Alpha & Omega AO4712 Schematic [ru]

General Description Product Summary
V
Symbol
V
V
Absolute Maximum Ratings T
=25°C unless otherwise noted
Drain-Source Voltage
30
SRFET
TM
D
D
S
S
V
A D
V
Drain-Source Voltage
30
A
AO4712
30V N-Channel MOSFET
SRFETTM AO4712 uses advanced trench technology with a monolithically integrated Schottky diode to provide excellent R
,and low gate charge. This device is
DS(ON)
suitable for use as a low side FET in SMPS, load switching and general purpose applications.
ID (at VGS=10V) 13A R R
(at VGS=10V) < 11m
DS(ON)
(at VGS = 4.5V) < 14m
DS(ON)
30V
100% UIS Tested 100% Rg Tested
SOIC-8
Top View Bottom View
D
D
S
A
G
G
D
SRFET Soft Recovery MOSFET:
Integrated Schottky Diode
S
TM
Maximum UnitsParameter
V
GS
C
B
TA=25°C TA=70°C
C
TA=25°C TA=70°C
I
D
I
DM
IAS, I
C
EAS, E P
D
TJ, T
AR
AR
STG
Continuous Drain Current
Pulsed Drain Current Avalanche Current Avalanche energy L=0.1mH
Power Dissipation Junction and Storage Temperature Range -55 to 150 °C
13 10 68
11
3.1
mJ
2
V±12Gate-Source Voltage
A
A15
W
Thermal Characteristics
Maximum Junction-to-Ambient Maximum Junction-to-Ambient Maximum Junction-to-Lead
t 10s Steady-State Steady-State
Symbol
R
θJA
R
θJL
32 60 17
40 75 24
UnitsParameter Typ Max
°C/W °C/W °C/W
www.aosmd.com Page 1 of 6
tr2.4
ns
Turn-On Rise Time
VGS=10V, V
=15V, R
=1.2Ω,
Electrical Characteristics (TJ=25°C unless otherwise noted)
AO4712
Symbol Min Typ Max Units
Parameter Conditions
STATIC PARAMETERS
BV I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
Drain-Source Breakdown Voltage
DSS
Zero Gate Voltage Drain Current Gate-Body leakage current
Gate Threshold Voltage On state drain current
Static Drain-Source On-Resistance
Forward Transconductance Diode Forward Voltage Maximum Body-Diode Continuous Current
ID=1mA, VGS=0V
30 V
VDS=30V, VGS=0V 0.5
TJ=125°C 100 VDS=0V, VGS= ±12V VDS=V
GS ID
=250µA VGS=10V, VDS=5V VGS=10V, ID=13A
1.1 1.65 2.1 V 68 A
100 nA
9 11
TJ=125°C 13 16 VGS=4.5V, ID=11A VDS=5V, ID=13A IS=1A,VGS=0V
10.7 14 m 80 S
0.4 0.7 V 5 A
mA
m
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
930 1170 1400 pF
90 128 170 pF 45 89 125 pF
0.7 1.4 2.1
SWITCHING PARAMETERS
Qg(10V) 16 20 24 nC Qg(4.5V) 7 8.7 10.5 nC Q
gs
Q
gd
t
D(on)
t
D(off)
t
f
t
rr
Q
rr
A. The value of R value in any given application depends on the user's specific board design. B. The power dissipation PDis based on T C. Repetitive rating, pulse width limited by junction temperature T initialTJ=25°C. D. The R E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, assuming a maximum junction temperature of T
Total Gate Charge Total Gate Charge Gate Source Charge Gate Drain Charge Turn-On DelayTime
Turn-Off DelayTime Turn-Off Fall Time
Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge
is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
θJA
=150°C, using 10s junction-to-ambient thermal resistance.
J(MAX)
is the sum of the thermal impedance from junction to lead R
θJA
J(MAX)
VGS=10V, VDS=15V, ID=13A
3.2 nC
3 nC 6 ns
DS
R
=3
GEN
L
23 ns
4 ns IF=13A, dI/dt=500A/µs IF=13A, dI/dt=500A/µs
=150°C. Ratings are based on low frequency and duty cycles to keep
J(MAX)
and lead to ambient.
θJL
=150°C. The SOA curve provides a single pulse rating.
5.5 7 8.5 ns 5 6.5 8
nC
Rev 8: December 2011 www.aosmd.com Page 2 of 6
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
(Note E)
AO4712
35
10V
30
25
20
(A)
D
I
15
10
5
0
13
12
11
Ω)
(m
10
DS(ON)
R
9
8
7
3V
VGS=2.25V
0 1 2 3 4 5
Fig 1: On-Region Characteristics (Note E)
1 6 11 16 21 26
Figure 3: On-Resistance vs. Drain Current and Gate
VDS(Volts)
VGS=4.5V
VGS=10V
ID(A)
Voltage (Note E)
2.75V
2.5V
35
30
25
20
(A)
D
I
15
10
5
0
1.5 2 2.5 3
Figure 2: Transfer Characteristics (Note E)
2
1.8
1.6
1.4
1.2
1
Normalized On-Resistance
0.8 0 25 50 75 100 125 150 175 200
VDS=5V
125°C
25°C
VGS(Volts)
VGS=10V ID=13A
VGS=4.5V ID=11A
Figure 4: On-Resistance vs. Junction Temperature
Temperature (°C)
17
5 2
10
0
18
25
20
15
Ω)
(m
10
DS(ON)
R
5
0
2 4 6 8 10
25°C
Figure 5: On-Resistance vs. Gate-Source Voltage
VGS(Volts)
(Note E)
125°C
ID=13A
1.0E+02
1.0E+01
1.0E+00
1.0E-01
(A)
S
I
1.0E-02
1.0E-03
1.0E-04
1.0E-05
125°C
40
25°C
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Figure 6: Body-Diode Characteristics (Note E)
VSD(Volts)
Rev 8: December 2011 www.aosmd.com Page 3 of 6
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