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BT11 Bluetooth Module OEM General User and
Installation Guide
I. OEM Usage Intructions
Installation
The BT11 is a surface mount Bluetooth module supplied on a 24 pin, 6-layer
PCB. The final assembly recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
Maximum peak temperature of 230° - 240°C (below 250°C).
Maximum rise and fall slope after liquidous of < 2°C/second.
Maximum rise and fall slope after liquidous of < 3°C/second.
Maximum time at liquidous of 40 – 80 seconds.
Layout
The area around the BT11 module should be free of any ground planes, trace
routings, or metal for at least 6mm from the antenna in all directions. Traces should
not be routed underneath the module.
Crystal Tuning and Power Calibration
These steps are performed by the manufacturer, and must NOT be modified from
the settings applied during manufacturing. Any changes to these settings may void
the user’s authority to operate this equipment.
Operating Conditions
The permitted operating and storage temperatures, power supply requirements, and
I/O tolerances are specified in the BT11 Datasheet.
RF Exposure Warning
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This device's external antenna must be installed in
accordance with provided instructions and it must be operated with a minimum of 20
cm spacing between antennas and all persons’ bodies (excluding extremities of
hands, wrists and feet) during wireless mode of operation. Further, this transmitter
must not be co-located or operated in conjunction with any other antenna or
transmitter.
Amp’ed RF Technology, Inc.
Rev: 1.0
1/6/2010
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II. Notice of FCC Regulatory Compliance
This module has been tested and found to comply with the FCC Part15 Rules.
These limits are designed to provide reasonable protection against harmful
interference in approved installations. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance the
instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. This
device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause
undesired operation.
Modifications or changes to this equipment not expressly approved by Amp’ed RF
Technology Inc. may void the user’s authority to operate this equipment.
III. Modular Approval
FCC ID: X3ZBTMOD1
In accordance with FCC Part 15, the BT11 is listed above as a Modular Transmitter
device.
In support of the Modular Transmitter Approval, the following is stated:
1. The module does have its own RF shielding.
2. The module does have buffered modulation / data inputs.
3. The module does regulate its own power supply.
4. The module does have a permanently attached antenna.
5. The module can be tested as a stand-alone device.
6. The module is labeled with the proper FCC ID, and labeling instructions are
provided to OEM end users for external product labels.
7. The module does have instruction for proper use.
8. The module does meet the FCC RF regulations.
IV. FCC Label Instructions
The outside of final products that contain a BT11 device must display a label
referring to the enclosed module. This exterior label can use wording such as the
following: “Contains Transmitter Module FCC ID: X3ZBTMOD1” or “Contains FCC
ID: X3ZBTMOD1.” Any similar wording that expresses the same meaning may be
used. An example of this label is figure 1 below:
Amp’ed RF Technology, Inc.
Rev: 1.0
1/6/2010
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Model: BT11
Input 3VDC 60mA
Made in China
Amp’ed RF Technology
Contains Transmitter Module
FCC ID: X3ZBTMOD1
This device complies with part 15 of the FCC Rules. Operation is
subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any in
received, including interference that may cause undesired ope
terference
ration.
Figure 1: External Device FCC Label Sample
Amp’ed RF Technology, Inc.
Rev: 1.0
1/6/2010
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