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AO4402
N-Channel Enhancement Mode Field Effect Transistor
March 2002
General Description
The AO4402 uses advanced trench technology to
provide excellent R
operation with gate voltages as low as 2.5V. This
device is suitable for use as a load switch or in PWM
applications.
S
S
S
G
SOIC-8
, low gate charge and
DS(ON)
D
D
D
D
Features
VDS (V) = 30V
I
D
R
R
R
G
= 12A
DS(ON)
DS(ON)
DS(ON)
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Symbol
Drain-Source Voltage
Gate-Source Voltage
=25°C
B
T
A
T
A
T
A
T
A
=70°C
=25°C
=70°C
Continuous Drain
Current
A
Pulsed Drain Current
Power Dissipation
Junction and Storage Temperature Range
V
DS
V
GS
I
D
I
DM
P
D
TJ, T
STG
< 14mΩ (VGS = 10V)
< 16mΩ (VGS = 4.5V)
< 22mΩ (VGS = 2.5V)
Maximum UnitsParameter
30
12
10
80
3
2.1
-55 to 150
V
V±12
A
W
°C
Thermal Characteristics
Parameter Units
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
C
A
A
t ≤ 10s
Steady-State
Steady-State
Symbol Ty
R
θJA
R
θJL
23 40
48 65
12 16
Max
°C/W
°C/W
°C/W
Alpha & Omega Semiconductor, Ltd.
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AO4402
Electrical Characteristics (T
Symbol Min Typ Max Units
=25°C unless otherwise noted)
J
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
DSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
I
V
V
Gate Threshold Voltage V
On state drain current
V
V
Static Drain-Source On-Resistance
V
V
Forward Transconductance
Diode Forward Voltage
V
I
Maximum Body-Diode Continuous Current
=250µA, VGS=0V
D
=24V, VGS=0V
DS
=0V, VGS= ±12V
DS
DS=VGS ID
GS
GS
GS
GS
DS
=10A,VGS=0V
S
=250µA
=4.5V, VDS=5V
=10V, ID=12A
=4.5V, ID=10A
=2.5V, ID=8A
=5V, ID=5A
=55°C
T
J
=125°C
T
J
30 V
1
5
µA
100 nA
0.6 0.8 1.2 V
60 A
11.1 14
16 19.2
13.1 16
21 26
mΩ
m
m
25 50 S
0.8 1 V
4.5 A
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance V
V
=0V, VDS=15V, f=1MHz
GS
=0V, VDS=0V, f=1MHz
GS
1630 pF
201 pF
142 pF
0.8 Ω
SWITCHING PARAMETERS
Q
Q
Q
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
g
gs
gd
rr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
VGS=4.5V, VDS=15V, ID=12A
V
=10V, VDS=15V, RL=1.2Ω,
GS
R
=3Ω
GEN
IF=10A, dI/dt=100A/µs
=10A, dI/dt=100A/µs
I
F
19 nC
3.3 nC
5.2 nC
3ns
4.7 ns
33.5 ns
6ns
21
ns
11 nC
A: The value of R
any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R
θJA
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
provides a single pulse rating.
is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The value in
θJA
is the sum of the thermal impedence from junction to lead R
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve
and lead to ambient.
θJL
Alpha & Omega Semiconductor, Ltd.