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Bluetooth Module
BLE60/BLE63 Datasheet
Amp’ed RF Technology, Inc.
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BLE60/BLE63 Product Specification
BLE60/BLE63 features
Bluetooth features
Bluetooth v4.2 Smart Ready
1Mbps data throughput
13.5mm x 10.5mm x 2.6mm
Description
Amp’ed RF Technology presents the
BLE60/BLE63 Smart Ready Bluetooth module
supporting v4.2 Bluetooth Low Energy.
Including an integrated internal antenna, the
BLE60/BLE63 provides a complete ready-touse RF platform. The BLE60/BLE63 is a
surface mount PCB module, with pre-tested
RF regulatory certifications improving time to
market and reliability.
A ready to use AT command set enables
instant BLE connectivity usage cases.
128-bit encryption security
Hardware configuration
l
Cortex-M0 microprocessor
l
128K bytes Flash memory
l
64Kbytes RAMmemory
l
96Kbytes ROM memory
l
Two UARTs
l
Up to 8 general purpose I/Os
l
1 SPI
Embedded software
BLE protocol stack
AT command set
Additional documentation
BLE Application Note
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Table of Contents
1.
Hardware Specifications ........................................................................................................ 4
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
1.8.
2.
3.
3.1.
3.2.
3.3.
3.4.
3.5.
4.
4.1.
4.2.
4.3.
5.
Recommended Operating Conditions ...................................................................................................................... 4
Absolute Maximum Ratings ..................................................................................................................................... 4
Current Consumption ............................................................................................................................................... 4
Selected RF Characteristics .................................................................................................................................... 5
I/O Operating Characteristics ................................................................................................................................... 5
Pin Assignment ........................................................................................................................................................ 6
Pin Placement Diagram (Top View) ......................................................................................................................... 7
Layout Drawing ........................................................................................................................................................ 8
Module Block Diagram ........................................................................................................... 9
Hardware Design ..................................................................................................................... 9
Module Reflow Installation ..................................................................................................................................... 10
GPIO Interface ....................................................................................................................................................... 10
PCB Layout Guidelines .......................................................................................................................................... 11
External LPO Input Circuit ..................................................................................................................................... 11
Application Reference Design................................................................................................................................ 13
Regulatory Compliance ........................................................................................................ 14
Modular Approval, FCC and IC .............................................................................................................................. 15
FCC Label Instructions .......................................................................................................................................... 15
CE Label Instructions ............................................................................................................................................. 16
Ordering Information ............................................................................................................ 16
6.
Revision History .................................................................................................................... 16
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Rating
Min
Typical
Max
Unit
Operating Temperature Range
-40 -
85
°C
Supply Voltage VIN
2.4
3.0
3.6
Volts
Signal Pin Voltage
-
0.7V
VDDIO
~ V
DDIO
- Volts
RF Frequency
2400 -
2483.5
MHz
Rating
Min
Typical
Max
Unit
Storage temperature range
-55 -
+150
°C
Supply voltage VIN
-0.3 -
+5.0
Volts
I/O pin voltage VIO
-0.3 -
+5.5
Volts
RF input power
- - 0 dBm
Modes (Typical Power Consumption)
Avg
Unit
Deep sleep mode
6 uA
Sleep mode
8 uA
Idle mode
0.9
mA
Rx mode
13.6
mA
Tx mode
13.3
mA
1.
Hardware Specifications
General Conditions (VIN= 3.0V and 25°C)
1.1. Recommended Operating Conditions
1.2. Absolute Maximum Ratings
1.3. Current Consumption
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Parameters
Conditions
Typical
Unit
Antenna load
50
ohm
Radio Receiver
Sensitivity level
BER < .001 with DH5
-92
dBm
Maximum usable level
BER < .001 with DH1
0 dBm
Input VSWR
2.5:1 Radio Transmitter
Maximum output power
50 Ω load
+4
dBm
Initial Carrier Frequency Tolerance
0 kHz
20 dB Bandwidth for modulated carrier
935
kHz
Symbol
Parameter
Min
Max
Unit
Conditions
V
IL
Low-Level Input Voltage
-
0.3 × VCC
Volts
V
IN
, 3.0V
V
IH
High-Level Input Voltage
0.7× VCC
- Volts
V
IN
, 3.0V
V
OL
Low-Level Output Voltage
-
0.1× VCC
Volts
V
IN
, 3.0V
V
OH
High-Level Output Voltage
0.9× VCC
- Volts
V
IN
, 3.0V
1.4. Selected RF Characteristics
1.5. I/O Operating Characteristics
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Name
Type
Pin #
Description
UART Interface
RXD1
I 13
Receive data/ SPI_MISO
TXD1 O
14
Transmit data/SPI_MOSI
RTS1 O
12
Request to send (active low)/ SPI_CLK
CTS1 I
11
Clear to send (active low) /SPI_CS
Power and Ground
VIN 8 VIN
GND 7 GND
GND 18
GND
Reset
RESETN
I 10
Reset input
LPO
LPO
I
15
Low power clock input
Connect an external source when using PN: BLE60.
Be left floating with PN: BLE60_LP
Fast boot
Fast boot
I 9
Fast boot enable
GPIO
GPIO1
1 GPIO1/SWCLK/ADC_IN3
GPIO2
2 GPIO2/SWDIO/ADC_IN2
GPIO3
3 GPIO3/PWM output 0
GPIO4
4 GPIO4/CLK output 0
TXD0
5 TXD0/GPIO5
RXD0
6 RXD0/GPIO6
GPIO7
16
GPIO7/SDA
GPIO8
17
GPIO8/SCL/ PWM output 1
1.6. Pin Assignment
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1.7. Pin Placement Diagram (Top View)
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1.8. Layout Drawing
13.5 mm x 10.5 mm x 2.6 mm (+/- 0.2mm, height tolerance))
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2.
Module Block Diagram
An external source may optionally supply the slow clock to the LPO pin when using PN: BLE60/BLE63. This
clock is already supplied on the module with PN: BLE60/BLE63_LP, and no additional circuitry is needed.
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3.
Hardware Design
Notes
All unused pins should be left floating; do not ground.
All GND pins must be well grounded.
The area around the antenna should be free of any ground planes, power planes, trace routings, or metal for
at least 5 mm in all directions.
Traces should not be routed underneath the module.
The BLE60s/BLE63s must be reprogramed via UART0.
3.1. Module Reflow Installation
The BLE60/BLE63 is a surface mount Bluetooth module supplied on an 18 pin, 6-layer PCB. The final
assembly recommended reflow profiles are:
For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended.
Maximum peak temperature of 230° - 240°C (below 250°C).
Maximum rise and fall slope after liquidous of < 2°C/second.
Maximum rise and fall slope after liquidous of < 3°C/second.
Maximum time at liquidous of 40 – 80 seconds.
3.2. GPIO Interface
All GPIOs are capable of sinking and sourcing 6mA of I/O current.
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Module part number
Low power usage
External LPO circuit required
BLE60/BLE63
No
Not required
BLE60/BLE63
Yes
Required
BLE60/BLE63_LP
Yes or no
Not required
3.3. PCB Layout Guidelines
3.4. External LPO Input Circuit
An external source may optionally supply the slow clock to the LPO pin when using PN: BLE60/BLE63.
This clock is already supplied on the module with PN: BLE60/BLE63_LP, and no additional circuitry is
needed. The source must be a digital signal in the range of 0.1V to Vcc. The accuracy of the slow clock
frequency must be 32.768 KHz ±100 ppm.
3.4.1. Low power circuit requirements
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3.4.2. External LPO circuit example
External LPO Reference Circuit
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3.5. Application Reference Design
3.5.1. Reference Design with EXT LPO
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3.5.1. Reference Design with INT LPO
Notes: The LPO pin should be left floating; do not ground.
4.
Regulatory Compliance
Federal Communications Commission statement:
This module has been tested and found to comply with the FCC Part15.
These limits are designed to provide reasonable protection against harmful interference in approved
installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by Amp’ed RF Technology may void the
user’s authority to operate this equipment.
The modular transmitter must be equipped with either a permanently affixed label or must be capable of
electronically displaying its FCC identification number
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(A)
If using a permanently affixed label, the modular transmitter must be labeled with its own FCC
identification number, and, if the FCC identification number is not visible when the module is installed inside
another device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following: “Contains
Transmitter Module FCC ID: X3ZBLEMOD1” or “Contains FCC ID: X3ZBLEMOD1.”
(B)
If the modular transmitter uses an electronic display of the FCC identification number, the
information must be readily accessible and visible on the modular transmitter or on the device in which it is
installed. If the module is installed inside another device, then the outside of the device into which the
module is installed must display a label referring to the enclosed module. This exterior label can use
wording such as the following: “Contains FCC certified transmitter module(s).”
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Industry Canada statement:
Label of the end product:
The final product must be labeled in a visible area with the following "Contains transmitter module IC: 8828ABLE1" This Class B digital apparatus complies with Canadian ICES-003.
Cetappareilnumérique de la classe B estconforme à la norme NMB-003 du Canada.
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and
Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:
(1)
This device may not cause interference; and
(2)
This device must accept any interference, including interference that may cause undesired operation of the
device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation,
Sciences et Développement économique Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
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(1)
L’appareil ne doit pas produire de brouillage;
(2)
L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.
4.1. Modular Approval, FCC and IC
FCC ID: X3ZBLEMOD1
IC: 8828A-BLE1
In accordance with FCC Part 15, the BLE60/BLE63 is listed above as a Modular Transmitter device.
4.2. FCC Label Instructions
The outside of final products that contain a BLE60/BLE63 device must display a label referring to the
enclosed module. This exterior label can use wording such as the following:
Contains Transmitter Module
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Part Name
Description
BLE60
BLE module, no LPO
BLE60_LP
BLE module, with LPO
BLE63
Audio BLE module
Date
Revision
Description
28, Dec 2018
1.0
Initial version
10, Jan, 2019
1.1
Added application reference design
27, Mar, 2019
1.2
Updated pinout chart
30, Apr, 2019
1.3
FCC and IC certifications
FCC ID: X3ZBLEMOD1
IC: 8828A-BLE1
Any similar wording that expresses the same meaning may be used.
4.3. CE Label Instructions
TBD
4.4. Bluetooth Certification
Bluetooth QDID:
5.
Ordering Information
6.
Revision History
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