AMD Am29lv004 Service Manual

PRELIMINARY
Am29LV004

DISTINCTIVE CHARACTERISTICS

Single p ower supply operation
— Full vol t ag e r ange : 2. 7 t o 3.6 v o l t re ad an d w r ite
operations f or battery-powered app licati ons
— Regulated voltage range: 3.0 to 3.6 volt read
and write operations and for compatibility with high performance 3.3 volt microprocessors
High performance
— Full voltage range: access times as fast as 100
ns
— Regulated voltage range: access times as fast
as 90 ns
Ultra low power consumptio n (typical values at
5 MHz)
— 200 nA Automatic Sleep mode current — 200 nA sta ndby mode current — 10 mA read current — 20 mA program/erase current
Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
seven 64 Kbyte sectors — Supports full chip erase — Sector Protection fe atures:
A hardware method of locking a sector to
preve nt any program or erase operations within
that sector
Sectors can be locked via programming
equipment
T empor ary Sect or Unprote ct featu re allows c ode
changes in previously locked sectors
Top or bottom boot block configurations
available
Embedded Algorithms
— Embedded Erase al gorithm automat ically
preprograms and erases the entire chip or any combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies d ata at sp ecified addresses
Typical 1,000,000 write cycles per sector
(100,000 cycles minimum guaranteed)
Package option
— 40-pin TSOP
Compatibility with JEDEC standards
— Pinout and software compatible with single-
power supply Flash
— Superior inadvertent write p rotect ion
Data# Polling a nd toggle bits
— Provides a software method of detecting
program or erase operation completion
Ready/Bu sy # pin (RY/BY#)
— Provides a hardware method of detecting
program or erase cycle completion
Erase Su s pe nd/E r as e Resume
— Suspends an erase operation to read data from,
or program data to, a sector that is not being erased, then resumes the erase operation
Hardware reset pin (RESET#)
— Hardware method to reset the device to reading
array data
This document contains in formation on a product under development at Adv anced Micro Device s . The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice.
Refer to AMD’s Website (www.amd.com) for the latest information.
Publication# 20510 Rev: D Amendment/+1 Issue Date: March 1998
PRELIMINARY

GENERAL DESCRIPTION

The Am29LV004 is an 4 Mbit, 3.0 volt-only Flash memory organized as 524,288 bytes. The device is offered in a 40-pin TSOP package. The byte-wide (x8)
data appe ars on DQ7 –DQ 0. This devic e requ ires onl y a single, 3.0 volt V and erase operations. A stan dard EPROM pro­grammer can als o be us ed to pr ogram a nd erase the device.
The standard device offers access times of 90, 100, 120, and 150 ns, allowing high speed microprocessors to operate without wait states. To eliminate bus conten­tion the d evice ha s separat e chip en able (CE #), writ e enable (WE#) and outp ut enabl e (OE#) controls.
The device requires only a single 3.0 volt power sup- ply for both rea d an d write fu nct ions. Interna l ly g en er ­ated and r egulated voltages a re provided for th e program and erase operations.
The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Com­mands ar e w ri tt en to th e c om ma nd re gi s ter us i ng st a n­dard micr opro cess or wr ite timi ngs. R egi ster c ont ents serve as input to an internal state-machine that con­trols the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the progra mming and e rase o pera tion s. Re ading d ata ou t of the de vice is s imilar to readin g from o ther Flas h or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that auto­matical ly time s the program pulse widths and ver ifies proper cell margin.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algo­rithm—an internal algorithm that automatically prepro­grams the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.
supply to pe rf o rm r ea d, pr og ra m,
CC
The host system can detect whether a program or erase op eratio n is co mpl ete by o bse rving th e RY/B Y# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been com p lete d, the devic e is re ady to read a rra y data o r accept another command.
The sector erase architecture allows memory sect ors to be er ased and reprog rammed withou t affecting the data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a l ow V
detector that au tomatically inhibits write opera-
CC
tions during power transitions. The hardware sector protection feature disables both program and erase
operat ions in any combina tion of the s ectors of m em­ory. This can be achieved via programming equipment.
The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved.
The hardware RESET# pin terminates a ny operatio n in progress and resets the internal state machine to reading array data. The RESET# pin may b e ti ed to t he system reset circuitry. A system reset would thus als o reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When addres ses have been stable for a s p ec i fied amount o f time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power co nsumpt ion is greatly reduc ed in bot h these modes.
AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effective­ness. The device electrically erases all b its with in a sector simultaneously via Fowler-Nordheim tun­neling. The data is programmed using hot electron injection.
2 Am29LV004
PRELIMINARY

PRODUCT SELECTOR GUIDE

Family Part Number Am29LV004
Speed Options
Max access time, ns (t Max CE# access time, ns (tCE) 90 100 120 150 Max OE# access time, ns (tOE) 40 40 40 55
Regulated Voltage Range: VCC =3.0–3.6 V -90R
Full Voltage Range: VCC = 2.7–3.6 V -100 -120 -150
) 90 100 120 150
ACC
Note: See “AC Characteristics” for full specifications.

BLOCK DIAGRAM

DQ0
DQ7
Input/Output
Buffers
Data
Latch
V
CC
V
SS
RESET#
WE#
CE#
OE#
RY/BY#
State
Control
Command
Register
PGM Voltage
Generator
Sector Switches
Erase Voltage
Generator
Chip Enable
Output Enable
Logic
STB
A0–A18
VCC Detector
Timer
STB
Address Latch
Y-Decoder
X-Decoder
Y-Gating
Cell Matrix
21522A-1
Am29LV004 3

CONNECTION DIAGRAMS

PRELIMINARY
A16 A15 A14 A13 A12 A11
A9 A8
WE#
RESET#
NC
RY/BY#
A18
A7 A6 A5 A4 A3 A2 A1
A17 V
SS
NC NC
A10 DQ7 DQ6 DQ5 DQ4
V
CC
V
CC
NC DQ3 DQ2 DQ1 DQ0
CE#
V
SS
CE#
A0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Standard TSOP
Reverse TSOP
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
A17 V
SS
NC NC A10 DQ7 DQ6 DQ5 DQ4 V
CC
V
CC
NC DQ3 DQ2 DQ1 DQ0 OE#
V
SS
CE# A0
A16 A15 A14 A13 A12 A11 A9 A8 WE# RESET# NC RY/BY# A18 A7 A6 A5 A4 A3 A2 A1
4 Am29LV004
21522A-2
PRELIMINARY

PIN CONFIGURATION

A0–A18 = 19 addresse s DQ0–DQ7 = 8 data inputs/outputs CE# = Chip enable OE# = Output enable WE# = Write enable RESET# = Hardware reset pin, active low RY/BY# = Ready/Busy# output V
= 3.0 volt-only single power supply
CC
V
SS
NC = Pin not connected internally
(see Product Selector Guide for speed options and voltage supply tolerances)
= Device ground

LOGIC SYMBOL

19
A0–A18
CE# OE#
WE# RESET#
8
DQ0–DQ7
RY/BY#
21522A-3
Am29LV004 5
PRELIMINARY
ORDERING INFORMATION Standard Products
AMD sta nd ar d p rod ucts are av a il ab le i n seve ral packa ge s and opera ti ng ra ng es. The order nu mb er (Valid Co mb i ­nation) is formed by a combination of the elements below.
Am29LV004
-90R
CET
OPTIONAL PROCESSING
Blank = Standard Proces sing B = Burn-in (Contact an AMD representative for more information)
TEMPERATURE RANGE
C=Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) E = Extended (–55°C to +125°C)
PACKAGE TYPE
E = 40-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 040)
F = 40-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR040)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top Sector B = Bottom Sector
DEVICE NUMBER/DE SCRIP TION
Am29LV004 4 Megabit (512 K x 8-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations list configurations planned to be sup­ported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.
Am29LV004T-70R, Am29LV004B-70R
Am29LV004T-80, Am29LV004B-80
Am29LV004T-90, Am29LV004B-90
Am29LV004T-120, Am29LV004B-120
Valid Combinations
EC, EI, FC, FI
EC, EI, EE, FC, FI, FE
6 Am29LV004
Valid Combinations
PRELIMINARY

DEVICE BUS OPERATIONS

This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memo ry location. The reg iste r is co mposed of lat che s that store the co m­mands, along with the address and data information needed to execu te the com mand . The co nte nts of th e
Table 1. Am29LV004 Device Bus Operations
Operation CE# OE# WE# RESET# Addresses (See Note) DQ0–DQ7
Read L L H H A Write L H L H A
V
±
Standby Output Disable L H H H X High-Z
Reset X X X L X High-Z Temporary Sector Unprotect X X X V
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5 V, X = Don’t Care, AIN = Address In, DIN = Data In, D
Note: Addresses are A18–A0.
CC
0.3 V
XX
register serve a s input s to the inter nal sta te mac hine. The state machine outputs dictate the function of the device. Table 1 lists the devi ce bus op erat ions , the in­puts and control levels they require, and the resulting output. The following subsections describe eac h of these operations in further detail.
D
D
D
= Data Out
OUT
OUT
VCC ±
0.3 V
ID
IN IN
X High-Z
A
IN
IN
IN

Requirements for Reading Array Data

To read array dat a from the ou tputs, the sys tem must drive the CE# and OE # pins to V
. CE# is the power
IL
control an d sel ects the de vice . OE# is th e outpu t con­trol and gates array data to the output pins. WE# should remain at V
.
IH
The internal state machine is set for reading array data upon devic e power-up, or aft er a hardware re set . This ensures that no spurious alteration of the mem­ory content occurs during the power transition. No command is necessary i n this mode to obtain array data. Standard micropr ocessor read cycles that as­sert valid addresses on the device add ress inputs pr o­duce valid data on the device data outputs. The device remains enabled for read access unt il the com­mand register contents are altered.
See “R ead ing Ar ray Data” fo r more info rmatio n. Refer to the AC Read Operations table for timing specifica­tions and to Figure 12 for the timing diagram. I
CC1
in
the DC Characteristics table represents the active cur­rent specification for reading array data.

Writing Commands/Command Sequences

To write a command or command sequence (which in­cludes programming data to the device and erasing sectors of memory ), the sy stem m ust drive WE# an d CE# to V
, and OE# to VIH.
IL
An eras e op e ra tio n ca n er ase on e s ect or, multipl e se c­tors, or the entire device. Tables 2 and 3 indicate the address space that each sector occupies. A “sector ad­dress” cons ists of the address bits required to uniquely select a sector. The “Command Defini tions” section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation.
After the system writes the autoselect command se­quence, the device enters the autoselect mode. The system can th en re ad aut ose lect codes fr om th e inter ­nal register (which is separate from the memory array) on DQ7– DQ0 . St anda rd r ead cycle ti ming s ap ply in this mode. Re fer to th e “ Autosele ct Mo de” an d “ Au to select Command Sequence” sections for more information.
I
in the DC Charac teristics table represents the ac-
CC2
tive current specification for the write mode. The “AC Characteristics” section contains timing specification tables and timing diagrams for write operations.

Program and Erase Operation Status

During an erase or program operation, the system may check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and I read specificati ons apply. Refer to “Write Operation Status” for more information, and to “AC Characteris­tics” for timing diagrams.
CC
Am29LV004 7
PRELIMINARY

Standby Mode

When th e sy st em is not read ing or wr itin g to the dev ice, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde­pendent of the OE# input.
The dev ice en ter s t he CM OS st an dby mode wh en the CE# and RESET# pins are both held at V
CC
± 0.3 V. (Note th at thi s is a mor e res trict ed vol tage rang e tha n V
.) If CE# and RESET# are held at VIH, but no t wit hin
IH
V
± 0.3 V, the device will be in the standby mode, but
CC
the standby current will be greater. The device requires standard access time (t
) for read access when the
CE
device is i n e ith er of these st and by modes, before it is ready to read data.
If the device i s desele cte d during erasur e or pro gram ­ming, the device draws active current until the operation is completed.
In the DC C haracte ristic s tabl es, I
CC3
and I
CC4
repre-
sents the standby current specification.

Automatic Sleep Mode

The au tomatic sl eep mode m inimizes F lash devi ce energy co nsumption. The device autom atically enables this mode when addresses remain stable for t
+ 30 ns. The automatic sleep mode is indepen-
ACC
dent of the CE # , WE #, an d O E # co ntr ol s i gn als. St an ­dard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. I
CC5
in the DC Characteristics table represents the auto­matic sleep mode current specification.

RESET#: Hardware Reset Pin

The RESET# pin provides a hardware method of reset­ting the device to reading array data. When the RE-
SET# pin is driven low for at least a per iod of t
RP
, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state ma­chine to reading array data. The operation that was in­terrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET # pulse. When RESET# is held at V
draws CMOS standby current (I at V
but no t wi t hin VSS±0.3 V, the standby current will
IL
±0.3 V, the device
SS
). If RESET# is held
CC4
be greater. The RESET# pin may be tied to the system reset cir-
cuitry. A system rese t would thus also res et th e Flas h memory, enabling the system to read the boot-up firm­ware from the Flash memory.
If RESET# is asserted during a program or erase op­eration, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of t
(during Embedded Algorithms ). The
READY
system can thus m onitor RY/BY# to determine whether the reset op erati on is c ompl ete. If R ESET # is asserted when a prog ram or erase operati on is not ex ­ecuting (RY/BY# pin is “1”), the reset operation is completed within a time of t ded Algorithms). The system can read data t the RESET# pin returns to V
(not during Embed-
READY
.
IH
RH
after
Refer to the AC Characteristics tables for RESET# pa­rameters and to Figure 13 for the timing diagram.

Output Disable Mode

When the OE# input is at VIH, output from the device is disabl e d . Th e o ut p ut pi n s ar e pl a c ed i n t he h igh i m ped­ance state.
8 Am29LV004
PRELIMINARY
Table 2. Am29LV004T Top Boot Block Sector Address Table
Sector Size
Sector A18 A17 A16 A15 A14 A13
SA0 0 0 0 X X X 64 00000h-0FFFFh SA1 0 0 1 X X X 64 10000h-1FFFFh SA2 0 1 0 X X X 64 20000h-2FFFFh SA3 0 1 1 X X X 64 30000h-3FFFFh SA4 1 0 0 X X X 64 40000h-4FFFFh SA5 1 0 1 X X X 64 50000h-5FFFFh SA6 1 1 0 X X X 64 60000h-6FFFFh SA7 1 1 1 0 X X 32 70000h-77FFFh SA8 1 1 1 1 0 0 8 78000h-79FFFh SA9 1 1 1 1 0 1 8 7A000h-7BFFFh
SA10 1 1 1 1 1 X 16 7C000h-7FFFFh
(Kbytes)
Address Range
(in hexadecimal)
Table 3. Am29LV004B Bottom Boot Block Sector Address Table
Sector Size
Sector A18 A17 A16 A15 A14 A13
SA0 0 0 0 0 0 X 16 00000h-03FFFh SA1 0 0 0 0 1 0 8 04000h-05FFFh SA2 0 0 0 0 1 1 8 06000h-07FFFh SA3 0 0 0 1 X X 32 08000h-0FFFFh SA4 0 0 1 X X X 64 10000h-1FFFFh SA5 0 1 0 X X X 64 20000h-2FFFFh SA6 0 1 1 X X X 64 30000h-3FFFFh SA7 1 0 0 X X X 64 40000h-4FFFFh SA8 1 0 1 X X X 64 50000h-5FFFFh SA9 1 1 0 X X X 64 60000h-6FFFFh
SA10 1 1 1 X X X 64 70000h-7FFFFh
(Kbytes)
Address Range
(in hexadecimal)

Autoselect Mode

The autoselect mode provides manufacturer and de­vice identification, and sector protection verification,
through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to auto mati ca lly match a de vice to b e pr ogra mmed with its corresponding programming al gorithm. However, the aut osel ect co des can also be a cces sed in -sy stem through the command register.
When using programming equipment, the autoselect mode requires V Address pins A6, A1, and A0 must be as shown in Table
4. In addition, when verifying sector protection, the sec-
(1 1.5 V to 12.5 V) on address pin A9.
ID
Am29LV004 9
tor address must appear on the appropriate highest order address bits (see Tables 2 and 3). Table 4 shows the remaining address bits that are don’t care. When all necessary bits have been set as required, the program­ming equipment may then read the corresponding iden­tifier code on DQ7–DQ0.
To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in Table 5. This method does not require V
. See “Command Definitions” for
ID
details on using the autoselect mode.
PRELIMINARY
Table 4. Am29LV004 Autoselect Codes (High Voltage Method)
Description CE# OE# WE#
A18
to
A13
A12
to
A10 A9
A8
to
A7 A6
A5
to
A2 A1 A0
DQ7
to
DQ0
Manufacturer ID: AMD L L H X X V Device ID: Am29LV004T
(Top Boot Block) Device ID: Am29LV004B
(Bottom Boot Block)
Sector Protection Verification L L H SA X V
LLHXXV
LLHXXV
XLXLL 01h
ID
XLXLH B5h
ID
XLXLH B6h
ID
XLXHL
ID
L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.

Sector Protection/Unprotection

The hardware sector protection feature disables both program and erase operations in any sector. The hard-
SET# pin, all the previously protected sectors are protected a gain. Figure 1 sh ows the algorithm, a nd Figure 19 shows the timing diagrams, for this feature.
ware sector unprotection feature re-enables both pro­gram and eras e operat ions in p reviou sly prot ected sectors.
The device is shipped with all secto rs unprotected . AMD offers the option of progra mming and prote cting sectors at its factory prior to shipping the device
through AMD’s ExpressFlash™ Service. Contact an AMD representative for details.
It is p ossi ble t o det ermi ne wh ethe r a s ector is p rotec ted or unprotected. See “Autoselect Mo de” for details.
START
RESET# = V
(Note 1)
Perform Erase or
Program Operations
ID
01h
(protected)
00h
(unprotected)
Sector protection/unprotection must be implemented using programming equipment.The procedure requires a high voltage (V
) on addr ess pin A9 a nd OE#. De -
ID
tails on this method are provided in a supplement, pub­licat ion n umbe r 20 874. Cont act an A MD re pre senta tive to request a copy .

Temporary Sector Unprotect

This feature allows temporary unprotection of previ­ously protected sectors to change data in-system. The Sector U n pr ote ct m od e i s a cti va ted by s e tting th e R E­SET# pin t o V sector s can b e pr o gr amm ed or er as ed by s ele ct i ng t he sector addres ses. Once V
. During thi s mod e, form erly pr otecte d
ID
is remove d fro m the RE -
ID
RESET# = V
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors unprotected.
2. All previously protected sectors are protected once again.
IH
21522A-4
Figure 1. Temporary Sector Unprotect Operation
10 Am29LV004
PRELIMINARY

Hardware Data Protection

The command sequence requir ement of unlock cycle s for programming or erasing provides data protection against inadvertent writes (refer to Table 5 for com­mand definitions). In addition, the following hardware data protection measures prevent accidental erasure or prog ramm ing, w hich m ig ht othe rwis e be ca use d by spurious system level signals during V
power-up
CC
and power-down transition s, or from system noise.
Low V
When V cept any write cycles. This protects data during V
Write I nhibit
CC
is less than V
CC
, the device does not ac-
LKO
CC
power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until V is greater t han V
. The system must p rovide the
LKO
CC
proper signals to the control pins to prevent uninten­tional writes when V
is greater than V
CC
LKO
.

COMMAND DEFINITIONS

Writing specific ad dress and data commands or se­quences into the command register initiates device op­erations. Table 5 defines the valid register command sequences. W riting incor rect ad dress and da ta val- ues or writing them in the improper sequence resets the device to reading array data.
All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens first. Refer to the appropriate timing diagrams in the
“AC Characteristics” section.

Reading Array Data

The device is automatically set to reading array data after d evice power- up. N o comm ands ar e requ ired t o retrieve data. The device is also ready to read array data after completing an Embedded Program or Em­bedded Erase algorithm.
After the device accepts an Erase Suspend com­mand, the de vice enters the E rase Suspend m ode. The system can read array data using the standard read timings, except that if it reads at an address within erase-susp ended sectors, the device outputs status data. After completing a programming opera­tion in the Erase Suspend mode, the system may once again read array data with the same exception. See “Erase Suspend/Erase Resume Commands” for more information on this mode.
The syst em able the device for reading array data if DQ5 goes high, or while in the a utoselect mode. Se e the “R eset C om ­mand” section, next.
must
issue the reset command to re-en-

Write Pulse “Glitch” Protection

Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.

Logical Inhibit

Write cycles are inhibited by holding any one of OE# = V
, CE# = VIH or WE# = VIH. To initiate a writ e cycle,
IL
CE# and WE# must be a logical zero while OE# is a logical one.
Power-Up Write Inhibit
If WE# = CE# = V
and OE# = VIH during po wer up, the
IL
device does not accept commands on the rising edge of WE#. The internal state machine is automatically reset to reading array data on power-up.
See also “Requirements for Reading Array Data” in the “Devic e B u s Op er at io ns ” section f or m ore i n for ma tion. The Read Operations table provides the read parame­ters, and Figure 12 shows the timing diagram.

Reset Command

Writing the reset command to the device resets the de­vice to r ea di n g a rr ay da ta. A dd re ss bits ar e do n’t car e for this command.
The reset command may be written between the se­quence cycles in an erase command sequence before erasing begins. This rese ts the device to reading array data. Once erasure begins, however, the device ig­nores reset commands until t he operation is complete.
The reset command may be written between the se­quence cycles in a program command sequence be­fore programmi ng begins. This resets the device to reading a rray data (a lso applie s to programm ing in Erase Su spend mode ). Once p rogrammin g begins, however, the device ignores r eset co m mand s until th e operat ion i s comp l et e.
The reset command may be written between the se­quence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command be written to re turn to re ading ar ray data (also applies to autoselect during Erase Suspend).
If DQ5 goes high during a program or erase operation, writing the res et comm and r eturn s th e devic e to re ad­ing array data (also applies during Erase Suspend).
must
Am29LV004 11
PRELIMINARY

Autoselect Command Sequence

The autoselect comm and sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. Table 5 shows th e address and d ata requiremen ts. This meth od is an alternati ve to th at sh own in Table 4, which is intended for PROM programmers and requires V
on address bi t A9.
ID
The auto sel e c t comm an d se qu enc e i s ini ti a te d by wr i t­ing two unlock cycles, followed by the autos elect com ­mand. The device then enters the autoselect mode, and the s yste m may r ead at any addre ss any n um ber of time s, witho ut initia ting ano ther comma nd sequen ce.
A read cycle at address XX00h retrieves the manufac­turer code. A read cy cle a t address X X0 1h r eturn s th e device code. A read cycle containing a sector address (SA) and the address 02h returns 01h if that sector is protect ed, or 00 h i f it is un pr ote cte d. R e fe r to Tables 2 and 3 for valid sector addresses.
The system must wr ite the reset comma nd to exit the autoselect mode and return to reading array data.

Byte Program Command Sequence

Programming is a four-bus-cycle operation. The pro­gram command sequence is initiated by writing two un­lock write cycles, followed by the program set-u p comman d. T he pr ogra m ad dres s an d dat a are wr itten next, which in turn initiate the Embedded Program a l­gorithm. The system is controls or timin gs. The device automat ically provides intern ally ge ne r ated p r og ra m pu lse s a nd ve ri fy t h e pr o­grammed cell marg in. Table 5 shows the a ddre ss an d data requirements for the byte program command se­quence .
not
required to provide further
Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed
from a “0” back to a “1”. Attempting to do so may halt
the oper ation and set DQ5 to “1”, or cau se the Data # Polling algorithm to indicate the operation was suc­cessful. However, a succeeding read will show that the data is still “0”. Only erase operations can convert a “0” to a “1”.
Figure 2 illustrates the algorithm for the program oper­ation. See the Erase/Program Operations table in “AC Characteristics” for parameters, and to Figure 14 for timing diagrams.
START
Write Program
Command Sequence
Data Poll
Embedded
algorithm
in progress
Increment Address
Program
No
from System
Verify Data?
Yes
Last Address?
No
When th e Embe dded Pr ogra m algor ithm is compl ete, the devic e then returns to readi ng array data a nd ad­dresses a re no l ong er latc hed. The sys tem can de ter­mine the status of the program operation by using
DQ7, DQ6, or RY/BY#. See “Write Operation Status” for information on these status bits.
Any commands written to the device during the Em­bedded Program Algorithm are ignored. Note that a
Note: See Table 5 for program command sequence.
hardware reset immediately t ermin ates the p rogram-
ming opera tion. The Byte Prog ram command se­quence should be reinitiated once the device has reset to reading array data, to ensure data integrity.
12 Am29LV004
Yes
Programming
Completed
21522A-4
Figure 2. Program Operation
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