Low power quad 16-bit nanoDAC, ±1 LSB INL
Low total unadjusted error of ±0.1 mV typically
Low zero code error of 0.05 mV typically
Individually buffered reference pins
2.7 V to 5.5 V power supply
Specified over full code range of 0 to 65535
Power-on reset to zero scale or midscale
Per channel power-down with 3 power-down functions
Hardware
function to programmable code
CLR
Small 16-lead TSSOP
APPLICATIONS
Process control
Data acquisition systems
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
GENERAL DESCRIPTION
The AD5066 is a low power, 16-bit quad-channel, unbuffered
voltage output nanoDAC offering relative accuracy specifications of ±1 LSB INL with individual reference pins and can
operate from a single 2.7 V to 5.5 V supply. The AD5066 also
offers a differential accuracy specification of ±1 LSB DNL.
Reference buffers are also provided on-chip. The part uses a
versatile 3-wire, low power Schmitt trigger serial interface that
operates at clock rates up to 50 MHz and is compatible with
standard SPI®, QSPI™, MICROWIRE™, and most DSP interface
standards. The AD5066 incorporates a power-on reset circuit
that ensures the DAC output powers up to zero scale or
midscale and remains there until a valid write to the device
takes place.
with software
LDAC
override function
LDAC
Interface, 2.7 V to 5.5 V nanoDAC in a TSSOP
AD5066
Total unadjusted error for the part is <0.8 mV. Zero code error
for the part is 0.05 mV typically.
The AD5066 contains a power-down feature that reduces the
current consumption of the device to typically 400 nA at 5 V
and provides software selectable output loads while in powerdown mode.
The outputs of all DACs can be updated simultaneously using
the hardware
user software selectable DAC channels to update simultaneously.
There is also an asynchronous
software-selectable code—0 V, midscale, or full scale.
PRODUCT HIGHLIGHTS
1. Quad channel available in 16-lead TSSOP, ±1 LSB INL.
2. Individually buffered voltage reference pins.
3. TUE = ±0.8 mV max and zero code error = 0.1 mV max.
4. High speed serial interface with clock speeds up to 50 MHz.
5. Three power-down modes available to the user.
6. Reset to known output voltage (zero scale or midscale).
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Resolution 16 16 Bits
Relative Accuracy (INL) ±0.5 ±4 ±0.5 ±1 LSB TA = −40°C to +105°C
±0.5 ±4 ±0.5 ±2 TA = −40°C to +125°C
Differential Nonlinearity (DNL) ±0.2 ±1 ±0.2 ±1 LSB
Total Unadjusted Error (TUE) ±0.1 ±0.8 ±0.1 ±0.8 mV VDD = 2.7 V, V
Zero-Code Error 0.05 0.1 0.05 0.1 mV All 0s loaded to the DAC register
Zero-Code Error Drift
3
±0.5 ±0.5 µV/°C
Full-Scale Error ±0.01 ±0.05 ±0.01 ±0.05 % FSR All 1s loaded to the DAC register
Gain Error ±0.005 ±0.05 ±0.005 ±0.05 % FSR
Gain Error Drift3
DC Crosstalk3
±0.5 ±0.5 ppm ppm of FSR/°C
1 5 1 5 V Due to single-channel full-scale
5 25 5 25 V Due to powering down (per channel)
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 V
DC Output Impedance (Normal
0 V
REF
8 8 kΩ Output impedance tolerance ± 10%
Mode)
DC Output Impedance DAC in power-down mode
Output Connected to 100 kΩ
100 100 kΩ Output impedance tolerance ± 20 kΩ
Network
Output Connected to 1 kΩ
1 1 kΩ Output impedance tolerance ± 400 Ω
Network
Power-Up Time4 2.9 2.9 µs
DC PSRR −120 −120 dB VDD ± 10%, DAC = full scale
REFERENCE INPUTS
Reference Input Range 2 V
− 0.4 2 VDD − 0.4 V
DD
Reference Current 0.002 ±1 0.002 ±1 µA Per DAC channel
Reference Input Impedance 40 40 MΩ Per DAC channel
LOGIC INPUTS3
Input Current5 ±1 ±1 µA
Input Low Voltage, V
Input High Voltage, V
0.8 0.8 V
INL
2.2 2.2 V
INH
Pin Capacitance 4 4 pF
POWER REQUIREMENTS
VDD 2.7 5.5 2.7 5.5 V All digital inputs at 0 V or VDD
DAC active, excludes load current
IDD V
Normal Mode6 2.5 3 2.5 3 mA
All Power-Down Modes7 0.4 0.4 µA
1
Temperature range is −40°C to +125°C, typical at 25°C.
2
Linearity calculated using a code range of 0 to 65,535; output unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Time taken to exit power-down mode and enter normal mode, 32nd clock edge to 90% of DAC midscale value, output unloaded.
5
Current flowing into individual digital pins. VDD = 5.5 V; VREF = 4.096 V; Code = midscale.
6
Interface inactive. All DACs active. DAC outputs unloaded.
7
All four DACs powered down.
B Grade
1
Unit Conditions/Comments
V
REF
= 2 V
REF
output change
= VDD and VIL = GND
IH
Rev. 0 | Page 3 of 24
AD5066
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V, 2.0 V ≤ V
REF
A, V
REF
B, V
REF
C, V
D ≤ VDD − 0.4 V all specifications T
REF
MIN
to T
, unless otherwise noted.
MAX
Table 3.
Parameter
1, 2
Min Ty p Max Unit Conditions/Comments3
DYNAMIC PERFORMACE
Output Voltage Settling Time 7.5 10 µs
¼ to ¾ scale settling to ±2 LSB, single channel update, output
unloaded
Output Voltage Settling Time 12 15 µs
¼ to ¾ scale settling to ±2 LSB, all channel update, output
unloaded
Slew Rate 1.7 V/µs
Digital-to-Analog Glitch Impulse 3 nV-sec 1 LSB change around major carry
Reference Feedthrough −70 dB V
= 3 V ± 0.5 V p-p, frequency = 60 Hz to 20 MHz
REF
Digital Feedthrough 0.02 nV-sec
Digital Crosstalk 1.7 nV-sec
Analog Crosstalk 3.7 nV-sec
DAC-to-DAC Crosstalk 5.4 nV-sec
Total Harmonic Distortion −83 dB V
Temperature range is −40°C to +125°C, typical at +25°C.
2
See the Terminology section.
3
Guaranteed by design and characterization; not production tested.
Rev. 0 | Page 4 of 24
AD5066
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2, VDD = 2.7 V to
5.5 V, all specifications T
Table 4.
Parameter1 Symbol MinTyp M ax Uni t
SCLK Cycle Time t1 20 ns
SCLK High Time t2 10 ns
SCLK Low Time t3 10 ns
SYNC to SCLK Falling Edge Set-Up Time
Data Set-Up Time t5 5 ns
Data Hold Time t6 5 ns
SCLK Falling Edge to SYNC Rising Edge
Minimum SYNC high time
Single Channel Update 2 µs
All Channel Update 8 µs
SYNC Rising Edge to SCLK Fall Ignore
LDAC Pulse Width Low
SCLK Falling Edge to LDAC Rising Edge
CLR Pulse Width Low
SCLK Falling Edge to LDAC Falling Edge
CLR Pulse Activation Time
1
Maximum SCLK frequency is 50 MHz. Guaranteed by design and characterization; not production tested.
SCLK
SYNC
DIN
LDAC
to T
MIN
1
, unless otherwise noted. See Figure 2.
MAX
t
1
t
t
8
DB31
t
4
t
t
3
t
6
5
2
DB0
t
17 ns
4
t
5 30 ns
7
t
8
t
17 ns
9
t
20 ns
10
t
20 ns
11
t
10 ns
12
t
10 ns
13
t
10.6 µs
14
t
9
t
7
t
10
t
13
t
11
2
LDAC
t
CLR
V
OUT
1
ASYNCHRONOUS LDAC UPDATE MODE.
2
SYNCHRONOUS LDAC UPDATE MODE.
12
t
14
06845-003
Figure 2. Serial Write Operation
Rev. 0 | Page 5 of 24
AD5066
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter Rating
VDD to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to VDD + 0.3 V
V
x to GND −0.3 V to VDD + 0.3 V
OUT
V
x to GND −0.3 V to VDD + 0.3 V
REF
Operating Temperature Range
Industrial −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ
TSSOP Package
Power Dissipation (TJ
θJA Thermal Impedance 150.4°C/W
Reflow Soldering Peak Temperature
SnPb 240°C
Pb-Free 260°C
) +150°C
MAX
− TA)/θJA
MAX
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 6 of 24
AD5066
V
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
LDAC
SYNC
V
REF
V
REF
V
OUT
OUT
POR
V
DD
B
A
A
C
1
2
3
AD5066
4
TOP VIEW
5
(Not to Scal e)
6
7
8
16
SCLK
15
DIN
14
GND
13
B
V
OUT
12
V
D
OUT
11
V
D
REF
10
CLR
9
C
V
REF
06845-004
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1
LDAC
Load DAC. Logic input. This is used to update the DAC register and, consequently, the analog outputs.
When tied permanently low, the addressed DAC register is updated on the falling edge of the 32
clock. If LDAC
is held high during the write cycle, the addressed DAC input shift register is updated but
the output is held off until the falling edge of LDAC. In this mode, all analog outputs can be updated
simultaneously on the falling edge of LDAC.
2
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes
SYNC
low, it powers on the SCLK and DIN buffers and enables the shift register. Data is transferred in on the
falling edges of the next 32 clocks. If SYNC
is taken high before the 32nd falling edge, the rising edge of
SYNC acts as an interrupt, and the write sequence is ignored by the device.
3 VDD
Power Supply Input. The AD5066 can be operated from 2.7 V to 5.5 V. Decouple the supply with a 10 µF
capacitor in parallel with a 0.1 µF capacitor to GND.
4 V
5 V
6 V
7 V
8 POR
B External Reference Voltage Input for DAC B.
REF
A External Reference Voltage Input for DAC A.
REF
A Unbuffered Analog Output Voltage from DAC A.
OUT
C Unbuffered Analog Output Voltage from DAC C.
OUT
Power-On Reset Pin. Tying this pin to GND powers the DAC outputs to zero scale on power-up. Tying
this pin to VDD powers the DAC outputs to midscale.
9 V
10
11 V
12 V
13 V
C External Reference Voltage Input for DAC C.
REF
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are
CLR
ignored. When CLR
contained in the CLR
D External Reference Voltage Input for DAC D.
REF
D Unbuffered Analog Output Voltage from DAC D.
OUT
B Unbuffered Analog Output Voltage from DAC B.
OUT
is activated, the input register and the DAC register are updated with the data
code register—zero, midscale, or full scale. Default setting clears the output to 0 V.
14 GND Ground Reference Point for All Circuitry on the Part.
15 DIN
Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on the falling
edge of the serial clock input.
16 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input.
Data can be transferred at rates of up to 50 MHz.
nd
Rev. 0 | Page 7 of 24
AD5066
TYPICAL PERFORMANCE CHARACTERISTICS
0.3
0.2
0.1
0
–0.1
–0.2
INL ERROR (LSB)
–0.3
VDD = 5V
V
= 4.096V
–0.4
–0.5
REF
T
= 25°C
A
010,000 20,000 30, 000 40,000 50,000 60,000
CODE
Figure 4. INL Error vs. Code
0.3
VDD = 5V
= 4.096V
V
REF
0.2
= 25°C
T
A
0.1
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
–0.4
010,000 20,000 30,000 40, 000 50, 000 60,000
CODE
Figure 5. DNL Error vs. Code
0.5
0.4
0.3
0.2
0.1
0
INL (LSB)
–0.1
–0.2
–0.3
VDD = 5V
T
–0.4
–0.5
6845-105
= 25°C
A
2345
MAX INL
MIN INL
REFERENCE VOLTAGE (V)
06845-108
Figure 7. INL vs. Reference Input Voltage
0.5
0.4
0.3
0.2
0.1
0
DNL (LSB)
–0.1
–0.2
–0.3
VDD = 5.5V
–0.4
T
= 25°C
A
–0.5
2345
06845-106
MAX DNL
MIN DNL
REFERENCE VOLTAGE (V)
06845-109
Figure 8. DNL vs. Reference Input Voltage
0.03
0.02
0.01
0
–0.01
–0.02
–0.03
TOTAL UNADJUSTED ERROR (mV)
–0.04
–0.05
–0.06
–0.07
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
010,00020,000 30,000 40,000 50, 000 60,000
CODE
Figure 6. Total Unadjusted Error vs. Code
06845-107
Rev. 0 | Page 8 of 24
100
80
60
40
20
0
–20
–40
–60
TOTAL UNADJUST ED ERROR (µV)
VDD = 5.5V
–80
T
= 25°C
A
–100
234
MAX TUE
MIN TUE
REFERENCE VOL TAGE (V)
Figure 9. Total Unadjusted Error vs. Reference Input Voltage
5
6845-110
AD5066
0.010
0.005
0
GAIN ERROR (%FSR)
–0.005
V
= 5.5V
DD
T
= 25°C
A
–0.010
2345
REFERENCE VOLTAGE (V)
Figure 10. Gain Error Vs. Reference Input Voltage
06845-111
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL (LSB)
–0.4
–0.6
–0.8
–1.0
–1.2
VDD = 5V
V
= 4.096V
REF
–40–20020406080100120
MAX DNL
MIN DNL
TEMPERATURE (° C)
Figure 13. DNL vs. Temperature
06845-114
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
ZERO-SCALE ERROR (mV)
VDD = 5.5V
0.02
T
= 25°C
A
0.01
0
2345
REFERENCE VOL TAGE (V)
6845-112
Figure 11. Zero-Code Error Vs. Reference Input Voltage
1.2
1.0
0.8
0.6
0.4
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
= 5V
V
DD
V
= 4.096V
REF
–40–20020406080100120
MAX INL
MIN INL
TEMPERATURE (° C)
06845-113
Figure 12. INL vs. Temperature
100
80
60
40
20
0
–20
–40
–60
TOTAL UNADJUSTED ERROR (µV )
–80
–100
VDD = 5V
V
= 4.096V
REF
–40–20020406080100120
MAX TUE
MIN TUE
TEMPERATURE (° C)
Figure 14. Total Unadjusted Error vs. Temperature
50
40
30
20
10
0
–10
–20
–30
ZERO-SCALE ERROR (µV)
–40
–50
VDD = 5V
= 4.096V
V
REF
–40–20020406080100120
TEMPERATURE (° C)
Figure 15. Zero-Code Error vs. Temperature
06845-115
6845-116
Rev. 0 | Page 9 of 24
AD5066
R
%
0.0020
0.0015
0.0010
0.0005
0
–0.0005
GAIN ERROR (%F SR)
–0.0010
–0.0015
–0.0020
VDD = 5V
V
= 4.096V
REF
–40–20020406080100120
TEMPERATURE (° C)
Figure 16. Gain Error vs. Temperature
06845-117
7
VDD = 5V
DAC OUTPUT UNLOADED
6
T
= 25°C
A
5
4
HITS
3
2
1
0
2.45
2.502.552.602. 652.70
Figure 19. IDD Histogram VDD = 5.5 V
IDD POWER-UP (mA)
06845-120
0.010
0.005
FSR)
0
OR (
ER
–0.005
–0.010
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
2.73.23.74.24. 75.2
VDD (V)
FULL-SCALE ERROR
GAIN ERROR
Figure 17. Gain Error and Full-Scale Error vs. Supply Voltage
20
15
10
VDD = 5V
ZERO-SCALE Error (µV)
5
V
= 4.096V
REF
T
= 25°C
A
60
50
40
30
HITS
20
10
0
0.20.40.6
06845-118
I
POWERDOWN (µA)
DD
= 5V
V
DD
T
= 25°C
A
DAC OUTPUT UNLO ADED
+125°C IDD POWERDOW N
+25°C I
POWERDOWN
DD
–40°C I
POWERDOWN
DD
0.81.0
06845-139
Figure 20. IDD Power-Down Histogram
5
VDD = 5.5V
V
= 4.096V
REF
T
= 25°C
A
4
3
(mA)
DD
I
2
1
0
2.73.74.7
VDD (V)
Figure 18. Zero-Code Error vs. Supply Voltage
06845-119
0
010,000 20, 000 30,000 40,00 0
DAC CODE
Figure 21. IDD vs. Code
50,000 60,000
06845-121
Rev. 0 | Page 10 of 24
AD5066
5
VDD = 5.5V
V
= 4.096V
REF
T
= 25°C
A
CODE = MIDSCALE
4
3
(mA)
DD
I
2
1
0
–40–2002040
TEMPERATURE (° C)
Figure 22. IDD vs. Temperature
5
V
= 4.096V
REF
= 25°C
T
A
CODE = MIDSCALE
4
3
(mA)
DD
I
2
1
0
2.73.03.54. 04.5
SUPPLY VOLTAGE (V)
Figure 23. IDD vs. Supply Voltage
6080100120
06845-122
5.05.5
06845-123
3.5
1/4 TO 3/ 4
3.0
2.5
2.0
1.5
OUTPUT VOLTAGE (V)
1.0
VDD = 4.5V
= 4.096V
V
REF
0.5
OUTPUT AMPLIFIER = AD797
= 25°C
T
A
DAC LOAD = 9pF
0
012345678910
3/4 TO 1/ 4
TIME (µs)
Figure 25. Settling Time
V
DD
V
REF
V
OUT
V
= 4.096V
REF
T
= 25°C
A
CH1 2.00V
CH3 2.00V
CH2 2.00VM10.00msA CH1 640mV
T 30.20%
Figure 26. POR to 0 V
6845-125
06845-126
10
VDD = 5.5V
= 4.096V
V
REF
= 25°C
T
A
8
6
(mA)
DD
I
4
2
0
0123456
DIGITAL INPUT VOLTAGE (V)
Figure 24. IDD vs. Digital Input Voltage
06845-124
Rev. 0 | Page 11 of 24
VDD = 5.5V
V
= 4.096V
REF
CH1 2.00V
CH3 2.00V
V
DD
V
REF
V
OUT
CH2 2.00VM10.00msA CH1 640mV
T 30.20%
Figure 27. POR to MS
06845-127
AD5066
15
CH1 = SCLK
1
CH2 = V
OUT
2
CH1 5VCH2 500mVM2µsA CH2 1.2V
VDD = 5V
POWER-UP T O MIDSCALE
OUTPUT UNLOADED
T 55%
Figure 28. Exiting PD to MS
15
10
5
10
5
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
–20246810
06845-128
TIME (µs)
Figure 31. Digital Crosstalk
20
15
10
5
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
06845-131
0
–5
VDD = 5V
GLITCH AM PLITUDE (mV)
V
= 4.096V
REF
T
= 25°C
–10
A
CODE = 0x8000 TO 0x7FFF
OUTPUT UNLO ADED WITH 5kΩ AND 200pF
–15
–20246810
TIME (µs)
Figure 29. Glitch
15
VDD = 5V
V
10
5
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
–20246810
TIME (µs)
REF
T
A
= 4.096V
= 25°C
Figure 30. Analog Crosstalk
0
–5
GLITCH AM PLITUDE (mV)
–10
–15
–20
–20246810
06845-129
TIME (µs)
06845-132
Figure 32. DAC-to-DAC Crosstalk
4
3
2
1
0
–1
OUTPUT VOLTAGE (µV)
–2
VDD = 5V
–3
V
= 4.096V
REF
T
= 25°C
A
–4
0147
6845-130
25836910
Time (Seco nds)
06845-133
Figure 33. 1/f Noise
Rev. 0 | Page 12 of 24
AD5066
0
–10
–20
–30
–40
–50
LEVEL (dB)
–60
OUT
V
–70
–80
–90
–100
510304055
2050
Figure 34. Total Harmonic Distortion
VDD= 5V,
T
= 25ºC
A
DAC LOADED WITH MIDSCALE
V
= 3.0V ± 200mV p -p
REF
FREQUENCY (kHz)
CLR
V
OUT
CH1 PEAK TO PEAK
155mV
V
OUT
LAST SCLK
VDD = 5V
V
= 4.096V
REF
T
= 25°C
06845-016
CH1 50.0mVCH2 5.00VM4.00µsA CH2 1.80V
T 9.800%
A
06845-137
Figure 37. Glitch Upon Entering Power Down
CH1 PEAK TO PEAK
159mV
V
OUT
CH1 5.00V CH2 2. 00VM2.00msA CH1 1.80V
T 10.20%
Figure 35. Hardware
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
OUTPUT VOLTAGE (V)
1.4
VDD = 4.5V
V
= 4.096V
REF
1.2
T
= 25°C
A
1.0
1.51.61.71.81.922.12.22.32.4
1/4 TO 3/4
3/4 TO 1/4
TIME (µs)
Figure 36. Slew Rate
CLR
LAST SCLK
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
CH1 50.0mVCH2 5.00VM4.00µsA CH2 1.80V
06845-135
Figure 38. Glitch Upon Exiting Power Down
T 9.800%
06845-138
06845-136
Rev. 0 | Page 13 of 24
AD5066
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or INL is a measure of the maximum
deviation in LSBs from a straight line passing through the
endpoints of the DAC transfer function. Figure 4, Figure 5,
and Figure 6 show typical INL vs. code plots.
Differential Nonlinearity (DNL)
DNL is the difference between the measured change and the
ideal 1 LSB change between any two adjacent codes. A specified
differential nonlinearity of ±1 LSB maximum ensures monotonicity. Figure 7, Figure 8, and Figure 9 show typical DNL vs.
code plots.
Zero-Code Error
Zero-code error is a measure of the output error when zero
code (0x0000) is loaded into the DAC register. Ideally, the
output should be 0 V. The zero-code error is always positive in
the AD5066, because the output of the DAC cannot go below
0 V. Zero-code error is expressed in millivolts. Figure 17 shows
a typical zero-code error vs. supply voltage plot.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal, expressed as a percentage of the full-scale range.
Gain Error Drift
Gain error drift is a measure of the change in gain error with
changes in temperature. It is expressed in (ppm of full-scale
range)/°C.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code
error with a change in temperature. It is expressed in microvolts
per degrees Celsius.
Full-Scale Error
Full-scale error is a measure of the output error when a fullscale code (0xFFFF) is loaded into the DAC register. Ideally, the
output should be V
percentage of the full-scale range.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nanovolts
per second and is measured when the digital input code is
changed by 1 LSB at the major carry transition (0x7FFF to
0x8000). See Figure 28.
DC Power Supply Rejection Ratio (PSRR)
DC PSRR indicates how the output of the DAC is affected by
changes in the supply voltage. DC PSRR is the ratio of the
change in V
DAC. It is measured in decibels.
OUT
− 1 LSB. Full-scale error is expressed as a
REF
to a change in VDD for full-scale output of the
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is measured
with a full-scale output change on one DAC (or soft power-down
and power-up) while monitoring another DAC kept at midscale.
It is expressed in microvolts.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal
at the DAC output to the reference input when the DAC output
is not being updated (that is,
decibels.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of a DAC from the digital input pins of the
device but is measured when the DAC is not being written to
SYNC
(
held high). It is specified in nanovolts per second and
measured with one simultaneous DIN and SCLK pulse loaded
to the DAC.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output
of one DAC at midscale in response to a full-scale code change
(all 0s to all 1s or vice versa) in the input register of another
DAC. It is measured in standalone mode and is expressed in
nanovolts per second.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC due to a change in the output of another DAC. It is
measured by loading one of the input registers with a full-scale
code change (all 0s to all 1s or vice versa) while keeping
high and then pulsing
the DAC whose digital code has not changed. The area of the
glitch is expressed in nanovolts per second.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
output change of another DAC. This includes both digital and
analog crosstalk. It is measured by loading one of the DACs
with a full-scale code change (all 0s to all 1s or vice versa) with
LDAC
low and monitoring the output of another DAC. The
energy of the glitch is expressed in nanovolts per second.
Total Harmonic Distortion (THD)
THD is the difference between an ideal sine wave and its
attenuated version using the DAC. The sine wave is used as
the reference for the DAC, and the THD is a measure of the
harmonics present on the DAC output. It is measured in
decibels.
LDAC
is high). It is expressed in
LDAC
low and monitoring the output of
LDAC
Rev. 0 | Page 14 of 24
AD5066
V
V
THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER
The AD5066 is a quad 16-bit, serial input, voltage output
nanoDAC. The part operates from supply voltages of 2.7 V to
5.5 V. Data is written to the AD5066 in a 32-bit word format via
a 3-wire serial interface. The AD5066 incorporates a power-on
reset circuit to ensure the DAC output powers up to a known
output state. The devices also have a software power-down mode
that reduces the typical current consumption to typically 400 nA.
Because the input coding to the DAC is straight binary, the ideal
output voltage when using an external reference is given by
D
⎞
⎛
OUT
VV
REFIN
×=
⎟
⎜
N
2
⎠
⎝
where:
D is the decimal equivalent of the binary code that is loaded to
the DAC register (0 to 65,535).
N is the DAC resolution.
DAC ARCHITECTURE
The DAC architecture of the AD5066 consists of two matched
DAC sections. A simplified circuit diagram is shown in
Figure 39. The four MSBs of the 16-bit data word are decoded
to drive 15 switches, E1 to E15. Each of these switches connects
one of 15 matched resistors to either GND or the V
output.
The remaining 12 bits of the data word drive the S0 to
buffer
REF
S11 switches of a 12-bit voltage mode R-2R ladder network.
OUT
2R
E15
06845-005
REF
2R
2R
2R
S1
S0
12-BIT R-2R LADDERFOUR MSBs DECODED
Figure 39. DAC Ladder Structure
2R
S11
2R
E12RE2
INTO 15 EQUAL
SEGMENTS
REFERENCE BUFFER
The AD5066 operates with an external reference. Each of the
four on-board DACs has a dedicated voltage reference pin that
is buffered. The reference input pin has an input range of 2 V
to V
− 0.4 V. This input voltage is then used to provide a
DD
buffered reference for the DAC core.
DB31 (MSB)DB0 (LSB)
SERIAL INTERFACE
Figure 2
SYNC
, SCLK, and
The AD5066 has a 3-wire serial interface (
DIN) that is compatible with SPI, QSPI, MICROWIRE, and
most DSP interface standards. See for a timing diagram
of a typical write sequence.
INPUT SHIFT REGISTER
The input shift register is 32 bits wide (see Figure 40). The first
four bits are don’t cares. The next four bits are the command
bits, C3 to C0 (see Tab le 7), followed by the 4-bit DAC address
bits, A3 to A0 (see Tab le 8), and finally the bit data-word. The
data-word comprises of a 16-bit input code followed by four
don’t care bits (see Figure 40). These data bits are transferred to
the Input register on the 32
can be executed on individually selected DAC channels or on all
DACs.
buffers. Data from the DIN line is clocked into the 32-bit shift
register on the falling edge of SCLK. The serial clock frequency
can be as high as 50 MHz, making the AD5066 compatible with
high speed DSPs. On the 32
nd
falling clock edge, the last data bit
is clocked in, and the programmed function is executed, that is,
a change in the input register contents (see ) and/or a
change in the mode of operation. At this stage, the
Table 8
SYNC
line
can be kept low or be brought high. In either case, it must be
brought high for a minimum of 2 s (single-channel update, see
the t
parameter in ) before the next write sequence so
8
that a falling edge of
SYNC
Idle
high between write sequences for even lower power
Tabl e 4
SYNC
can initiate the next write sequence.
operation of the part.
SYNC
Interrupt
In a normal write sequence, the
SYNC
line is kept low for at
least 32 falling edges of SCLK, and the DAC is updated on the
nd
falling edge. However, if
32
nd
falling edge, this acts as an interrupt to the write sequence.
32
SYNC
is brought high before the
The input shift register is reset, and the write sequence is seen
as invalid. Neither an update of the DAC register contents nor a
change in the operating mode occurs (see ). Figure 42
Power-Down Modes
The AD5066 can be configured through software, in one of
four different modes: normal mode (default) and three separate
power-down modes (see Table 9). Any or all DACs can be
powered down. Command 0100 is reserved for the powerdown function (see Ta b le 7 ). These power-down modes are
software-programmable by setting two bits, Bit DB9 and
Bit DB8, in the input shift register. Table 9 shows how the state
of the bits corresponds to the mode of operation of the device.
Any or all DACs (DAC A to DAC D) can be powered down to
the selected mode by setting the corresponding four bits (DB3,
DB2, DB1, DB0) to 1. See Table 1 0 for the contents of the input
shift register during power-down/power-up operation.
When Bit DB9 and Bit DB8 in the control register are set to 0,
the part is configured in normal mode with its normal power
consumption of 2.5 mA at 5 V. However, for the three powerdown modes, the supply current falls to 0.4 µA if all the channels
are powered down. Not only does the supply current fall, but
the output pin is also internally switched from the output of the
DAC to a resistor network of known values. This has the advantage
that the output impedance of the part is known while the part
is in power-down mode. There are three different options: the
output is connected internally to GND through either a 1 kΩ or
a 100 kΩ resistor, or it is left open-circuited (three-state). The
output stage is illustrated in Figure 41.
DAC
POWER-DOWN
CIRCUITRY
Figure 41. Output Stage During Power-Down Mode
RESISTOR
NETWORK
V
OUT
06845-008
The bias generator, DAC core, and other associated linear
circuitry are shut down when all channels are powered down.
However, the contents of the DAC register are unaffected when
in power-down mode. The time to exit power-down mode is
typically 2.9 µs (see Figure 27).
Table 9. Modes of Operation
DB9 DB8 Operating Mode
0 0 Normal operation
Power-down modes
0 1
1 0
1 kΩ to GND
100 kΩ to GND
1 1 Three-state
SCLK
SYNC
DIN
SYNC HIGH BEFO RE 32
DB31DB0
INVALID WRITE SEQUENCE:
ND
FALLING EDGE
Figure 42.
SYNC
Interrupt Facility
DB31DB0
OUTPUT UPDATES ON THE 32
VALID WRITE SE QUENCE:
ND
FALLING EDGE
06845-017
Rev. 0 | Page 16 of 24
AD5066
POWER-ON RESET
The AD5066 contains a power-on reset circuit that controls
the output voltage during power-up. By connecting the POR
pin low, the AD5066 output powers up to 0 V; by connecting
the POR pin high, the AD5066 output powers up to midscale.
The output remains powered up at this level until a valid write
sequence is made to the DAC. This is useful in applications
Table 10. 32-Bit Input Shift Register Contents for Power-Up/Power-Down Function
MSB LSB
DB31 to
DB28 DB27 DB26 DB25 DB24
X 0 1 0 0 X X PD1 PD0 X DAC D DAC C DAC B DAC A
Don’t
cares
Command bits (C2 to C0)
DB23 to
DB20
Address bits
(A3 to A0)—
don’t cares
DB10 to
DB19 DB9 DB8
Don’t
cares
where it is important to know the state of the output of the DAC
while it is in the process of powering up. There is also a software
executable reset function that resets the DAC to the power-on
reset code. Command 0111 is reserved for this reset function
(see Tabl e 7). Any events on
LDAC
CLR
or
during power-on
reset are ignored.
DB4 to
DB7 DB3 DB2 DB1 DB0
Power- down
mode
Don’t
cares
Power-down/power-up channel
selection—set bit to 1 to select
Rev. 0 | Page 17 of 24
AD5066
LDAC
CLEAR CODE REGISTER
The AD5066 has a hardware
clear input. The
CLR
line low clears the contents of the input register and the
CLR
DAC registers to the data contained in the user-configurable
CLR
register and sets the analog outputs accordingly (see
Tabl e 11
). This function can be used in system calibration to
load zero scale, midscale, or full scale to all channels together.
These clear code values are user-programmable by setting two
bits, Bit DB1 and Bit DB0, in the control register (see ).
The default setting clears the outputs to 0 V. Command 0101 is
reserved for loading the clear code register (see ).
Table 11. Clear Code Register
DB1 (CR1) DB0 (CR0) Clears to Code
0 0 0x0000
0 1 0x8000
1 0 0xFFFF
1 1 No operation
The part exits clear code mode on the 32nd falling edge of the
next write to the part. If
sequence, the write is aborted.
CLR
The
pulse activation time (the falling edge of
the output starts to change) is typically 10.6 µs. See for
contents of the input shift register during the loading clear code
register operation.
CLR
pin that is an asynchronous
input is falling edge sensitive. Bringing the
Tabl e 11
Table 7
CLR
is activated during a write
CLR
to when
Tabl e 13
LDAC FUNCTION
Hardware
The outputs of all DACs can be updated simultaneously using
the hardware LDAC pin, as shown in Figure 2. There are two
methods of using the hardware LDAC pin: synchronously
LDAC
(
LDAC
Pin
permanently low) and asynchronously (
LDAC
pulsed).
Synchronous
data is read, the DAC registers are updated on the falling edge
of the 32
nd
SCLK pulse, provided
Asynchronous
update. The outputs are not updated at the same time that the
input registers are written to. When
DAC registers are updated with the contents of the input
registers.
Command 0001, 0010 and 0011 (see Tab l e 7) update the DAC
Register/Registers, regardless of the level of the
Software
LDAC
Writing to the DAC using Command 0110 loads the 4-bit
LDAC
register (DB3 to DB0). The default for each channel is
0; that is, the
LDAC
updates the DAC channel regardless of the state of the hardware
LDAC
pin, so that it effectively sees the hardware
as being tied low (see for the LDAC register mode of
operation.) This flexibility is useful in applications where the
user wants to simultaneously update select channels while the
remainder of the channels are synchronously updating.
Table 12. Load
Bits
LDAC
(DB3 to
DB0)
0 1/0
1 X1
1
X = don’t care.
LDAC
The
register gives the user extra flexibility and control
over the hardware
bits (DB0 to DB3) to 0 for a DAC channel means that this
channel’s update is controlled by the hardware
LDAC
:
is held permanently low. After new
LDAC
is held low.
LDAC
LDAC
:
is held high then pulsed low to
LDAC
is pulsed low, the
LDAC
Function
pin works normally. Setting the bits to 1
Tabl e 12
LDAC
Register
LDAC
Operation
Pin
LDAC
Determined by LDAC
DAC channels update, overrides the LDAC
pin; DAC channels see LDAC as 0
LDAC
pin (see Table 14). Setting the
pin
LDAC
LDAC
pin.
pin
pin
LDAC
Table 13. 32-Bit Input Shift Register Contents for Clear Code Function
MSB
DB31 to DB28 DB27 DB26 DB25 DB24 DB23 DB22 DB21 DB20 DB2 to DB19 DB1 DB0
X 0 1 0 1 X X X X X 1/0 1/0
Don’t cares Command bits (C3 to C0) Address bits (A3 to A0) Don’t cares
Clear code register
(CR1 to CR0)
LSB
LDAC
Table 14. 32-Bit Input Shift Register Contents for
MSB
DB31
to DB28
X 0 1 1 0 X X DAC D DAC C DAC B DAC A
Don’t cares Command bits (C3 to C0) Address bits (A3 to A0)—don’t cares Don’t cares
DB27 DB26 DB25 DB24 DB23 to DB20
Overwrite Function
Rev. 0 | Page 18 of 24
DB4
to DB19
LSB
DB3 DB2 DB1 DB0
Setting LDAC
bit to 1 override LDAC pin
AD5066
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The printed circuit board containing the AD5066 should
have separate analog and digital sections. If the AD5066 is in a
system where other devices require an AGND-to-DGND connection, make the connection at one point only and as close as
possible to the AD5066.
Bypass the power supply to the AD5066 with 10 µF and 0.1 µF
capacitors. The capacitors should be physically as close as
possible to the device, with the 0.1 µF capacitor, ideally, right up
against the device. The 10 µF capacitors are the tantalum bead
type. It is important that the 0.1 µF capacitor has low effective
series resistance and low effective series inductance, typical of
common ceramic types of capacitors. This 0.1 µF capacitor
provides a low impedance path to ground for high frequencies
caused by transient currents due to internal logic switching.
The power supply line should have as large a trace as possible to
provide a low impedance path and reduce glitch effects on the
supply line. Shield the clocks and other fast switching digital
signals from other parts of the board by digital ground. Avoid
crossover of digital and analog signals if possible. When traces
cross on opposite sides of the board, ensure that they run at
right angles to each other to reduce feedthrough effects through
the board. The best board layout technique is the microstrip
technique, where the component side of the board is dedicated
to the ground plane only, and the signal traces are placed on
the solder side. However, this is not always possible with a
2-layer board.
AD5066 to 68HC11/68L11 Interface
Figure 44 shows a serial interface between the AD5066 and the
68HC11/68L11 microcontroller. SCK of the 68HC11/68L11
drives the SCLK of the AD5066, and the MOSI output drives
DIN of the DAC. A port line (PC7) drives the
68HC11/68L11*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 44. AD5066 to 68HC11/68L11 Interface
AD5066*
SYNCPC7
SCLKSCK
DINMOSI
SYNC
signal.
06845-010
The setup conditions for correct operation of this interface are
as follows: The 68HC11/68L11 is configured with its CPOL bit
as 0, and the CPHA bit as 1. When data is being transmitted to
the DAC, the
SYNC
line is taken low (PC7). When the 68HC11/
68L11 is configured as described previously, data appearing on
the MOSI output is valid on the falling edge of SCK. Serial data
from the 68HC11/68L11 is transmitted in 8-bit bytes with only
eight falling clock edges occurring in the transmit cycle. Data is
transmitted MSB first. To load data to the AD5066, PC7 is left
low after the first eight bits are transferred, and a second serial
write operation is performed to the DAC. PC7 is taken high at
the end of this procedure.
MICROPROCESSOR INTERFACING
AD5066 to Blackfin® ADSP-BF53X Interface
Figure 43 shows a serial interface between the AD5066 and
the Blackfin ADSP-BF53x microprocessor. The ADSP-BF53x
processor family incorporates two dual-channel synchronous
serial ports, SPORT1 and SPORT0, for serial and multiprocessor communications. Using SPORT0 to connect to the
AD5066, the setup for the interface is as follows: DT0PRI
drives the DIN pin of the AD5066, TSCLK0 drives the SCLK
of the parts, and TFS0 drives
ADSP-BF53x*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 43. AD5066 to Blackfin ADSP-BF53X Interface
SYNC
.
AD5066*
SYNCTFS0
DINDT 0PRI
SCLKTSCLK0
06845-009
Rev. 0 | Page 19 of 24
AD5066
AD5066 to 80C51/80L51 Interface
Figure 45 shows a serial interface between the AD5066 and the
80C51/80L51 microcontroller. The setup for the interface is as
follows: TxD of the 80C51/80L51 drives SCLK of the AD5066,
RxD drives DIN on the AD5066, and a bit-programmable pin on
the port (P3.3) drives the
SYNC
signal. When data is to be
transmitted to the AD5066, P3.3 is taken low. The 80C51/80L51
transmit data in 8-bit bytes only; thus, only eight falling clock
edges occur in the transmit cycle. To load data to the DAC, P3.3
is left low after the first eight bits are transmitted, and a second,
third, and fourth write cycle is initiated to transmit the second,
third, and fourth byte of data. P3.3 is taken high following the
completion of this cycle. The 80C51/80L51 output the serial
data in a format that has the LSB first. The AD5066 must
receive data with the MSB first. The 80C51/80L51 transmit
routine should take this into account.
AD5066 to MICROWIRE Interface
Figure 46 shows an interface between the AD5066 and any
MICROWIRE-compatible device. Serial data is clocked into
the AD5066 on the falling edge of the SCLK.
80C51/80L51*
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 45. AD5066 to 80C512/80L51 Interface
MICROWIRE *
*ADDITIONAL PINS OMI TTED FO R CLARITY.
Figure 46. AD5066 to MICROWIRE Interface
AD5066*
SYNCP3.3
SCLKTxD
DINRxD
AD5066*
SYNCCS
DINSK
SCLKSO
06845-011
06845-012
Rev. 0 | Page 20 of 24
AD5066
V
APPLICATIONS INFORMATION
USING A REFERENCE AS A POWER SUPPLY
Because the supply current required by the AD5066 is extremely
low, an alternative option is to use a voltage reference to supply
the required voltage to the parts (see Figure 47). This is especially useful if the power supply is quite noisy or if the system
supply voltages are at some value other than 5 V or 3 V, for
example, 15 V. The voltage reference outputs a steady supply
voltage for the AD5066. If the low dropout REF195 is used, it
must supply 2.5 mA of current to the AD5066 with no load on
the output of the DAC.
15
5V4.5V
V
DDVREF
AD5066
REF194
x = 0V TO 4. 5V
V
OUT
3-WIRE
SERIAL
INTERFACE
REF195
SYNC
SCLK
DIN
Figure 47. REF195 as a Power Supply to the AD5066
BIPOLAR OPERATION
The AD5066 has been designed for single-supply operation,
but a bipolar output range is also possible using the circuit in
Figure 48. The circuit gives an output voltage range of ±5 V.
Rail-to-rail operation at the amplifier output is achieved
using an AD8638 or AD8639 the output amplifier.
The output voltage for any input code can be calculated as
follows:
+5.5V
10µF
+5V
V
REF
0.1µF
R1 = 10kΩ
V
REF
V
V
OUT
DD
AD5066
3-WIRE
SERIAL INTE RFACE
Figure 48. Bipolar Operation with the AD5066
USING THE AD5066 WITH A GALVANICALLY
ISOLATED INTERFACE
In process control applications in industrial environments,
it is often necessary to use a galvanically isolated interface to
protect and isolate the controlling circuitry from any hazardous
06845-013
common-mode voltages that can occur in the area where
the DAC is functioning. iCoupler® provides isolation in excess
of 2.5 kV. The AD5066 uses a 3-wire serial logic interface, so
the ADuM1300 three-channel digital isolator provides the
required isolation (see Figure 49). The power supply to the
part also needs to be isolated, which is done by using a
transformer. On the DAC side of the transformer, a 5 V
regulator provides the 5 V supply required for the AD5066.
5V
POWER
REGULATOR
R2 = 10kΩ
+5V
AD820/
OP295
–5V
10µF
±5V
0.1µF
6845-014
⎡
O
⎝
⎣
⎛
×=
VV
⎜
⎢
⎞
×
⎟
536,65
⎠
R2R1D
+
R1
⎞
V
⎟
DDDD
⎠
⎛
⎜
⎝
⎤
R2
⎞
⎛
×−
⎟
⎜
⎥
R1
⎠
⎝
⎦
where:
D = the input code in decimal (0 to 65,535).
V
= 5 V.
DD
R1 = R2 = 10 kΩ.
10
×=D
⎛
V
⎜
O
⎝
⎞
V5
−
⎟
536,65
⎠
This is an output voltage range of ±5 V, with 0x0000 corresponding to a −5 V output, and 0xFFFF corresponding to a
+5 V output.
SCLK
DATA
Rev. 0 | Page 21 of 24
V
SCLK
AD5066
SYNC
DIN
GND
SDI
V
IA
ADuM1300
V
IB
V
IC
V
OA
V
OB
V
OC
Figure 49. AD5066 with a Galvanically Isolated Interface
DD
V
x
OUT
06845-015
AD5066
OUTLINE DIMENSIONS
5.10
5.00
4.90
0.15
0.05
4.50
4.40
4.30
PIN 1
16
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.10
0.30
0.19
9
81
1.20
MAX
SEATING
PLANE
6.40
BSC
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 50. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeter
ORDERING GUIDE
Package
Model Temperature Range Package Description
Option
AD5066BRUZ1 −40°C to +125°C 16-Lead TSSOP RU-16 Zero ±1 LSB INL 16 bits
AD5066BRUZ-REEL71 −40°C to +125°C 16-Lead TSSOP RU-16 Zero ±1 LSB INL 16 bits
AD5066ARUZ
AD5066ARUZ-REEL7
1
Z = RoHS Compliant Part.
1
−40°C to +125°C 16-Lead TSSOP RU-16 Zero ±4 LSB INL 16 bits
1
−40°C to +125°C 16-Lead TSSOP RU-16 Zero ±4 LSB INL 16 bits