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30V Dual N-Channel MOSFET with Schottky Diode
Absolute Maximum Ratings T
=25°C unless otherwise noted
General Description Product Summary
AO4914
The AO4914 uses advanced trench technology to provide
excellent R
and low gate charge. The two MOSFETs
DS(ON)
make a compact and efficient switch and synchronous
rectifier combination for use in DC-DC converters. A
Schottky diode is co-packaged in parallel with the
synchronous MOSFET to boost efficiency further.
SOIC-8
SOIC-8
Top View Bottom View
Top View Bottom View
S1/A
S1/A
G1
G1
S2
S2
G2
G2
Q1(N-Channel) Q2(N-Channel)
VDS= 30V 30V
ID= 8A (VGS=10V) 8A (VGS=10V)
R
R
<20.5mΩ R
DS(ON)
<28mΩ R
DS(ON)
DS(ON)
DS(ON)
ESD Protected ESD Protected
100% UIS Tested 100% UIS Tested
100% Rg Tested 100% Rg Tested
VDS = 30V, IF = 3A, VF<0.5V@1A
D1
Top View
Top View
D1/K
D1/K
D1/K
D1/K
D2
D2
D2
D2
G1
G1
D1
S1
K
K
A
A
<20.5mΩ (VGS=10V)
<28mΩ (VGS=4.5V)
D2
D2
G2
G2
S2
A
Max Q1
Drain-Source Voltage 30
Gate-Source Voltage
Continuous Drain
Current
Pulsed Drain Current
Avalanche Current
TA=25°C
TA=70°C
C
C
C
TA=25°C
B
Power Dissipation
TA=70°C
Junction and Storage Temperature Range
Parameter Units
Reverse Voltage V
Continuous Forward
Current
Pulsed Diode Forward Current
TA=25°C
TA=70°C
C
TA=25°C
B
TA=70°C
Junction and Storage Temperature Range -55 to 150 °C
V
DS
V
GS
I
D
I
DM
IAS, I
EAS, E
P
D
TJ, T
V
DS
I
F
I
FM
P
D
TJ, T
AR
STG
STG
8
6.5
40
19
AR
18
2
1.3
-55 to 150
Max Schottky
1.28Power Dissipation
30
2.2
20
Max Q2
30
±20
UnitsParameter
V
V±20
8
6.5
A
40
19
18
2
1.3
A
mJAvalanche energy L=0.1mH
W
°C
3
A
2
W
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AO4914
Thermal Characteristics - MOSFET
Parameter Typ Max Units
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
A
A D
t ≤ 10s
Steady-State
Steady-State
Thermal Characteristics - Schottky
Parameter Typ Max Units
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
A. The value of R
value in any given application depends on the user's specific board design.
B. The power dissipation PDis based on T
C. Repetitive rating, pulse width limited by junction temperature T
initialTJ=25°C.
D. The R
θJA
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
θJA
is the sum of the thermal impedence from junction to lead R
A
A D
=150°C, using ≤ 10s junction-to-ambient thermal resistance.
J(MAX)
t ≤ 10s
Steady-State
Steady-State
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
J(MAX)
Symbol
R
θJA
R
θJL
48
74 90
32
62.5 °C/W
40
Symbol
R
θJA
R
θJL
=150°C. Ratings are based on low frequency and duty cycles to keep
and lead to ambient.
θJL
48 62.5 °C/W
74 90
32 40
°C/W
°C/W
°C/W
°C/W
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AO4914
Q1 Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Min Typ Max Units
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
Drain-Source Breakdown Voltage
DSS
Zero Gate Voltage Drain Current (Set
by Schottky leakage)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode + Schottky Continuous Current
ID=250uA, VGS=0V
30 V
VR=30V 0.05
VR=30V, TJ=125°C 10
VR=30V, TJ=150°C 20
VDS=0V,VGS=±16V
VDS=V
GS ID
=250µA
VGS=10V, VDS=5V
VGS=10V, ID=8A
1.2 1.8 2.4 V
40 A
17 20.5
10 µA
TJ=125°C 23.5 29
VGS=4.5V, ID=4A
VDS=5V, ID=8A
IS=1A,VGS=0V
20.5 28 mΩ
30 S
0.45 0.5 V
3 A
mA
mΩ
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
575 730 865 pF
115 165 215 pF
50 82 120 pF
0.5 1.1 1.7 Ω
SWITCHING PARAMETERS
Qg(10V) 12 15 18 nC
Qg(4.5V) 6 7.5 9 nC
Q
gs
Q
gd
Total Gate Charge
Total Gate Charge
Gate Source Charge
Gate Drain Charge
VGS=10V, VDS=15V, ID=8A
2.5 nC
3 nC
t
r
t
D(off)
t
f
t
rr
Q
rr
A. The value of R
in any given application depends on the user's specific board design.
B. The power dissipation PDis based on T
C. Repetitive rating, pulse width limited by junction temperature T
initialTJ=25°C.
D. The R
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2FR-4 board with 2oz.
Copper, assuming a maximum junction temperature of T
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value
θJA
=150°C, using ≤ 10s junction-to-ambient thermal resistance.
J(MAX)
is the sum of the thermal impedence from junction to lead R
θJA
=150°C. The SOA curve provides a single pulse rating.
J(MAX)
VGS=10V, VDS=15V, RL=1.8Ω,
R
=3Ω
GEN
IF=8A, dI/dt=500A/µs
IF=8A, dI/dt=500A/µs
=150°C. Ratings are based on low frequency and duty cycles to keep
J(MAX)
and lead to ambient.
θJL
3.5 ns
19 ns
3.5 ns
8
ns
8 nC
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