Amp ed RF Technology BT53 datasheet

BT53 Datasheet

Amp’ed RF Technology, Inc.

BT53 Product Specification

11.6mm x 13.5mm

Description

Our micro-sized Bluetooth module, with

integrated antenna, is the smallest form factor

available providing a complete RF platform. The

BT53 is supports both Bluetooth Classic and Low

Energy, version v4.0.

BT53 Features
Bluetooth features

 FCC &Bluetooth licensed radio

 Bluetooth v4.0

 Class 1 radio

 Range up to 80m LOS

 1.5Mbps data throughput

 128-bit encryption security

Hardware configuration

 Cortex-M4microprocessor up to 84MHz

 256K bytes Flash memory

 64K bytes RAM memory

 UART, up to 2M baud

The BT53 is a surface mount PCB module that

provides fully embedded, ready to use Bluetooth

wireless technology. Our standard abSerial and

Amp’edUP Stack are pre-flashed into the

integrated flash memory, supporting the

SPPprofile. Other standard Bluetooth profiles are

also available.

Customized firmware for peripheral device

interaction, power optimization, security, and

other proprietary features may be supported and

can be ordered pre-loaded and configured.

 SPI and I2C interfaces

 7 general purpose I/O

 4x12-bit A/D inputs

 1 LPO input

Embedded software

 Amp’edUPdual mode Bluetooth stack: BT

Classic and BT Low Energy

 abSerial, AT command set

 SDK, Software Development Kit (Optional)

 BlueGuard, data encryption software (Optional)

 Mobile application software (Optional)

Additional documentation

 abSerial User Guide

 abSerial Reference Guide

 abSerial Configuration Guide

Phone: [phone] | Fax: [phone] | E-mail: [e-mail]
Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

Table of Contents

BT53 Product Specification ................................................................................................................................................ 2

Description ......................................................................................................................................................................... 2

1 Software Architecture ................................................................................................................................................. 4

1.1 Lower Layer Stack ..................................................................................................................................................... 4

1.2 Upper Layer Stack: Amp’ed UP ................................................................................................................................. 4

1.3 HCI Interface .............................................................................................................................................................. 4

1.4 AT Command Set: abSerial ....................................................................................................................................... 4

2 Hardware Specifications ............................................................................................................................................ 5

2.1 Recommended Operating Conditions ........................................................................................................................ 5

2.2 Absolute Maximum Ratings ....................................................................................................................................... 5

2.3 Current Consumption ................................................................................................................................................. 5

2.4 Selected RF Characteristics....................................................................................................................................... 6

2.5 I/O Operating Characteristics ..................................................................................................................................... 6

2.6 Pin Assignment .......................................................................................................................................................... 7

2.7 Pin Placement Diagram (Top View) ........................................................................................................................... 8

2.8 Layout Drawing .......................................................................................................................................................... 8

3 Module Block Diagram ............................................................................................................................................... 9

4 Hardware Design ....................................................................................................................................................... 9

4.1 Module Reflow Installation ......................................................................................................................................... 9

4.2 GPIO Interface ......................................................................................................................................................... 10

4.3 UART Interface ........................................................................................................................................................ 10

4.4 PCB Layout Guidelines ............................................................................................................................................ 11

4.5 Reset Circuit ............................................................................................................................................................. 11

4.6 External LPO Input Circuit........................................................................................................................................ 12

4.7 Audio Application Reference Design ....................................................................................................................... 13

5 Regulatory Compliance ............................................................................................................................................ 13

5.1 Modular Approval, FCC and IC ................................................................................................................................ 14

5.2 FCC Label Instructions ............................................................................................................................................. 14

6 Ordering Information ................................................................................................................................................ 15

7 Feature Comparison ................................................................................................................................................ 15

8 Revision History ....................................................................................................................................................... 15

Phone: [phone] | Fax: [phone] | E-mail: [e-mail]
Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

3

1 Software Architecture

1.1 Lower Layer Stack

 Bluetooth v4.0, Classic and Low Energy

 Device power modes: active, sleep and deep sleep

 Wake on Bluetooth feature optimized power consumption of host CPU

 Authentication and encryption

 Encryption key length from 8 to 128 bits

 Persistent FLASH memory for BD Address and user parameter storage

 All ACL packet types.

 Bluetooth test modes per Bluetooth specification

 802.11b/g/n co-existence: AFH

 Vendor specific HCI commands to support device configuration and certification test modes

1.2 Upper Layer Stack: Amp’ed UP

 SPP, GAP, ATT, GATT

 RFComm, SDP, and L2CAP

1.3 HCI Interface

 Bluetooth v4.0 specification compliant

 HCI UART transport layer (H4)

1.4 AT Command Set: abSerial

 Please see abSerial Reference Guide for details

Phone: [phone] | Fax: [phone] | E-mail: [e-mail]
Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

4

A

2 Hardware Specifications

General Conditions (VIN= 2.5V and 25°C)

2.1 Recommended Operating Conditions

Rating Min Typical Max Unit

Operating Temperature Range -40 - 85 °C

Supply Voltage VIN 2.2 2.5 4.8 Volts

Signal Pin Voltage - 1.9 - Volts

RF Frequency 2400 - 2483.5 MHz

2.2 Absolute Maximum Ratings

Rating Min Typical Max Unit

Storage temperature range -55 - +150 °C

Supply voltage VIN -0.3 - +5.0 Volts

I/O pin voltage VIO -0.3 - +5.5 Volts

RF input power - - -5 dBm

2.3 Current Consumption

Standard CPU Mode, 8 MHz

 UART supports up to 115 Kbps
 Data throughput up to 200 Kbps
 abSerial v1.7 (firmware)
 Shallow Sleep enabled

Modes (Typical Power Consumption)

ACL data 115K Baud UART at max throughput (Master) 16.5 mA

ACL data 115K Baud UART at max throughput (Slave) 18.5 mA

Connection, no data traffic, master 5.2 mA

Connection, no data traffic, slave 7.4 mA

Connection, 375ms sniff, slave 590 µA

Standby, without deep sleep 4.9 mA

Standby, with deep sleep 140 uA

Page/Inquiry Scan, with deep sleep 720 µA

BLE Advertising, 1.28s, non-connectable 195 µA

BLE Advertising, 1.28s, discoverable 215 µA

vg Unit

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5

2.4 Selected RF Characteristics

Parameters Conditions Typical Unit

Antenna load 50 ohm

Radio Receiver

Sensitivity level

Maximum usable level

Input VSWR 2.5:1

Radio Transmitter

Maximum output power 50 Ω load +12 dBm

Initial Carrier Frequency Tolerance 0 kHz

20 dB Bandwidth for modulated carrier 935 kHz

BER < .001

with DH5

BER < .001

with DH1

-92 dBm

0 dBm

2.5 I/O Operating Characteristics

Symbol Parameter Min Max Unit Conditions

VIL Low-Level Input Voltage - 0.6 Volts VIN, 2.1V

VIH High-Level Input Voltage 1.4 - Volts VIN, 2.1V

VOL Low-Level Output Voltage - 0.4 Volts VIN, 2.1V

VOH High-Level Output Voltage 1.8 - Volts VIN, 2.1V

IOL Low –Level Output Current - 4.0 mA VOL = 0.4 V

IOH High-Level Output Current - 4.0 mA VOH = 1.8V

RPU Pull-up Resistor 80 120 KΩ Resistor Turned On

RPD Pull-down Resistor 80 120 KΩ Resistor Turned On

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Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

6

2.6 Pin Assignment

Name Type Pin # Description ALT Function 5V Tolerant Initial State

UART Interface

RXD I 13 Receive data Y

TXD O 14 Transmit data Y

RTS O 12 Request to send (active low) I2C Data Y

CTS I 11 Clear to send (active low) I2C Clock Y

Reserved

BOOT 0 I 9 Reserved

Power and Ground

VIN 8 VIN

GND 7 GND

LDOOUT 18 LDO OUTPUT 1.9V

Reset

RESETN I 10 Reset input (active low for 5 ms) 2.5V max

LPO

LPO I 15 Low power clock input (required)

GPIO – General Purpose Input/Output

GPIO [1] I/O 1 General Purpose Input/Output SPI MISO Y Input pull down

GPIO [2] I/O 2 General Purpose Input/Output

GPIO [3] I/O 3 General Purpose Input/Output

GPIO [4] I/O 4 General Purpose Input/Output SPI SS/I2S_WS Y Input pull down

GPIO [5] I/O 5 General Purpose Input/Output I2C Data Y Input pull down

GPIO [6] I/O 6 General Purpose Input/Output I2C Clock Y Input pull down

GPIO [7] I/O 17 General Purpose Input/Output ADC 0 Y Input pull down

GPIO [8] I/O 16 General Purpose Input/Output ADC1 Y Input pull down

SPI

MOSI/I2S_SD

SPI SCLK/

I2S_SCK

Y Floating

Y Input pull down

Phone: [phone] | Fax: [phone] | E-mail: [e-mail]
Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

7

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acement D

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View)

2.8 Layo

Si

t Drawing

e: 11.6 mm x

1 GPIO1

2 GPIO

3 GPIO

4 GPIO

5 GPIO

6 GPIO

13.5 mm x 2.

UT

8 LD

(1.40

GPIO7 17

55

GPIO8 16

2 mm

531.5 mil

(13.5 mm)

471.5 mil

(12 mm)

il

mm)

LPO 15

296.5 mil

(7.5 mm)

TXD 14

RXD 13

RTS 12

CTS 11

RESET 10

BOOT0 9

31.2 mil

(0.8 mm)

40 mil

(1 mm)

456. 7 mil

(11.6 mm)

59 mil

(1.5 mm)

7 GND

VIN 8

Ph

ne: [phone]

ress : 1879 Lund

电

：[phone]
：天津市华苑

30 | Fax: 408-21
Ave, ste. 138, Sa

5100 | 传真：+8

业区海泰西路 1

-9533 | E-mail: i
Jose, CA 951 31

022-83945100

号西 3B-202（

fo@ampedrftech.

111 | E-mail: inf

00384）

om

cn@ampedrftech

.com

8

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The BT53





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e Design

modules s

hese interfa

scope of th

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area aroun

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t be routed

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, USB, SPI

ndent upon

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lator is requ

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ounded.

na should

6 mm in all

underneath

uetooth mo

and GPIO

the firmwar

mand inte

red on pin 1

not ground.

e free of

irections.

he module.

dule suppli

hardware in

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face uses th

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ase note th

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PCB. The

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final

assembly

For RoHS

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Pb-free app

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ications, Sn

emperature

d fall slope

d fall slope

liquidous o

files are:

6.5/Ag3.0/

of 230° - 24

fter liquido

fter liquido

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s of < 3°C/

onds.

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50°C).

econd.

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nded.

Ph

ne: [phone]

ress : 1879 Lund

电

：[phone]
：天津市华苑

30 | Fax: 408-21
Ave, ste. 138, Sa

5100 | 传真：+8

业区海泰西路 1

-9533 | E-mail: i
Jose, CA 951 31

022-83945100

号西 3B-202（

fo@ampedrftech.

111 | E-mail: inf

00384）

om

cn@ampedrftech

.com

9

4.2 GPIO Interface

All GPIOs are capable of sinking and sourcing 6mA of I/O current.

4.3 UART Interface

The UART is compatible with the 16550 industry standard. Four signals are provided with the UART

interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow

control.

Connection to Host Device

Typical RS232 Circuit

Phone: [phone] | Fax: [phone] | E-mail: [e-mail]
Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

10

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types of sy

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tem reset c

Reset Circ

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Note:

R

ranges

PU

rom 30K oh

m to 50K oh

m internally.

Ph

ne: [phone]

ress : 1879 Lund

电

：[phone]
：天津市华苑

30 | Fax: 408-21
Ave, ste. 138, Sa

5100 | 传真：+8

业区海泰西路 1

-9533 | E-mail: i
Jose, CA 951 31

022-83945100

号西 3B-202（

fo@ampedrftech.

111 | E-mail: inf

00384）

om

cn@ampedrftech

.com

11

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Internal

:

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it:

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4.6 Exter

n externa

crystal osci

The accura

ranges fro

U

should b

ST

nal LPO In

l source mu

llator). The

cy of the slo

Ext 32.768

1 GPI O1

2 GPI O2

3 GP IO3

4 GP IO4

5 GP IO5

30K ohm

from 1K oh

ut Circuit

t supply th

ource must

clock freq

Hz Clock In

15 LPO

o 50K ohm

to 10K oh

slow clock

be a digital

ency must

ut (LPO)

TXD 14

RXD 13

RTS 12

CTS 11

RESET 10

nternally.

and conne

ignal in the

e 32.768 K

t to the LP

range of 0 t

z ±150 pp

pin (for e

1.8 V.

for Blueto

LPO Para

Frequency:

Tolerance: 1

Voltage Lev

Lo

Hig

Input Capaci

ample, the

th use.

eters:

2.768 KHz

0 ppm

ls:

: 0.1 V

: 1.8 V

tance: 2.5 pF

ost or exte

maximum

nal

6 GP IO6

7 GND

BOOT0 9

VIN 8

Ph

ne: [phone]

ress : 1879 Lund

电

：[phone]
：天津市华苑

30 | Fax: 408-21
Ave, ste. 138, Sa

5100 | 传真：+8

业区海泰西路 1

-9533 | E-mail: i
Jose, CA 951 31

022-83945100

号西 3B-202（

fo@ampedrftech.

111 | E-mail: inf

00384）

om

cn@ampedrftech

.com

12

External LPO Reference Circuit

4.7 Audio Application Reference Design

TBD

5 Regulatory Compliance

This module has been tested and found to comply with the FCC Part15 and IC RSS-210 rules.

These limits are designed to provide reasonable protection against harmful interference in

approved installations. This equipment generates, uses, and can radiate radio frequency energy

and, if not installed and used in accordance the instructions, may cause harmful interference to

radio communications. However, there is no guarantee that interference will not occur in a

particular installation. This device complies with part 15 of the FCC Rules. Operation is subject to

the following two conditions: (1) This device may not cause harmful interference, and (2) this

device must accept any interference received, including interference that may cause undesired

operation.

Modifications or changes to this equipment not expressly approved by Amp’ed RF Technology

may void the user’s authority to operate this equipment.

This Class B digital apparatus complies with Canadian ICES-003.

Cetappareilnumérique de la classe B estconforme à la norme NMB-003 du Canada.

The modular transmitter must be equipped with either a permanently affixed label or must be

apable of electronically displaying its FCC identification number

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13

(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC

identification number, and, if the FCC identification number is not visible when the module is

installed inside another device, then the outside of the device into which the module is installed

must also display a label referring to the enclosed module. This exterior label can use wording

such as the following: “Contains Transmitter Module FCC ID: X3ZBTMOD8” or “Contains FCC ID:

X3ZBTMOD8.”

(B) If the modular transmitter uses an electronic display of the FCC identification number, the

information must be readily accessible and visible on the modular transmitter or on the device in

which it is installed. If the module is installed inside another device, then the outside of the device

into which the module is installed must display a label referring to the enclosed module. This

exterior label can use wording such as the following: “Contains FCC certified transmitter

module(s).”

To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a

separation distance of 20 cm or more should be maintained between the antenna of this device

and persons during operation. To ensure compliance, operation at closer than this distance is not

recommended. The antenna(s) used for this transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter.

5.1 Modular Approval, FCC and IC

FCC ID: X3ZBTMOD8

IC: 8828A-MOD8

In accordance with FCC Part 15, the BT53 is listed above as a Modular Transmitter device.

5.2 FCC Label Instructions

The outside of final products that contain a BT53 device must display a label referring to the

enclosed module. This exterior label can use wording such as the following:

Contains Transmitter Module

FCC ID: X3ZBTMOD8

IC: 8828A-MOD8

Any similar wording that expresses the same meaning may be used.

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电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

14

6 Ordering Information

Part Name Description

BT53H High performance version

BT53S Audio application version

7 Feature Comparison

Features BT53H BT53S

CPU Speed 84MHz Max. 84MHz Max.

CPU Memory 256K Flash, 64K RAM 256K Flash, 64K RAM

Bluetooth Profile Support SPP, IAP, OBEX SPP, IAP, A2DP, HFP, AVRCP,HID,

OBEX

Bluetooth Stack Amp’edUP, BT v4.0 + BLE Amp’edUP, BT v4.0 + BLE

Apple iOS Support Supported Supported

AT Command Interface abSerial abSerial

Multiple Connections 7 Max. 7 Max.

Link Throughput 1.5M bps max 1.5M bps max

Serial Interface UART, I2S, I2C, SPI UART, I2S, I2C, SPI

General I/O Lines 7 7

A/D Lines 4 4

8 Revision History

Data Revision Description

29Aug 2014 1 First release

18 Dec 2014 1.1 Added BT53S model

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Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131

电话：[phone] | 传真：[phone] 转 111 | E-mail: [e-mail]
地址：天津市华苑产业区海泰西路 18 号西 3B-202（300384）

15