
S11 switches of a 12-bit voltage mode R-2R ladder network.
OUT
2R
E15
06845-005
REF
2R
2R
2R
S1
S0
12-BIT R-2R LADDER FOUR MSBs DECODED
Figure 39. DAC Ladder Structure
2R
S11
2R
E12RE2
INTO 15 EQUAL
SEGMENTS

REFERENCE BUFFER

The AD5066 operates with an external reference. Each of the four on-board DACs has a dedicated voltage reference pin that is buffered. The reference input pin has an input range of 2 V to V
− 0.4 V. This input voltage is then used to provide a
DD
buffered reference for the DAC core.
DB31 (MSB) DB0 (LSB)

SERIAL INTERFACE

Figure 2
SYNC
, SCLK, and
The AD5066 has a 3-wire serial interface ( DIN) that is compatible with SPI, QSPI, MICROWIRE, and most DSP interface standards. See for a timing diagram of a typical write sequence.

INPUT SHIFT REGISTER

The input shift register is 32 bits wide (see Figure 40). The first four bits are don’t cares. The next four bits are the command bits, C3 to C0 (see Tab le 7), followed by the 4-bit DAC address bits, A3 to A0 (see Tab le 8), and finally the bit data-word. The data-word comprises of a 16-bit input code followed by four don’t care bits (see Figure 40). These data bits are transferred to the Input register on the 32 can be executed on individually selected DAC channels or on all DACs.
Table 7. Command Definitions
Command Description
C3 C2 C1 C0
0 0 0 0 Write to Input Register n 0 0 0 1
0 0 1 0
0 0 1 1
0 1 0 0 0 1 0 1 0 1 1 0
0 1 1 1 Reset (power-on reset) 1 0 0 0 1 0 0 1 1 1 1 1 Reserved
Table 8. DAC Input Register Address Bits
Address (n)
0 0 0 0 DAC A 0 0 0 1 DAC B 0 0 1 0 0 0 1 1 1 1 1 1 All DACs
nd
falling edge of SCLK. Commands
Transfer contents of Input Register n to DAC Register n
Write to Input Register n and update all DAC Registers
Write to Input Register n and update DAC Register n
Power down/power up DAC Load clear code register Load LDAC register
Reserved Reserved
Selected DAC Channel A3 A2 A1 A0
DAC C DAC D
X
XXX
C3 C2 C1 C0 A3 A2 A1 A0 DB1 5 DB14 DB13 DB 12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 X X X X
DATA BITS
ADDRESS BITSCOMMAND BITS
Figure 40. Input Shift Register Content
Rev. 0 | Page 15 of 24
06845-007
AD5066
The write sequence begins by bringing the
SYNC
Bringing the
line low enables the DIN and SCLK input
SYNC
line low.
buffers. Data from the DIN line is clocked into the 32-bit shift register on the falling edge of SCLK. The serial clock frequency can be as high as 50 MHz, making the AD5066 compatible with high speed DSPs. On the 32
nd
falling clock edge, the last data bit is clocked in, and the programmed function is executed, that is, a change in the input register contents (see ) and/or a change in the mode of operation. At this stage, the
Table 8
SYNC
line can be kept low or be brought high. In either case, it must be brought high for a minimum of 2 s (single-channel update, see the t
parameter in ) before the next write sequence so
8
that a falling edge of
SYNC
Idle
high between write sequences for even lower power
Tabl e 4
SYNC
can initiate the next write sequence.
operation of the part.
SYNC
Interrupt
In a normal write sequence, the
SYNC
line is kept low for at
least 32 falling edges of SCLK, and the DAC is updated on the
nd
falling edge. However, if
32
nd
falling edge, this acts as an interrupt to the write sequence.
32
SYNC
is brought high before the
The input shift register is reset, and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs (see ). Figure 42

Power-Down Modes

The AD5066 can be configured through software, in one of four different modes: normal mode (default) and three separate power-down modes (see Table 9). Any or all DACs can be powered down. Command 0100 is reserved for the power­down function (see Ta b le 7 ). These power-down modes are software-programmable by setting two bits, Bit DB9 and Bit DB8, in the input shift register. Table 9 shows how the state of the bits corresponds to the mode of operation of the device. Any or all DACs (DAC A to DAC D) can be powered down to the selected mode by setting the corresponding four bits (DB3, DB2, DB1, DB0) to 1. See Table 1 0 for the contents of the input shift register during power-down/power-up operation.
When Bit DB9 and Bit DB8 in the control register are set to 0, the part is configured in normal mode with its normal power consumption of 2.5 mA at 5 V. However, for the three power­down modes, the supply current falls to 0.4 µA if all the channels are powered down. Not only does the supply current fall, but the output pin is also internally switched from the output of the DAC to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode. There are three different options: the output is connected internally to GND through either a 1 kΩ or a 100 kΩ resistor, or it is left open-circuited (three-state). The output stage is illustrated in Figure 41.
DAC
POWER-DOWN
CIRCUITRY
Figure 41. Output Stage During Power-Down Mode
RESISTOR NETWORK
V
OUT
06845-008
The bias generator, DAC core, and other associated linear circuitry are shut down when all channels are powered down. However, the contents of the DAC register are unaffected when in power-down mode. The time to exit power-down mode is typically 2.9 µs (see Figure 27).
Table 9. Modes of Operation
DB9 DB8 Operating Mode
0 0 Normal operation Power-down modes 0 1 1 0
1 kΩ to GND 100 kΩ to GND
1 1 Three-state
SCLK
SYNC
DIN
SYNC HIGH BEFO RE 32
DB31 DB0
INVALID WRITE SEQUENCE:
ND
FALLING EDGE
Figure 42.
SYNC
Interrupt Facility
DB31 DB0
OUTPUT UPDATES ON THE 32
VALID WRITE SE QUENCE:
ND
FALLING EDGE
06845-017
Rev. 0 | Page 16 of 24
AD5066

POWER-ON RESET

The AD5066 contains a power-on reset circuit that controls the output voltage during power-up. By connecting the POR pin low, the AD5066 output powers up to 0 V; by connecting the POR pin high, the AD5066 output powers up to midscale. The output remains powered up at this level until a valid write sequence is made to the DAC. This is useful in applications
Table 10. 32-Bit Input Shift Register Contents for Power-Up/Power-Down Function
MSB LSB DB31 to
DB28 DB27 DB26 DB25 DB24
X 0 1 0 0 X X PD1 PD0 X DAC D DAC C DAC B DAC A Don’t
cares
Command bits (C2 to C0)
DB23 to DB20
Address bits (A3 to A0)— don’t cares
DB10 to DB19 DB9 DB8
Don’t cares
where it is important to know the state of the output of the DAC while it is in the process of powering up. There is also a software executable reset function that resets the DAC to the power-on reset code. Command 0111 is reserved for this reset function (see Tabl e 7). Any events on
LDAC
CLR
or
during power-on
reset are ignored.
DB4 to DB7 DB3 DB2 DB1 DB0
Power- down mode
Don’t cares
Power-down/power-up channel selection—set bit to 1 to select
Rev. 0 | Page 17 of 24
AD5066
LDAC

CLEAR CODE REGISTER

The AD5066 has a hardware clear input. The CLR
line low clears the contents of the input register and the
CLR
DAC registers to the data contained in the user-configurable CLR
register and sets the analog outputs accordingly (see
Tabl e 11
). This function can be used in system calibration to load zero scale, midscale, or full scale to all channels together. These clear code values are user-programmable by setting two bits, Bit DB1 and Bit DB0, in the control register (see ). The default setting clears the outputs to 0 V. Command 0101 is reserved for loading the clear code register (see ).
Table 11. Clear Code Register
DB1 (CR1) DB0 (CR0) Clears to Code
0 0 0x0000 0 1 0x8000 1 0 0xFFFF 1 1 No operation
The part exits clear code mode on the 32nd falling edge of the next write to the part. If sequence, the write is aborted.
CLR
The
pulse activation time (the falling edge of the output starts to change) is typically 10.6 µs. See for contents of the input shift register during the loading clear code register operation.
CLR
pin that is an asynchronous
input is falling edge sensitive. Bringing the
Tabl e 11
Table 7
CLR
is activated during a write
CLR
to when
Tabl e 13

LDAC FUNCTION

Hardware
The outputs of all DACs can be updated simultaneously using the hardware LDAC pin, as shown in Figure 2. There are two methods of using the hardware LDAC pin: synchronously
LDAC
(
LDAC
Pin
permanently low) and asynchronously (
LDAC
pulsed).
Synchronous data is read, the DAC registers are updated on the falling edge of the 32
nd
SCLK pulse, provided
Asynchronous update. The outputs are not updated at the same time that the input registers are written to. When DAC registers are updated with the contents of the input registers.
Command 0001, 0010 and 0011 (see Tab l e 7) update the DAC Register/Registers, regardless of the level of the
Software
LDAC
Writing to the DAC using Command 0110 loads the 4-bit LDAC
register (DB3 to DB0). The default for each channel is
0; that is, the
LDAC
updates the DAC channel regardless of the state of the hardware LDAC
pin, so that it effectively sees the hardware as being tied low (see for the LDAC register mode of operation.) This flexibility is useful in applications where the user wants to simultaneously update select channels while the remainder of the channels are synchronously updating.
Table 12. Load
Bits
LDAC (DB3 to
DB0)
0 1/0 1 X1
1
X = don’t care.
LDAC
The
register gives the user extra flexibility and control over the hardware bits (DB0 to DB3) to 0 for a DAC channel means that this channel’s update is controlled by the hardware
LDAC
:
is held permanently low. After new
LDAC
is held low.
LDAC
LDAC
:
is held high then pulsed low to
LDAC
is pulsed low, the
LDAC
Function
pin works normally. Setting the bits to 1
Tabl e 12
LDAC
Register
LDAC
Operation
Pin
LDAC
Determined by LDAC DAC channels update, overrides the LDAC
pin; DAC channels see LDAC as 0
LDAC
pin (see Table 14). Setting the
pin
LDAC
LDAC
pin.
pin
pin
LDAC
Table 13. 32-Bit Input Shift Register Contents for Clear Code Function
MSB DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB2 to DB19 DB1 DB0
X 0 1 0 1 X X X X X 1/0 1/0 Don’t cares Command bits (C3 to C0) Address bits (A3 to A0) Don’t cares
Clear code register
(CR1 to CR0)
LSB
LDAC
Table 14. 32-Bit Input Shift Register Contents for
MSB DB31
to DB28
X 0 1 1 0 X X DAC D DAC C DAC B DAC A Don’t cares Command bits (C3 to C0) Address bits (A3 to A0)—don’t cares Don’t cares
DB27 DB26 DB25 DB24 DB23 to DB20
Overwrite Function
Rev. 0 | Page 18 of 24
DB4 to DB19
LSB
DB3 DB2 DB1 DB0
Setting LDAC
bit to 1 override LDAC pin
AD5066

POWER SUPPLY BYPASSING AND GROUNDING

When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5066 should have separate analog and digital sections. If the AD5066 is in a system where other devices require an AGND-to-DGND con­nection, make the connection at one point only and as close as possible to the AD5066.
Bypass the power supply to the AD5066 with 10 µF and 0.1 µF capacitors. The capacitors should be physically as close as possible to the device, with the 0.1 µF capacitor, ideally, right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the 0.1 µF capacitor has low effective series resistance and low effective series inductance, typical of common ceramic types of capacitors. This 0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching.
The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Shield the clocks and other fast switching digital signals from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique, where the component side of the board is dedicated to the ground plane only, and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board.

AD5066 to 68HC11/68L11 Interface

Figure 44 shows a serial interface between the AD5066 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK of the AD5066, and the MOSI output drives DIN of the DAC. A port line (PC7) drives the
68HC11/68L11*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 44. AD5066 to 68HC11/68L11 Interface
AD5066*
SYNCPC7
SCLKSCK
DINMOSI
SYNC
signal.
06845-010
The setup conditions for correct operation of this interface are as follows: The 68HC11/68L11 is configured with its CPOL bit as 0, and the CPHA bit as 1. When data is being transmitted to the DAC, the
SYNC
line is taken low (PC7). When the 68HC11/ 68L11 is configured as described previously, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. To load data to the AD5066, PC7 is left low after the first eight bits are transferred, and a second serial write operation is performed to the DAC. PC7 is taken high at the end of this procedure.

MICROPROCESSOR INTERFACING

AD5066 to Blackfin® ADSP-BF53X Interface

Figure 43 shows a serial interface between the AD5066 and the Blackfin ADSP-BF53x microprocessor. The ADSP-BF53x processor family incorporates two dual-channel synchronous serial ports, SPORT1 and SPORT0, for serial and multipro­cessor communications. Using SPORT0 to connect to the AD5066, the setup for the interface is as follows: DT0PRI drives the DIN pin of the AD5066, TSCLK0 drives the SCLK of the parts, and TFS0 drives
ADSP-BF53x*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 43. AD5066 to Blackfin ADSP-BF53X Interface
SYNC
.
AD5066*
SYNCTFS0
DINDT 0PRI
SCLKTSCLK0
06845-009
Rev. 0 | Page 19 of 24
AD5066

AD5066 to 80C51/80L51 Interface

Figure 45 shows a serial interface between the AD5066 and the 80C51/80L51 microcontroller. The setup for the interface is as follows: TxD of the 80C51/80L51 drives SCLK of the AD5066, RxD drives DIN on the AD5066, and a bit-programmable pin on the port (P3.3) drives the
SYNC
signal. When data is to be transmitted to the AD5066, P3.3 is taken low. The 80C51/80L51 transmit data in 8-bit bytes only; thus, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted, and a second, third, and fourth write cycle is initiated to transmit the second, third, and fourth byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 output the serial data in a format that has the LSB first. The AD5066 must receive data with the MSB first. The 80C51/80L51 transmit routine should take this into account.

AD5066 to MICROWIRE Interface

Figure 46 shows an interface between the AD5066 and any MICROWIRE-compatible device. Serial data is clocked into the AD5066 on the falling edge of the SCLK.
80C51/80L51*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 45. AD5066 to 80C512/80L51 Interface
MICROWIRE *
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 46. AD5066 to MICROWIRE Interface
AD5066*
SYNCP3.3
SCLKTxD
DINRxD
AD5066*
SYNCCS
DINSK
SCLKSO
06845-011
06845-012
Rev. 0 | Page 20 of 24
AD5066
V

APPLICATIONS INFORMATION

USING A REFERENCE AS A POWER SUPPLY

Because the supply current required by the AD5066 is extremely low, an alternative option is to use a voltage reference to supply the required voltage to the parts (see Figure 47). This is espe­cially useful if the power supply is quite noisy or if the system supply voltages are at some value other than 5 V or 3 V, for example, 15 V. The voltage reference outputs a steady supply voltage for the AD5066. If the low dropout REF195 is used, it must supply 2.5 mA of current to the AD5066 with no load on the output of the DAC.
15
5V 4.5V
V
DDVREF
AD5066
REF194
x = 0V TO 4. 5V
V
OUT
3-WIRE
SERIAL
INTERFACE
REF195
SYNC
SCLK
DIN
Figure 47. REF195 as a Power Supply to the AD5066

BIPOLAR OPERATION

The AD5066 has been designed for single-supply operation, but a bipolar output range is also possible using the circuit in Figure 48. The circuit gives an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achieved using an AD8638 or AD8639 the output amplifier.
The output voltage for any input code can be calculated as follows:
+5.5V
10µF
+5V
V
REF
0.1µF
R1 = 10k
V
REF
V
V
OUT
DD
AD5066
3-WIRE
SERIAL INTE RFACE
Figure 48. Bipolar Operation with the AD5066

USING THE AD5066 WITH A GALVANICALLY ISOLATED INTERFACE

In process control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous
06845-013
common-mode voltages that can occur in the area where the DAC is functioning. iCoupler® provides isolation in excess of 2.5 kV. The AD5066 uses a 3-wire serial logic interface, so the ADuM1300 three-channel digital isolator provides the required isolation (see Figure 49). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5066.
5V
POWER
REGULATOR
R2 = 10k
+5V
AD820/
OP295
–5V
10µF
±5V
0.1µF
6845-014
O
×=
VV
×
536,65
R2R1D
+
R1
V
DDDD
⎛ ⎜ ⎝
R2
×
R1
where:
D = the input code in decimal (0 to 65,535). V
= 5 V.
DD
R1 = R2 = 10 kΩ.
10
×=D
V
O
V5
536,65
This is an output voltage range of ±5 V, with 0x0000 corre­sponding to a −5 V output, and 0xFFFF corresponding to a +5 V output.
SCLK
DATA
Rev. 0 | Page 21 of 24
V
SCLK
AD5066
SYNC
DIN
GND
SDI
V
IA
ADuM1300
V
IB
V
IC
V
OA
V
OB
V
OC
Figure 49. AD5066 with a Galvanically Isolated Interface
DD
V
x
OUT
06845-015
AD5066

OUTLINE DIMENSIONS

5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.10
0.30
0.19
9
81
1.20 MAX
SEATING PLANE
6.40 BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 50. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeter

ORDERING GUIDE

Package
Model Temperature Range Package Description
Option
AD5066BRUZ1 −40°C to +125°C 16-Lead TSSOP RU-16 Zero ±1 LSB INL 16 bits AD5066BRUZ-REEL71 −40°C to +125°C 16-Lead TSSOP RU-16 Zero ±1 LSB INL 16 bits AD5066ARUZ AD5066ARUZ-REEL7
1
Z = RoHS Compliant Part.
1
−40°C to +125°C 16-Lead TSSOP RU-16 Zero ±4 LSB INL 16 bits
1
−40°C to +125°C 16-Lead TSSOP RU-16 Zero ±4 LSB INL 16 bits
Power-On Reset to Code Accuracy Resolution
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AD5066
NOTES
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AD5066
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06845-0-7/09(0)
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