
30V N-Channel MOSFET
General Description Product Summary
AON6428L
The AON6428L uses advanced trench technology to
provide excellent R
, low gate charge.This device is
DS(ON)
suitable for use as a high side switch in SMPS and general
purpose applications.
DS
ID (at VGS=10V)
R
R
(at VGS=10V)
DS(ON)
(at VGS= 4.5V)
DS(ON)
30V
24A
< 10mΩ
< 14.5m
100% UIS Tested
100% Rg Tested
Top View
1
2
3
4
8
7
6
5
G
DFN5X6
Absolute Maximum Ratings T
Drain-Source Voltage 30
Continuous Drain
Current
G
Pulsed Drain Current
Continuous Drain
Current
TC=25°C
T
C
C
T
A
T
A
Avalanche Current
Repetitive avalanche energy L=0.1mH
T
C
Power Dissipation
Power Dissipation
B
C
T
A
A
T
A
Junction and Storage Temperature Range -55 to 150 °C
=25°C unless otherwise noted
A
=100°C
=25°C
=70°C
=25°C
=100°C
=25°C
=70°C
Symbol
V
DS
V
GS
I
D
I
DM
I
DSM
I
AR
E
AR
P
D
P
DSM
TJ, T
STG
Maximum UnitsParameter
24
19
80
11
8
20
25
10T
2
1.3
D
S
mJ
W
W
V
V±20Gate-Source Voltage
A
A
A20
Thermal Characteristics
Parameter Typ Max
Maximum Junction-to-Ambient
Maximum Junction-to-Case
D
t ≤ 10s
Steady-State
Steady-State
Symbol
R
θJA
R
θJC
21
50
3.5
25
60
5
Units
°C/W
°C/WMaximum Junction-to-Ambient
°C/W
Rev 1: April 2009 www.aosmd.com Page 1 of 6

AON6428L
Electrical Characteristics (T
Symbol Min Typ Max Units
=25°C unless otherwise noted)
J
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
DSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode Continuous Current
=250µA, VGS=0V
I
D
=30V, VGS=0V
V
DS
=0V, VGS= ±20V
V
DS
V
DS=VGS ID
V
GS
V
GS
V
GS
V
DS
=1A,VGS=0V
I
S
=250µA
=10V, VDS=5V
=10V, ID=20A
=4.5V, ID=20A
=5V, ID=20A
T
J
=125°C
T
J
=55°C
30 V
1
5
µA
±100 nA
1.2 1.7 2.2 V
80 A
8.3 10
12.4 15
11.3 14.5
mΩ
m
43 S
0.7 1 V
25 A
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance V
=0V, VDS=15V, f=1MHz
V
GS
=0V, VDS=0V, f=1MHz
GS
620 770 920 pF
170 240 310 pF
45 77 110 pF
0.4 0.8 1.4 Ω
SWITCHING PARAMETERS
(10V)
Q
g
(4.5V)
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
. The value of R
Power dissipation P
the user's specific board design.
B. The power dissipation P
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T
T
=25°C.
J
D. The R
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of T
G. The maximum current rating is limited by bond-wires.
H. These tests are performed with the device mounted on 1 in
Total Gate Charge
Total Gate Charge
Gate Source Charge
V
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
V
R
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
θJA
is based on R
DSM
is based on T
D
is the sum of the thermal impedence from junction to case R
θJA
and the maximum allowed junction temperature of 150°C. The value in any given application depends on
θJA
=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
J(MAX)
I
I
2
FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
11.8 14.8 17.8 nC
=10V, VDS=15V, ID=20A
GS
5.7 7.1 8.5 nC
1.7 2.2 2.6 nC
1.8 3.1 4.3 nC
5ns
=10V, VDS=15V, RL=0.75Ω,
GS
=3Ω
GEN
3ns
18 ns
3ns
=20A, dI/dt=500A/µs
F
=20A, dI/dt=500A/µs
F
=150°C. Ratings are based on low frequency and duty cycles to keep initial
J(MAX)
and case to ambient.
θJC
911
18 23
13 ns
28
nC
Rev 1: April 2009
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 1: April 2009 www.aosmd.com Page 2 of 6