Alpha & Omega Semiconductor AOL1424 Service Manual

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AOT424 N-Channel Enhancement Mode Field Effect Transistor
General Description
The AOT424 uses advanced trench technology to provide excellent R
gate resistance. This device is ideally suited for use as a low side switch in CPU core power conversion. Standard Product AOT424 is Pb-free (meets ROHS & Sony 259 specifications). AOT424L is a Green Product ordering option. AOT424 and AOT424L are electrically identical.
O-220
G D S
Absolute Maximum Ratings T
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain
Current
B,G
Pulsed Drain Current Avalanche Current
Repetitive avalanche energy L=0.1mH
Power Dissipation
Junction and Storage Temperature Range
, low gate charge and low
DS(ON)
=25°C unless otherwise noted
A
G
=25°C
T
C
TC=100°C
C
B
TC=25°C
B
T
=100°C
C
Symbol
V
DS
V
GS
I
D
I
DM
I
C
AR
E
AR
P
D
TJ, T
STG
Features
VDS (V) = 30V
= 110A (VGS = 10V)
I
D
R
DS(ON)
R
< 5.5m (VGS = 4.5V)
DS(ON)
D
G
S
< 4m (VGS = 10V)
Maximum UnitsParameter
30
110
88
200
30
112 mJ
100
50
-55 to 175
V
V±20
A
A
W
°C
Thermal Characteristics Parameter Units
Maximum Junction-to-Ambient Maximum Junction-to-Ambient
Maximum Junction-to-Case
C
t 10s Steady-State Steady-State
Symbol Typ Ma
R
θJA
R
θJC
14.2 20 39 50
0.8 1.5
°C/W °C/W °C/W
Alpha & Omega Semiconductor, Ltd.
AOT424
Electrical Characteristics (T
Symbol Min Typ Max Units
=25°C unless otherwise noted)
J
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
DSS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body leakage current
Gate Threshold Voltage V On state drain current
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage Maximum Body-Diode Continuous Current
I
=250µA, VGS=0V
D
=24V, VGS=0V
V
DS
V
=0V, VGS= ±20V
DS DS=VGS ID
V
GS
V
GS
V
GS
V
DS
I
=1A,VGS=0V
S
=250µA =10V, VDS=5V =10V, ID=30A
=4.5V, ID=30A =5V, ID=30A
T
J
=125°C
T
J
=55°C
30 V
1 5
µA
100 nA
123V
110 A
34
4.7 6
4.3 5.5
m
m
106 S
0.72 1 V 85 A
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance V
V
=0V, VDS=15V, f=1MHz
GS
=0V, VDS=0V, f=1MHz
GS
3200 3840 pF
590 pF 414 pF
0.54 0.7
SWITCHING PARAMETERS
(10V)
Q
g
Q
(4.5V)
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
A: The value of R dissipation P depends on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB or heatsink allows it. B. The power dissipation P limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. C: Repetitive rating, pulse width limited by junction temperature T D. The R E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These tests are performed with the device mounted on 1 in provides a single pulse rating. G. The maximum current rating is limited by the package current capability.
Rev2: August 2005
Total Gate Charge Total Gate Charge Gate Source Charge Gate Drain Charge Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time
Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge
is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T
θJA
is based on steady-state R
DSM
is based on T
D
is the sum of the thermal impedence from junction to case R
θJA
and the maximum allowed junction temperature of 150°C. The value in any given application
θJA
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
J(MAX)
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve
=10V, VDS=15V, ID=30A
V
GS
=10V, VDS=15V, RL=0.5,
V
GS
R
=3
GEN
IF=30A, dI/dt=100A/µs I
=30A, dI/dt=100A/µs
F
=175°C.
J(MAX)
and case to ambient.
θJC
59.6 72 nC
30.4 37 nC
9.5 nC
19.8 nC
12.5 ns
35.5 ns
40 ns
32.5 ns
35.3 42
ns
30.7 nC
=25°C. The Power
A
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
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