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AMD Geode™ Solutions
EBGA Package Clarification
1.0 Scope
Some AMD Geode™ devices are available in an EBGA
(Enhanced Ball Grid Array) package. This document provides clarification on the EBGA package. The data book(s)
do not specify any electrical condition pertaining to the
metal top. Through the epoxy die attach process used for
the Geode devices, the metal top (heat sink) of the EBGA
package can be electrically open or connected to V
2.0 Discussion
The Geode devices are packaged in 352-terminal and 432terminal cavity-down EBGA substrates. Each has separate
planes for V
tripline with VSS as the reference plane. The VSS ring is
connected to the VSS plane using the plated sidewall of the
cavity. In order to allow for adequate thermal dissipation, a
conductive (silver-impregnated) die attach epoxy is used to
connect the die directly to the heat sink.
, VIO, and V
SS
. Signal traces are micros-
CORE
SS
.
As a result of the cavity size tolerance in addition to the
assembly process controls, it is possible for the die attach
epoxy to bridge the die edge and heat sink to the sidewall,
and short the die backside and heat sink to V
ume resistivity of the die attach epoxy is ~ 0.3 Ω-cm.
In summary, the epoxy bridging is inherent to the manufacturing process. Some devices have been in high-volume
production for well over two years. Furthermore, AMD’s
dynamic operational-life results (1,600 units representing
over 75,000 device-hours) along with the Customer DPPM
performance does not suggest that the epoxy bridging
adversely affects product quality or reliability. If any questions arise, contact you local AMD support representative.
. The vol-
SS
Revision 2.0 - January 2001 - Confidential 1
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