AMD Advanced Micro Devices AM29F200AT-90DPI1, AM29F200AT-90DPE1, AM29F200AT-90DPC1, AM29F200AT-90DGI1, AM29F200AT-90DGE1 Datasheet

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SUPPLEMENT
Am29F200A Known Good Die
2 Megabit (25 6 K x 8-Bit/128 K x 16-Bit)
CMOS 5.0 Volt-only, Sect ored Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
— Minimizes system level power requirements
High performance
— 90 or 120 ns access time
Low power consumption
— 20 mA typical active read current (byte mode) — 28 mA typical active read current for
(word mode) — 30 mA typical program/erase current —1 µA typical standby current
Sector erase architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors (byte mode) — One 8 Kword, two 4 Kword, one 16 Kword, and
three 32 Kword sectors (word mode) — Supports full chip erase — Sector Protection features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be locked via programming
equipment
T emporary Sector Unprotect feature allows code
changes in previously locked sectors
Top or bottom boot block configurations
available
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies data at specified addresses
Minimum 100,000 write/erase cycles guaranteed
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply flash
— Superior inadvertent write protection
Data# Polling and Toggle Bit
— Detects program or erase cycle completion
Ready/Busy# output (RY/BY#)
— Hardware method for detection of program or
erase cycle completion
Erase Suspend/Resume
— Supports reading data from a sector not being
erased
Hardware RESET# pin
— Resets internal state machine to the reading
array data
1/13/98
Tested to datasheet specifications at
temperature
Quality and reliability levels equivalent to
standard packaged components
Publicat ion# 21257 Rev: B Amendment/0 Issue Date: December 1997
SUPPLEMENT
GENERAL DESCRIPTION
The Am29F200A in Known Good Die (KGD) form is a 2 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reli­ability and quality as AMD products in packaged form.
Am29F200A Features
The Am29F200 A is organiz ed as 262,144 bytes of 8 bits each or 131,072 words of 16 bits each. The 8-bit data appears on DQ0-DQ7; the 16-bit data appears on DQ0-DQ15. This device is desi gned to be programmed in-system with the standard system 5.0 Volt V ply . A 12.0 vol t V
is not required for program or er ase
PP
operations. The standard Am29F200A in KGD form offers an ac-
cess time of 90 or 120 ns, allowing high-speed micro­processors to operate without wait states. To eliminate bus contention the device has separate chip enable (CE#), write e nable (WE# ), and output enab le (OE#) controls.
The device requires only a single 5.0 volt power sup- ply for both read and write functions. Internally gener­ated and regulated voltages are provided for the program and erase operations.
The device is entir ely command set compatibl e with the JEDEC single-power-sup ply Flash standard . Com­mands are written to the command register using stan­dard microprocesso r write timings. Re gister contents serve as input to an internal state-machine that con­trols the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequ ence. This initiates th e Embedded
Program algorithm —an in ternal algorit hm that auto­matically times the program pulse widths and verifies proper cell margin.
Device e rasure occurs by exe cuting t he eras e com­mand seque nce. Th is initia tes the Embedded Erase algorithm—an internal algo rithm that automatically preprograms the array (if it is not already pro-
CC
sup-
grammed) before executing the erase operation. Dur­ing erase, the device automatically times the erase pulse widths and verifies proper cell margin.
The host system can detect whethe r a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6/ DQ2 (toggle) status bits. After a pr ogram or e rase cycle has been completed, the device is ready to read array data or accept another command.
The sector erase architecture allow s memory sector s to be erased and reprogrammed without affecting the data content s of other secto rs. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low
detector that automatically inhibits write opera-
V
CC
tions during power t ransitions. The h ardware sector protectio n feat ure disables both program and e rase
operations in any combination of the sectors of mem­ory . This can be achieved via programming equipment.
The Erase Suspen d feature enab les the user t o put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. Tr ue bac kground erase can thus be achieved.
The hardware RESE T# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The system can place the device into the standby mode. Power consumption is greatly reduced in this mode.
AMD’s Flash technology combines yea rs of Flas h mem­ory manufacturing experience to produce the highest lev­els of quality , reliability and cost effectiveness. The device electrically erases al l b i t s wi t hi n a se c t or s i mu l ta ­n e ous ly via Fowl er-N ordh eim t unn elin g. T he dat a is programmed using hot electron injection.
ELECTRICAL SPECIFICATIONS
Refer to the Am29F200A data sheet, publication number 20380, for full electrical specifications on t he Am29F200A.
PRODUCT SELECTOR GUIDE
Family Part Number Am29F200A KGD Speed Option (V Max access time, ns (t Max CE# access time, ns (t Max OE# access time, ns (t
2 Am29F200A Known Good Die 1/13/98
= 5.0 V ± 10%) -90 -120
CC
) 90 120
ACC
) 90 120
CE
)3550
OE
DIE PHOTOGRAPH
Orientation relative to top left corner of Gel-Pak
SUPPLEMENT
Orientation relative to leading edge of tape and reel
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AMD logo location
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1/13/98 Am29F200A Known Good Die 3
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