The AS7C1024A and AS7C31024A are high performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as
131,012 words x 8 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 3/3/4/5 ns are ideal for high
performance applications. Active high and low chip enables (CE1
When CE1
static, then full standby power is reached (I
conditions. All devices in this family will retain data when VCC is reduced as low as 2.0V.
A write cycle is accomplished by asserting write enable (WE) and both chip enables (CE1, CE2). Data on the input pins I/O0-I/O7 is written
on the rising edge of WE
should drive I/O pins only after outputs have been disabled with output enable (OE
A read cycle is accomplished by asserting output enable (OE
I/O pins with the data word referenced by the input address. When either chip enable is inactive, output enable is inactive, or write enable is
active, output drivers stay in high-impedance mode.
is high or CE2 is low the devices enter standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is
). For example, the AS7C31024A is guaranteed not to exceed 36mW under nominal full standby
SB1
(write cycle 1) or the active-to-inactive edge of CE1 or CE2 (write cycle 2). To avoid bus contention, external devices
Absolute maximum ratings
ParameterSymbolMinMaxUnit
Vo l ta ge o n V
Voltage on any pin relative to GND BothV
Power dissipationBothP
Storage temperature (plastic)BothT
Ambient temperature with V
DC current into outputs (low)BothI
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional oper-
ation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
relative to GND
CC
appliedBothT
CC
, CE2) permit easy memory expansion with multiple-bank systems.
) or write enable (WE).
) and both chip enables (CE1, CE2), with write enable (WE) high. The chips drive
AS7C1024AV
AS7C31024AV
t1
t1
t2
D
stg
bias
OUT
–0.50+7.0V
-0.50+5.0V
–0.50VCC +0.50V
–1.0W
–65+150°C
–55+125°C
–20mA
Truth table
CE1
HXXXHigh ZStandby (I
XLXXHigh ZStandby (I
LHHHHigh ZOutput disable (I
LHHLD
LHLXD
Key: X = Don’t Care, L = Low, H = High
2/6/01; V.0.9Alliance SemiconductorP. 2 of 8
CE2WEOEDataMode
OUT
IN
Read (ICC)
Write (
SB
SB
ICC
, I
, I
SB1
SB1
)
CC
)
)
)
Recommended operating conditions
ParameterDeviceSymbolMinNominalMaxUnit
Supply voltage
Input voltage
Ambient operating temperature
†
VILmin. = –3.0V for pulse width less than t
AS7C1024AV
AS7C31024AV
ASAS7C1024AV
AS7C31024AV
commercialT
industrialT
.
RC/2
CC
CC
IH
IH
V
IL
A
A
DC operating characteristics (over the operating range)1
ParameterSymTest conditionsDevice
®
4.55.05.5V
3.03.33.6V
2.2–VCC + 0.5V
2.0–VCC + 0.5V
†
–0.5–0.8V
0–70°C
–40–85°C
-10-12-15-20
Min Max Min Max Min Max Min Max
AS7C1024A
AS7C31024A
Unit
Input leakage
current
Output leakage
current
Operating power
supply current
Standby power
supply current
Output voltage
Data retention
current
|VCC = Max, VIN = GND to V
|I
LI
V
= Max, CE1 = VIH or
CC
|
|I
LO
CE2 = V
, V
IL
= GND to V
OUT
VCC = Max, CE1 = VIL,
CE2 = V
I
CC
IH
, f = f
Max
mA
VCC = Max, CE1 ≥ VIH and/or
I
SB
I
SB1
V
OL
V
OH
ICCDR
CE2 ≤ V
VCC = Max, CE1
IOH = –4 mA, VCC = Min2.4–2.4–2.4–2.4–V
, VIN = VIH or VIL,
IL
, I
f = f
Max
OUT
≥
≤ GND + 0.2V or
V
IN
≥ VCC –0.2V, f = 0
V
IN
IOL = 8 mA, VCC = Min–0.4–0.4–0.4–0.4V
= 2.0V
V
CC
CE1
≥ VCC–0.2V or
CE2 ≤ 0.2V
V
≥
V
CC
≤ 0.2V
IN
–0.2V or
V
IN
, I
OUT
= 0mA
V
–0.2V
CC
CC
Both –1–1–1–1µA
Both –1–1–1–1µA
CC
AS7C1024A–120–110–100–100
= 0
AS7C31024A–90–80–80–80
AS7C1024A–30–25–20–20
AS7C31024A–30–25–20–20
AS7C1024A–10–10–10–15
AS7C31024A–10–10–10–15
AS7C1024A-1-1-1-5mA
AS7C31024A-1-1-1-5mA
mA
mA
mA
Capacitance (f = 1 MHz, T
= 25 °C, V
a
= NOMINAL)
CC
2
ParameterSymbolSignalsTest conditionsMaxUnit
Input capacitanceC
I/O capacitanceC
2/6/01; V.0.9Alliance SemiconductorP. 3 of 8
IN
I/O
A, CE1, CE2, WE, OEVIN = 0V5pF
I/OVIN = V
= 0V7pF
OUT
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