AMD Advanced Micro Devices AM28F010A-70FCB, AM28F010A-70FC, AM28F010A-70EIB, AM28F010A-70EI, AM28F010A-70EEB Datasheet

FINAL

Am28F010A

1 Megabit (128 K x 8-Bit)
CMOS 12.0 Volt, Bulk Erase Flash Memory with Embedded Algorithms

DISTINCTIVE CHARACTERISTICS

■ High performance

— Access times as fast as 70 ns

■ CMOS low power consumption

— 30 mA maximum active current
— 100 µA maximum standby current
— No data retention power consumption

■ Compatible with JEDEC-standard byte-wide

32-pin EPROM pinou ts

— 32-pin PDIP
— 32-pin PLCC
— 32-pin TSOP

■ 100,000 write/erase cycles minimum

■ Write and erase voltage 12.0 V ±5%

GENERAL DESCRIPTION

The Am28F010A is a 1 M egabit Flash memor y orga­nized as 128 Kbytes of 8 bits each. AMD’ s Flash memo­ries offer the most cost-effective and reliable read/write
non-volatile random access memor y. The Am28F010A
is packaged in 32-pin PDIP, PLCC, and TSOP versions.
It is designed to be reprogrammed and erased in-system
or in standard EPROM programmers. The Am28F010A
is erased when shipped from the factory.

The standard Am28F010A offers access times of as fast
as 70 ns, allowing high speed microprocessors to
operate without wait states. To eliminate bus contention,
the device has separate chip enable (CE#) and output
enable (OE#) controls.

AMD’s Flash memories au gment EPROM functi onality
with in-circuit electrical erasure and programming. The
Am28F010A uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining
maximum EPROM compatibility.

The Am28F010A is compatible with the AMD
Am28F256A, Am2 8F512A, and Am28F020A Flash
memories. All devices in the Am28Fxxx family follow the
JEDEC 32-pin pinout standar d. In additio n, all devices

■ Latch-up protected to 100 mA from

–1 V to V

■ Embedded Erase Electrical Bulk Chip Erase

— 5 seconds typical chip erase, including

pre-programming

■ Embedded Program

— 14 µs typical byte program, including time-out
— 4 seconds typical chip program

■ Command register architecture for

microprocessor/microcontroller compatible
write interface

■ On-chip address and data latches

■ Advanced CMOS flash memory technology

— Low cost single transistor memory cell

■ Embedded algorithms for completely self-timed

write/erase operations

within this family that offer Embedded Algorithms use
the same command set. This offers designers the flexi­bility to retain the same device footprint and command
set, at any density between 256 Kbits and 2 Mbits.

AMD’s Flash technology reliably stores memo ry con­tents even after 100,000 erase and program cycles. The
AMD cell is designed to optimize the erase and program­ming mechanisms. In addition, the combination of
advanced tunnel oxide processing and low internal elec­tric fields for erase and programming operations pro­duces reliable cycling. The Am28F010 A uses a

12.0±5% V
ming functions.

The highest degree of latch-up protection is achieved
with AMD’s proprietar y non-ep i process. Latch-u p pro­tection is provided for stresses up to 100 mA on address
and data pins from –1 V to V

AMD’s Flash technology combines years of EPROM and
EEPROM experience to produce the highest levels of
quality, reliability, and cost effectiveness. The
Am28F010A electrically erases all bits simultaneously
using Fowler-Nordheim tunneling. The bytes are
programmed one byte at a time using the EPROM pro­gramming mechanism of hot electron injection.

+1 V

CC

input to perform the erase and program-

PP

+1 V.

CC

Publication# 16778 Rev: D Amendment/+2
Issue Date: May 1998

Embedded Program

The Am28F010A is byte programmable using the
Embedded Program algorithm, which does not require
the system to time-out or verify the data programmed.
The typical room temperature progr amming time of this
device is two seconds.

Comparing Embedded Algorithms with Flasherase and Flashrite Algorithms

Embedded Erase

The entire device is bulk erased using the Embedded
Erase algorithm, which automatically programs the
entire array prior to electrical erase. The timing and v er­ification of electrical erase are controlled internal to the
device. Typical erasure time at room temperature is fiv e
seconds, including preprogramming.

Embedded
Programming
Algorithm vs.
Flashrite
Programming
Algorithm

Embedded Erase
Algorithm vs.
Flasherase Erase
Algorithm

Am28F010A with

Embedded Algorithms

AMD’s Embedded Programming algorithm
requires the user to only write a program
set-up command and a program command
(program data and address). The device
automatically times the programming
pulse width, verifies the programming, and
counts the number of sequences. A status
bit, Data
the programming operation status.

AMD’s Embedded Erase algorithm
requires the user to only write an erase set­up command and erase command. The
device automatically pre-programs and
verifies the entire array. The device then
automatically times the erase pulse width,
verifies the erase operation, and counts
the number of sequences. A status bit,
Data
erase operation status.

# Polling, provides the user with

# Polling, provides the user with the

Am28F010 using AMD Flashrite

and Flasherase Algorith ms

The Flashrite Programming algorithm requires the
user to write a program set-up command, a program
command, (program data and address), and a
program verify command, followed by a read and
compare operation. The user is required to time the
programming pulse width in order to issue the
program verify command. An integrated stop timer
prevents any possibility of overprogramming.

Upon completion of this sequence, the data is read
back from the device and compared by the user with
the data intended to be written; if there is not a
match, the sequence is repeated until there is a
match or the sequence has been repeated 25 times.

The Flasherase Erase algorithm requires the device
to be completely programmed prior to executing an
erase command.

To invoke the erase operation, the user writes an
erase set-up command, an erase command, and an
erase verify command. The user is required to time
the erase pulse width in order to issue the erase
verify command. An integrated stop timer prevents
any possibility of overerasure.

Upon completion of this sequence, the data is read
back from the device and compared by the user with
erased data. If there is not a match, the sequence is
repeated until there is a match or the sequence has
been repeated 1,000 times.

Commands are written to the command register using
standard microprocessor write timings. Register con­tents serve as input to an internal state-machine,
which controls the erase and programming circuitry.
During write cycles, the command register internally
latches addresses and data needed for the program­ming and erase operations. For system design simpli-

cycle, addresses are latched on the falling edge of
WE# or CE#, whichever occurs last. Data is latched
on the rising edge of WE# or CE#, whichever occurs
first. To simplify the follo wing discussion, the WE# pin
is used as the write cycle control pin throughout the
rest of this text. All setup and hold times are with

respect to the WE# signal.
fication, the Am28F010 A is designed to support either
WE# or CE# controlled writes. During a system write

2 Am28F010A

PRODUCT SELECTOR GUIDE

Family Part Number Am28F010A
Speed Options (V

= 5.0 V ± 10%) -70 -90 -120 -150 -200

CC

Max Access Time (ns) 70 90 120 150 200

# (E#) Access (ns) 70 90 120 150 200

CE

# (G#) Access (ns) 35 35 50 55 55

OE

BLOCK DIAGRAM

DQ0–DQ7

V

CC

V

SS

V

PP

WE#

CE#
OE#

State

Control

Command

Register

Program

Voltage

Switch

Erase

Voltage

Switch

Input/Output

Buffers

To Array

Chip Enable

Output Enable

Logic

A0–A16

Low VCC
Detector

Embedded
Algorithms

Program/Erase

Pulse Timer

Address Latch

Y-Decoder

X-Decoder

Data Latch

Y-Gating

1,048,576

Bit

Cell Matrix

16778D-1

Am28F010A 3

CONNECTION DIAGRAMS

PDIP PLCC

V

1

PP

A16

2

A15

3

A12

4

A7

5

A6

6

A5

7

A4

8

A3

9

A2

10

A1

11

A0

12

DQ0

13

DQ1

14

DQ2

15

V

16

SS

Note:

Pin 1 is marked for orientation.

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

V

CC

WE# (W#)
NC
A14
A13
A8
A9
A11

# (G#)

OE
A10

# (E#)

CE
DQ7
DQ6
DQ5
DQ4
DQ3

16778D-2

A7
A6
A5
A4
A3
A2
A1
A0

DQ0

5
6
7
8
9
10
11
12
13

A12

DQ1

A15

A16

VPPVCCWE# (W#)

1313023432

17 18 19 20161514

SS

V

DQ2

DQ3

DQ4

DQ5

NC

29
28
27
26
25
24
23
22
21

DQ6

A14
A13
A8
A9
A11
OE (G)
A10
CE# (E#)
DQ7

16778D-3

4 Am28F010A

CONNECTION DIAGRAMS (continued)

A11

A9

A8
A13
A14

NC
WE#
VCC

VPP

A16
A15
A12

A7
A6
A5
A4

OE#

A10

CE#

D7
D6
D5
D4

D3

VSS

D2
D1
D0
A0
A1
A2
A3

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

32-Pin TSOP—Standard Pinout

32-Pin TSOP—Reverse Pinout

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

OE#
A10
CE#

D7
D6
D5
D4
D3
VSS
D2
D1
D0
A0
A1
A2
A3

A11
A9
A8
A13
A14
NC
WE#
VCC
VPP
A16
A15
A12
A7
A6
A5
A4

16778D-4

LOGIC SYMBOL

17

A0–A16

# (E#)

CE

# (G#)

OE

# (W#)

WE

DQ0–DQ7

8

16778D-5

Am28F010A 5

ORDERING INFORMATION
Standard Pr od ucts

AMD standard prod ucts are availa ble in several pack ages and ope rating ranges. The ordering n umber (Valid C ombination) is
formed by a combination of the following:

AM28F010A -70 J C

DEVICE NUMBER/DES CR IPT IO N

Am28F010A
1 Megabit (128 K x 8-Bit) CMOS Flash Memory with Embedded Algorithms

B

OPTIONAL PROCESSING

Blank = Standard Pro ces sin g
B = Burn-In

Contact an AMD representative for more information.

TEMPERATURE RANGE

C=Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended (–55°C to +125°C)

PACKAGE TYPE

P = 32-Pin Plastic DIP (PD 032)
J = 32-Pin Rectangular Plastic Leaded Chip

Carrier (PL 032)

E = 32-Pin Thin Small Outline Package (TSOP)

Standard Pinout (TS 032)

F = 32-Pin Thin Small Outline Package (TSOP)

Reverse Pinout (TSR032)

SPEED OPTION

See Product Selector Guide and Valid Combinations

Valid Combinations

AM28F010A-70
AM28F010A-90
AM28F010A-120
AM28F010A-150
AM28F010A-200

PC, PI, PE,

JC, JI, JE,

EC, EI, EE,

FC, FI, FE

Valid Combinations list configurations planned to be support­ed in volume for this device. Cons ult the loc al AM D sale s of­fice to confirm availab ility of specific valid com binations and
to check on newly released combinations.

6 Am28F010A

Valid Combinations

PIN DESCRIPTION

A0–A16

Address Inputs for memory locations. Internal latches
hold addresses during write cycles.

CE# (E#)

Chip Enable active lo w input activates the chip’ s control
logic and input buffers. Chip Enable high will deselect
the device and operates the chip in stand-by mode.

DQ0–DQ7

Data Inputs during memory write cycles. Internal
latches hold data during write cycles. Data Outputs
during memory read cycles.

NC

No Connect—corre sponding pin is not connecte d
internally to the die.

OE# (G#)

Output Enable active low input gates the outputs of the
device through the data buffers during memory read

cycles. Output Enable is high during command
sequencing and program/erase operations.

V

CC

Pow er supply f or de vice operat ion. (5.0 V ± 5% or 10%)

V

PP

Program voltage input. VPP must be at high voltage in
order to write to the command register. The command
register controls all functions required to alt er the mem­ory array contents. Memory contents cannot be a ltered
when V

V

SS

Ground

PP

≤ V

CC

+2 V.

WE# (W#)

Write Enable active low input controls the write function
of the command register to the memory array. The tar­get address is latched on the falling edge of the Write
Enable pulse and the appropriate data is latched on the
rising edge of the pulse. Write Enable high inhibits writ­ing to the device.

Am28F010A 7

BASIC PRINCIPLES

This section contains descriptions about the device
read, erase, and program operations, and write opera­tion status of the Am29FxxxA, 12.0 volt f amily of Flash
devices. References to some tables or figures may be

given in generic form, such as “Command Definitions
table”, rather than “ Table 1”. Refer to the corresponding
data sheet for the actual table or figure.

The Am28FxxxA family uses 100% TTL-level control
inputs to manage the comman d register. Erase and
reprogramming operations use a fixed 12.0 V ± 5%
high voltage input.

Read Only Memory

Without high VPP voltage, the device functions as a
read only memory and operates like a standard
EPROM. The control inputs still manage traditional
read, standby, output disable, and Auto select modes.

Command Register

The command register is enabled only when high volt­age is applied to the V
gramming operations are only accessed via the
register. In addit i on, two-cycle commands are required
for erase and reprogramming operations. The tradi­tional read, standby, output disable, and Auto select
modes are available via the register.

The device’s command register is written using standard
microprocessor write timings. The register controls an
intern al state machi ne that manag es all device opera­tions. For system design simplification, the device is de­signed to support either WE# or CE # controlled writes.
During a system write cycle, addresses are latched on
the falling edge of WE# o r CE# whichever occurs last .
Data is latched on the rising edge of WE# or CE# which­ever occur first. To si mplify the following discussion, the
WE# pin is used as the write cycle control pin throughout
the rest of this text. All setup and hold times are with re­spect to the WE# signal.

pin. The erase and repro-

PP

OVERVIEW OF ERASE/PROGRAM OPERATIONS

Embedded

AMD now makes erasure extremely simple and reli­able. The Embedded Erase algorithm requires the user
to only write an erase setup command and erase com­mand. The device will automatica lly pre-program and
verify the entire array. The device automatically times
the erase pulse width, provides the erase verify and
counts the number of sequences. A status bit, Data#
Polling, provides feedback to the user as to the status
of the erase operation.

Erase Algorithm

Embedded Programming Algorithm

AMD now makes programming extremely simple and
reliable. The Embedded Programming algorithm re­quires the user to only write a program setup command
and a program command. The device automatically
times the programming pulse width, provides the pro­gram verify and counts the number of sequences. A
status bit, Data# Polling, provides feedback to the user
as to the status of the programming operation.

DATA PROTECTION

The device is designed to offer protection against acci­dental erasur e or programming ca used by spurious
system level signals that ma y e xist during power t ransi­tions. The device po wers up in its read only state . Also,
with its control register architecture, alteration of the
memory contents only occurs after successful comple­tion of specific command sequences.

The device also incor porates several features to pre­vent inadvertent wr ite cycles resulting from V
power-up and power-down trans itions or system noise.

CC

Low VCC Write Inhibit

To avoid initiation of a write cycle during VCC power-up
and power-down, the device locks out write cycles for

< V

V

CC

ages). When V
abled, all internal program/erase circuits are disabled,
and the device resets to the read mode. The dev ic e ig­nores all writes until V
that the control pins are in the correct logic state when

> V

V

CC

(see DC characteristics section for volt-

LKO

LKO

< V

CC

to prevent unintentional writes.

, the command register is dis-

LKO

> V

CC

. The user must ensure

LKO

Write Pulse “Glitch” Protection

Noise pulses of less than 10 ns (typical) on OE#, CE#
or WE# will not initiate a write cycle.

Logical Inhibit

Writing is inhibited by holding any one of OE# = VIL,
CE# =V
and WE# must be a logical zero while OE# is a logical
one.

or WE# = VIH. To initiate a write cycle CE#

IH

Power-Up Write Inhibit

Power-up of the device with WE# = CE# = VIL and
OE# = V
edge of WE#. The internal state machine is automati­cally reset to the read mode on power-up.

will not accept commands on the rising

IH

8 Am28F010A

FUNCTIONAL DESCRIPTION
Description Of User Modes

Table 1. Am28F010A Device Bus Operations (Notes 7 and 8)

Read-Only

Read/Write

CE#

Operation

(E#)

Read V
Standby V
Output Disable V
Auto-select Manufacturer

Code (Note 2)
Auto-select Device

Code (Note 2)
Read V

Standby (Note 5) V
Output Disable V
Write V

V

V

OE#
(G#)

IL

IH

IL

IL

IL

IL

IH

IL

IL

V

V

V

V

V

V
V

WE#
(W#)

IL

XV

XXV

IH

V

IH

V

IL

IL

IL

IH

V

IH

V

IH

XXV

IH

IH

V

IH

V

IL

V

PP

(Note 1) A0 A9 I/O

PPL

PPL

V

PPL

V

PPL

V

PPL

V

PPH

PPH

V

PPH

V

PPH

A0 A 9 D

X X HIGH Z
X X HIGH Z

V

V

IL

V

IH

ID

(Note 3)

V

ID

(Note 3)

A0 A9

X X HIGH Z
X X HIGH Z

A0 A9

Legend:

X = Don’t care, where Don’t Care is either V

of V

. 0 V < An < VCC + 2 V, (normal TTL or CMOS input levels, where n = 0 or 9).

PPH

or VIH levels. V

IL

= VPP < VCC + 2 V. See DC Characteristics for voltage levels

PPL

Notes:

1. V

may be grounded, connected with a resistor to ground, or < VCC + 2.0 V . V

PPL

the device. Refer to the DC characteristics. When V

PP

= V

, memory contents can be read but not written or erased.

PPL

is the programming voltage specified for

PPH

2. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 2.

3. 11.5 < V

4. Read operation with V

5. With V

6. Refer to Table 3 for valid D

7. All inputs are Don’t Care unless otherwise stated, where Don’t Care is either V
addresses except A

8. If V

< 13.0 V. Minimum VID rise time and fall time (between 0 and VID voltages) is 500 ns.

ID

= V

PP

at high voltage, the standby current is ICC + IPP (standby).

PP

and A0 must be held at VIL.

9

≤

1.0 Volt, the voltage difference between VPP and VCC should not exceed 10.0 volts. Also, the Am28F256 has a VPP

CC

may access array data or the Auto select codes.

PPH

during a write operation.

IN

or VIH levels. In the Auto select mode all

IL

rise time and fall time specification of 500 ns minimum.

OUT

CODE

(01h)

CODE

(A2h)
D

OUT

(Note 4)

D

IN

(Note 6)

Am28F010A 9

READ-ONLY MODE

When VPP is less than V
is inactive. The device can either read array or autose­lect data, or be standby mode.

+ 2 V , the command register

CC

Read

The device functions as a read only memory when V
< V

+ 2 V. The device has two control functions. Both

CC

must be satisfied in order to output data. CE# controls
power to the device. This pin should be used for spe­cific device selection. OE# controls the device outputs
and should be used to gate data to the output pins if a
device is selected.

Address access time t

is equal to the delay from

ACC

stable addresses to valid output data. The chip enable
access time t

is the delay from st able addres ses and

CE

stable CE# to valid data at the output pins. The output
enable access time is the delay from the f alling edge of
OE# to valid data at the output pins (assuming the ad­dresses have been stable at least t

ACC

- tOE).

PP

Standby Mode

The device has two standby modes. The CMOS
standby mode (CE# input held at V

sumes less than 100 µA of current. TTL standby mode
(CE# is held at V

) reduces the current requirements

IH

to less than 1 mA. When in the standby mode the out­puts are in a high impedance state, independent of the
OE# input.

If the device is deselected during erasure, program­ming, or program/erase verification, the device will
draw activ e current until the operation is terminated.

± 0.5 V), con-

CC

Output Disable

Output from the device is disabled whe n OE# is at a
logic high level. When disabled, output pins are in a
high impedance state.

Auto Select

Flash memories can be programmed in-system or in a
standard PROM programmer. The device may be sol­dered to the circuit board upon receipt of shipment and
programmed in-system. Alternatively, the device may
initially be programmed in a PROM programmer prior
to soldering the device to the board.

The Auto select mode allows the reading out of a binary
code from the device that will identify its manufacturer and
type. This mode is intended for the purpos e of autom ati­cally matching the device to be programmed with its cor­responding p rogramming algorithm . This mode is
functional over the entire temperature range of the device.

Programming In a PROM Programmer

To activate this mode, the programming equipment
must force V
identifier bytes ma y then be sequenced from the device
outputs by toggling address A0 f rom V
address lines must be held at V
less than or equal to V
select mode. Byte 0 (A0 = V
turer code and byte 1 (A0 = V
code. For t he device t he two b ytes are given in the table
2 of the device data sheet. All identifiers for manufac­turer and device codes will exhibit odd parity with the
MSB (DQ7) defined as the parity bit.

(11.5 V to 13.0 V) on address A9. Two

ID

to VIH. All other

IL

, and VPP must be

+ 2.0 V while using this Auto

CC

IL

) represents the manufac-

IL

) the device identifier

IH

Table 2. Am28F010A Auto Select Code

Type A0

Manufacturer Code V
Device Code V

IL

IH

10 Am28F010A

Code

(HEX)

01
A2

ERASE, PROGRAM, AND READ MODE

When VPP is equal to 12.0 V ± 5%, the command reg-

ister is active. All functions are available. That is, the
device can program, erase, read array or autoselect
data, or be standby mode.

Write Operations

High voltage must be applied to the VPP pin in order to
activate the command register. Data written to the reg­ister serves as input to the internal state machine. The
output of the state machine determines the operational
function of the device.

The command register does not occupy an address­able memory location. The register is a latch that stores
the command, along with the address and data infor­mation needed to execute the command. The register
is written by bringing WE# and CE# to V
is at V

. Addresses are latched on the falling edge of

IH

WE#, while data is latched on the rising edge of the
WE# pulse. Standard microprocessor write timings are
used.

The device requires the OE# pin to be V
erations. This condition eliminates the possi bility for
bus contention during programming operations. In
order to write, OE# must be V
must be V

. If any pin is not in the correct state a write

IL

, and CE# and WE#

IH

command will not be executed.

, while OE#

IL

for write op-

IH

Refer to AC Write Characteristics and the Erase/Pro­gramming Waveforms for specific timing parameters.

Command Definitions

The contents of the command register default to 00h
(Read Mode) in the abs ence of hi gh v oltage applie d to
the V
memory. High voltage on the V

pin. The device operates as a read only

PP

pin enables the

PP

command register. Device operations are selected by
writing specific data codes i nto the command regi ster.
Tabl e 3 in the de vice data sheet def ines these regis ter
commands.

Read Command

Memory contents can be accessed via the read com­mand when V
00h into the command register. Standard microproces­sor read cycles access data from the memory. The de­vice will remain in the read mode until the command
register contents are altered.

The command register defaults to 00h (read mode)
upon V

PP

fault helps ensure that inadvertent alteration of the
memory contents does not occur during the V
transition. Refer to the AC Read Characteristics and
Waveforms for the specific timing parameters.

is high. To read from the device, write

PP

power-up. The 00h (Read Mode) register de-

power

PP

Table 3. Am28F010A Command Definitions

First Bus Cycle Second Bus Cycle

Operation

Command

Read Memory (Note 4) Write X 00h/FFh Read RA RD
Read Auto select Write X 80h or 90h Read 00h/01h 01h/A2h
Embedded Erase Set-up/

Embedded Erase
Embedded Program Set-up/

Embedded Program
Reset (Note 4) Write X 00h/FFh Write X 00h/FFh

Notes:

1. Bus operations are defined in Table 1.

2. RA = Address of the memory location to be read.
PA = Address of the memory location to be programmed.
Addresses are latched on the falling edge of the WE

X = Don’t care.

3. RD = Data read from location RA during read operation.
PD = Data to be programmed at location PA. Data latched on the rising edge of WE

4. Please reference Reset Command section.

(Note 1)

Write X 30h Write X 30h

Write X 10h or 50h Write PA PD

Address

(Note 2)

#

pulse.

Data

(Note 3)

Operation

(Note 1)

#

.

Address

(Note 2)

Data

(Note 3)

Am28F010A 11

FLASH MEMORY PROGRAM/ERASE OPERATIONS

Embedded Erase Algorithm

The automatic chip erase does not require the device
to be entirely pre-programmed prior to executing the
Embedded set-up erase comm and and Embedded
erase command. Upon ex ecuting the Embedded erase
command the device automatically will program and
verify the entire memor y for an all zero data patter n.

not

The system is
timing during these operations.

required to provide any controls or

has been achiev ed f or the memory arra y ( no eras e v er­ify command is required). The margin voltages are in­ternally generated in the same manner as when the
standard erase verify command is used.

The Embedded Erase Set-Up command is a command
only operation that stages the device for automatic
electrical erasure of all bytes in the array. Embedded
Erase Setup is performed by writing 30h to the com­mand register.

When the device is automatical ly verified to contain an
all zero pattern, a self-timed chip erase and verify be­gin. The erase and ve rify oper ation are c omplete when

the data on DQ7 is “1" (see Write Operation Status sec­tion) atwhich time the device returns to Read mode.
The system is not required to provide any control or
timing during these operations.

When using the Embedded Erase algorithm, the erase
automatically terminates when adequate erase margin

Apply V

Write Embedded Erase Setup Command

Write Embedded Erase Command

Data# Poll from Device

To commence automatic chip erase, t he command 30h
must be written again to the command register . The au­tomatic erase begins on the rising edge of the WE and
terminates when the data on DQ7 is “1" (see Write Op­eration Status section) at which time the device returns
to Read mode.

Figure 1 and Table 4 illustrate the Embedded Erase al­gorithm, a typical command string and bus operation.

START

PPH

Erasure Completed

Figure 1. Embedded Erase Algorithm

Table 4. Embedded Erase Algorithm

Bus Operations Command Comments

Standby Wait for V

Write

Read Data
Standby Compare Output to FFh
Read Available for Read Operations

Note: See AC and DC Characteristics for values of V
switchable. When V
to Functional Description.

Embedded Erase Setup Command Data = 30h
Embedded Erase Command Data = 30h

parameters. The V

is switched, V

PP

may be ground, no connect with a resistor tied to ground, or less than VCC + 2.0 V. Refer

PPL

PP

Ramp to V

PP

# Polling to Verify Erasure

power supply can be hard-wired to the device or

PP

(see Note)

PPH

12 Am28F010A

16778D-6

Embedded Programming Algorithm

The Embedded Program Setup is a command only op­eration that stages the device for automatic program­ming. Embedde d Program Setup is performed by
writing 10h or 50h to the command register.

Once the Embedded Setup Progr am ope r ation is per­formed, the next WE# pulse causes a transition to an
active prog ramming operati on. Ad dresses are latched
on the falling edge of CE# or WE# pulse, whichever
happens later. Data is latched on the rising edge of
WE# or CE#, whiche ver happens first. The ris ing edge

Apply V

Write Embedded Setup Program Command

Write Embedded

of WE# also begins the programming operation. The
system is not required to provide further controls or
timings. The device will automatically provide an ade­quate internally generated program pulse and verify
margin. The automatic programming operation is
completed when the data on DQ7 is equiva lent to data
written to this bit (see Write Oper at io n Stat us s ecti on)
at which time the device returns to Read mode.

Figure 2 and Table 5 illustrate the Embedded Program
algorithm, a typical command string, and bus operation.

START

PPH

Program Command (A/D)

Data# Poll Device

Increment Address

No

Last Address

Yes

Programming Completed

Figure 2. Embedded Programming Algorithm

Table 5. Embedded Programming Algorithm

Bus Operations Command Comments

Standby Wait for V
Write Embedded Program Setup Command Data = 10h or 50h
Write Embedded Program Command Valid Address/Data
Read Data
Read Available for Read Operations

Ramp to V

PP

# Polling to Verify Completion

(see Note)

PPH

16778D-7

Note: See AC and DC Characteristics for values of V
switchable. When V
to Functional Description. Device is either powered-down, erase inhibit or program inhibit.

is switched, V

PP

may be ground, no connect with a resistor tied to ground, or less than VCC + 2.0 V. Refer

PPL

parameters. The V

PP

power supply can be hard-wired to the device or

PP

Am28F010A 13

Write Operation Status

Data Polling—DQ7

The device features Data# Polling as a method to indi­cate to the host system that the Embedded algorithms
are either in progress or completed.

While the Embedded Programming algorithm is in oper­ation, an attempt to read the device at a valid address
will produce the complement of expected Valid data on
DQ7. Upon completion of the Embedded Program algo­rithm an attempt to read the device at a valid address will
produce Valid data on DQ7. The Data# Polling feature is
valid after the rising edge of the se cond WE# pulse of
the two write pulse sequence.

START

While the Embedded Erase algorithm is in operation,

DQ7 will read “0"

until the erase operation is com­pleted. Upon completion of the eras e operation, the
data on DQ7 will read “1.” The Data# Polling feature is
valid after the rising edge of the second WE# pulse of
the two Write pulse sequence.

The Data# Polling feature is only active during Embed­ded Programming or erase algorithms.

See Figures 3 and 4 for the Data# Polling timing spec­ifications and diagrams. Data# Polling is the standard
method to check the write operation status, however,
an alternative method is available using Toggle Bit.

No

Read Byte

(DQ0–DQ7)

Addr = VA

DQ7 = Data

?

No

DQ5 = 1

?

Yes

Read Byte

(DQ0–DQ7)

Addr = VA

DQ7 = Data

?

No

VA = Byte address for programming

= XXXXh during chip erase

Yes

Yes

Fail

Note:

DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5 or after DQ5.

Pass

Figure 3. Data# Polling Algorithm

14 Am28F010A

16778D-8

CE#

t

CH

t

t

OE

DF

OE#

t

OEH

WE#

DQ7

t

CE

t

WHWH 3 or 4

DQ7#

DQ0–DQ6 = InvalidDQ0–DQ6

*DQ7 = Valid Data (The device has completed the Embedded operation.)

Figure 4. AC Waveforms for Data# Polling during Embedded Algorithm Operations

*

DQ7 =

Valid Data

t

OH

DQ0–DQ7
Valid Data

High Z

16778D-9

Am28F010A 15

Toggle Bit—DQ6

The device also f eatures a “Toggle Bit” as a method to
indicate to the host system that the Embedded algo­rithms are either in progress or completed.

Successive attempts to read data from the device at a
valid address, while the Embedded Program algorithm
is in progress, or at any address while the Embedded
Erase algorithm is in progress, will result in D Q6 tog­gling between one and zero. Once the Embedded Pro­gram or Erase algor ithm is completed, D Q6 will stop

START

toggling to indicate the completion of either Embedded
operation. Only on the next read cycl e will valid data be
obtained. The toggle bit is valid after the rising edge of
the first WE# pulse of the two write pulse seq uence, un­like Data# Polling which is valid after the rising edge of
the second WE# pulse. This feature allows the user to
determine if the device is partially through the two write
pulse sequence.

See Figures 5 and 6 for the Toggle Bit timing specifica­tions and diagrams.

Read Byte

(DQ0–DQ7)

Addr = VA

DQ6 = Toggle

No

Read Byte

(DQ0–DQ7)

Addr = VA

DQ6 = Toggle

VA = Byte address for programming

= XXXXh during chip erase

No

?

Yes

DQ5 = 1

?

Yes

No

?

Yes

Fail

Note:

DQ6 is rechecked even if DQ5 = “1” because DQ6 may stop toggling at the same time as DQ5 changing to “1”.

Pass

Figure 5. Toggle Bit Algorithm

16 Am28F010A

16778D-10

CE#

t

OEH

WE#

OE#

Data

DQ0–DQ7

Note:

*DQ6 stops toggling (The device has completed the Embedded operation.)

DQ6 = DQ6 =

Figure 6. AC Waveforms for Toggle Bit during Embedded Algorithm Operations

t

*

OE

DQ6

Stop Toggling

DQ0–DQ7

Valid

16778D-11

DQ5

Exceeded Timing Limits

DQ5 will indicate if the program or erase time has
exceeded the specified limits. This is a failure condi­tion and the device may not be used again (internal
pulse count exceeded). Under these conditions DQ5

will produce a “1.” The program or er ase cycle was not
successfully completed. Data# Polling is the only op­erating function of the de vice under this conditi on. The
CE# circuit will partially power down the device under
these conditions (to approximately 2 m A). The OE#
and WE# pins will control the output disable functions
as described in the Command Definitions table in the
corresponding device data sheet.

Parallel Device Erasure

The Embedded Erase algorithm greatly simplifies par­allel device erasure. Sinc e the erase process is internal
to the device, a single eras e command can be given to
multiple devices concurrently. By implementing a paral­lel erase algorithm, total erase time may be minimized.

Note that the Flash memories may erase at different
rates. If this is the case, when a device is completely
erased, use a masking code to prevent further erasure
(over-erasure). The other de vices will continue t o erase
until verified. The masking code applied could be the
read command (00h).

Power-Up/Power-Down Sequence

The device powers-up in the Read only mode. Power
supply sequencing is not required. Note that if V

1.0 Volt, the voltage difference between V

and V

PP

CC

≤

CC

should not exceed 10.0 Volts. Also, the device has a
rise V

rise time and fall time specification of 500 ns

PP

minimum.

Reset Command

The Reset command initializes the Flash memory de­vice to the Read mode. In addition, it also provides the
user with a safe method to abort any device operation
(including program or erase).

The Reset must be written two consecutive times after
the Setup Program command (10h or 50h). This will
reset the device to the Read mode.

Following any other Flash comm and, write the Reset
command once to the device. This wi ll safely abort any
previous operation and initializ e the de vice to the Read
mode.

The Setup Program command (10h or 50h) is the only
command that requires a two-sequence reset cycle. The
first Reset command is interpreted as program data.
However , FFh data is considered as null data during pro­gramming operations (memor y cells are only pro­grammed from a logical “1" to “0"). The second Reset
command safely aborts the programming operation and
resets the device to the Read mode.

Memory contents are not altered in any case.

Am28F010A 17

This detailed information i s for your reference. It may
prove easier to always issue the Reset command two
consecutive times. This elim inates the need to deter ­mine if you are in the Setup Program state or not.

In-System Programming Considerations

Flash memories can be programmed in-system or in a
standard PROM programmer. The device may be sol­dered to the circuit board upon receipt of shipment and
programmed in-system. Alternatively, the device may
initially be programmed in a PROM programmer prior
to soldering the device to the circuit board.

Auto Select Command

AMD’s Flash memories are designed for use in appli­cations where the local CPU alters memory contents.
In order to correctly program any Flash memories

in-system, manufacturer and device codes must be
accessible while the device resides in the target
system. PROM programmers typically access the sig­nature codes by r aising A9 to a hig h voltage . How ev er ,
multiplexing high voltage onto address lines is not a
generally desired system design practice.

The device contains an Auto Select operation to supple­ment traditional PROM programming methodologies.
The operation is initiated by writing 80h or 90h into the
command register. Following this command, a read
cycle address 0000h retrieves the manufacturer code of
01h (AMD). A read cycle from address 0001h returns
the device code (see the Auto Select Code table of the
corresponding device data sheet). To terminate the op­eration, it is necessary to write another valid command,
such as Reset (00h or FFh), into the register.

18 Am28F010A

ABSOLUTE MAXIMUM RATINGS

Storage Temperature . . . . . . . . . . . . –65°C to +125°C

Ambient Temperat ure

with Power Applied. . . . . . . . . . . . . . –55°C to +125°C

Voltage with Respect to Ground
All pins except A9 and V

VCC (Note 1). . . . . . . . . . . . . . . . . . . .–2.0 V to +7.0 V

A9, V

(Note 2) . . . . . . . . . . . . . . .–2.0 V to +14.0 V

PP

Output Short Circuit Current (Note 3) . . . . . . 200 mA

Notes:

1. Minimum DC voltage on input or I/O pins is –0.5 V . During
voltage transitions, input or I/O pins may overshoot V
–2.0 V for periods of up to 20 ns. Maximum DC voltage on
input or I/O pins is V
input or I/O pins may overshoot to V
up to 20 ns.

2. Minimum DC input voltage on pins A9 and V
During voltage transitions, A9 and V
V

to –2.0 V for periods of up to 20 ns. Maximum DC

SS

input voltage on pin A9 and V
overshoot to 14.0 V for periods up to 20 ns.

3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.

4. Stresses above those listed under “Absolute Maximum
Ratings” may cause permanen t dama ge to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those
indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum
rating conditions for extended periods may affect device
reliability.

(Note 1) .–2.0 V to +7.0 V

PP

+0.5 V . During voltage transitions,

CC

PP

+2.0 V for periods

CC

is –0.5 V.

PP

may overshoot

PP

is +13.0 V, which may

SS

to

OPERATING RANGES

Commercial (C) Devices

Ambient Temperature (T

Industrial (I) Devices

Ambient Temperature (T

Extended (E) Devices

Ambient Temperature (T

VCC Supply Voltages

. . . . . . . . . . . . . . . . . . . . . . . +4.50 V to +5.50 V

V

CC

Voltages

V

PP

Read . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +12.6 V

Program, Erase , and Verify. . . . . . +11.4 V to +12.6 V

Operating ranges define those limits between which the
functionality of the device is guaranteed.

) . . . . . . . . . . .0°C to +70°C

A

) . . . . . . . . .–40°C to +85°C

A

) . . . . . . . .–55°C to +125°C

A

Am28F010A 19

MAXIMUM OVERSHOOT

V

CC

+0.8 V

–0.5 V

+ 0.5 V

2.0 V

V

CC

20 ns

–2.0 V

20 ns

Maximum Negative Input Overshoot

20 ns

+ 2.0 V

20 ns 20 ns

20 ns

16778D-12

V

CC

16778D-13

Maximum Positive Input Overshoot

20 ns

14.0 V

13.5 V

+ 0.5 V

20 ns 20 ns

16778D-14

Maximum VPP Overshoot

20 Am28F010A

DC CHARACTERISTICS over operating range unless otherwise specified
TTL/NMOS Compatible

Parameter

Symbol Parameter Description Test Conditions Min Typ Max Unit

I

I

CCS

I

CC1

I

CC2

I

CC3

I

PPS

I

I

I

V
V

V

V

V

V

V

I

LI

LO

PP1

PP2

PP3

IL

IH

OL

OH1

ID

I

ID

PPL

PPH

Input Leakage Current V

Output Leakage Current VCC = VCC Max, V
VCC Standby Current VCC = VCC Max, CE# = V

VCC Active Read Current

VCC Programming Current

VCC Erase Current

V

Standby Current V

PP

V

Read Current

PP

V

Programming Current

PP

V

Erase Current

PP

= V

CC

V

CC = VCC

I

OUT

CE

= VIL

Max, VIN = V

CC

= VCC or V

OUT

Max, CE# = V

= 0 mA, at 6 MHz

Programming in Progress

CC

IH

IL,

(Note 4)

#

CE

= VIL

Erasure in Progress (Note 4)

= V

PP

PPL

V

= V

PP

PPH

= V

V

PP

PPL

= V

V

PP

Programming in Progress

PPH

(Note 4)
V

= V

PP

Erasure in Progress

PPH

(Note 4)

or V

SS

OE# = V

SS

±1.0 µA
±1.0 µA

0.2 1.0 mA

IH

20 30 mA

20 30 mA

20 30 mA

±1.0 µA

70 200

µA

±1.0

10 30 mA

10 30 mA

Input Low Voltage –0.5 0.8 V
Input High Voltage 2.0 VCC + 0.5 V
Output Low Voltage IOL = 5.8 mA, VCC = VCC Min 0.45 V
Output High Voltage IOH = –2.5 mA, VCC = VCC Min 2.4 V
A9 Auto Select Voltage A9 = V

ID

11.5 13.0 V
A9 Auto Select Current A9 = VID Max, VCC = VCC Max 5 50 µA
V

during Read-Only

PP

Operations
V

during Read/Write

PP

Operations

Note: Erase/Program are inhibited
when V

PP

= V

PPL

0.0 VCC +2.0 V

11.4 12.6 V

V

LKO

Low VCC Lock-out Voltage 3.2 3.7 V

Notes:

1. Caution: The Am28F010A must not be removed from (or inserted into) a socket when V
volt, the voltage difference between V

and VCC should not exceed 10.0 volts. Also, the Am28F010A has a VPP rise time

PP

and fall time specification of 500 ns minimum.

2. I

3. Maximum active power usage is the sum of I

is tested with OE# = VIH to simulate open outputs.

CC1

CC

and IPP.

4. Not 100% tested.

Am28F010A 21

or VPP is applied. If VCC ≤ 1.0

CC

DC CHARACTERISTICS
CMOS Compatible

Parameter

Symbol Parameter Description Test Conditions Min Typ Max Unit

I

I

CCS

I

CC1

I

CC2

I

CC3

I

PPS

I

I

I

V
V

V
V
V

V

V

V

I

LI

LO

PP1

PP2

PP3

IL

IH

OL

OH1

OH2

ID

I

ID

PPL

PPH

Input Leakage Current V

Output Leakage Current VCC = VCC Max, V
VCC Standby Current VCC = VCC Max, CE#

V

Active Read Current

CC

VCC Programming Current

VCC Erase Current

V

Standby Current V

PP

V

Read Current V

PP

V

Programming Current

PP

V

Erase Current

PP

= V

CC

V

CC

V

IH

I

OUT

CE# = V

Max, VIN = V

CC

= V

Max, CE# = V

CC

= 0 mA, at 6 MHz

Programming in Progress

IL

OUT

or V

CC

SS

= VCC or V

±0.5 V 15 100 µA

= VCC

OE# =

IL,

(Note 4)

# = V

CE

Erasure in Progress

IL

(Note 4)

= V

PP

PPL

= V

PP

PPH

V

= V

PPH

PP

Programming in Progress (Note 4)

= V

V

PP

PPH

Erasure in Progress (Note 4)

SS

±1.0 µA
±1.0 µA

20 30 mA

20 30 mA

20 30 mA

±1.0 µA

70 200 µA

10 30 mA

10 30 mA

Input Low Voltage –0.5 0.8 V
Input High Voltage 0.7 V

CC

V

CC

+ 0.5 V

Output Low Voltage IOL = 5.8 mA, VCC = VCC Min 0.45 V

Output High Voltage

IOH = –2.5 mA, VCC = VCC Min 0.85 V
IOH = –100 µA, V

A9 Auto Select Voltage A9 = V

CC

CC = VCC

ID

Min VCC –0.4

11.5 13.0 V

V

A9 Auto Select Current A9 = VID Max, VCC = VCC Max 5 50 µA
V

during Read-Only

PPL

Operations
V

during Read/Write

PP

Operations

Note: Erase/Program are inhibited
when V

PP

= V

PPL

0.0 VCC + 2.0 V

11.4 12.6 V

V

LKO

Low VCC Lock-out Voltage 3.2 3.7 V

Notes:

1. Caution: The Am28F010A must not be removed from (or inserted into) a socket when V
the voltage difference between V

and VCC should not exceed 10.0 volts. Also, the Am28F010A has a VPP rise time and fall

PP

time specification of 500 ns minimum.

2. I

3. Maximum active power usage is the sum of I

is tested with OE# = VIH to simulate open outputs.

CC1

CC

and IPP.

4. Not 100% tested.

22 Am28F010A

or VPP is applied. If VCC ≤ 1.0 volt,

CC

25

20

15

Active in mA

10

CC

I

5

0

0123456789101112

Frequency in MHz

55°C
0°C
25°C
70°C
125°C

Figure 7. Am28F010A—Average ICC Active vs. Frequency

TEST CONDITIONS

Device

Under

Test

C

L

Note: Diodes are IN3064 or equivalent

Figure 8. Test Setup

6.2 kΩ

VCC = 5.5 V, Addressing Pattern = Minmax

Data Pattern = Checkerboard

5.0 V

2.7 kΩ

16778D-16

Output Load 1 TTL gate
Output Load Capacitance, C

(including jig capacitance)
Input Rise and Fall Times ≤10 ns
Input Pulse Levels 0.0–3.0 0.45–2.4 V

Input timing measurement
reference levels

Output timing measurement
reference levels

Table 6. Test Specifications

Test Condition -70 All others Unit

L

30 100 pF

1.5 0.8, 2.0 V

1.5 0.8, 2.0 V

16778D-15

Am28F010A 23

SWITCHING TEST WAVEFORMS

s

2.4 V

0.45 V

2.0 V
Test Points

0.8 V

Input

2.0 V

0.8 V
Output

AC T esting (all speed options except -70): Inputs are driven at

2.4 V for a logic “1” and 0.45 V for a logic “0”. Input pulse rise
and fall times are

≤

10 ns.

3 V

1.5 V

0 V

Input

Test Points

1.5 V

Output

AC Testing for -70 devices: Inputs are driven at 3.0 V for a

logic “1” and 0 V for a logic “0”. Input pulse rise and fall time
are ≤10 ns.

16778D-17

SWITCHING CHARACTERISTICS over operating range, unless otherwise specified

AC Characteristics—Read-Only Operations

Parameter

Symbols Am28F010A Speed Options

JEDEC Standard Parameter Description -70 -90 -120 -150 -200 Unit

t

AVAV

t

ELQV

t

AVQV

t

GLQVtOE

t

ELQX

t

EHQZtDF

t

GLQXtOLZ

t

GHQZtDF

t

AXQXtOH

t
t
t

t

RC

CE

ACC

LZ

Read Cycle Time (Note 3) Min 70 90 120 150 200 ns
Chip Enable Access Time Max 70 90 120 150 200 ns
Address Access Time Max 70 90 120 150 200 ns
Output Enable Access Time Max 35 35 50 55 55 ns
Chip Enable to Output in Low Z (Note 3)Min00000ns
Chip Disable to Output in High Z (Note 1) Max 20 20 30 35 35 ns
Output Enable to Output in Low Z (Note 3) Min 00000ns
Output Disable to Output in High Z (Note 3) Max 20 20 30 35 35 ns
Output Hold Time From First Address, CE#,

or OE

# change (Note 3)

Min00000ns

t

VCS

VCC Set-up Time to Valid Read (Note 3) Min 50 50 50 50 50 ns

Notes:

1. Guaranteed by design; not tested.

2. Not 100% tested.

24 Am28F010A

AC Characteristics—Write (Erase/Program) Operations

Parameter Symbols Am28F010A Speed Options
JEDEC Standard Description -70 -90 -120 -150 -200 Unit

t

AVAV

t

AVWLtAS

t

WLAXtAH

t

DVWHtDS

t

WHDXtDH

t

OEH

t

GHWL

t

ELWLEtCSE

t

WHEHtCH

t

WLWHtWP

t

WHWLtWPH

t

WHWH3

t

WHWH4

t

VPEL

t

VCS

t

VPPR

t

VPPF

t

LKO

t

WC

Write Cycle Time (Note 4) Min 70 90 120 150 200 ns
Address Setup Time Min00000ns
Address Hold Time Min 45 45 50 60 75 ns
Data Setup Time Min 45 45 50 50 50 ns
Data Hold Time Min 10 10 10 10 10 ns
Output Enable Hold Time for Embedded

Algorithm only

Min1010101010ns

Read Recovery TIme Before Write Min00000ns
CE# Embedded Algorithm Set up TIm e Min 20 20 20 20 20 ns
CE# Hold TIme Min00000ns
Write Pulse Width Min 45 45 50 60 60 ns
Write Pulse Width High Min 20 20 20 20 20 ns
Embedded Program Operation (Note 2) Min 14 14 14 14 14 µs

Embedded Erase Operation (Note 3) Typ 5 5555sec
VPP Setup Time to Chip Enable Low (Note 4) Min 100 100 100 100 100 ns
VCC Setup TIme (Note 4) Min 50 50 50 50 50 µs
VPP Rise Time (Note 4) 90% V
VPP Fall Time (Note 4) 90% V
VCC < V

to Reset (Note 4) Min 100 100 100 100 100 ns

LKO

PPH

PPL

Min 500 500 500 500 500 ns
Min 500 500 500 500 500 ns

Notes:

1. Read timing characteristics during read/write operations are the same as during read-only operations. Refer to AC
Characteristics for Read Only operations.

2. Embedded Program Operation of 14 µs consists of 10 µs program pulse and 4 µs write recovery before read. This is the

minimum time for one pass through the programming algorithm.

3. Embedded Erase operation of 5 sec consists of 4 sec array pre-programming time and one sec array erase time. This is a
typical time for one embedded erase operation.

4. Not 100% tested.

Am28F010A 25

KEY TO SWITCHING WAVEFORMS

WAVEFORM INPUTS OUTPUTS

Don’t Care, Any Change Permitted Changing, State Unknown

Does Not Apply Center Line is High Impedance State (High Z)

SWITCHING WAVEFORMS

Steady

Changing from H to L

Changing from L to H

Addresses

# (E#)

CE

OE

# (G#)

WE# (W#)

Data (DQ)

5.0 V
V

CC

0 V

Power-up, Standby

t

VCS

High Z High Z

Device and

Address Selection

Addresses Stable

t

WHGL

t

GLQV

t

(tCE)

ELQV

t

(tLZ)

ELQX

t

(t

AVQV

ACC

)

Outputs
Enabled

t

AVAV

(tOE)

t

GLQX

(tRC)

(t

OLZ

Data
Valid

)

Output Valid

t

AXQX (tOH

Standby, Power-down

t

EHQZ

(tDF)

t

GHQZ

(tDF)

)

Figure 9. AC Waveforms for Read Operations

26 Am28F010A

16778D-18

SWITCHING WAVEFORMS

Addresses

CE

OE#

WE#

Data

V

CC

Embedded

Erase Setup

t

WC

#

t

GHWL

t

WP

t

CSE

t

VCS

t

DS

Embedded

Erase

t

AS

t

WPH

Erase Standby

t

AH

t

WHWH3 OR 4

t

DH

30h

Data# Polling

DQ7#30h

DQ7#

Read

t

RC

t

t

OE

t

CE

DF

t

OH

V

PP

t

VPEL

Note:

DQ7

#

is the complement of the data written to the device.

Figure 10. AC Waveforms for Embedded Erase Operation

16778D-19

Am28F010A 27

SWITCHING WAVEFORMS

Addresses

CE

OE#

WE#

Data

V

CC

t

GHWL

t

Embedded

WPH

Program

PA

t

AS

t

AH

IN

t

WHWH3 OR 4

Data# Polling

PA

DQ7#D

DQ7

# D

OUT

Read

t

RC

t

t

DF

OH

t

OE

t

CE

Embedded

Program Setup

t

WC

#

t

WP

t

CSE

t

DH

50h

t

VCS

t

DS

V

PP

t

VPEL

Notes:

D

is data input to the device.

IN

#

is the complement of the data written to the device.

DQ7

is the data written to the device.

D

OUT

Figure 11. AC Waveforms for Embedded Programming Operation

16778D-20

28 Am28F010A

AC Characteristics—Write (Erase/Program) Operations
Alternate CE

# Controlled Writes

Parameter Symbols Am28F010A Speed Options
JEDEC Standard Description -70 -90 -120 -150 -200 Unit

t

AVAV

t

AVEL

t

ELAX

t

DVEHtDS

t

EHDXtDH

t

OEH

t

GHEL

t

WLELtWS

t

EHWKtWH

t

ELEHtCP

t

EHELtCPH

t

EHEH3

t

EHEH4

t

VPEL

t

VCS

t

VPPR

t

VPPF

t

LKO

t
t
t

WC

AS

AH

Write Cycle Time (Note 4) Min 70 90 120 150 200 ns
Address Setup Time Min00000ns
Address Hold Time Min 45 45 50 60 75 ns
Data Setup Time Min 45 45 50 50 50 ns
Data Hold Time Min 10 10 10 10 10 ns
Output Enable Hold Time for Embedded

Algorithm only

Min1010101010ns

Read Recovery Time Before Write Min00000ns
WE# Setup Time by CE# Min00000ns
CE# Hold Time Min00000ns
Write Pulse Width Min 65 65 70 80 80 ns
Write Pulse Width High Min 20 20 20 20 20 ns
Embedded Program Operation (Note 2) Min 14 14 14 14 14 µs

Embedded Erase Operation (Note 2) Typ 5 5555sec
VPP Setup Time to Chip Enable Low (Note 3) Min 100 100 100 100 100 ns
VCC Setup Time (Note 3) Min 50 50 50 50 50 µs
VPP Rise Time (Note 3) 90% V
VPP Fall Time (Note 3) 90% V
VCC < V

to Reset (Note 3) Min 100 100 100 100 100 ns

LKO

Min 500 500 500 500 500 ns

PPH

PPL

Min 500 500 500 500 500 ns

Notes:

1. Read timing characteristics during read/write operations are the same as during read-only operations. Refer to AC
Characteristics for Read Only operations.

2. Embedded Program Operation of 14 µs consists of 10 µs program pulse and 4 µs write recovery before read. This is the

minimum time for one pass through the programming algorithm.

3. Embedded erase operation of 5 sec consists of 4 sec array pre-programming time and one sec array erase time. This is a
typical time for one embedded erase operation.

4. Not 100% tested.

Am28F010A 29

SWITCHING WAVEFORMS

Addresses

CE

OE#

WE#

Data

V

CC

Embedded

Program Setup

t

WC

#

t

GHEL

t

CP

t

WS

50h

t

DS

Embedded

Program

t

CPH

Data# Polling

PA

t

AS

t

AH

t

EHEH3 OR 4

t

DH

IN

PA

DQ7#D

DQ7

D

OUT

V

PP

t

VPEL

Notes:

D

is data input to the device.

IN

#

is the complement of the data written to the device.

DQ7

is the data written to the device.

D

OUT

Figure 12. AC Waveforms for Embedded Programming Operation Using CE# Controlled Writes

16778D-21

30 Am28F010A

ERASE AND PROGRAMMING PERFORMANCE

Limits

Typ

Parameter

Chip Erase Time 1 10 sec Excludes 00h programming prior to erasure
Chip Programming Time 2 12.5 sec Excludes system-level overhead
Write/Erase Cycles 100,000 C ycl es
Byte Programming Time 14 µs

(Note 1)

Max

(Note 2) Unit

96

(Note 3)

ms

CommentsMin

Notes:

1. 25

°

C, 12 V VPP.

2. Maximum time specified is lower than worst case. Worst case is derived from the embedded algorithm internal counter which
allows for a maximum 6000 pulses for both program and erase operations. Typical worst case for program and erase is
significantly less than the actual device limit.

3. Typical worst case = 84 µs. DQ5 = “1” only after a byte takes longer than 96 ms to program.

LATCHUP CHARACTERISTICS

Parameter Min Max

Input Voltage with respect to V
Input Voltage with respect to V
Current –100 mA +100 mA

on all pins except I/O pins (Including A9 and VPP) –1.0 V 13.5 V

SS

on all pins I/O pins –1.0 V VCC + 1.0 V

SS

Includes all pins except V

. Test conditions: VCC = 5.0 V, one pin at a time.

CC

PIN CAPACITANCE

Parameter

Symbol Parameter Description Test Conditions Typ Max Unit

Input Capacitance VIN = 0 8 10 pF
Output Capacitance V
VPP Input Capacitance VPP = 0 8 12 pF

= 0 8 12 pF

OUT

C

C

C

IN

OUT

IN2

Note: Sampled, not 100% tested. Test conditions TA = 25°C, f = 1.0 MHz.

DATA RETENTION

Parameter Test Conditions Min Unit

Minimum Pattern Data Retention Time

150°C 10 Years
125°C 20 Years

Am28F010A 31

PHYSICAL DIMENSIONS

PD032—32-Pin Plastic DIP (measured in inches)

1.640

1.670

.120
.160

32

.140
.225

Pin 1 I.D.

.045
.065

.005 MIN

.090
.110

.016
.022

17

.530
.580

16

0°

10°

SEATING PLANE

.015
.060

PL032—32-Pin Plastic Leaded Chip Carrier (measured in inches)

.485
.495

.009
.015

.125
.140

.080
.095

SEATING

PLANE

.013
.021

.050 REF.

SIDE VIEW

.585
.595

.447
.453

Pin 1 I.D.

.547
.553

.026
.032

TOP VIEW

.600
.625

.009
.015

.630
.700

16-038-S_AG
PD 032
EC75
5-28-97 lv

.042
.056

.400

REF.

.490
.530

16-038FPO-5
PL 032
DA79
6-28-94 ae

32 Am28F010A

PHYSICAL DIMENSIONS

TS032—32-Pin Standard Thin Small Outline Package (measured in millimeters)

0.95

1.05

Pin 1 I.D.

1

7.90

8.10

0.50 BSC

1.20

MAX

18.30

18.50

19.80

20.20

0.05

0.15

0.08

0.20

0.10

0°
5°

0.50

0.70

0.21

16-038-TSOP-2
TS 032
DA95
3-25-97 lv

33 Am28F010A

PHYSICAL DIMENSIONS

TSR032—32-Pin Reversed Thin Small Outline Package (measured in millimeters)

0.95

1.05

Pin 1 I.D.

1

7.90

8.10

0.50 BSC

1.20

MAX

18.30

18.50

19.80

20.20

0.05

0.15

0.08

0.20

0.10

0°
5°

0.50

0.70

0.21

16-038-TSOP-2
TSR032
DA95
3-25-97 lv

Am28F010A 34

DATA SHEET REVISION SUMMARY FOR AM28F010A

Revision C+1

Distinctive Characteristics:

High Performance:

is now 70 ns.

General Description:

Paragraph 2: Changed fastest speed option to 70 ns.

Product Selector Guide:

Added -70, deleted -95 and -250 speed options.

Ordering Information, Standard Products:

The -70 speed option is now listed in the example.

Valid Combinations:

combinations.

Operating Ranges:

VCC Supply V oltages :

speed options in the list.

AC Characteristics:

Read Only Operations Characteristics:

column and test conditions.
Deleted -95 and -250 speed options.

The fastest speed option available

Added -70, deleted -95 and -250

Added -70, deleted -9 5 and -250

Added the -70

AC Characteristics:

Write/Erase/Program Operations, Alternate CE# Con­trolled Writes:

-250 speed options.

Switching Test Waveforms:

In the 3.0 V waveform caption, changed -95 to -70.

Added the -70 column. Deleted -95 and

Revision D

Matched formatting to other current data sheets.

Revision D+1

Programming In A PROM Programmer:

Deleted the paragraph “(Refer to the AUTO SELECT
paragraph in the ERASE, PROGRA M, and READ
MODE section for programming the Flash memory de­vice in-system).”

Revision D+2

General Description

Embedded Program:

perature programming time of this device is four sec­onds.” to “The typical room temperature programming
time of this device is two seconds.”

Changed “The typical room tem-

Trademarks

Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

35 Am28F010A