Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com 1
Specifications subject to change without notice. 12/99A
30–36 GHz GaAs MMIC
Power Amplifier
Features
■ Single Gate and Drain Biases
■ 25 dBm Typical P
1 dB
Output Power
at 31 GHz
■ 11 dB Typical Small Signal Gain
■ 0.25 µm Ti/Pd/Au Gates
■ 100% On-Wafer RF and DC Testing
■ 100% Visual Inspection to MIL-STD-883
MT 2010
Chip Outline
AA032P1-00
Description
Alpha’s two-stage reactively-matched Ka band GaAs
MMIC power amplifier has a typical P
1 dB
of 25 dBm with
10 dB associated gain and 15% power added efficiency
at 31 GHz. The chip uses Alpha’s proven
0.25 µm MESFET technology, and is based upon MBE
layers and electron beam lithography for the highest
uniformity and repeatability. The FETs employ surface
passivation to ensure a rugged, reliable part with
through-substrate via holes and gold-based backside
metallization to facilitate solder or epoxy die attach
processes. Single gate and drain bias pads cover both
stages, with the added convenience that the chip can be
wire bonded from either side for either bias. All chips are
screened for gain, output power, efficiency and Sparameters prior to shipment for guaranteed performance.
A broad range of applications exist in both the military and
commercial areas where high power and gain are
required.
Parameter Condition Symbol Min. Typ.
2
Max. Unit
Drain Current (at Saturation) I
DS
400 450 mA
Small Signal Gain F = 30–31, 34–36 GHz G 8 11 dB
Input Return Loss F = 30–31, 34–36 GHz RL
I
-7 -6 dB
Output Return Loss F = 30–31, 34–36 GHz RL
O
-8 -6 dB
Output Power at 1 dB Gain Compression F = 31 GHz P
1 dB
24 25 dBm
Saturated Output Power F = 31 GHz P
SAT
25 27 dBm
Gain at Saturation F = 31 GHz G
SAT
8dB
Thermal Resistance
1
Θ
JC
42 °C/W
Electrical Specifications at 25°C (VDS= 6 V, VGS= -1 V)
1. Calculated value based on measurement of discrete FET.
2. Typical represents the median parameter value across the specified
frequency range for the median chip.
Dimensions indicated in mm.
All DC (V) pads are 0.1 x 0.1 mm and RF In, Out pads are 0.07 mm wide.
Chip thickness = 0.1 mm.
Characteristic Value
Operating Temperature (TC) -55°C to +90°C
Storage Temperature (TST) -65°C to +150°C
Bias Voltage (VD)7 V
DC
Power In (PIN) 22 dBm
Junction Temperature (TJ) 175°C
Absolute Maximum Ratings